CN115302869A - 一种高频覆铜板及包含其的印制电路板 - Google Patents
一种高频覆铜板及包含其的印制电路板 Download PDFInfo
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- CN115302869A CN115302869A CN202210790270.1A CN202210790270A CN115302869A CN 115302869 A CN115302869 A CN 115302869A CN 202210790270 A CN202210790270 A CN 202210790270A CN 115302869 A CN115302869 A CN 115302869A
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- prepreg
- woven fabric
- clad plate
- copper
- parts
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- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 26
- 239000011737 fluorine Substances 0.000 claims abstract description 26
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011889 copper foil Substances 0.000 claims abstract description 18
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- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 claims description 3
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 claims description 3
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- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 2
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- IVUXZQJWTQMSQN-UHFFFAOYSA-N distrontium;oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[Sr+2].[Sr+2].[Ta+5].[Ta+5] IVUXZQJWTQMSQN-UHFFFAOYSA-N 0.000 claims description 2
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Abstract
本发明提供一种高频覆铜板及包含其的印制电路板,所述高频覆铜板包括预浸料层以及设置于所述预浸料层两侧的铜箔;所述预浸料层包括依次设置的第一无纺布预浸料、芯层预浸料和第二无纺布预浸料;所述第一无纺布预浸料、第二无纺布预浸料中的无纺布由无机纤维和含氟树脂乳液粘结剂组成;所述芯层预浸料包括至少一张玻璃布预浸料。本发明将特定的无纺布预浸料与玻璃布预浸料复配形成层叠结构,使所述高频覆铜板的介电损耗低,介电一致性和均匀性好,耐热性优异,可靠性高,充分满足了高频高速板材的性能要求。
Description
技术领域
本发明属于覆铜板技术领域,具体涉及一种高频覆铜板及包含其的印制电路板。
背景技术
近年来,计算机、手机、智能穿戴设备等电子产品面向高性能化、高功能化和网络化发展,为了实现高速传输和处理大容量信息,操作信号呈现高频化的趋势,因此,需要一种适用于高频信号传输特性的高性能电绝缘材料。
在高频电路中,电信号传输损失用介电损耗、导体损失与辐射损失之和表示,电信号频率越高,则介电损耗、导体损失和辐射损失越大。由于传输损失使电信号衰减,破坏电信号的可靠性,同时该损耗从高频电路辐射,可能造成电子设备故障,因此,减小介电损耗、导体损耗和辐射损耗是十分必要的。众所周知,电信号的介电损耗与形成电路的绝缘体的介质损耗角正切及所使用的电信号频率的乘积成正比,因此,作为绝缘体,可以通过选择介质损耗角正切小的绝缘材料,以抑制介电损耗的增大。
