WO2021259308A1 - Oled显示面板及其制造方法 - Google Patents

Oled显示面板及其制造方法 Download PDF

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Publication number
WO2021259308A1
WO2021259308A1 PCT/CN2021/101734 CN2021101734W WO2021259308A1 WO 2021259308 A1 WO2021259308 A1 WO 2021259308A1 CN 2021101734 W CN2021101734 W CN 2021101734W WO 2021259308 A1 WO2021259308 A1 WO 2021259308A1
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Prior art keywords
layer
electrode layer
base substrate
oled
light
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PCT/CN2021/101734
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English (en)
French (fr)
Inventor
高洪成
黄傲
黄灿
鲍建东
王计伟
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Priority to US17/771,956 priority Critical patent/US11882726B2/en
Publication of WO2021259308A1 publication Critical patent/WO2021259308A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80521—Cathodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80515—Anodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K59/8792—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. black layers

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to an OLED display panel and a manufacturing method thereof.
  • the present disclosure provides an OLED display panel and a manufacturing method thereof.
  • the OLED display panel of the present disclosure includes: a base substrate; an OLED device layer provided on a first side of the base substrate, which includes a plurality of OLED light-emitting devices; an encapsulation layer, which covers the plurality of OLED light-emitting devices;
  • the color film layer, which is arranged on the encapsulation layer, includes a black matrix that defines a plurality of openings and a one-to-one correspondence with the plurality of OLED light-emitting devices which are respectively located in the plurality of openings and spaced apart from each other by the black matrix
  • the plurality of color films wherein the OLED device layer includes a first electrode layer, a plurality of electroluminescent layers of a plurality of OLED light emitting devices on the first electrode layer, and a plurality of electroluminescent layers covering the plurality of electroluminescent layers
  • the OLED device layer further includes a pixel defining layer defining a plurality of sub-pixel regions of the plurality of OLED light emitting devices and exposing the first electrode layer, and the plurality of second hollowed-out regions
  • the orthographic projection on the base substrate is located within the orthographic projection range of the pixel defining layer on the base substrate.
  • the material of the second electrode layer is Mg, Al and alloys thereof; the OLED device layer further includes: a plurality of transparent organic material layers, the plurality of transparent organic material layers are arranged on the first In the multiple hollow areas of the second electrode layer.
  • the orthographic projection of the plurality of transparent organic material layers on the base substrate coincides with the orthographic projection of the plurality of hollow regions on the base substrate.
  • the first electrode layer includes a plurality of discrete first electrodes of the plurality of OLED light emitting devices
  • the second electrode layer includes an integrated first electrode for the plurality of OLED light emitting devices.
  • Two electrode layers, and the plurality of second hollow areas are a plurality of openings opened in the second electrode layer.
  • the first electrode layer has a plurality of first hollow regions, the plurality of light-transmitting holes, the plurality of second hollow regions, the plurality of first hollow regions, and the plurality of The orthographic projection of the fingerprint sensor on the base substrate at least partially overlaps.
  • the OLED display panel further includes: a cover layer, which covers the color film layer.
  • the material of the first electrode layer includes a light-shielding and conductive material.
  • the plurality of color filters include red filters, green filters, and blue filters arranged in an array.
  • the method for manufacturing an OLED display panel includes: fabricating an OLED device layer on the first side of a base substrate, which has a plurality of OLED light-emitting devices, and includes a first electrode layer and a plurality of OLEDs on the first electrode layer A plurality of electroluminescent layers of a light emitting device and a second electrode layer on the plurality of electroluminescent layers, wherein the second electrode layer has a plurality of second hollow areas; Encapsulation is performed to cover the plurality of OLED light-emitting devices to form an encapsulation layer; a color film layer is formed on the encapsulation layer, which includes a black matrix defining a plurality of openings and a black matrix respectively located in the plurality of openings and passing through the black matrix A plurality of color filters spaced apart from each other and corresponding to the plurality of OLED light-emitting devices one-to-one, wherein the black matrix is provided with a plurality of light-transmitting holes; a plurality
  • the fabricating the OLED device layer on the first side of the base substrate includes: forming a first electrode layer on the base substrate, and the first electrode layer includes a plurality of OLED light emitting devices.
  • a plurality of electroluminescent layers are formed on a plurality of discrete first electrodes; and the second electrode layer is formed on the pixel defining layer and the plurality of electroluminescent layers, and a plurality of the second electrode layers
  • the orthographic projection of the second hollow area on the base substrate is within the range of the orthographic projection of the pixel defining layer on the base substrate.
  • forming the second electrode layer on the pixel defining layer and the plurality of electroluminescent layers includes: positions corresponding to the plurality of second hollow regions on the pixel defining layer Forming a plurality of transparent organic material layers; and forming a second electrode material layer on the pixel defining layer and the plurality of electroluminescent layers to form the second electrode layer, the second electrode layer including a plurality of The plurality of transparent organic material layers at the position of the second hollowed-out area and the second electrode material outside the position of the plurality of second hollowed-out areas.
  • forming the first electrode layer on the base substrate includes forming a first electrode layer having a plurality of first hollowed-out regions, so that the plurality of light-transmitting holes and the plurality of second hollowed-out regions , The orthographic projections of the plurality of first hollow areas and the plurality of fingerprint photosensitive sensors on the base substrate at least partially overlap.
  • the manufacturing method further includes: forming a cover layer on the color filter layer.
  • FIG. 1 is a cross-sectional view of an OLED display panel provided by an embodiment of the disclosure
  • FIG. 2 is a working principle diagram of an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 3 is a cross-sectional view of an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 4 is a cross-sectional view of an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 5 is a top view of a color film layer of an OLED display panel provided by an embodiment of the disclosure.
  • 6A is a top view of a second electrode layer of an OLED display panel provided by an embodiment of the disclosure.
  • 6B is a top view of the second electrode layer of the OLED display panel provided by an embodiment of the disclosure.
  • FIG. 7 is a top view of a first electrode layer of an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 8A is a cross-sectional view of an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 8B is a cross-sectional view of an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 9 is a flowchart of a manufacturing method of an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 10 is a schematic diagram of an intermediate structure of a method for manufacturing an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 11 is a schematic diagram of an intermediate structure of a method for manufacturing an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 12 is a schematic diagram of an intermediate structure of a method for manufacturing an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 13 is a schematic diagram of an intermediate structure of a method for manufacturing an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 14 is a schematic diagram of an intermediate structure of a method for manufacturing an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 15 is a schematic diagram of an intermediate structure of a method for manufacturing an OLED display panel provided by an embodiment of the disclosure.
  • FIG. 16 is a schematic diagram of an intermediate structure of a method for manufacturing an OLED display panel provided by an embodiment of the disclosure.
  • 19-fingerprint photosensitive sensor 31-transparent organic material layer; 71-covering layer; 170-transparent hole;
  • words such as “exemplary” or “for example” are used to represent examples, illustrations, or illustrations. Any embodiment or design solution described as “exemplary” or “for example” in the embodiments of the present disclosure should not be construed as being more preferable or advantageous than other embodiments or design solutions. To be precise, words such as “exemplary” or “for example” are used to present related concepts in a specific manner. In addition, in the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "plurality” means two or more.
  • the prior art proposes to implement the fingerprint identification function through an off-screen fingerprint identification method.
  • the under-screen fingerprint recognition can integrate the fingerprint acquisition module in the display panel without occupying the display area of the display panel. Therefore, the under-screen fingerprint recognition has become an important realization method of fingerprint recognition.
  • COE-based OLEDs have very low light transmittance, which cannot meet the requirements of under-screen fingerprint recognition for transmittance.
