WO2022088248A1 - 一种磁介电树脂组合物及其应用 - Google Patents
一种磁介电树脂组合物及其应用 Download PDFInfo
- Publication number
- WO2022088248A1 WO2022088248A1 PCT/CN2020/127789 CN2020127789W WO2022088248A1 WO 2022088248 A1 WO2022088248 A1 WO 2022088248A1 CN 2020127789 W CN2020127789 W CN 2020127789W WO 2022088248 A1 WO2022088248 A1 WO 2022088248A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- magnetic
- mass
- temperature drift
- resin composition
- drift coefficient
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 88
- 239000012762 magnetic filler Substances 0.000 claims abstract description 124
- 239000000463 material Substances 0.000 claims abstract description 82
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 65
- 229910052802 copper Inorganic materials 0.000 claims abstract description 56
- 239000010949 copper Substances 0.000 claims abstract description 56
- 229920005989 resin Polymers 0.000 claims abstract description 47
- 239000011347 resin Substances 0.000 claims abstract description 47
- 230000035699 permeability Effects 0.000 claims abstract description 46
- -1 laminates Substances 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 34
- 229910000859 α-Fe Inorganic materials 0.000 claims description 24
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 16
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 13
- 238000002156 mixing Methods 0.000 claims description 13
- 238000010298 pulverizing process Methods 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 12
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 9
- 229920001568 phenolic resin Polymers 0.000 claims description 9
- 239000005011 phenolic resin Substances 0.000 claims description 9
- 239000012779 reinforcing material Substances 0.000 claims description 9
- 229910001308 Zinc ferrite Inorganic materials 0.000 claims description 8
- 239000003431 cross linking reagent Substances 0.000 claims description 8
- 229910001053 Nickel-zinc ferrite Inorganic materials 0.000 claims description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 6
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 5
- 229920000459 Nitrile rubber Polymers 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- WNKMTAQXMLAYHX-UHFFFAOYSA-N barium(2+);dioxido(oxo)titanium Chemical compound [Ba+2].[O-][Ti]([O-])=O WNKMTAQXMLAYHX-UHFFFAOYSA-N 0.000 claims description 5
- 238000007580 dry-mixing Methods 0.000 claims description 5
- 229920001955 polyphenylene ether Polymers 0.000 claims description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 4
- 229910001289 Manganese-zinc ferrite Inorganic materials 0.000 claims description 4
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 claims description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 4
- PGTXKIZLOWULDJ-UHFFFAOYSA-N [Mg].[Zn] Chemical compound [Mg].[Zn] PGTXKIZLOWULDJ-UHFFFAOYSA-N 0.000 claims description 4
- KOMIMHZRQFFCOR-UHFFFAOYSA-N [Ni].[Cu].[Zn] Chemical compound [Ni].[Cu].[Zn] KOMIMHZRQFFCOR-UHFFFAOYSA-N 0.000 claims description 4
- JIYIUPFAJUGHNL-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[Mn++].[Mn++].[Mn++].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Fe+3].[Zn++].[Zn++] JIYIUPFAJUGHNL-UHFFFAOYSA-N 0.000 claims description 4
- 238000000498 ball milling Methods 0.000 claims description 4
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 claims description 4
- 150000002460 imidazoles Chemical class 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 claims description 4
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000005416 organic matter Substances 0.000 claims description 3
- 150000001451 organic peroxides Chemical class 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 claims description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 claims description 2
- LEHNQGSPRXHYRT-UHFFFAOYSA-N 2-dodecyl-1h-imidazole Chemical compound CCCCCCCCCCCCC1=NC=CN1 LEHNQGSPRXHYRT-UHFFFAOYSA-N 0.000 claims description 2
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 2
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 claims description 2
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 claims description 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims description 2
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 claims description 2
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 2
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000004641 Diallyl-phthalate Substances 0.000 claims description 2
- 239000002841 Lewis acid Substances 0.000 claims description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 2
- 239000002174 Styrene-butadiene Substances 0.000 claims description 2
- OUPYOLABCAXGHH-UHFFFAOYSA-N [Ba].[Rb] Chemical compound [Ba].[Rb] OUPYOLABCAXGHH-UHFFFAOYSA-N 0.000 claims description 2
- WOIHABYNKOEWFG-UHFFFAOYSA-N [Sr].[Ba] Chemical compound [Sr].[Ba] WOIHABYNKOEWFG-UHFFFAOYSA-N 0.000 claims description 2
- VNSWULZVUKFJHK-UHFFFAOYSA-N [Sr].[Bi] Chemical compound [Sr].[Bi] VNSWULZVUKFJHK-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- YNDGDLJDSBUSEI-UHFFFAOYSA-N aluminum strontium Chemical compound [Al].[Sr] YNDGDLJDSBUSEI-UHFFFAOYSA-N 0.000 claims description 2
- IQONKZQQCCPWMS-UHFFFAOYSA-N barium lanthanum Chemical compound [Ba].[La] IQONKZQQCCPWMS-UHFFFAOYSA-N 0.000 claims description 2
- DUPIXUINLCPYLU-UHFFFAOYSA-N barium lead Chemical compound [Ba].[Pb] DUPIXUINLCPYLU-UHFFFAOYSA-N 0.000 claims description 2
- IJBYNGRZBZDSDK-UHFFFAOYSA-N barium magnesium Chemical compound [Mg].[Ba] IJBYNGRZBZDSDK-UHFFFAOYSA-N 0.000 claims description 2
- 229910052454 barium strontium titanate Inorganic materials 0.000 claims description 2
- XBYNNYGGLWJASC-UHFFFAOYSA-N barium titanium Chemical compound [Ti].[Ba] XBYNNYGGLWJASC-UHFFFAOYSA-N 0.000 claims description 2
- YIMPFANPVKETMG-UHFFFAOYSA-N barium zirconium Chemical compound [Zr].[Ba] YIMPFANPVKETMG-UHFFFAOYSA-N 0.000 claims description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 2
- 229910002115 bismuth titanate Inorganic materials 0.000 claims description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical class FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 claims description 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 2
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004643 cyanate ester Substances 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- 238000005470 impregnation Methods 0.000 claims description 2
- 229910052746 lanthanum Inorganic materials 0.000 claims description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 2
- 239000004973 liquid crystal related substance Substances 0.000 claims description 2
- PSVBHJWAIYBPRO-UHFFFAOYSA-N lithium;niobium(5+);oxygen(2-) Chemical compound [Li+].[O-2].[O-2].[O-2].[Nb+5] PSVBHJWAIYBPRO-UHFFFAOYSA-N 0.000 claims description 2
- ZAUUZASCMSWKGX-UHFFFAOYSA-N manganese nickel Chemical compound [Mn].[Ni] ZAUUZASCMSWKGX-UHFFFAOYSA-N 0.000 claims description 2
- ZBSCCQXBYNSKPV-UHFFFAOYSA-N oxolead;oxomagnesium;2,4,5-trioxa-1$l^{5},3$l^{5}-diniobabicyclo[1.1.1]pentane 1,3-dioxide Chemical compound [Mg]=O.[Pb]=O.[Pb]=O.[Pb]=O.O1[Nb]2(=O)O[Nb]1(=O)O2 ZBSCCQXBYNSKPV-UHFFFAOYSA-N 0.000 claims description 2
- 150000002989 phenols Chemical class 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 229920000582 polyisocyanurate Polymers 0.000 claims description 2
