WO2021189411A1 - 覆盖膜、电路板及制造方法 - Google Patents

覆盖膜、电路板及制造方法 Download PDF

Info

Publication number
WO2021189411A1
WO2021189411A1 PCT/CN2020/081624 CN2020081624W WO2021189411A1 WO 2021189411 A1 WO2021189411 A1 WO 2021189411A1 CN 2020081624 W CN2020081624 W CN 2020081624W WO 2021189411 A1 WO2021189411 A1 WO 2021189411A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
covering
adhesive layer
thermally conductive
circuit
Prior art date
Application number
PCT/CN2020/081624
Other languages
English (en)
French (fr)
Inventor
徐筱婷
何明展
藤原胜美
沈芾云
钟福伟
Original Assignee
鹏鼎控股(深圳)股份有限公司
庆鼎精密电子（淮安）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 鹏鼎控股(深圳)股份有限公司, 庆鼎精密电子（淮安）有限公司 filed Critical 鹏鼎控股(深圳)股份有限公司
Priority to CN202080059618.9A priority Critical patent/CN114287172A/zh
Priority to PCT/CN2020/081624 priority patent/WO2021189411A1/zh
Priority to US17/637,133 priority patent/US20230038731A1/en
Priority to TW109110906A priority patent/TWI740435B/zh
Publication of WO2021189411A1 publication Critical patent/WO2021189411A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards

