WO2021201227A1 - 樹脂、樹脂前駆体組成物、塗液組成物、電子写真感光体、電子写真感光体の製造方法、成形物および電子デバイス - Google Patents
樹脂、樹脂前駆体組成物、塗液組成物、電子写真感光体、電子写真感光体の製造方法、成形物および電子デバイス Download PDFInfo
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- WO2021201227A1 WO2021201227A1 PCT/JP2021/014163 JP2021014163W WO2021201227A1 WO 2021201227 A1 WO2021201227 A1 WO 2021201227A1 JP 2021014163 W JP2021014163 W JP 2021014163W WO 2021201227 A1 WO2021201227 A1 WO 2021201227A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
- C08G64/04—Aromatic polycarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
- C08G64/18—Block or graft polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G81/00—Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G5/00—Recording members for original recording by exposure, e.g. to light, to heat, to electrons; Manufacture thereof; Selection of materials therefor
- G03G5/14—Inert intermediate or cover layers for charge-receiving layers
- G03G5/147—Cover layers
Definitions
- the present invention relates to a resin, a resin precursor composition, a coating liquid composition, an electrophotographic photosensitive member, a method for producing an electrophotographic photosensitive member, a molded product, and an electronic device.
- Polycarbonate resin has been used as a material for molded products in various industrial fields because it has excellent mechanical, thermal, and electrical properties.
- polycarbonate resins have been widely used in the field of functional products that also utilize their optical properties.
- the required performance for polycarbonate resins has diversified, and not only conventional polycarbonate resins but also polycarbonate resins having various chemical structures have been proposed.
- An example of a functional product is an organic electrophotographic photosensitive member in which a polycarbonate resin is used as a binder resin for functional materials such as a charge generating material and a charge transporting material.
- the organic electrophotographic photosensitive member is required to have predetermined sensitivity, electrical characteristics, and optical characteristics depending on the electrophotographic process applied. Since the surface of the photosensitive layer of an electrophotographic photosensitive member is repeatedly subjected to operations such as corona charging, toner development, transfer to paper, and cleaning processing, an external electrical and mechanical force is applied each time these operations are performed. Is added.
- the photosensitive layer provided on the surface of the electrophotographic photosensitive member is required to have durability against these external forces.
- the organic electrophotographic photosensitive member is usually manufactured by a method of dissolving a binder resin in an organic solvent together with a functional material and casting a film on a conductive substrate or the like, the solubility and stability in the organic solvent are improved. Desired.
- a polycarbonate resin made from 2,2-bis (4-hydroxyphenyl) propane, 1,1-bis (4-hydroxyphenyl) cyclohexane, or the like has been used as a binder resin for a photoconductor, but it is durable. I was not fully satisfied with this point. As one of the measures for improving the durability, it is conceivable to improve the wear resistance of the photosensitive layer. As an effective technique for improving the wear resistance of the photosensitive layer, a technique for cross-linking polycarbonate is known.
- Patent Document 1 discloses a technique for cross-linking a polycarbonate resin having an allyl group by a cross-linking reaction using a radical initiator. According to Patent Document 1, the crosslinked polycarbonate resin has better mechanical strength (tensile strength, etc.) than the bisphenol A type polycarbonate resin.
- Patent Document 2 describes a crosslinked polycarbonate resin in which a polycarbonate resin having an epoxy group or the like is crosslinked by an ionic mechanism.
- Patent Document 3 describes a cross-linking technique in which a polycarbonate having a double bond and a compound having a plurality of silicon-hydrogen bonds are reacted in the presence of a platinum catalyst. Further, Patent Document 3 describes a cross-linking technique in which a polycarbonate having a double bond and a compound having an alkoxy group and a hydrogen on a silicon atom are reacted in the presence of a platinum catalyst, followed by hydrolysis and condensation reaction. Have been described.
- Patent Document 4 discloses a cross-linking technique in which a polycarbonate copolymer having an allyl group is irradiated with an electron beam while being heated to 120 ° C. or higher and 260 ° C. or lower.
- Patent Document 5 discloses a method of cross-linking a polycarbonate having an allyl group by heating without a catalyst using a triarylamine having a specific structure and a radical polymerizable compound having no triarylamine structure.
- Patent Document 6 describes a resin obtained by extending the chain length of a resin having an anthracene skeleton at the end of an aliphatic-aromatic polyester with bismaleimide.
- Patent Document 7 discloses a crosslinked resin obtained by reacting an aliphatic polyester having a furan structure, a polyamide, or a polyurea with a polyfunctional maleimide.
- Non-Patent Document 1 discloses a resin obtained by cross-linking a resin in which an anthracene dicarboxylic acid skeleton is introduced into a part of an aliphatic-aromatic polyester with a bifunctional maleimide compound.
- the charge transport material (Charge Transport Material, CTM) is altered by using the radical initiator, and the added initiator remains in the photoconductor, so that the photoconductor is used as a photoconductor. There was a risk that the residual potential would rise when used.
- Patent Document 2 a compound having a nucleophilic group such as an amino group or an acidic group such as an carboxylic anhydride group is used for the initiation reaction. Therefore, there is a problem that the CTM is denatured and the added compound remains in the photoconductor, so that the residual potential rises when used as the photoconductor. Further, Patent Document 2 does not have a description confirming that the disclosed resin is crosslinked, and it is unclear whether the disclosed effect of improving the physical properties is derived from the crosslinked structure.
- the polycarbonate described in Patent Document 4 has a problem that the CTM is denatured when irradiated with an electron beam and the residual potential rises when used as a photoconductor.
- Patent Document 5 uses a monomer having high radical polymerization activity and radically polymerizing only by heating without using an initiator or UV irradiation, and a technique for coexisting polycarbonate having an allyl group therein. Has been reported.
- the obtained composition does not have a dense three-dimensional network structure of the polymer, but a crosslinked polymer of the polycarbonate resin and the radical polymerization monomer exists separately, and only a part thereof is bonded to the composition. It is thought that there is.
- Patent Document 6 discloses a linear polymer obtained by a molecular weight extension reaction of an aliphatic-aromatic polyester by a Diels-Alder reaction as an example using a resin other than polycarbonate. ing.
- an object of the invention described in Patent Document 6 is to utilize the fact that the bonds formed by the Diels-Alder reaction cause a retro-Diels-Alder reaction that dissociates at a high temperature, and the melt viscosity is lowered by lowering the viscosity at a high temperature.
- Patent Document 6 does not describe or suggest that the technique described in Patent Document 6 is applied to aromatic polycarbonate or all aromatic polyester.
- Patent Document 7 describes an example in which an aliphatic polyester, a polyamide, or a polyurea is crosslinked by a Diels-Alder reaction.
- these examples are aimed at imparting solvent resistance by cross-linking a soft aliphatic resin and obtaining an elastomer applicable to a diaphragm seal or an adhesive intended for use.
- the technical idea of these examples is different from the idea of the present invention in which aromatic polycarbonate having high mechanical strength and all aromatic polyester are further increased in strength by cross-linking.
- Patent Document 7 does not describe or suggest that the technique described in Patent Document 7 is applied to aromatic polycarbonate or all aromatic polyester.
- Non-Patent Document 1 describes an example in which an anthracene dicarboxylic acid skeleton is introduced into polyethylene terephthalate (PET) and crosslinked with a bifunctional maleimide compound.
- PET polyethylene terephthalate
- the object of this example is similar to the object of the present invention in that the mechanical properties are improved by heat cross-linking, but Non-Patent Document 1 is an example in which the technique described in Non-Patent Document 1 is applied to polycarbonate or polyarylate.
- PET is used for an electrophotographic photosensitive member, it has low solubility in an organic solvent such as THF which is usually used as a coating solvent, and is compatible with a charge transporting substance such as triarylamine. It is bad and cannot be used for this purpose.
- the first object of the present invention is that it does not contain a radical initiator or a reaction catalyst that causes deterioration of electrical properties, and can be produced without using UV or an electron beam that alters a charge transporter (CTM). It is an object of the present invention to provide at least one resin of aromatic polycarbonate and polyarylate having a novel structure in which a polymer containing only a single component is substantially not contained when there are a plurality of polymerizable components.
- a second object of the present invention is to provide a resin precursor composition and a coating liquid composition, which have a characteristic that the reaction at the stage of the coating liquid composition is unlikely to occur and the characteristic change is small.
- a third object of the present invention is to provide an electrophotographic photosensitive member having good solvent resistance, excellent wear resistance, less mechanical deterioration, and no deterioration of residual potential by containing the resin. It is to provide a method of manufacturing an electrophotographic photosensitive member.
- At least one resin selected from the group consisting of aromatic polycarbonate and polyarylate said resin has a bond between polymer chains due to a reaction between an allyl group and a maleimide group.
- a resin characterized by having is provided.
- a resin precursor composition characterized in that the resin according to the above-mentioned one aspect of the present invention can be produced by a cross-linking reaction.
- a coating composition comprising the resin precursor composition according to the above-mentioned aspect of the present invention and an organic solvent.
- an electrophotographic photosensitive member characterized by containing the resin according to the above-mentioned aspect of the present invention in the outermost layer.
- the organic composition in the coating composition is formed by applying the coating composition according to the above aspect of the present invention to a conductive substrate by a wet molding method and heating. It is provided with a step of removing the solvent and a step of performing a cross-linking reaction of the resin precursor composition in the coating liquid composition by simultaneously or continuously heating the heating in the step of removing the organic solvent.
- a method for producing an electrophotographic photosensitive member is provided.
- a molded product containing the resin according to the above-mentioned aspect of the present invention there is provided a molded product containing the resin according to the above-mentioned aspect of the present invention.
- an electronic device characterized by containing the resin according to the above-mentioned aspect of the present invention.
- At least one of the aromatic polycarbonate and polyarylate resins does not contain a radical initiator or reaction catalyst that causes deterioration of electrical properties, and a charge transport material (CTM) is used.
- CTM charge transport material
- by containing the resin it is possible to provide an electrophotographic photosensitive member having excellent wear resistance, less likely to cause mechanical deterioration, and no deterioration of residual potential.
- the present inventors have conducted cross-linking precursor polycarbonate resins, polyarylate resins, and copolymer resins thereof having a structure capable of being crosslinked by the reaction of an allyl group and a maleimide group.
- the solution stability was excellent
- the obtained crosslinked resin was excellent in solvent resistance and abrasion resistance
- the electrical characteristics when used as an electrophotographic photosensitive member were good.
- the present invention has been completed based on such findings.
- the resin according to this embodiment is at least one resin selected from the group consisting of aromatic polycarbonate and polyarylate.
- Specific examples of the resin include aromatic polycarbonate, polyarylate, and aromatic polycarbonate-polyarylate copolymer (hereinafter, these are also simply referred to as “PCs”).
- PCs aromatic polycarbonate, polyarylate, and aromatic polycarbonate-polyarylate copolymer
- the resin according to this embodiment has a bond between polymer chains due to a reaction between an allyl group and a maleimide group.
- the resin according to the present embodiment is a polymer having at least one of allyl and maleimide having a structure capable of being crosslinked by a reaction between an allyl group and a maleimide group in the structure, and a cross-linking agent or a high compound having each partner's group. It can be obtained by a cross-linking reaction in combination with a molecule.
- the bond between the polymer chains in the resin according to the present embodiment can be formed by, for example, the following combination of reactions.
- (I) Reaction of a molecule having two or more allyl structures in a polymer chain with a compound having a bifunctional or higher maleimide group (ii) A polymer having two or more maleimide structures in a polymer chain, Reaction with a compound having a bifunctional or higher allyl group (iii) Reaction between a polymer having two or more allyl structures in a polymer chain and a polymer having two or more maleimide structures in a polymer chain (iv) ) Reaction of a polymer having both an allyl group and a maleimide group structure in one polymer chain, and the average number of the allyl group and the maleimide group per polymer chain is 1 or more, respectively.
- the bond between the polymer chains in the resin according to the present embodiment may be, for example, the reaction of (i-1) below.
- (I-1) Reaction of a polymer having two or more allyl groups in the main chain of a polymer chain with a compound having a bifunctional or more maleimide group
- the bond between the polymer chains in the resin according to the present embodiment may be, for example, at least one of the following reactions (iii-1) to (iii-8).
- (Iii-2) A polymer having two maleimide structures and having one maleimide structure at each end of the polymer chain, A polymer having more than two allyl structures in a polymer chain, having one allyl structure at both ends of the polymer chain and having one or more allyl structures in the main chain. Reaction with molecules
- (Iii-3) A polymer having two maleimide structures and having one maleimide structure at each end of the polymer chain, A polymer having more than two allyl structures in a polymer chain, having one allyl structure at one end of the polymer chain and not having the allyl structure at the other end. Reaction with a polymer having two or more of the allyl structures in the main chain
- (Iii-7) A polymer having two allyl structures and having one allyl structure at both ends of the polymer chain, A polymer having more than two maleimide structures in a polymer chain, having one maleimide structure at one end of the polymer chain, no maleimide structure at the other end, and a main chain. Reaction with a polymer having two or more maleimide structures inside
- the polymer used for bonding between polymer chains in the resin according to the present embodiment does not have at least two or more of an allyl structure and a maleimide structure at the end of the polymer chain.
- the allyl structure in a polymer having two or more allyl structures, is not bound to at least one end of one end and the other end of the polymer chain.
- the allyl structure may not be bound to the end of the polymer chain.
- the maleimide structure in a polymer having two or more maleimide structures, is not bound to at least one end of one end and the other end of the polymer chain.
- the maleimide structure may not be bound to the end of the polymer chain.
- the allyl structure in a polymer having two or more allyl structures, is bound to at least one end of one end and the other end of the polymer chain.
- the maleimide structure in a polymer having two or more maleimide structures, may not be bound to at least one end of one end and the other end of the polymer chain, and the height is high.
- the allyl structure and the maleimide structure may not be bonded to the end of the molecular chain.
- the polymer used for bonding between polymer chains in the resin according to the present embodiment preferably has at least one of an allyl structure and a maleimide structure in the main chain of the polymer chains.
- one or more allyl structures may be bonded to the main chain of the polymer chain, or the main chain of the polymer chain. All allyl structures may be attached to the chain.
- one or more maleimide structures may be bonded to the main chain of the polymer chain, or the main chain of the polymer chain. All maleimide structures may be attached to the chain.
- one or more allyl structures are bonded to the main chain of the polymer chain, and the polymer has two or more maleimide structures.
- one or more maleimide structures may be bonded to the main chain of the polymer chain.
- all allyl structures are bonded to the main chain of the polymer chain and the polymer has two or more maleimide structures.
- all maleimide structures may be bonded to the main chain of the polymer chain.
- the allyl structure or the maleimide structure may be directly bonded to the main chain of the polymer chain, or the polymer chain may be directly bonded to the main chain of the polymer chain via another group. It may be bound to the main chain.
- the polymer used for bonding between polymer chains in the resin according to the present embodiment does not have at least two or more allyl groups and maleimide groups at the ends of the polymer chains.
- examples of the polymer having both an allyl group and a maleimide group structure in one polymer chain include polymers having the following aspects.
- (Iv-1) A polymer to which an allyl group and a maleimide group are not bonded to at least one end of one end and the other end of the polymer chain
- (iv-2) At one end of the polymer chain Is to which one of the allyl group and the maleimide group is bonded, neither the allyl group nor the maleimide group is bonded to the other end of the polymer chain, and the other of the allyl group and the maleimide group is bonded to the main chain of the polymer chain.
- Polymer to which at least one is bound iv-3 A polymer to which an allyl group and a maleimide group are not bonded to the end of the polymer chain.
- the polymer used for bonding between polymer chains in the resin according to the present embodiment preferably has at least one of an allyl group and a maleimide group in the main chain of the polymer chain.
- any one of an allyl group and a maleimide group is in the main chain of the polymer chain.
- the above may be bonded, or all allyl groups and maleimide groups may be bonded to the main chain of the polymer chain.
- examples of the polymer having both an allyl group and a maleimide group structure in one polymer chain include polymers having the following aspects.
- (Iv-4) A polymer in which one maleimide group is bonded to both ends of the polymer chain and at least one allyl group is bonded to the main chain of the polymer chain.
- the allyl group or the maleimide group may be directly bonded to the main chain of the polymer chain, or the polymer chain may be bonded via another group. It may be bound to the main chain.
- the bonds between the polymer chains in the resin according to the present embodiment are not only the bonds between the ends of the polymer chains. That is, the bond between the polymer chains in the resin according to the present embodiment is one of the allyl group and the maleimide group bonded to the end of one polymer and the allyl bonded to the main chain of the other polymer.
- the bonds are not made only between the ends of the polymer chains, three-dimensional cross-linking between the polymer chains occurs, and the solvent resistance of the resin can be easily improved. Further, even if the ends of the polymer chains are not bonded to each other, the three-dimensional cross-linking does not occur in the case of the bonds between the polymer chains having two reactive groups, and the polymer becomes a linear polymer. Therefore, the bond between the polymer chains in the resin according to the present embodiment is limited to the polymers having two reaction points (reactive groups) in the polymer chains (for example, the polymers having a reactive group at the end). It is also preferable that the binding is not due to the reaction of.