- 239000011495 polyisocyanurate Substances 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- 239000011591 potassium Substances 0.000 claims description 2
- UKDIAJWKFXFVFG-UHFFFAOYSA-N potassium;oxido(dioxo)niobium Chemical compound [K+].[O-][Nb](=O)=O UKDIAJWKFXFVFG-UHFFFAOYSA-N 0.000 claims description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 2
- HGTDVVTWYKXXMI-UHFFFAOYSA-N pyrrole-2,5-dione;triazine Chemical compound C1=CN=NN=C1.O=C1NC(=O)C=C1 HGTDVVTWYKXXMI-UHFFFAOYSA-N 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 2
- 239000011115 styrene butadiene Substances 0.000 claims description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 2
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical compound FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 claims 1
- 239000004810 polytetrafluoroethylene Substances 0.000 claims 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 23
- 230000002195 synergetic effect Effects 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 20
- 239000004744 fabric Substances 0.000 description 12
- 239000003365 glass fiber Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 9
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- 239000011190 CEM-3 Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000002075 main ingredient Substances 0.000 description 2
- 210000001161 mammalian embryo Anatomy 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- PPNAOCWZXJOHFK-UHFFFAOYSA-N manganese(2+);oxygen(2-) Chemical class [O-2].[Mn+2] PPNAOCWZXJOHFK-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- FYRCDEARNUVZRG-UHFFFAOYSA-N 1,1,5-trimethyl-3,3-bis(2-methylpentan-2-ylperoxy)cyclohexane Chemical compound CCCC(C)(C)OOC1(OOC(C)(C)CCC)CC(C)CC(C)(C)C1 FYRCDEARNUVZRG-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004305 biphenyl Chemical group 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- BWSZXUOMATYHHI-UHFFFAOYSA-N tert-butyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(C)(C)C BWSZXUOMATYHHI-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/26—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on ferrites
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/26—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on ferrites
- C04B35/2608—Compositions containing one or more ferrites of the group comprising manganese, zinc, nickel, copper or cobalt and one or more ferrites of the group comprising rare earth metals, alkali metals, alkaline earth metals or lead
- C04B35/2625—Compositions containing one or more ferrites of the group comprising manganese, zinc, nickel, copper or cobalt and one or more ferrites of the group comprising rare earth metals, alkali metals, alkaline earth metals or lead containing magnesium
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/26—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on ferrites
- C04B35/2608—Compositions containing one or more ferrites of the group comprising manganese, zinc, nickel, copper or cobalt and one or more ferrites of the group comprising rare earth metals, alkali metals, alkaline earth metals or lead
- C04B35/2633—Compositions containing one or more ferrites of the group comprising manganese, zinc, nickel, copper or cobalt and one or more ferrites of the group comprising rare earth metals, alkali metals, alkaline earth metals or lead containing barium, strontium or calcium
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/26—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on ferrites
- C04B35/265—Compositions containing one or more ferrites of the group comprising manganese or zinc and one or more ferrites of the group comprising nickel, copper or cobalt
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/208—Magnetic, paramagnetic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3239—Vanadium oxides, vanadates or oxide forming salts thereof, e.g. magnesium vanadate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3244—Zirconium oxides, zirconates, hafnium oxides, hafnates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3251—Niobium oxides, niobates, tantalum oxides, tantalates, or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3293—Tin oxides, stannates or oxide forming salts thereof, e.g. indium tin oxide [ITO]
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3298—Bismuth oxides, bismuthates or oxide forming salts thereof, e.g. zinc bismuthate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3418—Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
- C04B2235/442—Carbonates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2371/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Definitions
- the invention belongs to the technical field of copper clad laminates, and in particular relates to a magnetic dielectric resin composition and applications thereof.
- Plates represented by copper clad laminates are important building blocks for antennas.
- One of the ways to reduce the size of antennas is to use high-dielectric plates.
- CN103101252A discloses a manufacturing method of CEM-3 copper clad laminate with high dielectric constant and low loss.
- bisphenol A epoxy resin with good dielectric properties is used as the main resin, and it is combined with high dielectric properties.
- the filler is compounded to make it have high dielectric constant and low dielectric loss after curing; the high dielectric filler is titanium dioxide, aluminum trioxide, barium titanate or lead titanate, and the obtained CEM-3 copper clad laminate has good performance .
- CN103351578A discloses a resin composition for forming a dielectric layer of a dielectric substrate for an antenna and its use, the resin composition comprising an epoxy resin containing a naphthalene ring or a biphenyl structure, a ring having a low thermal expansion coefficient after curing Oxygen resin, viscosity modifier and pre-fired spherical ceramic powder; the dielectric substrate obtained by the resin composition has high dielectric constant, high peel strength, low thermal expansion coefficient and thickness consistency, and can meet the requirements of high dielectric constant Performance requirements for the antenna substrate.
- the above-mentioned high dielectric constant sheet material can reduce the size of the antenna, this method will also reduce the gain of the antenna and reduce the overall performance of the antenna.
- Another method to reduce the size of the antenna is to use a magnetic dielectric material as a substrate.
- ⁇ represents the speed of light in vacuum
- f represents Frequency
- ⁇ represents the wavelength
- ( ⁇ r ⁇ r ) 1/2 represents the miniaturization factor, the larger the dielectric constant ⁇ r and the greater the magnetic permeability ⁇ r , the higher the miniaturization factor, the more conducive to miniaturization.
- increasing the permeability can effectively reduce the size of the antenna while maintaining or improving the antenna gain and bandwidth.
- CN106797699A discloses a magnetic dielectric substrate, a circuit material and an assembly having the same, comprising a first dielectric layer, a second dielectric layer spaced apart from the first dielectric layer, and disposed on the first dielectric layer and the At least one magnetic enhancement layer between and in close contact with the second dielectric layers, the magnetic enhancement layer contains ferrite; the magnetic dielectric substrate has low dielectric, low magnetic loss and low power consumption.
