HUE064697T2 - Eljárás fém-kerámia hordozók egyedi kódolására - Google Patents

Eljárás fém-kerámia hordozók egyedi kódolására

Info

Publication number
HUE064697T2
HUE064697T2 HUE16205606A HUE16205606A HUE064697T2 HU E064697 T2 HUE064697 T2 HU E064697T2 HU E16205606 A HUE16205606 A HU E16205606A HU E16205606 A HUE16205606 A HU E16205606A HU E064697 T2 HUE064697 T2 HU E064697T2
Authority
HU
Hungary
Prior art keywords
metal
ceramic substrates
individual encoding
encoding
individual
Prior art date
Application number
HUE16205606A
Other languages
English (en)
Inventor
Alexander Rogg
Original Assignee
Heraeus Electronics Gmbh & Co Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Electronics Gmbh & Co Kg filed Critical Heraeus Electronics Gmbh & Co Kg
Publication of HUE064697T2 publication Critical patent/HUE064697T2/hu

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F7/00—Signs, name or number plates, letters, numerals, or symbols; Panels or boards
    • G09F7/16—Letters, numerals, or other symbols adapted for permanent fixing to a support
    • G09F7/165—Letters, numerals, or other symbols adapted for permanent fixing to a support obtained by a treatment of the support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927—Machine readable code, e.g. bar code
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
HUE16205606A 2015-12-22 2016-12-21 Eljárás fém-kerámia hordozók egyedi kódolására HUE064697T2 (hu)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15201883 2015-12-22

Publications (1)

Publication Number Publication Date
HUE064697T2 true HUE064697T2 (hu) 2024-04-28

Family

ID=55023981

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE16205606A HUE064697T2 (hu) 2015-12-22 2016-12-21 Eljárás fém-kerámia hordozók egyedi kódolására

Country Status (3)

Country Link
EP (1) EP3185655B8 (hu)
CN (1) CN106910417B (hu)
HU (1) HUE064697T2 (hu)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108345173A (zh) * 2017-12-31 2018-07-31 广州美维电子有限公司 基于阻焊开窗的品质追溯码标识方法及系统
CN109033917A (zh) * 2018-06-04 2018-12-18 广州美维电子有限公司 一种pcb板及pcb板的信息追溯方法
DE102018113571B4 (de) 2018-06-07 2023-11-09 Rogers Germany Gmbh Verfahren zur Herstellung von Metall-Keramik-Substraten und Metall-Keramik-Basissubstrat
CN110582158A (zh) * 2018-06-11 2019-12-17 三赢科技（深圳）有限公司 电路板、相机模组及标记电路板的方法
CN115053638A (zh) * 2020-03-26 2022-09-13 电化株式会社 陶瓷电路基板、散热构件及铝-金刚石系复合体
DE102020111701A1 (de) 2020-04-29 2021-11-04 Rogers Germany Gmbh Trägersubstrat, Verfahren zur Herstellung eines solchen Trägersubstrats und Verfahren zum Auslesen einer Kodierung im Trägersubstrat

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3113031A1 (de) 1981-04-01 1982-10-21 Hagenuk GmbH, 2300 Kiel "handhabungsvorrichtung fuer leiterplatten"
DE3544299A1 (de) * 1985-12-14 1987-06-19 Hoechst Ag Verfahren zum herstellen eines eich- und pruefstandardelements und nach dem verfahren hergestelltes eich- und pruefstandardelement
DE19829986C1 (de) * 1998-07-04 2000-03-30 Lis Laser Imaging Systems Gmbh Verfahren zur Direktbelichtung von Leiterplattensubstraten
GB2343059A (en) 1998-10-21 2000-04-26 Jerseyfield Limited A method for tracking printed circuit boards on multi-board panels through a production process
WO2002021435A1 (en) * 2000-09-06 2002-03-14 R.T.S., Spol. S R.O. Equipment for the wireless numeric identification of metallic, namely ferromagnetic bodies
WO2003078353A1 (de) * 2002-03-13 2003-09-25 Schulz-Harder Juergen Verfahren zum herstellen eines metal-keramik-subtrats, vorzugsweise eines kupfer-keramik-substrats
CN1773450A (zh) * 2004-11-08 2006-05-17 刘荣杰 直数
KR20070010868A (ko) * 2005-07-20 2007-01-24 삼성전자주식회사 박막트랜지스터 기판의 제조방법
DE102005061049A1 (de) * 2005-12-19 2007-06-21 Curamik Electronics Gmbh Metall-Keramik-Substrat
ATE554065T1 (de) * 2006-10-04 2012-05-15 Basf Se Sulfoniumsalz-fotoinitiatoren
US8079656B2 (en) * 2006-12-22 2011-12-20 Palo Alto Research Center Incorporated Method for decimation of images
WO2008083853A1 (de) * 2007-01-10 2008-07-17 Osram Gesellschaft mit beschränkter Haftung Elektronisches bauelementmodul und verfahren zu dessen herstellung
CN101426330A (zh) * 2007-10-29 2009-05-06 英业达股份有限公司 具有条形码的电路板及其制法
US20090223435A1 (en) 2008-03-04 2009-09-10 Powertech Technology Corporation Substrate panel
JP6172966B2 (ja) * 2013-02-19 2017-08-02 シチズン時計株式会社 光学素子用基板及び光学素子パッケージの製造方法並びに光学素子用基板及び光学素子パッケージ
DE102013110291A1 (de) * 2013-03-06 2014-09-11 Heraeus Sensor Technology Gmbh Verfahren zur Herstellung eines Rußsensors mit einem Laserstrahl
CN103910536B (zh) * 2014-03-14 2015-06-03 锦州金属陶瓷有限公司 一种施釉陶瓷金属化管釉下打码标识的方法

Also Published As

Publication number Publication date
EP3185655A1 (de) 2017-06-28
CN106910417A (zh) 2017-06-30
EP3185655B1 (de) 2023-11-29
CN106910417B (zh) 2022-10-25
EP3185655B8 (de) 2024-01-03

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