覆铜板具有承载装联电子元器件、形成导电线路图形、在层间/线路间绝缘的功能,是基础的电子材料。覆铜板包括铜箔、增强材料和树脂材料,增强材料的性质会直接影响覆铜板的各项性能,进而影响电子产品的信号传输。玻璃布是目前最常用的增强材料之一,其在绝缘性、机械强度和柔韧性等方面都具有良好的表现,但是,玻璃布采用经纬编织而成,极易形成布纹,制备的覆铜板均匀性欠佳,导致覆铜板不同位置的介电常数、介电损耗、热膨胀性能有所不同,进而影响信号传输品质。
与玻璃布相比,无纺布具有各向同性的特点,可以规避经纬编织导致的不均匀问题。例如CN102029746A公开了一种覆铜板,所述覆铜板包括:至少一层玻纤布增强半固化片、覆合于玻纤布增强半固化片两侧的玻纤纸增强半固化片以及覆合于玻纤纸增强半固化片上的铜箔;其中,玻纤纸是由玻璃纤维和胶粘剂制成的无纺布,玻纤纸增强半固化片的引入降低了布纹的出现几率,提高了覆铜板的电气可靠性。CN108130784A公开了用于CEM-3覆铜箔板的E玻璃纤维纸及其制作方法,所述E玻璃纤维纸由电子级的E型玻璃纤维和环氧树脂粘结剂制成,是良好的CEM-3覆铜箔板基材。但是,现有的无纺布中的粘结剂以环氧树脂粘结剂居多,此外还有丙烯酸酯类粘结剂、三聚氰胺类粘结剂或聚乙烯醇类粘结剂,上述粘结剂的介电损耗高,无法用于高频产品中,而且无纺布的增强效果、力学性能和耐热性也存在明显的不足之处。
总体而言,目前常用的玻璃布增强材料由于经纬编织导致的均匀性缺陷难以克服,而各向同性的无纺布无法满足高频传输所要求的介电性能。因此,开发一种兼具优异的介电性能、均匀性、力学性能和耐热性的覆铜板,以满足高频传输的应用需求,是本领域亟待解决的问题。
发明内容
针对现有技术的不足,本发明的目的在于提供一种高频覆铜板及包含其的印制电路板,通过无纺布预浸料中无纺布的设计及其与玻璃布预浸料的相互复配,得到特定的层叠结构,使所述高频覆铜板的介电损耗低,力学强度高,介电一致性和均匀性好,耐热性优异,充分满足了高频高速传输的应用要求。
为达此目的,本发明采用以下技术方案:
第一方面,本发明提供一种高频覆铜板,所述高频覆铜板包括预浸料层以及设置于所述预浸料层两侧的铜箔,所述预浸料层包括依次设置的第一无纺布预浸料、芯层预浸料和第二无纺布预浸料;
所述第一无纺布预浸料、第二无纺布预浸料中的无纺布由无机纤维和含氟树脂乳液粘结剂组成;
所述芯层预浸料包括至少一张玻璃布预浸料;
所述第一无纺布预浸料、第二无纺布预浸料、玻璃布预浸料各自独立地包括无纺布或玻璃布以及附着于其上的热固性树脂组合物,所述热固性树脂组合物中的树脂各自独立地选自聚苯醚树脂、聚烯烃树脂、多官能乙烯基芳香族聚合物、马来酰亚胺化合物或氰酸酯树脂中的任意一种或至少两种的组合。
本发明通过无纺布中含氟树脂乳液粘结剂的设计,使作为增强材料的所述无纺布具有低的介电损耗,纤维各向分布一致,均匀性好,厚度一致,拉伸强度高,耐热性佳,浸渍介电性能优异的热固性树脂(例如聚苯醚树脂、聚烯烃树脂、多官能乙烯基芳香族聚合物、马来酰亚胺化合物或氰酸酯树脂等),制备低介电损耗的高频覆铜板。本发明提供的高频覆铜板中,所述预浸料层包括两张无纺布预浸料(第一无纺布预浸料、第二无纺布预浸料)和设置于二者之间的芯层预浸料,芯层预浸料中包括至少一张玻璃布预浸料,将特定的无纺布预浸料与玻璃布预浸料搭配形成层叠结构,避免了覆铜板中玻璃布预浸料与铜箔直接接触,不会出现布纹、白点等缺陷,使所述高频覆铜板具有更低的介电损耗,力学强度和弯曲性能高,介电一致性和均匀性高,耐热性好,可靠性高,充分满足了高频高速板材的性能要求。
本发明中,所述芯层预浸料中包括至少一张玻璃布预浸料,例如玻璃布预浸料的张数可以为1、2、3、4、5、6或7等。此外,所述芯层预浸料中还包括可选地无纺布预浸料,所述芯层预浸料中的玻璃布预浸料与可选地无纺布预浸料以任意可行的方式叠合。
所述芯层预浸料中玻璃布预浸料的张数≥2时,多个玻璃布预浸料相同或不同。
优选地,所述无纺布中无机纤维的质量百分含量为60-95%,例如可以为62%、65%、68%、70%、72%、75%、78%、80%、82%、85%、88%、90%、92%或94%等。
优选地,所述无纺布中含氟树脂乳液粘结剂的质量百分含量为5-40%,例如可以为8%、10%、12%、15%、18%、20%、22%、25%、28%、30%、32%、35%或38%等。在本发明中,如果所述含氟树脂乳液粘结剂的质量百分含量过低,则粘结剂无法连续成膜,造成无纺布强度低;如果含氟树脂乳液粘结剂的质量百分含量过高,则会造成无纺布内部空洞多,缺陷多,导致无纺布的强度低,进而影响介电损耗及粘结性。
优选地,所述无纺布的单重(又称单位面积质量)为20-200g/m2,例如可以为30g/m2、40g/m2、50g/m2、70g/m2、90g/m2、100g/m2、110g/m2、130g/m2、150g/m2、170g/m2或190g/m2等,进一步优选20-100g/m2。