Definitions

  • This application relates to a cover film, a circuit board and a manufacturing method.
  • the flexible circuit boards are widely used in electronic products such as mobile phones.
  • the flexible circuit boards are usually set in direct contact with the battery shell.
  • the quality of high-frequency signal transmission will vary with The temperature increases and decreases, and the battery will accumulate a large amount of heat when used for a long time, and part of the heat is directly transmitted into the flexible circuit board, thereby affecting the transmission quality of high-frequency signals in the flexible circuit board.
  • a covering film comprising a first covering layer, a first adhesive layer, and a thermally conductive layer arranged between the first covering layer and the first adhesive layer.
  • the thermal conductivity of the thermally conductive layer is The thermal conductivity of the first covering layer is K1, the thermal conductivity of the first covering layer is K2, the thermal conductivity of the first adhesive layer is K3, and K1>K2>K3.
  • the thermally conductive layer includes a substrate and a first thermally conductive powder, and the first thermally conductive powder is dispersed in the substrate.
  • the matrix includes at least one of polyimide, epoxy resin, phenolic resin, polyether ether ketone, and polyurethane
  • the first thermally conductive powder is graphene, graphitized carbon fiber, carbon powder, nanocarbon At least one of tube or silver powder, the outer surface of the graphene or the carbon nanotube is bonded with a polar group.
  • the material of the first covering layer includes polyimide and a second thermally conductive powder
  • the second thermally conductive powder includes at least one of alumina powder, aluminum nitride powder, silicon carbide powder, and boron nitride powder kind.
  • the thickness of the first covering layer is 7.5-25 ⁇ m
  • the thickness of the first adhesive layer is 5-50 ⁇ m
  • the thickness of the thermally conductive layer is 3-15 ⁇ m.
  • a method for manufacturing a circuit board includes the steps:
  • the inner substrate includes a substrate layer, two first circuit layers arranged on two opposite surfaces of the substrate layer, and a second circuit layer arranged in the substrate layer.
  • a first covering film is disposed on one of the first circuit layers, the first covering film includes a first covering layer, a first adhesive layer and disposed on the first covering layer and the first adhesive layer
  • the thermal conductivity of the thermal conductivity layer is K1
  • the thermal conductivity of the first covering layer is K2
  • the thermal conductivity of the first adhesive layer is K3, and K1>K2>K3, the The first adhesive layer directly contacts the first circuit layer.
  • it further includes: disposing a second cover film on the other of the first circuit layer, the second cover film including a second adhesive layer disposed on the first circuit layer and A second covering layer on the second adhesive layer.
  • the method further includes: opening an opening in the first covering film, disposing a conductive adhesive layer outside the first covering layer, and filling part of the conductive adhesive layer in the opening. Further, the method further includes: arranging a steel plate outside the conductive adhesive layer, and the steel plate is electrically connected to the first circuit layer through the conductive adhesive filled in the opening.
  • a circuit board includes an inner substrate and a cover film arranged on one side of the inner substrate.
  • the inner substrate includes a base material layer, two first circuit layers arranged on two opposite surfaces of the base material layer, and a second circuit layer arranged in the base material layer.
  • the covering film includes a first covering layer, a first adhesive layer, and a thermally conductive layer disposed between the first covering layer and the first adhesive layer, and the thermal conductivity of the thermally conductive layer is K1, so The thermal conductivity of the first covering layer is K2, the thermal conductivity of the first adhesive layer is K3, and K1>K2>K3, and the first adhesive layer directly contacts the first circuit layer.
  • the circuit board provided by the present application is provided with the cover film, contacts the heat source through the first cover layer, and transfers heat from the heat source to the thermally conductive layer in the thickness direction of the cover mold, and the heat is in the thermally conductive layer It is quickly transferred along the extension direction of the cover mold to avoid local accumulation, thereby reducing the heat transferred to the first adhesive layer, and ultimately reducing the problem of signal transmission quality deterioration caused by heat absorption and heating of the circuit layer.
  • Fig. 1 is a schematic cross-sectional view of a cover film provided by the present application.
  • Fig. 2 is a schematic cross-sectional view of the inner substrate provided by the present application.
  • FIG. 3 is a schematic cross-sectional view of the inner substrate shown in FIG. 2 after being covered with a cover film.
  • Fig. 4 is a schematic cross-sectional view of a circuit board obtained by covering the inner substrate shown in Fig. 3 with another cover film.
  • FIG. 5 is a schematic cross-sectional view of a circuit board provided by another embodiment of the application.
  • the first rubber layer 20 is The first rubber layer 20.
  • the first line layer 50 is the first line layer 50
  • an embodiment of the present application provides a cover film 100.
  • the cover film 100 includes a first cover layer 10, a first adhesive layer 20, and is disposed on the first cover layer 10 and the first cover film.