  • the light transmittance of COE-based OLEDs is generally improved by opening holes in the BM.
  • the electrode layer of the OLED still affects the light transmittance of the OLED, thereby affecting the accuracy of fingerprint collection.
  • the opening on the BM directly exposes the electrode layer of the OLED, causing the intensity of the reflected light at the opening to increase significantly, thereby affecting the display effect of the OLED.
  • the embodiment of the present disclosure provides an OLED display panel.
  • the OLED display panel provided by the embodiment of the present disclosure includes: a base plate (BP) 11, and a base plate (BP) 11 disposed on the base plate 11;
  • BP base plate
  • PDL pixel definition layer
  • EL Electro Luminescent
  • EL electroluminescent layer
  • the black matrix 17 is provided with a plurality of light-transmitting holes 170 (for example, it may be a plurality of openings opened in the black matrix 17, which may also be referred to as a plurality of light-transmitting openings here), and the second electrode layer 15 There are a plurality of second hollow areas 150, and the orthographic projection of the plurality of light-transmitting holes 170 on the second electrode layer 15 is located in the plurality of second hollow areas 150; the plurality of fingerprint photosensitive sensors 19 are respectively Located in the orthographic projection of the plurality of light-transmitting holes 170.
  • the orthographic projections of the plurality of light-transmitting holes 170, the plurality of second hollow areas 150, and the plurality of fingerprint photosensitive devices 19 on the base substrate 11 at least partially overlap, so that the light reflected from the first side of the OLED display panel can be It is incident on a plurality of fingerprint photosensitive sensors 19 with a small loss.
  • the plurality of hollow regions 150 in the second electrode layer 15 may be a plurality of openings formed in the second electrode layer 15, which may also be referred to as a plurality of electrode openings; or may have other openings relative to the second electrode layer.
  • the area has a transparent material layer with a relatively large light transmittance, for example, a transparent organic material layer.
  • the electrode included in the first electrode layer 12 in the embodiment of the present disclosure may be the anode of the OLED or the cathode of the OLED.
  • the second electrode layer is the cathode of the OLED, and when the first electrode layer 12 is the cathode of the OLED, the second electrode layer is the anode of the OLED.
  • the OLED display panel provided by the embodiment of the present disclosure may further include a fingerprint processing module electrically connected to the plurality of fingerprint photosensitive sensors 19, for after the fingerprint photosensitive sensor 19 converts the reflected light of the finger into electrical signals, according to The electrical signal output by the fingerprint sensor 19 determines the collected fingerprint and matches it with the pre-stored fingerprint.
  • a fingerprint processing module electrically connected to the plurality of fingerprint photosensitive sensors 19, for after the fingerprint photosensitive sensor 19 converts the reflected light of the finger into electrical signals, according to The electrical signal output by the fingerprint sensor 19 determines the collected fingerprint and matches it with the pre-stored fingerprint.
  • the embodiments of the present disclosure can prevent the second electrode layer 15 from affecting the light transmittance of the OLED, thereby avoiding a substantial increase in the intensity of the reflected light at the light-transmitting holes of the black matrix.
  • the OLED display panel includes: a base substrate, a first electrode layer and a pixel defining layer disposed on a first side of the base substrate, and an electroluminescent layer disposed on the first electrode layer ,
  • the second electrode layer covering the pixel defining layer and the electroluminescent layer that is, an OLED device layer is formed on the base substrate, which includes a plurality of OLED light-emitting devices), covering the second electrode layer Encapsulation layer, a color filter layer including a black matrix arranged on the encapsulation layer, and a plurality of fingerprint photosensitive sensors arranged on the second side of the base substrate.
  • the black matrix includes a black matrix that defines a plurality of openings, and a plurality of color films respectively located in the plurality of openings and spaced apart from each other by the black matrix, corresponding to the plurality of OLED light-emitting devices one-to-one.
  • a plurality of light-transmitting holes are also opened in the black matrix.
  • the second electrode layer has a plurality of hollow areas, and the orthographic projections of the plurality of light-transmitting holes on the second electrode layer at least partially overlap with the plurality of hollow areas of the second electrode layer, respectively.
  • the orthographic projections of the plurality of light-transmitting holes on the second electrode layer are respectively located in the plurality of hollowed-out areas of the second electrode layer.
  • the fingerprint photosensitive sensor receives; the plurality of fingerprint photosensitive sensors are respectively located in the orthographic projection of the plurality of light-transmitting holes so that the light reflected from the plurality of light-transmitting holes is collected by the fingerprint photosensitive device.
  • the second electrode layer has a plurality of hollow areas, and the orthographic projections of the plurality of light-transmitting holes opened in the black matrix on the second electrode layer are all located in the plurality of hollow areas of the second electrode layer The light reflected by the fingerprint will not be blocked by the black matrix and the second electrode layer, so the embodiments of the present disclosure can improve the light transmittance of the COE-based OLED.
  • the embodiments of the present disclosure can also prevent the intensity of the reflected light at the light-transmitting hole from being greatly increased.
  • the embodiments of the present disclosure can improve the light transmittance of the COE-based OLED while avoiding affecting the display effect.
  • the material for making the second electrode layer may be Mg, Al or a composite material of the two; the organic light-emitting display device further includes: a plurality of transparent organic material layers 31 .
  • the transparent organic material layer may be, for example, a weak bonding layer (WBL).
  • WBL weak bonding layer
  • the patterns of the plurality of transparent organic material layers are complementary to the plurality of hollow areas of the second electrode layer, and are located on the pixel defining layer.
  • the second electrode layer of the multiple OLED light-emitting devices is an integrated structure. At this time, the multiple hollow areas on the second electrode layer are lined with multiple transparent organic material layers.
  • the orthographic projections on the base substrate 11 overlap, that is, a plurality of transparent organic material layers will fill the plurality of hollow areas.
  • the bonding force between the multiple transparent organic material layers and the pixel defining layer is relatively large, while the bonding force with the metal material as the pixel electrode of the OLED is relatively small. Therefore, when the metal material of the second electrode layer is formed, the hollow area can be avoided.
  • a metal material is formed at the position to ensure that there is no material such as Mg, Al or an alloy of the two that can block the light incident from the corresponding light-transmitting hole in the hollow area on the pixel defining layer.
  • FIG. 3 shows a cross-sectional view of an OLED display panel in which a plurality of transparent organic material layers 31 are formed in the second electrode layer
  • FIG. 4 shows a cross-sectional view of an OLED display panel including a cover layer 71
  • FIG. 5 shows A top view of a color filter layer including a black matrix with a plurality of light-transmitting holes 170 is shown.
  • FIG. 6A shows a top view of the second electrode layer 15 provided with a plurality of hollow regions 150 corresponding to a plurality of light-transmitting holes of the black matrix one-to-one.
  • 6B shows a top view of the second electrode layer 15 provided with the transparent organic material layer 31 in the plurality of hollow areas 150 corresponding to the plurality of light-transmitting holes of the black matrix one-to-one.
  • the pattern of the transparent organic material layer 31 is complementary to the hollowed-out area 150 of the second electrode layer 15 (that is, the orthographic projection of the plurality of transparent organic material layers 31 on the base substrate 11 and the The orthographic projections of the plurality of hollow areas 150 on the base substrate 11 overlap), and the transparent organic material layer 31 is located on the pixel defining layer 13.
  • the transparent organic material layer 31 has a higher light transmittance and a lower light reflectivity, so the transparent organic material layer 31 has a higher light transmittance to the OLED and the light-transmitting holes of the black matrix 17
  • the intensity of the reflected light at 170 has a small effect. Therefore, when an OLED display panel includes the transparent organic material layer 31, the fingerprint collection accuracy and display effect of the OLED are within an acceptable range.