优选地,所述无纺布10GHz的介电损耗<0.0015,例如10GHz的介电损耗可以为0.0014、0.0013、0.0012、0.0011、0.0010、0.0009、0.0008或0.0007等。
本文中介电常数和介电损耗采用SPDR(split post dielectric resonator)法进行测试,频率为10GHz。
优选地,所述无机纤维选自E玻璃纤维、NE玻璃纤维、L玻璃纤维、石英纤维、氧化铝纤维、氮化硼纤维、碳化硅纤维、氧化锌纤维、氧化镁纤维、氮化硅纤维、碳化硼纤维、氮化铝纤维、氧化铝晶须、氮化硼晶须、碳化硅晶须、氧化锌晶须、氧化镁晶须、氮化硅晶须、碳化硼晶须或氮化铝晶须中的任意一种或至少两种的组合。
优选地,所述无机纤维的平均直径<10μm,例如可以为9μm、8μm、7μm、6μm、5μm、4μm、3μm、2μm或1μm等,进一步优选1-5μm。无机纤维直径,是指无机纤维的单丝直径,一般情况下,单丝长度大于单丝直径,较优地,单丝纤维的长径比大于10,或者大于50,或者大于100。
优选地,所述无机纤维的平均长度为1-100mm,例如可以为2mm、5mm、8mm、10mm、20mm、30mm、40mm、50mm、60mm、70mm、80mm或90mm等,进一步优选1-10mm。
示例性地,所述无机纤维的平均直径和平均长度可采用扫描电子显微镜观察测试获得。
优选地,所述含氟树脂乳液粘结剂选自聚全氟乙丙烯(FEP)乳液、聚偏氟乙烯(PVDF)乳液、聚四氟乙烯(PTFE)乳液、四氟乙烯-全氟烷基乙烯基醚共聚物(PFA)乳液、乙烯-四氟乙烯共聚物乳液、聚三氟氯乙烯(PCTFE)乳液或乙烯-三氟氯乙烯共聚物乳液中的任意一种或至少两种的组合。
优选地,所述含氟树脂乳液粘结剂的固含量为30-70%,例如可以为32%、35%、38%、40%、42%、45%、48%、50%、52%、55%、58%、60%、62%、65%或68%等。
优选地,所述含氟树脂乳液粘结剂中乳胶颗粒的粒径为0.10-0.40μm,例如可以为0.12μm、0.15μm、0.18μm、0.20μm、0.22μm、0.25μm、0.28μm、0.30μm、0.32μm、0.35μm或0.38μm等。
示例性地,所述含氟树脂乳液粘结剂中乳胶颗粒的粒径采用激光衍射法测试,测试仪器马尔文激光粒度仪,型号MS3000。
优选地,所述含氟树脂乳液粘结剂可以根据需要添加溶剂去溶解稀释到合适的粘度,来使得制备的无纺布中的纤维、粘结剂分散均匀,溶剂示例性地包括但不限于去离子水等。溶剂会随着无纺布制备过程的烘干、烧结而挥发。
优选地,所述含氟树脂乳液粘结剂还可以包括消泡剂、分散剂、增稠剂等。
优选地,所述无纺布采用如下方法进行制备,所述方法包括:将无机纤维与粘结剂混合,浸渍,经过抄纸成型后干燥,得到所述无纺布。在制备过程中可以控制无纺布中无机纤维、含氟树脂乳液粘结剂、溶剂的添加量以及车速来获得不同单重的无纺布。
优选地,所述浸渍的时间为40-50min,例如41min、43min、45min、47min或49min等。
优选地,所述干燥的温度为120-150℃,例如122℃、125℃、128℃、130℃、132℃、135℃、138℃、140℃、142℃、145℃或148℃等。
优选地,所述干燥的时间为1-30min,例如1min、3min、5min、8min、10min、13min、15min、18min或20min等。
优选地,所述干燥后包括烧结的步骤,使含氟树脂熔融成膜。
优选地,所述烧结的温度为250℃-350℃,例如250℃、270℃、290℃、300℃、320℃、340℃或350℃等。
优选地,所述烧结的时间为1-30min,例如1min、3min、5min、8min、10min、13min、15min、18min、20min、23min、26min或30min等。
优选地,所述第一无纺布预浸料、第二无纺布预浸料、玻璃布预浸料中热固性树脂组合物的质量百分含量各自独立地为60-95%,例如可以为62%、65%、68%、70%、72%、75%、78%、80%、82%、85%、88%、90%、92%或94%等。
需要说明的是,所述第一无纺布预浸料、第二无纺布预浸料、玻璃布预浸料中的热固性树脂组合物的组分相同或不同,含量相同或不同。
优选地,所述热固性树脂组合物各自独立地包括树脂,以及可选地交联剂、可选地引发剂、可选地阻燃剂、可选地填料、可选地偶联剂中的任意一种或至少两种的组合。
优选地,所述聚苯醚树脂为含不饱和基团的聚苯醚,进一步优选为不饱和基团封端的聚苯醚。
优选地,所述不饱和基团包括乙烯基、乙烯基苯基、乙烯基苄基、丙烯酸酯基或甲基丙烯酸酯基中的任意一种或至少两种组合。
