WO2021184486A1 - 一种显示面板及制程方法 - Google Patents

一种显示面板及制程方法 Download PDF

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Publication number
WO2021184486A1
WO2021184486A1 PCT/CN2020/086320 CN2020086320W WO2021184486A1 WO 2021184486 A1 WO2021184486 A1 WO 2021184486A1 CN 2020086320 W CN2020086320 W CN 2020086320W WO 2021184486 A1 WO2021184486 A1 WO 2021184486A1
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WO
WIPO (PCT)
Prior art keywords
layer
display panel
metal layer
away
light
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PCT/CN2020/086320
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English (en)
French (fr)
Inventor
王俊
唐甲
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深圳市华星光电半导体显示技术有限公司
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Publication of WO2021184486A1 publication Critical patent/WO2021184486A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks

Definitions

  • This application relates to the field of panel manufacturing technology, and in particular to a display panel and a manufacturing process method.
  • the ink flows after printing to the pixel area, so it is easy to climb up on the edge of the pixel definition layer, causing the phenomenon of fluid accumulation.
  • the accumulation of fluid will cause uneven film thickness of the display panel device, thereby causing the luminous effect of the entire display panel device to deteriorate.
  • the embodiment of the present application provides a display panel and a manufacturing method. In order to solve the problem of the deterioration of the light emitting effect of the display panel device.
  • the embodiment of the present application provides a display panel and a manufacturing method.
  • the luminous effect of the display panel can be improved.
  • An embodiment of the present application provides a display panel, including:
  • An anode layer the anode layer has a first surface and a second surface that are opposed to each other;
  • a metal layer, the metal layer is arranged on the first surface, and a side of the metal layer away from the anode layer is provided with an accommodation space;
  • a pixel definition layer is arranged on a side of the metal layer away from the anode layer, and an opening is provided on the side of the pixel definition layer away from the metal layer;
  • a light-emitting layer, the light-emitting layer is arranged in the containing space;
  • the accommodating space communicates with the opening, and the accommodating space extends to the pixel definition layer on both sides of the opening, so that a side of the pixel definition layer close to the metal layer is formed between the metal layer gap.
  • the material used for the metal layer is aluminum.
  • the light-emitting layer is formed into the receiving space by inkjet printing.
  • a planarization layer is further included, and the planarization layer is disposed on a side of the anode layer away from the metal layer.
  • it further includes a thin film transistor layer and a glass substrate, the thin film transistor layer is disposed on the side of the planarization layer away from the anode layer, and the glass substrate is disposed on the thin film transistor layer away from the anode layer.
  • the planarization layer is disposed on the side of the planarization layer away from the anode layer
  • the glass substrate is disposed on the thin film transistor layer away from the anode layer.
  • the anode layer includes a first transparent conductive film, a silver layer, and a second transparent conductive film, the first transparent conductive film is disposed on a side close to the metal layer, and the silver layer is disposed on The first transparent conductive film is on a side away from the metal layer, and the second transparent conductive film is disposed on a side of the silver layer away from the first transparent conductive film.
  • the metal layer is provided with a groove, and the groove forms the receiving space.
  • the metal layer is provided with a through hole, and the through hole and the anode layer form the accommodating space.
  • the opening gradually increases from a side close to the light-emitting layer to a side far away from the light-emitting layer.
  • the light-emitting layer is formed to the anode layer and is located in the through hole.
  • An embodiment of the present application also provides a manufacturing method of a display panel, including:
  • anode layer having a first surface and a second surface opposite to each other;
  • a metal layer is provided on the first surface
  • a pixel definition layer is provided on the side of the metal layer away from the anode layer, and an opening is provided on the side of the pixel definition layer away from the metal layer;
  • An accommodating space is provided on the side of the metal layer away from the anode layer, the accommodating space is connected to the opening, and the accommodating space extends to the pixel definition layer on both sides of the opening, so that the pixel definition layer A gap is formed between the side close to the metal layer and the metal layer;
  • the light-emitting layer is placed in the receiving space.
  • the material used for the metal layer is aluminum.
  • the light-emitting layer is formed into the receiving space by inkjet printing.
  • a planarization layer is provided on the side of the anode layer away from the metal layer.
  • a thin film transistor layer is provided on the side of the planarization layer away from the anode layer, and a glass substrate is provided on the side of the thin film transistor layer away from the planarization layer.