  • the second electrode layer 15 is generally formed by an evaporation process.
  • the second electrode layer 15 formed by evaporation is usually a whole layer structure, and it is difficult to form the required hollow area during the evaporation process. Therefore, after the second electrode layer 15 is formed by evaporation, a hollow area needs to be further formed on the second electrode layer 15. The process is more complicated and the production cost is higher.
  • a transparent organic material layer 31 is fabricated in the hollow area 150 of the second electrode layer 15, and then the metal material of the second electrode layer 15 is evaporated.
  • the transparent organic material layer 31 for example, an organic material with a small adsorption force to metal materials can be used
  • the required pattern of the second electrode layer including multiple hollow areas can be directly formed, so the second electrode can be saved
  • the complexity of the layer further reduces the production cost of the OLED display panel.
  • a plurality of second hollow regions 150 are provided.
  • a plurality of first hollow regions may be provided in the first electrode layer 12.
  • the hollow area 120 is such that the orthographic projections of the plurality of light-transmitting holes 170 on the first electrode layer 120 are all located in the plurality of first hollow areas 120 of the first electrode layer 12.
  • the embodiment of the present invention can prevent the first electrode layer from affecting the light transmittance of the OLED.
  • an OLED display panel as shown in FIG. 8A can be prepared.
  • each first electrode (for example, anode) of a plurality of OLED light-emitting devices can be integrated, that is, the first electrode of the integrated structure
  • a plurality of first hollow areas 120 are provided in one electrode layer 12 for transmitting light incident from the plurality of light-transmitting holes 170.
  • a separate second electrode for example, a separate cathode
  • a part of the second electrode layer 15 is provided on the pixel defining layer 13, and a hollow area 150 is provided on the pixel defining layer 13 to separate the second electrodes of the plurality of OLED light-emitting devices.
  • the present disclosure is not limited to this, and those skilled in the art can specifically set the structure of the first electrode layer and the second electrode layer according to the display needs of the display panel, as long as they ensure that they correspond to the plurality of light-transmitting holes 170 and the plurality of fingerprint photosensitive sensors.
  • the light energy reflected back from the first side at the position of 19 can be received by a plurality of fingerprint photosensitive sensors 19 with less loss.
  • the OLED display panel further includes: an overcoating layer 71, and the overcoating (OC) 71 covers the black matrix 17 and the color film layer 18.
  • the material of the first electrode layer 12 is a light-shielding and conductive material.
  • the first electrode layer 12 may be made of metal materials such as copper, silver, and aluminum. Setting the first electrode layer 12 to be made of light-shielding and conductive material can prevent the light emitted by the electroluminescent layer 13 from being directly received by the fingerprint photosensitive sensor 19, thereby further improving the accuracy of fingerprint recognition.
  • the color filter layer 18 includes: a red filter 181, a green filter 182, and a blue filter arranged in an array with the black matrix 17 as an interval.
  • Light sheet 183 As shown in FIG. 5, a plurality of light transmission holes 170 are provided in the black matrix 17 of the present disclosure. According to the detection accuracy and detection area, a plurality of fingerprint photosensitive sensors 19 are arranged on the second side of the base substrate. Based on this, a corresponding number of light-transmitting holes are arranged in the black matrix 17 and the second electrode layer (for example, the anode layer) 15 170 and the hollow area 150. For example, as shown in FIG.
  • a plurality of light-transmitting holes 170 are provided in the black matrix 17, and the light-transmitting holes 170 may be arranged in a matrix.
  • corresponding multiple first hollow areas and multiple second hollow areas may be provided on the first electrode layer and the second electrode layer.
  • the plurality of first hollowed-out areas and the plurality of second hollowed-out areas are also arranged in a matrix.
  • the OLED display panel provided by the embodiments of the present disclosure may further include a polarizer, a touch function layer, etc., which are not limited in the embodiments of the present disclosure.
  • embodiments of the present disclosure also provide a manufacturing method of an OLED display panel, which is used to manufacture the OLED display panel provided in any of the above-mentioned embodiments.
  • the manufacturing method of the OLED display panel provided by the embodiment of the present disclosure includes the following steps:
  • the OLED device layer is fabricated on the first side of the base substrate, which specifically includes:
  • the implementation process of the foregoing step S91 may specifically include the following steps a to c:
  • Step a forming the first electrode layer in the effective display area by using a light-shielding and conductive material by evaporation.
  • Step b forming the pixel defining layer in the pixel defining area on the first side of the base substrate to expose a part of the first electrode layer.
  • the OLED display panel is divided into two areas, an effective display area and a pixel defined area.
  • the effective display area corresponds to the area where each sub-pixel is located
  • the pixel bounding area corresponds to the area where the pixel bounding layer is located.
  • the pixel defining layer divides the display panel into a plurality of sub-pixel areas arranged in an array for accommodating the plurality of OLED light-emitting devices, and the collection of all the sub-pixel areas is the effective display area.
  • Step c forming electroluminescent layers of the plurality of OLED light-emitting devices on the exposed portion of the first electrode layer.
  • the electroluminescent layer can be formed on the first electrode layer by a deposition process.
  • the formed layer structure may be as shown in FIG. 10, including: a base substrate 11, arranged on the base substrate The first electrode layer 12 and the pixel defining layer 13 on the first side of 11, and the electroluminescent layer 14 provided on the first electrode layer 12.
  • the formed layer structure may be as shown in FIG.
  • the first electrode layer 12 and the pixel defining layer 13 on the side, the electroluminescent layer 14 disposed on the first electrode layer 12, and the second electrode covering the pixel defining layer 13 and the electroluminescent layer 14 Layer 15 completes the preparation of the related OLED device layer, the OLED device layer includes a plurality of OLED light-emitting devices.
  • step S92 (making a second electrode layer covering the pixel defining layer and the electroluminescent layer) may include the following steps 1 and 2:
  • Step 1 By evaporating a weak bonding material (for example, a transparent organic material), a plurality of weak bonding layers (for example, a plurality of A transparent organic material layer 31).
  • a weak bonding material for example, a transparent organic material
  • a plurality of weak bonding layers for example, a plurality of A transparent organic material layer 31.
  • the second electrode layer is formed in a region other than the transparent organic material layer 31 by evaporating the metal material of the second electrode layer (for example, Mg, Al or an alloy of the two).
  • the second electrode layer of the area makes the hollow area filled with transparent organic metal material, which can ensure that the reflected light can pass through, and further enter and be received by the fingerprint sensor 19 on the second side of the base substrate.
  • the formed layer structure may be as shown in FIG.
  • the second electrode layer 15 on the light-emitting layer 14, the second electrode layer has a hollow area 150; a transparent organic material layer 31, the pattern of the transparent organic material layer 31 is complementary to the hollow area 150 of the second electrode layer 15 , And located on the pixel defining layer 13.
  • the layer structure formed by packaging the first side of the base substrate to form an encapsulation layer may be as shown in FIG. 13, including: a base substrate 11, a first electrode layer disposed on the first side of the base substrate 11 12 and the pixel defining layer 13, the electroluminescent layer 14 arranged on the first electrode layer 11, the second electrode layer 15 covering the pixel defining layer 13 and the electroluminescent layer 14, covering the second The encapsulation layer 16 on the electrode layer 15.
