WO2021179417A1 - 一种阵列基板、显示面板及显示面板的制作方法 - Google Patents

一种阵列基板、显示面板及显示面板的制作方法 Download PDF

Info

Publication number
WO2021179417A1
WO2021179417A1 PCT/CN2020/087713 CN2020087713W WO2021179417A1 WO 2021179417 A1 WO2021179417 A1 WO 2021179417A1 CN 2020087713 W CN2020087713 W CN 2020087713W WO 2021179417 A1 WO2021179417 A1 WO 2021179417A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
light
display panel
emitting element
array substrate
Prior art date
Application number
PCT/CN2020/087713
Other languages
English (en)
French (fr)
Inventor
李柱辉
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Priority to US16/981,719 priority Critical patent/US11411149B2/en
Publication of WO2021179417A1 publication Critical patent/WO2021179417A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays

Definitions

  • the present invention relates to the field of display technology, and in particular to a manufacturing method of an array substrate, a display panel, and a display panel.
  • LCD liquid crystal displays
  • OLED organic light emitting diodes
  • Micro-LEDs still have many defects, such as uneven brightness, reliability, low transfer yield, poor TFT uniformity, cross-color, color mixing, poor contrast and other issues.
  • Micro-LED has problems such as cross-color, color mixing, and poor contrast. This is because the micro-led chip is a multi-faceted light-emitting body, and all we need is the light emitted from the top of the micro-led chip. When the adjacent micro-led chips are all lit At the time, the light emitted from the side will interfere with each other, resulting in problems such as cross-color, color mixing, and poor contrast; the poor contrast is also related to the reflection of the ambient light from the micro-led panel metal.
  • the first method is to use a micro-led chip with higher luminous efficiency to increase the contrast.
  • the disadvantage of this method is high power consumption and poor uniformity;
  • the second method is to add a black matrix (BM) between the micro-led chips for shading to reduce cross-color, color mixing, poor contrast and other problems.
  • BM black matrix
  • the third method is to package the micro-led chip on the side to block the light on the side, thereby reducing cross-color, color mixing, poor contrast and other issues.
  • the disadvantage of this method is that the brightness of the micro-led chip is reduced and the power consumption is greatly improved.
  • the fourth method is to add a polarizer to improve the contrast, the disadvantage is that it increases the cost.
  • the purpose of the present invention is to provide an array substrate, a display panel, and a method for manufacturing a display panel.
  • the cover layer can not only absorb ambient light and light emitted by light-emitting elements, without adding
  • the polarizer can greatly improve the problems of cross-color, color mixing, and poor contrast of the display panel, making the black state of the display panel blacker, thereby increasing the contrast.
  • the manufacturing process of the covering layer is simple, which reduces the manufacturing cost.
  • one of the embodiments of the present invention provides an array substrate, which includes a substrate layer, a driving circuit layer, and a cover layer stacked from bottom to top; the cover layer is made of gray light-absorbing material for absorbing environmental impact. Light and reflected light of the drive circuit layer.
  • the driving circuit layer includes a light shielding layer, a buffer layer, an active layer, a gate insulating layer, a gate metal layer, an interlayer insulating layer, a source and drain metal layer, a flat layer, and A conductive layer; specifically, the buffer layer is provided on the light-shielding layer; the active layer is provided on the buffer layer; the gate insulating layer is provided on the active layer; the gate An electrode metal layer is provided on the gate insulating layer; the interlayer insulating layer is provided on the buffer layer and completely covers the active layer, the gate insulating layer and the gate metal layer; The source and drain metal layer is provided on the interlayer insulating layer; the flat layer is provided on the interlayer insulating layer and completely covers the source and drain metal layer; the conductive layer is provided on the flat layer superior.
  • the source and drain metal layer includes a source electrode, a drain electrode, and a floating wiring layer, and the source electrode and the drain electrode are respectively electrically connected to the doped region of the active layer;
  • the conductive layer includes an anode Section and a cathode section, the anode section is electrically connected with the drain electrode, and the cathode section is electrically connected with the floating wiring layer.
  • the covering layer is provided with a groove, and the anode section and the cathode section are exposed in the groove.
  • the present invention also provides a display panel including the above-mentioned array substrate and light-emitting elements; the light-emitting elements are arranged in the grooves on the cover layer; the light-emitting elements include an anode and a cathode, and the anode and the anode section The cathode is electrically connected to the cathode segment.
  • the depth of the groove is less than or equal to the height of the light-emitting element.
  • the light-emitting element includes LED lamp beads or micro-LED chips.
  • the display panel further includes an encapsulation layer, which is disposed on the cover layer and completely covers the light-emitting element.
  • the present invention also provides a manufacturing method of a display panel, including the following steps:
