WO2021193098A1 - プローブヘッド - Google Patents

プローブヘッド Download PDF

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Publication number
WO2021193098A1
WO2021193098A1 PCT/JP2021/009786 JP2021009786W WO2021193098A1 WO 2021193098 A1 WO2021193098 A1 WO 2021193098A1 JP 2021009786 W JP2021009786 W JP 2021009786W WO 2021193098 A1 WO2021193098 A1 WO 2021193098A1
Authority
WO
WIPO (PCT)
Prior art keywords
guide
guide pin
substrate
diameter
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/009786
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English (en)
French (fr)
Japanese (ja)
Inventor
岳史 軣木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokowo Co Ltd
Original Assignee
Yokowo Co Ltd
Yokowo Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokowo Co Ltd, Yokowo Mfg Co Ltd filed Critical Yokowo Co Ltd
Publication of WO2021193098A1 publication Critical patent/WO2021193098A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes

Definitions

  • the present invention relates to a probe head.
  • a probe head for electrically connecting the device to be inspected and the inspection device may be used, for example, as described in Patent Document 1.
  • the probe head is provided with a guide pin.
  • the guide pin is inserted into a guide hole formed in a substrate of an inspection device such as a wiring substrate.
  • the probe head is positioned with respect to the substrate of the inspection device.
  • the diameter of the guide hole on the board of the inspection device may vary due to tolerance.
  • the diameter of the outer wall of the guide pin is constant as in the guide pin of Patent Document 1
  • the probe head is displaced from the position where the probe contacts the pad of the substrate. May be done. In this case, the probe may not come into contact with the pad of the substrate, and the inspection device may not be able to perform an accurate inspection.
  • An example of an object of the present invention is to suppress the influence of the tolerance of the guide hole of the substrate and bring the probe into contact with the pad of the substrate.
  • the guide pin is a probe head having a tapered portion in which the diameter of the outer wall increases from one end side to the other end side of the guide pin.
  • the portion of the tapered portion having a diameter substantially equal to the diameter of the guide hole of the substrate and a diameter smaller than the diameter of the guide hole can be fitted into the opening of the guide hole of the substrate. Therefore, it is possible to suppress the influence of the tolerance of the guide hole of the substrate and bring the probe into contact with the pad of the substrate.
  • FIG. It is a figure which shows the probe head which concerns on Embodiment 1.
  • FIG. It is a figure for demonstrating the method of making a probe of the probe head which concerns on Embodiment 1 come into contact with a pad of a substrate. It is a figure for demonstrating the method of making a probe of the probe head which concerns on Embodiment 1 come into contact with a pad of a substrate. It is a figure which shows the probe head which concerns on Embodiment 2. It is a figure for demonstrating the method of making a probe of the probe head which concerns on Embodiment 2 come into contact with a pad of a substrate. It is a figure which shows the probe head which concerns on Embodiment 3.
  • FIG. 1 is a diagram showing a probe head 10A according to the first embodiment.
  • a cross section showing a cross section passing through the center of the guide hole 22 described later along the thickness direction of the substrate 20 is shown.
  • a cross section showing a cross section passing through the first mounting hole 212 and the second mounting hole 222 described later along the thickness direction of the socket 200 is shown.
  • the side surfaces of the guide pin 100 and the probe 300, which will be described later, are shown.
  • the probe head 10A includes a guide pin 100, a socket 200, and a probe 300.
  • the guide pin 100 has a first guide portion 110 and a second guide portion 120.
  • the socket 200 has a pin block 210 and a pin plate 220.
  • the pin block 210 and the pin plate 220 are overlapped in this order from the upper side to the lower side of the probe head 10A.
  • the probe 300 is inserted into the socket 200 along the vertical direction of the probe head 10A.
  • a substrate of a device to be inspected (not shown) such as a semiconductor device to be inspected by an inspection device having a substrate 20 described later is arranged above the probe head 10A.
  • the substrate 20 of the inspection device is arranged below the probe head 10A.
  • the substrate 20 is, for example, a PCB (Printed Circuit Board).
  • a guide hole 22 is formed in the substrate 20.
  • the substrate 20 has a pad 20a located on the upper surface side of the substrate 20.
  • the lower end side of the guide pin 100 is the side on which the substrate 20 is located.