  • the packaging layer is coated with a black matrix provided with a plurality of light-transmitting holes, and the orthographic projections of the plurality of light-transmitting holes on the second electrode layer are all located in the hollow area of the second electrode layer
  • the formed layer structure may be as shown in FIG. 14, including: a base substrate 11, a first electrode layer 12 and a pixel defining layer 13 disposed on the first side of the base substrate 11, and a base substrate 11 disposed on the first side.
  • the electroluminescent layer 14 on an electrode layer 11, the second electrode layer 15 covering the pixel defining layer 13 and the electroluminescent layer 14, and the packaging layer 16 covering the second electrode layer 15 are arranged on the The black matrix 17 on the encapsulation layer 16.
  • the black matrix 17 is provided with a plurality of light-transmitting holes 170, and the orthographic projections of the plurality of light-transmitting holes 170 on the second electrode layer 15 are all located in the hollow area 150.
  • the color filter layer in the embodiment of the present invention may include a red filter, a green filter, and a blue filter arranged in an array with the black matrix as an interval.
  • the color film layer includes the red filter, the green filter, and the blue filter arranged in an array with the black matrix as an interval
  • forming the color film layer on the encapsulation layer includes:
  • the red filter, the green filter, and the blue filter are formed one by one.
  • the layer structure formed after the color filter layer is fabricated on the encapsulation layer can be as shown in FIG. ,
  • the black matrix 17 is provided with a plurality of light-transmitting holes 170, the second electrode layer 15 has a hollow area 150, and the orthographic projections of the plurality of light-transmitting holes 170 on the second electrode layer 15 are all located at all.
  • the hollow area 150 is described.
  • the formed layer structure may be as shown in FIG.
  • the black matrix 17 is provided with a plurality of light-transmitting holes 170
  • the second electrode layer 15 has a hollow area 150
  • the orthographic projections of the plurality of light-transmitting holes 170 on the second electrode layer 15 are all located at all.
  • the plurality of fingerprint photosensitive devices 19 are respectively located in the orthographic projection of the plurality of light-transmitting holes 170.
  • the embodiment of the present invention does not limit the sequence of making the structure on the first side of the base substrate and making the structure on the second side of the base substrate.
  • the structure on the first side of the base substrate, and then the structure on the second side of the base substrate is manufactured through the above step S96, or the structure on the second side of the base substrate is manufactured through the above step S96.
  • the structure on the first side of the base substrate is fabricated through the above steps S91 to S95, and the above step S96 can also be interspersed between any adjacent steps of the steps S91 to S95.
  • the method for manufacturing an OLED display panel provided by the embodiment of the present invention further includes:
  • the manufacturing method of the OLED display panel provided in the embodiments of the present disclosure can manufacture the OLED display panel provided in any of the above embodiments. Therefore, the manufacturing method of the OLED display panel provided in the embodiments of the present disclosure can achieve the same value as the OLED display panel provided in the above embodiments. The same technical effect will not be repeated here.