  • the step of manufacturing an array substrate comprising a substrate layer, a driving circuit layer and a covering layer which are sequentially stacked from bottom to top;
  • the driving circuit layer comprises a conductive layer, the conductive layer comprises an anode section and a cathode section;
  • the covering The layer is a gray light-absorbing material for absorbing the reflected light to the ambient light and the driving circuit layer;
  • a groove is provided on the cover layer, and the groove exposes the anode section and the cathode section;
  • a light-emitting element is embedded in a groove on the covering layer.
  • the light-emitting element includes an anode and a cathode.
  • the welding is electrically connected to the cathode section.
  • the step of manufacturing the array substrate includes the following steps:
  • a cover layer is made on the driving circuit layer, and a groove is formed by etching at the position corresponding to the anode section and the cathode section through exposure, development, and curing processes, and the depth of the groove is less than or equal to the light-emitting element the height of.
  • the beneficial effect of the present invention is to provide a manufacturing method of an array substrate, a display panel, and a display panel.
  • the cover layer can not only absorb ambient light and light emitted by the light-emitting element, but also Without adding a polarizer, the problems of cross-color, color mixing, and poor contrast of the display panel can be greatly improved, so that the black state of the display panel is darker, thereby improving the contrast.
  • the manufacturing process of the covering layer is simple, the manufacturing cost is reduced, and the competitiveness of the product is greatly improved.
  • FIG. 1 is a schematic diagram of the structure of an array substrate in an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of the structure of a display panel in an embodiment of the present invention.
  • FIG. 3 is a flowchart of a manufacturing method of a display panel in an embodiment of the present invention.
  • FIG. 4 is a flowchart of the steps of fabricating the source and drain metal layers described in FIG. 3;
  • FIG. 5 is a flowchart of the steps of manufacturing the driving circuit layer described in FIG. 4.
  • Substrate layer 2. Drive circuit layer, 3. Cover layer, 4. Light emitting element, 5. Encapsulation layer,
  • Display panel 271, source electrode, 272, drain electrode, 273, floating wiring layer,
  • the part When some part is described as being “on” another part, the part may be directly placed on the other part; there may also be an intermediate part on which the part is placed, And the middle part is placed on another part.
  • a component When a component is described as “installed to” or “connected to” another component, both can be understood as directly “installed” or “connected”, or a component is indirectly “mounted to” or “connected to” through an intermediate component “Another component.
  • an embodiment of the present invention provides an array substrate 10, which includes a substrate layer 1, a driving circuit layer 2, and a cover layer 3 which are sequentially stacked from bottom to top;
  • the cover layer 3 is a gray light-absorbing material, It is used to absorb the ambient light and the reflected light of the driving circuit layer 2, and prevent the display panel composed of the array substrate 10 from cross-color, color mixing, etc., so that the black state of the display panel is darker, thereby improving the contrast.
  • the driving circuit layer 2 includes a light shielding layer 21, a buffer layer 22, an active layer 23, a gate insulating layer 24, a gate metal layer 25, and an interlayer insulating layer stacked from bottom to top. 26.
  • the gate insulating layer 24 is disposed on the active layer 23;
  • the gate metal layer 25 is disposed on the gate insulating layer 24;
  • the interlayer insulating layer 26 is disposed on the buffer layer 22 And completely cover the active layer 23, the gate insulating layer 24, and the gate metal layer 25;
  • the source and drain metal layers 27 are disposed on the interlayer insulating layer 26;
  • the flat layer 28 It is arranged on the interlayer insulating layer 26 and completely covers the source and drain metal layer 27;
  • the conductive layer 29 is arranged on the flat layer 28.
  • the source and drain metal layer 27 includes a source electrode 271, a drain electrode 272, and a floating wiring layer 273.
  • the source electrode 271 and the drain electrode 272 are doped with the active layer 23, respectively.
  • the miscellaneous regions are electrically connected;
  • the conductive layer 29 includes an anode section 291 and a cathode section 292, the anode section 291 is electrically connected to the drain electrode 272, and the cathode section 292 is electrically connected to the floating wiring layer 273.
  • the drain electrode 272 is connected to the positive electrode of the power supply, and the current is conducted to the drain electrode 272 through the active layer 23 through the drain electrode 272, and then to the anode section 291, and the floating
  • the wiring layer 273 is connected to the negative pole of the power supply, and electrons are conducted to the cathode section 292 through the floating wiring layer 273.
  • the source electrode 271 is also electrically connected to the light shielding layer 21.
  • the covering layer 3 is provided with a groove 31, and the anode section 291 and the cathode section 292 are exposed in the groove 31 to facilitate the subsequent anode section 291 and the cathode section 292 is electrically connected to the light-emitting element.
