WO2019148550A1 - 偏光片的剥离设备及其剥离方法 - Google Patents

偏光片的剥离设备及其剥离方法 Download PDF

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Publication number
WO2019148550A1
WO2019148550A1 PCT/CN2018/076568 CN2018076568W WO2019148550A1 WO 2019148550 A1 WO2019148550 A1 WO 2019148550A1 CN 2018076568 W CN2018076568 W CN 2018076568W WO 2019148550 A1 WO2019148550 A1 WO 2019148550A1
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Prior art keywords
polarizer
ion beam
predetermined trajectory
etching
etched
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PCT/CN2018/076568
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English (en)
French (fr)
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易国霞
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武汉华星光电半导体显示技术有限公司
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Priority to US15/775,244 priority Critical patent/US11092843B2/en
Publication of WO2019148550A1 publication Critical patent/WO2019148550A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00595—Control etch selectivity
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/42—Polarizing, birefringent, filtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528—Polarisers

Definitions

  • the invention relates to the technical field of flexible panel processing, and in particular to a stripping device for a polarizer and a stripping method thereof.
  • the flexible display is a flexible display device made of a flexible material, which has the advantages of thin thickness, small size, light weight, easy to carry, bendable, energy-saving and environmentally friendly, and fashionable personality. Therefore, the flexible display will be obtained in the field of display technology. Rapid development. The process of the flexible display is complicated, and the structure is formed by stacking a plurality of layers. After the touch screen is finished, a polarizer is attached to the surface of the touch screen, and foreign matter, bubbles, and stains remain in the polarizer during the dressing process. Such adverse factors, therefore, for these undesirable factors, often need to rework, the current rework process is to use external force to tear the polarizer off the surface of the touch screen, which is easy to cause poor peeling and damage to other layers.
  • the present invention provides a peeling device for a polarizer and a peeling method thereof, which can avoid the phenomenon of poor peeling of the polarizer and damage to other film layers.
  • a specific technical solution proposed by the present invention is to provide a peeling method for a polarizer, and the peeling method includes the steps of:
  • the polarizer that is not etched by the ion beam on the display panel is removed.
  • the shape of the etched area is a square, and a side length of the etched area is equal to a diameter of a spot of the ion beam.
  • the spot size of the ion beam is from 0.1 to 1 micron.
  • an incident direction of the ion beam is perpendicular to a surface of the polarizer.
  • the step of performing ion beam etching on the plurality of etched regions sequentially along a predetermined trajectory specifically includes:
  • the other etched regions of the plurality of etched regions are sequentially subjected to ion beam etching using the etching parameters.
  • the etching parameter includes a size, an intensity, and an etching time of the spot of the ion beam.
  • the predetermined trajectory is an S-shaped curve extending in a first direction or in a second direction, the first direction being perpendicular to the second direction.
  • the predetermined trajectory is spiral.
  • the non-ion etched polarizer on the display panel is removed by an organic solution in the step of removing the polarizer that is not etched by the ion beam on the display panel.
  • the present invention also provides a stripping device for a polarizer, the stripping device comprising an ion gun, a stage and a flexible panel disposed on the stage, the flexible panel comprising a display panel and being disposed on the display panel a polarizer, an emission port of the ion gun is disposed opposite to the polarizer, and the ion gun and/or the stage moves to ion beam etch the polarizer.
  • the plurality of etched regions are sequentially etched by the ion beam along a predetermined trajectory, thereby avoiding tearing of the polarizer and damage to other layers by directly tearing the polarizer by external force.
  • the phenomenon has improved the peeling efficiency.
  • Figure 1 is a flow chart of the stripping method
  • FIG. 2 is a schematic structural view of a flexible panel
  • FIG. 3 is a schematic structural view of a polarizer
  • Figure 5 is a schematic view of a predetermined trajectory of the second embodiment
  • Figure 6 is a schematic view showing the structure of the stripping apparatus.
  • the embodiment provides a method for peeling off a polarizer for removing the polarizer 1 attached to the display panel 2 .
  • the display panel 2 may be an LCD panel or an OLED.
  • the peeling method is described by taking the display panel 2 as an OLED panel as an example.
