CN112538253A - 一种磁介电树脂组合物、包含其的层压板及其印刷电路板 - Google Patents

一种磁介电树脂组合物、包含其的层压板及其印刷电路板 Download PDF

Info

Publication number
CN112538253A
CN112538253A CN202011431352.4A CN202011431352A CN112538253A CN 112538253 A CN112538253 A CN 112538253A CN 202011431352 A CN202011431352 A CN 202011431352A CN 112538253 A CN112538253 A CN 112538253A
Authority
CN
China
Prior art keywords
resin
resin composition
titanate
magneto
barium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011431352.4A
Other languages
English (en)
Inventor
殷卫峰
张江陵
李莎
霍翠
张记明
刘锐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shengyi Technology Shaanxi Co ltd
Original Assignee
Shengyi Technology Shaanxi Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shengyi Technology Shaanxi Co ltd filed Critical Shengyi Technology Shaanxi Co ltd
Priority to CN202011431352.4A priority Critical patent/CN112538253A/zh
Publication of CN112538253A publication Critical patent/CN112538253A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08J2371/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
    • C08J2471/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08J2471/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08J2471/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2248—Oxides; Hydroxides of metals of copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2262—Oxides; Hydroxides of metals of manganese
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C08K2003/2272—Ferric oxide (Fe2O3)
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)

Abstract

本发明提供一种磁介电树脂组合物、包含其的层压板及其印刷电路板，所述所述磁介电树脂组合物包括：树脂，尖晶石型磁性填料；所述的尖晶石型磁性填料包含Fe、Zn和M1元素，M1为选自Ni、Mg、Mn中的至少一种。本发明的磁介电树脂组合物的磁导率高、磁损耗小，满足磁介电基板的性能要求。