  • the present invention also provides a display panel 100, including the above-mentioned array substrate 10 and a light-emitting element 4; the light-emitting element 4 is disposed in the groove 31 on the cover layer 3; the light-emitting element 4 includes an anode 41 and a cathode 42, between the anode 41 and the cathode 42 is a light-emitting layer 43, the anode 41 is electrically connected to the anode section 291, and the cathode 42 is electrically connected to the cathode section 292 .
  • the cover layer 3 is a gray light-absorbing material, which is used to absorb the reflected light to the ambient light and the driving circuit layer 2, and prevent the cross-color and color mixing problems from the display panel 100, so that the display panel 100 The black state is darker, thereby increasing the contrast.
  • the drain electrode 272 is connected to the positive electrode of the power supply, and the current is conducted to the drain electrode 272 via the active layer 23 through the drain electrode 272, and then to the drain electrode 272.
  • the anode section 291 is connected to the anode 41 of the light-emitting element 4
  • the floating wiring layer 273 is connected to the negative pole of the power supply, and the electrical signal is conducted to the cathode section 292 and the cathode section 292 through the floating wiring layer 273.
  • the cathode 42 of the light-emitting element 4 is turned on, so that the light-emitting element 4 emits light.
  • the depth of the groove 31 is less than or equal to the height of the light-emitting element 4, which facilitates the insertion of the light-emitting element 4 into the groove 31.
  • the light-emitting element 4 includes LED lamp beads or Micro-LED chips.
  • LED lamp beads can also be referred to as LED chips, which are usually used in the backlight module of a liquid crystal display device as a light-emitting element on a light bar.
  • the Micro-LED chip has a smaller size relative to the LED lamp bead and can be used in an LED display device.
  • a single independent Micro-LED chip may be formed, and then the Micro-LED chip may be electrically connected to one side surface of the base substrate by batch transfer technology or mass transfer technology to form the display panel 100.
  • the light-emitting element 4 may also be other types of light-emitting structures known to those skilled in the art, which is not limited in the embodiment of the present invention.
  • the display panel 100 further includes an encapsulation layer 5, which is disposed on the cover layer 3 and completely covers the light emitting element 4, for blocking water and oxygen.
  • the present invention also provides a manufacturing method of the display panel 100, which includes the following steps:
  • the step of manufacturing an array substrate 10 includes a substrate layer 1, a driving circuit layer 2 and a cover layer 3 which are sequentially stacked from bottom to top;
  • the driving circuit layer 2 includes a conductive layer 29, and the conductive layer 29 It includes an anode section 291 and a cathode section 292;
  • the covering layer 3 is made of gray light-absorbing material for absorbing the reflected light to the ambient light and the driving circuit layer 2;
  • the covering layer 3 is provided with a groove 31, the The anode section 291 and the cathode section 292 are exposed in the groove 31; and
  • the light-emitting element 4 includes an anode 41 and a cathode 42, and the anode 41 is soldered to the anode by solder paste.
  • the section 291 is electrically connected, and the cathode 42 is electrically connected to the cathode section 292 by solder paste welding.
  • the step S1 of manufacturing the array substrate 10 includes the following steps:
  • a cover layer 3 is formed on the driving circuit layer 2, and a groove 31 is formed by etching at a position corresponding to the anode section 291 and the cathode section 292 through exposure, development, and curing processes.
  • the depth of is less than or equal to the height of the light-emitting element 4, which facilitates the light-emitting element 4 to be embedded in the groove 31.
  • the step S12 of manufacturing the driving circuit layer 2 includes the following steps:
  • the source and drain metal layer 27 includes a source electrode 271, a drain electrode 272, and a floating wiring layer 273.
  • the source electrode 271 and the drain electrode 272 are connected to the active layer respectively.
  • 23 is electrically connected to the doped region;
  • the conductive layer 29 includes an anode section 291 and a cathode section 292, the anode section 291 is electrically connected to the drain electrode 272, and the cathode section 292 is electrically connected to the floating wiring layer 273 .
  • the method further includes the following steps:
  • the beneficial effect of the present invention is to provide a manufacturing method of the array substrate 10, the display panel 100, and the display panel 100.
  • the cover layer 3 can not only absorb ambient light and emit light.
  • the light emitted by the element 4 can greatly improve the problems of cross-color, color mixing, and poor contrast of the display panel 100 without adding a polarizer, so that the black state of the display panel 100 is darker, thereby improving the contrast.
  • the manufacturing process of the covering layer 3 is simple, which reduces the manufacturing cost and greatly improves the competitiveness of the product.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种阵列基板、显示面板及显示面板的制作方法。显示面板（100）包括阵列基板（10）以及发光元件（4）。阵列基板（10）包括从下至上依次层叠设置的衬底层（1）、驱动电路层（2）以及覆盖层（3）；覆盖层（3）为灰色吸光材料，用于吸收对环境光及驱动电路层（2）的反射光。