优选地,所述聚烯烃树脂包括聚丁二烯树脂、苯乙烯-丁二烯共聚物或苯乙烯-丁二烯-苯乙烯三嵌段共聚物中的任意一种或至少两种的组合。
可选地,所述聚丁二烯树脂为极性基团改性聚丁二烯树脂,所述极性基团改性聚丁二烯树脂选自环氧改性聚丁二烯树脂、马来酸酐改性聚丁二烯树脂、丙烯酸改性聚丁二烯树脂、羟基封端的聚丁二烯树脂、羧基封端的聚丁二烯树脂、胺改性的聚丁二烯树脂中的任意一种或至少两种的组合。
优选地,所述树脂包括含不饱和基团的聚苯醚、聚丁二烯树脂、丁二烯-苯乙烯共聚物、苯乙烯-丁二烯-苯乙烯三嵌段共聚物或马来酰亚胺化合物中的任意一种或至少两种的组合。
在一个优选实施方式中,所述树脂以重量份计包括:聚丁二烯树脂20-60份(例如25份、30份、35份、40份、45份、50份或55份等),马来酰亚胺化合物10-50份(例如15份、20份、25份、30份、35份、40份或45份等)。
在另一优选实施方式中,所述树脂以重量份计包括:含不饱和基团的聚苯醚50-90份(例如55份、60份、65份、70份、75份、80份或85份等),苯乙烯-丁二烯共聚物10-50份(例如15份、20份、25份、30份、35份、40份或45份等)。
优选地,所述交联剂包括异氰脲酸三烯丙酯、聚异氰脲酸三烯丙酯、三烯丙酯三聚氰酸酯、邻苯二甲酸二烯丙酯、三甲基丙烯酸、二乙烯基苯或多官能丙烯酸酯中的任意一种或至少两种的组合。
优选地,以所述树脂的质量为100份计,所述交联剂的质量为1-40份,例如可以为3份、5份、8份、10份、12份、15份、18份、20份、22份、25份、28份、30份、32份、35份或38份等。
优选地,所述引发剂包括有机过氧化物、有机胺、有机膦、磷酸酯、亚磷酸酯、磷酸、酚类化合物、咪唑类化合物、三氟化硼及其络合物中的任意一种或至少两种的组合,进一步优选有机过氧化物。
优选地,所述引发剂包括α,α'-二(叔丁基过氧化间异丙)苯、过氧化二异丙苯、过氧化苯甲酰、叔丁基过氧化异丙苯、1,1-双(叔己基过氧化)-3,3,5-三甲基环己烷、2,5-二甲基-2,5-二(叔丁基过氧基)-3-己炔、过氧化辛酸叔丁酯、过氧化苯甲酸叔丁酯、三级胺、三级胺盐、四级胺盐化合物、2,4,6-三(二甲胺基甲胺)苯酚、苄基二甲胺、咪唑类化合物、三戊基酚酸胺、单酚化合物、多酚化合物、三氟化硼及其有机物的络合物、磷酸或亚磷酸三苯酯中的任意一种或至少两种的组合。
优选地,所述引发剂包括α,α'-二(叔丁基过氧化间异丙)苯、过氧化二异丙苯、过氧化苯甲酰、叔丁基过氧化异丙苯、1,1-双(叔己基过氧化)-3,3,5-三甲基环己烷、2,5-二甲基-2,5-二(叔丁基过氧基)-3-己炔、过氧化辛酸叔丁酯或过氧化苯甲酸叔丁酯中的任意一种或至少两种的组合。
优选地,以所述树脂的质量为100份计,所述引发剂的质量为0.1-7份,例如可以为0.5份、1份、1.5份、2份、2.5份、3份、3.5份、4份、4.5份、5份、5.5份、6份或6.5份等。
本发明对于阻燃剂没有特别限定,具有阻燃效果的阻燃剂均可应用于所述所述热固性树脂组合物中。
优选地,所述阻燃剂包括氮系阻燃剂、卤系阻燃剂(例如含溴阻燃剂和/或含氯阻燃剂)、磷系阻燃剂或金属氢氧化物阻燃剂中的任意一种或至少两种的组合。
优选地,所述阻燃剂包括十溴二苯醚、乙基-双(四溴苯邻二甲酰亚胺)、十溴二苯基乙烷、三(2,6-二甲基苯基)膦、10-(2,5-二羟基苯基)-9,10-二氢-9-氧化-10膦菲-10-氧化物、2,6-二(2,6-二甲基苯基)膦基苯或10-苯基-9,10-二氢-9-氧化-10-膦菲-10-氧化物中的任意一种或至少两种的组合。
优选地,以所述树脂的质量为100份计,所述阻燃剂的质量为1-40份,例如可以为3份、5份、8份、10份、12份、15份、18份、20份、22份、25份、28份、30份、32份、35份或38份等。
优选地,所述填料包括二氧化硅、二氧化钛、氮化硼、氮化铝、碳化硅、氧化铝、钛酸钡、钛酸锶、钛酸镁、钛酸钙、钛酸锶钡、钙钛酸钡、钛酸铅、锆钛酸铅、锆钛酸镧铅、钛酸镧钡、钛酸锆钡、二氧化铪、铌镁酸铅、铌镁酸钡、铌酸锂、铌酸钾、钽酸铝锶、铌酸钽钾、铌酸锶钡、铌酸钡铅、铌酸钛钡、钽酸铋锶、钛酸铋、钛酸钡铷、钛酸铜或钛酸铅-铌镁酸铅中的任意一种或至少两种的组合。
优选地,所述二氧化硅包括结晶型二氧化硅、无定型二氧化硅、球型二氧化硅中的任意一种或至少两种的组合。
优选地,所述填料的中值粒径(D50)为0.5-20μm,例如可以为1μm、2μm、3μm、4μm、5μm、6μm、7μm、8μm、9μm、10μm、11μm、13μm、15μm、17μm或19μm等,进一步优选1-15μm,更进一步优选4-10μm。