Description

一种磁介电树脂组合物、包含其的层压板及其印刷电路板
技术领域
本发明属于层压板技术领域，涉及一种磁介电树脂组合物、包含其的层压板及其印刷电路板。
背景技术
随着微电子、微机械等新兴微加工技术的发展，在以高密度安装技术为背景的潮流中，驱动电容器、集成电路、电路模块、天线射频模块等不断往小型化方向发展。作为雷达和现代无线通信系统中的关键组件，作为小型化的瓶颈，天线尺寸减小已引起人们极大关注。减小天线尺寸之一的办法是使用高介电材料，CN103101252A和CN103351578A中公开了高介电常数板材，这种板材可以减小天线尺寸，但是这种办法会减小天线的增益、降低天线综合性能。
减小天线尺寸的另一条办法是采用磁介电材料作为基板，如公式1所示，(εrμr)1/2是小型化因子，介电常数越高、磁导率越大，小型化因子越高，越有利于小型化。在介电常数不能改变的情况、提高磁导率就能有效减小天线尺寸，同时保持或提高天线增益和带宽。
λ＝c/f(εrμr)1/2 (1)
尖晶石铁氧体具有高磁导率值，例如NiZn、MnZn铁氧体，但是，这些尖晶石铁氧体截止频率的截止频率低，在300MHz以上难以使用。平面六角铁氧体具有高的截止频率，例如Co2Z六角铁氧体，但是磁导率低，难以大幅度降低天线尺寸。
磁介质板材可以作为埋入电感使用，也可以减小电子产品尺寸、优化电子产品性能，因此目前一般使用磁介电板材来减小天线的尺寸。US20190264005A公开了一种聚四氟+Co2Z的技术方案，磁导率低、成本高。CN109553955A公开了一种磁介电树脂组合物，但是未研究频率对材料磁性能的影响。CN1246500公开了一种磁介电树脂组合物，但是制备的板材在300MHZ磁损耗高。
因此，在本领域，期望开发一种成本低并且磁损耗低的磁介电材料。
发明内容
针对现有技术的不足，本发明的目的在于提供一种磁介电树脂组合物、包含其的层压板及其印刷电路板。本发明的磁介电材料成本低并且磁损耗低。
为达此目的，本发明采用以下技术方案：
一方面，本发明提供一种磁介电树脂组合物，所述磁介电树脂组合物包括：树脂，尖晶石型磁性填料；所述的尖晶石型磁性填料包含Fe、Zn和M1元素，M1为选自Ni、Mg、Mn中的至少一种。
优选地，所述尖晶石型磁性填料还包含M2元素，所述M2元素为Cu和/或Co元素。
在本发明中，所述尖晶石型磁性填料占磁介电树脂组合物的重量百分比为20wt％～90wt％；例如可以是20wt％、25wt％、30wt％、35wt％、40wt％、45wt％、50wt％、55wt％、60wt％、65wt％、70wt％、75wt％、80wt％、85wt％或90wt％等。
优选地，所述尖晶石型磁性填料的截止频率为200～300MHZ。例如200MHZ、220MHZ、240MHZ、250MHZ、260MHZ、280MHZ、300MHZ。截止频率小于200MHz，频率低不满足市场使用要求；截止频率大于300MHz，板材的磁导率太低。
优选地，所述尖晶石型磁性填料的粒径为0.1μm～30μm，例如0.1μm、2μm、5μm、8μm、10μm、13μm、16μm、19μm、22μm、25μm、28μm、30μm。
优选地，所述尖晶石型磁性填料为镍锌铁氧体、锰锌铁氧体、镁锌铁氧体中的任意一种或至少两种的混合物。
优选地，所述树脂选自环氧树脂、氰酸酯树脂、聚苯醚树脂、聚丁二烯树脂、丁苯树脂、双马来酰亚胺-三嗪树脂、双马来酰亚胺树脂、聚四氟乙烯树脂、聚酰亚胺树脂、酚醛树脂、丙烯酸树脂、液晶树脂、苯并恶嗪树脂、酚氧树脂、丁腈橡胶、端羧基丁腈橡胶或端羟基丁腈橡胶中的任意一种或者至少两种的混合物。
优选地，所述树脂在磁介电树脂组合物中的重量百分比为10wt％～80wt％，例如10wt％、15wt％、20wt％、30wt％、40wt％、50wt％、60wt％、70wt％或80wt％。
优选地，所述磁介电树脂组合物还包括非磁性填料和促进剂。