- CN101188903A discloses a multi-layer printed circuit board, comprising an inner magnetic layer mainly composed of magnetic materials; the inner magnetic layer is mainly composed of a ferrite film, and the ferrite film can be directly formed on the inner surface by a chemical immersion plating method on the conductive layer.
- the magnetic permeability of the above-mentioned magnetic dielectric sheet is low, which makes it difficult to meet the differentiated requirements of electronic products for magnetic substrates, and the insulation performance is not ideal, resulting in poor usability of electronic products.
- the purpose of the present invention is to provide a magnetic dielectric resin composition and its application.
- a positive temperature drift coefficient magnetic filler and a negative temperature drift coefficient magnetic filler By introducing a positive temperature drift coefficient magnetic filler and a negative temperature drift coefficient magnetic filler, the magnetic dielectric resin is improved.
- the performance of the composition in terms of stability, temperature drift coefficient and magnetic permeability; the copper clad laminate containing it has good permeability coverage and low temperature drift coefficient, and has high stability and excellent dielectric properties, which can fully meet the requirements of electronic The demand for high performance and miniaturization of products.
- the present invention provides a magnetic dielectric resin composition
- the magnetic dielectric resin composition includes a resin and a magnetic filler
- the magnetic filler is a combination of a positive temperature drift coefficient magnetic filler and a negative temperature drift coefficient magnetic filler thing.
- the magneto-dielectric resin composition provided by the present invention includes resin and magnetic filler, and provides the magneto-dielectric resin composition with good magnetic and dielectric properties.
- the magnetic filler is a combination of a magnetic filler with a positive temperature drift coefficient and a magnetic filler with a negative temperature drift coefficient. On the other hand, it can effectively reduce the temperature drift coefficient and improve the stability, so that the copper clad laminate containing it can achieve a performance balance in terms of magnetic permeability, magnetic loss, dielectric properties and stability, and more It is suitable for the preparation of high-performance and miniaturized electronic products.
- the temperature drift coefficient of the present invention is ( ⁇ r ⁇ r ) 1/2 temperature drift coefficient, wherein ⁇ r represents the relative permittivity, ⁇ r represents the relative magnetic permeability; the temperature drift coefficient represents -55 to 150
- the relative change rate of magnetic permeability in °C by using the air line test method (the test instrument is the E5071C, N1500 or 8050D test system of Keysight Technology), the magnetic properties and dielectric properties of the test material from 0.1 to 18GHz, and the performance at different temperatures The test is placed in a temperature-controlled box for testing. The following refers to the same description, and all have the same meaning.
- the temperature drift coefficient of the magnetic filler with positive temperature drift coefficient is 5 to 1000ppm/°C under the conditions of -55 to 150°C and 0.1 to 18GHz, such as 8ppm/°C, 10ppm/°C, 20ppm/°C, 30ppm/°C.
- °C 50ppm/°C, 70ppm/°C, 90ppm/°C, 100ppm/°C, 150ppm/°C, 200ppm/°C, 250ppm/°C, 300ppm/°C, 350ppm/°C, 400ppm/°C, 450ppm/°C, 500ppm/°C, 550 ppm/°C, 600ppm/°C, 650ppm/°C, 700ppm/°C, 750ppm/°C, 800ppm/°C, 850ppm/°C, 900ppm/°C or 950ppm/°C, and the specific point values between the above-mentioned point values are limited by space And for the sake of brevity, the present invention does not exhaustively enumerate the specific points included in the range.
- the temperature drift coefficient of the magnetic filler with positive temperature drift coefficient is 5-500ppm/°C under the conditions of -55-150°C and 0.1-18GHz, such as 8ppm/°C, 10ppm/°C, 20ppm/°C, 30ppm/°C , 50ppm/°C, 70ppm/°C, 90ppm/°C, 100ppm/°C, 150ppm/°C, 200ppm/°C, 250ppm/°C, 300ppm/°C, 350ppm/°C, 400ppm/°C or 450ppm/°C, etc.
- 8ppm/°C such as 8ppm/°C, 10ppm/°C, 20ppm/°C, 30ppm/°C , 50ppm/°C, 70ppm/°C, 90ppm/°C, 100ppm/°C, 150ppm/°C, 200ppm/°C, 250ppm/°C, 300ppm/°C, 350ppm/°C, 400pp
- the temperature drift coefficient of the magnetic filler with negative temperature drift coefficient under the conditions of -55 to 150°C and 0.1 to 18GHz is -1000 to 0ppm/°C, such as -950ppm/°C, -900ppm/°C, -850ppm/°C.
- the temperature drift coefficient of the positive temperature drift coefficient magnetic filler is 5-1000ppm/°C
- the temperature drift coefficient of the negative temperature drift coefficient magnetic filler is -1000-0ppm/°C.
- Compounding endows the magnetic filler and the magneto-dielectric resin combination with desired magneto-dielectric properties. If the absolute value of the intrinsic temperature drift coefficient of the magnetic filler is greater than 1000ppm/°C, the temperature drift coefficient of the prepared magnetic dielectric resin composition will be greater than 400ppm/°C, resulting in a large coefficient of variation of the magnetic permeability, which is difficult to meet the application requirements.
- the mass percentage content of the positive temperature drift coefficient magnetic filler in the magnetic filler is 5-50%, such as 6%, 8%, 10%, 12%, 15%, 18%, 20%, 22%, 25%, 28%, 30%, 32%, 35%, 38%, 40%, 42%, 45% or 48%, and specific point values between the above-mentioned point values, limited by space and for the sake of brevity, The present invention does not exhaustively enumerate the specific point values included in the stated ranges.
- the mass percentage content of the magnetic filler with a positive temperature drift coefficient in the magnetic filler is 5-50%, which can make the magnetic dielectric resin composition and the copper clad laminate containing the same have both excellent magnetic properties.
- the particle size of the magnetic filler is 0.1-30 ⁇ m (the particle size of the filler referred to herein is obtained by measuring the particle size distribution of the laser diffraction scattering method), such as 0.5 ⁇ m, 1 ⁇ m, 1.5 ⁇ m, 2 ⁇ m, 3 ⁇ m, 4 ⁇ m, 5 ⁇ m, 6 ⁇ m, 7 ⁇ m, 8 ⁇ m, 9 ⁇ m, 10 ⁇ m, 11 ⁇ m, 13 ⁇ m, 15 ⁇ m, 17 ⁇ m, 19 ⁇ m, 20 ⁇ m, 21 ⁇ m, 23 ⁇ m, 25 ⁇ m, 27 ⁇ m or 29 ⁇ m, as well as specific point values between the above point values, are limited for space and for reasons For the sake of brevity, the present invention does not exhaustively enumerate the specific point values included in the range.