示例性地,所述填料的粒径采用MS3000马尔文激光粒度仪测试得到。
优选地,以所述树脂的质量为100份计,所述填料的质量为1-300份,例如可以为5份、10份、20份、30份、50份、70份、90份、100份、120份、150份、180份、200份、220份、250份或280份等。
优选地,所述偶联剂包括硅烷偶联剂、钛酸酯偶联剂、硼酸酯偶联剂、锆酸酯偶联剂或磷酸酯偶联剂中的任意一种或至少两种的组合,进一步优选硅烷偶联剂。
上述的热固性树脂组合物中还可以包含可选地其他助剂,以提高预浸料的使用性能和加工性等。
上述的热固性树脂组合物中还可以加入溶剂,溶剂的添加量由本领域技术人员根据工艺需求来选择,使树脂组合物达到适合使用的粘度,以便于热固性树脂组合物的浸渍、涂覆等即可。后续在烘干、半固化或完全固化环节,热固性树脂组合物中的溶剂会部分或完全挥发。
作为本发明的溶剂,没有特别限定,一般可选用丙酮、丁酮、环己酮等酮类,甲苯、二甲苯等芳香烃类,醋酸乙酯、醋酸丁酯等酯类,甲醇、乙醇或丁醇等醇类,乙基溶纤剂、丁基溶纤剂、乙二醇单甲醚、卡必醇或丁基卡必醇等醇类,N,N-二甲基甲酰胺、N,N-二甲基乙酰胺或N-甲基-2-吡咯烷酮等含氮类;溶剂可以单独使用,也可两种或两种以上混合使用。优选丙酮、丁酮、环己酮等酮类,以及甲苯、二甲苯等芳香烃类。
示例性地,本发明中的预浸料(无纺布预浸料、玻璃布预浸料)的制备方法为:采用热固性树脂组合物的树脂胶液浸润增强材料后,干燥,得到所述预浸料;所述增强材料为无纺布或玻璃布。
优选地,所述干燥的温度为100-180℃,例如105℃、110℃、115℃、120℃、125℃、130℃、135℃、140℃、145℃、150℃、155℃、160℃、165℃、170℃或175℃等。
优选地,所述铜箔与预浸料层之间还包括粘结层。
优选地,所述粘结层涂覆于铜箔上(即采用涂树脂铜箔与预浸料层叠合)或以粘结树脂膜的形式存在。
优选地,所述粘结层的材料包括聚苯醚树脂、聚丁二烯树脂、苯乙烯-丁二烯共聚物、苯乙烯-丁二烯-苯乙烯三嵌段共聚物、多官能乙烯基芳香族共聚物、有机硅树脂、氰酸酯树脂或马来酰亚胺化合物中的任意一种或至少两种的组合。
优选地,所述高频覆铜板的制备方法包括:将第一无纺布预浸料、芯层预浸料和第二无纺布预浸料叠合成预浸料层,在所述预浸料层的两侧压合铜箔后,固化,得到所述高频覆铜板。
优选地,所述固化在压机中进行。
优选地,所述固化的温度为170-280℃,例如180℃、190℃、200℃、210℃、220℃、230℃、240℃、250℃、260℃或270℃等。
优选地,所述固化的压力为1-10MPa,例如1.5MPa、2MPa、3MPa、4MPa、5MPa、6MPa、7MPa、8MPa或9MPa等。
优选地,所述固化的时间为30-150min,例如40min、50min、60min、70min、80min、90min、100min、110min、120min、130min、140min或145min等。
第二方面,本发明提供一种印制电路板,所述印制电路板包括如第一方面所述的高频覆铜板。
相对于现有技术,本发明具有以下有益效果:
本发明提供的高频覆铜板中,将特定的无纺布预浸料与玻璃布预浸料复配形成层叠结构,使覆铜板中预浸料与铜箔接触的位置不会出现布纹、白点等缺陷,使所述高频覆铜板的介电损耗低,10GHz的介电损耗<0.0025,力学强度高,弯曲强度≥155MPa,介电一致性和均匀性好,耐热性优异,288℃热应力>5min,兼具优异的介电性能、均匀性、力学性能、耐热性和可靠性,充分满足了高频高速板材的性能要求。
具体实施方式
下面通过具体实施方式来进一步说明本发明的技术方案。本领域技术人员应该明了,所述实施例仅仅是帮助理解本发明,不应视为对本发明的具体限制。
本发明以下具体实施方式中,用于无纺布的原料如下:
(1)无机纤维
平均直径为5μm的E玻璃纤维,中国巨石股份有限公司;
平均直径为5μm的NE玻璃纤维,中国巨石股份有限公司;
平均直径分别为0.5μm和5μm的石英纤维,中国神玖。
(2)粘结剂
聚全氟乙丙烯(FEP)乳液,粒径为0.20μm,固含量为50%,日本大金公司的ND-110;
四氟乙烯-全氟烷基乙烯基醚共聚物(PFA)乳液,粒径为0.20μm,固含量为55%,日本大金公司的AD-2CR;
聚四氟乙烯(PTFE)乳液,粒径为0.25μm,固含量为55%,日本大金公司的D210C。
制备例1
无纺布A,由E玻璃纤维和含氟树脂乳液粘结剂组成,所述含氟树脂乳液粘结剂为FEP乳液,具体制备方法如下:
以重量份计,将95份E玻璃纤维(平均直径为5μm)与5份FEP乳液和适量去离子水混合后浸渍45min,经抄纸成型后,于150℃烘箱中干燥,再置于高温烘箱中300℃烧结30min,取出冷却,得到单重为75g/m2的无纺布A。