优选地，所述的非磁性填料选自二氧化硅、二氧化钛、钛酸钡、钛酸锶、钛酸镁、钛酸钙、钛酸锶钡、钙钛酸钡、钛酸铅、锆钛酸铅、锆钛酸镧铅、钛酸镧钡、钛酸锆钡、二氧化铪、铌镁酸铅、铌镁酸钡、铌酸锂、铌酸钾、钽酸铝锶、铌酸钽钾、铌酸锶钡、铌酸钡铅、铌酸钛钡、钽酸铋锶、钛酸铋、钛酸钡铷、钛酸铜或钛酸铅-铌镁酸铅中的任意一种或者至少两种的混合物。
优选地，所述促进剂为2-甲基咪唑、2-乙基-4甲基咪唑、2-苯基咪唑、2-十一烷基咪唑、1-苄基-2-甲基咪唑、2-十七烷基咪唑、2-异丙基咪唑、2-苯基-4-甲基咪唑、2-十二烷基咪唑或1-氰乙基-2-甲基咪唑中的任意一种或者至少两种的混合物。
优选地，所述磁介电树脂组合物还包括引发剂。
优选地，所述引发剂选自a,a'-二(叔丁基过氧化间异丙苯)苯、过氧化二异丙苯、叔丁基过氧化异丙苯、1,1-双(叔己基过氧化)-3,3,5-三甲基环己烷、2,5-二甲基-2,5-二(叔丁基过氧基)己-3-炔、辛酸叔丁酯、过氧化苯甲酸叔丁酯，三乙级胺及其盐类、四级胺盐化合物、2,4,6-三(二甲胺基甲胺)苯酚、苄基二甲胺、咪唑类、三戊基酚酸胺、单酚化合物\多酚化合物、三氟化硼、三氟化硼有机物的配合物、磷酸或亚磷酸三苯酯中的任意一种或者至少两种的混合。
优选地，所述磁介电树脂组合物还包括交联剂；
优选地，所述交联剂选自异氰脲酸三烯丙酯、聚异氰脲酸三烯丙酯、三烯丙酯三聚氰酸酯、三甲基丙烯酸、邻苯二甲酸二烯丙酯、二乙烯基苯或多官能的丙烯酸酯中的任意一种或者至少两种的混合。
另一方面，本发明提供一种树脂胶液，所述树脂胶液中含有如上所述的磁介电树脂组合物和溶剂。
优选地，所述溶剂为醚类、酮类、芳香族烃类、酯类或含氮类溶剂中的任意一种或至少两种的组合。
优选地，所述溶剂选自甲醇、乙醇、丁醇、乙基溶纤剂、丁基溶纤剂、乙二醇甲醚、二乙二醇乙醚、二乙二醇丁醚等醚类，或丙酮、丁酮、甲基乙基甲酮、甲基异丁基甲酮、环己酮、甲苯、二甲苯、均三甲苯、乙氧基乙基乙酸酯、醋酸乙酯、N,N-二甲基甲酰胺、N,N-二甲基乙酰胺或N-甲基-2-吡咯烷中的任意一种或至少两种的组合。
另一方面，本发明提供一种预浸料，所述预浸料包括增强材料及通过含浸干燥后附着其上的如上所述的磁介电树脂组合物。
优选地，所述增强材料包括玻璃纤维布。
另一方面，本发明提供一种覆金属箔层压板，所述覆金属箔层压板包括至少一张如上所述的预浸料以及覆于叠合后的预浸料一侧或两侧的金属箔。
另一方面，本发明提供一种印刷电路板，所述印刷电路板包括至少一张如上所述的预浸料或至少一张如上所述的覆金属箔层压板。
相对于现有技术，本发明具有以下有益效果：
本发明的磁介电树脂组合物中，利用尖晶石型磁性填料中Fe、Zn和M1元素的组合，使得磁介电树脂组合物的磁导率高、磁损耗小，满足磁介电基板的性能要求。
具体实施方式
下面通过具体实施方式来进一步说明本发明的技术方案。本领域技术人员应该明了，所述实施例仅仅是帮助理解本发明，不应视为对本发明的具体限制。
以下实施例和对比例中所用到的材料具体如下：
聚苯醚树脂：沙比克SA9000；
溴化环氧树脂：台湾长春BEB531A80P；
酚氧树脂：新日铁YP-50EK35；
邻甲酚线型酚醛树脂：KOLON KCE-F2118；
2-MI：巴斯夫(德国)2MI；
本发明以下实施例和对比例中所使用的磁性填料的组分及其性能如表1所示；表1中，各组分的含量为摩尔百分含量(其中所述磁导率为相对磁导率)。
表1
Figure BDA0002820774540000051
磁性填料的制备方法如下：
按照表1所示的配方，按照摩尔比例称取各原料组分，物理干法混合1h，制备成环状胚体，然后1300℃烧结4h；得到的烧结产物为环形样品(内径3.04mm、外径6.96mm、厚度3mm)；将烧结产物在球磨机中湿法球磨粉碎，转速为3000转/min，时间为1～5h，锆珠的粒径为1～10mm复配；球磨后干燥，得到磁性填料；通过球磨时间的控制实现不同粒径的制备。
表1中，磁导率和温漂系数的测试方法为：
(1)样品制备：将各原料组分物理干法混合后，制备成环状胚体，1300℃烧结4h，得到的烧结产物为成环形样品(内径3.04mm、外径6.96mm、厚度3mm)，测试烧结产物的磁导率和温漂系数；
