WO2021193810A1 - セラミックス回路基板、放熱部材及びアルミニウム－ダイヤモンド系複合体 - Google Patents

セラミックス回路基板、放熱部材及びアルミニウム－ダイヤモンド系複合体 Download PDF

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Publication number
WO2021193810A1
WO2021193810A1 PCT/JP2021/012500 JP2021012500W WO2021193810A1 WO 2021193810 A1 WO2021193810 A1 WO 2021193810A1 JP 2021012500 W JP2021012500 W JP 2021012500W WO 2021193810 A1 WO2021193810 A1 WO 2021193810A1
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WIPO (PCT)
Prior art keywords
aluminum
heat radiating
radiating member
marker portion
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/012500
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English (en)
French (fr)
Japanese (ja)
Inventor
大助 後藤
寛朗 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Priority to US17/791,971 priority Critical patent/US11983586B2/en
Priority to KR1020227023670A priority patent/KR20220159950A/ko
Priority to EP21776350.7A priority patent/EP4131361A4/en
Priority to CN202180010953.4A priority patent/CN115053638A/zh
Priority to JP2022510653A priority patent/JP7587570B2/ja
Publication of WO2021193810A1 publication Critical patent/WO2021193810A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/016—Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of aluminium or aluminium alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/06009—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking
    • G06K19/06037—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking multi-dimensional coding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H10W70/664—Carbon-based materials, e.g. fullerenes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B32B2264/108—Carbon, e.g. graphite particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/538—Roughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/08—Interconnection of layers by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927—Machine readable code, e.g. bar code
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H10W46/103—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols alphanumeric information, e.g. words, letters or serial numbers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H10W46/106—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols digital information, e.g. bar codes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/601—Marks applied to devices, e.g. for alignment or identification for use after dicing
    • H10W46/607—Located on parts of packages, e.g. on encapsulations or on package substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Definitions

  • the present invention relates to a ceramic circuit board, a heat radiating member, and an aluminum-diamond complex.
  • ceramic circuit boards and heat dissipation members have been used as electronic components.
  • the ceramic circuit board is mounted on the heat radiating member.
  • Various electronic elements such as Si semiconductor elements are mounted on the ceramic circuit board.
  • Patent Document 1 describes that a marker pattern is formed on a ceramic circuit board.
  • the marker pattern is formed, for example, by a laser.
  • the marker patterns are arranged in a bar code or a matrix code, for example.
  • the marker pattern indicates, for example, the model, mold characteristics, performance or size of the ceramic circuit board.
  • Patent Document 2 describes that an aluminum-diamond composite is used as a heat radiating member such as a heat sink.
  • the aluminum-diamond complex contains diamond particles and a metal containing aluminum as a main component.
  • the aluminum-diamond-based composite includes a composite portion and surface layers provided on both sides of the composite portion.
  • the surface layer is made of a metal whose main component is aluminum.
  • the members used for the electronic components for example, ceramic circuit boards, heat dissipation members or aluminum-diamond-based composites.
  • An example of an object of the present invention is to acquire information on a member used for an electronic component by a new method.
  • Other objects of the invention will become apparent from the description herein.
  • One aspect of the present invention is With a metal layer A marker portion formed on the surface of the metal layer and It is a ceramic circuit board provided with.
  • Another aspect of the present invention is It is a heat dissipation member
  • a flat aluminum-diamond complex containing diamond particles and a metal containing aluminum as a main component.
  • the aluminum-diamond complex comprises a composite portion and surface layers provided on both sides of the composite portion.
  • the surface layer is made of a material containing a metal whose main component is aluminum. It is an aluminum-diamond complex having a marker portion formed on the surface of the surface layer.
  • information on a member used for an electronic component can be obtained by a new method.
  • FIG. 1 is a cross-sectional view taken along the line AA'in FIG. It is a top view of the heat dissipation member which concerns on Embodiment 2.
  • FIG. 4 is a cross-sectional view taken along the line BB'in FIG. It is a top view of the aluminum-diamond complex which concerns on Embodiment 3.
  • FIG. 6 is a cross-sectional view taken along the line CC ′ of FIG.
  • FIG. 1 is a top view of the ceramic circuit board 100 according to the first embodiment.
  • FIG. 2 is a bottom view of the ceramic circuit board 100 shown in FIG.
  • FIG. 3 is a cross-sectional view taken along the line AA'of FIG.
  • the outline of the ceramic circuit board 100 will be described with reference to FIGS. 1 to 3.
  • the ceramic circuit board 100 includes a marker unit 150.