  • the substrate of the device to be inspected and the substrate 20 of the inspection device are electrically connected via the probe 300.
  • the first guide portion 110 is inserted into the first mounting hole 212 formed in the pin block 210 and the second mounting hole 222 formed in the pin plate 220.
  • the first mounting hole 212 has a first hole portion 212a and a second hole portion 212b.
  • the first hole portion 212a and the second hole portion 212b are arranged in this order from the upper side to the lower side of the probe head 10A.
  • the diameter of the first hole portion 212a is smaller than the diameter of the outer edge of the flange 112 attached to the outer wall of the first guide portion 110.
  • the diameter of the second hole portion 212b is larger than the diameter of the first hole portion 212a and the diameter of the second mounting hole 222, and is equal to or larger than the diameter of the outer edge of the flange 112 of the first guide portion 110.
  • a part of the guide pin 100, specifically, the flange 112 is located in a part of the first mounting hole 212 and the second mounting hole 222, specifically in the second hole portion 212b, and is first mounted. It has a diameter larger than the diameter of each of the holes 212 and other portions of the second mounting hole 222, specifically, the diameter of the first hole 212a and the diameter of the second mounting hole 222. Therefore, the flange 112 of the first guide portion 110 can move only in the second hole portion 212b along the vertical direction of the probe head 10A.
  • the second guide portion 120 projects downward from the lower end of the first guide portion 110.
  • the diameter of the second guide portion 120 is smaller than the diameter of the first guide portion 110. Further, the diameter of the second guide portion 120 is smaller than the diameter of the guide hole 22 of the substrate 20.
  • the second guide portion 120 has a cylindrical shape. In this case, the guide pin 100 is less likely to fall when the second guide portion 120 is inserted into the guide hole 22 of the substrate 20, as compared with the case where the second guide portion 120 has a conical shape.
  • the second guide portion 120 may have a shape different from the cylindrical shape, for example, a conical shape.
  • the diameter of the outer wall of at least a part of the guide pin 100 increases from one end side to the other end side of the guide pin 100.
  • the outer wall of the guide pin 100 is provided with a first tapered portion 132 and a second tapered portion 134.
  • the guide pin 100 may not be provided with the second tapered portion 134.
  • the first tapered portion 132 is provided between the first guide portion 110 and the second guide portion 120.
  • the outer wall of the guide pin 100 in the first tapered portion 132 extends substantially linearly from the lower end side to the upper end side of the guide pin 100. However, the outer wall of the guide pin 100 in the first tapered portion 132 may expand while being curved.
  • the portion of the first tapered portion 132 having a diameter substantially equal to the diameter of the guide hole 22 and a diameter smaller than the diameter of the guide hole 22 is opened in the guide hole 22 of the substrate 20. Can be fitted. Therefore, the probe 300 can be brought into contact with the pad 20a of the substrate 20 while suppressing the influence of the tolerance of the guide hole 22 of the substrate 20.
  • the minimum value of the diameter of the outer wall of the guide pin 100 in the first tapered portion 132 is smaller than the diameter of the guide hole 22 of the substrate 20.
  • the diameter of the outer wall of the guide pin 100 in the first tapered portion 132 has a minimum value at the lowermost end of the first tapered portion 132.
  • the maximum value of the diameter of the outer wall of the guide pin 100 in the first tapered portion 132 is larger than the diameter of the guide hole 22 of the substrate 20.
  • the diameter of the outer wall of the guide pin 100 in the first tapered portion 132 has a maximum value at the uppermost end of the first tapered portion 132. Therefore, the diameter of any portion of the first tapered portion 132 can be made substantially equal to the diameter of the guide hole 22.
  • the second tapered portion 134 is provided on the upper end side of the first guide portion 110.
  • the outer wall of the guide pin 100 in the second tapered portion 134 extends substantially linearly from the upper end side to the lower end side of the guide pin 100.
  • the outer wall of the guide pin 100 in the second tapered portion 134 may be curved and widened.
  • the second tapered portion 134 is provided, when the first guide portion 110 is passed through the first mounting hole 212 of the socket 200 from the upper end side of the guide pin 100, the guide pin 100 passes through the first mounting hole 212 of the socket 200.
  • the socket 200 can be guided by the second taper portion 134 so as to be inserted into.