- the particle size of the magnetic filler is 0.1-30 ⁇ m, which can be well dispersed in the resin system to obtain a magnetic and dielectric resin composition with stable performance and excellent performance. If the particle size of the magnetic filler exceeds the above range, its dispersibility will be reduced, thereby affecting the performance stability and uniformity of the magnetic dielectric resin composition.
- the magnetic permeability of the magnetic filler is 5-1000, such as 10, 15, 20, 30, 50, 80, 100, 150, 200, 250, 300, 350, 400, 450, 500, 550, 600 , 650, 700, 750, 800, 850, 900 or 950, and specific point values between the above-mentioned point values, due to space limitations and for the sake of simplicity, the present invention will not exhaustively list the specific point values included in the range.
- the magnetic permeability (relative magnetic permeability) of the magnetic filler is 5-1000, so that the magneto-dielectric resin composition has high magnetic permeability and suitable cut-off frequency.
- the magnetic permeability of the magnetic filler is less than 5
- the magnetic permeability of the magnetic dielectric resin composition will be less than 1.5, and it is difficult to meet the use requirements.
- the magnetic permeability of the magnetic filler is greater than 1000, the corresponding cutoff frequency is less than 200MHz, which is difficult to meet the application requirements.
- the positive temperature drift coefficient magnetic filler and the negative temperature drift coefficient magnetic filler each independently include spinel-type ferrite and/or hexagonal-type ferrite.
- the spinel-type ferrite includes any one or at least one of nickel-zinc ferrite, manganese-zinc ferrite, manganese-nickel ferrite, magnesium-zinc ferrite or nickel-copper-zinc ferrite A combination of the two is more preferably nickel-zinc ferrite.
- the spinel ferrite includes any one or at least two of nickel-zinc ferrite, manganese-zinc ferrite, magnesium-zinc ferrite or nickel-copper-zinc ferrite A combination of nickel-zinc ferrite is further preferred.
- magnesium-zinc ferrite/manganese-zinc ferrite has high magnetic loss and low cut-off frequency
- nickel-copper-zinc ferrite has low resistivity, high magnetic loss and low cut-off frequency. meet the usage requirements.
- the hexagonal ferrite is a Co 2 Z-type ferrite, which has higher magnetic permeability and can impart better magnetic properties to the magneto-dielectric resin composition.
- the positive temperature drift coefficient magnetic filler is prepared by the following method.
- the method includes: mixing main materials and auxiliary materials and then sintering, and pulverizing the sintered product to obtain the positive temperature drift coefficient magnetic filler;
- the material is a combination of Fe 2 O 3 and at least two of ZnO, NiO, manganese oxides (such as MnO 2 or Mn 2 O 3 ) or MgO, and the auxiliary material is selected from SiO 2 , V 2 O 5 , BiO, Any one or a combination of at least two of SnO 2 , HfO 2 , Nb 2 O 5 , Ta 2 O 5 or CaCO 3 .
- the mixing method is dry mixing.
- the molar percentage of Fe 2 O 3 in the main material is 40-72%, such as 42%, 45%, 48%, 50%, 52%, 55%, 58%, 60%, 62% , 65%, 68% or 70% etc.
- the molar content of NiO in the main material is 5-22%, such as 6%, 8%, 10%, 12%, 14%, 15%, 18%, 20% or 21%, etc.
- the masses of the SiO 2 , V 2 O 5 , BiO, SnO 2 , HfO 2 , Nb 2 O 5 , Ta 2 O 5 , and CaCO 3 are independently based on the mass of the main material as 100%. 0.01 to 0.8%, such as 0.02%, 0.05%, 0.08%, 0.1%, 0.12%, 0.15%, 0.18%, 0.2%, 0.22%, 0.25%, 0.28%, 0.3%, 0.32%, 0.35%, 0.38 %, 0.4%, 0.42%, 0.42%, 0.48%, 0.5%, 0.52%, 0.55%, 0.58%, 0.6%, 0.62%, 0.65%, 0.68%, 0.7%, 0.72%, 0.75% or 0.78%, etc. .
- the mass of the SiO 2 is 0.1-0.6%.
- the mass of the V 2 O 5 is 0.06-0.2%.
- the mass of the BiO is 0.1-0.6%.
- the mass of the SnO 2 is 0.02-0.5%.
- the mass of the HfO 2 is 0.01-0.1%.
- the mass of the Nb 2 O 5 is 0.01-0.08%.
- the mass of the Ta 2 O 5 is 0.01-0.1%.
- the mass of the CaCO 3 is 0.02-0.2%.
- the positive temperature drift coefficient magnetic filler is prepared by the following method.
- the method includes: after mixing the main material and the auxiliary material, sintering at 800-1100° C. for 3-5 hours, and pulverizing the sintered product to obtain the positive temperature drift coefficient Magnetic filler;
- the main material includes, in terms of mole percentage, a combination of 40-72% Fe 2 O 3 , 5-42% ZnO and 5-22% NiO;
- the mass of the main material is 100%
- the auxiliary materials include: 0.1-0.6% SiO 2 , 0.06-0.2% V 2 O 5 , 0.1-0.6% BiO, 0.02-0.5% SnO 2 , 0.01-0.1% A combination of HfO 2 , 0.01-0.08% Nb 2 O 5 , 0.01-0.1% Ta 2 O 5 , and 0.02-0.2% CaCO 3 .
- the magnetic filler with negative temperature drift coefficient is prepared by the following method.
- the material is a combination of Fe 2 O 3 and at least two of ZnO, NiO, manganese oxides (such as MnO 2 , Mn 2 O 3 ) or MgO, and the auxiliary material is selected from SiO 2 , V 2 O 5 , BiO, Any one or a combination of at least two of SnO 2 , HfO 2 , Nb 2 O 5 , Ta 2 O 5 or CaCO 3 .
- the mixing method is dry mixing.
- the mixing time is 0.5-3h, such as 0.6h, 0.8h, 1h, 1.2h, 1.5h, 1.8h, 2h, 2.2h, 2.5h, 2.8h or 3h, etc.
- the sintering temperature is 800-1100°C, such as 820°C, 850°C, 880°C, 900°C, 920°C, 950°C, 980°C, 1000°C, 1020°C, 1050°C or 1080°C, etc.