  • the marker portion 150 is formed on the surface of the ceramic circuit board 100. Information about the ceramic circuit board 100 can be obtained from the marker unit 150.
  • the details of the ceramic circuit board 100 will be described with reference to FIGS. 1 to 3.
  • the ceramic circuit board 100 includes a ceramic base material 110, a metal layer 120 (first metal layer 122 and second metal layer 124), and a marker portion 150.
  • the ceramic circuit board 100 (ceramic base material 110) has a first surface 102, a second surface 104, and a side surface (in the example shown in FIG. 1, the first side surface 106a, the second side surface 106b, the third side surface 106c, and the fourth side surface 106d). )have.
  • the second surface 104 is on the opposite side of the first surface 102.
  • Each side surface is between the first surface 102 and the second surface 104.
  • the second side surface 106b is on the opposite side of the first side surface 106a.
  • the third side surface 106c is between the first side surface 106a and the second side surface 106b.
  • the fourth side surface 106d is on the opposite side of the third side surface 106c.
  • the first surface 102 and the second surface 104 of the ceramic base material 110 have a substantially rectangular shape. This rectangle does not have to be a strict rectangle, and may have, for example, the sides on which the sections are formed, or may have rounded corners.
  • the first surface 102 and the second surface 104 of the ceramic base material 110 may have a shape other than a rectangle.
  • Ceramic base 110 may be, for example, AlN, and is formed by Si 3 N 4 or Al 2 O 3.
  • the thickness of the ceramic base material 110 is, for example, 0.2 mm or more and 1.5 mm or less.
  • the first metal layer 122 is located on the first surface 102 of the ceramic base material 110.
  • the second metal layer 124 is located on the second surface 104 of the ceramic base material 110.
  • the first metal layer 122 forms a metal pattern (for example, a circuit pattern). In the example shown in FIG. 1, this metal pattern includes four rectangular patterns arranged side by side. However, the metal pattern is not limited to this example.
  • the second metal layer 124 extends over almost the entire second surface 104 of the ceramic base material 110. However, the area of the second metal layer 124 is slightly smaller than the area of the second surface 104.
  • the area of the second metal layer 124 is, for example, 80% or more and 97% or less of the area of the second surface 104.
  • the ratio of the area of the first metal layer 122 to the area of the first surface 102 is smaller than the ratio of the area of the second metal layer 124 to the area of the second surface 104.
  • the metal layer 120 is formed of, for example, at least one selected from the group consisting of Cu, Al and Mo, an alloy containing Cu and Mo, and an alloy containing Cu and W.
  • the thickness of the metal layer 120 is, for example, 0.1 mm or more and 2 mm or less.
  • the surface of the metal layer 120 may be plated.
  • the plating applied to the surface of the metal layer 120 is formed of, for example, at least one selected from the group consisting of Ni, Au, Ag and Cu.
  • the marker portion 150 is formed on the surface of the first metal layer 122. However, the marker portion 150 may be formed on the surface of the second metal layer 124, or may be formed on both the surface of the first metal layer 122 and the surface of the second metal layer 124. When the surface of the metal layer 120 (first metal layer 122 or second metal layer 124) is plated, the marker portion 150 may be formed on the surface of the plating or is covered by the plating. You may.
  • the marker unit 150 shows information about the ceramic circuit board 100.
  • the information about the ceramic circuit board 100 is, for example, information including the manufacturing conditions of the ceramic circuit board 100.
  • the information including the manufacturing conditions of the ceramic circuit board 100 includes, for example, the quality or quantity of the material used for manufacturing the ceramic circuit board 100, the heating time or temperature of the ceramic circuit board 100, and the like.
  • the traceability of the ceramic circuit board 100 can be improved by acquiring information including the manufacturing conditions of the ceramic circuit board 100 from the marker unit 150.
  • the shape of the marker portion 150 is not limited to a specific shape.
  • the marker portion 150 is, for example, a one-dimensional code (bar code).
  • the marker unit 150 may be a two-dimensional code.
  • the marker unit 150 may be both a one-dimensional code and a two-dimensional code.
  • the marker unit 150 can contain a lot of information about the ceramic circuit board 100.
  • the marker unit 150 may include, for example, at least one selected from the group consisting of letters, numbers and symbols.
  • the marker portion 150 can include various structures formed on the surface of the ceramic base material 110.
  • the marker portion 150 is a recess formed on the surface of the metal layer 120 (first metal layer 122) of the ceramic base material 110.
  • the recess is formed by a laser on the surface of the metal layer 120 (first metal layer 122) of the ceramic base material 110, for example.