  • FIGS. 1 to 3 are views for explaining a method of bringing the probe 300 of the probe head 10A according to the first embodiment into contact with the pad 20a of the substrate 20. 2 and 3 show the latter part of FIG. 1 in this method.
  • the probe head 10A is arranged above the substrate 20. At this point, at least a part of the guide pin 100 overlaps with the guide hole 22 of the substrate 20 in the vertical direction of the probe head 10A.
  • the second guide portion 120 of the guide pin 100 is inserted into the guide hole 22 of the substrate 20 from the lower end side of the guide pin 100.
  • the minimum value of the diameter of the outer wall of the guide pin 100 in the first tapered portion 132 is smaller than the diameter of the guide hole 22 of the substrate 20, and the diameter of the outer wall of the guide pin 100 in the first tapered portion 132.
  • the maximum value is larger than the diameter of the guide hole 22 of the substrate 20. Therefore, the first tapered portion 132 of the guide pin 100 can be slid with respect to the opening edge of the guide hole 22 of the substrate 20 until the first tapered portion 132 is fitted into the guide hole 22 of the substrate 20.
  • the guide pin 100 can be aligned with the appropriate position of the guide hole 22, that is, the position where the pad 20a of the substrate 20 is located directly below the lower end of the probe 300.
  • the center of the guide pin 100 can be aligned with the center of the guide hole 22.
  • the probe head 10A can be guided to an appropriate position by the first tapered portion 132.
  • the socket 200 is pushed toward the substrate 20.
  • the lower end of the probe 300 comes into contact with the pad 20a of the substrate 20.
  • FIG. 4 is a diagram showing a probe head 10B according to the second embodiment.
  • the probe head 10B according to the second embodiment is the same as the probe head 10A according to the first embodiment except for the following points.
  • the guide pin 100 is removable from the socket 200. Further, the first guide portion 110 of the guide pin 100 can be passed through the second mounting hole 222 and the first mounting hole 212 of the socket 200 from the upper end side of the guide pin 100.
  • FIG. 5 is a diagram for explaining a method of bringing the probe 300 of the probe head 10B according to the second embodiment into contact with the pad 20a of the substrate 20. Further, FIG. 5 shows the latter part of FIG. 4 in this method.
  • the second guide portion 120 of the guide pin 100 is inserted into the guide hole 22 of the substrate 20.
  • the minimum value of the diameter of the outer wall of the guide pin 100 in the first tapered portion 132 is smaller than the diameter of the guide hole 22 of the substrate 20, and the diameter of the outer wall of the guide pin 100 in the first tapered portion 132.
  • the maximum value of is larger than the diameter of the guide hole 22 of the substrate 20. Therefore, the first tapered portion 132 of the guide pin 100 can be slid with respect to the opening edge of the guide hole 22 of the substrate 20 until the first tapered portion 132 is fitted into the guide hole 22 of the substrate 20.
  • the guide pin 100 is placed at an appropriate position of the guide hole 22, that is, when the socket 200 is attached to the guide pin 100 as shown in FIG. 5 described later, the pad 20a of the substrate 20 is directly below the lower end of the probe 300. Can be adjusted to the position where.
  • the first guide portion 110 of the guide pin 100 is passed through the second mounting hole 222 and the first mounting hole 212 of the socket 200 from the upper end side of the guide pin 100.
  • the socket 200 can be guided by the second tapered portion 134 so that the guide pin 100 is inserted into the second mounting hole 222 and the first mounting hole 212 of the socket 200. Further, the socket 200 is pushed toward the substrate 20.
  • the guide pin 100 is located at an appropriate position of the guide hole 22, that is, when the socket 200 is attached to the guide pin 100, the guide pin 100 is directly below the lower end of the probe 300. It can be adjusted to the position where the pad 20a of 20 is located. Therefore, the influence of the tolerance of the guide hole 22 of the substrate 20 can be suppressed so that the lower end of the probe 300 can be brought into contact with the pad 20a of the substrate 20.
  • FIG. 6 is a diagram showing a probe head 10C according to the third embodiment.
  • the probe head 10C according to the third embodiment is the same as the probe head 10A according to the first embodiment except for the following points.