制备例2
无纺布B,由NE玻璃纤维和含氟树脂乳液粘结剂组成,所述含氟树脂乳液粘结剂为FEP乳液,具体制备方法如下:
以重量份计,将55份NE玻璃纤维(平均直径为5μm)与45份PFA乳液和适量去离子水混合后浸渍45min,经抄纸成型后,于150℃烘箱中干燥,再置于高温烘箱中300℃烧结30min,取出冷却,得到单重为75g/m2的无纺布B。
制备例3
无纺布C,由NE玻璃纤维和含氟树脂乳液粘结剂组成,所述含氟树脂乳液粘结剂为PTFE乳液,具体制备方法如下:
以重量份计,将70份NE玻璃纤维(平均直径为5μm)与30份PTFE乳液和适量去离子水混合后浸渍45min,经抄纸成型后,于150℃烘箱中干燥,再置于高温烘箱中340℃烧结30min,取出冷却,得到单重为75g/m2的无纺布C。
制备例4
无纺布D,由E玻璃纤维和含氟树脂乳液粘结剂组成,所述含氟树脂乳液粘结剂为FEP乳液,具体制备方法如下:
以重量份计,将80份E玻璃纤维(平均直径为5μm)与20份FEP乳液和适量去离子水混合后浸渍45min,经抄纸成型后,于150℃烘箱中干燥,再置于高温烘箱中300℃烧结30min,取出冷却,得到单重为75g/m2的无纺布D。
制备例5
无纺布E,由E玻璃纤维和含氟树脂乳液粘结剂组成,所述含氟树脂乳液粘结剂为FEP乳液,具体制备方法如下:
以重量份计,将95份E玻璃纤维(平均直径为5μm)与5份FEP乳液和适量去离子水混合后浸渍45min,经抄纸成型后,于150℃烘箱中干燥,再置于高温烘箱中300℃烧结30min,取出冷却,得到单重为50g/m2的无纺布E。
制备例6
无纺布F,由石英纤维和含氟树脂乳液粘结剂组成,所述含氟树脂乳液粘结剂为FEP乳液,具体制备方法如下:
以重量份计,将90份石英纤维(平均直径0.5μm和5μm,重量比为1:4)与10份FEP乳液和适量去离子水混合后浸渍45min,经抄纸成型后,于150℃烘箱中干燥,再置于高温烘箱中300℃烧结30min,取出冷却,得到单重为20g/m2的无纺布F。
本发明以下具体实施方式中,用于覆铜板的原料如下:
(1)无纺布
采用制备例1-6提供的无纺布,具体材料及参数如表1所示:
表1
无纺布D1,由环氧粘结剂和平均直径为13μm的E玻璃纤维组成,单重为75g/m2,购自陕西华特;
无纺布D2,由丙烯酸酯粘结剂和平均直径为13μm的E玻璃纤维组成,单重为75g/m2,购自陕西华特;
无纺布D3,由三聚氰胺粘结剂和平均直径为13μm的E玻璃纤维组成,单重为75g/m2,购自陕西华特。
(2)玻璃布
玻璃布106,中国巨石股份有限公司;
玻璃布1080,中国巨石股份有限公司;
玻璃布1078,中国巨石股份有限公司。
(3)热固性树脂组合物
热固性树脂组合物A,以重量份计包括如下组分:30份双马来酰亚胺(BMI-5100,日本大和化成株式会社),40份聚丁二烯(分子量为3200g/mol,日本曹达株式会社),70份硅微粉(SJF0100E,壹石通股份有限公司),2份过氧化苯甲酰。按照前述配方量将热固性树脂组合物A溶于50份二甲苯中,混合均匀,得到均一的树脂胶液A。
热固性树脂组合物B,以重量份计包括如下组分:70份聚苯醚树脂MMA-PPE(SA9000,SABIC公司),30份苯乙烯-丁二烯共聚物(R100,Sartomer公司),3份过氧化异丙苯,15份含溴阻燃剂乙基-双(四溴苯邻二甲酰亚胺)(BT-93W,雅宝公司,溴含量67.2%)。按照前述配方量将热固性树脂组合物B与70份甲苯溶剂混合,充分搅拌分散均匀,得到均一的树脂胶液B。
实施例1
一种高频覆铜板,包括预浸料层以及设置于所述预浸料层两侧的铜箔;所述预浸料层包括依次设置的第一无纺布预浸料、玻璃布预浸料(芯层预浸料)和第二无纺布预浸料;所述第一无纺布预浸料、第二无纺布预浸料中的无纺布均为无纺布A(制备例1);其制备方法如下:
(1)用无纺布A浸渍树脂胶液A,155℃烘烤干燥5min,得到热固性树脂组合物的质量百分含量为60%的无纺布预浸料;用玻璃布106浸渍树脂胶液B,155℃烘烤干燥5min,得到热固性树脂组合物的质量百分含量为90%的玻璃布预浸料;
(2)将步骤(1)得到的无纺布预浸料和玻璃布预浸料按照“1张无纺布预浸料-1张玻璃布预浸料-1张无纺布预浸料”的顺序叠合,在其上下两侧覆盖铜箔,于压机中210℃、5MPa固化2h,得到所述高频覆铜板。
对所述高频覆铜板进行如下性能测试:
(1)介电损耗因子Df:使用谐振腔法(SPDR)法进行测定,频率为10GHz;
(2)热应力:按照IPC-650方法测试板材288℃的热应力;
(3)弯曲强度:按照IPC-650方法测试板材的弯曲强度;