Description

一种阵列基板、显示面板及显示面板的制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种阵列基板、显示面板及显示面板的制作方法。
 背景技术
近年来，显示行业得到了快速的发展，尤其是我国的显示行业，发生了天翻地覆的变化。通过技术、人才、先进设备的引进、以及核心技术的创新，我国已成为世界显示器制造大国，显示器水平达到世界领先水平。不仅结束了我国少屏的窘境，还引领显示界的潮流。
显示行业的竞争变得越来越激烈，更新周期不断缩短，以液晶显示器（LCD）与有机发光二极管（OLED）的竞争尤为激烈。随着OLED工艺、材料的成熟以及良率的提升，LCD渐渐失去了在小尺寸的市场优势，特别是在手机市场，OLED已渐渐取代LCD的地位。近年来也兴起了很多新型的显示技术，例如QLED显示、E-ink、柔性LCD、PE显示、mini-LED、micro-LED等等。这些新技术因还存在成本、寿命、可靠性等一些问题，还不具备量产性。micro-LED因具有色域广、对比度高、响应速度快、分辨率高、寿命长等优点，被很多企业大力推广，同时被视为下一代最具有潜力的新型显示技术。
发光元件 micro-LED目前仍然存在很多缺陷，例如亮度不均匀、可靠性、转移良率低、TFT均匀性差、串色、混色、对比度差等问题。micro-LED出现串色、混色、对比度差等问题，这是因为micro-led芯片是多面发光体，而我们需要的只是micro-led芯片顶部发出的光，当相邻micro-led芯片都点亮的时候，侧面发出的光会互相干扰，从而出现串色、混色、对比度差等问题；对比度差也与micro-led面板金属对环境光发生反射有关。因此可以从控制micro-led芯片出光方向以及降低面板金属反射率两个方面着手，解决micro-led出现串色、混色、对比度差等问题。目前常见改善micro-led串色、混色、对比度差等问题的方法有：第一种方式为采用发光效率较高的micro-led芯片可提高对比度，该方法的缺点是功耗大、均匀性差；第二种方式为在micro-led芯片之间加黑色矩阵（BM）进行遮光，减少串色、混色、对比度差等问题，该方法的缺点是黑色矩阵制程难度大、黑色矩阵容易残留在铜电极上；第三种方式为对micro-led芯片进行侧面封装处理，遮挡侧面的光，从而减少串色、混色、对比度差等问题，该方法的缺点是micro-led芯片亮度降低、功耗大大提高；第四种方式为加贴偏光片提高对比度，缺点是增加成本。
因此，确有必要来开发一种新型的阵列基板、显示面板及显示面板的制作方法，来克服现有技术中的缺陷。
 技术问题
本发明的目的在于，提供一种阵列基板、显示面板及显示面板的制作方法，通过在阵列基板上制作一层覆盖层，所述覆盖层不仅可以吸收环境光及发光元件发出的光，无需增加偏光片就可以大大改善显示面板出现串色、混色、对比度差等问题，使得显示面板的黑态更黑，从而提高了对比度。同时所述覆盖层的制作工艺简单，减少了制作成本。
 技术解决方案
为了实现上述目的，本发明其中一实施例中提供一种阵列基板，包括从下至上依次层叠设置的衬底层、驱动电路层以及覆盖层；所述覆盖层为灰色吸光材料，用于吸收对环境光及所述驱动电路层的反射光。
进一步地，所述驱动电路层包括从下至上依次层叠设置的遮光层、缓冲层、有源层、栅极绝缘层、栅极金属层、层间绝缘层、源漏极金属层、平坦层以及导电层；具体地讲，所述缓冲层设于所述遮光层上；所述有源层设于所述缓冲层上；所述栅极绝缘层设于所述有源层上；所述栅极金属层设于所述栅极绝缘层上；所述层间绝缘层设于所述缓冲层上且完全覆盖所述有源层、所述栅极绝缘层以及所述栅极金属层；所述源漏极金属层设于所述层间绝缘层上；所述平坦层设于所述层间绝缘层上且完全覆盖所述源漏极金属层；所述导电层设于所述平坦层上。
进一步地，所述源漏极金属层包括源电极、漏电极和浮动接线层，所述源电极和所述漏电极分别与所述有源层的掺杂区电连接；所述导电层包括阳极段和阴极段，所述阳极段与所述漏电极电连接，所述阴极段与所述浮动接线层电连接。
进一步地，所述覆盖层设有凹槽，所述阳极段和所述阴极段裸露于所述凹槽内。
本发明还提供一种显示面板，包括上述阵列基板以及发光元件；所述发光元件设于所述覆盖层上的凹槽内；所述发光元件包括阳极和阴极，所述阳极与所述阳极段电连接，所述阴极与所述阴极段电连接。
进一步地，所述凹槽的深度小于等于所述发光元件的高度。