- the bond between the polymer chains in the resin according to the present embodiment may include a bond between the ends of the polymer chains.
- the allyl group or allyl structure can be applied without particular limitation as long as it has a structure that causes a reaction with a maleimide group.
- a compound or resin having a diallyl bisphenol skeleton, allyl phenol, and eugenol can be mentioned.
- the allyl group or allyl structure preferably contains at least one of the structures represented by the following formulas (AL1), (AL2) and (AL3).
- the allyl structure represented by the following formula (AL1) has two allyl groups.
- R 11 to R 14 are independent of each other. Hydrogen atom, Halogen atom, Alkyl with 1 or more and 10 or less carbon atoms, Ring-forming Aryl having 6 or more carbon atoms and 12 or less carbon atoms, or alkyl fluoride having 1 or more carbon atoms and 10 or less carbon atoms. ) In the general formulas (AL1) to (AL3), * indicates a binding position.
- the maleimide group or the maleimide structure can be applied without particular limitation as long as it has a structure that causes a reaction with an allyl group, and the following are preferably used.
- the compound or resin having a maleimide group or a maleimide structure include 4,4'-diphenylmethanebismaleimide, m-phenylene bismaleimide, and bisphenol A diphenyl ether bismaleimide (2,2-bis [4- (4-maleimidephenoxy)).
- the maleimide group or the maleimide structure preferably contains a structure represented by the following general formula (MA1).
- X 2 is a single bond or a linking group with another skeleton.
- X 2 as the linking group contains at least one atom selected from the group consisting of a carbon atom, an oxygen atom, a nitrogen atom, a sulfur atom, a silicon atom, a phosphorus atom and a boron atom, and is an atom constituting the linking group. It is a group in which all the bonding modes of each other are covalent bonds.
- * indicates a bonding position.
- the compound or polymer having a plurality of maleimide groups or maleimide structures contains a plurality of structures represented by the general formula (MA1).
- the compound or polymer contains a plurality of structures represented by the general formula (MA1)
- the plurality of structures represented by the general formula (MA1) are the same as or different from each other, and a plurality of the general formulas are used.
- the structure represented by (MA1) is preferably bonded to each other by a single bond or linked via another group.
- the maleimide group or the maleimide structure is preferably contained in at least one of the structures represented by the following general formula (MA2) and general formula (MA3).
- X 2 in the general formula (MA2) and X 21 and X 22 in the general formula (MA3) are independently synonymous with X 2 in the general formula (MA1).
- Y 2 in the general formula (MA3) is a group containing an aromatic polycarbonate skeleton or a polyarylate skeleton.
- the maleimide group or the maleimide structure preferably contains a structure represented by the following general formula (MA4).
- MA4 a structure represented by the following general formula (MA4).
- * indicates a bonding position.
- the ratio of the allyl group or the allyl structure to the maleimide group and the maleimide structure can be appropriately set according to the target physical properties and the target application.
- the molar ratio of moles M AL allyl groups to moles M MA maleimide groups (M AL / M MA) is 0.01 or more, preferably 100 or less, 0.1 or more and 10 or less Is more preferable, and 0.2 or more and 5 or less is further preferable.
- M AL / M MA is 0.01 or more and 100 or less, cross-linking proceeds sufficiently, and solvent resistance and mechanical properties are likely to be improved.
- Examples of the bond between the polymer chains due to the reaction between the allyl group and the maleimide group of the resin according to the present embodiment include a bond having the following structure.
- X 1 is synonymous with X 1 in the general formula (AL1), and X 21 and X 22 are independently and X 2 in the general formula (MA1). are synonymous, Y 2 has the same meaning as Y 2 in the general formula (MA3), * represents a bonding position.
- X 21 and X 22 are independently synonymous with X 2 in the general formula (MA1), and Y 2 is the general formula (CL-AM33). It is synonymous with Y 2 in MA3), and * indicates the connection position.
- X 1 is synonymous with X 1 in the general formula (AL1), and in the general formulas (CL-AM14), (CL-AM24) and (CL-AM34). , * Indicates the connection position.
- the bond between the polymer chains may be a bond by an ene reaction between an allyl group and a maleimide group, or by a Diels-Alder reaction that occurs following an ene reaction between an allyl group and a maleimide group. It may be a combination.
- the resin according to the present embodiment may have only a bond by an ene reaction or a bond by a Diels-Alder reaction as a bond between polymer chains due to a reaction between an allyl group and a maleimide group. Alternatively, it may have both an Ene reaction and a Diels-Alder reaction.
- the resin according to this embodiment preferably contains at least one of the structures represented by the following general formulas (UN1) and general formula (UN2).
- Ar 3 , Ar 31 and Ar 32 are each independently represented by the following general formula (UN11).
- * indicates a bonding position.
- R 3 are each independently a hydrogen atom, Halogen atom, Alkyl with 1 or more and 10 or less carbon atoms, Ring-forming Aryl having 6 or more carbon atoms and 12 or less carbon atoms, or alkyl fluoride having 1 or more carbon atoms and 10 or less carbon atoms.
- R 31 to R 34 are independent of each other. Hydrogen atom, Halogen atom, Alkyl with 1 or more and 10 or less carbon atoms, Ring-forming Aryl having 6 or more carbon atoms and 12 or less carbon atoms, or alkyl fluoride having 1 or more carbon atoms and 10 or less carbon atoms. ) In the general formula (UN11), * indicates a bonding position.
- the halogen atoms represented by R 11 to R 14 in the general formula (AL1) and R 3 in the general formula (UN11) are independently examples of a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.
- the alkyl having 1 or more and 10 or less carbon atoms represented by R 11 to R 14 in the general formula (AL1) and R 3 in the general formula (UN11) is independently represented by, for example, methyl, ethyl, n-propyl, and the like.
- the aryls having 6 or more and 12 or less ring-forming carbon atoms represented by R 11 to R 14 in the general formula (AL1) and R 3 in the general formula (UN11) are independently, for example, phenyl, naphthyl, and. Examples include groups such as biphenyl.
- the alkyl fluorides having 1 or more and 10 or less carbon atoms represented by R 11 to R 14 in the general formula (AL1) and R 3 in the general formula (UN11) are independently, for example, the above-mentioned general formula (UN11).
- UN11) of R 3 has 1 or more carbon atoms indicated, the alkyl exemplified in 10 an alkyl include groups of the alkyl in which at least one hydrogen atom is substituted with a fluorine atom with a carbon atom.
- alkylenes having 2 or more carbon atoms and 20 or less carbon atoms represented by X 1 in the general formula (AL1) and X 3 in the general formula (UN11) are independently linear or branched alkylene groups. Examples thereof include groups such as ethylene, propylene, isopropylene, butylene, hexylene, octylene, and decylene.
- Alkylidene having 2 or more carbon atoms and 20 or less carbon atoms represented by X 1 in the general formula (AL1) and X 3 in the general formula (UN11) can be independently used, for example, ethylidene, propylidene, butylidene, hexylidene, octylidene, and the like. Examples include groups such as decylidene, pentadecylidene, and icosilidene.
- the cycloalkylenes having 3 or more carbon atoms and 20 or less carbon atoms represented by X 1 in the general formula (AL1) and X 3 in the general formula (UN11) are independently, for example, cyclopropylene, cyclobutylene, and cyclohexylene. , Cyclooctylene, cyclodecylene, cyclopentadecylene, and cycloicosilene and the like.
- Formula (AL1) X 1 and Formula (UN11) X 3 is 3 or more carbon atoms shown in the in, 20 following cycloalkylidene are each independently, for example, cyclopropylidene, cyclobutylidene, cyclohexanol Groups such as silidene, cyclooctylidene, cyclodecylidene, cyclopentadecylidene, cyclododecylidene, and cycloicosilidene can be mentioned.
- arylenes having 6 or more and 12 or less ring-forming carbon atoms represented by X 1 in the general formula (AL1) and the arylenes having 6 or more and 20 or less ring-forming carbon atoms represented by X 3 in the general formula (UN11) are each.
- groups such as phenylene, naphthylene, and biphenylene can be mentioned.
- Formula (AL1) X 1 is carbon number of 8 or more indicating in, 20 following alkylidene arylene alkylidene are each independently exemplified alkylidene and arylene described above can be cited a group formed by bonding in this order.
- Alkyriden Allyrene Alkyriden includes, for example, a group represented by the following formula (L1) or formula (L2).
- the bicycloalkanediyl having 4 or more and 20 or less ring-forming carbon atoms represented by X 1 in the general formula (AL1) and X 3 in the general formula (UN11) can be independently used, for example, two of the above-mentioned cycloalkylenes.
- the ring body is exemplified, and the tricycloalkanediyl having 5 or more and 20 or less ring-forming carbon atoms is independently exemplified by the above-mentioned cycloalkylene tricycle.
- groups such as an adamantandiyl group and a tricyclodecanediyl group can be mentioned.
- Formula (AL1) X 1 and Formula (UN11) X 3 represents ring carbon atoms of 4 or more in during 20 following bicycloalkyl cycloalkylidene each independently bicyclic body of the aforementioned cycloalkylidene is
- the tricycloalkylidene having 5 or more and 20 or less ring-forming carbon atoms is independently exemplified by the above-mentioned tricyclic body of cycloalkylidene.
- groups such as an adamantylidene group, a tricyclodecanilidene group, and a tricyclodecylidene group can be mentioned.
- halogen atoms represented by R 31 to R 34 of X 3 alkyl having 1 or more and 10 or less carbon atoms, aryl having 6 or more and 12 or less ring-forming carbon atoms, and 1 or more and 10 carbon atoms.
- alkyl having 1 or more and 10 or less carbon atoms aryl having 6 or more and 12 or less ring-forming carbon atoms, and 1 or more and 10 carbon atoms.
- the following fluorinated alkyl, the same groups as represented by R 3 in the general formula (UN11) are exemplified.
- the resin precursor composition according to the present embodiment can produce the above-mentioned resin according to the present embodiment by a cross-linking reaction. That is, the resin precursor composition according to the present embodiment contains a polymer having at least one of allyl and maleimide having a structure crosslinkable by a reaction between an allyl group and a maleimide group in the structure, and a group of each partner. Includes a cross-linking agent or polymer having. As a combination of groups capable of cross-linking, the "counterpart" when one is an allyl group is a maleimide group, and the "counterpart” when one is a maleimide group is an allyl group.
- the compound or polymer having an allyl group or an allyl structure the compound or polymer having a maleimide group or a maleimide structure, and the ratio of the allyl group to the maleimide group are described in the present embodiment. It is the same as the resin according to the form.
- the concentrations of the allyl group and the maleimide group in the resin precursor composition can be appropriately set according to the target physical properties and the target application, but the composition has at least one of the allyl group and the maleimide group.
- the functional group concentration is calculated by the smaller number of moles of the total number of allyl groups and the total number of maleimide groups with respect to the total amount of the functional groups, the functional group concentration is 0.01 mmol / It is preferably g or more and 10 mmol / g or less, more preferably 0.03 mmol / g or more and 7 mmol / g or less, further preferably 0.1 mmol / g or more and 5 mmol / g or less, and 0.
- the functional group concentration is 0.01 mmol / g or more, it is easy to obtain a crosslink density for improving solvent resistance and mechanical properties.
- the functional group concentration is 10 mmol / g or less, it is easy to prevent the crosslink density from becoming too high. If the cross-linking density becomes too high, the toughness of the cross-linked product is insufficient, unreacted functional groups are likely to remain, and the cross-linking reaction and other side reactions proceed over time, causing changes in the physical properties of the material and deterioration. There is a risk of cross-linking.
- the resin precursor composition according to the present embodiment preferably contains, for example, at least one of the following components (b1) to (b4).
- B1 A polymer having two or more allyl structures in the polymer chain and a compound having a bifunctional or higher maleimide group
- b2 A polymer having two or more maleimide structures in the polymer chain and a bifunctional or higher allyl Compound with group
- b3 Polymer having two or more allyl structures in the polymer chain and polymer having two or more maleimide structures in the polymer chain
- Allyl group and maleimide in one polymer chain A polymer having both structures of groups and having an average number of the allyl group and the maleimide group per polymer chain being 1 or more, respectively.
- the resin precursor composition according to the present embodiment contains, for example, the following component (b1-1).
- (B1-1) A polymer having two or more allyl groups in the main chain of the polymer chain and a compound having two or more functional maleimide groups.
- the resin precursor composition according to the present embodiment contains, for example, at least one of the following components (b3-1) to (b3-8).
- (B3-1) A polymer having two maleimide structures, one having one maleimide structure at each end of the polymer chain, and one having more than two allyl structures in the polymer chain.
- (B3-2) A polymer having two maleimide structures, a polymer having one maleimide structure at both ends of the polymer chain, and a polymer having more than two allyl structures in the polymer chain.
- (B3-3) A polymer having two maleimide structures, a polymer having one maleimide structure at both ends of the polymer chain, and a polymer having more than two allyl structures in the polymer chain.
- (B3-4) A polymer having two maleimide structures, a polymer having one maleimide structure at both ends of the polymer chain, and a polymer having no allyl structure at both ends of the polymer chain and in the main chain. Polymers with more than two allyl structures
- (B3-5) A polymer having two allyl structures, one having one allyl structure at each end of the polymer chain, and one having more than two maleimide structures in the polymer chain.
- (B3-6) A polymer having two allyl structures, one having one allyl structure at both ends of the polymer chain, and one having more than two maleimide structures in the polymer chain.
- (B3-7) A polymer having two allyl structures, one having one allyl structure at both ends of the polymer chain, and one having more than two maleimide structures in the polymer chain.
- (B3-8) A polymer having two allyl structures, one having one allyl structure at both ends of the polymer chain, and no maleimide structure at both ends of the polymer chain, and within the main chain. Polymers with more than two maleimide structures
- the polymer contained in the resin precursor composition according to the present embodiment does not have at least two or more of an allyl structure and a maleimide structure at the end of the polymer chain.
- a composition containing the component (b1) in a polymer having two or more allyl structures, at least one end of the polymer chain and at least one end of the other end have an allyl structure. May not be bound, and the allyl structure may not be bound to the end of the polymer chain.
- a composition containing the component (b2) in a polymer having two or more maleimide structures, at least one end of the polymer chain and at least one end of the other end have a maleimide structure. May not be bound, and the maleimide structure may not be bound to the end of the polymer chain.
- a composition containing the component (b3) in a polymer having two or more allyl structures, at least one end of the polymer chain and at least one end of the other end have an allyl structure.
- a polymer having two or more maleimide structures that are not bound to each other even if the maleimide structure is not bound to at least one end of one end and the other end of the polymer chain.
- the allyl structure and the maleimide structure may not be bonded to the end of the polymer chain.
- the polymer contained in the resin precursor composition according to the present embodiment preferably has at least one of an allyl structure and a maleimide structure in the main chain of the polymer chain.
- one or more allyl structures may be bonded to the main chain of the polymer chain, or All allyl structures may be bound to the main chain of the polymer chain.
- one or more maleimide structures may be bonded to the main chain of the polymer chain. All maleimide structures may be bound to the main chain of the polymer chain.
- a composition containing the component (b3) in a polymer having two or more allyl structures, one or more allyl structures are bonded to the main chain of the polymer chain, and two or more allyl structures are bonded.
- a polymer having a maleimide structure one or more maleimide structures may be bonded to the main chain of the polymer chain.
- all allyl structures are bonded to the main chain of the polymer chain, and two or more allyl structures are bonded.
- all the maleimide structures may be bonded to the main chain of the polymer chain.
- the allyl structure or the maleimide structure may be directly bonded to the main chain of the polymer chain, or the polymer chain may be directly bonded to the main chain of the polymer chain via another group. It may be bound to the main chain.
- the polymer contained in the resin precursor composition according to the present embodiment does not have at least two or more allyl groups and maleimide groups at the ends of the polymer chains.
- examples of the polymer having both an allyl group and a maleimide group structure in one polymer chain include polymers having the following aspects.
- (B4-1) A polymer in which an allyl group and a maleimide group are not bonded to at least one end of one end and the other end of the polymer chain (b4-2)
- At one end of the polymer chain Is to which one of the allyl group and the maleimide group is bonded, neither the allyl group nor the maleimide group is bonded to the other end of the polymer chain, and the other of the allyl group and the maleimide group is bonded to the main chain of the polymer chain.
- Polymer to which at least one is bound (b4-3) A polymer to which an allyl group and a maleimide group are not bonded to the end of the polymer chain.
- the polymer contained in the resin precursor composition according to the present embodiment preferably has at least one of an allyl group and a maleimide group in the main chain of the polymer chain.
- an allyl group and a maleimide group are in the main chain of the polymer chain. Any one or more of these may be bonded, or all allyl groups and maleimide groups may be bonded to the main chain of the polymer chain.
- examples of the polymer having both an allyl group and a maleimide group structure in one polymer chain include polymers having the following aspects.
- (B4-4) A polymer in which one maleimide group is bonded to both ends of the polymer chain and at least one allyl group is bonded to the main chain of the polymer chain.
- the allyl group or the maleimide group may be directly bonded to the main chain of the polymer chain, or the polymer chain may be bonded via another group. It may be bound to the main chain.