- the sintering time is 3-5h, for example, 3.2h, 3.5h, 3.8h, 4h, 4.2h, 4.5h or 4.8h and the like.
- the pulverization method is wet ball milling pulverization.
- the molar percentage of Fe 2 O 3 in the main material is 40-72%, such as 42%, 45%, 48%, 50%, 52%, 55%, 58%, 60%, 62% , 65%, 68% or 70% etc.
- the molar percentage of ZnO in the main material is 5-42%, such as 6%, 8%, 10%, 12%, 15%, 18%, 20%, 22%, 25%, 28% , 30%, 32%, 35%, 38% or 40% etc.
- the molar content of NiO in the main material is 5-22%, such as 6%, 8%, 10%, 12%, 14%, 15%, 18%, 20% or 21%, etc.
- the masses of the SiO 2 , V 2 O 5 , BiO, SnO 2 , HfO 2 , Nb 2 O 5 , Ta 2 O 5 , and CaCO 3 are independently based on the mass of the main material as 100%. 0.01 to 0.8%, such as 0.02%, 0.05%, 0.08%, 0.1%, 0.12%, 0.15%, 0.18%, 0.2%, 0.22%, 0.25%, 0.28%, 0.3%, 0.32%, 0.35%, 0.38 %, 0.4%, 0.42%, 0.42%, 0.48%, 0.5%, 0.52%, 0.55%, 0.58%, 0.6%, 0.62%, 0.65%, 0.68%, 0.7%, 0.72%, 0.75% or 0.78%, etc. .
- the mass of the HfO 2 is 0.15-0.6%.
- the mass of the CaCO 3 is 0.4-0.8%.
- the magneto-dielectric resin composition further includes a curing accelerator.
- the curing accelerator includes any one or a combination of at least two of imidazole-based compounds, piperidine-based compounds, pyridine-based compounds or organic metal salt Lewis acids.
- the magneto-dielectric resin composition further includes a cross-linking agent.
- the cross-linking agent includes triallyl isocyanurate, triallyl polyisocyanurate, triallyl cyanurate, trimethacrylic acid, diallyl phthalate , any one or a combination of at least two of divinylbenzene or multifunctional acrylates.
- the magneto-dielectric resin composition further includes a flame retardant.
- the present invention provides a resin glue solution obtained by dissolving or dispersing the above-mentioned magneto-dielectric resin composition in a solvent.
- the solvent includes any one or a combination of at least two of alcohol-based solvents, ether-based solvents, aromatic hydrocarbon-based solvents, ester-based solvents, ketone-based solvents or nitrogen-containing solvents.
- the alcoholic solvent includes any one or a combination of at least two of methanol, ethanol or butanol.
- the ether solvent includes any one or a combination of at least two of ethyl cellosolve, butyl cellosolve, ethylene glycol methyl ether, diethylene glycol ethyl ether or diethylene glycol butyl ether.
- the aromatic hydrocarbon solvent includes any one or a combination of at least two of benzene, toluene, xylene or mesitylene.
- the ester solvent includes any one or a combination of at least two of ethyl acetate, butyl acetate or ethoxyethyl acetate.
- the ketone solvent includes any one or a combination of at least two of acetone, methyl ethyl ketone, methyl ethyl ketone, methyl isobutyl ketone or cyclohexanone.
- the nitrogen-containing solvent includes any one or a combination of at least two of N,N-dimethylformamide, N,N-dimethylacetamide or N-methyl-2-pyrrolidone.
- the solid content of the resin glue is 10-80%, such as 12%, 15%, 18%, 20%, 22%, 25%, 28%, 30%, 32%, 35%, 38% , 40%, 42%, 45%, 48%, 50%, 52%, 55%, 58%, 60%, 62%, 65%, 68%, 70%, 72%, 75%, or 78%, and
- the specific point values between the above-mentioned point values are limited by space and for the sake of brevity, and the present invention will not exhaustively list the specific point values included in the range.
- the present invention provides a resin-coated copper foil or resin film prepared with the above-mentioned magneto-dielectric resin composition.
- the resin-coated copper foil is obtained by applying the magnetic dielectric resin composition as described above to the surface of the conductive metal layer in the form of a solution to provide a coating weight of 2 ⁇ 15 g/m 2 .
- the above-mentioned magnetic dielectric resin composition is coated on the release material, and after drying, semi-curing or curing, etc., the release material is removed to obtain the resin film.
- the present invention provides a prepreg comprising a reinforcing material, and the above-mentioned magneto-dielectric resin composition adhered to the reinforcing material by impregnation and drying.
- the reinforcing material includes inorganic material and/or organic material.
- the reinforcing material includes any one or a combination of at least two of glass fiber cloth, non-woven fabric, quartz cloth or paper.
- the glass fiber cloth can be E-glass fiber cloth, D-glass fiber cloth, S-glass fiber cloth, T glass fiber cloth, NE-glass fiber cloth, Q glass fiber cloth, L glass fiber cloth or QL Fiberglass cloth, etc.
- the preparation method of the prepreg is as follows: immersing the reinforcing material in the resin glue solution of the magneto-dielectric resin composition, taking it out and drying to obtain the prepreg.
- the drying temperature is 100-250°C, such as 105°C, 110°C, 115°C, 120°C, 130°C, 140°C, 150°C, 160°C, 170°C, 180°C, 190°C, 200°C , 210°C, 220°C, 230°C, 240°C or 245°C, etc.
- the drying time is 1 to 15 minutes, such as 2 minutes, 3 minutes, 4 minutes, 5 minutes, 6 minutes, 7 minutes, 8 minutes, 9 minutes, 10 minutes, 11 minutes, 12 minutes, 13 minutes, or 14 minutes.
- the curing is carried out in a hot press.
- the curing temperature is 150-250°C, such as 150°C, 155°C, 160°C, 165°C, 170°C, 175°C, 180°C, 185°C, 190°C, 195°C, 200°C, 205°C , 210°C, 215°C, 220°C, 225°C, 230°C, 235°C, 240°C or 245°C, etc.
- the copper clad laminate comprising the magnetic dielectric resin composition has high relative magnetic permeability, which can reach 3.9-6.7, and low magnetic loss, the magnetic loss tangent value is 0.01-0.09, and the absolute value of the temperature drift coefficient is 9-150ppm/°C , has high magnetic permeability, low magnetic loss, low temperature drift coefficient and high performance stability, which can fully meet the application requirements of CCL in the preparation of high-performance and miniaturized electronic products.