进一步地，所述发光元件包括LED灯珠或micro-LED芯片。
进一步地，所述显示面板还包括封装层，设于所述覆盖层上且完全覆盖所述发光元件。
本发明还提供一种显示面板的制作方法，包括以下步骤：
制作阵列基板步骤，所述阵列基板包括从下至上依次层叠设置的衬底层、驱动电路层以及覆盖层；所述驱动电路层包括导电层，所述导电层包括阳极段和阴极段；所述覆盖层为灰色吸光材料，用于吸收对环境光及所述驱动电路层的反射光；所述覆盖层上设有一凹槽，所述凹槽裸露所述阳极段和所述阴极段；以及
设置发光元件步骤，在所述覆盖层上的凹槽内嵌入一发光元件，所述发光元件包括阳极和阴极，所述阳极通过锡膏焊接与所述阳极段电连接，所述阴极通过锡膏焊接与所述阴极段电连接。
进一步地，所述制作阵列基板步骤包括以下步骤：
制作衬底层；
在所述衬底层上制作驱动电路层；以及
在所述驱动电路层上制作覆盖层，并通过曝光、显影、固化工艺在对应所述阳极段和所述阴极段位置处蚀刻形成一凹槽，所述凹槽的深度小于等于所述发光元件的高度。
 有益效果
本发明的有益效果在于，提供一种阵列基板、显示面板及显示面板的制作方法，通过在阵列基板、上制作一层覆盖层，所述覆盖层不仅可以吸收环境光及发光元件发出的光，无需增加偏光片就可以大大改善显示面板出现串色、混色、对比度差等问题，使得显示面板的黑态更黑，从而提高了对比度。同时所述覆盖层的制作工艺简单，减少了制作成本，极大地提高了产品的竞争力。
 附图说明
图1为本发明实施例中一种阵列基板的结构示意图；
图2为本发明实施例中一种显示面板的结构示意图；
图3为本发明实施例中一种显示面板的制作方法的流程图；
图4为图3中所述制作源漏极金属层步骤的流程图；
图5为图4中所述制作驱动电路层步骤的流程图。
图中部件标识如下：
1、衬底层，2、驱动电路层，3、覆盖层，4、发光元件，5、封装层，
10、阵列基板，21、遮光层，22、缓冲层，23、有源层，24、栅极绝缘层，
25、栅极金属层，26、层间绝缘层，27、源漏极金属层，28、平坦层，
29、导电层，31、凹槽，41、阳极，42、阴极，43、发光层，
100、显示面板，271、源电极，272、漏电极，273、浮动接线层，
291、阳极段，292、阴极段。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在附图中，结构相同的部件以相同数字标号表示，各处结构或功能相似的部件以相似数字标号表示。本发明所提到的方向用语，例如，上、下、前、后、左、右、内、外、上表面、下表面、侧面、顶部、底部、前端、后端、末端等，仅是附图中的方向，只是用来解释和说明本发明，而不是用来限定本发明的保护范围。
当某些部件被描述为“在”另一部件“上”时，所述部件可以直接置于所述另一部件上；也可以存在一中间部件，所述部件置于所述中间部件上，且所述中间部件置于另一部件上。当一个部件被描述为“安装至”或“连接至”另一部件时，二者可以理解为直接“安装”或“连接”，或者一个部件通过一中间部件间接“安装至”或“连接至”另一个部件。
请参阅图1所示，本发明实施例中提供一种阵列基板10，包括从下至上依次层叠设置的衬底层1、驱动电路层2以及覆盖层3；所述覆盖层3为灰色吸光材料，用于吸收对环境光及所述驱动电路层2的反射光，并防止由阵列基板10构成的显示面板出现串色、混色等问题，使得显示面板的黑态更黑，从而提高对比度。
请参阅图1所示，所述驱动电路层2包括从下至上依次层叠设置的遮光层21、缓冲层22、有源层23、栅极绝缘层24、栅极金属层25、层间绝缘层26、源漏极金属层27、平坦层28以及导电层29；具体地讲，所述缓冲层22设于所述遮光层21上；所述有源层23设于所述缓冲层22上；所述栅极绝缘层24设于所述有源层23上；所述栅极金属层25设于所述栅极绝缘层24上；所述层间绝缘层26设于所述缓冲层22上且完全覆盖所述有源层23、所述栅极绝缘层24以及所述栅极金属层25；所述源漏极金属层27设于所述层间绝缘层26上；所述平坦层28设于所述层间绝缘层26上且完全覆盖所述源漏极金属层27；所述导电层29设于所述平坦层28上。