(2)磁导率、截止频率测试：采用阻抗分析仪测试材料0.1～1GHz的磁导率，测试仪器为是德科技E5071C网络分析仪+N1500测试系统；
实施例1
将25g溴化环氧树脂B、15g酚氧树脂C、40g聚苯醚树脂SA9000，溶解在溶剂乙二醇甲醚中；再加入磁性填料，磁性填料的种类为C-300、磁性填料的截止频率为300MHz、磁导率为27、粒径为0.1μm，加入量为20g；在室温下混合得到胶液。
使用增强材料浸渍上述胶液，然后在155℃的烘箱中烘烤5分钟固化为B阶段，得到增强材料预浸料。将制作的预浸料放在铜箔之间，在压机中于210℃层压并固化，得到覆铜板后测量介电常数、磁导率、电阻率等性能，具体性能测试结果见表2。
实施例2
本实施例与实施例1的区别在于：制备原料包括：4g环氧树脂A、5g溴化环氧树脂B、1g酚氧树脂C，磁性填料的种类为C-275、磁性填料的截止频率为275MHz、磁导率为32、粒径为10μm，加入量为90g。
将本实施例制备的磁介电树脂组合物制备覆铜板，所制备的覆铜板的性能见表2。
实施例3
本实施例与实施例1的区别在于：制备原料包括：20g环氧树脂A、25g溴化环氧树脂B、5g酚氧树脂C，磁性填料的种类为C-200、磁性填料的截止频率为200MHz、磁导率为40、粒径为30μm，加入量为50g。
将本实施例制备的磁介电树脂组合物制备覆铜板，所制备的覆铜板的性能见表2。
实施例4
本实施例与实施例1的区别在于：制备原料包括：磁性填料的种类为C-300、磁性填料的截止频率为300MHz、磁导率为27、粒径为0.1μm，加入量为20g；还包括10g的硅微粉。
将本实施例制备的磁介电树脂组合物制备覆铜板，所制备的覆铜板的性能见表2。
比较例1
提供一种覆铜箔层压板，与实施例3的区别在于，磁性填料为C-100，其截止频率为100MHZ。
比较例2
提供一种覆铜箔层压板，与实施例1的区别在于，磁性填料的粒径为0.05μm，填料分散性差、粘度大，无法制备出合格覆铜板。
比较例3
提供一种覆铜箔层压板，与实施例1的区别在于，磁性填料加入10g。
比较例4
提供一种覆铜箔层压板，与实施例2的区别在于，磁性填料加入95g，填料分散性差、粘度大，无法制备出合格覆铜板。
比较例5
提供一种覆铜箔层压板，与实施例3的区别在于，磁性填料为C-50，其磁性填料不含Zn元素。
实施例以及比较例制备的磁介电树脂组合物制备覆铜板，所制备的覆铜板的性能见表2。
表2
Figure BDA0002820774540000081
Figure BDA0002820774540000091
上述实施例和对比例中板材的磁导率、磁损耗角正切采用空气同轴传输线法测试；
磁损耗角正切小于0.05对应的最大频率(MHz)是指板材截止频率之前的频率。
从上述实施例和对比例的可以看出，实施例1到实施例4制备的覆铜板的磁导率、介电损耗、弯曲强度等综合性能较好。
比较例1中使用磁性填料的截止频率小于100MHz，与实施例3相比，制备覆铜板的磁损耗角正切0.05对应的频率小，只有40MHz；介电损耗角正切大，达到0.0115。
比较例3中使用磁性填料占树脂组合的质量百分比小于20wt％，与实施例1相比，制备的覆铜板的磁导率低，只有1.5。
比较例5中使用磁性填料不含Zn元素，与实施例3相比，制备覆铜板的磁损耗角正切0.05对应的频率小，只有35MHz；介电损耗角正切大，达到0.097。
综上述结果可知，本发明制备的树脂组合物制备的覆铜板具有使用频率高、磁导率高等优良综合性能，可以满足磁介电基板的性能要求。
申请人声明，本发明通过上述实施例来说明本发明的磁介电树脂组合物、包含其的层压板及其印刷电路板，但本发明并不局限于上述实施例，即不意味着本发明必须依赖上述实施例才能实施。所属技术领域的技术人员应该明了，对本发明的任何改进，对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等，均落在本发明的保护范围和公开范围之内。