  • the anode layer includes a first transparent conductive film, a silver layer, and a second transparent conductive film, the first transparent conductive film is disposed on a side close to the metal layer, and the silver layer is disposed on The first transparent conductive film is on a side away from the metal layer, and the second transparent conductive film is disposed on a side of the silver layer away from the first transparent conductive film.
  • the metal layer is provided with a groove, and the groove forms the receiving space.
  • the metal layer is provided with a through hole, and the through hole and the anode layer form the accommodating space.
  • the opening gradually increases from a side close to the light-emitting layer to a side far away from the light-emitting layer.
  • the light-emitting layer is formed to the anode layer and is located in the through hole.
  • the embodiments of the present application provide a display panel and a manufacturing method.
  • the display panel includes an anode layer, a metal layer, a pixel definition layer, and a light-emitting layer.
  • On the first surface an accommodation space is provided on the side of the metal layer away from the anode layer, the pixel defining layer is provided on the side of the metal layer away from the anode layer, and the pixel defining layer is away from the anode layer.
  • One side of the metal layer is provided with an opening, and the light-emitting layer is disposed in the accommodating space, wherein the accommodating space is in communication with the opening, and the accommodating space extends to the pixel definition layers on both sides of the opening, so that A gap is formed between a side of the pixel definition layer close to the metal layer and the metal layer. Since the accommodating space extends to the pixel defining layer on both sides of the opening, a gap is formed between the side of the pixel defining layer close to the metal layer and the metal layer.
  • the fluid The light-emitting layer will flow to the gaps at both ends of the groove, so that no fluid stack is formed at the edge of the light-emitting layer located in the opening, so that the devices of the display panel are stacked uniformly and the light-emitting effect of the display panel is improved.
  • FIG. 1 is a schematic diagram of the structure of a display panel provided by an embodiment of the application.
  • FIG. 2 is a schematic structural diagram of another display panel provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of another display panel structure provided by an embodiment of the application.
  • FIG. 4 is a schematic flowchart of a manufacturing method of a display panel provided by an embodiment of the application.
  • FIG. 5 is a schematic flowchart of another method for manufacturing a display panel provided by an embodiment of the application.
  • a display panel and a manufacturing method are provided.
  • the display panel of the embodiment of the present application will be described in detail below.
  • FIG. 1 is a schematic structural diagram of a display panel provided by an embodiment of the application.
  • an embodiment of the present application provides a display panel 100.
  • the display panel 100 includes an anode layer 10, a metal layer 20, a pixel definition layer 30, and a light-emitting layer 40.
  • the anode layer 10 has a first surface 10a and a first surface 10a and On the two sides 10b, the metal layer 20 is provided on the first side 10a, the side of the metal layer 20 away from the anode layer 10 is provided with an accommodation space 50, and the pixel definition layer 30 is provided on the metal layer 20
  • the side far away from the anode layer 10, the side of the pixel definition layer 30 away from the metal layer 20 is provided with an opening 31, and the light-emitting layer 40 is disposed in the receiving space 50, wherein the receiving space 50 and The opening 31 is connected, and the accommodating space 50 extends to the pixel definition layer 30 on both sides of the opening 31, so that the pixel definition layer 30 is formed between the side of the pixel definition layer 30 that is close to the metal layer 20 and the metal layer 20. Gap 51.
  • first surface 10 a may be the upper surface of the anode layer 10, and the second surface 10 b may be the lower surface of the anode layer 10.
  • first surface 10 a may also be the lower surface of the anode layer 10, and the second surface 10 b may be the upper surface of the anode layer 10.
  • the default is that the first surface 10a is the upper surface of the anode layer 10, and the second surface 10b is the lower surface of the anode layer 10 by default.
  • the metal layer 20 can use a variety of metal materials, such as aluminum, silver and other materials.
  • an accommodating space 50 is provided on the metal layer 20, and the accommodating space 50 is a space hollowed out on the metal layer 20, and the luminous layer 40 is accommodated through the accommodating space 50.
  • the pixel definition layer 30 is provided with an opening 31, and the light-emitting layer 40 can emit light through the opening 31.