(4)布纹:采用扫描电子显微镜(SEM,SU3500,日本日立株式会社)观察板材横截面,判断是否有布纹;
具体测试结果如表1所示。
实施例2-6,比较例1-5
一种高频覆铜板,其与实施例1的区别在于,预浸料的种类和/或层叠结构不同,具体如表2和表3所示;其中,“热固性树脂组合物比例(%)”意指无纺布预浸料/玻璃布预浸料中的热固性树脂组合物的质量百分含量,“结构”意指两张铜箔之间的预浸料层的层叠结构。按照实施例1中相同的方法制备高频覆铜板并对其进行性能测试,测试结果如表2和表3所示。
表2
表3
根据表2的性能测试数据可知,本发明通过无纺布的设计,并将无纺布预浸料与玻璃布预浸料复配成特定的层叠结构,使所述高频覆铜板在10GHz的介电损耗<0.0025,为0.0019-0.0023,力学强度高,弯曲强度为155-195MPa,介电一致性和均匀性好,预浸料与铜箔接触的位置不会出现布纹、白点等缺陷,耐热性优异,288℃热应力>5min,兼具介电损耗低、力学强度高、介电一致性和均匀性好、耐热性好、可靠性高的特性,能够满足覆铜板在制备高频高性能和小型化的电子产品中的应用需求。
结合表2和表3,对比实施例2与比较例1-2可知,如果覆铜板中不包含玻璃布预浸料(比较例1),则板材的弯曲强度只有95MPa,难以满足覆铜板支撑的要求;如果覆铜板中不包含无纺布预浸料(比较例2),由于玻璃布预浸料中的玻璃布采用经纬编织而成,导致预浸料与铜箔接触的位置出现明显的布纹缺陷,使覆铜板的均匀性不佳。
本发明通过无纺布中粘结剂的设计,使所述无纺布具有低的介电损耗,纤维各向分布一致,均匀性好,强度高,耐热性佳,从而使包含其的覆铜板具有优异的综合性能。对比实施例1与比较例3-5可知,现有的无纺布作为增强材料,虽然克服了覆铜板中的布纹缺陷,但板材的Df高,且热应力只有3s,无法满足高频传输和耐热性的性能要求。
申请人声明,本发明通过上述实施例来说明本发明的高频覆铜板及包含其的印制电路板,但本发明并不局限于上述实施例,即不意味着本发明必须依赖上述实施例才能实施。所属技术领域的技术人员应该明了,对本发明的任何改进,对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等,均落在本发明的保护范围和公开范围之内。
Claims (10)
1.一种高频覆铜板,其特征在于,所述高频覆铜板包括预浸料层以及设置于所述预浸料层两侧的铜箔;所述预浸料层包括依次设置的第一无纺布预浸料、芯层预浸料和第二无纺布预浸料;
所述第一无纺布预浸料、第二无纺布预浸料中的无纺布由无机纤维和含氟树脂乳液粘结剂组成;
所述芯层预浸料包括至少一张玻璃布预浸料;
所述第一无纺布预浸料、第二无纺布预浸料、玻璃布预浸料各自独立地包括无纺布或玻璃布以及附着于其上的热固性树脂组合物,所述热固性树脂组合物中的树脂各自独立地选自聚苯醚树脂、聚烯烃树脂、多官能乙烯基芳香族聚合物、马来酰亚胺化合物或氰酸酯树脂中的任意一种或至少两种的组合。
2.根据权利要求1所述的高频覆铜板,其特征在于,所述无纺布中无机纤维的质量百分含量为60-95%,含氟树脂乳液粘结剂的质量百分含量为5-40%;
优选地,所述无纺布的单重为20-200g/m2,进一步优选20-100g/m2。
3.根据权利要求1或2所述的高频覆铜板,其特征在于,所述无机纤维选自E玻璃纤维、NE玻璃纤维、L玻璃纤维、石英纤维、氧化铝纤维、氮化硼纤维、碳化硅纤维、氧化锌纤维、氧化镁纤维、氮化硅纤维、碳化硼纤维、氮化铝纤维、氧化铝晶须、氮化硼晶须、碳化硅晶须、氧化锌晶须、氧化镁晶须、氮化硅晶须、碳化硼晶须或氮化铝晶须中的任意一种或至少两种的组合;
优选地,所述无机纤维的平均直径<10μm,进一步优选1-5μm;
优选地,所述无机纤维的平均长度为1-100mm,进一步优选1-10mm。
4.根据权利要求1-3任一项所述的高频覆铜板,其特征在于,所述含氟树脂乳液粘结剂选自聚全氟乙丙烯乳液、聚偏氟乙烯乳液、聚四氟乙烯乳液、四氟乙烯-全氟烷基乙烯基醚共聚物乳液、乙烯-四氟乙烯共聚物乳液、聚三氟氯乙烯乳液或乙烯-三氟氯乙烯共聚物乳液中的任意一种或至少两种的组合。
5.根据权利要求1-4任一项所述的高频覆铜板,其特征在于,所述第一无纺布预浸料、第二无纺布预浸料、玻璃布预浸料中热固性树脂组合物的质量百分含量各自独立地为60-95%。
6.根据权利要求1-5任一项所述的高频覆铜板,其特征在于,所述热固性树脂组合物各自独立地包括树脂,以及可选地交联剂、可选地引发剂、可选地阻燃剂、可选地填料、可选地偶联剂中的任意一种或至少两种的组合;
优选地,所述聚烯烃树脂包括聚丁二烯树脂、丁二烯-苯乙烯共聚物或苯乙烯-丁二烯-苯乙烯三嵌段共聚物中的任意一种或至少两种的组合。