  • the first covering layer 10 When in use, the first covering layer 10 is in contact with a heat source (for example, the housing of a mobile phone power supply) and transfers heat from the heat source to the thermally conductive layer 30 along the thickness direction D of the covering film 100, and the heat is in the thermally conductive layer.
  • the inner portion 30 is rapidly transferred along the extending direction of the cover film 100 to avoid local accumulation, thereby reducing the heat transferred to the first adhesive layer 20.
  • the thermally conductive layer 30 includes a substrate and a first thermally conductive powder.
  • the first thermally conductive powder is dispersed in the substrate, and the substrate is used to fill the gap between the first thermally conductive powders.
  • the first thermally conductive powder is bonded together to form a layered structure.
  • the substrate is polyimide
  • the first thermally conductive powder is at least one of graphene or carbon nanotubes.
  • the first thermally conductive powder is also It can be at least one of carbon powder, graphitized carbon fiber, silver powder, and copper powder
  • the matrix can also be at least one of epoxy resin, phenol resin, polyether ether ketone, and polyurethane.
  • the outer surface of the graphene or the carbon nanotube is bonded with a polar group (for example, an oxygen group, or an amino group formed after modification treatment), and the polar group The group is used to increase the bonding force between the thermally conductive layer 30 and the first covering layer 10 or the first adhesive layer 20.
  • a polar group for example, an oxygen group, or an amino group formed after modification treatment
  • the material of the first covering layer 10 includes polyimide and second thermally conductive powder
  • the second thermally conductive powder includes aluminum oxide powder, aluminum nitride powder, silicon carbide powder, and boron nitride powder. At least one of the second thermally conductive powder is used to enhance the thermal conductivity of the first covering layer 10, and at the same time, the second thermally conductive powder can reduce the thermal expansion coefficient of the first covering layer 10, reduce deformation, and maintain The cover film 100 is dimensionally stable.
  • the material of the first adhesive layer 20 includes epoxy resin.
  • the thickness of the first covering layer 10 is 7.5-25 ⁇ m
  • the thickness of the first adhesive layer 20 is 5-50 ⁇ m
  • the thickness of the thermally conductive layer 30 is 3-15 ⁇ m.
  • the thickness of each of the first covering layer 10, the first adhesive layer 20, and the thermally conductive layer 30 may also be in other ranges that meet requirements.
  • the present application provides a manufacturing method of the circuit board 200, including the steps:
  • the inner substrate 201 includes a substrate layer 40, two first circuit layers 50 arranged on the outside of the substrate layer 40, and A second circuit layer 60 in the material layer 40.
  • a first cover film is provided on one of the first circuit layers 50, the first cover film is the cover film 100, and the first adhesive layer 20 is directly connected to the first cover film.
  • a circuit layer 50 contacts.
  • a second cover film 70 is provided on the other first circuit layer 50 to obtain the circuit board 200, and the second cover film 70 includes the first circuit layer 50 A second adhesive layer 71 on the upper surface and a second covering layer 72 disposed on the second adhesive layer 71 to obtain the circuit board 200.
  • the material of the second adhesive layer 71 includes epoxy resin
  • the material of the second covering layer 72 includes polyimide, epoxy resin, phenolic resin, polyether ether ketone, and polyurethane. At least one.
  • step S1 the first circuit layer 50 is a ground circuit, and the second circuit layer 60 is a signal circuit.
  • step S2 further includes disposing a steel plate 80 outside the first covering layer 10, and the steel plate 80 and the first covering layer 10 pass through a conductive adhesive layer. 90 are glued together, and the steel plate 80 is used to enhance the structural strength of the circuit board 200.
  • step S2 further includes drilling an opening 91 in the cover film 100, the opening 91 connects the steel plate 80 and the first circuit layer 50, and a part of the conductive adhesive layer 90 is filled in the cover film 100.
  • the first circuit layer 50 is electrically connected to the steel plate 80, and finally a circuit board 300 is formed.
  • the present application provides a circuit board 200, including an inner substrate 201, a cover film 100 disposed on one side of the inner substrate 201, and a cover film 100 disposed on the other side of the inner substrate 201
  • the second cover film 70 wherein the inner substrate 201 includes a substrate layer 40, two first circuit layers 50 arranged outside the substrate layer 40, and one substrate layer 40
  • the second covering film 70 includes a second adhesive layer 71 arranged on the first circuit layer 50 and a second covering layer 72 arranged on the second adhesive layer;
  • the covering film 100 includes a first covering layer 10, a first adhesive layer 20, and a thermally conductive layer 30 disposed between the first covering layer 10 and the first adhesive layer 20.
  • the circuit board provided by the present application is provided with the cover film, contacts the heat source through the first cover layer, and transfers heat from the heat source to the thermally conductive layer in the thickness direction of the cover mold, and the heat is in the thermally conductive layer It is quickly transferred along the extension direction of the cover mold to avoid local accumulation, thereby reducing the heat transferred to the first adhesive layer, and ultimately reducing the problem of signal transmission quality deterioration caused by heat absorption and heating of the circuit layer.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