  • the first tapered portion 132 of the guide pin 100 is not exposed from the lower surface of the pin plate 220 before the guide pin 100 is pushed toward the substrate 20, as will be described later with reference to FIGS. 7 and 8.
  • 7 and 8 are views for explaining a method of bringing the probe 300 of the probe head 10C according to the third embodiment into contact with the pad 20a of the substrate 20. Further, FIGS. 7 and 8 show the latter part of FIG. 6 in this method.
  • the probe head 10C is arranged above the substrate 20. At this point, at least a part of the guide pin 100 overlaps with the guide hole 22 of the substrate 20 in the vertical direction of the probe head 10C.
  • the second guide portion 120 of the guide pin 100 is inserted into the guide hole 22 of the substrate 20 from the lower end side of the second guide portion 120.
  • the guide pin 100 is pushed toward the guide hole 22 of the substrate 20 from the upper end side of the guide pin 100.
  • the first tapered portion 132 of the guide pin 100 is formed in the guide hole 22 of the substrate 20 until the first tapered portion 132 of the guide pin 100 is fitted into the guide hole 22 of the substrate 20.
  • the guide pin 100 can be aligned with the appropriate position of the guide hole 22, that is, the position where the lower end of the probe 300 comes into contact with the pad 20a of the substrate 20. Therefore, the influence of the tolerance of the guide hole 22 of the substrate 20 can be suppressed so that the lower end of the probe 300 can be brought into contact with the pad 20a of the substrate 20.
  • FIG. 9 is a diagram showing the probe head 10D according to the first modification.
  • the probe head 10D according to the first modification is the same as the probe head 10A according to the first embodiment except for the following points.
  • the guide pin 100 is urged toward the substrate 20.
  • the upper end of the guide pin 100 is attached to the socket 200 via an elastic body 140 such as a spring.
  • the upper end of the first mounting hole 212 of the pin block 210 is a closed end.
  • the upper end of the elastic body 140 is attached to this closed end of the pin block 210.
  • the upper end of the guide pin 100 is attached to the lower end of the elastic body 140.
  • the guide pin 100 when the second guide portion 120 of the guide pin 100 is passed through the guide hole 22 of the substrate 20, the guide pin 100 can be pressed toward the substrate 20 by the elastic body 140. Also in this modification, the minimum value of the diameter of the outer wall of the guide pin 100 in the first tapered portion 132 is smaller than the diameter of the guide hole 22 of the substrate 20, and the diameter of the outer wall of the guide pin 100 in the first tapered portion 132. The maximum value of is larger than the diameter of the guide hole 22 of the substrate 20. Therefore, due to the urging by the elastic body 140, the first tapered portion 132 of the guide pin 100 is attached to the opening edge of the guide hole 22 of the substrate 20 until the first tapered portion 132 is fitted into the guide hole 22 of the substrate 20. Can be slid.
  • the guide pin 100 can be aligned with the appropriate position of the guide hole 22, that is, the position where the pad 20a of the substrate 20 is located directly below the lower end of the probe 300.
  • the probe head 10D can be guided to an appropriate position by the first tapered portion 132.
  • FIG. 10 is a side view of the guide pin 100A according to the second modification.
  • the guide pin 100A according to the second modification is the same as the guide pin 100 according to the first embodiment except for the following points.
  • the substrate 20 shown in FIGS. 1 to 3 will be referred to as necessary.
  • the guide pin 100A has a first guide portion 110A and a second guide portion 120A.
  • the second guide portion 120A includes a plurality of tip portions branched from each other, that is, a first tip portion 122A and a second tip portion 124A.
  • the first tip portion 122A and the second tip portion 124A are aligned in the width direction of the guide pin 100A, that is, in a direction orthogonal to the direction between + Z and ⁇ Z.
  • the first tip portion 122A and the second tip portion 124A can be inserted into the guide hole 22 of the substrate 20, and the first tip portion 122A and the second tip portion 124A can be sandwiched between the inner side walls of the guide hole 22. Therefore, even if the diameter of the guide hole 22 of the substrate 20 varies due to the tolerance, the guide pin 100A can be adjusted to an appropriate position of the guide hole 22 so that the probe 300 comes into contact with the pad 20a of the substrate 20.
  • the distance between them increases from the tips of the first tip 122A and the second tip 124A toward the opposite side of the tips.