  • the accommodating space 50 extends to the pixel defining layer 30 on both sides of the opening 31, a gap 51 is formed between the side of the pixel defining layer 30 close to the metal layer 20 and the metal layer 20, and the light emitting layer 40
  • the light-emitting layer 40 formed by the fluid will flow to the notches 51 at both ends of the groove, so that no fluid stack is formed at the edge of the light-emitting layer 40 located in the opening 31, so that the devices of the display panel 100 are stacked.
  • the light emitting angle of the light emitting layer 40 will not be blocked in this way. Therefore, the aperture 31 ratio of the display panel 100 can be increased, thereby improving the light emitting effect of the display panel 100.
  • the material used for the metal layer 20 is aluminum.
  • the metal layer 20 can also be made of other metal materials. It will not be repeated in the embodiments of this application.
  • the light-emitting layer 40 is formed into the containing space 50 by inkjet printing.
  • the light emitting layer 40 is formed into the accommodation space 50 by inkjet printing. This can improve the formation efficiency of the light-emitting layer 40.
  • FIG. 2 is a schematic structural diagram of another display panel provided by an embodiment of the application.
  • the display panel 100 further includes a planarization layer 60, and the planarization layer 60 is disposed on the side of the anode layer 10 away from the metal layer 20.
  • the display panel 100 further includes a thin film transistor layer 70 and a glass substrate 80, the thin film transistor layer 70 is disposed on the side of the planarization layer 60 away from the anode layer 10, and the glass substrate 80 is disposed on the thin film.
  • the transistor layer 70 is away from the side of the planarization layer 60.
  • the anode layer 10 includes a first transparent conductive film 11, a silver layer 12, and a second transparent conductive film 13.
  • the first transparent conductive film 11 is disposed on a side close to the metal layer 20, and the silver layer 12 is arranged on the side of the first transparent conductive film 11 away from the metal layer 20, and the second transparent conductive film 13 is arranged on the side of the silver layer 12 away from the first transparent conductive film 11.
  • the metal layer 20 is provided with a groove, and the groove forms the accommodating space 50.
  • the metal layer 20 is provided with a through hole, and the through hole and the anode layer 10 form the accommodating space 50.
  • the light-emitting layer 40 will be formed to the anode layer 10 and located in the through hole.
  • the opening 31 gradually increases from a side close to the light-emitting layer 40 to a side far away from the light-emitting layer 40. In this way, the ratio of the opening 31 can be increased, and the display effect can be improved.
  • the display panel 100 provided by the embodiment of the present application includes an anode layer 10, a metal layer 20, a pixel definition layer 30, and a light-emitting layer 40.
  • the anode layer 10 has a first surface 10a and a second surface 10b that are opposed to each other.
  • the pixel definition layer 30 is arranged on the side of the metal layer 20 away from the anode layer 10 ,
  • the pixel defining layer 30 is provided with an opening 31 on a side away from the metal layer 20, and the light-emitting layer 40 is disposed in the containing space 50, wherein the containing space 50 is in communication with the opening 31, and the
  • the accommodating space 50 extends to the pixel defining layer 30 on both sides of the opening 31, so that a gap 51 is formed between the side of the pixel defining layer 30 close to the metal layer 20 and the metal layer 20.
  • the accommodating space 50 extends to the pixel defining layer 30 on both sides of the opening 31, a gap 51 is formed between the side of the pixel defining layer 30 close to the metal layer 20 and the metal layer 20, and the light emitting layer 40
  • the light-emitting layer 40 formed by the fluid will flow to the notches 51 at both ends of the groove, so that no fluid stack is formed at the edge of the light-emitting layer 40 located in the opening 31, so that the devices of the display panel 100 are stacked. Evenly, the luminous effect of the display panel 100 is improved.
  • FIG. 4 is a schematic flow chart of a manufacturing method of a display panel provided by an embodiment of the application.
  • the manufacturing method of the display panel of the embodiment of the present application includes the following steps:
  • An anode layer is provided, and the anode layer has a first surface and a second surface opposite to each other.
  • first surface may be the upper surface of the anode layer
  • second surface may be the lower surface of the anode layer
  • first surface may also be the lower surface of the anode layer
  • second surface may be the upper surface of the anode layer
  • a metal layer is provided on the first surface.
  • the metal layer can use a variety of metal materials, such as aluminum, silver and other materials.
  • a pixel definition layer is provided on the side of the metal layer away from the anode layer, and an opening is provided on the side of the pixel definition layer away from the metal layer.