  • embodiments of the present disclosure also provide a display device.
  • the display device includes the OLED display panel provided in any of the above embodiments, or the OLED display panel manufactured by the OLED display panel manufacturing method provided in the above embodiments.
  • the electronic device in the embodiment of the present disclosure may be a mobile phone, a tablet computer (portable android device, PAD), a smart watch, a vehicle-mounted device, and the like.

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Abstract

本公开实施例提供一种OLED显示面板及其制造方法，涉及显示技术领域，用于在提升基于COE的OLED的透光率的同时避免影响显示效果。该OLED显示面板包括：衬底基板、设置于衬底基板的第一侧的第一电极层和像素界定层、设置于第一电极层上的电致发光层、覆盖于像素界定层和电致发光层上的第二电极层、覆盖于第二电极层上的封装层、设置于封装层上的黑矩阵和彩膜层以及设置于衬底基板的第二侧的多个指纹感光传感器；黑矩阵上开设有多个透光孔，第二电极层具有镂空区域，多个透光孔在第二电极层上的正投影均位于第二电极层的镂空区域内；多个指纹感光器件分别位于多个透光孔的正投影内。本公开实施例还提供了OLED显示面板的制造方法。

Description

OLED显示面板及其制造方法
相关申请的交叉引用
本申请要求于2020年6月23日在中国知识产权局提交的No.202010580971.3的中国专利申请的优先权，该中国专利申请的全部内容通过引用合并于此。
技术领域
本公开涉及显示技术领域，尤其涉及一种OLED显示面板及其制造方法。
背景技术
随着终端技术的发展，电子设备的屏幕尺寸越来越大，高屏占比电子设备逐渐受到用户的青睐。全面屏电子设备作为高屏占比电子设备的发展目标，实现了电子设备屏幕比例的最大化，是当前最热门的技术之一，受到广大用户的喜爱和追捧。
发明内容
本公开提供了一种OLED显示面板及其制造方法。
本公开的OLED显示面板，包括：衬底基板；设置于所述衬底基板的第一侧的OLED器件层，其包括多个OLED发光器件；封装层，其覆盖所述多个OLED发光器件；彩膜层，其布置在所述封装层上，包括限定出多个开口的黑矩阵以及分别处于所述多个开口中且通过黑矩阵彼此间隔开的与所述多个OLED发光器件一一对应的多个彩膜，其中，所述OLED器件层包括第一电极层、第一电极层上的多个OLED发光器件的多个电致发光层、覆盖于所述多个电致发光层上的第二电极层；其中，所述封装层形成在第二电极层上；所述OLED显示面板还包括设置于所述衬底基板的与所述第一侧相对的第二侧的多个指纹感光传感器；所述黑矩阵上开设有多个透光孔，所述第二电极层具有多个第二镂空区域，所述多个透光孔、所述多个第二镂空区域和所述多个指纹感光器件在所述衬底基板上的正投影至 少部分重叠。
在一些实施例中，所述OLED器件层还包括限定出所述多个OLED发光器件的多个子像素区域并且暴露出第一电极层的像素界定层，以及所述多个第二镂空区域在所述衬底基板上的正投影位于所述像素限定层在所述衬底基板上的正投影范围内。
在一些实施例中，所述第二电极层的材料为Mg、Al及其合金；所述OLED器件层还包括：多个透明有机材料层，所述多个透明有机材料层设置在所述第二电极层的多个镂空区域内。
在一些实施例中，所述多个透明有机材料层在所述衬底基板上的正投影与所述多个镂空区域在所述衬底基板上的正投影重合。
在一些实施例中，所述第一电极层包括所述多个OLED发光器件的多个分立的第一电极，以及所述第二电极层包括针对所述多个OLED发光器件的一体化的第二电极层，并且所述多个第二镂空区域为开设在第二电极层中的多个开口。
在一些实施例中，所述第一电极层具有多个第一镂空区域，所述多个透光孔、所述多个第二镂空区域、所述多个第一镂空区域和所述多个指纹感光传感器在所述衬底基板上的正投影至少部分重叠。
在一些实施例中，所述OLED显示面板还包括：覆盖层，其覆盖于所述彩膜层上。
在一些实施例中，所述第一电极层的材料包括遮光且导电的材料。
在一些实施例中，所述多个彩膜包括阵列排布的红色滤光片、绿色滤光片、蓝色滤光片。
本公开提供的OLED显示面板的制造方法，包括：在衬底基板的第一侧制作OLED器件层,其具有多个OLED发光器件,并且包括第一电极层、第一电极层上的多个OLED发光器件的多个电致发光层和所述多个电致发光层上的第二电极层，其中所述第二电极层具有多个第二镂空区域；对所述衬底基板的第一侧进行封装以覆盖所述多个OLED发光器件，形成封装层；在所述封装层上形成彩膜层，其包括限定出多个开口的黑矩阵以及分别处于所述多个开口中且通过黑矩阵彼此间隔开的与所述多个OLED发光器件一一对应的多个彩膜，其中所述黑矩阵上开设有多个透光孔；在所述衬底 基板的第二侧制作多个指纹感光传感器；其中，所述多个透光孔、所述多个第二镂空区域和所述多个指纹感光器件在所述衬底基板上的正投影至少部分重叠。
在一些实施例中，所述在衬底基板的第一侧制作OLED器件层包括：在所述衬底基板上形成第一电极层，所述第一电极层包括针对多个OLED发光器件的多个分立的第一电极；在所述多个分立的第一电极上形成像素限定层，以限定出所述多个OLED发光器件的多个子像素区域并且暴露出多个分立的第一电极；在多个分立的第一电极上形成多个电致发光层；以及在所述像素限定层和所述多个电致发光层上形成所述第二电极层，所述第二电极层的多个第二镂空区域在所述衬底基板上的正投影处于所述像素限定层在所述衬底基板上的正投影的范围内。
在一些实施例中，在所述像素限定层和所述多个电致发光层上形成所述第二电极层包括：在所述像素限定层上对应于所述多个第二镂空区域的位置形成多个透明有机材料层；以及在所述像素限定层和所述多个电致发光层上形成第二电极材料层，以形成所述第二电极层，所述第二电极层包括多个第二镂空区域位置的多个透明有机材料层和所述多个第二镂空区域位置以外的第二电极材料。
在一些实施例中，在所述衬底基板上形成第一电极层包括形成具有多个第一镂空区域的第一电极层，使得所述多个透光孔、所述多个第二镂空区域、所述多个第一镂空区域和所述多个指纹感光传感器在所述衬底基板上的正投影至少部分重叠。
在一些实施例中，在所述封装层上形成彩膜层之后，所述制造方法还包括：在所述彩膜层上形成覆盖层。
附图说明
通过下文实施例的详细描述，本公开各种其他的优点和益处对于本领域普通技术人员将变得清楚明了。附图仅用于示出示例的目的，而并不认为是对本公开的限制。在本公开全部附图中，用相同的参考符号表示相同的部件。
图1为本公开实施例提供的OLED显示面板的剖视图；
图2为本公开实施例提供的OLED显示面板的工作原理图；
图3为本公开实施例提供的OLED显示面板的剖视图；
图4为本公开实施例提供的OLED显示面板的剖视图；
图5为本公开实施例提供的OLED显示面板的彩膜层的俯视图；
图6A为本公开实施例提供的OLED显示面板的第二电极层的俯视图；
图6B为本公开实施例提供的OLED显示面板的第二电极层的俯视图；
图7为本公开实施例提供的OLED显示面板的第一电极层的俯视图；
图8A为本公开实施例提供的OLED显示面板的剖视图；
图8B为本公开实施例提供的OLED显示面板的剖视图；
图9为本公开实施例提供的OLED显示面板的制造方法的流程图；
图10为本公开实施例提供的OLED显示面板的制造方法的中间结构的示意图；
图11为本公开实施例提供的OLED显示面板的制造方法的中间结构的示意图；
图12为本公开实施例提供的OLED显示面板的制造方法的中间结构的示意图；
图13为本公开实施例提供的OLED显示面板的制造方法的中间结构的示意图；
图14为本公开实施例提供的OLED显示面板的制造方法的中间结构的示意图；