- the bonds between the polymer chains in the resin formed when the resin precursor composition according to the present embodiment is used are not only the bonds between the ends of the polymer chains. That is, the bonds between the polymer chains in the resin formed when the resin precursor composition according to the present embodiment is used are one of the allyl group and the maleimide group bonded to the end of one polymer.
- the bonds are not made only between the ends of the polymer chains, three-dimensional cross-linking between the polymer chains occurs, and the solvent resistance of the resin can be easily improved. Further, even if the ends of the polymer chains are not bonded to each other, the three-dimensional cross-linking does not occur in the case of the bonds between the polymer chains having two reactive groups, and the polymer becomes a linear polymer. Therefore, the bonds between the polymer chains in the resin formed when the resin precursor composition according to the present embodiment is used are such that the polymers having two reaction points (reactive groups) in the polymer chains (for example). , It is preferable that the bond is not formed by the reaction of only polymers having a reactive group at the terminal.
- the bond between the polymer chains in the resin formed when the resin precursor composition according to the present embodiment is used may include a bond between the ends of the polymer chains.
- the first form of the polycarbonate polymer (hereinafter, also referred to as PC polymer) according to the present embodiment is a PC polymer having a repeating unit A alone represented by the following general formula (1).
- PC polymer is a PC polymer having a repeating unit A represented by the following general formula (1) and a repeating unit B represented by the following general formula (2), and is represented by the following general formula (1A).
- It is obtained from at least one of a bischloroformate oligomer represented by the following general formula (2A) and a bischlorohomete oligomer represented by the following general formula (2C) as a raw material.
- Ar 33 is a group represented by the following general formula (AL11) in the general formula (AL1), and n 31 represents the average number of dimers. .. The average number of dimers n 31 is 1.0 or more and 10 or less.
- X 1 is synonymous with X 1 in the general formula (AL1), and * indicates a bonding position.
- Ar 34 is a group represented by the general formula (UN11), and n 32 represents the average number of dimers. The average number of dimers n 32 is 1.0 or more and 10 or less. * Indicates the bonding position.
- Ar 33 is a group represented by the general formula (AL11) in the general formula (AL1)
- Ar 34 is a group represented by the general formula (UN11). be.
- n 33 and n 34 represent the average number of dimers, respectively.
- the total of the average number of dimers n 33 and n 34 is 1.0 or more and 10 or less.
- Ar 33 and Ar 34 are different from each other.
- each repeating unit does not necessarily have to be continuous. Examples of the method for calculating the average number of dimers include the methods described in Examples described later.
- Such a PC polymer has a repeating unit A containing a group represented by the general formula (AL11) in the general formula (AL1) having at least two allyl groups, and thus has 2 in the polymer chain. It becomes a polymer having one or more allyl structures.
- the PC polymer having the unit B is preferably represented by the following general formula (100).
- a represents the molar copolymer weight ratio in the repeating unit A
- b represents the molar copolymer weight ratio in the repeating unit B.
- a is [Ar 33 ] / ([Ar 33 ] + [Ar 34 ])
- b is [Ar 34 ] / ([Ar 33 ] + [Ar 34 ])
- repeat [Ar 33] represents the number of moles of repeating unit A containing a group represented by Ar 33 in the PC polymer
- [Ar 34] may include a group represented by Ar 34 in the PC polymer Represents the number of moles of unit B.
- each repeating unit is not always continuous.
- the PC polymer represented by the general formula (100) may be any of block copolymers, alternating copolymers, random copolymers and the like.
- the second form of the PC polymer according to the present embodiment has any of the structures represented by the general formula (AL2) and the general formula (AL3) as the chain end of the PC polymer described above. ..
- the PC polymer represented by the general formula (100) does not have to contain Ar 33 , but in the case of the PC polymer containing no Ar 33 , the chain end is the general formula (AL2) and the general formula. It is necessary to include at least two of any of the structures represented by (AL3) on average per molecule.
- the PC polymer represented by the general formula (100) preferably contains Ar 33.
- the total number of allyl groups in the allyl group and the chain ends contained in the Ar 33 per molecule may be two or more.
- the chain end of the PC polymer according to the present embodiment is sealed with a monovalent aromatic group or a monovalent fluorine-containing aliphatic group within a range satisfying the requirements of the present application, in addition to the above-mentioned specific terminal group.
- the monovalent aromatic group may be a group containing an aliphatic group.
- the monovalent fluorine-containing aliphatic group may be a group containing an aromatic group. Further, at least one substituent selected from the group consisting of an alkyl group, a halogen atom, and an aryl group may be added to the monovalent aromatic group and the monovalent fluorine-containing aliphatic group.
- At least one substituent selected from the group consisting of an alkyl group, a halogen atom, and an aryl group may be further added to these substituents. Further, when there are a plurality of substituents, these substituents may be bonded to each other to form a ring.
- the monovalent aromatic group constituting the chain end preferably contains an aryl group having 6 to 12 ring-forming carbon atoms.
- Examples of such an aryl group include a phenyl group and a biphenyl group.
- Examples of the substituent added to the aromatic group and the substituent added to the alkyl group added to the aromatic group include halogen atoms such as a fluorine atom, a chlorine atom and a bromine atom.
- examples of the substituent added to the aromatic group include an alkyl group having 1 to 20 carbon atoms. This alkyl group may be a group to which a halogen atom is added as described above, or may be a group to which an aryl group is added.
- Examples of the monovalent fluorine-containing aliphatic group constituting the chain end include a monovalent group derived from a fluorine-containing alcohol.
- the fluorine-containing alcohol is preferably one in which a plurality of fluoroalkyl chains having 2 to 6 carbon atoms are linked to each other via an ether bond and the total number of fluorine atoms is 13 to 19.
- the total number of fluorine atoms is 13 or more, sufficient water repellency and oil repellency can be exhibited.
- the total number of fluorine atoms is 19 or less, the decrease in reactivity during polymerization can be suppressed, and at least one of the mechanical strength, surface hardness, heat resistance, etc. of the obtained PC polymer can be improved. ..
- the monovalent fluorine-containing aliphatic group a monovalent group derived from a fluorine-containing alcohol having two or more ether bonds is also preferable.
- a fluorine-containing alcohol By using such a fluorine-containing alcohol, the dispersibility of the PC polymer in the coating composition is improved, the abrasion resistance in the molded product or the electrophotographic photosensitive member is improved, and the surface lubricity and repellent after abrasion are improved. Can retain water and oil repellency.
- examples of the fluorine-containing alcohol include a fluorine-containing alcohol represented by the following general formula (30) or (31), a fluorine-containing alcohol such as 1,1,1,3,3,3-hexafluoro-2-propanol, and the like.
- a fluorine-containing alcohol via an ether bond represented by the following general formulas (32), (33), or (34) is also preferable.
- n1 is an integer of 1 to 12
- m1 is an integer of 1 to 12.
- n 31 is an integer of 1 to 10, preferably an integer of 5 to 8.
- n 32 is an integer from 0 to 5, preferably an integer from 0 to 3.
- n 33 is an integer from 1 to 5, preferably an integer from 1 to 3.
- n 34 is an integer of 1 to 5, preferably an integer of 1 to 3.
- n 35 is an integer from 0 to 5, preferably an integer from 0 to 3.
- R is CF 3 or F.
- the chain end of the PC polymer is a monovalent group derived from phenol represented by the following general formula (35) or the following general formula (36). ) Is preferably sealed with a monovalent group derived from the fluorine-containing alcohol.
- R 30 represents an alkyl group having 1 to 10 carbon atoms or a fluoroalkyl group having 1 to 10 carbon atoms
- p is an integer of 1 to 3.
- R f is a perfluoroalkyl group having 5 or more carbon atoms and 11 or more fluorine atoms, or a perfluoroalkyloxy group represented by the following general formula (37). show.
- R f2 is a linear or branched perfluoroalkyl group having 1 to 6 carbon atoms.
- mx is an integer from 1 to 3.
- the bischlorohomete oligomer compound represented by the general formula (1A) and the bischlorohomete oligomer represented by the general formula (2A) are used.
- Examples thereof include a production method in which at least one of the compounds, an organic solvent, an alkaline aqueous solution, and a monomer such as a bisphenol compound are used to mix an organic layer and an aqueous layer to carry out an interfacial polycondensation reaction.
- a monovalent carboxylic acid and its derivative, or a monovalent phenol can be used as the terminal encapsulant for producing the chain end.
- a fluorine-containing alcohol represented by the general formula (30) or (31), or 1,1,1,3,3,3-hexafluoro-2-propanol or the like As an end-capping agent that produces a chain end, a fluorine-containing alcohol represented by the general formula (30) or (31), or 1,1,1,3,3,3-hexafluoro-2-propanol or the like. A monovalent fluorine-containing alcohol is also preferably used. It is also preferable to use a fluorine-containing alcohol via an ether bond represented by the general formula (32), (33), or (34) as an end-capping agent for forming a chain end.
- the terminal encapsulant for forming the chain end is a monovalent phenol represented by the general formula (35) or the general formula (36) from the viewpoint of improving electrical characteristics and wear resistance. It is preferable to use the represented monovalent fluorine-containing alcohol.
- Examples of the monovalent phenol represented by the general formula (35) include p-tert-butyl-phenol, p-perfluorononylphenol, p-perfluorohexylphenol, p-tert-perfluorobutylphenol, and p-.
- Perfluorooctylphenol and the like are preferably used. That is, in the present embodiment, the chain end is a group consisting of p-tert-butyl-phenol, p-perfluorononylphenol, p-perfluorohexylphenol, p-tert-perfluorobutylphenol, and p-perfluorooctylphenol. It is preferably sealed with an end-capping agent selected from.
- Examples of the fluorine-containing alcohol via the ether bond represented by the general formula (36) include the following compounds. That is, it is preferable that the chain end of the present embodiment is sealed with an end sealant selected from any of the following fluorine-containing alcohols.
- the appropriate ratio of the end-capping agent is different depending on whether the cross-linking reactive functional group (allyl or maleimide group) is present at the terminal or the main chain or side chain.
- the concentration of the crosslinkable reactive group and the molecular weight change in conjunction with each other depending on the fraction at the end.
- the molar percentage of the copolymerization composition of the allyl or maleimide end group with respect to the total of the main chain and the terminal repeating unit is preferably 0.1 mol% or more and 33 mol% or less, more preferably 0.5 mol%. The above is 25 mol% or less.
- the addition ratio of the end sealant is 33 mol% or less, the decrease in mechanical strength can be suppressed, and when it is 0.1 mol% or more, the effect of improving the characteristics by cross-linking can be obtained.
- the molar percentage of the copolymerization composition of the chain end with respect to the total of the main chain and the repeating unit at the end is preferably 0.05 mol% or more and 30 mol% or less. More preferably, it is 0.1 mol% or more and 10 mol% or less.
- the addition ratio of the end sealant is 30 mol% or less, the decrease in mechanical strength can be suppressed, and when it is 0.05 mol% or more, the decrease in moldability can be suppressed.
- the branching agent that can be used in the method for producing a PC polymer according to the present embodiment is not particularly limited, but specific examples of the branching agent include fluoroglucin, pyrogallol, 4,6-dimethyl-2,4,6. -Tris (4-hydroxyphenyl) -2-heptene, 2,6-dimethyl-2,4,6-tris (4-hydroxyphenyl) -3-heptene, 2,4-dimethyl-2,4,6-tris (4-Hydroxyphenyl) heptane, 1,3,5-tris (2-hydroxyphenyl) benzene, 1,3,5-tris (4-hydroxyphenyl) benzene, 1,1,1-tris (4-hydroxyphenyl) ) Etan, Tris (4-hydroxyphenyl) phenylmethane, 2,2-bis [4,54-bis (4-hydroxyphenyl) cyclohexyl] propane, 2,4-bis [2-bis (4-hydroxyphenyl)- 2-propyl]
- the addition ratio of these branching agents is 30 mol% or less in terms of the molar percentage of the copolymerization composition of the repeating unit A, the repeating unit B, and the chain end, or the molar percentage of the copolymer composition of the repeating unit A and the chain end. It is preferably 5 mol% or less, and more preferably 5 mol% or less.
- the addition ratio of the branching agent is 30 mol% or less, the decrease in moldability can be suppressed.
- examples of the acid binder include alkali metal hydroxides such as sodium hydroxide, potassium hydroxide, lithium hydroxide and cesium hydroxide, and alkaline soils such as magnesium hydroxide and calcium hydroxide.
- alkali metal weak acid salts such as metal hydroxides, sodium carbonate, potassium carbonate and calcium acetate, alkaline earth metal weak acid salts, and organic bases such as pyridine.
- Preferred acid binders for interfacial polycondensation are alkali metal hydroxides such as sodium hydroxide, potassium hydroxide and calcium hydroxide, and alkaline earth metal hydroxides. In addition, these acid binders can also be used as a mixture.
- the ratio of the acid binder used may be appropriately adjusted in consideration of the stoichiometric ratio (equivalent) of the reaction. Specifically, 1 equivalent or an excess amount of the acid binder may be used per 1 mol of the total number of hydroxyl groups of the divalent phenol as the raw material, preferably 1 to 10 equivalents of the acid binder. good.
- the solvent used in the method for producing a PC polymer according to the present embodiment there is no problem as long as it shows a certain level of solubility in the obtained polymer.
- the solvent include aromatic hydrocarbons such as toluene and xylene, methylene chloride, chloroform, 1,1-dichloroethane, 1,2-dichloroethane, 1,1,1-trichloroethane, 1,1,2-trichloroethane, and the like.
- Halogenized hydrocarbons such as 1,1,1,2-tetrachloroethane, 1,1,2,2-tetrachloroethane, pentachloroethane and chlorobenzene, ketones such as cyclohexanone, acetone and acetophenone, tetrahydrofuran and 1,4-dioxane.
- Etc. such as ethers, are preferable.
- solvents may be used alone or in combination of two or more. Further, the interfacial polycondensation reaction may be carried out using two kinds of solvents which are immiscible with each other.
- the organic solvent used in the method for producing a PC polymer according to the present embodiment it is preferable to use an organic solvent that is substantially immiscible with water and can dissolve 5% by mass or more of the finally obtained polycarbonate polymer.
- the organic solvent is preferably an organic solvent that is substantially immiscible with water and can dissolve 5% by mass or more of the finally obtained polycarbonate polymer.
- the organic solvent "substantially immiscible with water” is composed of a uniform layer when water and the organic solvent are mixed in a composition range of 1: 9 to 9: 1 under normal temperature and pressure conditions. It is an organic solvent for which a solution (a solution in which neither a gelled substance nor an insoluble substance is found) cannot be obtained.
- the organic solvent "can dissolve 5% by mass or more of the finally obtained polycarbonate polymer” is the solubility of the polycarbonate polymer when measured under the conditions of a temperature of 20 to 30 ° C. and normal pressure.
- the "finally obtained polycarbonate polymer” is a polymer obtained through a polymerization step in the method for producing a polycarbonate polymer of the present embodiment.
- organic solvent include aromatic hydrocarbons such as toluene, ketones such as cyclohexanone, and halogenated hydrocarbons such as methylene chloride. Of these, methylene chloride is preferable because of its high solubility.
- the catalyst used in the method for producing the PC polymer of the present embodiment is not particularly limited, but for example, trimethylamine, triethylamine, tributylamine, N, N-dimethylcyclohexylamine, pyridine, N, N-diethylaniline, etc.
- Tertiary amines such as N, N-dimethylaniline, quaternary ammonium salts such as trimethylbenzylammonium chloride, triethylbenzylammonium chloride, tributylbenzylammonium chloride, trioctylmethylammonium chloride, tetrabutylammonium chloride, tetrabutylammonium bromide, Tetrabutylphosphonium chloride, tetrabutylphosphonium bromide and other quaternary phosphonium salts are suitable. Further, if necessary, a small amount of an antioxidant such as sodium sulfite or hydrosulfite salt may be added to the reaction system of the PC polymer of the present embodiment.
- an antioxidant such as sodium sulfite or hydrosulfite salt may be added to the reaction system of the PC polymer of the present embodiment.
- the coating liquid composition according to the present embodiment contains the resin precursor composition according to the present embodiment and an organic solvent.
- organic solvent consideration is given to the solubility of a material such as a resin precursor composition, the drying rate after molding, the effect of residual on the molded product, and the danger (fire or health hazard). However, it can be selected as appropriate.
- examples of the organic solvent according to the present embodiment include cyclic ethers (such as tetrahydrofuran (THF), dioxane, and dioxolane), cyclic ketones (such as cyclohexanone, cyclopentanone, and cycloheptanone), and aromatic hydrocarbons (toluene).
- ketones such as methyl ethyl ketone (MEK), and methyl isobutyl ketone (MIBK)
- halogenated hydrocarbons such as dichloromethane and chloroform
- esters ethyl acetate, isopropyl acetate, isobutyl acetate, etc.
- ethers such as ethylene glycol dimethyl ether and ethylene glycol monoethyl ether
- amides such as dimethyl fumarate (DMF), and dimethylacetamide (DMAc)
- aprotonic polar solvents dimethyl).