  • the pixel definition layer is provided with an opening, and the light-emitting layer can emit light through the opening.
  • An accommodating space is provided on the side of the metal layer away from the anode layer, the accommodating space communicates with the opening, and the accommodating space extends to the pixel definition layer on both sides of the opening, so that the pixel A gap is formed between the side of the definition layer close to the metal layer and the metal layer.
  • the embodiment of the application adopts the above-mentioned method, because the accommodating space extends to the pixel definition layer on both sides of the opening, so that a gap is formed between the side of the pixel definition layer close to the metal layer and the metal layer, and the light emitting layer
  • the light-emitting layer formed by the fluid will flow to the gaps at both ends of the groove, so that no fluid stack is formed at the edge of the light-emitting layer located in the opening, so that the devices of the display panel are stacked uniformly.
  • the light-emitting angle of the light-emitting layer is blocked, and therefore, the aperture ratio of the display panel can be increased, thereby improving the light-emitting effect of the display panel.
  • FIG. 5 is a schematic flowchart of another method for manufacturing a display panel according to an embodiment of the application.
  • the manufacturing method of the display panel of the embodiment of the present application includes the following steps:
  • a planarization layer is provided on the thin film transistor layer.
  • An aluminum layer is provided on the first transparent conductive film.
  • a pixel definition layer is provided on the aluminum layer, and an opening is opened on the pixel definition layer.
  • An accommodating space is provided on the side of the aluminum layer away from the anode layer, the accommodating space is connected to the opening, and the accommodating space extends to the pixel defining layer on both sides of the opening, so that the pixel A gap is formed between the side of the definition layer close to the aluminum layer and the aluminum layer.
  • the accommodation space is formed by etching.