  • the display panel 2 includes a substrate 21, an alignment film layer 22, an array substrate 23, an OLED display layer 24, an encapsulation layer 25, and a touch layer 26.
  • the polarizer 1 is attached to the surface of the touch layer 26.
  • the stripping method includes the steps:
  • the polarizer 1 is divided into a plurality of etched regions 10 according to the size of the spot 20 of the ion beam. Since the spot 20 of the ion beam has a circular shape, the shape of the etched region 10 is square, engraved. The side length of the etched region 10 is equal to the diameter of the spot 20 of the ion beam, and the center of the spot 20 of the ion beam coincides with the center of the etched region 10, such that when the spot 20 of the ion beam is incident on the etched region 10, the etched region The area covered by the spot 20 of the ion beam is the largest, that is, the etching area is the largest.
  • the spot 20 of the ion beam cannot be too large. If the spot 20 of the ion beam is too large, the polarizer 1 remaining after the etching is relatively large, and the workload of the subsequent cleaning is relatively large, and the spot 20 of the ion beam cannot be too small, if the ion If the beam spot 20 is too small, the etching workload will be increased, thereby reducing the etching efficiency. Therefore, it is necessary to determine the size of the spot 20 of the ion beam according to the actual area of the polarizer 1. Preferably, this embodiment The size of the spot 20 of the ion beam is 0.1 to 1 ⁇ m, so that the amount of subsequent cleaning can be reduced while ensuring the etching efficiency.
  • the incident direction of the ion beam is perpendicular to the surface of the polarizer 1.
  • the spot 20 of the ion beam covers the etched region 10 as much as possible, and on the other hand, the energy of the ion beam is more evenly distributed in the etched region 10, so that etching
  • the area etch rate is consistent, increasing etch uniformity.
  • Step S2 specifically includes:
  • the first etching region 10 is first subjected to ion beam etching using the set etching parameters, and in step S22, the etching of the first etching region 10 is observed by a microscope, and when ions are observed, When the beam is just etched to expose the display panel 2, the etching is stopped, and the etching parameters at this time are recorded.
  • the etching parameter is an etching parameter capable of ensuring an etching effect, and the etching parameter is sequentially used in step S23.
  • the remaining etched regions 10 are etched.
  • the etching parameters in this embodiment include the size, intensity, and etching time of the spot of the ion beam.
  • the predetermined trajectory is an S-shaped curve extending in the first direction or in the second direction, the first direction being perpendicular to the second direction.
  • the first direction is the x direction in FIG. 4
  • the second direction is the y direction in FIG.
  • the S-shaped curve extending in the x direction may be from the etched area of the first row to the etched area of the last row (as indicated by the dashed line in FIG.
  • the S-shaped curve extending in the y direction may be the direction from the etched area of the first column to the etched area of the last column, or may be from the etched area of the last column to the first The direction of the etched area of the column.
  • the predetermined trajectory is a spiral shape, and the spiral shape may be a clockwise direction or a counterclockwise direction.
  • step S3 the area of the portion of the etched region 10 that is etched by the ion beam is equal to the area of the spot of the ion beam, and the remaining portion of the etched region 10 is removed by the organic solution, or may be removed by a knife and then reused. The organic solution is removed.
  • the polarizing plate 1 is peeled off by the ion beam, which can avoid the phenomenon that the polarizing plate is broken and the other film layer is damaged by directly tearing the polarizing plate by external force, thereby improving the peeling efficiency.
  • the embodiment further provides a stripping device for a polarizer
  • the stripping device includes an ion gun 3, a stage 4, and a flexible panel disposed on the stage 4.
  • the flexible panel includes a display panel 2 and is disposed on The polarizer 1 on the display panel 2 and the display panel 2-position OLED.
  • the emission port of the ion gun 3 is disposed opposite to the polarizer 1.
  • the ion gun 3 is for emitting an ion beam, and the ion beam emitted from the ion gun 3 is perpendicular to the surface of the polarizer 1.
  • the ion gun 3 and/or the stage 4 are moved to perform ion beam etching on the polarizer 1, that is, only the ion gun 3 can be moved to sequentially perform ion beam etching on the plurality of etching regions 10 along a predetermined track, or to simultaneously move ions.
  • the gun 3 and the stage 4 perform ion beam etching on the plurality of etched regions 10 in sequence along a predetermined trajectory.