请参阅图1所示，所述源漏极金属层27包括源电极271、漏电极272和浮动接线层273，所述源电极271和所述漏电极272分别与所述有源层23的掺杂区电连接；所述导电层29包括阳极段291和阴极段292，所述阳极段291与所述漏电极272电连接，所述阴极段292与所述浮动接线层273电连接。在使用时，所述漏电极272接通电源正极，电流通过所述漏电极272经所述有源层23传导至所述漏电极272上，再传导至所述阳极段291上，所述浮动接线层273接通电源负极，电子经所述浮动接线层273传导至所述阴极段292上。
如图1所示，本实施例中，所述源电极271还与所述遮光层21电连接。
请参阅图1所示，所述覆盖层3设有凹槽31，所述阳极段291和所述阴极段292裸露于所述凹槽31内，便于后续所述阳极段291和所述阴极段292与发光元件电连接。
请参阅图2所示，本发明还提供一种显示面板100，包括上述阵列基板10以及发光元件4；所述发光元件4设于所述覆盖层3上的凹槽31内；所述发光元件4包括阳极41和阴极42，在所述阳极41与所述阴极42之间为发光层43，所述阳极41与所述阳极段291电连接，所述阴极42与所述阴极段292电连接。其中所述覆盖层3为灰色吸光材料，用于吸收对环境光及所述驱动电路层2的反射光，并防止由所述显示面板100出现串色、混色等问题，使得所述显示面板100的黑态更黑，从而提高对比度。
请参阅图1、图2所示，在使用时，所述漏电极272接通电源正极，电流通过所述漏电极272经所述有源层23传导至所述漏电极272上，再传导至所述阳极段291上与所述发光元件4的所述阳极41导通，所述浮动接线层273接通电源负极，电信号经所述浮动接线层273传导至所述阴极段292上与所述发光元件4的所述阴极42导通，从而使得所述发光元件4发光。
在本实施例中，所述凹槽31的深度小于等于所述发光元件4的高度，这样便于所述发光元件4嵌入至所述凹槽31内。
在本实施例中，所述发光元件4包括LED灯珠或Micro-LED芯片。其中，LED灯珠还可称为LED芯片，通常用在液晶显示装置的背光模组中，作为灯条上的发光元件。Micro-LED芯片相对于LED灯珠的尺寸较小，可用在LED显示装置中。示例性的，可形成单个独立的Micro-LED芯片，后通过批量转移技术或巨量转移技术，将Micro-LED芯片电连接至衬底基板的一侧表面，以形成所述显示面板100。
在其他实施方式中，所述发光元件4还可为本领域技术人员可知的其他类型的发光结构，本发明实施例对此不作限定。
请参阅图2所示，所述显示面板100还包括封装层5，设于所述覆盖层3上且完全覆盖所述发光元件4，用于阻隔水氧。
请参阅图3所示，本发明还提供一种显示面板100的制作方法，包括以下步骤：
S1、制作阵列基板10步骤，所述阵列基板10包括从下至上依次层叠设置的衬底层1、驱动电路层2以及覆盖层3；所述驱动电路层2包括导电层29，所述导电层29包括阳极段291和阴极段292；所述覆盖层3为灰色吸光材料，用于吸收对环境光及所述驱动电路层2的反射光；所述覆盖层3上设有一凹槽31，所述阳极段291和所述阴极段292裸露于所述凹槽31内；以及
S2、设置发光元件4步骤，在所述覆盖层3上的凹槽31内嵌入一发光元件4，所述发光元件4包括阳极41和阴极42，所述阳极41通过锡膏焊接与所述阳极段291电连接，所述阴极42通过锡膏焊接与所述阴极段292电连接。
请参阅图4所示，所述制作阵列基板10步骤S1包括以下步骤：
S11、制作衬底层1；
S12、在所述衬底层1上制作驱动电路层2；以及
S13、在所述驱动电路层2上制作覆盖层3，并通过曝光、显影、固化工艺在对应所述阳极段291和所述阴极段292位置处蚀刻形成一凹槽31，所述凹槽31的深度小于等于所述发光元件4的高度，这样便于所述发光元件4嵌入至所述凹槽31内。
请参阅图5所示，所述制作驱动电路层2步骤S12包括以下步骤：
S121、制作遮光层21；
S122、在所述遮光层21上制作缓冲层22；
S123、在所述缓冲层22上制作有源层23；
S124、在所述有源层23上制作栅极绝缘层24；
S125、在所述栅极绝缘层24上制作栅极金属层25；
S126、在所述缓冲层22上制作层间绝缘层26，所述层间绝缘层26完全覆盖所述有源层23、所述栅极绝缘层24以及所述栅极金属层25；
S127、在所述层间绝缘层26上制作源漏极金属层27；
S128、在所述层间绝缘层26上制作平坦层28，所述平坦层28完全覆盖所述源漏极金属层27；以及
S129、在所述平坦层28上制作导电层29。