  • the tips of the first tip 122A and the second tip 124A are the lower ends of the first tip 122A and the second tip 124A.
  • at least a part of the first tip portion 122A and the second tip portion 124A on the opposite side of the tip is approximately the central portion of the first tip portion 122A and the second tip portion 124A.
  • the distance between the outermost edges of the first tip portion 122A and the second tip portion 124A is a distance orthogonal to the direction connecting the tips of the first tip portion 122A and the second tip portion 124A and the opposite side of the tip. It has become. Further, in the example shown in FIG. 10, the distance between the outermost edges of the first tip portion 122A and the second tip portion 124A is between the left outer edge of the first tip portion 122A and the right outer edge of the second tip portion 124A. Interval. In this case, the first tip portion 122A and the second tip portion 124A can be slid with respect to the opening edge of the guide hole 22 to insert the first tip portion 122A and the second tip portion 124A into the guide hole 22.
  • the distance between the outermost edges of the first tip portion 122A and the second tip portion 124A may be constant.
  • the minimum value of the above-mentioned interval that spreads from the lower end to the upper end side of the guide pin 100A is smaller than the diameter of the guide hole 22. Therefore, the first tip portion 122A and the second tip portion 124A can be inserted into the guide hole 22.
  • the maximum value of the above-mentioned interval that spreads from the lower end to the upper end side of the guide pin 100A is larger than the diameter of the guide hole 22. Therefore, when the first tip portion 122A and the second tip portion 124A are inserted into the guide hole 22, the first tip portion 122A and the second tip portion 124A come into contact with the inner side wall of the guide hole 22, and the first tip portion The 122A and the second tip portion 124A can be sandwiched between the inner side walls of the guide hole 22.
  • FIG. 11 is a cross-sectional view of the guide pin 100B according to the third modification.
  • FIG. 11 shows a cross section through which the screw hole 112B and the wedge hole 122B, which will be described later, pass along the vertical direction of the guide pin 100B.
  • the guide pin 100B according to the third modification is the same as the guide pin 100 according to the first embodiment except for the following points.
  • the guide pin 100B has a member that pushes the outer wall of at least a part of the first guide portion 110B from the inside of the guide pin 100B, that is, a screw portion 114B and a wedge portion 124B described later.
  • the guide pin 100B has a first guide portion 110B and a second guide portion 120B. Inside the first guide portion 110B, a screw hole 112B extending along the vertical direction of the guide pin 100B is formed. A screw portion 114B is inserted into the screw hole 112B. Inside the second guide portion 120B, a wedge hole 122B extending in the vertical direction of the guide pin 100B is formed. A wedge portion 124B is inserted into the wedge hole 122B.
  • each of the wedge hole 122B and the wedge portion 124B narrows from the upper end side to the lower end side of the second guide portion 120B. In this case, by pushing the screw portion 114B into the wedge portion 124B, the outer wall of the second guide portion 120B can be expanded by the wedge portion 124B.
  • the second guide portion 120B of the guide pin 100B is inserted into the guide hole 22 of the board 20 from the lower end side of the guide pin 100B.
  • the diameter of the outer wall of the second guide portion 120B becomes smaller than the diameter of the guide hole 22 of the substrate 20. There is. Therefore, the second guide portion 120B can be inserted into the guide hole 22 without the outer surface of the second guide portion 120B being caught on the inner surface of the guide hole 22.
  • the screw portion 114B is screwed inward along the screw hole 112B toward the lower side of the guide pin 100B. ..
  • the wedge portion 124B is pushed downward by the screw portion 114B.
  • the wedge portion 124B expands the wedge hole 122B and the diameter of the outer wall of the second guide portion 120B is increased. Therefore, the guide pin 100B can be sandwiched between the inner side walls of the guide hole 22. Therefore, even if the diameter of the guide hole 22 of the substrate 20 varies due to the tolerance, the guide pin 100B can be aligned with the appropriate position of the guide hole 22 so that the probe comes into contact with the pad 20a of the substrate 20.
  • Aspect 1-1 is Equipped with a guide pin
  • the guide pin is a probe head having a tapered portion in which the diameter of the outer wall increases from one end side to the other end side of the guide pin.