  • the light-emitting layer is placed in the containing space through this inkjet printing method.
  • the "upper” or “lower” of the first feature of the second feature may include direct contact between the first feature and the second feature, or may include the first feature.
  • the first and second features are not in direct contact but through another feature between them.
  • the "above”, “above” and “above” of the first feature on the second feature include the first feature directly above and obliquely above the second feature, or it simply means that the first feature is higher in level than the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • the embodiment of the present application adopts the above-mentioned method. Since the accommodating space extends to the pixel definition layer on both sides of the opening, a gap is formed between the side of the pixel definition layer close to the aluminum layer and the aluminum layer, and the light-emitting layer When set in the containing space, the light-emitting layer formed by the fluid will flow to the gaps at both ends of the groove, so that no fluid stack is formed at the edge of the light-emitting layer located in the opening, so that the devices of the display panel are stacked uniformly. The light-emitting angle of the light-emitting layer is blocked, and therefore, the aperture ratio of the display panel can be increased, thereby improving the light-emitting effect of the display panel.

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Abstract

本申请实施例提供一种显示面板及制程方法，显示面板的阳极层具有相对设置的第一面和第二面，金属层设置在第一面，金属层远离阳极层的一面设有容纳空间，像素定义层设置在金属层远离阳极层的一面，像素定义层远离金属层的一面设有开口，发光层设置在容纳空间内，其中，容纳空间与开口连通，容纳空间向开口两侧的像素定义层延伸，以使得所述像素定义层靠近金属层的一面与金属层之间形成缺口。本申请可以提高显示面板发光效果。

Description

一种显示面板及制程方法 技术领域
本申请涉及面板制造技术领域，特别涉及一种显示面板及制程方法。
 背景技术
喷墨打印显示面板的技术中墨水打印到像素区后是流动的，因此容易在像素定义层的边缘爬高，造成流体堆积的现象。流体堆积会导致显示面板器件膜厚不均，从而导致整个显示面板器件的发光效果变差。
因此，提供一种能够提高发光效果的显示面板成为本领域技术人员亟待解决的技术问题。
 技术问题
本申请实施例提供一种显示面板及制程方法。以解决在显示面板器件的发光效果变差的问题。
 技术解决方案
本申请实施例提供一种显示面板及制程方法。可以提高显示面板发光效果。
本申请实施例提供一种显示面板，包括：
阳极层，所述阳极层具有相对设置的第一面和第二面；
金属层，所述金属层设置在所述第一面，所述金属层远离所述阳极层的一面设有容纳空间；
像素定义层，所述像素定义层设置在所述金属层远离所述阳极层的一面，所述像素定义层远离所述金属层的一面设有开口；
发光层，所述发光层设置在所述容纳空间内；
其中，所述容纳空间与所述开口连通，所述容纳空间向所述开口两侧的像素定义层延伸，以使得所述像素定义层靠近所述金属层的一面与所述金属层之间形成缺口。
在一些实施例中，所述金属层采用的材料为铝。