Claims (10)

1.一种磁介电树脂组合物，其特征在于，所述磁介电树脂组合物包括：树脂，尖晶石型磁性填料；所述的尖晶石型磁性填料包含Fe、Zn和M1元素，M1为选自Ni、Mg、Mn中的至少一种。
2.根据权利要求1所述的磁介电树脂组合物，其特征在于，所述尖晶石型磁性填料还包含M2元素，所述M2元素为Cu和/或Co元素。
3.根据权利要求1或2所述的磁介电树脂组合物，其特征在于，所述尖晶石型磁性填料占磁介电树脂组合物的重量百分比为20wt％～90wt％；
优选地，所述尖晶石型磁性填料的截止频率为200～300MHZ；
优选地，所述尖晶石型磁性填料的粒径为0.1μm～30μm；
优选地，所述尖晶石型磁性填料为镍锌铁氧体、锰锌铁氧体、镁锌铁氧体中的任意一种或至少两种的混合物。
4.根据权利要求1-3中任一项所述的磁介电树脂组合物，其特征在于，所述树脂选自环氧树脂、氰酸酯树脂、聚苯醚树脂、聚丁二烯树脂、丁苯树脂、双马来酰亚胺-三嗪树脂、双马来酰亚胺树脂、聚四氟乙烯树脂、聚酰亚胺树脂、酚醛树脂、丙烯酸树脂、液晶树脂、苯并恶嗪树脂、酚氧树脂、丁腈橡胶、端羧基丁腈橡胶或端羟基丁腈橡胶中的任意一种或者至少两种的混合物；
优选地，所述树脂在磁介电树脂组合物中的重量百分比为10wt％～80wt％。
5.根据权利要求1-4中任一项所述的磁介电树脂组合物，其特征在于，所述磁介电树脂组合物还包括非磁性填料和促进剂；
优选地，所述的非磁性填料选自二氧化硅、二氧化钛、钛酸钡、钛酸锶、钛酸镁、钛酸钙、钛酸锶钡、钙钛酸钡、钛酸铅、锆钛酸铅、锆钛酸镧铅、钛酸镧钡、钛酸锆钡、二氧化铪、铌镁酸铅、铌镁酸钡、铌酸锂、铌酸钾、钽酸铝锶、铌酸钽钾、铌酸锶钡、铌酸钡铅、铌酸钛钡、钽酸铋锶、钛酸铋、钛酸钡铷、钛酸铜或钛酸铅-铌镁酸铅中的任意一种或者至少两种的混合物；
优选地，所述促进剂为2-甲基咪唑、2-乙基-4甲基咪唑、2-苯基咪唑、2-十一烷基咪唑、1-苄基-2-甲基咪唑、2-十七烷基咪唑、2-异丙基咪唑、2-苯基-4-甲基咪唑、2-十二烷基咪唑或1-氰乙基-2-甲基咪唑中的任意一种或者至少两种的混合物；
优选地，所述磁介电树脂组合物还包括引发剂；
优选地，所述引发剂选自a,a'-二(叔丁基过氧化间异丙苯)苯、过氧化二异丙苯、叔丁基过氧化异丙苯、1,1-双(叔己基过氧化)-3,3,5-三甲基环己烷、2,5-二甲基-2,5-二(叔丁基过氧基)己-3-炔、辛酸叔丁酯、过氧化苯甲酸叔丁酯，三乙级胺及其盐类、四级胺盐化合物、2,4,6-三(二甲胺基甲胺)苯酚、苄基二甲胺、咪唑类、三戊基酚酸胺、单酚化合物\多酚化合物、三氟化硼、三氟化硼有机物的配合物、磷酸或亚磷酸三苯酯中的任意一种或者至少两种的混合。
6.根据权利要求1-5中任一项所述的磁介电树脂组合物，其特征在于，所述磁介电树脂组合物还包括交联剂；
优选地，所述交联剂选自异氰脲酸三烯丙酯、聚异氰脲酸三烯丙酯、三烯丙酯三聚氰酸酯、三甲基丙烯酸、邻苯二甲酸二烯丙酯、二乙烯基苯或多官能的丙烯酸酯中的任意一种或者至少两种的混合。
7.一种树脂胶液，其特征在于，所述树脂胶液中含有如权利要求1-6中任一项所述的磁介电树脂组合物和溶剂。
8.一种预浸料，其特征在于，所述预浸料包括增强材料及通过含浸干燥后附着其上的如权利要求1-6中任一项所述的磁介电树脂组合物；
优选地，所述增强材料包括玻璃纤维布。
9.一种覆金属箔层压板，其特征在于，所述覆金属箔层压板包括至少一张如权利要求8所述的预浸料以及覆于叠合后的预浸料一侧或两侧的金属箔。
10.一种印刷电路板，其特征在于，所述印刷电路板包括至少一张如权利要求8所述的预浸料或至少一张如权利要求9所述的覆金属箔层压板。
CN202011431352.4A 2020-12-07 2020-12-07 一种磁介电树脂组合物、包含其的层压板及其印刷电路板 Pending CN112538253A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011431352.4A CN112538253A (zh) 2020-12-07 2020-12-07 一种磁介电树脂组合物、包含其的层压板及其印刷电路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011431352.4A CN112538253A (zh) 2020-12-07 2020-12-07 一种磁介电树脂组合物、包含其的层压板及其印刷电路板