- the concentration of the resin precursor composition according to the present embodiment in the coating liquid composition according to the present embodiment may be any concentration as long as it has an appropriate viscosity according to the usage of the coating liquid composition. It is preferably 1% by mass or more and 40% by mass or less, more preferably 1% by mass or more and 35% by mass or less, and further preferably 5% by mass or more and 30% by mass or less. If it is 40% by mass or less, the viscosity does not become too high and the coatability is good. If it is 0.1% by mass or more, the viscosity can be maintained at an appropriate level, and a homogeneous film can be obtained. In addition, the drying time after coating is shortened, and the concentration is appropriate for easily achieving the target film thickness.
- the coating liquid composition may contain additives in addition to the resin precursor composition and the organic solvent according to the present embodiment.
- Additives include, for example, low molecular weight compounds, colorants (eg, dyes and pigments), functional compounds (eg, charge transport materials, electron transport materials, hole transport materials, and charge generators), fillings. Materials (eg, inorganic or organic fillers, fibers, and microparticles, etc.), antioxidants, UV absorbers, acid traps, and the like can be mentioned.
- the coating liquid composition may contain a resin other than the resin precursor composition according to the embodiment of the present invention. As these additives and other resins, known substances can be used as substances that can be blended with the resin precursor composition.
- the ratio of the resin precursor composition to the charge transporting substance in the coating liquid composition according to the present embodiment is from 20:80 to 80:20 in terms of mass ratio from the viewpoint of product performance. It is preferably in the range of 30:70 to 70:30, and more preferably in the range of 30:70 to 70:30.
- the resin precursor composition according to the present embodiment may be used alone or in combination of two or more.
- the coating liquid composition according to the present embodiment is usually preferably used for forming a photosensitive layer of a laminated electrophotographic photosensitive member.
- the photosensitive layer of the laminated electrophotographic photosensitive member preferably includes at least a charge generating layer and a charge transporting layer, and the coating liquid composition according to the present embodiment is preferably used for forming the charge transporting layer.
- the coating liquid composition according to the present embodiment can also be used for forming a protective layer of a photoconductor.
- the molded product according to the present embodiment contains the resin according to the present embodiment.
- the molded product according to this embodiment can be used for various purposes in addition to the use of the electrophotographic photosensitive member described later.
- it can be suitably used as a substrate such as an electronic device, an insulating layer, a protective layer, an adhesive layer, a conductive layer, and a structural material.
- the molded product according to the present embodiment can be produced by using the resin precursor composition according to the present embodiment.
- the resin precursor composition according to the present embodiment is used, either a wet molding method or a melt molding method can be applied as the molding method.
- a molded product is obtained by a wet molding method, (i) a method of molding at a temperature at which the cross-linking reaction proceeds, and (ii) a wet molded product is obtained at a temperature at which cross-linking does not substantially proceed, and then the solvent is removed.
- a method of raising the temperature to the temperature at which the reaction proceeds and cross-linking can be adopted. Any of these methods may be used.
- the above-mentioned coating liquid composition according to the present embodiment can be used.
- the cross-linking temperature can be appropriately set according to the target physical properties and the target application.
- the cross-linking method may be set by adjusting the type of cross-linking functional group, allyl / maleimide ratio, and functional group concentration according to the cross-linking temperature.
- the cross-linking temperature for an electrophotographic photosensitive member is usually preferably a wet-molded product obtained by wet molding and then cross-linked in a drying step, and the temperature is such that the functional low molecular weight compound does not deteriorate.
- the cross-linking temperature for the electrophotographic photosensitive member is preferably 60 ° C. or higher and 170 ° C. or lower, more preferably 80 ° C. or higher and 160 ° C. or lower, and further preferably 100 ° C. or higher and 150 ° C. or lower.
- the cross-linking temperature is 170 ° C. or lower, it is easy to suppress the alteration of functional low molecular weight compounds such as charge transporting substances.
- the cross-linking temperature is 60 ° C. or higher, the drying proceeds sufficiently, and the cross-linking is easy even if it is not dried for a long time.
- the crosslinking temperature for electronic devices is preferably 60 ° C. or higher and 250 ° C. or lower, and more preferably 100 ° C. or higher and 200 ° C. or lower.
- the cross-linking temperature is 250 ° C. or lower, failure of electronic components and decomposition of other organic materials can be prevented.
- the cross-linking temperature is 60 ° C. or higher, the cross-linking proceeds sufficiently.
- a material in which cross-linking proceeds at a low temperature such as less than 60 ° C. may have a problem in the stability of the coating liquid, for example, the viscosity increases due to the partial reaction progressing even in the coating liquid composition.
- the cross-linking of the resin precursor composition can be carried out without adding a catalyst, a polymerization initiator or the like.
- substances such as catalysts and polymerization initiators may be added for the purpose of combined use with other cross-linking systems as long as the effects of the present embodiment are not impaired.
- the electrophotographic photosensitive member according to the present embodiment preferably contains the resin according to the present embodiment in the outermost layer.
- the electrophotographic photosensitive member according to the present embodiment has a substrate and a photosensitive layer provided on the substrate, and the photosensitive layer contains a resin according to the present embodiment.
- the electrophotographic photosensitive member of the present embodiment may be any electrophotographic photosensitive member of various known general types as long as the resin according to the present embodiment is used in the photosensitive layer.
- the photosensitive layer is a laminated electrophotographic photosensitive member having at least one charge generating layer and at least one charge transporting layer, or a single layer electrophotographic photosensitive member having a charge generating substance and a charge transporting substance in one layer. It is preferably a body.
- the resin according to this embodiment may be used in any part of the photosensitive layer, but in order to fully exert the effect of this embodiment, it is used as a binder resin for a charge transfer substance in the charge transport layer. It is desirable to use it as a binder resin for a single photosensitive layer. Further, it is desirable to use it not only as a photosensitive layer but also as a surface protective layer. In the case of a multi-layer electrophotographic photosensitive member having two charge transport layers, it is preferable to use it for any one of the charge transport layers. In the electrophotographic photosensitive member of the present embodiment, the resin according to the present embodiment may be used alone or in combination of two or more. Further, if desired, a binder resin component such as other polycarbonate may be contained as long as the object of the present embodiment is not impaired. Further, an additive such as an antioxidant may be contained.
- the electrophotographic photosensitive member of this embodiment has a photosensitive layer on a conductive substrate.
- the charge transport layer may be laminated on the charge generation layer, or conversely, the charge generation layer may be laminated on the charge transport layer.
- it may be a photosensitive layer containing a charge generating substance and a charge transporting substance at the same time in one layer.
- a conductive or insulating protective film may be formed on the surface layer, if necessary.
- the conductive substrate material used for the electrophotographic photosensitive member of the present embodiment various materials such as known materials can be used, and specifically, aluminum, nickel, chromium, palladium, titanium, molybdenum, and indium. , Gold, platinum, silver, copper, zinc, brass, stainless steel, lead oxide, tin oxide, indium oxide, ITO (indium tin oxide: tin-doped indium oxide) or graphite, plates, drums, and sheets, vapor deposition, Glass, cloth, paper, and plastic films, sheets or seamless belts that have been conductively treated by coating by sputtering, coating, or the like, and metal drums that have been metal-oxidized by electrode oxidation or the like can be used.
- ITO indium tin oxide: tin-doped indium oxide
- the charge generation layer has at least a charge generation material.
- a layer of charge generation material is formed on the substrate which is the base thereof by vacuum deposition or sputtering method, or the charge generation material is bound on the substrate which is the base by using a binder resin. It can be obtained by forming a layer of resin.
- a method for forming the charge generation layer using the binder resin various methods such as a known method can be used. Usually, for example, a method in which a coating liquid composition in which a charge generating material is dispersed or dissolved with a binder resin in an appropriate solvent is applied onto a substrate as a predetermined base and dried to obtain a wet molded product is preferable.
- the charge generating material in the charge generating layer various known materials can be used. Specific compounds include selenium alone (eg, amorphous selenium and trigonal selenium, etc.), selenium alloys (eg, selenium-tellu, etc.), selenium compounds or selenium-containing compositions (eg, As 2 Se 3 and the like). ), Inorganic materials consisting of Group 12 and Group 16 elements of the periodic table (for example, zinc oxide and CdS-Se), oxide-based semiconductors (for example, titanium oxide), silicon-based materials (for example, amorphous silicon).
- Group 12 and Group 16 elements of the periodic table for example, zinc oxide and CdS-Se
- oxide-based semiconductors for example, titanium oxide
- silicon-based materials for example, amorphous silicon
- Metal-free phthalocyanine pigments eg, ⁇ -type metal-free phthalocyanine, and ⁇ -type metal-free phthalocyanine, etc.
- Metal phthalocyanine pigments eg, ⁇ -type copper phthalocyanine, ⁇ -type copper phthalocyanine, ⁇ -type copper phthalocyanine, ⁇ -type copper phthalocyanine
- X-type copper phthalocyanine A-type titanyl phthalocyanine, B-type titanyl phthalocyanine, C-type titanyl phthalocyanine, D-type titanyl phthalocyanine, E-type titanyl phthalocyanine, F-type titanyl phthalocyanine, G-type titanyl phthalocyanine, H-type titanyl phthalocyanine, K-type titanyl phthalocyanine , L-type titanyl phthalocyanine, M-type titanyl phthalocyanine, N-type titanyl phthalo
- These compounds can be used alone or in combination of two or more compounds as a charge generating substance.
- suitable charge generating substances include the charge generating substances specifically described in JP-A-11-172003.
- the charge transport layer can be obtained as a wet molded product by forming a layer formed by binding a charge transport substance with a binder resin on a substrate as a base.
- the binder resin for the charge generation layer and the charge transport layer is not particularly limited, and various known resins can be used. Specifically, for example, polystyrene, polyvinyl chloride, polyvinyl acetate, vinyl chloride-vinyl acetate copolymer, polyvinyl acetal, alkyd resin, acrylic resin, polyacrylonitrile, polycarbonate, polyurethane, epoxy resin, phenol resin, polyamide, etc.
- Polyketone polyacrylamide, butyral resin, polyester resin, vinylidene chloride-vinyl chloride copolymer, methacrylic resin, styrene-butadiene copolymer, vinylidene chloride-acrylonitrile copolymer, vinyl chloride-vinyl acetate-maleic anhydride copolymer , Silicon resin, Silicon alkyd resin, Phenol-formaldehyde resin, Styrene-Alkid resin, Melamine resin, Polyether resin, Benzoguanamine resin, Epoxy acrylate resin, Urethane acrylate resin, Poly-N-Vinylcarbazole, Polyvinyl butyral, Polyvinylformal, Polysulfone , Casein, gelatin, polyvinyl alcohol, ethyl cellulose, nitrocellulose, carboxy-methylcellulose, vinylidene chloride polymer latex, acrylonitrile-butadiene copolymer, vinyltoluene-
- the charge transport layer As a method for forming the charge transport layer, various known general formulas can be used, and a coating liquid composition in which the charge transport substance is dispersed or dissolved in an appropriate solvent together with the PC polymer of the present embodiment can be used. A method of applying the coating onto a substrate serving as a predetermined base and drying the mixture to obtain a wet molded product is preferable.
- the blending ratio of the charge transport substance used for forming the charge transport layer and the PC polymer is preferably in the range of 20:80 to 80:20, more preferably in the range of 30:70 to 70:30 in terms of mass ratio. be.
- the PC polymer of the present embodiment can be used alone or in combination of two or more. Further, it is also possible to use another binder resin in combination with the PC polymer of the present embodiment as long as the object of the present embodiment is not impaired.
- the thickness of the charge transport layer thus formed is usually about 5 ⁇ m or more and 100 ⁇ m or less, preferably 10 ⁇ m or more and 50 ⁇ m or less, and more preferably 15 ⁇ m or more and 40 ⁇ m or less. When this thickness is 5 ⁇ m or more, the initial potential does not decrease, and when it is 100 ⁇ m or less, deterioration of electrophotographic characteristics can be prevented.
- the charge transporting substance that can be used together with the PC polymer of the present embodiment various known compounds can be used.
- Examples of such compounds include carbazole compounds, indol compounds, imidazole compounds, oxazole compounds, pyrazole compounds, oxaziazole compounds, pyrazoline compounds, thiadiazol compounds, aniline compounds, hydrazone compounds, aromatic amine compounds and aliphatic amine compounds.
- Stilben compounds Fluorenone compounds, butadiene compounds, quinone compounds, quinodimethane compounds, thiazole compounds, triazole compounds, imidazolone compounds, imidazolidine compounds, bisimidazolidine compounds, oxazolone compounds, benzothiazole compounds, benzimidazole compounds, quinazoline compounds, benzofuran compounds , Aclysine compound, phenazine compound, poly-N-vinylcarbazole, polyvinylpyrene, polyvinylanthracene, polyvinylacridin, poly-9-vinylphenylanthracene, pyrene-formaldehyde resin, ethylcarbazole resin, or the main chain or side chain of these structures.
- the polymer contained in the above is preferably used. These compounds may be used alone or in combination of two or more. Among these charge-transporting substances, the compounds specifically exemplified in JP-A-11-172003 and the charge-transporting substances represented by the following structures are particularly preferably used.
- the resin precursor composition according to the present embodiment as a binder resin for at least one of the charge generation layer, the charge transport layer, and the surface protection layer. be.
- an undercoat layer as is normally used can be provided between the conductive substrate and the photosensitive layer.
- the undercoat layer includes, for example, fine particles (eg, titanium oxide, aluminum oxide, zirconia, titanic acid, zirconic acid, lanthanum lead, titanium black, silica, lead titanate, barium titanate, tin oxide, indium oxide, and the like. (Silicon oxide, etc.), polyamide resin, phenol resin, casein, melamine resin, benzoguanamine resin, polyurethane resin, epoxy resin, cellulose, nitrocellulose, polyvinyl alcohol, polyvinyl butyral resin, and other components can be used.
- the binder resin may be used, or the resin precursor composition according to the present embodiment may be used.
- These fine particles and resin can be used alone or in admixture. When used as a mixture of these, it is preferable to use the inorganic fine particles and the resin in combination because a film having good smoothness is formed.
- the thickness of the undercoat layer is 0.01 ⁇ m or more and 10 ⁇ m or less, preferably 0.1 ⁇ m or more and 7 ⁇ m or less. When this thickness is 0.01 ⁇ m or more, the undercoat layer can be uniformly formed, and when it is 10 ⁇ m or less, deterioration of electrophotographic characteristics can be suppressed.
- a known blocking layer that is usually used can be provided between the conductive substrate and the photosensitive layer.
- a resin of the same type as the binder resin can be used. Moreover, you may use the resin precursor composition which concerns on this embodiment.
- the thickness of this blocking layer is 0.01 ⁇ m or more and 20 ⁇ m or less, preferably 0.1 ⁇ m or more and 10 ⁇ m or less. When this thickness is 0.01 ⁇ m or more, the blocking layer can be uniformly formed, and when it is 20 ⁇ m or less, deterioration of electrophotographic characteristics can be suppressed.
- a protective layer may be laminated on the photosensitive layer.
- a resin of the same type as the binder resin can be used for this protective layer. Further, it is particularly preferable to use the resin precursor composition according to the present embodiment.
- the thickness of this protective layer is 0.01 ⁇ m or more and 20 ⁇ m or less, preferably 0.1 ⁇ m or more and 10 ⁇ m or less.
- the protective layer contains the charge generating substance, the charge transporting substance, the additive, the metal and its oxide, the nitride, or a conductive material such as a salt, an alloy, carbon black, and an organic conductive compound. May be.
- the charge generating layer and the charge transporting layer are provided with a binder, a plasticizer, a curing catalyst, a fluidity imparting agent, and pinholes as long as the effects of the present invention are not lost.
- a control agent, a spectrosensitive sensitizer (infectious agent), and the like may be added.
- various chemical substances, antioxidants, surfactants, curl inhibitors, leveling agents, etc. are added for the purpose of preventing an increase in residual potential, a decrease in charge potential, and a decrease in sensitivity with repeated use. Agents can be added.
- binder examples include silicone resin, polyamide resin, polyurethane resin, polyester resin, epoxy resin, polyketone resin, polycarbonate copolymer, polystyrene resin, polymethacrylate resin, polyacrylamide resin, polybutadiene resin, polyisoprene resin, and melamine.
- thermosetting resin and a photocurable resin
- the resin is electrically insulating and can form a film in a normal state, and is not particularly limited as long as it does not impair the effects of the present embodiment.
- plasticizer examples include biphenyl, biphenyl chloride, o-terphenyl, halogenated paraffin, dimethylnaphthalene, dimethylphthalate, dibutylphthalate, dioctylphthalate, diethyleneglycolphthalate, triphenylphosphate, diisobutyladipate, and dimethylseva.
- plasticizer examples include cate, dibutylsevacate, butyl laurate, methylphthalyl ethylglycolate, dimethylglycolphthalate, methylnaphthalene, benzophenone, polypropylene, polystyrene, and fluorohydrocarbons.
- the curing catalyst include methanesulfonic acid, dodecylbenzenesulfonic acid, dinonylnaphthalenedisulfonic acid, and the like
- examples of the fluidity-imparting agent include modaflow and acronal 4F
- examples of the pinhole control agent include benzoin and dimethylphthalate.