图15为本公开实施例提供的OLED显示面板的制造方法的中间结构的示意图；以及
图16为本公开实施例提供的OLED显示面板的制造方法的中间结构的示意图。
附图标记：
11-衬底基板；12-第一电极层；13-像素界定层；14-电致发光层；
15-第二电极层；16-封装层；17-黑矩阵；18-彩膜层；
19-指纹感光传感器；31-透明有机材料层；71-覆盖层；170-透光孔；
150-第二电极层15的镂空区域；120-第一电极层12的镂空区域；
181-红色滤光片；182-绿色滤光片；183-蓝色滤光片。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于本公开实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本公开实施例中，“示例性的”或者“例如”等词用于表示例子、例证或说明。本公开实施例中被描述为“示例性的”或者“例如”的任何实施例或设计方案不应被解释为比其它实施例或设计方案更优选或更具优势。确切而言，使用“示例性的”或者“例如”等词旨在以具体方式呈现相关概念。此外，在本公开实施例的描述中，除非另有说明，“多个”的含义是指两个或两个以上。
为了在电子设备的显示面保留指纹采集模块且避免影响电子设备的屏占比，现有技术中提出了通过屏下指纹识别的方式实现指纹识别功能。相比于传统指纹识别模块，屏下指纹识别可将指纹采集模块集成在显示面板中，无需占用显示面板的显示区域，因此屏下指纹识别已成为指纹识别的一种重要实现方式。将屏下指纹识别技术应用于基于COE(CF on EL，在薄膜封装的有机电致发光器件上形成彩膜层)的有机发光显示器件(Organic Light-Emitting Diode，OLED)时，由于黑矩阵(Black Matrix，BM)、彩膜层(Color Filter，CF)以及电极层的遮挡，基于COE的OLED的透光率非常低，无法满足屏下指纹识别对透过率的要求。现有技术中一般通过在BM上开孔，提升基于COE的OLED的透光率，然而，一方面OLED的电极层仍会影响OLED的透光率，进而影响指纹采集精度，另一方面，在BM上开孔会直接暴露出OLED的电极层，造成开孔处的反射光强度大幅提升，进而影响OLED的显示效果。
本公开实施例提供了一种OLED显示面板，参照图1所示，本公开实施例提供的OLED显示面板包括：衬底基板(Base Plate，BP)11、设置于所述衬底基板11的第一侧的第一电极层12和像素界定层(Pixel Definition  Layer，PDL)13，设置于所述第一电极层12上的电致发光层(Electro Luminescent，EL)14、覆盖于所述像素界定层13和电致发光层14上的第二电极层15、覆盖于第二电极层15上的封装层(Encapsulation Layer，EN)16、设置于所述封装层16上的黑矩阵(Black Matrix，BM)17和彩膜层(Color Filter，CF)18以及设置于所述衬底基板11的第二侧的多个指纹感光传感器19；
所述黑矩阵17上开设有多个透光孔170(例如，可以为在黑矩阵17中开设的多个开口，此处也可以称为多个透光开口)，所述第二电极层15具有多个第二镂空区域150，所述多个透光孔170在所述第二电极层15上的正投影位于所述多个第二镂空区域150内；所述多个指纹感光传感器19分别位于所述多个透光孔170的正投影内。例如，多个透光孔170、多个第二镂空区域150和多个指纹感光器件19在衬底基板11上的正投影至少部分重叠，以使得从OLED显示面板第一侧反射回的光能够以较小的损耗入射到多个指纹感光传感器19。第二电极层15中的多个镂空区域150可以为在第二电极层15中形成的多个开口，此处也可以称为多个电极开口；也可以为具有相对于第二电极层的其他区域具有光透过率较大的透明材料层，例如为一种透明有机材料层。
本公开实施例中的第一电极层12所包括的电极可以为OLED的阳极或OLED的阴极。当第一电极层12为OLED的阳极时，第二电极层为OLED的阴极，当第一电极层12为OLED的阴极时，第二电极层为OLED的阳极。
进一步，本公开实施例提供的OLED显示面板还可以包括与所述多个指纹感光传感器19均电连接的指纹处理模块，用于在指纹感光传感器19将手指的反射光线转换为电信号后，根据指纹感光传感器19输出的电信号确定采集到的指纹，并与预存储的指纹进行匹配。
如图2所示，手指反射的光线从黑矩阵17上开设的透光孔170进入有OLED显示面板后，首先穿过封装层16，然后从第二电极层15的镂空区域150进入像素界定层13，并穿过像素界定层13到达指纹感光传感器19。由于手指反射的光线传播至指纹感光传感器19的过程中，手指反射的光线可以从第二电极层15的镂空区域150穿射过第二电极层15，因此第二电极层 15不会吸收和反射手指反射的光线，因此本公开实施例可以避免第二电极层15影响OLED的透光率从而可以避免黑矩阵的透光孔处的反射光强度大幅提升。
本公开实施例提供的OLED显示面板包括：衬底基板、设置于所述衬底基板的第一侧的第一电极层和像素界定层、设置于所述第一电极层上的电致发光层、覆盖于所述像素界定层和电致发光层上的第二电极层(即，在所述衬底基板上形成OLED器件层，其包括多个OLED发光器件)、覆盖于第二电极层上的封装层、设置于所述封装层上的包括黑矩阵的彩膜层以及设置于所述衬底基板的第二侧的多个指纹感光传感器。其中，所述黑矩阵包括限定出多个开口的黑矩阵以及分别处于所述多个开口中且通过黑矩阵彼此间隔开的与所述多个OLED发光器件一一对应的多个彩膜。在此基础上，所述黑矩阵中还开设有多个透光孔。所述第二电极层具有多个镂空区域，所述多个透光孔在所述第二电极层上的正投影分别与所述第二电极层的多个镂空区域至少部分重叠。例如，所述多个透光孔在所述第二电极层上的正投影分别处于所述第二电极层的多个镂空区域内，因此，从透光孔入射的光几乎都会通过镂空区域被指纹感光传感器接收到；所述多个指纹感光传感器分别位于所述多个透光孔的正投影内以使得从所述多个透光孔反射回的光线均被指纹感光器件采集到。一方面，由于第二电极层具有多个镂空区域，且黑矩阵上开设的多个透光孔在所述第二电极层上的正投影均位于所述第二电极层的多个镂空区域内，指纹反射的光线不会受到黑矩阵和第二电极层的遮挡，因此本公开实施例可以提升基于COE的OLED的透光率。另一方面，由于黑矩阵上开设的多个透光孔在所述第二电极层上的正投影均位于所述第二电极层的镂空区域内，第二电极层不会反射透光孔透射的光线，因此本公开实施例还可以避免透光孔处的反射光强度大幅提升。综上分析，本公开实施例可以在提升基于COE的OLED的透光率的同时避免影响显示效果。
作为本公开实施例一种可选的实施方式，制作所述第二电极层的材料可以为Mg、Al或者二者的复合材料；所述有机发光显示器件还包括：多个透明有机材料层31。透明有机材料层例如可以为弱键合层(Weak Bonding  Layer，WBL)。所述多个透明有机材料层的图案与所述第二电极层的多个镂空区域互补，且位于所述像素界定层上。例如，在针对包括多个OLED发光器件的显示面板时，多个OLED发光器件的第二电极层为一体结构，此时第二电极层上的多个镂空区域与多个透明有机材料层在衬底基板11上的正投影重合，即多个透明有机材料层将填充所述多个镂空区域。多个透明有机材料层与像素限定层的接合力较大，而与作为OLED的像素电极的金属材料的接合力相对较小，因此在形成第二电极层的金属材料时，可以避免在镂空区域处形成金属材料，从而确保在像素限定层上的镂空区域中不存在会阻挡从对应的透光孔入射的光线的例如Mg、Al或者二者合金材料。
具体的，图3示出了在第二电极层中形成多个透明有机材料层31的OLED显示面板的截面图，图4示出了包括覆盖层71的OLED显示面板的截面图，图5示出了包括具有多个透光孔170的黑矩阵的彩膜层的俯视图。图6A示出了设置有与黑矩阵的多个透光孔一一对应的多个镂空区域150的第二电极层15的俯视图。图6B示出了设置有与黑矩阵的多个透光孔一一对应的多个镂空区域150内的透明有机材料层31的第二电极层15的俯视图。
如图6B所示，所述透明有机材料层31的图案与所述第二电极层15的镂空区域150互补(即，多个透明有机材料层31在衬底基板11上的正投影与所述多个镂空区域150在所述衬底基板11上的正投影重合)，且所述透明有机材料层31位于所述像素界定层13上。
一方面，由于相比于第二电极层15，透明有机材料层31透光率较大且光反射率交小，因此透明有机材料层31对OLED的透光率以及黑矩阵17的透光孔170处的反射光强度影响较小，因此当有OLED显示面板包括透明有机材料层31时，OLED的指纹采集精度以及显示效果均在可接受范围内。