一种覆盖膜（100），所述覆盖膜（100）包括一第一覆盖层（10）、一第一胶层（20）及设置于第一覆盖层（10）及第一胶层（20）之间的一导热层（30），导热层（30）的导热率为K1，K1＝3～65W/m.K，第一覆盖层（10）的导热率为K2，K2＝0.02～3.0W/m.K，第一胶层（20）的导热率为K3，K3＝0.02～1.0W/m.K。一种电路板及其制造方法，设置覆盖膜（100），通过第一覆盖层（10）与热源接触并把热量由热源沿覆盖膜（100）厚度方向传递给导热层（30），该热量在导热层（30）内沿覆盖膜（100）延伸方向迅速传递，避免局部聚集，从而减少传递至第一胶层（20）的热量，最终减少线路层因吸热升温而导致的信号传输质量变差的问题。所述电路板及制造方法能够提供隔热性能优良的电路板，以降低高温对高频信号传输的不利影响。

Description

覆盖膜、电路板及制造方法 技术领域
本申请涉及一种覆盖膜、电路板及制造方法。
背景技术
柔性电路板作为高频信号传输线广泛应用在手机等电子产品中，且为节省空间及方便布线，该柔性电路板通常设置为与电池的外壳直接接触，然而，高频信号传输的质量会随着温度增加而降低，而电池在长时间使用时会聚集大量的热量，部分热量直接传入柔性电路板内，从而影响柔性电路板中高频信号的传输质量。
发明内容
有鉴于此，有必要提供一种隔热性能优良的电路板，以降低高温对高频信号传输的不利影响。
另，还有必要提供一种电路板的制作方法。
另，还有必要提供一种覆盖膜。
一种覆盖膜，所述覆盖膜包括一第一覆盖层、一第一胶层及设置于所述第一覆盖层及所述第一胶层之间的一导热层，所述导热层的导热率为K1，所述第一覆盖层的导热率为K2，所述第一胶层的导热率为K3，且K1>K2>K3。
进一步地，所述导热层包括基体及第一导热粉末，所述第一导热粉末分 散在所述基体中。
进一步地，所述基体包括聚酰亚胺、环氧树脂、酚醛树脂、聚醚醚酮及聚氨酯中的至少一种，所述第一导热粉为石墨烯、石墨化碳纤、碳粉、纳米碳管或银粉中的至少一种，所述石墨烯或所述纳米碳管的外表面键接有极性基团。
进一步地，所述第一覆盖层的材料包括聚酰亚胺及第二导热粉末，所述第二导热粉末包括氧化铝粉末、氮化铝粉末、碳化硅粉末及氮化硼粉末中的至少一种。
进一步地，所述第一覆盖层的厚度为7.5～25μm，所述第一胶层的厚度为5～50μm，所述导热层的厚度为3～15μm。
一种电路板的制造方法，包括步骤：
提供一内层基板，所述内层基板包括一基材层、设置在所述基材层相对两表面的两个第一线路层及设置在所述基材层内的一个第二线路层。
于一个所述第一线路层上设置一第一覆盖膜，所述第一覆盖膜包括一第一覆盖层、一第一胶层及设置于所述第一覆盖层及所述第一胶层之间的一导热层，所述导热层的导热率为K1，所述第一覆盖层的导热率为K2，所述第一胶层的导热率为K3，且K1>K2>K3，所述第一胶层直接与所述第一线路层接触。
进一步地，还包括：于另一所述第一线路层上设置一第二覆盖膜，所述第二覆盖膜包括设置在所述第一线路层上的一第二胶层及设置在所述第二胶层上的一第二覆盖层。
进一步地，还包括：在所述第一覆盖膜开设一开孔，在所述第一覆盖层外侧设置一导电胶层，并使部分所述导电胶层填充在所述开孔内。进一步地，还包括：在所述导电胶层外侧设置一钢板，所述钢板通过填充在开孔内的导电胶与所述第一线路层电性连接。一种电路板，包括一内层基板以及设置在所述内层基板一侧的一覆盖膜。
所述内层基板包括一基材层、设置在所述基材层相对两表面的两个第一线路层及设置在所述基材层内的一个第二线路层。
所述覆盖膜包括一第一覆盖层、一第一胶层及设置于所述第一覆盖层及所述第一胶层之间的一导热层，所述导热层的导热率为K1，所述第一覆盖层的导热率为K2，所述第一胶层的导热率为K3，且K1>K2>K3，所述第一胶层直接与所述第一线路层接触。