  • a portion of the tapered portion having a diameter substantially equal to the diameter of the guide hole of the substrate and a diameter smaller than the diameter of the guide hole can be fitted into the opening of the guide hole of the substrate. Therefore, it is possible to suppress the influence of the tolerance of the guide hole of the substrate and bring the probe into contact with the pad of the substrate.
  • Aspect 1-2 is The probe head according to aspect 1-1, wherein one end side of the guide pin is the side on which the substrate of the inspection device is located. According to Aspect 1-2, the probe can be brought into contact with the pad of the substrate by suppressing the influence of the tolerance of the guide hole of the substrate in the same manner as in Aspect 1-1.
  • Aspect 1-3 are The minimum value of the diameter of the tapered portion is smaller than the diameter of the guide hole of the substrate into which the guide pin is inserted.
  • Aspect 1-2 wherein the maximum value of the diameter of the tapered portion is larger than the diameter of the guide hole.
  • the diameter of any portion of the tapered portion can be made substantially equal to the diameter of the guide hole.
  • Aspect 1-4 Further provided with a socket having a mounting hole into which the guide pin is inserted. The diameter of one part of the mounting hole is wider than the diameter of the other part of the mounting hole. 13. Probe head. According to Aspect 1-4, the part of the guide pin can be moved only within the part of the mounting hole.
  • Aspect 2-1 Aspect 2-1 is Equipped with a guide pin The guide pin is a probe head having a plurality of tips branched from each other.
  • a plurality of tip portions can be inserted into the guide holes of the substrate, and the plurality of tip portions can be sandwiched between the inner side walls of the guide holes. Therefore, even if the diameter of the guide hole of the substrate varies due to the tolerance, the guide pin can be adjusted to an appropriate position of the guide hole so that the probe contacts the pad of the substrate.
  • Aspect 2-2 Aspect 2-2 The most of the plurality of tips in a direction orthogonal to the direction connecting the tip and the opposite side of the tip from the tips of the plurality of tips to at least a part of the tips opposite to the tips.
  • the probe head according to aspect 2-1 in which the distance between the outer edges increases from the tip of the plurality of tips toward the opposite side of the tip.
  • the plurality of tip portions can be inserted into the guide hole by sliding the plurality of tip portions with respect to the opening edge of the guide hole. Therefore, it is easier to insert the plurality of tip portions into the guide holes as compared with the case where the distance between the outermost edges of the plurality of tip portions is constant.
  • Aspect 2-3 The probe according to aspect 2-2, wherein the maximum value of the interval extending from the tip of the plurality of tips toward the opposite side of the tip is larger than the diameter of the guide hole into which the guide pin is inserted. The head.
  • Aspect 2-3 when a plurality of tip portions are inserted into the guide hole, the plurality of tip portions may come into contact with the inner side wall of the guide hole and sandwich the plurality of tip portions into the inner side wall of the guide hole.
  • Aspect 3-1 is Equipped with a guide pin
  • the guide pin is a probe head having a member that pushes the outer wall of at least a part of the guide pin from the inside of the guide pin.
  • the outer wall of the guide pin can be spread out to sandwich the guide pin in the inner side wall of the guide hole of the substrate.
  • the guide pin can be adjusted to an appropriate position of the guide hole so that the probe contacts the pad of the substrate.
  • the member of the guide pin is the probe head according to aspect 3-1 including a wedge portion and a screw portion for pushing the wedge portion.
  • the outer wall of the guide pin can be expanded by pushing the threaded portion into the wedge portion.
  • the diameter of the outer wall of the guide pin before the outer wall of the guide pin is expanded by the member is smaller than the diameter of the guide hole into which the guide pin is inserted.
  • the outer wall of the guide pin after inserting the guide pin into the guide hole, the outer wall of the guide pin can be expanded to sandwich the guide pin in the inner side wall of the guide hole of the substrate.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
PCT/JP2021/009786 2020-03-23 2021-03-11 プローブヘッド Ceased WO2021193098A1 (ja)

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Application Number Priority Date Filing Date Title
JP2020050842A JP7578404B2 (ja) 2020-03-23 2020-03-23 プローブヘッド
JP2020-050842 2020-03-23

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WO2021193098A1 true WO2021193098A1 (ja) 2021-09-30

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CN120720321A (zh) * 2025-09-04 2025-09-30 成都迈特航空制造有限公司 一种桶形游动自锁螺母

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