另一方面，OLED显示面板的制程工艺中，一般通过蒸镀工艺形成第二电极层15，然而蒸镀形成的第二电极层15通常为整层结构，蒸镀过程中难以形成需要的镂空区域，因此在蒸镀形成第二电极层15后，还需要进一 步在第二电极层15上制作镂空区域，工艺比较复杂，生产成本较高。根据一个实施例，本公开中，在第二电极层15的镂空区域150制作透明有机材料层31，然后再进行第二电极层15的金属材料的蒸镀，由于第二电极层15的金属材料无法附着在透明有机材料层31(例如可以采用对金属材料吸附力较小的有机材料)上，可以直接形成需要的包括多个镂空区域的第二电极层的图案，因此可以节省制作第二电极层的复杂度，进而降低OLED显示面板的生产成本。
参照图7所示，类似于如上图6A所示的第二电极层15中设置多个第二镂空区域150，在一个实施例中，可以在所述第一电极层12中设置多个第一镂空区域120，以使得所述多个透光孔170在所述第一电极层120上的正投影均位于所述第一电极层12的多个第一镂空区域120内。
由于透光孔170在所述第一电极层120上的正投影均位于所述第一电极层12的镂空区域120内，因此手指反射的光线可以从第一电极层12的镂空区域120穿射过第一电极层12，因此第一电极层12也不会吸收和反射手指反射的光线，因此本发明实施例可以避免第一电极层影响OLED的透光率。在这种情况下，例如可以制备如图8A所示的OLED显示面板，在该显示面板中，多个OLED发光器件的各个第一电极(例如阳极)可以是一体的，即，一体结构的第一电极层12中设置了多个第一镂空区域120，用于透射从多个透光孔170入射的光。此时，可以针对每个OLED发光器件设置分立的第二电极(例如分立的阴极)。又例如图8B所示，第二电极层15的一部分设置在像素限定层13上，而在像素限定层13上设置有镂空区域150，用以将多个OLED发光器件的第二电极分隔开，并且也能够允许从OLED显示面板第一侧反射回的光能够被指纹感光传感器19接收到。但是，本公开不限于此，本领域技术人员可以显示面板的显示需要来具体设置第一电极层和第二电极层的结构，只要确保在对应于多个透光孔170和多个指纹感光传感器19的位置从第一侧反射回的光能以较少的损耗被多个指纹感光传感器19接收到即可。
进一步的，参照图4所示，所述OLED显示面板还包括：覆盖层71，所述覆盖层(Over Coating，OC)71覆盖于所述黑矩阵17和彩膜层18上。
作为本公开的实施例，所述第一电极层12的材料为遮光且导电的材料。
示例性的，第一电极层12可以由铜、银、铝等金属材料制作。设置第一电极层12由遮光且导电材料制作，可以避免电致发光层13发出的光线直接被指纹感光传感器19接收，进而进一步提升指纹识别的精度。
作为本公开的一个实施例，参照图5所示，所述彩膜层18包括：以所述黑矩阵17为间隔的阵列排布的红色滤光片181、绿色滤光片182、蓝色滤光片183。如图5所示，本公开的黑矩阵17中设置了多个透光孔170。根据检测精度和检测面积，在衬底基板的第二侧设置多个指纹感光传感器19，基于此，在黑矩阵17和第二电极层(例如，阳极层)15中设置相应数量的透光孔170和镂空区域150。例如，图8所示，在黑矩阵17中设置了多个透光孔170，这些透光孔170可以呈矩阵方式排列。相应地，如图6A、图6B和图7所示，可以在第一电极层和第二电极层上设置对应的多个第一镂空区域和多个第二镂空区域。类似地，多个第一镂空区域和多个第二镂空区域也呈矩阵方式排列。
当然，在上述实施例的基础上，本公开实施例提供的OLED显示面板还可以包括偏光片、触摸功能层等，本公开实施例对此不做限定。
基于同一发明构思，本公开实施例还提供了一种OLED显示面板的制造方法，该OLED显示面板的制造方法用于制造上述任一实施例提供的OLED显示面板。具体的，参照图9所示，本公开实施例提供的OLED显示面板的制造方法包括如下步骤：
在衬底基板的第一侧制作OLED器件层，其具体包括：
S91、依次在衬底基板的第一侧制作第一电极层、像素界定层以及电致发光层。
具体的，上述步骤S91(依次在衬底基板的第一侧制作第一电极层、像素界定层以及电致发光层)的实现过程，具体可以包括如下步骤a至步骤c：
步骤a、通过蒸镀遮光且导电材料在有效显示区域内形成所述第一电极层。
步骤b、在所述衬底基板的第一侧的像素界定区域内形成所述像素界定层，以暴露出部分第一电极层。
需要说明的是，本公开实施例中将OLED显示面板划分为有效显示区域和像素界定区域两个区域。其中，有效显示区域对应各个子像素所在的区域，像素界定区域对应像素界定层所在区域。像素界定层将显示面板分割为多个阵列排布的子像素区域，用以分别容纳所述多个OLED发光器件，全部子像素区域的合集即为有效显示区域。
步骤c、在所述第一电极层上暴露的部分上形成所述多个OLED发光器件的电致发光层。
具体的，可以通过沉积工艺在第一电极层上形成所述电致发光层。
依次在衬底基板的第一侧制作第一电极层、像素界定层以及电致发光层后，形成的层结构可以如图10所示，包括：衬底基板11、设置于所述衬底基板11的第一侧的第一电极层12和像素界定层13、设置于所述第一电极层12上的电致发光层14。
S92、制作覆盖所述像素界定层和所述电致发光层的第二电极层，所述第二电极层具有多个镂空区域。
制作覆盖所述像素界定层和所述电致发光层的第二电极层后，形成的层结构可以如图11所示，包括：衬底基板11、设置于所述衬底基板11的第一侧的第一电极层12和像素界定层13、设置于所述第一电极层12上的电致发光层14，以及覆盖于所述像素界定层13和电致发光层14上的第二电极层15，完成了有关OLED器件层的制备，该OLED器件层包括多个OLED发光器件。
具体的，步骤S92(制作覆盖所述像素界定层和所述电致发光层的第二电极层)的实现过程可以包括如下步骤1和步骤2：
步骤1、通过蒸镀弱键合材料(例如透明有机材料)，在所述像素界定层上形成与所述第二电极层的多个镂空区域相对应的多个弱键合层(例如，多个透明有机材料层31)。
步骤2、通过蒸镀第二电极层的金属材料(例如，Mg、Al或者二者的合金)，在所述透明有机材料层31以外的其它区域内形成所述第二电极层。
由于第二电极层的金属材料不会附着在弱键合材料上，因此在形成与所述第二电极层的镂空区域相对应的弱键合层后，直接蒸镀金属材料即可 以形成具有镂空区域的第二电极层，使得在镂空区域中填充有透明有机金属材料，可以确保反射回的光线能够通过，进一步入射至衬底基板第二侧的指纹感光传感器19并且被其接收。
当通过上述步骤1和步骤2制作覆盖所述像素界定层和所述电致发光层的第二电极层时，形成的层结构可以如图12所示，包括：衬底基板11、设置于所述衬底基板11的第一侧的第一电极层12和像素界定层13、设置于所述第一电极层12上的电致发光层14，以及覆盖于所述像素界定层13和电致发光层14上的第二电极层15，所述第二电极层具有镂空区域150；透明有机材料层31，所述透明有机材料层31的图案与所述第二电极层15的镂空区域150互补，且位于所述像素界定层13上。
S93、对所述衬底基板的第一侧进行封装，形成封装层。
对所述衬底基板的第一侧进行封装形成封装层形成的层结构可以如图13所示，包括：衬底基板11、设置于所述衬底基板11的第一侧的第一电极层12和像素界定层13、设置于所述第一电极层11上的电致发光层14、覆盖于所述像素界定层13和电致发光层14上的第二电极层15、覆盖于第二电极层15上的封装层16。
S94、在所述封装层上涂覆开设有多个透光孔的黑矩阵，且设置所述多个透光孔在所述第二电极层上的正投影均位于所述第二电极层的镂空区域内。
在所述封装层上涂覆开设有多个透光孔的黑矩阵，且设置所述多个透光孔在所述第二电极层上的正投影均位于所述第二电极层的镂空区域内后，形成的层结构可以如图14所示，包括：衬底基板11、设置于所述衬底基板11的第一侧的第一电极层12和像素界定层13、设置于所述第一电极层11上的电致发光层14、覆盖于所述像素界定层13和电致发光层14上的第二电极层15、覆盖于第二电极层15上的封装层16设置于所述封装层16上的黑矩阵17。所述黑矩阵17上开设有多个透光孔170，所述多个透光孔170在所述第二电极层15上的正投影均位于所述镂空区域150内。
S95、在所述封装层上制作彩膜层。
具体的，本发明实施例中的彩膜层可以包括以所述黑矩阵为间隔，阵 列排布的红色滤光片、绿色滤光片、蓝色滤光片。
当彩膜层包括以所述黑矩阵为间隔，阵列排布的红色滤光片、绿色滤光片、蓝色滤光片时，在所述封装层上制作彩膜层包括：
逐一形成红色滤光片、绿色滤光片、蓝色滤光片。