  • the recess may be formed by a method other than laser, for example, etching. By using the laser, equipment can be easily added to the line of continuous processes, so that the marker unit 150 can be easily added without impairing productivity by adding a new process.
  • the marker portion can be formed in a small region of 1 mm 2 or more and 100 mm 2 or less, so that the marker portion (recess) can be easily formed even in a narrow region that does not affect the performance of the product. Can be granted. As a narrow area that does not affect the performance of the product, there are places that are not used for assembly such as soldering and wire bonding. Further, if the marker portion is formed by a laser, there is almost no possibility that it will disappear in the manufacturing process, and information can be acquired even after the product has been used for a long period of time.
  • a code such as a two-dimensional code with a laser, a large amount of information can be recorded even with a small marker portion.
  • a laser for example, a recess having a width of 10 ⁇ m or more and 200 ⁇ m or less and a depth of 10 ⁇ m or more and 200 ⁇ m or less can be formed, so that a cord can be formed in a small region.
  • the recesses formed by these lasers are also useful in other embodiments.
  • the marker portion 150 may be formed of paint.
  • the paint is, for example, a solder resist and is applied, for example, by inkjet.
  • FIG. 4 is a top view of the heat radiating member 200 according to the second embodiment.
  • FIG. 5 is a cross-sectional view taken along the line BB'of FIG.
  • the heat radiating member 200 includes a first surface 202 and a second surface 204.
  • the second surface 204 is on the opposite side of the first surface 202.
  • a heat radiating fin 210 is attached to the first surface 202 via grease 212.
  • the heat radiation fin 210 mounts an electronic element (not shown) such as a Si semiconductor element on the second surface 204 via a ceramic circuit board (for example, the ceramic circuit board 100 of the first embodiment) (not shown). After the power module is formed by the heat radiating member 200, the ceramic circuit board, and the electronic element, it is attached to the first surface 202 via the grease 212.
  • the heat radiating fin 210 may be screwed to the first surface 202 of the heat radiating member 200.
  • a marker portion 250 is formed on the second surface 204. Information about the heat radiating member 200 can be obtained from the marker unit 250. Further, since the marker portion 250 is formed on the surface (second surface 204) opposite to the heat radiating fin 210, the marker portion 250 does not interfere with the heat conduction from the heat radiating member 200 to the heat radiating fin 210. There is.
  • the heat radiating member 200 has a first surface 202, a second surface 204, and side surfaces (in the example shown in FIG. 4, the first side surface 206a, the second side surface 206b, the third side surface 206c, and the fourth side surface 206d). Each side surface is between the first surface 202 and the second surface 204.
  • the second side surface 206b is on the opposite side of the first side surface 206a.
  • the third side surface 206c is between the first side surface 206a and the second side surface 206b.
  • the fourth side surface 206d is on the opposite side of the third side surface 206c.
  • the second surface 204 of the heat radiating member 200 has a substantially rectangular shape. This rectangle does not have to be a strict rectangle, and may have, for example, the sides on which the sections are formed, or may have rounded corners.
  • the second surface 204 of the heat radiating member 200 may have a shape other than a rectangle.
  • Heat dissipation member 200 may, for example, a metal of Al or Mg as a main component (for example more than 85 wt%), SiC, Si 3 N 4, Al 2 O 3, SiO 2 and at least one selected from the group consisting of AlN Metal group composite composed of, Cu and Mo or an alloy containing Cu and W (for example, Cu / Mo, Cu / W alloy), or a multilayer metal plate formed of Cu and Mo or Cu and W (Cu / Mo, Cu / W multilayer metal plate).
  • the coefficient of linear expansion of the heat radiating member 200 is, for example, 5 ⁇ 10 -6 / K or more and 9 ⁇ 10 -6 / K or less.
  • the thermal conductivity of the heat radiating member 200 is, for example, 150 W / mK or more.
  • the surfaces of the heat radiating member 200 are plated. ..
  • the plating applied to the surface of the heat radiating member 200 is formed of, for example, at least one selected from the group consisting of Ni, Au, Ag and Cu.
  • the marker portion 250 may be formed on the surface of the plating or may be covered with the plating.
  • the marker unit 250 shows information about the heat radiating member 200.
  • the information regarding the heat radiating member 200 is, for example, information including the direction of warpage of the heat radiating member 200.
  • the marker portion 250 is preferably located on the second surface 204 side. If the heat radiating member 200 is warped convexly from the first surface 202 to the second surface 204 and the heat radiating fin 210 is attached to the first surface 202, the heat radiating fin 210 can be brought into good contact with the heat radiating member 200. However, good heat dissipation by the heat dissipation fins 210 is not realized.