在一些实施例中，所述发光层通过喷墨打印形成到所述容纳空间内。
在一些实施例中，还包括平坦化层，所述平坦化层设置在所述阳极层远离所述金属层的一面。
在一些实施例中，还包括薄膜晶体管层和玻璃基板，所述薄膜晶体管层设置在所述平坦化层远离所述阳极层的一侧，所述玻璃基板设置在所述薄膜晶体管层远离所述平坦化层的一侧。
在一些实施例中，所述阳极层包括第一透明导电薄膜、银层以及第二透明导电薄膜，所述第一透明导电薄膜设置在靠近所述金属层的一侧，所述银层设置在所述第一透明导电薄膜远离所述金属层的一侧，所述第二透明导电薄膜设置在所述银层远离所述第一透明导电薄膜的一侧。
在一些实施例中，所述金属层设置有凹槽，所述凹槽形成所述容纳空间。
在一些实施例中，所述金属层上设置有通孔，所述通孔与所述阳极层形成所述容纳空间。
在一些实施例中，所述开口从靠近所述发光层的一侧向远离所述发光层的一侧逐渐增大。
在一些实施例中，所述发光层形成到所述阳极层，且位于所述通孔内。
本申请实施例还提供一种显示面板的制程方法，包括：
提供一阳极层，所述阳极层具有相对设置的第一面和第二面；
在所述第一面设置有金属层；
在所述金属层远离所述阳极层的一面设置有像素定义层，所述像素定义层远离所述金属层的一面设有一开口；
在所述金属层远离所述阳极层的一面设有容纳空间，所述容纳空间与所述开口连通，所述容纳空间向所述开口两侧的像素定义层延伸，以使得所述像素定义层靠近所述金属层一面与所述金属层之间形成缺口；
将发光层放置到所述容纳空间内。
在一些实施例中，所述金属层采用的材料为铝。
在一些实施例中，所述发光层通过喷墨打印形成到所述容纳空间内。
在一些实施例中，在所述阳极层远离所述金属层的一面设置平坦化层。
在一些实施例中，在所述平坦化层远离所述阳极层的一侧设置薄膜晶体管层，在所述薄膜晶体管层远离所述平坦化层的一侧设置有玻璃基板。
在一些实施例中，所述阳极层包括第一透明导电薄膜、银层以及第二透明导电薄膜，所述第一透明导电薄膜设置在靠近所述金属层的一侧，所述银层设置在所述第一透明导电薄膜远离所述金属层的一侧，所述第二透明导电薄膜设置在所述银层远离所述第一透明导电薄膜的一侧。
在一些实施例中，所述金属层设置有凹槽，所述凹槽形成所述容纳空间。
在一些实施例中，所述金属层上设置有通孔，所述通孔与所述阳极层形成所述容纳空间。
在一些实施例中，所述开口从靠近所述发光层的一侧向远离所述发光层的一侧逐渐增大。
在一些实施例中，所述发光层形成到所述阳极层，且位于所述通孔内。
 有益效果
本申请实施例提供一种显示面板及制程方法，显示面板包括阳极层、金属层、像素定义层以及发光层，所述阳极层具有相对设置的第一面和第二面，所述金属层设置在所述第一面，所述金属层远离所述阳极层的一面设有容纳空间，所述像素定义层设置在所述金属层远离所述阳极层的一面，所述像素定义层远离所述金属层的一面设有开口，所述发光层设置在所述容纳空间内，其中，所述容纳空间与所述开口连通，所述容纳空间向所述开口两侧的像素定义层延伸，以使得所述像素定义层靠近所述金属层的一面与所述金属层之间形成缺口。由于容纳空间向所述开口两侧的像素定义层延伸，以使得所述像素定义层靠近所述金属层的一面与所述金属层之间形成缺口，将发光层设在容纳空间时，流体形成的发光层会流到凹槽两端的缺口处，这样就不会在位于开口内的发光层边缘形成流体堆叠，从使得显示面板的器件堆叠均匀，提高显示面板的发光效果。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。
图1为本申请实施例提供的显示面板结构示意图。
图2为本申请实施例提供的另一种显示面板结构示意图。
图3为本申请实施例提供的再一种显示面板结构示意图。
图4为本申请实施例提供的一种显示面板的制程方法流程示意图。
图5为本申请实施例提供的另一种显示面板的制程方法流程示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例中提供一种显示面板及制程方法。以下对本申请实施例的显示面板做详细介绍。
请参阅图1，图1为本申请实施例提供的显示面板结构示意图。其中，本申请实施例提供一种显示面板100，该显示面板100包括阳极层10、金属层20、像素定义层30以及发光层40，所述阳极层10具有相对设置的第一面10a和第二面10b，所述金属层20设置在所述第一面10a，所述金属层20远离所述阳极层10的一面设有容纳空间50，所述像素定义层30设置在所述金属层20远离所述阳极层10的一面，所述像素定义层30远离所述金属层20的一面设有开口31，所述发光层40设置在所述容纳空间50内，其中，所述容纳空间50与所述开口31连通，所述容纳空间50向所述开口31两侧的像素定义层30延伸，以使得所述像素定义层30靠近所述金属层20的一面与所述金属层20之间形成缺口51。
需要说明的是，第一面10a可以为阳极层10的上表面，第二面10b可以为阳极层10的下表面。当然，第一面10a也可以为阳极层10的下表面，第二面10b可以为阳极层10的上表面。本申请实施例中不做特殊说明的情况下，默认为第一面10a为阳极层10的上表面，第二面10b为阳极层10的下表面。
另外的，金属层20可以采用多种金属材料，比如，铝、银等材料。
另外的，金属层20上设置有容纳空间50，容纳空间50是在金属层20上镂空出一个空间，通过容纳空间50用来容纳发光层40。