- Magnetic permeability test use an impedance analyzer to test the magnetic permeability of the material from 0.1 to 18 GHz, and the test instrument is Keysight E5071C network analyzer + N1500 test system;
- Epoxy resin Bisphenol A Novlac epoxy resin (EPR627 from Momentive Chemical Company, USA); Brominated epoxy resin: BEB531A80P from Changchun, Taiwan; Phenoxy resin: YP-50EK35 from Nippon Steel ; Polyphenylene ether resin: Sabic SA9000;
- the magnetic dielectric resin composition is used for the preparation of the copper clad laminate, and the specific method is the same as that of Example 1, and the copper clad laminate is obtained.
- a magnetic dielectric resin composition comprising the following components in parts by weight: 3.97 parts by weight of epoxy resin, 4.5 parts by weight of brominated epoxy resin, 1 part by weight of phenolic resin, and 40 parts by weight of positive temperature drift coefficient magnetic filler ZC -140, 10 parts by weight of silicon micropowder, 40 parts by weight of negative temperature drift coefficient magnetic filler FC-140, 0.5 part by weight of DDS, 0.03 part by weight of 2-MI.
- the magnetic dielectric resin composition is used for the preparation of the copper clad laminate, and the specific method is the same as that of Example 1, and the copper clad laminate is obtained.
- the magnetic dielectric resin composition is used for the preparation of the copper clad laminate, and the specific method is the same as that of Example 1, and the copper clad laminate is obtained.
- the magnetic dielectric resin composition is used for the preparation of the copper clad laminate, and the specific method is the same as that of Example 1, and the copper clad laminate is obtained.
- the magnetic dielectric resin composition is used for the preparation of the copper clad laminate, and the specific method is the same as that of Example 1, and the copper clad laminate is obtained.
- Temperature drift coefficient Put the above test system into a high and low temperature oven, test the magnetic permeability at -55°C, 25°C, and 150°C respectively, and calculate the temperature drift coefficient according to the following announcement.
- Temperature drift coefficient 1000000 ⁇ (magnetic permeability 150°C -magnetic permeability- 55°C )/(200 ⁇ magnetic permeability 25°C ).
- the magnetic dielectric resin compositions provided in Examples 1 to 4 of the present invention are used to prepare copper clad laminates, and the obtained copper clad laminates have high magnetic permeability, low magnetic loss, low temperature drift coefficient and High performance stability, high relative magnetic permeability can reach 6 ⁇ 10.1, magnetic loss tangent value is as low as 0.01 ⁇ 0.05, absolute value of temperature drift coefficient is 30 ⁇ 150ppm/°C, which can meet the requirements of high performance and small size of copper clad laminates. application requirements in electronic products.
- the temperature drift coefficient of the positive temperature drift coefficient magnetic filler is 5-1000ppm/°C
- the temperature drift coefficient of the negative temperature drift coefficient magnetic filler is -1000-0ppm/°C
- the magnetic filler is a combination of a magnetic filler with a positive temperature drift coefficient and a magnetic filler with a negative temperature drift coefficient.
- the copper clad laminate containing it has a large magnetic permeability, which reduces the magnetic loss, and on the other hand, can effectively reduce the temperature drift coefficient and improve the stability. If the magnetic filler is only a negative temperature drift coefficient magnetic filler (comparative example 1) or a positive temperature drift coefficient magnetic filler (comparative example 2), the magnetic properties of the copper clad laminate will be significantly reduced, the magnetic permeability is too low, or the temperature Drift factor is too high.