Publications (1)

Publication Number Publication Date
CN112538253A true CN112538253A (zh) 2021-03-23

Family

ID=75019759

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011431352.4A Pending CN112538253A (zh) 2020-12-07 2020-12-07 一种磁介电树脂组合物、包含其的层压板及其印刷电路板

Country Status (1)

Country Link
CN (1) CN112538253A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023051066A1 (zh) * 2021-09-30 2023-04-06 华为技术有限公司 一种印制电路板、电源、电感、变压器及电子设备

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB729538A (en) * 1952-08-19 1955-05-04 Rca Corp Improvements in manganese zinc ferrospinel compositions
JPH06231936A (ja) * 1993-01-26 1994-08-19 Tokin Corp 磁性充填剤
JPH09129434A (ja) * 1995-09-19 1997-05-16 Thomson Csf 透磁率と損失の小さい合成磁気材料
JP2006160560A (ja) * 2004-12-07 2006-06-22 Nitto Denko Corp 球状焼結フェライト粒子およびそれを用いた半導体封止用樹脂組成物ならびにそれを用いて得られる半導体装置
JP2010109056A (ja) * 2008-10-29 2010-05-13 Kyocera Corp 磁性体と誘電体との複合焼結体およびそれを用いたｌｃ複合電子部品
US20100163779A1 (en) * 2007-04-24 2010-07-01 Yoji Okano Ni-zn-cu ferrite particles, green sheet comprising the ni-zn-cu ferrite particles and ni-zn-cu ferrite sintered ceramics
CN102132456A (zh) * 2008-09-29 2011-07-20 日油株式会社 天线用磁性复合体及使用其的天线单元
CN102875129A (zh) * 2012-10-12 2013-01-16 西安交通大学 一种尖晶石型固溶体磁介电功能介质陶瓷材料及其制备方法
CN109553955A (zh) * 2018-11-12 2019-04-02 陕西生益科技有限公司 一种磁介电树脂组合物及其应用
CN111217402A (zh) * 2020-03-10 2020-06-02 南昌航空大学 一种六元尖晶石型铁钴铬锰铜锌系高熵氧化物及其粉体制备方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB729538A (en) * 1952-08-19 1955-05-04 Rca Corp Improvements in manganese zinc ferrospinel compositions
JPH06231936A (ja) * 1993-01-26 1994-08-19 Tokin Corp 磁性充填剤
JPH09129434A (ja) * 1995-09-19 1997-05-16 Thomson Csf 透磁率と損失の小さい合成磁気材料
JP2006160560A (ja) * 2004-12-07 2006-06-22 Nitto Denko Corp 球状焼結フェライト粒子およびそれを用いた半導体封止用樹脂組成物ならびにそれを用いて得られる半導体装置
US20100163779A1 (en) * 2007-04-24 2010-07-01 Yoji Okano Ni-zn-cu ferrite particles, green sheet comprising the ni-zn-cu ferrite particles and ni-zn-cu ferrite sintered ceramics
CN102132456A (zh) * 2008-09-29 2011-07-20 日油株式会社 天线用磁性复合体及使用其的天线单元
JP2010109056A (ja) * 2008-10-29 2010-05-13 Kyocera Corp 磁性体と誘電体との複合焼結体およびそれを用いたｌｃ複合電子部品
CN102875129A (zh) * 2012-10-12 2013-01-16 西安交通大学 一种尖晶石型固溶体磁介电功能介质陶瓷材料及其制备方法
CN109553955A (zh) * 2018-11-12 2019-04-02 陕西生益科技有限公司 一种磁介电树脂组合物及其应用
CN111217402A (zh) * 2020-03-10 2020-06-02 南昌航空大学 一种六元尖晶石型铁钴铬锰铜锌系高熵氧化物及其粉体制备方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
任平等: "微量成分添加对锰锌铁氧体性能影响研究进展", 《材料导报》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023051066A1 (zh) * 2021-09-30 2023-04-06 华为技术有限公司 一种印制电路板、电源、电感、变压器及电子设备