  • the heat radiating fin 210 is good for the heat radiating member 200. Good heat dissipation is realized by the heat dissipation fins 210.
  • the manufacturer of the electronic component can tell the opposite side of the marker portion 250. It can be determined that it is preferable that the heat radiating fin 210 is attached to the surface (that is, the first surface 202).
  • the information regarding the heat radiating member 200 is, for example, information including the manufacturing conditions of the heat radiating member 200.
  • the information including the manufacturing conditions of the heat radiating member 200 includes, for example, the quality or amount of the material used for manufacturing the heat radiating member 200, the heating time or temperature of the heat radiating member 200, and the like.
  • the traceability of the heat radiating member 200 can be improved by acquiring the information including the manufacturing conditions of the heat radiating member 200 from the marker unit 250.
  • the shape of the marker portion 250 is not limited to a specific shape.
  • the marker portion 250 is, for example, a one-dimensional code (bar code).
  • the marker portion 250 may be a two-dimensional code.
  • the marker unit 250 may be both a one-dimensional code and a two-dimensional code.
  • the marker unit 250 can include a lot of information about the heat radiating member 200.
  • the marker unit 250 may include, for example, at least one selected from the group consisting of letters, numbers and symbols.
  • the marker portion 250 can include various structures formed on the surface of the heat radiating member 200.
  • the marker portion 250 is a recess formed on the surface (second surface 204) of the heat radiating member 200.
  • the recess is formed by, for example, a laser on the surface (second surface 204) of the heat radiating member 200.
  • the recess may be formed by a method other than laser, for example, etching.
  • the marker portion 250 may be formed of paint.
  • the paint can be, for example, the same as the paint used for the marker portion 150 of the first embodiment.
  • FIG. 6 is a top view of the aluminum-diamond complex 300 according to the third embodiment.
  • FIG. 7 is a cross-sectional view taken along the line CC'of FIG.
  • the outline of the aluminum-diamond complex 300 will be described with reference to FIGS. 6 and 7.
  • the aluminum-diamond complex 300 is a flat plate containing diamond particles and a metal containing aluminum as a main component.
  • the aluminum-diamond-based composite 300 is composed of a surface layer 320 (first surface layer 322 and second surface layer 324) provided on both sides of the composite portion 310 and the composite portion 310.
  • the surface layer 320 is made of a material containing a metal containing aluminum as a main component.
  • the aluminum-diamond complex 300 includes a marker portion 350.
  • the marker portion 350 is formed on the surface of the surface layer 320. Information about the aluminum-diamond complex 300 can be obtained from the marker unit 350.
  • the aluminum-diamond complex 300 has a first surface 302, a second surface 304, and side surfaces (in the example shown in FIG. 6, the first side surface 306a, the second side surface 306b, the third side surface 306c, and the fourth side surface 306d). doing.
  • the second surface 304 is on the opposite side of the first surface 302. Each side surface is between the first surface 302 and the second surface 304.
  • the second side surface 306b is on the opposite side of the first side surface 306a.
  • the third side surface 306c is between the first side surface 306a and the second side surface 306b.
  • the fourth side surface 306d is on the opposite side of the third side surface 306c.
  • FIG. 6 The aluminum-diamond complex 300 has a first surface 302, a second surface 304, and side surfaces (in the example shown in FIG. 6, the first side surface 306a, the second side surface 306b, the third side surface 306c, and the fourth side surface 306d).
  • the first surface 302 of the aluminum-diamond complex 300 has a substantially rectangular shape. This rectangle does not have to be a strict rectangle, and may have, for example, the sides on which the sections are formed, or may have rounded corners.
  • the first surface 302 of the aluminum-diamond complex 300 may have a shape other than a rectangle.
  • the thickness of the aluminum-diamond complex 300 is, for example, 0.4 mm or more and 6 mm or less.
  • the composite unit 310 is a composite unit of diamond particles and an aluminum alloy.
  • the content of the diamond particles is, for example, 40% by volume or more and 75% by volume or less with respect to the total volume of the aluminum-diamond complex 300.
  • the aluminum alloy is a metal containing aluminum as a main component.
  • the aluminum alloy contains, for example, 75% by mass or more of aluminum with respect to the total mass of the aluminum alloy.
  • the aluminum alloy may contain 5% by mass or more and 25% by mass or less of silicon with respect to the total mass of the aluminum alloy.
  • the aluminum alloy may further contain magnesium.
  • the surface layer 320 is made of a material containing a metal containing aluminum as a main component.