其中，请同时参阅图1所示，所述源漏极金属层27包括源电极271、漏电极272和浮动接线层273，所述源电极271和所述漏电极272分别与所述有源层23的掺杂区电连接；所述导电层29包括阳极段291和阴极段292，所述阳极段291与所述漏电极272电连接，所述阴极段292与所述浮动接线层273电连接。
请参阅图3所示，在所述设置发光元件4步骤S2之后还包括步骤：
S3、制作封装层5步骤，在所述覆盖层3上制作封装层5，所述封装层5完全覆盖所述发光元件4，用于阻隔水氧。
本发明的有益效果在于，提供一种阵列基板10、显示面板100及显示面板100的制作方法，通过在阵列基板10上制作一层覆盖层3，所述覆盖层3不仅可以吸收环境光及发光元件4发出的光，无需增加偏光片就可以大大改善显示面板100出现串色、混色、对比度差等问题，使得显示面板100的黑态更黑，从而提高了对比度。同时所述覆盖层3的制作工艺简单，减少了制作成本，极大地提高了产品的竞争力。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种阵列基板，其包括：
    衬底层；
    驱动电路层，设于所述衬底层上；以及
    覆盖层，设于所述驱动电路层上，所述覆盖层为灰色吸光材料，用于吸收对环境光及所述驱动电路层的反射光。
  2. 根据权利要求1所述的阵列基板，其中，所述驱动电路层包括：
    遮光层；
    缓冲层，设于所述遮光层上；
    有源层，设于所述缓冲层上；
    栅极绝缘层，设于所述有源层上；
    栅极金属层，设于所述栅极绝缘层上；
    层间绝缘层，设于所述缓冲层上且完全覆盖所述有源层、所述栅极绝缘层以及所述栅极金属层；
    源漏极金属层，设于所述层间绝缘层上；
    平坦层，设于所述层间绝缘层上且完全覆盖所述源漏极金属层；以及
    导电层，设于所述平坦层上。
  3. 根据权利要求2所述的阵列基板，其中，所述源漏极金属层包括源电极、漏电极和浮动接线层，所述源电极和所述漏电极分别与所述有源层的掺杂区电连接；所述导电层包括阳极段和阴极段，所述阳极段与所述漏电极电连接，所述阴极段与所述浮动接线层电连接。
  4. 根据权利要求3所述的阵列基板，其中，所述覆盖层设有凹槽，所述凹槽裸露所述阳极段和所述阴极段。
  5. 一种显示面板，其中，包括：
    权利要求书1所述的阵列基板；以及
    发光元件，设于所述覆盖层上的凹槽内；所述发光元件包括阳极和阴极，所述阳极与所述阳极段电连接，所述阴极与所述阴极段电连接。
  6. 根据权利要求5所述的显示面板，其中，所述凹槽的深度小于等于所述发光元件的高度。
  7. 根据权利要求5所述的显示面板，其中，所述发光元件包括LED灯珠或micro-LED芯片。
  8. 根据权利要求5所述的显示面板，其中，还包括：
    封装层，设于所述覆盖层上且完全覆盖所述发光元件。
  9. 一种显示面板的制作方法，其包括步骤：
    制作阵列基板步骤，所述阵列基板包括从下至上依次层叠设置的衬底层、驱动电路层以及覆盖层；所述驱动电路层包括导电层，所述导电层包括阳极段和阴极段；所述覆盖层为灰色吸光材料，用于吸收对环境光及所述驱动电路层的反射光；所述覆盖层上设有一凹槽，所述阳极段和所述阴极段裸露于所述凹槽内；以及
    设置发光元件步骤，在所述覆盖层上的凹槽内嵌入一发光元件，所述发光元件包括阳极和阴极，所述阳极通过锡膏焊接与所述阳极段电连接，所述阴极通过锡膏焊接与所述阴极段电连接。
  10. 据权利要求9所述的显示面板的制作方法，其中，所述制作阵列基板步骤包括：
    制作衬底层；
    在所述衬底层上制作驱动电路层；以及
    在所述驱动电路层上制作覆盖层，并通过曝光、显影、固化工艺在对应所述阳极段和所述阴极段位置处蚀刻形成一凹槽，所述凹槽的深度小于等于所述发光元件的高度。
PCT/CN2020/087713 2020-03-12 2020-04-29 一种阵列基板、显示面板及显示面板的制作方法 WO2021179417A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/981,719 US11411149B2 (en) 2020-03-12 2020-04-29 Array substrate, display panel, and manufacturing method of display panel