本申请提供的电路板通过设置所述覆盖膜，通过所述第一覆盖层与热源接触并把热量由热源沿所述覆盖模厚度方向传递给所述导热层，该热量在所述导热层内沿所述覆盖模延伸方向迅速传递，避免局部聚集，从而减少传递至第一胶层的热量，最终减少线路层因吸热升温而导致的信号传输质量变差的问题。
附图说明
图1是本申请提供的覆盖膜的截面示意图。
图2是本申请提供的内层基板的截面示意图。
图3是在图2所示的内层基板上覆盖覆盖膜后的截面示意图。
图4为在图3所示的内层基板上覆盖另一覆盖膜后得到的电路板的截面 示意图。
图5为本申请另一实施例提供的电路板的截面示意图。
主要元件符号说明
覆盖膜                                      100
第一覆盖层                                   10
第一胶层                                     20
导热层                                       30
基材层                                       40
第一线路层                                   50
第二线路层                                   60
第二覆盖膜                                   70
第二胶层                                     71
第二覆盖层                                   72
钢板                                         80
导电胶层                                     90
开孔                                         91
电路板                                       200、300
内层基板                                     201
覆盖模厚度方向                               D
如下具体实施方式将结合上述附图进一步说明本申请。
具体实施方式
下面将结合本申请实施例中的附图1-5，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例， 而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。
请参见图1，本申请实施例提供一种覆盖膜100，所述覆盖膜100包括一第一覆盖层10、一第一胶层20及设置于所述第一覆盖层10及所述第一胶层20之间的一导热层30，所述导热层的导热率为K1，K1＝3～65W/m.K，所述第一覆盖层的导热率为K2，K2＝0.02～3.0W/m.K，所述第一胶层的导热率为K3，K3＝0.02～1.0W/m.K。使用时，所述第一覆盖层10与热源(例如，手机电源的外壳)接触并把热量由热源沿所述覆盖膜100厚度方向D传递给所述导热层30，该热量在所述导热层30内沿所述覆盖膜100延伸方向迅速传递，避免局部聚集，从而减少传递至第一胶层20的热量。
在本实施例中，所述导热层30包括基体及第一导热粉末，所述第一导热粉末分散在所述基体中，所述基体用于填充在所述第一导热粉末之间的间隙同时将所述第一导热粉末粘接在一起并形成层状结构。
在本实施例中，所述基体为聚酰亚胺，所述第一导热粉为石墨烯或纳米碳管中的至少一种，在本申请的其它实施例中，所述第一导热粉还可以是碳粉、石墨化碳纤、银粉、铜粉中的至少一中，所述基体还可以是环氧树脂、酚醛树脂、聚醚醚酮及聚氨酯中的至少一种。
在本实施例中，所述石墨烯或所述纳米碳管的外表面键接有极性基团(例如氧基团，还可以是经改性处理后形成的氨基等)，所述极性基团用以增加所述导热层30与所述第一覆盖层10或所述第一胶层20之间的结合力。