另外的，像素定义层30设置有开口31，发光层40可以通过开口31将光线射出。
由于容纳空间50向所述开口31两侧的像素定义层30延伸，以使得所述像素定义层30靠近所述金属层20的一面与所述金属层20之间形成缺口51，将发光层40设在容纳空间50时，流体形成的发光层40会流到凹槽两端的缺口51处，这样就不会在位于开口31内的发光层40边缘形成流体堆叠，从使得显示面板100的器件堆叠均匀，同时，这样不会遮挡发光层40的出光角度，因此，能够提高显示面板100的开口31率，从而提高显示面板100的发光效果。
其中，所述金属层20采用的材料为铝。当然，金属层20还可以采用其他金属材料。本申请实施例中不一一赘述。
其中，所述发光层40通过喷墨打印形成到所述容纳空间50内。通过喷墨打印将发光层40形成到容纳空间50。这样能够提高发光层40的形成效率。
请参阅图2，图2为本申请实施例提供的另一种显示面板结构示意图。其中，显示面板100还包括平坦化层60，所述平坦化层60设置在所述阳极层10远离所述金属层20的一面。
其中，显示面板100还包括薄膜晶体管层70和玻璃基板80，所述薄膜晶体管层70设置在所述平坦化层60远离所述阳极层10的一侧，所述玻璃基板80设置在所述薄膜晶体管层70远离所述平坦化层60的一侧。
请参阅图3，图3为本申请实施例提供的再一种显示面板结构示意图。其中，所述阳极层10包括第一透明导电薄膜11、银层12以及第二透明导电薄膜13，所述第一透明导电薄膜11设置在靠近所述金属层20的一侧，所述银层12设置在所述第一透明导电薄膜11远离所述金属层20的一侧，所述第二透明导电薄膜13设置在所述银层12远离所述第一透明导电薄膜11的一侧。
其中，所述金属层20设置有凹槽，所述凹槽形成所述容纳空间50。其中，所述金属层20上设置有通孔，所述通孔与所述阳极层10形成所述容纳空间50。
可以理解的是，这样发光层40将形成到所述阳极层10，且位于所述通孔内。
其中，所述开口31从靠近所述发光层40的一侧向远离所述发光层40的一侧逐渐增大。采用这种方式，能够增大开口31率，提高显示效果。
本申请实施例提供的显示面板100包括阳极层10、金属层20、像素定义层30以及发光层40，所述阳极层10具有相对设置的第一面10a和第二面10b，所述金属层20设置在所述第一面10a，所述金属层20远离所述阳极层10的一面设有容纳空间50，所述像素定义层30设置在所述金属层20远离所述阳极层10的一面，所述像素定义层30远离所述金属层20的一面设有开口31，所述发光层40设置在所述容纳空间50内，其中，所述容纳空间50与所述开口31连通，所述容纳空间50向所述开口31两侧的像素定义层30延伸，以使得所述像素定义层30靠近所述金属层20的一面与所述金属层20之间形成缺口51。由于容纳空间50向所述开口31两侧的像素定义层30延伸，以使得所述像素定义层30靠近所述金属层20的一面与所述金属层20之间形成缺口51，将发光层40设在容纳空间50时，流体形成的发光层40会流到凹槽两端的缺口51处，这样就不会在位于开口31内的发光层40边缘形成流体堆叠，从使得显示面板100的器件堆叠均匀，提高显示面板100的发光效果。
请参阅图4，图4为本申请实施例提供的一种显示面板的制程方法流程示意图。其中，本申请实施例显示面板的制造方法，包括如下步骤：
201、提供一阳极层，所述阳极层具有相对设置的第一面和第二面。
需要说明的是，第一面可以为阳极层的上表面，第二面可以为阳极层的下表面。当然，第一面也可以为阳极层的下表面，第二面可以为阳极层的上表面。本申请实施例中不做特殊说明的情况下，默认为第一面为阳极层的上表面，第二面为阳极层的下表面。
202、在所述第一面设置有金属层。
需要说明的是，金属层可以采用多种金属材料，比如，铝、银等材料。
203、在所述金属层远离所述阳极层的一面设置有像素定义层，所述像素定义层远离所述金属层的一面设有开口。
需要说明的是，像素定义层设置有开口，发光层可以通过开口将光线射出。
204、在所述金属层远离所述阳极层的一面设有容纳空间，所述容纳空间与所述开口连通，所述容纳空间向所述开口两侧的像素定义层延伸，以使得所述像素定义层靠近所述金属层一面与所述金属层之间形成缺口。
需要说明的是，
205、将所述发光层放置到所述容纳空间内。
本申请实施例采用上述方法，由于容纳空间向所述开口两侧的像素定义层延伸，以使得所述像素定义层靠近所述金属层的一面与所述金属层之间形成缺口，将发光层设在容纳空间时，流体形成的发光层会流到凹槽两端的缺口处，这样就不会在位于开口内的发光层边缘形成流体堆叠，从使得显示面板的器件堆叠均匀，同时，这样不会遮挡发光层的出光角度，因此，能够提高显示面板的开口率，从而提高显示面板的发光效果。
请参阅图5，图5为本申请实施例提供的另一种显示面板的制程方法流程示意图。其中，本申请实施例显示面板的制造方法，包括如下步骤：
301、提供一玻璃基板。
302、在所述玻璃基板设置薄膜晶体管层。
303、在所述薄膜晶体管层上设置平坦化层。
304、在所述平坦化层上设置第二透明导电薄膜。
305、在所述第二透明导电薄膜上设置银层。
306、在所述银层上设置第一透明导电薄膜。
307、在所述第一透明导电薄膜上设置铝层。