- the mass percentage content of the magnetic filler with positive temperature drift coefficient in the magnetic filler is 5-50%, which can make the magnetic permeability, magnetic loss and temperature drift stable for the magnetic dielectric resin composition and the copper clad laminate containing the same. If the positive temperature drift coefficient magnetic filler content is too low (Example 7), the magnetic permeability of the magnetic dielectric resin composition will be reduced, and it is difficult to meet the differentiated requirements of electronic products; If the content of the magnetic filler with the drift coefficient is too high (Example 8), the temperature drift coefficient of the magnetic dielectric resin composition will be high, and the stability will be reduced.
- the mass of the magnetic filler accounts for 20-90% of the total mass of the organic matter and the magnetic filler, and the two cooperate with each other, on the one hand, the magnetic filler is uniformly dispersed in the organic system, and on the other hand, the composition is uniformly dispersed. It has excellent magnetic properties and dielectric properties; and the particle size of the magnetic filler is 0.1-30 ⁇ m, which can obtain better dispersibility. If the content of the magnetic filler is too low (Example 9), the magnetic permeability of the copper clad laminate will be low, and the ideal magneto-dielectric properties cannot be achieved.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Soft Magnetic Materials (AREA)
Abstract
Description
Claims (10)
- 一种磁介电树脂组合物,其特征在于,所述磁介电树脂组合物包括树脂和磁性填料;所述磁性填料为正温漂系数磁性填料和负温漂系数磁性填料的组合物。
- 根据权利要求1所述的磁介电树脂组合物,其特征在于,所述正温漂系数磁性填料在-55~150℃、0.1~18GHz条件下的温漂系数为5~1000ppm/℃;优选地,所述正温漂系数磁性填料在-55~150℃、0.1~18GHz条件下的温漂系数为5~500ppm/℃;优选地,所述负温漂系数磁性填料在-55~150℃、0.1~18GHz条件下的温漂系数为-1000~0ppm/℃。
- 根据权利要求1或2所述的磁介电树脂组合物,其特征在于,所述磁性填料中正温漂系数磁性填料的质量百分含量为5~50%;优选地,所述磁性填料的粒径为0.1~30μm;优选地,所述磁性填料的磁导率为5~1000。
- 根据权利要求1~3任一项所述的磁介电树脂组合物,其特征在于,所述正温漂系数磁性填料、负温漂系数磁性填料各自独立地包括尖晶石型铁氧体和/或六角型铁氧体;优选地,所述尖晶石型铁氧体包括镍锌铁氧体、锰锌铁氧体、锰镍铁氧体、镁锌铁氧体或镍铜锌铁氧体中的任意一种或至少两种的组合,进一步优选为镍锌铁氧体;优选地,所述六角型铁氧体包括Co 2Z型铁氧体和/或Co 2Y型铁氧体,进一步优选为Co 2Z型铁氧体;优选地,所述正温漂系数磁性填料采用如下方法制备得到,所述方法包括:将主料与辅料混合后进行烧结,将烧结产物粉碎,得到所述正温漂系数磁性填 料;所述主料为Fe 2O 3与ZnO、NiO、锰的氧化物或MgO中的至少两种的组合,所述辅料选自SiO 2、V 2O 5、BiO、SnO 2、HfO 2、Nb 2O 5、Ta 2O 5或CaCO 3中的任意一种或至少两种的组合;优选地,所述混合的方法为干法混合;优选地,所述混合的时间为0.5~3h;优选地,所述烧结的温度为800~1100℃;优选地,所述烧结的时间为3~5h;优选地,所述粉碎的方法为湿法球磨粉碎;优选地,所述主料中Fe 2O 3的摩尔百分含量为40~72%;优选地,所述主料中ZnO的摩尔百分含量为5~42%;优选地,所述主料中NiO的摩尔百分含量为5~22%;优选地,以所述主料的质量为100%计,所述SiO 2、V 2O 5、BiO、SnO 2、HfO 2、Nb 2O 5、Ta 2O 5、CaCO 3的质量各自独立地为0.01~0.8%;优选地,以所述主料的质量为100%计,所述SiO 2的质量为0.1~0.6%;优选地,以所述主料的质量为100%计,所述V 2O 5的质量为0.06~0.2%;优选地,以所述主料的质量为100%计,所述BiO的质量为0.1~0.6%;优选地,以所述主料的质量为100%计,所述SnO 2的质量为0.02~0.5%;优选地,以所述主料的质量为100%计,所述HfO 2的质量为0.01~0.1%;优选地,以所述主料的质量为100%计,所述Nb 2O 5的质量为0.01~0.08%;优选地,以所述主料的质量为100%计,所述Ta 2O 5的质量为0.01~0.1%;优选地,以所述主料的质量为100%计,所述CaCO 3的质量为0.02~0.2%;优选地,所述负温漂系数磁性填料采用如下方法制备得到,所述方法包括:将主料与辅料混合后进行烧结,将烧结产物粉碎,得到所述负温漂系数磁性填 料;所述主料为Fe 2O 3与ZnO、NiO、锰的氧化物或MgO中的至少两种的组合,所述辅料选自SiO 2、V 2O 5、BiO、SnO 2、HfO 2、Nb 2O 5、Ta 2O 5或CaCO 3中的任意一种或至少两种的组合;优选地,所述混合的方法为干法混合;优选地,所述混合的时间为0.5~3h;优选地,所述烧结的温度为800~1100℃;优选地,所述烧结的时间为3~5h;优选地,所述粉碎的方法为湿法球磨粉碎;优选地,所述主料中Fe 2O 3的摩尔百分含量为40~72%;优选地,所述主料中ZnO的摩尔百分含量为5~42%;优选地,所述主料中NiO的摩尔百分含量为5~22%;优选地,以所述主料的质量为100%计,所述SiO 2、V 2O 5、BiO、SnO 2、HfO 2、Nb 2O 5、Ta 2O 5、CaCO 3的质量各自独立地为0.01~0.8%;优选地,以所述主料的质量为100%计,所述SiO 2、V 2O 5、BiO、SnO 2的质量各自独立地为0.01~0.1%;优选地,以所述主料的质量为100%计,所述HfO 2的质量为0.15~0.6%;优选地,以所述主料的质量为100%计,所述Nb 2O 5的质量为0.06~0.3%;优选地,以所述主料的质量为100%计,所述Ta 2O 5的质量为0.2~0.6%;优选地,以所述主料的质量为100%计,所述CaCO 3的质量为0.4~0.8%。
- 根据权利要求1~4任一项所述的磁介电树脂组合物,其特征在于,所述磁性填料的质量占磁性填料与有机物总质量的20~90%;优选地,所述树脂包括环氧树脂、氰酸酯树脂、聚苯醚树脂、聚丁二烯树脂、丁苯树脂、马来酰亚胺-三嗪树脂、马来酰亚胺树脂、聚四氟乙烯树脂、聚 酰亚胺树脂、酚醛树脂、丙烯酸树脂、液晶树脂、苯并恶嗪树脂、酚氧树脂或丁腈橡胶中的任意一种或至少两种的组合。
- 根据权利要求1~5任一项所述的磁介电树脂组合物,其特征在于,所述磁介电树脂组合物中还包括固化剂和/或引发剂;优选地,所述固化剂、引发剂各自独立地包括有机过氧化物、胺类化合物、咪唑类化合物、酚类化合物、三氟化硼配合物、磷酸三苯酯或亚磷酸三苯酯中的任意一种或至少两种的组合;优选地,所述磁介电树脂组合物中还包括固化促进剂;优选地,所述固化促进剂包括咪唑类化合物、哌啶类化合物、吡啶类化合物或有机金属盐路易斯酸中的任意一种或至少两种的组合;优选地,所述咪唑类化合物包括2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-十一烷基咪唑、1-苄基-2-甲基咪唑、2-十七烷基咪唑、2-异丙基咪唑、2-苯基-4-甲基咪唑、2-十二烷基咪唑或1-氰乙基-2-甲基咪唑中的任意一种或至少两种的组合;优选地,所述磁介电树脂组合物中还包括交联剂;优选地,所述交联剂包括异氰脲酸三烯丙酯、聚异氰脲酸三烯丙酯、三聚氰酸三烯丙酯、三甲基丙烯酸、邻苯二甲酸二烯丙酯、二乙烯基苯或多官能丙烯酸酯中的任意一种或至少两种的组合;优选地,所述磁介电树脂组合物中还包括非磁性填料;优选地,所述非磁性填料包括二氧化硅、二氧化钛、钛酸钡、钛酸锶、钛酸镁、钛酸钙、钛酸锶钡、钙钛酸钡、钛酸铅、锆钛酸铅、锆钛酸镧铅、钛酸镧钡、钛酸锆钡、二氧化铪、铌镁酸铅、铌镁酸钡、铌酸锂、铌酸钾、钽酸铝锶、铌酸钽钾、铌酸锶钡、铌酸钡铅、铌酸钛钡、钽酸铋锶、钛酸铋、钛酸钡 铷、钛酸铜或铌镁酸铅-钛酸铅中的任意一种或至少两种的组合;优选地,所述磁介电树脂组合物中还包括阻燃剂。
- 一种用权利要求1~6任一项所述的磁介电树脂组合物制备的涂树脂铜箔或树脂膜。
- 一种预浸料,其特征在于,所述预浸料包括增强材料,以及通过浸渍干燥附着于所述增强材料上的如权利要求1~6任一项所述的磁介电树脂组合物。
- 一种覆铜板,其特征在于,所述覆铜板包括至少一张如权利要求8所述的预浸料,以及设置于所述预浸料的一侧或两侧的铜箔。
- 一种印刷线路板,其特征在于,所述印刷线路板包括至少一张如权利要求8所述的预浸料或如权利要求9所述的覆铜板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011166888.8 | 2020-10-27 | ||