在本实施例中，所述第一覆盖层10的材料包括聚酰亚胺及第二导热粉末，所述第二导热粉末包括氧化铝粉末、氮化铝粉末、碳化硅粉末及氮化硼粉末中的至少一种，所述第二导热粉末用于增强所述第一覆盖层10的导热性能，同时所述第二导热粉末可以降低所述第一覆盖层10的热膨胀系数，减少形变，维持所述覆盖膜100的尺寸稳定。
在本实施例中，所述第一胶层20的材料包括环氧树脂。
在本实施例中，所述第一覆盖层10的厚度为7.5～25μm，所述第一胶层20的厚度为5～50μm，所述导热层30的厚度为3～15μm。在本申请的其他实施例中，所述第一覆盖层10、所述第一胶层20及所述导热层30各自的厚度还可以是满足需求的其它范围。
本申请提供一种电路板200的制造方法，包括步骤：
S1:请参见图2，提供一内层基板201，所述内层基板201包括一基材层40、设置在所述基材层40外侧的两个第一线路层50及设置在所述基材层40内的一个第二线路层60。
S2:请参见图3，于一个所述第一线路层50上设置一第一覆盖膜，所述第一覆盖膜为所述覆盖膜100，且所述第一胶层20直接与所述第一线路层50接触。
S3:请参见图4，于另一所述第一线路层50上设置一第二覆盖膜70以得 到所述电路板200，所述第二覆盖膜70包括设置在所述第一线路层50上的一第二胶层71及设置在所述第二胶层71上的一第二覆盖层72，从而得到所述电路板200。
在本实施例中，所述第二胶层71的材料包括环氧树脂，所述第二覆盖层72的材料包括聚酰亚胺、环氧树脂、酚醛树脂、聚醚醚酮及聚氨酯中的至少一种。
在本申请的实施例中，步骤S1中，所述第一线路层50为接地线路，所述第二线路层60为信号线路。
在本申请的另一实施例中，请参见图5，步骤S2还包括在所述第一覆盖层10外侧设置一钢板80，所述钢板80及所述第一覆盖层10通过一导电胶层90粘连在一起，所述钢板80用于增强所述电路板200的结构强度。
进一步地，步骤S2还包括在所述覆盖膜100上钻取一开孔91，所述开孔91连通所述钢板80与所述第一线路层50，部分所述导电胶层90填充在所述开孔91内以使得所述第一线路层50与所述钢板80电性连接，最终形成一电路板300。通过将所述第一线路层50与所述钢板80电性连接可以满足阻抗匹配及避免此叠构下所衍生产生的讯号抖动。
请参见图4，本申请提供一种电路板200，包括一内层基板201，设置在所述内层基板201一侧的一覆盖膜100以及设置在所述内层基板201另一侧的一第二覆盖膜70，其中，所述内层基板201包括一基材层40、设置在所述基材层40外侧的两个第一线路层50及设置在所述基材层40内的一个第二线路层60；
所述第二覆盖膜70包括设置在所述第一线路层50上的一第二胶层71及设置在所述第二胶层上的一第二覆盖层72；
所述覆盖膜100包括一第一覆盖层10、一第一胶层20及设置于所述第一覆盖层10及所述第一胶层20之间的一导热层30，所述导热层的导热率为K1，K1＝3～65W/m.K，所述第一覆盖层的导热率为K2，K2＝0.02～3.0W/m.K，所述第一胶层的导热率为K3，K3＝0.02～1.0W/m.K，所述第一胶层20直接与所述第一线路层50接触。
本申请提供的电路板通过设置所述覆盖膜，通过所述第一覆盖层与热源接触并把热量由热源沿所述覆盖模厚度方向传递给所述导热层，该热量在所述导热层内沿所述覆盖模延伸方向迅速传递，避免局部聚集，从而减少传递至第一胶层的热量，最终减少线路层因吸热升温而导致的信号传输质量变差的问题。
以上所述，仅是本申请的较佳实施方式而已，并非对本申请任何形式上的限制，虽然本申请已是较佳实施方式揭露如上，并非用以限定本申请，任何熟悉本专业的技术人员，在不脱离本申请技术方案范围内，当可利用上述揭示的技术内容做出些许更动或修饰为等同变化的等效实施方式，但凡是未脱离本申请技术方案内容，依据本申请的技术实质对以上实施方式所做的任何简单修改、等同变化与修饰，均仍属于本申请技术方案的范围内。