- a triphenylmethane dye for example, methyl violet, crystal violet, night blue, and Victoria blue
- an acridin dye for example, erythrosin.
- Thiadine Dyes eg, Methylene Blue, and Methylene Green, etc.
- Oxazine Dyes Capri Blue, and Meldra Blue, etc.
- Cyanine Dyes, Melosinine Dyes, Styryl Dyes, Pyrylium salt dyes, thiopyrilium salt dyes and the like are suitable.
- An electron-accepting substance can be added to the photosensitive layer for the purpose of improving sensitivity, reducing residual potential, reducing fatigue during repeated use, etc., as long as the effects of the present invention are not lost.
- Specific examples thereof include succinic anhydride, maleic anhydride, dibromomaleic anhydride, phthalic anhydride, tetrachlorophthalic anhydride, tetrabromophthalic anhydride, 3-nitrohydride phthalic acid, and 4-nitrohydride phthalic acid.
- These compounds may be added to either the charge generating layer or the charge transporting layer, and the blending ratio thereof is based on the case where the amount of the charge generating substance or the charge transporting substance is 100 parts by mass within a range that does not lose the effect of the present invention. It is 0.01 part by mass or more and 200 parts by mass or less, preferably 0.1 parts by mass or more and 50 parts by mass or less.
- ethylene tetrafluoride resin ethylene trifluoride resin, ethylene tetrafluoride propylene hexafluoride resin, vinyl fluoride resin, vinylidene fluoride resin, ethylene difluoride dichloride resin and These copolymers, fluorine-based graft polymers, and the like may be used as long as the effects of the present invention are not lost.
- the blending ratio of these surface modifiers is 0.1% by mass or more and 60% by mass or less, preferably 5% by mass or more and 40% by mass or less, with respect to the binder resin as long as the effects of the present invention are not lost. If the blending ratio is 0.1% by mass or more, surface modification such as surface durability and reduction in surface energy is sufficient, and if it is 60% by mass or less, the electrophotographic characteristics are not deteriorated.
- antioxidant for example, a hindered phenol-based antioxidant, an aromatic amine-based antioxidant, a hindered amine-based antioxidant, a sulfide-based antioxidant, an organic phosphoric acid-based antioxidant, and the like are preferable.
- the blending ratio of these antioxidants is usually 0.01% by mass or more and 10% by mass or less, preferably 0.1% by mass or more and 2% by mass, based on the charge transporting substance, as long as the effects of the present invention are not lost. It is as follows.
- the compounds of the general chemical formulas [Chemical 94] to [Chemical 101] described in the specification of JP-A-11-172003 are suitable. These antioxidants may be used alone or in admixture of two or more, and these may be added to the photosensitive layer, the surface protective layer, the undercoat layer, and the blocking layer. You may.
- the solvent used in forming at least one of the charge generation layer and the charge transport layer include, for example, aromatic solvents (for example, benzene, toluene, xylene, and chloroform), ketones (for example, for example, chlorobenzene, etc.).
- aromatic solvents for example, benzene, toluene, xylene, and chloroform
- ketones for example, for example, chlorobenzene, etc.
- alcohols eg, methanol, ethanol, and isopropanol, etc
- the photosensitive layer of the single-layer electrophotographic photosensitive member is easily formed by applying the resin precursor composition according to the present embodiment as a binder resin using the above-mentioned charge generating substance, charge transporting substance, and additive. be able to. Further, as the charge transporting substance, it is preferable to add at least one of the above-mentioned hole transporting substance and electron transporting substance.
- the electron-transporting substance the electron-transporting substance exemplified in JP-A-2005-139339 can be preferably applied.
- each layer can be performed using various coating devices such as known devices, specifically, for example, an applicator, a spray coater, a bar coater, a tip coater, a roll coater, a dip coater, and a doctor blade. Can be done.
- the thickness of the photosensitive layer in the electrophotographic photosensitive member is 5 ⁇ m or more and 100 ⁇ m or less, preferably 8 ⁇ m or more and 50 ⁇ m or less. When this is 5 ⁇ m or more, it is possible to prevent the initial potential from being lowered, and when it is 100 ⁇ m or less, the electron It is possible to suppress deterioration of photographic characteristics.
- the charge-generating substance: binder resin ratio used in the production of the electrophotographic photosensitive member is in the range of 1:99 to 30:70, preferably in the range of 3:97 to 15:85, in terms of mass ratio.
- the ratio of the charge transporting substance to the binder resin is in the range of 20:80 to 80:20, preferably in the range of 30:70 to 70:30 in terms of mass ratio.
- the electrophotographic photosensitive member Since the electrophotographic photosensitive member thus obtained has a crosslinked resin composed of the resin precursor composition object according to the present embodiment as a binder resin in the photosensitive layer, it has solvent resistance and durability (wear resistance). ), And also has excellent electrical characteristics (electrophotographic characteristics), and is a photoconductor that maintains excellent electrophotographic characteristics for a long period of time.
- the electrophotographic photosensitive member includes various electronic devices such as copiers (monochrome, multicolor, full color, analog, digital), printers (laser, LED, liquid crystal shutter), facsimiles, plate making machines, and devices having these multiple functions. It is preferably used in the photographic field.
- the method for producing an electrophotographic photosensitive member according to the present embodiment is a step of applying the coating liquid composition according to the present embodiment to a conductive substrate by a wet molding method, and heating the coating liquid composition in the coating liquid composition.
- the process comprises a step of removing the organic solvent and a step of performing a cross-linking reaction of the resin precursor composition in the coating liquid composition by simultaneously or continuously heating the heating in the step of removing the organic solvent.
- the coating thickness of the coating liquid composition can be appropriately set according to the thickness of the photosensitive layer of the electrophotographic photosensitive member according to the present embodiment.
- the step of removing the organic solvent it can be appropriately set according to the type of the organic solvent in the coating liquid composition according to the present embodiment.
- the heating temperature is the same as the cross-linking temperature for the electrophotographic photosensitive member in the molded product according to the present embodiment.
- the electronic device according to the present embodiment preferably contains the resin according to the present embodiment. Further, it is also preferable that the electronic device according to the present embodiment includes a molded product according to the present embodiment.
- methylene chloride was distilled off until it reached a predetermined concentration.
- 210 mL of pure water, 1.2 g of concentrated hydrochloric acid, and 450 mg of hydrosulfite were added and washed.
- washing with 210 mL of pure water was repeated 5 times to obtain a methylene chloride solution of a bisphenol Z oligomer having a chlorohomate group at the molecular terminal.
- the chlorohomate concentration of the obtained solution was 1.12 mol / L
- the solid matter concentration was 0.225 kg / L
- the average number of dimers was 1.03.
- the obtained raw material is referred to as Z-CF.
- M1 is calculated by the following formula.
- M1 (268 ⁇ (366 ⁇ (366 + 108)) + 214 ⁇ (108 ⁇ (366 + 108)) +124.9 "124.9" in the calculation formula of M1 is a molecular weight increment when two hydrogen atoms of the monomer used are eliminated and two carbon atoms, two oxygen atoms, and two chlorine atoms are increased.
- Ar X1 is a divalent group.
- the divalent group represented by the following general formula (10) corresponds to Ar X1.
- Ar 33 corresponds to Ar X1 and n 31 corresponds to n X.
- Ar 34 corresponds to Ar X1 and n 32 corresponds to n X.
- a solution prepared by dissolving 93.8 g (929 mmol) of triethylamine in 256 mL of methylene chloride was added dropwise in a temperature range of 16 ° C to 19 ° C. Next, after stirring for 140 minutes, methylene chloride was distilled off until it reached a predetermined concentration. To the residual liquid, 1100 mL of pure water, 2.4 g of concentrated hydrochloric acid, and 450 mg of hydrosulfite were added and washed.
- PC-1 having the following structure.
- PC polymer (PC-1) (Specification of PC polymer)
- PC-1 The PC polymer (PC-1) thus obtained was dissolved in methylene chloride to prepare a solution having a concentration of 0.5 g / dL, and the reduced viscosity [ ⁇ sp / C] at 20 ° C. was measured. It was 1.10 dL / g.