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Abstract

一种偏光片的剥离设备及其剥离方法，剥离方法包括步骤：将偏光片（1）划分为多个刻蚀区域（10）；沿预定轨迹依次对多个刻蚀区域（10）进行离子束刻蚀；去除显示面板（2）上未被离子束刻蚀的偏光片（1）。通过离子束沿预定轨迹依次对多个刻蚀区域（10）进行刻蚀，可以避免直接通过外力撕开偏光片（1）而造成偏光片（1）断裂及对其他膜层造成损坏的现象，提升了剥离效率。

Description

偏光片的剥离设备及其剥离方法 技术领域
本发明涉及柔性面板加工技术领域，尤其涉及一种偏光片的剥离设备及其剥离方法。
背景技术
柔性显示器是用柔性材料制成的可弯曲的显示装置，其具有厚度薄、体积小、轻便、易携带、可弯曲、节能环保、个性时尚等优点，因此，柔性显示器将会在显示技术领域得到快速发展。柔性显示器的工艺复杂，结构由多层膜层堆叠而成，在完成触摸屏的制作之后，需要在触摸屏的表面贴上偏光片，在贴服过程中，偏光片中会残留异物、气泡、赃污等不良因素，因此，针对这些不良因素，经常需要返工，目前的返工工艺是利用外力将偏光片从触摸屏的表面撕掉，这样很容易造成剥离不良及对其他膜层造成损坏的现象。
发明内容
为了解决现有技术的不足，本发明提供一种偏光片的剥离设备及其剥离方法，能够避免偏光片剥离不良的现象以及对其他膜层造成损坏。
本发明提出的具体技术方案为：提供一种偏光片的剥离方法，所述剥离方法包括步骤：
将偏光片划分为多个刻蚀区域；
沿预定轨迹依次对所述多个刻蚀区域进行离子束刻蚀；
去除显示面板上未被离子束刻蚀的偏光片。
可选地，所述刻蚀区域的形状为正方形，所述刻蚀区域的边长等于所述离子束的光斑的直径。
可选地，所述离子束的光斑的大小为0.1～1微米。
可选地，所述离子束的入射方向与所述偏光片的表面垂直。
可选地，所述步骤沿预定轨迹依次对所述多个刻蚀区域进行离子束刻蚀具体包括：
对位于所述预定轨迹上的第一个刻蚀区域进行离子束刻蚀；
记录刻蚀至露出显示面板时的刻蚀参数；
利用所述刻蚀参数依次对所述多个刻蚀区域中其他的刻蚀区域进行离子束刻蚀。
可选地，所述刻蚀参数包括离子束的光斑的大小、强度及刻蚀时间。
可选地，所述预定轨迹为沿第一方向或沿第二方向延伸的S形曲线，所述第一方向与所述第二方向垂直。
可选地，所述预定轨迹为螺旋形。
可选地，在步骤去除显示面板上未被离子束刻蚀的偏光片中通过有机溶液去除显示面板上未被离子刻蚀的偏光片。
本发明还提供了一种偏光片的剥离设备，所述剥离设备包括离子枪、载台及设于所述载台上的柔性面板，所述柔性面板包括显示面板及设于所述显示面板上的偏光片，所述离子枪的发射口与所述偏光片相对设置，所述离子枪和/或所述载台移动对所述偏光片进行离子束刻蚀。
本发明提出的偏光片的剥离方法，通过离子束沿预定轨迹依次对所述多个刻蚀区域进行刻蚀，可以避免直接通过外力撕开偏光片而造成偏光片断裂及对其他膜层造成损坏的现象，提升了剥离效率。
附图说明
图1为剥离方法的流程图；
图2为柔性面板的结构示意图；
图3为偏光片的结构示意图；
图4为第一实施方式的预定轨迹示意图；
图5为第二实施方式的预定轨迹示意图；
图6为剥离设备的结构示意图。
具体实施方式
以下，将参照附图来详细描述本发明的实施例。然而，可以以许多不同的形式来实施本发明，并且本发明不应该被解释为限制于这里阐述的具体实施例。相反，提供这些实施例是为了解释本发明的原理及其实际应用，从而使本领域的其他技术人员能够理解本发明的各种实施例和适合于特定预期应用的各种修改。在附图中，相同的标号将始终被用于表示相同的元件。
参照图1、图2及图3，本实施例提供了一种偏光片的剥离方法，用于将显示面板2上贴付的偏光片1去除。显示面板2可以为LCD面板，也可以为OLED，这里，以显示面板2为OLED面板为例来对该剥离方法进行描述。其中，显示面板2包括依次叠层设置的基板21、配向膜层22、阵列基板23、OLED显示层24、封装层25、触摸层26，偏光片1贴付于触摸层26的表面，所述剥离方法包括步骤：