Claims (10)

  1. 一种覆盖膜，所述覆盖膜包括一第一覆盖层、一第一胶层及设置于所述第一覆盖层及所述第一胶层之间的一导热层，所述导热层的导热率为K1，K1＝3～65W/m.K，所述第一覆盖层的导热率为K2，K2＝0.02～3.0W/m.K，所述第一胶层的导热率为K3，K3＝0.02～1.0W/m.K。
  2. 如权利要求1所述的覆盖膜，其特征在于，所述导热层包括基体及第一导热粉末，所述第一导热粉末分散在所述基体中。
  3. 如权利要求2所述的覆盖膜，其特征在于，所述基体包括聚酰亚胺、环氧树脂、酚醛树脂、聚醚醚酮及聚氨酯中的至少一种，所述第一导热粉为石墨烯、石墨化碳纤、碳粉、纳米碳管或银粉中的至少一种，所述石墨烯或所述纳米碳管的外表面键接有极性基团。
  4. 如权利要求1所述的覆盖膜，其特征在于，所述第一覆盖层的材料包括聚酰亚胺及第二导热粉末，所述第二导热粉末包括氧化铝粉末、氮化铝粉末、碳化硅粉末及氮化硼粉末中的至少一种。
  5. 如权利要求1所述覆盖膜，其特征在于，所述第一覆盖层的厚度为7.5～25μm，所述第一胶层的厚度为5～50μm，所述导热层的厚度为3～15μm。
  6. 一种电路板的制造方法，包括步骤：
    提供一内层基板，所述内层基板包括一基材层、设置在所述基材层相对两表面的两个第一线路层及设置在所述基材层内的一个第二线路层；及
    于一个所述第一线路层上设置一第一覆盖膜，所述第一覆盖膜包括一第一覆盖层、一第一胶层及设置于所述第一覆盖层及所述第一胶层之间的一导 热层，所述导热层的导热率为K1，K1＝3～65W/m.K，所述第一覆盖层的导热率为K2，K2＝0.02～3.0W/m.K，所述第一胶层的导热率为K3，K3＝0.02～1.0W/m.K，所述第一胶层直接与所述第一线路层接触。
  7. 如权利要求6所述的电路板的制造方法，其特征在于，还包括：
    于另一所述第一线路层上设置一第二覆盖膜，所述第二覆盖膜包括设置在所述第一线路层上的一第二胶层及设置在所述第二胶层上的一第二覆盖层。
  8. 如权利要求6所述的电路板的制造方法，其特征在于，还包括：在所述第一覆盖层外侧设置一钢板，所述钢板及所述第一覆盖层通过一导电胶层粘连在一起。
  9. 如权利要求8所述的电路板的制造方法，其特征在于，还包括：
    在所述第一覆盖膜中开设一开孔，所述开孔连通所述钢板与所述第一线路层，并使部分所述导电胶层填充在所述开孔内以使得所述第一线路层与所述钢板电性连接。
  10. 一种电路板，其特征在于，包括一内层基板以及设置在所述内层基板一侧的一覆盖膜；
    所述内层基板包括一基材层、设置在所述基材层相对两表面的两个第一线路层及设置在所述基材层内的一个第二线路层；
    所述覆盖膜包括一第一覆盖层、一第一胶层及设置于所述第一覆盖层及所述第一胶层之间的一导热层，所述导热层的导热率为K1，K1＝3～65W/m.K，所述第一覆盖层的导热率为K2，K2＝0.02～3.0W/m.K，所述第一胶层的导热 率为K3，K3＝0.02～1.0W/m.K，所述第一胶层直接与所述第一线路层接触。
PCT/CN2020/081624 2020-03-27 2020-03-27 覆盖膜、电路板及制造方法 WO2021189411A1 (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202080059618.9A CN114287172A (zh) 2020-03-27 2020-03-27 覆盖膜、电路板及制造方法
PCT/CN2020/081624 WO2021189411A1 (zh) 2020-03-27 2020-03-27 覆盖膜、电路板及制造方法
US17/637,133 US20230038731A1 (en) 2020-03-27 2020-03-27 Covering film, and circuit board and manufacturing method
TW109110906A TWI740435B (zh) 2020-03-27 2020-03-30 覆蓋膜、電路板及製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/081624 WO2021189411A1 (zh) 2020-03-27 2020-03-27 覆盖膜、电路板及制造方法

Publications (1)

Publication Number Publication Date
WO2021189411A1 true WO2021189411A1 (zh) 2021-09-30

Family

ID=77889850

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/081624 WO2021189411A1 (zh) 2020-03-27 2020-03-27 覆盖膜、电路板及制造方法

Country Status (4)