在封装层上制作彩膜层后形成的层结构可以如图15所示，包括：衬底基板11、设置于所述衬底基板11的第一侧的第一电极层12和像素界定层13、设置于所述第一电极层12上的电致发光层14、覆盖于所述像素界定层13和电致发光层14上的第二电极层15、覆盖于第二电极层15上的封装层16、设置于所述封装层16上的黑矩阵17和彩膜层18；
所述黑矩阵17上开设有多个透光孔170，所述第二电极层15具有镂空区域150，所述多个透光孔170在所述第二电极层15上的正投影均位于所述镂空区域150内。
S96、在所述衬底基板的第二侧制作多个指纹感光传感器，且使所述多个指纹感光器件分别位于所述多个透光孔的正投影内。
在所述衬底基板的第二侧制作多个指纹感光传感器后，形成的层结构可以如图16所示，包括：衬底基板11、设置于所述衬底基板11的第一侧的第一电极层12和像素界定层13、设置于所述第一电极层12上的电致发光层14、覆盖于所述像素界定层13和电致发光层14上的第二电极层15、覆盖于第二电极层15上的封装层16、设置于所述封装层16上的黑矩阵17和彩膜层18以及设置于所述衬底基板11的第二侧的多个指纹感光传感器19。
所述黑矩阵17上开设有多个透光孔170，所述第二电极层15具有镂空区域150，所述多个透光孔170在所述第二电极层15上的正投影均位于所述镂空区域150内，所述多个指纹感光器件19分别位于所述多个透光孔170的正投影内。
需要说明的是，本发明实施例中不限定制作位于衬底基板的第一侧的结构和制作位于衬底基板的第二侧的结构的先后关系，可以先通过上述步骤S91至S95制作位于所述衬底基板的第一侧的结构，再通过上述步骤S96制作位于所述衬底基板的第二侧的结构，也可以先通过上述步骤S96制作 位于所述衬底基板的第二侧的结构，再通过上述步骤S91至S95制作位于所述衬底基板的第一侧的结构，还可以将通过上述步骤S96穿插于步骤S91至S95任意相邻步骤之间。
可选的，在步骤S95(在所述封装层上制作彩膜层)之后，本发明实施例提供的OLED显示面板的制造方法还包括：
制作覆盖所述彩膜层和所述黑矩阵的覆盖层。
本公开实施例提供的OLED显示面板的制造方法可以制造得到上述任一实施例提供的OLED显示面板，因此本公开实施例提供的OLED显示面板的制造方法可以达到与上述实施例提供的OLED显示面板相同的技术效果，在此不再赘述。
基于同一发明构思，本公开实施例还提供了一种显示设备。该显示设备包括上述任一实施例提供的OLED显示面板，或者通过上述实施例提供的OLED显示面板的制造方法制造的OLED显示面板。
示例性的，本公开实施例中的电子设备可以为手机、平板电脑(portable android device，PAD)、智能手表、车载设备等。
最后应说明的是：以上各实施例仅用以说明本公开的技术方案，而非对其限制；尽管参照前述各实施例对本公开进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本公开各实施例技术方案的范围。

Claims (15)

  1. 一种OLED显示面板，包括：
    衬底基板；
    设置于所述衬底基板的第一侧的OLED器件层，其包括多个OLED发光器件；
    封装层，其覆盖所述多个OLED发光器件；
    彩膜层，其布置在所述封装层上，包括限定出多个开口的黑矩阵以及分别处于所述多个开口中且通过黑矩阵彼此间隔开的与所述多个OLED发光器件一一对应的多个彩膜，
    其中，所述OLED器件层包括第一电极层、第一电极层上的多个OLED发光器件的多个电致发光层、覆盖于所述多个电致发光层上的第二电极层；其中，所述封装层形成在第二电极层上；
    所述OLED显示面板还包括设置于所述衬底基板的与所述第一侧相对的第二侧的多个指纹感光传感器；
    所述黑矩阵上开设有多个透光孔，所述第二电极层具有多个第二镂空区域，所述多个透光孔、所述多个第二镂空区域和所述多个指纹感光器件在所述衬底基板上的正投影至少部分重叠。
  2. 根据权利要求1所述的OLED显示面板，其中，所述OLED器件层还包括限定出所述多个OLED发光器件的多个子像素区域并且暴露出第一电极层的像素界定层，以及所述多个第二镂空区域在所述衬底基板上的正投影位于所述像素限定层在所述衬底基板上的正投影范围内。
  3. 根据权利要求1或2所述的OLED显示面板，其中，
    所述第二电极层的材料为Mg、Al及其合金；
    所述OLED器件层还包括：多个透明有机材料层，所述多个透明有机材料层设置在所述第二电极层的多个镂空区域内。
  4. 根据权利要求3所述的OLED显示面板，其中，
    所述多个透明有机材料层在所述衬底基板上的正投影与所述多个镂空区域在所述衬底基板上的正投影重合。
  5. 根据权利要求1至4中任一项所述的OLED显示面板，其中，
    所述第一电极层包括所述多个OLED发光器件的多个分立的第一电极，以及
    所述第二电极层包括针对所述多个OLED发光器件的一体化的第二电极，并且所述多个第二镂空区域为开设在第二电极层中的多个开口。
  6. 根据权利要求1所述的OLED显示面板，其中，所述第一电极层具有多个第一镂空区域，所述多个透光孔、所述多个第二镂空区域、所述多个第一镂空区域和所述多个指纹感光传感器在所述衬底基板上的正投影至少部分重叠。
  7. 根据权利要求1至6中任一项所述的OLED显示面板，还包括：
    覆盖层，其覆盖于所述彩膜层上。
  8. 根据权利要求1至7中任一项所述的OLED显示面板，其中，所述第一电极层的材料包括遮光且导电的材料。
  9. 根据权利要求1至8中任一项所述的OLED显示面板，其中，所述多个彩膜包括阵列排布的红色滤光片、绿色滤光片、蓝色滤光片。
  10. 一种OLED显示面板的制造方法，包括：
    在衬底基板的第一侧制作OLED器件层,其具有多个OLED发光器件,并且包括第一电极层、第一电极层上的多个OLED发光器件的多个电致发光层和所述多个电致发光层上的第二电极层，其中所述第二电极层具有多个第二镂空区域；
    对所述衬底基板的第一侧进行封装以覆盖所述多个OLED发光器件，形成封装层；
    在所述封装层上形成彩膜层，其包括限定出多个开口的黑矩阵以及分别处于所述多个开口中且通过黑矩阵彼此间隔开的与所述多个OLED发光器件一一对应的多个彩膜，其中所述黑矩阵上开设有多个透光孔；
    在所述衬底基板的第二侧制作多个指纹感光传感器；
    其中，所述多个透光孔、所述多个第二镂空区域和所述多个指纹感光器件在所述衬底基板上的正投影至少部分重叠。
  11. 根据权利要求10所述的制造方法，其中，所述在衬底基板的第一侧制作OLED器件层包括：
    在所述衬底基板上形成第一电极层，所述第一电极层包括针对多个OLED发光器件的多个分立的第一电极；
    在所述多个分立的第一电极上形成像素限定层，以限定出所述多个OLED发光器件的多个子像素区域并且暴露出多个分立的第一电极；
    在多个分立的第一电极上形成多个电致发光层；以及
    在所述像素限定层和所述多个电致发光层上形成所述第二电极层，所述第二电极层的多个第二镂空区域在所述衬底基板上的正投影处于所述像素限定层在所述衬底基板上的正投影的范围内。
  12. 根据权利要求11所述的制造方法，其中，在所述像素限定层和所述多个电致发光层上形成所述第二电极层包括：
    在所述像素限定层上对应于所述多个第二镂空区域的位置形成多个透明有机材料层；以及
    在所述像素限定层和所述多个电致发光层上形成第二电极材料层，以形成所述第二电极层，所述第二电极层包括多个第二镂空区域位置的多个透明有机材料层和所述多个第二镂空区域位置以外的第二电极材料。
  13. 根据权利要求10所述的制造方法，其中，
    在所述衬底基板上形成第一电极层包括形成具有多个第一镂空区域的第一电极层，使得所述多个透光孔、所述多个第二镂空区域、所述多个第一镂空区域和所述多个指纹感光传感器在所述衬底基板上的正投影至少部分重叠。
  14. 根据权利要求10至13中任一项所述的制造方法，其中，在所述封装层上形成彩膜层之后，所述制造方法还包括：
    在所述彩膜层上形成覆盖层。
  15. 根据权利要求12所述的制造方法，其中，所述第二电极材料为Mg、Al及其合金。
PCT/CN2021/101734 2020-06-23 2021-06-23 Oled显示面板及其制造方法 WO2021259308A1 (zh)

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