S1、将偏光片划分为多个刻蚀区域；
S2、沿预定轨迹依次对多个刻蚀区域进行离子束刻蚀；
S3、去除显示面板2上未被离子束刻蚀的偏光片。
具体地，在步骤S1中，根据离子束的光斑20的大小将偏光片1划分为多个刻蚀区域10，由于离子束的光斑20形状为圆形，刻蚀区域10的形状为正方形，刻蚀区域10的边长等于离子束的光斑20的直径，离子束的光斑20的中心与刻蚀区域10的中心重合，这样，离子束的光斑20入射至刻蚀区域10上时，刻蚀区域10被离子束的光斑20覆盖的区域最大，即刻蚀面积最大。
离子束的光斑20不能太大，若离子束的光斑20太大，则刻蚀后残留的偏光片1比较多，后续清理的工作量比较大，离子束的光斑20也不能太小，若离子束的光斑20太小，则将会增加刻蚀的工作量，从而降低刻蚀效率，因此，需要根据偏光片1的实际面积来确定离子束的光斑20的大小，较佳地，本实施例中 的离子束的光斑20的大小为0.1～1微米，这样，在保证刻蚀效率的同时能够减小后续清理的工作量。
离子束的入射方向与偏光片1的表面垂直，一方面使得离子束的光斑20尽可能的覆盖刻蚀区域10，另一方面离子束的能量更加均匀的分布于刻蚀区域10，使得刻蚀区域刻蚀速率保持一致，增加刻蚀均匀性。
为了能够保证刻蚀效果，即在离子束刚好将偏光片1刻蚀掉的情况下又不会对其他膜层造成损坏。步骤S2具体包括：
S21、对位于预定轨迹上的第一个刻蚀区域10进行离子束刻蚀；
S22、记录刻蚀至露出显示面板时的刻蚀参数；
S23、利用刻蚀参数依次对多个刻蚀区域10中其他的刻蚀区域10进行离子束刻蚀。
在步骤S21中先采用设定的刻蚀参数来对第一个刻蚀区域10进行离子束刻蚀，在步骤S22中通过显微镜观察第一个刻蚀区域10的刻蚀情况，当观察到离子束刚好刻蚀至露出显示面板2时，停止刻蚀，记录此时的刻蚀参数，该刻蚀参数即为能够保证刻蚀效果的刻蚀参数，在步骤S23中利用该刻蚀参数依次对剩下的刻蚀区域10进行刻蚀。较佳地，本实施例中的刻蚀参数包括离子束的光斑的大小、强度及刻蚀时间。
参照图4，在本实施例的第一实施方式中，预定轨迹为沿第一方向或沿第二方向延伸的S形曲线，第一方向与第二方向垂直。其中，第一方向为图4中的x方向，第二方向为图4中的y方向。沿x方向延伸的S形曲线可以是从第一行的刻蚀区域到最后一行的刻蚀区域的方向(如图4中的虚线所示)，也可以是从最后一行的刻蚀区域到第一行的刻蚀区域的方向，沿y方向延伸的S形曲线可以是从第一列的刻蚀区域到最后一列的刻蚀区域的方向，也可以是从最后一列的刻蚀区域到第一列的刻蚀区域的方向。
参照图5，在本实施例的第二实施方式中，预定轨迹为螺旋形，螺旋形可以是顺时针方向，也可以是逆时针方向。
在步骤S3中，刻蚀区域10被离子束刻蚀的部分的面积与离子束的光斑的面积相等，刻蚀区域10剩下的部分通过有机溶液去除，或者可以先用刀去除，然后再用有机溶液去除。
本实施例通过离子束来对偏光片1进行剥离，可以避免直接通过外力撕开偏光片而造成偏光片断裂及对其他膜层造成损坏的现象，提升了剥离效率。
参照图6，本实施例还提供了一种偏光片的剥离设备，所述剥离设备包括离子枪3、载台4及设于载台4上的柔性面板，柔性面板包括显示面板2及设于显示面板2上的偏光片1，显示面板2位OLED。离子枪3的发射口与偏光片1相对设置。离子枪3用于发射离子束，离子枪3发射的离子束与偏光片1的表面垂直。
离子枪3和/或载台4移动对偏光片1进行离子束刻蚀，即可以只移动离子枪3来沿预定轨迹依次对多个刻蚀区域10进行离子束刻蚀，也可以同时移动离子枪3和载台4来沿预定轨迹依次对多个刻蚀区域10进行离子束刻蚀。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (20)