Country Link
US (1) US20230038731A1 (zh)
CN (1) CN114287172A (zh)
TW (1) TWI740435B (zh)
WO (1) WO2021189411A1 (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102118916A (zh) * 2009-12-30 2011-07-06 昆山雅森电子材料科技有限公司 导热覆盖膜
CN202319173U (zh) * 2011-11-11 2012-07-11 松扬电子材料(昆山)有限公司 有色导热覆盖膜
CN204047017U (zh) * 2014-09-26 2014-12-24 络派模切（北京）有限公司 一种导热垫
CN106142777A (zh) * 2015-03-31 2016-11-23 李少帅 一种聚酰亚胺高散热覆盖膜
US20180328677A1 (en) * 2016-09-06 2018-11-15 The Goodsystem Corp. Heat-dissipating plate for high-power element

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8916278B2 (en) * 2009-08-12 2014-12-23 Samsung Sdi Co., Ltd. Heat transfer member for battery pack
KR100961272B1 (ko) * 2009-12-17 2010-06-03 주식회사 플렉스컴 연성회로기판의 부품 실장구조 및 그 실장방법
JP2013159097A (ja) * 2012-02-08 2013-08-19 Sekisui Chem Co Ltd 積層構造体
BR112019020435A2 (pt) * 2017-04-05 2020-04-22 Milliken & Co tecido de malha de múltiplas camadas e artigo de vestuário compreendendo o tecido de malha de múltiplas camadas
JP2020009817A (ja) * 2018-07-03 2020-01-16 Nok株式会社 熱伝導シート
CN209322776U (zh) * 2018-12-29 2019-08-30 昆山市中迪新材料技术有限公司 多层结构导热硅橡胶及电子元器件

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102118916A (zh) * 2009-12-30 2011-07-06 昆山雅森电子材料科技有限公司 导热覆盖膜
CN202319173U (zh) * 2011-11-11 2012-07-11 松扬电子材料(昆山)有限公司 有色导热覆盖膜
CN204047017U (zh) * 2014-09-26 2014-12-24 络派模切（北京）有限公司 一种导热垫
CN106142777A (zh) * 2015-03-31 2016-11-23 李少帅 一种聚酰亚胺高散热覆盖膜
US20180328677A1 (en) * 2016-09-06 2018-11-15 The Goodsystem Corp. Heat-dissipating plate for high-power element

Also Published As

Publication number Publication date
TW202137833A (zh) 2021-10-01
CN114287172A (zh) 2022-04-05
TWI740435B (zh) 2021-09-21
US20230038731A1 (en) 2023-02-09

Similar Documents

Publication Publication Date Title
TW580854B (en) Method for cooling electronic components and thermally conductive sheet for use therewith
JP4261713B2 (ja) 熱伝導基板とその製造方法
WO2022007274A1 (zh) 一种电路板及其制作方法
EP4152376A1 (en) Chip encapsulation structure and electronic device
JPH1154939A (ja) 配線基板
CN113129761A (zh) 显示模组和显示装置
WO2021189411A1 (zh) 覆盖膜、电路板及制造方法
CN206371003U (zh) 高导热柔性印制电路板
CN111182741A (zh) 柔性电路板及其制作方法
TWI805098B (zh) 薄膜覆晶封裝結構和電子設備
JP4075481B2 (ja) 金属−グラファイトシート複合体および電子機器
JP3659336B2 (ja) 半導体素子収納用パッケージ
US11665859B2 (en) Heat dissipation conductive flexible board
CN106273883B (zh) 一种石墨层压结构及其制备方法
WO2022252453A1 (zh) 一种埋入式元件电路板及其制做方法和电子装置
JP4454164B2 (ja) 半導体素子収納用パッケージ
JP3554304B2 (ja) 半導体素子収納用パッケージおよび半導体装置
CN107743339A (zh) 一种柔性电路板及其制造方法
CN215577411U (zh) 显示模组和显示装置
CN213403615U (zh) 一种复合式散热电路主板
US20230382076A1 (en) Substrate
CN211880703U (zh) 一种5g高频高速四层挠性电路板
JP2011166029A (ja) 配線基板、それを用いた電子装置、及び配線基板の製造方法
US11553602B2 (en) Method for manufacturing circuit board with heat dissipation function
CN212086769U (zh) 一种导热胶片结构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20927109

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20927109

Country of ref document: EP

Kind code of ref document: A1