308、在所述铝层上设置像素定义层，所述像素定义层上开设有开口。
309、在所述铝层远离所述阳极层的一面设有容纳空间，所述容纳空间与所述开口连通，所述容纳空间向所述开口两侧的像素定义层延伸，以使得所述像素定义层靠近所述铝层一面与所述铝层之间形成缺口。
需要说明的是，通过蚀刻的方式形成所述容纳空间。
310、将所述发光层放置到所述容纳空间内。
需要说明的是，通过该喷墨打印的方式将发光层放置到所述容纳空间内。
需要说明的是，在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
本申请实施例采用上述方法，由于容纳空间向所述开口两侧的像素定义层延伸，以使得所述像素定义层靠近所述铝层的一面与所述铝层之间形成缺口，将发光层设在容纳空间时，流体形成的发光层会流到凹槽两端的缺口处，这样就不会在位于开口内的发光层边缘形成流体堆叠，从使得显示面板的器件堆叠均匀，同时，这样不会遮挡发光层的出光角度，因此，能够提高显示面板的开口率，从而提高显示面板的发光效果。
以上对本申请实施例提供的一种显示面板及制程方法进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种显示面板，其中，包括：
    阳极层，所述阳极层具有相对设置的第一面和第二面；
    金属层，所述金属层设置在所述第一面，所述金属层远离所述阳极层的一面设有容纳空间；
    像素定义层，所述像素定义层设置在所述金属层远离所述阳极层的一面，所述像素定义层远离所述金属层的一面设有开口；
    发光层，所述发光层设置在所述容纳空间内；
    其中，所述容纳空间与所述开口连通，所述容纳空间向所述开口两侧的像素定义层延伸，以使得所述像素定义层靠近所述金属层的一面与所述金属层之间形成缺口。
  2. 根据权利要求1所述的显示面板，其中，所述金属层采用的材料为铝。
  3. 根据权利要求1所述的显示面板，其中，所述发光层通过喷墨打印形成到所述容纳空间内。
  4. 根据权利要求1所述的显示面板，其中，还包括平坦化层，所述平坦化层设置在所述阳极层远离所述金属层的一面。
  5. 根据权利要求4所述的显示面板，其中，还包括薄膜晶体管层和玻璃基板，所述薄膜晶体管层设置在所述平坦化层远离所述阳极层的一侧，所述玻璃基板设置在所述薄膜晶体管层远离所述平坦化层的一侧。
  6. 根据权利要求1所述的显示面板，其中，所述阳极层包括第一透明导电薄膜、银层以及第二透明导电薄膜，所述第一透明导电薄膜设置在靠近所述金属层的一侧，所述银层设置在所述第一透明导电薄膜远离所述金属层的一侧，所述第二透明导电薄膜设置在所述银层远离所述第一透明导电薄膜的一侧。
  7. 根据权利要求1所述的显示面板，其中，所述金属层设置有凹槽，所述凹槽形成所述容纳空间。
  8. 根据权利要求1所述的显示面板，其中，所述金属层上设置有通孔，所述通孔与所述阳极层形成所述容纳空间。
  9. 根据权利要求1所述的显示面板，其中，所述开口从靠近所述发光层的一侧向远离所述发光层的一侧逐渐增大。
  10. 根据权利要求1所述的显示面板，其中，所述发光层形成到所述阳极层，且位于所述通孔内。
  11. 一种显示面板的制程方法，其中，包括：
    提供一阳极层，所述阳极层具有相对设置的第一面和第二面；
    在所述第一面设置有金属层；
    在所述金属层远离所述阳极层的一面设置有像素定义层，所述像素定义层远离所述金属层的一面设有一开口；
    在所述金属层远离所述阳极层的一面设有容纳空间，所述容纳空间与所述开口连通，所述容纳空间向所述开口两侧的像素定义层延伸，以使得所述像素定义层靠近所述金属层一面与所述金属层之间形成缺口；
    将发光层放置到所述容纳空间内。
  12. 根据权利要求11所述的显示面板的制程方法，其中，所述金属层采用的材料为铝。
  13. 根据权利要求11所述的显示面板的制程方法，其中，所述发光层通过喷墨打印形成到所述容纳空间内。
  14. 根据权利要求11所述的显示面板的制程方法，其中，在所述阳极层远离所述金属层的一面设置平坦化层。
  15. 根据权利要求14所述的显示面板的制程方法，其中，在所述平坦化层远离所述阳极层的一侧设置薄膜晶体管层，在所述薄膜晶体管层远离所述平坦化层的一侧设置有玻璃基板。
  16. 根据权利要求11所述的显示面板的制程方法，其中，所述阳极层包括第一透明导电薄膜、银层以及第二透明导电薄膜，所述第一透明导电薄膜设置在靠近所述金属层的一侧，所述银层设置在所述第一透明导电薄膜远离所述金属层的一侧，所述第二透明导电薄膜设置在所述银层远离所述第一透明导电薄膜的一侧。
  17. 根据权利要求11所述的显示面板的制程方法，其中，所述金属层设置有凹槽，所述凹槽形成所述容纳空间。
  18. 根据权利要求11所述的显示面板的制程方法，其中，所述金属层上设置有通孔，所述通孔与所述阳极层形成所述容纳空间。
  19. 根据权利要求11所述的显示面板的制程方法，其中，所述开口从靠近所述发光层的一侧向远离所述发光层的一侧逐渐增大。
  20. 根据权利要求11所述的显示面板的制程方法，其中，所述发光层形成到所述阳极层，且位于所述通孔内。
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