CN202011166888.8A CN114479418B (zh) | 2020-10-27 | 2020-10-27 | 一种磁介电树脂组合物及其应用 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022088248A1 true WO2022088248A1 (zh) | 2022-05-05 |
Family
ID=81381480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2020/127789 WO2022088248A1 (zh) | 2020-10-27 | 2020-11-10 | 一种磁介电树脂组合物及其应用 |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN114479418B (zh) |
TW (1) | TWI771826B (zh) |
WO (1) | WO2022088248A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115073864B (zh) * | 2022-07-05 | 2023-11-10 | 陕西生益科技有限公司 | 一种磁介电无纺布预浸料、包含其的覆铜板及应用 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1876705A (zh) * | 2006-07-13 | 2006-12-13 | 内蒙古科技大学 | 用于温度和应力传感器的聚合物导电复合材料及制备方法 |
CN106205910A (zh) * | 2016-07-26 | 2016-12-07 | 厦门火炬特种金属材料有限公司 | 一种复合精密电阻带材 |
US20180153453A1 (en) * | 2016-12-05 | 2018-06-07 | Biotronik Se & Co. Kg | Sensor system, method and cross-linked hydrogel for detecting the presence or concentration of analytes |
CN109553955A (zh) * | 2018-11-12 | 2019-04-02 | 陕西生益科技有限公司 | 一种磁介电树脂组合物及其应用 |
CN110113026A (zh) * | 2019-05-22 | 2019-08-09 | 武汉大学 | 一种二维兰姆波谐振器 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101821009B1 (ko) * | 2014-10-10 | 2018-01-22 | 주식회사 두산 | 열경화성 수지 조성물, 이의 제조방법 및 상기 열경화성 수지 조성물을 이용한 프리프레그, 금속박 적층판 및 인쇄회로기판 |
TWI663896B (zh) * | 2014-10-15 | 2019-06-21 | 美商羅傑斯公司 | 磁-電介質基板、製作該磁-電介質基板之方法及包含該磁-電介質基板之物件 |
CN107347258B (zh) * | 2015-03-19 | 2022-03-01 | 罗杰斯公司 | 磁介电基底、电路材料以及具有其的组合件 |
US10707110B2 (en) * | 2015-11-23 | 2020-07-07 | Lam Research Corporation | Matched TCR joule heater designs for electrostatic chucks |
-
2020
- 2020-10-27 CN CN202011166888.8A patent/CN114479418B/zh active Active
- 2020-11-10 WO PCT/CN2020/127789 patent/WO2022088248A1/zh active Application Filing
- 2020-12-15 TW TW109144331A patent/TWI771826B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1876705A (zh) * | 2006-07-13 | 2006-12-13 | 内蒙古科技大学 | 用于温度和应力传感器的聚合物导电复合材料及制备方法 |
CN106205910A (zh) * | 2016-07-26 | 2016-12-07 | 厦门火炬特种金属材料有限公司 | 一种复合精密电阻带材 |
US20180153453A1 (en) * | 2016-12-05 | 2018-06-07 | Biotronik Se & Co. Kg | Sensor system, method and cross-linked hydrogel for detecting the presence or concentration of analytes |
CN109553955A (zh) * | 2018-11-12 | 2019-04-02 | 陕西生益科技有限公司 | 一种磁介电树脂组合物及其应用 |
CN110113026A (zh) * | 2019-05-22 | 2019-08-09 | 武汉大学 | 一种二维兰姆波谐振器 |
Also Published As
Publication number | Publication date |
---|---|
CN114479418B (zh) | 2023-08-11 |
TW202216893A (zh) | 2022-05-01 |
TWI771826B (zh) | 2022-07-21 |
CN114479418A (zh) | 2022-05-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7790268B2 (en) | Circuit materials, multilayer circuits, and methods of manufacture thereof | |
CN112552630B (zh) | 一种树脂组合物及包含其的树脂胶液、预浸料、层压板、覆铜板和印刷电路板 | |
KR20170063958A (ko) | 자기 유전기판, 회로 재료 및 이들을 갖는 어셈블리 | |
WO2022120921A1 (zh) | 一种含氟树脂组合物及包含其的树脂胶液、含氟介质片、层压板、覆铜板和印刷电路板 | |
CN111344351B (zh) | 树脂组合物、带树脂铜箔、介电层、覆铜层叠板、电容器元件以及内置电容器的印刷电路板 | |
JP2009073987A (ja) | 高誘電樹脂組成物 | |
KR20150047880A (ko) | 인쇄회로기판용 절연 수지 조성물 및 이를 이용한 제품 | |
CN109553955A (zh) | 一种磁介电树脂组合物及其应用 | |
KR20180007306A (ko) | 열경화성 수지 조성물, 이를 이용한 프리프레그, 적층 시트 및 인쇄회로기판 | |
TWI771826B (zh) | 一種磁介電樹脂組成物及其應用 | |
CN115073864B (zh) | 一种磁介电无纺布预浸料、包含其的覆铜板及应用 | |
TWI755974B (zh) | 一種磁介電樹脂組成物及包含其的預浸料及覆銅板 | |
CN115198563A (zh) | 一种无纺布及其制备方法和应用 | |
CN115651335A (zh) | 一种树脂组合物及包含其的预浸料、覆铜板 | |
CN112538254A (zh) | 一种磁介电树脂组合物、包含其的层压板及其印刷电路板 | |
CN112538253A (zh) | 一种磁介电树脂组合物、包含其的层压板及其印刷电路板 | |
CN115302869A (zh) | 一种高频覆铜板及包含其的印制电路板 | |
JPH05128912A (ja) | 複合誘電体および回路用基板 | |
CN112662127A (zh) | 一种磁介电树脂组合物、包含其的层压板及其印刷电路板 | |
CN112824451B (zh) | 低介电树脂组合物、半固化片、及覆铜层压板 | |
TW202411318A (zh) | 預浸體、積層板、印刷線路板及半導體封裝體 | |
CN114957893A (zh) | 一种无纺布预浸料、覆铜板及其应用 | |
Yu et al. | Polymer Composites for Embedded Capacitors | |
WO2023218976A1 (ja) | 熱硬化性樹脂組成物、プリプレグ、樹脂フィルム、積層板、プリント配線板、アンテナ装置、アンテナモジュール及び通信装置 | |
CN115023348A (zh) | 树脂层叠体、电介质层、带树脂的金属箔、电容器元件及电容器内置印刷电路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 20959408 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20959408 Country of ref document: EP Kind code of ref document: A1 |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 28/09/2023). |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 20959408 Country of ref document: EP Kind code of ref document: A1 |