- the structure and composition of the obtained PC polymer (PC-1) were analyzed by 1 H-NMR spectrum, it was confirmed that the PC polymer consisted of the following repeating units, the number of repeating units, and the composition. rice field.
- the reduced viscosity was measured with a Ubberode improved viscometer (RM type) for automatic viscosity using an automatic viscosity measuring device VMR-042 manufactured by Rigosha.
- RM type Ubberode improved viscometer
- the 1 H-NMR spectrum was measured by a nuclear magnetic resonance apparatus JNM-ECZ400S manufactured by JEOL Ltd. 1
- the measurement conditions of the 1 H-NMR spectrum are as follows.
- diallyl bis A is an abbreviation for a repeating unit derived from 2,2-bis (3-allyl-4-hydroxyphenyl) propane
- “BisZ” is a repeating unit derived from bisphenol Z. Abbreviation for unit.
- the allyl group concentration in the PC polymer (PC-1) was 1.05 mmol / g.
- a 3,3'-dimethyl-4,4'-dihydroxybiphenyl solution prepared in this solution (solution preparation method: 60 mL of a 2.5 mol / L potassium carbonate aqueous solution) (20.9 g of potassium carbonate) was prepared, cooled to room temperature or lower, and then 0.1 g of hydrosulfite and 7.3 g of 3,3'-dimethyl-4,4'-dihydroxybiphenyl were added as antioxidants. The whole amount was added, 2.7 mL of an aqueous triethylamine solution (7 vol%) was added while stirring, and stirring was continued for 3 hours.
- PC polymer (Specification of PC polymer)
- PC-2 The PC polymer (PC-2) was dissolved in methylene chloride to prepare a solution having a concentration of 0.5 g / dL, and the reduced viscosity [ ⁇ sp / C] at 20 ° C. was measured and found to be 0.23 dL / g. rice field.
- PC-2 the structure and composition of the obtained PC polymer (PC-2) were analyzed by 1 H-NMR spectrum, it was confirmed that the PC polymer consisted of the following repeating units, the number of repeating units, and the composition.
- OCBP is an abbreviation for a repeating unit derived from 3,3'-dimethyl-4,4'-dihydroxybiphenyl
- BisZ is an abbreviation for a repeating unit derived from bisphenol Z.
- Male1 is an abbreviation for a unit derived from N- (4-hydroxyphenyl) maleimide.
- the maleimide group concentration in the PC polymer (PC-2) was 0.39 mmol / g.
- Example 1 ⁇ Preparation of coating liquid consisting of polycarbonate having an allyl group and polycarbonate having a maleimide group, and preparation of a crosslinked resin film> 1.05 g of PC polymer (PC-1) and 0.45 g of 2,2-bis [4- (4-maleimidephenoxy) phenyl] propane represented by the following formula (MA4-2) with a screw cap. It was weighed in a sample tube and dissolved in 10 mL of THF to prepare a THF solution. Using an applicator with a gap of 200 ⁇ m, a cast film was formed on a polyimide film having a thickness of 50 ⁇ m.
- the cast film After the cast film was formed, it was air-dried for 1 hour, and further heat-treated at 50 ° C. for 16 hours in a vacuum dryer to remove the solvent.
- the film obtained after the heat treatment for 16 hours was crosslinked by heating in a vacuum dryer at a pressure reduction degree of 1 Pa or more and 100 Pa or less at 200 ° C. for 3 hours.
- 2,2-Bis [4- (4-maleimidephenoxy) phenyl] propane may be abbreviated as MI-BizA.
- Comparative Example 1 The evaluation film according to Comparative Example 1 for use in the abrasion test did not use 2,2-bis [4- (4-maleimidephenoxy) phenyl] propane in Example 1, and used 1. It was produced in the same manner as in Example 1 except that it was changed to 5 g.
- the evaluation criteria are as follows. A: Insoluble (no swelling or slight swelling, and the film shape was maintained) B: Swelling (The insoluble matter is a lump, but the film shape was not maintained due to solvent swelling.) C: Shredded (There was a shredded insoluble matter, but most of it was dissolved.) D: Dissolved (insoluble content could not be visually confirmed)
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Abstract
Description
この有機電子写真感光体には、適用される電子写真プロセスに応じて、所定の感度、電気特性、および光学特性を備えていることが要求される。電子写真感光体は、その感光層の表面に、コロナ帯電、トナー現像、紙への転写、およびクリーニング処理などの操作が繰返し行われるため、これら操作を行う度に電気的および機械的な外力が加えられる。したがって、長期間にわたって電子写真の画質を維持するためには、電子写真感光体の表面に設けた感光層に、これら外力に対する耐久性が要求される。また、有機電子写真感光体は、通常、機能性材料と共にバインダー樹脂を有機溶剤に溶解し、導電性基板等にキャスト製膜する方法で製造されるため、有機溶剤への溶解性および安定性が求められる。
また、特許文献3には、二重結合を有するポリカーボネートとケイ素原子上にアルコキシ基および水素を有する化合物とを白金触媒存在下に反応させ、その後に加水分解と縮合反応を行うことによる架橋技術が記載されている。
このような例として、特許文献5には、ラジカル重合活性が高く、開始剤の使用やUVの照射なく加熱するだけでラジカル重合するモノマーを使用し、そこにアリル基を持つポリカーボネートを共存させる技術が報告されている。しかしながら、開始剤や光照射がなくてもラジカル重合するモノマーを使用していることから当該重合性モノマー単独の重合物が主に生成し、相対的にラジカル重合活性が低いアリル基を持つポリカーボネートと当該重合性モノマーの反応確率は低いと考えられる。そのため、得られた組成物はポリマーの緻密な3次元網目構造を持つのではなく、ポリカーボネート樹脂とラジカル重合モノマーの架橋重合物が別々に存在し、その一部分のみが結合された組成物になっていると考えられる。そして、通常、低分子として存在する電荷輸送物質が高分子量化することによる物性向上の効果が支配的で、ポリカーボネート部分が架橋されることによる物性向上は不十分なものであった。また、開始剤がなくてもラジカル重合が進行する高活性な化合物を使用しているため、塗液組成物の段階で重合が進行することを抑制するのが困難であり、塗液保管中の粘度の上昇や、ゲル化などの問題があった。
本実施形態に係る樹脂は、芳香族ポリカーボネートおよびポリアリレートからなる群から選択される少なくとも1つの樹脂である。具体的な樹脂としては、芳香族ポリカーボネート、ポリアリレート、および芳香族ポリカーボネート-ポリアリレート共重合体(以下、これらを単に「PC類」ともいう)が挙げられる。
以下に、本発明の一実施形態に係るPC類、このPC類を用いた塗液組成物、電子写真感光体および電子デバイスについて詳細に説明する。
本実施形態に係る樹脂は、アリル基とマレイミド基との反応により架橋可能な構造を有するアリルおよびマレイミドの少なくとも1つを構造中に有する高分子と、それぞれの相手方の基を持つ架橋剤または高分子との組合せで架橋反応させて得ることができる。
(i)高分子鎖に2つ以上のアリル構造を有する高分子と、2官能以上のマレイミド基を有する化合物との反応
(ii)高分子鎖に2つ以上のマレイミド構造を有する高分子と、2官能以上のアリル基を有する化合物との反応
(iii)高分子鎖に2つ以上のアリル構造を有する高分子と、高分子鎖に2つ以上のマレイミド構造を有する高分子との反応
(iv)一本の高分子鎖にアリル基およびマレイミド基の双方の構造を持ち、高分子鎖一本当たりの前記アリル基および前記マレイミド基の平均個数がそれぞれ1以上である高分子の反応
(i-1)
高分子鎖の主鎖に2つ以上のアリル基を有する高分子と、2官能以上のマレイミド基を有する化合物との反応
2つのマレイミド構造を有する高分子であって、高分子鎖の両末端に当該マレイミド構造を1つずつ有する高分子と、
高分子鎖に2つを超えるアリル構造を有する高分子と、の反応
2つのマレイミド構造を有する高分子であって、高分子鎖の両末端に当該マレイミド構造を1つずつ有する高分子と、
高分子鎖に2つを超えるアリル構造を有する高分子であって、当該高分子鎖の両末端に当該アリル構造を1つずつ有し、かつ主鎖内にも当該アリル構造を1以上有する高分子と、の反応
2つのマレイミド構造を有する高分子であって、高分子鎖の両末端に当該マレイミド構造を1つずつ有する高分子と、
高分子鎖に2つを超えるアリル構造を有する高分子であって、当該高分子鎖の一方の末端に当該アリル構造を1つ有し、他方の末端には当該アリル構造を有さず、かつ主鎖内に当該アリル構造を2つ以上有する高分子と、の反応
2つのマレイミド構造を有する高分子であって、高分子鎖の両末端に当該マレイミド構造を1つずつ有する高分子と、
高分子鎖の両末端にはアリル構造を有さず、かつ主鎖内に2つを超えるアリル構造を有する高分子と、の反応
2つのアリル構造を有する高分子であって、高分子鎖の両末端に当該アリル構造を1つずつ有する高分子と、
高分子鎖に2つを超えるマレイミド構造を有する高分子との反応
2つのアリル構造を有する高分子であって、高分子鎖の両末端に当該アリル構造を1つずつ有する高分子と、
高分子鎖に2つを超えるマレイミド構造を有する高分子であって、当該高分子鎖の両末端にマレイミド構造を1つずつ有し、かつ主鎖内にもマレイミド構造を1つ以上有する高分子と、の反応
2つのアリル構造を有する高分子であって、高分子鎖の両末端に当該アリル構造を1つずつ有する高分子と、
高分子鎖に2つを超えるマレイミド構造を有する高分子であって、当該高分子鎖の一方の末端にマレイミド構造を1つ有し、他方の末端にはマレイミド構造を有さず、かつ主鎖内にマレイミド構造を2つ以上有する高分子と、の反応
2つのアリル構造を有する高分子であって、高分子鎖の両末端に当該アリル構造を1つずつ有する高分子と、
高分子鎖の両末端にはマレイミド構造を有さず、かつ主鎖内に2つを超えるマレイミド構造を有する高分子と、の反応
また、例えば、前記(iii)の反応の場合、2つ以上のアリル構造を有する高分子において、高分子鎖の主鎖に全てのアリル構造が結合し、かつ、2つ以上のマレイミド構造を有する高分子において、高分子鎖の主鎖に全てのマレイミド構造が結合していてもよい。
(iv-1)高分子鎖の一方の末端及び他方の末端の少なくともいずれかの末端には、アリル基およびマレイミド基が結合していない高分子
(iv-2)高分子鎖の一方の末端には、アリル基およびマレイミド基の一方が結合し、高分子鎖の他方の末端には、アリル基およびマレイミド基のいずれも結合せず、高分子鎖の主鎖にアリル基およびマレイミド基の他方が少なくとも1つ結合する高分子
(iv-3)高分子鎖の末端にはアリル基およびマレイミド基が結合していない高分子
(iv-4)高分子鎖の両末端にマレイミド基が1つずつ結合し、かつ高分子鎖の主鎖にアリル基が少なくとも1つ結合する高分子
すなわち、本実施形態に係る樹脂における高分子鎖間の結合は、一方の高分子の末端に結合しているアリル基およびマレイミド基の一方と、他方の高分子の主鎖に結合しているアリル基およびマレイミド基の他方との結合であるか、及び一方の高分子の主鎖に結合しているアリル基およびマレイミド基の一方と、他方の高分子の主鎖に結合しているアリル基およびマレイミド基の他方との結合の少なくともいずれかを持つことも好ましい。
また、高分子鎖の末端同士の結合でなくても、反応性基を2つ持つ高分子鎖同士の結合の場合も、同様に3次元架橋は起こらず、直鎖状の高分子になる。そのため、本実施形態に係る樹脂における高分子鎖間の結合は、高分子鎖に2つの反応点(反応性基)を持つ高分子同士(例えば、末端に反応性基を持つ高分子同士)のみの反応による結合ではないことも好ましい。
X1は、各々独立に、
単結合、
-C(-R11)2-、
-O-、
-S-、
-SO-、
-SO2-、
-N(-R12)-,
-P(-R13)-、
-P=O(-R14)-、
カルボニル、
エステル、
アミド、
炭素数2以上、20以下のアルキレン、
炭素数2以上、20以下のアルキリデン、
炭素数8以上、20以下のアルキリデンアリーレンアルキリデン、
環形成炭素数3以上、20以下のシクロアルキレン、
環形成炭素数3以上、20以下のシクロアルキリデン、
環形成炭素数6以上、12以下のアリーレン、
環形成炭素数4以上、20以下のビシクロアルカンジイル、
環形成炭素数5以上、20以下のトリシクロアルカンジイル、
環形成炭素数4以上、20以下のビシクロアルキリデン、
環形成炭素数5以上、20以下のトリシクロアルキリデン、および
ナフチレン基からなる群から選択される1種又は2種以上からなる基であり、
R11~R14は、各々独立に、
水素原子、
ハロゲン原子、
炭素数1以上、10以下のアルキル、
環形成炭素数6以上、12以下のアリール、または
炭素数1以上、10以下のフッ化アルキルである。)
前記一般式(AL1)~(AL3)において、*は、結合位置を示す。
マレイミド基またはマレイミド構造を有する化合物または樹脂としては、例えば、4,4’-ジフェニルメタンビスマレイミド、m-フェニレンビスマレイミド、ビスフェノール A ジフェニルエーテルビスマレイミド(2,2-ビス[4-(4-マレイミドフェノキシ)フェニル]プロパン、)、3,3’-ジメチル-5,5’-ジエチル-4,4’-ジフェニルメタンビスマレイミド、4-メチル-1,3-フェニレンビスマレイミド、1,6-ビスマレイミド-(2,2,4-トリメチル)ヘキサン、4,4’-ジフェニルエーテルビスマレイミド、4,4’-ジフェニルスルフォンビスマレイミド、1,3-ビス(3-マレイミドフェノキシ)ベンゼン、1,3-ビス(4-マレイミドフェノキシ)ベンゼン、4,4’-メチレンジアニリンを有するジフェニルメタン-4,4’-ビスマレイミドポリマー、N,N’-(2,2’-ジエチル-6,6’-ジメチレンジフェニレン)ビスマレイミド、N,N’-(4-メチル-m-フェニレン)ビスマレイミド、N,N’-m-フェニレンジマレイミド、N,N’-m-フェニレンビスマレイミド、ポリフェニルメタンビスマレイミドなどのビスマレイミド類、N-フェニルマレイミドなどのモノマレイミド類、下記化合物(MA4-1)で分子末端が停止された構造を有するPC類が挙げられる。
X2は、単結合、又は他の骨格との連結基であり、
当該連結基としてのX2は、炭素原子、酸素原子、窒素原子、硫黄原子、ケイ素原子、リン原子およびホウ素原子からなる群から選択される少なくともいずれかの原子を含み、連結基を構成する原子同士の結合様式が全て共有結合からなる基である。)
前記一般式(MA1)において、*は、結合位置を示す。
当該化合物または高分子が前記一般式(MA1)で表される構造を複数含む場合、複数の前記一般式(MA1)で表される構造は、互いに同一であるか又は異なり、複数の前記一般式(MA1)で表される構造は、互いに単結合で結合するか又は他の基を介して連結されていることが好ましい。
前記一般式(MA3)におけるY2は、芳香族ポリカーボネート骨格またはポリアリレート骨格を含む基である。)
マレイミド基のモル数MMAに対するアリル基のモル数MALのモル比(MAL/MMA)は、0.01以上、100以下であることが好ましく、0.1以上、10以下であることがより好ましく、0.2以上、5以下であることがさらに好ましい。モル比MAL/MMAが0.01以上、100以下であれば、架橋が十分に進行し、耐溶剤性および機械物性が向上し易い。
前記一般式(UN1)および一般式(UN2)において、*は、結合位置を示す。
m3は、0、1または2であり、
n3は、4であり、
複数のR3は、各々独立に
水素原子、
ハロゲン原子、
炭素数1以上、10以下のアルキル、
環形成炭素数6以上、12以下のアリール、または
炭素数1以上、10以下のフッ化アルキルであり、
X3は、各々独立に、
単結合、
-C(-R31)2-、
-O-、
-S-、
-SO-、
-SO2-、
-N(-R32)-,
-P(-R33)-、
-P=O(-R34)-、
カルボニル、
エステル、
アミド、
炭素数2以上、20以下のアルキレン、
炭素数2以上、20以下のアルキリデン、