Similar Documents

Publication Publication Date Title
US6908960B2 (en) Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettin
CN109553955A (zh) 一种磁介电树脂组合物及其应用
CN103351578B (zh) 一种用于形成天线用的介质基板的介质层的树脂组合物及其用途
CN103515526A (zh) 感应器及其制备方法
CN111993720B (zh) 一种具有高导热性的聚四氟乙烯高频覆铜板
CN112552630A (zh) 一种树脂组合物及包含其的树脂胶液、预浸料、层压板、覆铜板和印刷电路板
CN101964254B (zh) 电容基板结构
CN112538253A (zh) 一种磁介电树脂组合物、包含其的层压板及其印刷电路板
WO2022033033A1 (zh) 一种电磁波噪声抑制片材及高频电子设备
CN112538254A (zh) 一种磁介电树脂组合物、包含其的层压板及其印刷电路板
CN114479418B (zh) 一种磁介电树脂组合物及其应用
CN105385107A (zh) 一种高介电基板用热固性树脂组合物、层压板
JP2006059999A (ja) プリント配線板および電子部品
CN105348741B (zh) 用于高速基板的热固性树脂组合物、层压板
CN109370497B (zh) 一种生产高速覆铜板的胶水的制备方法及其产品
CN112662127A (zh) 一种磁介电树脂组合物、包含其的层压板及其印刷电路板
CN115073864B (zh) 一种磁介电无纺布预浸料、包含其的覆铜板及应用
TWI755974B (zh) 一種磁介電樹脂組成物及包含其的預浸料及覆銅板
JP2007048703A (ja) 複合誘電体材料及びこれを用いたプリプレグ、金属箔塗工物、成形体、複合誘電体基板、多層基板
WO2021107136A1 (ja) 電磁波遮蔽材料
CN110713616B (zh) 电子用材料及其应用
CN114987011A (zh) 一种覆铜板、包含其的印制电路板及其应用
JP2006260895A (ja) 複合誘電体材料及びこれを用いたプリプレグ、金属箔塗工物、成形体、複合誘電体基板、多層基板
CN113043681A (zh) 一种磁性材料及其制备方法和用途
CN117946394A (zh) 一种低介电、高韧茚满缩合构型马来酰亚胺树脂及其制备方法和用途

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20210323