  1. 一种偏光片的剥离方法，其中，包括步骤：
    将偏光片划分为多个刻蚀区域；
    沿预定轨迹依次对所述多个刻蚀区域进行离子束刻蚀；
    去除显示面板上未被离子束刻蚀的偏光片。
  2. 根据权利要求1所述的剥离方法，其中，所述刻蚀区域的形状为正方形，所述刻蚀区域的边长等于所述离子束的光斑的直径。
  3. 根据权利要求2所述的剥离方法，其中，所述离子束的光斑的大小为0.1～1微米。
  4. 根据权利要求1所述的剥离方法，其中，所述离子束的入射方向与所述偏光片的表面垂直。
  5. 根据权利要求1所述的剥离方法，其中，所述步骤沿预定轨迹依次对所述多个刻蚀区域进行离子束刻蚀具体包括：
    对位于所述预定轨迹上的第一个刻蚀区域进行离子束刻蚀；
    记录刻蚀至露出显示面板时的刻蚀参数；
    利用所述刻蚀参数依次对所述多个刻蚀区域中其他的刻蚀区域进行离子束刻蚀。
  6. 根据权利要求5所述的剥离方法，其中，所述刻蚀参数包括离子束的光斑的大小、强度及刻蚀时间。
  7. 根据权利要求1所述的剥离方法，其中，所述预定轨迹为沿第一方向或沿第二方向延伸的S形曲线，所述第一方向与所述第二方向垂直。
  8. 根据权利要求2所述的剥离方法，其中，所述预定轨迹为沿第一方向或沿第二方向延伸的S形曲线，所述第一方向与所述第二方向垂直。
  9. 根据权利要求3所述的剥离方法，其中，所述预定轨迹为沿第一方向或沿第二方向延伸的S形曲线，所述第一方向与所述第二方向垂直。
  10. 根据权利要求4所述的剥离方法，其中，所述预定轨迹为沿第一方向或沿第二方向延伸的S形曲线，所述第一方向与所述第二方向垂直。
  11. 根据权利要求5所述的剥离方法，其中，所述预定轨迹为沿第一方向或沿第二方向延伸的S形曲线，所述第一方向与所述第二方向垂直。
  12. 根据权利要求6所述的剥离方法，其中，所述预定轨迹为沿第一方向或沿第二方向延伸的S形曲线，所述第一方向与所述第二方向垂直。
  13. 根据权利要求1所述的剥离方法，其中，所述预定轨迹为螺旋形。
  14. 根据权利要求2所述的剥离方法，其中，所述预定轨迹为螺旋形。
  15. 根据权利要求3所述的剥离方法，其中，所述预定轨迹为螺旋形。
  16. 根据权利要求4所述的剥离方法，其中，所述预定轨迹为螺旋形。
  17. 根据权利要求5所述的剥离方法，其中，所述预定轨迹为螺旋形。
  18. 根据权利要求6所述的剥离方法，其中，所述预定轨迹为螺旋形。
  19. 根据权利要求1所述的剥离方法，其中，在步骤去除显示面板上未被离子束刻蚀的偏光片中通过有机溶液去除显示面板上未被离子刻蚀的偏光片。
  20. 一种偏光片的剥离设备，其中，包括离子枪、载台及设于所述载台上的柔性面板，所述柔性面板包括显示面板及设于所述显示面板上的偏光片，所述离子枪的发射口与所述偏光片相对设置，所述离子枪和/或所述载台移动对所述偏光片进行离子束刻蚀。
PCT/CN2018/076568 2018-01-31 2018-02-12 偏光片的剥离设备及其剥离方法 WO2019148550A1 (zh)

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