環形成炭素数3以上、20以下のシクロアルキレン、
環形成炭素数3以上、20以下のシクロアルキリデン、
環形成炭素数6以上、20以下のアリーレン、
環形成炭素数4以上、20以下のビシクロアルカンジイル、
環形成炭素数5以上、20以下のトリシクロアルカンジイル、
環形成炭素数4以上、20以下のビシクロアルキリデン、および
環形成炭素数5以上、20以下のトリシクロアルキリデンからなる群から選択される1種または2種以上からなる基であり、
R31~R34は、各々独立に、
水素原子、
ハロゲン原子、
炭素数1以上、10以下のアルキル、
環形成炭素数6以上、12以下のアリール、または
炭素数1以上、10以下のフッ化アルキルである。)
前記一般式(UN11)において、*は、結合位置を示す。
前記一般式(AL1)中のX1並びに前記一般式(UN11)中のX3が示す炭素数2以上、20以下のアルキリデンは、各々独立に、例えば、エチリデン、プロピリデン、ブチリデン、ヘキシリデン、オクチリデン、デシリデン、ペンタデシリデン、およびイコシリデン等の基が挙げられる。
前記一般式(AL1)中のX1並びに前記一般式(UN11)中のX3が示す炭素数3以上、20以下のシクロアルキリデンは、各々独立に、例えば、シクロプロピリデン、シクロブチリデン、シクロヘキシリデン、シクロオクチリデン、シクロデシリデン、シクロペンタデシリデン、シクロドデシリデン、およびシクロイコシリデン等の基が挙げられる。
前記一般式(AL1)中のX1が示す環形成炭素数6以上、12以下のアリーレン並びに前記一般式(UN11)中のX3が示す環形成炭素数6以上、20以下のアリーレンは、各々独立に、例えば、フェニレン、ナフチレン、およびビフェニレン等の基が挙げられる。
前記一般式(AL1)中のX1並びに前記一般式(UN11)中のX3が示す環形成炭素数4以上、20以下のビシクロアルキリデンは、各々独立に、上述のシクロアルキリデンの二環体が例示され、環形成炭素数5以上、20以下のトリシクロアルキリデンは、各々独立に、上述のシクロアルキリデンの三環体が例示される。例えば、アダマンチリデン基、トリシクロデカニリデン基、およびトリシクロデシリデン基等の基が挙げられる。
本実施形態に係る樹脂前駆体組成物は、架橋反応により、前述の本実施形態に係る樹脂を作製できる。
すなわち、本実施形態に係る樹脂前駆体組成物は、アリル基とマレイミド基との反応により架橋可能な構造を有するアリルおよびマレイミドの少なくとも1つを構造中に有する高分子と、それぞれの相手方の基を有する架橋剤または高分子とを含む。
なお、架橋反応可能な基の組み合わせとして、一方がアリル基である場合の「相手方」は、マレイミド基であり、一方がマレイミド基である場合の「相手方」は、アリル基である。
この官能基濃度が0.01mmol/g以上であれば、耐溶剤性および機械物性を向上させるための架橋密度を得やすい。
この官能基濃度が10mmol/g以下であれば、架橋密度が高くなり過ぎることを抑制し易い。架橋密度が高くなり過ぎると、架橋物の靭性が不足したり、未反応の官能基が残りやすく、架橋反応やその他の副反応が経時的に進行して、材料の物性が変化したり、劣化したりするおそれがある。
(b1)高分子鎖に2つ以上のアリル構造を有する高分子および2官能以上のマレイミド基を有する化合物
(b2)高分子鎖に2つ以上のマレイミド構造を有する高分子および2官能以上のアリル基を有する化合物
(b3)高分子鎖に2つ以上のアリル構造を有する高分子および高分子鎖に2つ以上のマレイミド構造を有する高分子
(b4)一本の高分子鎖にアリル基およびマレイミド基の双方の構造を持ち、高分子鎖一本当たりの前記アリル基および前記マレイミド基の平均個数がそれぞれ1以上である高分子
高分子鎖の主鎖に2つ以上のアリル基を有する高分子と、2官能以上のマレイミド基を有する化合物
2つのマレイミド構造を有する高分子であって、高分子鎖の両末端に当該マレイミド構造を1つずつ有する高分子、及び
高分子鎖に2つを超えるアリル構造を有する高分子
2つのマレイミド構造を有する高分子であって、高分子鎖の両末端に当該マレイミド構造を1つずつ有する高分子、及び
高分子鎖に2つを超えるアリル構造を有する高分子であって、当該高分子鎖の両末端に当該アリル構造を1つずつ有し、かつ主鎖内にも当該アリル構造を1以上有する高分子
2つのマレイミド構造を有する高分子であって、高分子鎖の両末端に当該マレイミド構造を1つずつ有する高分子、及び
高分子鎖に2つを超えるアリル構造を有する高分子であって、当該高分子鎖の一方の末端に当該アリル構造を1つ有し、他方の末端には当該アリル構造を有さず、かつ主鎖内に当該アリル構造を2つ以上有する高分子
2つのマレイミド構造を有する高分子であって、高分子鎖の両末端に当該マレイミド構造を1つずつ有する高分子、及び
高分子鎖の両末端にはアリル構造を有さず、かつ主鎖内に2つを超えるアリル構造を有する高分子
2つのアリル構造を有する高分子であって、高分子鎖の両末端に当該アリル構造を1つずつ有する高分子、及び
高分子鎖に2つを超えるマレイミド構造を有する高分子
2つのアリル構造を有する高分子であって、高分子鎖の両末端に当該アリル構造を1つずつ有する高分子、及び
高分子鎖に2つを超えるマレイミド構造を有する高分子であって、当該高分子鎖の両末端にマレイミド構造を1つずつ有し、かつ主鎖内にもマレイミド構造を1つ以上有する高分子
2つのアリル構造を有する高分子であって、高分子鎖の両末端に当該アリル構造を1つずつ有する高分子、及び
高分子鎖に2つを超えるマレイミド構造を有する高分子であって、当該高分子鎖の一方の末端にマレイミド構造を1つ有し、他方の末端にはマレイミド構造を有さず、かつ主鎖内にマレイミド構造を2つ以上有する高分子
2つのアリル構造を有する高分子であって、高分子鎖の両末端に当該アリル構造を1つずつ有する高分子、及び
高分子鎖の両末端にはマレイミド構造を有さず、かつ主鎖内に2つを超えるマレイミド構造を有する高分子
また、例えば、前記(b3)の成分を含有する組成物の場合、2つ以上のアリル構造を有する高分子において、高分子鎖の主鎖に全てのアリル構造が結合し、かつ、2つ以上のマレイミド構造を有する高分子において、高分子鎖の主鎖に全てのマレイミド構造が結合していてもよい。
(b4-1)高分子鎖の一方の末端及び他方の末端の少なくともいずれかの末端には、アリル基およびマレイミド基が結合していない高分子
(b4-2)高分子鎖の一方の末端には、アリル基およびマレイミド基の一方が結合し、高分子鎖の他方の末端には、アリル基およびマレイミド基のいずれも結合せず、高分子鎖の主鎖にアリル基およびマレイミド基の他方が少なくとも1つ結合する高分子
(b4-3)高分子鎖の末端にはアリル基およびマレイミド基が結合していない高分子
(b4-4)高分子鎖の両末端にマレイミド基が1つずつ結合し、かつ高分子鎖の主鎖にアリル基が少なくとも1つ結合する高分子
すなわち、本実施形態に係る樹脂前駆体組成物を用いた場合に形成される樹脂における高分子鎖間の結合は、一方の高分子の末端に結合しているアリル基およびマレイミド基の一方と、他方の高分子の主鎖に結合しているアリル基およびマレイミド基の他方との結合であるか、及び一方の高分子の主鎖に結合しているアリル基およびマレイミド基の一方と、他方の高分子の主鎖に結合しているアリル基およびマレイミド基の他方との結合の少なくともいずれかを持つことも好ましい。
また、高分子鎖の末端同士の結合でなくても、反応性基を2つ持つ高分子鎖同士の結合の場合も、同様に3次元架橋は起こらず、直鎖状の高分子になる。そのため、本実施形態に係る樹脂前駆体組成物を用いた場合に形成される樹脂における高分子鎖間の結合は、高分子鎖に2つの反応点(反応性基)を持つ高分子同士(例えば、末端に反応性基を持つ高分子同士)のみの反応による結合ではないことが好ましい。
*は、結合位置を示す。
前記一般式(2C)において、Ar33は、前記一般式(AL1)中の前記一般式(AL11)で表される基であり、Ar34は、前記一般式(UN11)で表される基である。また、n33およびn34は、それぞれ平均量体数を表す。また、平均量体数n33およびn34の合計は、1.0以上、10以下である。
ただし、Ar33およびAr34は、互いに異なる。前記一般式(2C)において、各繰り返し単位は必ずしも連続していなくてもよい。
平均量体数の算出方法は、後述する実施例において説明する方法が挙げられる。
aは、[Ar33]/([Ar33]+[Ar34])であり、bは、[Ar34]/([Ar33]+[Ar34])であり、bが0の場合も含む。[Ar33]は、PC重合体中のAr33で表される基を含む繰り返し単位Aのモル数を表し、[Ar34]は、PC重合体中のAr34で表される基を含む繰り返し単位Bのモル数を表す。
前記一般式(100)で表されるPC重合体は、ブロック共重合体、交互共重合体、およびランダム共重合体など、いずれであってもよい。
本実施形態に係るPC重合体の第二の形態は、前記したPC重合体の連鎖末端として、前記一般式(AL2)および一般式(AL3)で表される構造のいずれかを有するものである。また、前記一般式(100)で表されるPC重合体において、Ar33を含まなくてもよいが、Ar33を含まないPC重合体の場合、連鎖末端は前記一般式(AL2)および一般式(AL3)で表されるいずれかの構造を合計で、1分子当たり平均で2つ以上含むことが必要である。ただし、高分子鎖の末端に、アリル基を2つ以上持たないとき、前記一般式(100)で表されるPC重合体は、Ar33を含むことが好ましい。他方、Ar33を含む骨格の場合には、1分子当たりにAr33に含まれるアリル基と上記連鎖末端に含まれるアリル基の数の合計が2以上であれば良い。
一価の芳香族基は、脂肪族基を含有する基であってもよい。
一価のフッ素含有脂肪族基は、芳香族基を含有する基であってもよい。
また、一価の芳香族基および一価のフッ素含有脂肪族基には、アルキル基、ハロゲン原子、およびアリール基からなる群から選択される少なくともいずれかの置換基が付加していてもよい。これらの置換基には、アルキル基、ハロゲン原子、およびアリール基からなる群から選択される少なくともいずれかの置換基がさらに付加していてもよい。また、置換基が複数ある場合、これらの置換基同士が互いに結合して環を形成してもよい。
芳香族基に付加する置換基、および芳香族基に付加しているアルキル基に付加する置換基としては、フッ素原子、塩素原子、臭素原子などのハロゲン原子が挙げられる。また、芳香族基に付加する置換基として炭素数1から20のアルキル基が挙げられる。このアルキル基は、上記のようにハロゲン原子が付加した基であってもよく、アリール基が付加した基であってもよい。
さらに、一価のフッ素含有脂肪族基としては、エーテル結合を2つ以上有するフッ素含有アルコールから誘導される一価の基でも好ましい。このようなフッ素含有アルコールを用いることで、塗液組成物におけるPC重合体の分散性が良くなり、成形体や電子写真感光体における耐摩耗性を向上させ、摩耗後の、表面潤滑性、撥水性および撥油性を保持することができる。
F(CF2)m1CH2OH・・・(31)
F-(CF2CF2)n 32-(CF2CF2O)n 33-CF2CH2OH・・・(33)
CR3-(CF2)n 35-O-(CF2CF2O)n 34-CF2CH2OH・・・(34)
前記一般式(33)において、n32は0から5の整数であり、好ましくは、0から3の整数である。n33は1から5の整数であり、好ましくは、1から3の整数である。
前記一般式(34)において、n34は1から5の整数であり、好ましくは、1から3の整数である。n35は0から5の整数であり、好ましくは、0から3の整数である。Rは、CF3またはFである。
前記一般式(36)において、Rfは、炭素数が5以上、かつ、フッ素原子数が11以上であるパーフルオロアルキル基、あるいは下記一般式(37)で表されるパーフルオロアルキルオキシ基を示す。
例えば、p-tert-ブチル-フェノール、p-フェニルフェノール、p-クミルフェノール、p-パーフルオロノニルフェノール、p-(パーフルオロノニルフェニル)フェノール、p-(パーフルオロヘキシル)フェノール、p-tert-パーフルオロブチルフェノール、p-パーフルオロオクチルフェノール、1-(p-ヒドロキシベンジル)パーフルオロデカン、p-〔2-(1H,1H-パーフルオロトリドデシルオキシ)-1,1,1,3,3,3-ヘキサフルオロプロピル〕フェノール、3,5-ビス(パーフルオロヘキシルオキシカルボニル)フェノール、p-ヒドロキシ安息香酸パーフルオロドデシル、p-(1H,1H-パーフルオロオクチルオキシ)フェノール、2H,2H,9H-パーフルオロノナン酸などが好適に用いられる。
アリル、またはマレイミド基を末端に含む場合は、末端の分率により架橋性反応基の濃度、および分子量が連動して変化する。主鎖、および末端の繰り返し単位の合計に対するアリル、またはマレイミド末端基の共重合組成のモル百分率として、好ましくは0.1モル%以上、33モル%以下であり、さらに好ましくは0.5モル%以上、25モル%以下である。末端封止剤の添加割合が、33モル%以下であると機械的強度の低下を抑制でき、0.1モル%以上であると架橋による特性向上の効果を得る事ができる。
アリル、またはマレイミド以外の末端が含まれる場合は、主鎖および末端の繰り返し単位の合計に対する連鎖末端の共重合組成のモル百分率として、好ましくは0.05モル%以上、30モル%以下であり、さらに好ましくは0.1モル%以上、10モル%以下である。末端封止剤の添加割合が、30モル%以下であると機械的強度の低下を抑制でき、0.05モル%以上であると成形性の低下を抑制できる。
これら分岐剤の添加割合は、繰り返し単位A、繰り返し単位B、および連鎖末端の共重合組成のモル百分率で、または繰り返し単位A、および連鎖末端の共重合組成のモル百分率で30モル%以下であることが好ましく、5モル%以下であることがより好ましい。分岐剤の添加割合が30モル%以下であると、成形性の低下を抑制できる。
ここで、「実質的に水と混じりあわない」有機溶剤とは、常温常圧条件で、水と有機溶剤を1:9~9:1の組成範囲で混合した場合に、均一な層からなる溶液(ゲル化物および不溶物のいずれもみられない溶液)が得られない有機溶剤である。
また、有機溶剤が「最終的に得られるポリカーボネート重合体を5質量%以上溶解可能」とは、温度20~30℃、常圧の条件で測定した際のポリカーボネート重合体の溶解度である。
また、「最終的に得られるポリカーボネート重合体」とは、本実施形態のポリカーボネート重合体の製造方法における重合工程を経て得られる重合体のことである。
このような有機溶剤としては、例えば、トルエンなどの芳香族炭化水素類、シクロヘキサノンなどのケトン類、および塩化メチレンなどのハロゲン化炭化水素などが挙げられる。中でも、溶解性が高いことから、塩化メチレンが好ましい。
さらに、必要に応じて、本実施形態のPC重合体の反応系に亜硫酸ナトリウムやハイドロサルファイト塩などの酸化防止剤を少量添加してもよい。
本実施形態に係る塗液組成物は、本実施形態に係る樹脂前駆体組成物と、有機溶剤とを含む。
本実施形態に係る有機溶剤としては、環状エーテル類(テトラヒドロフラン(THF)、ジオキサン、およびジオキソランなど)、環状ケトン類(シクロヘキサノン、シクロペンタノン、およびシクロヘプタノンなど)、芳香族炭化水素類(トルエン、キシレン、およびクロロベンゼンなど)、ケトン類(メチルエチルケトン(MEK)、およびメチルイソブチルケトン(MIBK)など)、ハロゲン化炭化水素類(ジクロロメタン、およびクロロホルムなど)、エステル類(酢酸エチル、酢酸イソプロピル、酢酸イソブチル、および酢酸ブチルなど)、エーテル類(エチレングリコールジメチルエーテル、およびエチレングリコールモノエチルエーテルなど)、アミド類(フマル酸ジメチル(DMF)、およびジメチルアセトアミド(DMAc)など)、および非プロトン性極性溶媒(ジメチルスルホキシド(DMSO)など)などが挙げられる。
これら添加剤や他の樹脂としては、樹脂前駆体組成物と配合し得る物質として公知の物質を用いることができる。
本実施形態に係る塗液組成物中、本実施形態に係る樹脂前駆体組成物は1種単独で用いてもよいし、2種以上を併用してもよい。
また、本実施形態に係る塗液組成物は、感光体の保護層の形成に使用することも可能である。
本実施形態に係る成形物は、本実施形態に係る樹脂を含む。本実施形態に係る成形物は、後述する電子写真感光体の用途の他に、様々な用途に使用できる。例えば、電子デバイスなどの基板、絶縁層、保護層、接着層、導電層、および構造材としての用途に好適に用いることができる。
本実施形態に係る樹脂前駆体組成物を用いる場合、その成形方法としては、湿式成形法、および溶融成形法のいずれの方法も適用できる。
なお、湿式成形法においては、前述の本実施形態に係る塗液組成物を用いることができる。
本実施形態に係る電子写真感光体は、本実施形態に係る樹脂を最外層に含むことが好ましい。
本実施形態に係る電子写真感光体は、基板と、この基板上に設けられた感光層とを有し、この感光層に、本実施形態に係る樹脂を含む。
本実施形態の電子写真感光体は、本実施形態に係る樹脂を感光層中に用いる限り、公知の種々の形一般式の電子写真感光体はもとより、どのような電子写真感光体としてもよいが、感光層が、少なくとも1層の電荷発生層と少なくとも1層の電荷輸送層とを有する積層型電子写真感光体、または、一層に電荷発生物質と電荷輸送物質とを有する単層型電子写真感光体とすることが好ましい。
本実施形態の電子写真感光体において、本実施形態に係る樹脂は、1種単独で使用してもよいし、2種以上を組合せて用いてもよい。また、所望に応じて本実施形態の目的を阻害しない範囲で、他のポリカーボネートなどのバインダー樹脂成分を含有させてもよい。さらに、酸化防止剤などの添加物を含有させてもよい。
さらに、各層間の接着性を向上させるための接着層あるいは電荷のブロッキングの役目を果すブロッキング層などの中間層などが形成されていてもよい。
前記した電荷発生層や電荷輸送層のバインダー樹脂としては、特に制限はなく、公知の各種の樹脂を使用することができる。具体的には、例えば、ポリスチレン、ポリ塩化ビニル、ポリ酢酸ビニル、塩化ビニル-酢酸ビニル共重合体、ポリビニルアセタール、アルキッド樹脂、アクリル樹脂、ポリアクリロニトリル、ポリカーボネート、ポリウレタン、エポキシ樹脂、フェノール樹脂、ポリアミド、ポリケトン、ポリアクリルアミド、ブチラール樹脂、ポリエステル樹脂、塩化ビニリデン-塩化ビニル共重合体、メタクリル樹脂、スチレン-ブタジエン共重合体、塩化ビニリデン-アクリロニトリル共重合体、塩化ビニル-酢酸ビニル-無水マレイン酸共重合体、シリコン樹脂、シリコンアルキッド樹脂、フェノール-ホルムアルデヒド樹脂、スチレン-アルキッド樹脂、メラミン樹脂、ポリエーテル樹脂、ベンゾグアナミン樹脂、エポキシアクリレート樹脂、ウレタンアクリレート樹脂、ポリ-N-ビニルカルバゾール、ポリビニルブチラール、ポリビニルホルマール、ポリスルホン、カゼイン、ゼラチン、ポリビニルアルコール、エチルセルロース、ニトロセルロース、カルボキシ-メチルセルロース、塩化ビニリデン系ポリマーラテックス、アクリロニトリル-ブタジエン共重合体、ビニルトルエン-スチレン共重合体、大豆油変性アルキッド樹脂、ニトロ化ポリスチレン、ポリメチルスチレン、ポリイソプレン、ポリチオカーボネート、ポリアリレート、ポリハロアリレート、ポリアリルエーテル、ポリビニルアクリレート、およびポリエステルアクリレートなどが挙げられる。
これらは、1種を単独で用いることもできるし、また、2種以上を混合して用いることもできる。なお、電荷発生層および電荷輸送層の少なくともいずれかにおけるバインダー樹脂としては、前記した本実施形態のPC重合体を使用することが好適である。
この電荷輸送層において、本実施形態のPC重合体は1種単独で用いることもでき、また2種以上混合して用いることもできる。また、本実施形態の目的を阻害しない範囲で、他のバインダー樹脂を本実施形態のPC重合体と併用することも可能である。
本実施形態のPC重合体と共に使用できる電荷輸送物質としては、公知の各種の化合物を使用することができる。このような化合物としては、例えば、カルバゾール化合物、インドール化合物、イミダゾール化合物、オキサゾール化合物、ピラゾール化合物、オキサジアゾール化合物、ピラゾリン化合物、チアジアゾール化合物、アニリン化合物、ヒドラゾン化合物、芳香族アミン化合物、脂肪族アミン化合物、スチルベン化合物、フルオレノン化合物、ブタジエン化合物、キノン化合物、キノジメタン化合物、チアゾール化合物、トリアゾール化合物、イミダゾロン化合物、イミダゾリジン化合物、ビスイミダゾリジン化合物、オキサゾロン化合物、ベンゾチアゾール化合物、ベンズイミダゾール化合物、キナゾリン化合物、ベンゾフラン化合物、アクリジン化合物、フェナジン化合物、ポリ-N-ビニルカルバゾール、ポリビニルピレン、ポリビニルアントラセン、ポリビニルアクリジン、ポリ-9-ビニルフェニルアントラセン、ピレン-ホルムアルデヒド樹脂、エチルカルバゾール樹脂、あるいはこれらの構造を主鎖や側鎖に有する重合体などが好適に用いられる。これら化合物は、1種を単独で使用してもよいし、2種以上を組み合わせて使用してもよい。