  • the surface layer 320 contains, for example, 80% by volume or more of the metal with respect to the total volume of the surface layer 320.
  • the surface roughness Ra of the surface layer 320 is, for example, 1 ⁇ m or less.
  • a Ni plating layer or two layers of Ni plating and Au plating may be formed with a thickness of, for example, 0.5 ⁇ m or more and 10 ⁇ m or less.
  • the marker unit 350 shows information about the aluminum-diamond complex 300.
  • the information regarding the aluminum-diamond complex 300 is, for example, information including the production conditions of the aluminum-diamond complex 300.
  • Information including the manufacturing conditions of the aluminum-diamond composite 300 includes, for example, the quality or quantity of the material used in the manufacture of the aluminum-diamond composite 300, the heating time or temperature of the aluminum-diamond composite 300, and the like. including.
  • the traceability of the aluminum-diamond complex 300 can be improved by acquiring information including the manufacturing conditions of the aluminum-diamond complex 300 from the marker unit 350.
  • the shape of the marker portion 350 is not limited to a specific shape.
  • the marker portion 350 is, for example, a one-dimensional code (bar code).
  • the marker portion 350 may be a two-dimensional code.
  • the marker unit 350 may be both a one-dimensional code and a two-dimensional code.
  • the marker portion 350 can contain a lot of information about the aluminum-diamond-based complex 300.
  • the marker unit 350 may include, for example, at least one selected from the group consisting of letters, numbers and symbols.
  • the marker portion 350 can include various structures formed on the surface of the aluminum-diamond complex 300.
  • the marker portion 350 is a recess formed on the surface of the aluminum-diamond complex 300.
  • the recess is formed in, for example, the aluminum-diamond complex 300 by a laser.
  • the recess may be formed by a method other than laser, for example, etching.
  • the marker portion 350 may be formed of paint.
  • the paint can be, for example, the same as the paint used for the marker portion 150 of the first embodiment.
  • Ceramic circuit board 102 First surface 104 Second surface 106a First side surface 106b Second side surface 106c Third side surface 106d Fourth side surface 110 Ceramic base material 120 Metal layer 122 First metal layer 124 Second metal layer 150 Marker section 200 Marker 200 Heat dissipation member 202 Recession 202 First surface 204 Second surface 206a First side surface 206b Second side surface 206c Third side surface 206d Fourth side surface 210 Heat dissipation fin 212 Grease 250 Marker part 302 First surface 304 Second surface 306a First side surface 306b 2nd side surface 306c 3rd side surface 306d 4th side surface 310 Composite part 320 Surface layer 322 1st surface layer 324 2nd surface layer 350 Marker part

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Geometry (AREA)
PCT/JP2021/012500 2020-03-26 2021-03-25 セラミックス回路基板、放熱部材及びアルミニウム－ダイヤモンド系複合体 Ceased WO2021193810A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US17/791,971 US11983586B2 (en) 2020-03-26 2021-03-25 Ceramic circuit board, heat-dissipating member, and aluminum-diamond composite
KR1020227023670A KR20220159950A (ko) 2020-03-26 2021-03-25 세라믹스 회로 기판, 방열 부재 및 알루미늄-다이아몬드계 복합체
EP21776350.7A EP4131361A4 (en) 2020-03-26 2021-03-25 Ceramic circuit board, heat-dissipating member, and aluminum-diamond complex
CN202180010953.4A CN115053638A (zh) 2020-03-26 2021-03-25 陶瓷电路基板、散热构件及铝-金刚石系复合体
JP2022510653A JP7587570B2 (ja) 2020-03-26 2021-03-25 セラミックス回路基板、放熱部材及びアルミニウム－ダイヤモンド系複合体

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JP2020055457 2020-03-26

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WO2022109552A1 (en) * 2020-11-18 2022-05-27 Sharfi Benjamin K Diamond-based thermal cooling devices methods and materials
DE102023119620A1 (de) * 2023-07-25 2025-01-30 Rogers Germany Gmbh Verfahren zur Herstellung und/oder Handhabung eines Metall-Keramik-Substrats, ein Metall-Keramik-Substrat, eine Anlage zur Herstellung von Metall-Keramik-Substraten und Datenbank für Metall-Keramik-Substrate

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JPWO2021193810A1 (https=) 2021-09-30
US20230042932A1 (en) 2023-02-09
CN115053638A (zh) 2022-09-13
US11983586B2 (en) 2024-05-14
KR20220159950A (ko) 2022-12-05
EP4131361A1 (en) 2023-02-08
EP4131361A4 (en) 2024-02-14

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