7.根据权利要求6所述的高频覆铜板,其特征在于,所述交联剂包括异氰脲酸三烯丙酯、聚异氰脲酸三烯丙酯、三烯丙酯三聚氰酸酯、邻苯二甲酸二烯丙酯、三甲基丙烯酸、二乙烯基苯或多官能丙烯酸酯中的任意一种或至少两种的组合;
优选地,所述引发剂包括有机过氧化物。
8.根据权利要求6或7所述的高频覆铜板,其特征在于,所述阻燃剂包括氮系阻燃剂、卤系阻燃剂、磷系阻燃剂或金属氢氧化物阻燃剂中的任意一种或至少两种的组合;
优选地,所述填料包括二氧化硅、二氧化钛、氮化硼、氮化铝、碳化硅、氧化铝、钛酸钡、钛酸锶、钛酸镁、钛酸钙、钛酸锶钡、钙钛酸钡、钛酸铅、锆钛酸铅、锆钛酸镧铅、钛酸镧钡、钛酸锆钡、二氧化铪、铌镁酸铅、铌镁酸钡、铌酸锂、铌酸钾、钽酸铝锶、铌酸钽钾、铌酸锶钡、铌酸钡铅、铌酸钛钡、钽酸铋锶、钛酸铋、钛酸钡铷、钛酸铜或钛酸铅-铌镁酸铅中的任意一种或至少两种的组合。
9.根据权利要求1-8任一项所述的高频覆铜板,其特征在于,所述铜箔与预浸料层之间还包括粘结层;
优选地,所述粘结层涂覆于铜箔上或以粘结树脂膜的形式存在。
10.一种印制电路板,其特征在于,所述印制电路板包括如权利要求1-9任一项所述的高频覆铜板。
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CN115651335A (zh) * | 2022-11-14 | 2023-01-31 | 陕西生益科技有限公司 | 一种树脂组合物及包含其的预浸料、覆铜板 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003324257A (ja) * | 2002-05-02 | 2003-11-14 | Tomoegawa Paper Co Ltd | フッ素樹脂プリント配線板及びその製造方法 |
JP2005307371A (ja) * | 2004-04-19 | 2005-11-04 | Oji Paper Co Ltd | 湿式法不織布およびプリプレグ、複合材料 |
CN102029746A (zh) * | 2010-09-21 | 2011-04-27 | 广东生益科技股份有限公司 | 覆铜板及其制作方法 |
CN102056971A (zh) * | 2008-07-31 | 2011-05-11 | 东丽株式会社 | 预浸料坯、预成型体、成型品及预浸料坯的制造方法 |
CN106379006A (zh) * | 2016-08-29 | 2017-02-08 | 陕西生益科技有限公司 | 一种高频覆铜板 |
CN106626566A (zh) * | 2016-09-29 | 2017-05-10 | 广东生益科技股份有限公司 | 一种高介电材料、制备方法及其用途 |
-
2022
- 2022-07-05 CN CN202210790270.1A patent/CN115302869B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003324257A (ja) * | 2002-05-02 | 2003-11-14 | Tomoegawa Paper Co Ltd | フッ素樹脂プリント配線板及びその製造方法 |
JP2005307371A (ja) * | 2004-04-19 | 2005-11-04 | Oji Paper Co Ltd | 湿式法不織布およびプリプレグ、複合材料 |
CN102056971A (zh) * | 2008-07-31 | 2011-05-11 | 东丽株式会社 | 预浸料坯、预成型体、成型品及预浸料坯的制造方法 |
CN102029746A (zh) * | 2010-09-21 | 2011-04-27 | 广东生益科技股份有限公司 | 覆铜板及其制作方法 |
CN106379006A (zh) * | 2016-08-29 | 2017-02-08 | 陕西生益科技有限公司 | 一种高频覆铜板 |
CN106626566A (zh) * | 2016-09-29 | 2017-05-10 | 广东生益科技股份有限公司 | 一种高介电材料、制备方法及其用途 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115651335A (zh) * | 2022-11-14 | 2023-01-31 | 陕西生益科技有限公司 | 一种树脂组合物及包含其的预浸料、覆铜板 |
CN115651335B (zh) * | 2022-11-14 | 2024-01-30 | 陕西生益科技有限公司 | 一种树脂组合物及包含其的预浸料、覆铜板 |
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