これら電荷輸送物質の中でも、特開平11-172003号公報において具体的に例示されている化合物、および以下の構造で表される電荷輸送物質が特に好適に用いられる。
また、前記導電性基体と感光層との間には、通常使用されるような公知のブロッキング層を設けることができる。このブロッキング層としては、前記のバインダー樹脂と同種の樹脂を用いることができる。また本実施形態に係る樹脂前駆体組成物を用いてもよい。このブロッキング層の厚みは、0.01μm以上20μm以下、好ましくは0.1μm以上10μm以下である。この厚みが0.01μm以上であると、ブロッキング層を均一に形成することが可能となり、また20μm以下であると電子写真特性が低下することを抑制できる。
このような酸化防止剤の具体例としては、特開平11-172003号公報の明細書に記載された化学一般式[化94]から[化101]の化合物が好適である。
これら酸化防止剤は、1種単独で用いてもよく、2種以上を混合して用いてもよい、そして、これらは前記感光層のほか、表面保護層や下引き層、ブロッキング層に添加してもよい。
各層の塗布は公知の装置など各種の塗布装置を用いて行うことができ、具体的には、例えば、アプリケーター、スプレーコーター、バーコーター、チップコーター、ロールコーター、ディップコーター、およびドクタブレードなどを用いて行うことができる。
本実施形態に係る電子写真感光体の製造方法は、本実施形態に係る塗液組成物を湿式成形法で導電性基体に塗布する工程と、加熱を行うことにより、この塗液組成物中の有機溶剤を除去する工程と、この有機溶剤を除去する工程における加熱と同時、または引き続き加熱を行うことにより、この塗液組成物中の樹脂前駆体組成物の架橋反応を行う工程と、を備える方法である。
有機溶剤を除去する工程において、本実施形態に係る塗液組成物における有機溶剤の種類に応じて、適宜設定できる。
樹脂前駆体組成物の架橋反応を行う工程において、加熱温度は、本実施形態に係る成形物における電子写真感光体向けの架橋温度と同様である。
本実施形態に係る電子デバイスは、本実施形態に係る樹脂を含むことが好ましい。
また、本実施形態に係る電子デバイスは、本実施形態に係る成形物を含むことも好ましい。
<製造例1:ビスフェノールZオリゴマー(ビスクロロホーメート)の合成>
1,1-ビス(4-ヒドロキシフェニル)シクロヘキサン(ビスフェノールZ)60.0g(224ミリモル)を塩化メチレン1080mLで懸濁し、そこにホスゲン66.0g(667ミリモル)を加えて溶解させた。これにトリエチルアミン44.0g(435ミリモル)を塩化メチレン120mLに溶解させた液を、温度5℃から15℃の範囲で滴下した。次に、30分間撹拌後、塩化メチレンを所定濃度になるまで留去した。残液に、純水210mL、濃塩酸1.2g、ハイドロサルファイト450mgを加え洗浄した。その後、純水210mLで5回洗浄を繰り返し、分子末端にクロロホーメート基を有するビスフェノールZオリゴマーの塩化メチレン溶液を得た。得られた溶液のクロロホーメート濃度は1.12モル/L、固形物濃度は0.225kg/L、平均量体数は1.03であった。以後この得られた原料をZ-CFという。
平均量体数(nX)=1+(Mav-M1)/M2・・・(数1)
(前記数式(数1)において、Mavは(2×1000/(CF価))であり、M2は(M1-98.92)であり、M1は、下記一般式(X1)において、nX=1のときのビスクロロホーメート化合物の分子量であり、CF価(N/kg)は(CF値/濃度)であり、CF値(N)は反応溶液1Lに含まれる下記一般式(X1)で表されるビスクロロホーメート化合物中のクロル原子数であり、濃度(kg/L)は反応溶液1Lを濃縮して得られる固形分の量である。ここで、98.92は、ビスクロロホーメート化合物同士の重縮合で脱離する2個の塩素原子、1個の酸素原子および1個の炭素原子の合計の原子量である。)
なお、2種類以上の原料を用いてビスクロロホーメートを合成した場合の平均量体数を求める際には、用いた原料の分子量をモル比で平均した分子量に基づきM1を算出して求める。例として、分子量268のモノマーを366モル、分子量214のモノマーを108モル使用して合成した場合、M1は、次の計算式で算出される。
M1=(268×(366÷(366+108))+214×(108÷(366+108))+124.9
このM1の計算式における「124.9」は、使用するモノマーの水素原子2つが無くなり、炭素原子、酸素原子、および塩素原子がそれぞれ2つ増加した際の分子量増分である。
前記一般式(2A)で表されるビスクロロホーメートオリゴマーの場合は、Ar34が、ArX1に相当し、n32が、nXに相当する。
1,1-ビス(4-ヒドロキシフェニル)シクロヘキサン(ビスフェノールZ)98g(366ミリモル)、3,3’-ジメチル-4,4’-ジヒドロキシビフェニル22g(103ミリモル)を塩化メチレン2400mLで懸濁し、そこにホスゲン138g(1395ミリモル)を加えて溶解させた。これにトリエチルアミン93.8g(929ミリモル)を塩化メチレン256mLに溶解させた液を、温度16℃から19℃の範囲で滴下した。次に、140分間撹拌後、塩化メチレンを所定濃度になるまで留去した。残液に、純水1100mL、濃塩酸2.4g、ハイドロサルファイト450mgを加え洗浄した。その後、純水210mLで5回洗浄を繰り返し、分子末端にクロロホーメート基を有するビスフェノールZオリゴマー、および3,3’-ジメチル-4,4’-ジヒドロキシビフェニルオリゴマーの塩化メチレン溶液を得た。得られた溶液のクロロホーメート濃度は0.57モル/L、固形物濃度は0.11kg/L、平均量体数は1.02であった。以後この得られた原料をZOCBP-CFという。
(PC重合体の製造)
メカニカルスターラー、撹拌羽根、邪魔板を装着した反応容器に、製造例1のZ-CF(76mL)と塩化メチレン(114mL)を注入した。これに末端停止剤としてp-tert-ブチルフェノール(以下、PTBPと表記)(0.151g)を添加し、十分に混合されるように撹拌した。反応器内の温度が10℃になるまで冷却した後、この溶液に調製した1,1-ビス(4-ヒドロキシフェニル)シクロヘキサンと2,2-ビス(3-アリル-4-ヒドロキシフェニル)プロパン溶液(溶液調製法:2.36Nの水酸化カリウム水溶液65mL(水酸化カリウム8.6g)を調製し、室温以下に冷却した後、酸化防止剤としてハイドロサルファイトを0.25g、1,1-ビス(4-ヒドロキシフェニル)シクロヘキサン7.9g、および2,2-ビス(3-アリル-4-ヒドロキシフェニル)プロパン4.9gを添加し、完全に溶解して調製した)を全量添加し、撹拌しながらトリエチルアミン水溶液(7vol%)を1.0mL添加し、3時間撹拌を継続した。
得られた反応混合物を塩化メチレン1L、水0.1Lで希釈し、洗浄を行った。下層を分離し、さらに水0.25Lで1回、0.03N塩酸0.25Lで1回、水0.25Lで3回の順で洗浄を行った。得られた塩化メチレン溶液を、撹拌下メタノールに滴下投入し、得られた再沈物をろ過、乾燥することにより下記構造のPC重合体(PC-1)を得た。
このようにして得られたPC重合体(PC-1)を塩化メチレンに溶解して、濃度0.5g/dLの溶液を調製し、20℃における還元粘度[ηsp/C]を測定したところ、1.10dL/gであった。なお、得られたPC重合体(PC-1)の構造および組成を1H-NMRスペクトルにより分析したところ、下記の繰り返し単位、繰り返し単位数、および組成からなるPC重合体であることが確認された。
1H-NMRスペクトルの測定条件は以下の通りである。
・溶媒 :CD2Cl2
・測定濃度(サンプル量/溶媒量):1.5mg/mL
・積算回数:64回(約3min)
PC重合体(PC-1)におけるアリル基濃度は、1.05mmol/gであった。
(PC重合体の製造)
メカニカルスターラー、撹拌羽根、および邪魔板を装着した反応容器に、製造例2のZOCBP-CF(184mL)と塩化メチレン(41mL)を注入した。これに末端停止剤としてN-(4-ヒドロキシフェニル)マレイミド(以下、Male1と表記)(2.968g)を添加し、十分に混合されるように撹拌した。反応器内の温度が10℃になるまで冷却した後、この溶液に調製した3,3’-ジメチル-4,4’-ジヒドロキシビフェニル溶液(溶液調製法:2.5mol/Lの炭酸カリウム水溶液60mL(炭酸カリウム20.9g)を調製し、室温以下に冷却した後、酸化防止剤としてハイドロサルファイトを0.1g、3,3’-ジメチル-4,4’-ジヒドロキシビフェニル7.3gを添加して調製した)を全量添加し、撹拌しながらトリエチルアミン水溶液(7vol%)を2.7mL添加し、3時間撹拌を継続した。
3時間撹拌後、得られた反応混合物を塩化メチレン0.5L、および水0.1Lで希釈し、洗浄した。洗浄後の下層を分離し、上層をさらに水0.15Lで一回、0.03N塩酸0.15Lで1回、水0.15Lで3回の順で洗浄した。得られた塩化メチレン溶液を、撹拌下メタノールに滴下投入し、得られた再沈物をろ過、乾燥することにより下記構造のPC重合体(PC-2)を得た。
PC重合体(PC-2)を塩化メチレンに溶解して、濃度0.5g/dLの溶液を調製し、20℃における還元粘度[ηsp/C]を測定したところ、0.23dL/gであった。得られたPC重合体(PC-2)の構造および組成を1H-NMRスペクトルにより分析したところ、下記の繰り返し単位、繰り返し単位数、および組成からなるPC重合体であることが確認された。
PC重合体(PC-2)におけるマレイミド基濃度は、0.39mmol/gであった。
<アリル基を有するポリカーボネートとマレイミド基を有するポリカーボネートからなる塗液調製と、架橋樹脂膜の調製>
PC重合体(PC-1)を1.05g、並びに下記式(MA4-2)で表される2,2-ビス[4-(4-マレイミドフェノキシ)フェニル]プロパン0.45gをスクリューキャップ付きのサンプルチューブに計り取り、THF10mLに溶解して、THF溶液を調製した。ギャップ200μmのアプリケータを用い、50μm厚のポリイミドフィルムにキャスト成膜した。キャスト成膜後、1時間風乾し、さらに、真空乾燥機で50℃、16時間加熱処理し、溶剤を除去した。16時間加熱処理後に得られたフィルムを減圧乾燥機にて、減圧度1Pa以上100Pa以下、200℃、3時間加熱して架橋処理した。2,2-ビス[4-(4-マレイミドフェノキシ)フェニル]プロパンは、MI-BisAと略記する場合がある。
摩耗試験に用いるための比較例1に係る評価フィルムは、実施例1における2,2-ビス[4-(4-マレイミドフェノキシ)フェニル]プロパンを使用せず、PC-1の使用量を1.5gに変更する以外、実施例1と同様にして作製した。
(耐溶剤性(塩化メチレン溶解性)の評価)
ポリイミドフィルムから架橋処理後の膜を剥離した。剥離した架橋処理後の膜を塩化メチレン中に投入し、外観を確認し、下記評価基準に即して評価した。得られた結果を表1に示す。
耐溶剤性の評価の詳細は、以下の通りである。厚さ20~30μmのフィルムを1cm×2cmの長方形に切り出してサンプルを作製した。サンプルを8mLのサンプルチューブに入れた。続いて、サンプルチューブに塩化メチレンを8mL入れ、サンプルを塩化メチレン中に完全に浸漬した。振とう機を用い、サンプルチューブを室温で1時間、振とう速度120rpmで振とうした後、外観を確認した。評価基準は以下のとおりである。
A:不溶(膨潤が生じないか又は僅かに膨潤し、フィルム形状を保っていた。)
B:膨潤(不溶分は、ひと塊だが、溶剤膨潤によりフィルム形状を保っていなかった。)
C:細切れ(細切れの不溶分が有ったが、大部分が溶解した。)
D:溶解(不溶分を目視で確認できなかった。)
前記実施例および比較例で調製したフィルムサンプルのキャスト面の耐摩耗性をスガ摩耗試験機NUS-ISO-3型(スガ試験機社製)を用いて評価した。試験条件は、4.9Nの荷重をかけた摩耗紙(粒径3μmのアルミナ粒子を含有)をキャスト面(感光層表面を模した面)と接触させて2,000回往復運動を行い、質量減少量(摩耗量)を測定した。得られた結果を表1に示す。
Claims (22)
- 芳香族ポリカーボネートおよびポリアリレートからなる群から選択される少なくとも1つの樹脂であって、
前記樹脂は、アリル基とマレイミド基との反応による高分子鎖間の結合を有する、
ことを特徴とする樹脂。 - 請求項1に記載の樹脂において、
前記高分子鎖間の結合は、高分子鎖に2つ以上のアリル構造を有する高分子と、2官能以上のマレイミド基を有する化合物との反応による、
ことを特徴とする樹脂。 - 請求項2に記載の樹脂において、
前記高分子鎖間の結合は、高分子鎖の主鎖に2つ以上のアリル基を有する高分子と、2官能以上のマレイミド基を有する化合物との反応による、
ことを特徴とする樹脂。 - 請求項1に記載の樹脂において、
前記高分子鎖間の結合は、高分子鎖に2つ以上のマレイミド構造を有する高分子と、2官能以上のアリル基を有する化合物との反応による、
ことを特徴とする樹脂。 - 請求項1に記載の樹脂において、
前記高分子鎖間の結合は、高分子鎖に2つ以上のアリル構造を有する高分子と、高分子鎖に2つ以上のマレイミド構造を有する高分子との反応による、
ことを特徴とする樹脂。 - 請求項2から請求項5のいずれか一項に記載の樹脂において、
前記高分子は、前記高分子鎖の末端に、アリル構造およびマレイミド構造の少なくとも一方を2つ以上持たない、
ことを特徴とする樹脂。 - 請求項2から請求項6のいずれか一項に記載の樹脂において、
前記高分子は、前記高分子鎖の主鎖中に、アリル構造およびマレイミド構造の少なくとも一方を1つ以上持つ、
ことを特徴とする樹脂。 - 請求項1に記載の樹脂において、
前記高分子鎖間の結合は、下記(iii-1)~(iii-8)の少なくともいずれかの反応による、
ことを特徴とする樹脂。
(iii-1)2つのマレイミド構造を有する高分子であって、高分子鎖の両末端に当該マレイミド構造を1つずつ有する高分子と、
高分子鎖に2つを超えるアリル構造を有する高分子と、の反応
(iii-2)2つのマレイミド構造を有する高分子であって、高分子鎖の両末端に当該マレイミド構造を1つずつ有する高分子と、
高分子鎖に2つを超えるアリル構造を有する高分子であって、当該高分子鎖の両末端に当該アリル構造を1つずつ有し、かつ主鎖内にも当該アリル構造を1以上有する高分子と、の反応
(iii-3)2つのマレイミド構造を有する高分子であって、高分子鎖の両末端に当該マレイミド構造を1つずつ有する高分子と、
高分子鎖に2つを超えるアリル構造を有する高分子であって、当該高分子鎖の一方の末端に当該アリル構造を1つ有し、他方の末端には当該アリル構造を有さず、かつ主鎖内に当該アリル構造を2つ以上有する高分子と、の反応
(iii-4)2つのマレイミド構造を有する高分子であって、高分子鎖の両末端に当該マレイミド構造を1つずつ有する高分子と、
高分子鎖の両末端にはアリル構造を有さず、かつ主鎖内に2つを超えるアリル構造を有する高分子と、の反応
(iii-5)2つのアリル構造を有する高分子であって、高分子鎖の両末端に当該アリル構造を1つずつ有する高分子と、
高分子鎖に2つを超えるマレイミド構造を有する高分子との反応
(iii-6)2つのアリル構造を有する高分子であって、高分子鎖の両末端に当該アリル構造を1つずつ有する高分子と、
高分子鎖に2つを超えるマレイミド構造を有する高分子であって、当該高分子鎖の両末端にマレイミド構造を1つずつ有し、かつ主鎖内にもマレイミド構造を1つ以上有する高分子と、の反応
(iii-7)2つのアリル構造を有する高分子であって、高分子鎖の両末端に当該アリル構造を1つずつ有する高分子と、
高分子鎖に2つを超えるマレイミド構造を有する高分子であって、当該高分子鎖の一方の末端にマレイミド構造を1つ有し、他方の末端にはマレイミド構造を有さず、かつ主鎖内にマレイミド構造を2つ以上有する高分子と、の反応
(iii-8)2つのアリル構造を有する高分子であって、高分子鎖の両末端に当該アリル構造を1つずつ有する高分子と、
高分子鎖の両末端にはマレイミド構造を有さず、かつ主鎖内に2つを超えるマレイミド構造を有する高分子と、の反応 - 請求項1に記載の樹脂において、
前記高分子鎖間の結合は、一本の高分子鎖にアリル基およびマレイミド基の双方の構造を持ち、高分子鎖一本当たりの前記アリル基および前記マレイミド基の平均個数がそれぞれ1以上である高分子の反応による、
ことを特徴とする樹脂。 - 請求項9に記載の樹脂において、
前記高分子は、前記高分子鎖の末端に、アリル基およびマレイミド基の少なくとも一方を2つ以上持たない、
ことを特徴とする樹脂。 - 請求項9又は請求項10に記載の樹脂において、
前記高分子は、前記高分子鎖の主鎖中に、アリル基およびマレイミド基の少なくとも一方を1つ以上持つ、
ことを特徴とする樹脂。 - 請求項2から請求項11のいずれか一項に記載の樹脂において、
前記アリル基または前記アリル構造は、下記一般式(AL1)、一般式(AL2)および一般式(AL3)で表される構造の少なくともいずれかの構造を含む、
ことを特徴とする樹脂。
(前記一般式(AL1)において、
X1は、各々独立に、
単結合、
-C(-R11)2-、
-O-、
-S-、
-SO-、
-SO2-、
-N(-R12)-,
-P(-R13)-、
-P=O(-R14)-、
カルボニル、
エステル、
アミド、
炭素数2以上、20以下のアルキレン、
炭素数2以上、20以下のアルキリデン、
炭素数8以上、20以下のアルキリデンアリーレンアルキリデン、
環形成炭素数3以上、20以下のシクロアルキレン、
環形成炭素数3以上、20以下のシクロアルキリデン、
環形成炭素数6以上、12以下のアリーレン、
環形成炭素数4以上、20以下のビシクロアルカンジイル、
環形成炭素数5以上、20以下のトリシクロアルカンジイル、
環形成炭素数4以上、20以下のビシクロアルキリデン、
環形成炭素数5以上、20以下のトリシクロアルキリデン、および
ナフチレン基からなる群から選択される1種又は2種以上からなる基であり、
R11~R14は、各々独立に、
水素原子、
ハロゲン原子、
炭素数1以上、10以下のアルキル、
環形成炭素数6以上、12以下のアリール、または
炭素数1以上、10以下のフッ化アルキルである。) - 請求項1から請求項15のいずれか一項に記載の樹脂において、
下記一般式(UN1)および一般式(UN2)で表される構造の少なくともいずれかの構造を含む、
ことを特徴とする樹脂。
(前記一般式(UN1)および一般式(UN2)において、Ar3、Ar31およびAr32は、各々独立に、下記一般式(UN11)で表される基である。)
(前記一般式(UN11)において、
m3は、0、1または2であり、
n3は、4であり、
複数のR3は、各々独立に
水素原子、
ハロゲン原子、
炭素数1以上、10以下のアルキル、
環形成炭素数6以上、12以下のアリール、または
炭素数1以上、10以下のフッ化アルキルであり、
X3は、各々独立に、
単結合、
-C(-R31)2-、
-O-、
-S-、
-SO-、
-SO2-、
-N(-R32)-,
-P(-R33)-、
-P=O(-R34)-、
カルボニル、
エステル、
アミド、
炭素数2以上、20以下のアルキレン、
炭素数2以上、20以下のアルキリデン、
環形成炭素数3以上、20以下のシクロアルキレン、
環形成炭素数3以上、20以下のシクロアルキリデン、
環形成炭素数6以上、20以下のアリーレン、
環形成炭素数4以上、20以下のビシクロアルカンジイル、
環形成炭素数5以上、20以下のトリシクロアルカンジイル、
環形成炭素数4以上、20以下のビシクロアルキリデン、および
環形成炭素数5以上、20以下のトリシクロアルキリデンからなる群から選択される1種または2種以上からなる基であり、
R31~R34は、各々独立に、
水素原子、
ハロゲン原子、
炭素数1以上、10以下のアルキル、
環形成炭素数6以上、12以下のアリール、または
炭素数1以上、10以下のフッ化アルキルである。) - 架橋反応により、請求項1から請求項16のいずれか一項に記載の樹脂を作製できる、
ことを特徴とする樹脂前駆体組成物。 - 請求項17に記載の樹脂前駆体組成物と、有機溶剤とを含む、
ことを特徴とする塗液組成物。 - 請求項1から請求項16のいずれか一項に記載の樹脂を最外層に含む、
ことを特徴とする電子写真感光体。 - 請求項18に記載の塗液組成物を湿式成形法で導電性基体に塗布する工程と、
加熱を行うことにより、前記塗液組成物中の有機溶剤を除去する工程と、
前記有機溶剤を除去する工程における加熱と同時、または引き続き加熱を行うことにより、前記塗液組成物中の樹脂前駆体組成物の架橋反応を行う工程と、を備える、
ことを特徴とする電子写真感光体の製造方法。 - 請求項1から請求項16のいずれか一項に記載の樹脂を含む、
ことを特徴とする成形物。 - 請求項1から請求項16のいずれか一項に記載の樹脂を含む、
ことを特徴とする電子デバイス。
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