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010168803.3 2020-03-12
CN202010168803.3A CN111341792B (zh) 2020-03-12 2020-03-12 一种阵列基板、显示面板及显示面板的制作方法

Publications (1)

Publication Number Publication Date
WO2021179417A1 true WO2021179417A1 (zh) 2021-09-16

Family

ID=71187312

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/087713 WO2021179417A1 (zh) 2020-03-12 2020-04-29 一种阵列基板、显示面板及显示面板的制作方法

Country Status (2)

Country Link
CN (1) CN111341792B (zh)
WO (1) WO2021179417A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112242413B (zh) * 2020-10-10 2022-10-04 武汉华星光电技术有限公司 灯板及显示装置
CN112838079B (zh) * 2020-12-31 2022-06-10 湖北长江新型显示产业创新中心有限公司 显示模组及其制作方法
CN113745267A (zh) * 2021-09-06 2021-12-03 深圳市华星光电半导体显示技术有限公司 一种驱动背板、显示面板及驱动背板制作方法
CN114023782B (zh) * 2021-10-19 2023-06-02 深圳市华星光电半导体显示技术有限公司 显示面板、显示面板的制作方法及移动终端

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140166995A1 (en) * 2012-12-17 2014-06-19 Lg Display Co., Ltd. Organic light emitting diode display device
CN108878626A (zh) * 2018-06-29 2018-11-23 京东方科技集团股份有限公司 一种显示面板及制作方法、显示装置
CN110112141A (zh) * 2019-04-26 2019-08-09 深圳市华星光电技术有限公司 微发光二极管显示面板及制备方法
CN209496866U (zh) * 2018-10-22 2019-10-15 隆达电子股份有限公司 显示装置
CN110416225A (zh) * 2019-07-24 2019-11-05 深圳市华星光电半导体显示技术有限公司 一种TFT驱动背板及Micro-LED显示器

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100494557B1 (ko) * 2002-09-05 2005-06-13 한국전자통신연구원 고굴절률 덮개층을 가지는 고효율 발광소자
KR101175931B1 (ko) * 2010-08-02 2012-08-22 김용환 Ｌｅｄ를 이용한 면광원 장치
KR20120130842A (ko) * 2011-05-24 2012-12-04 삼성전자주식회사 하이브리드 표시 장치 및 그의 표시 방법
CN113130725B (zh) * 2015-03-31 2024-09-24 科锐Led公司 具有包封的发光二极管和方法
CN105405943A (zh) * 2015-05-21 2016-03-16 美科米尚技术有限公司 微型发光二极管
CN204834686U (zh) * 2015-07-16 2015-12-02 深圳市同一方光电技术有限公司 一种倒装式无金线封装的超导铝led cob面光源
KR102661474B1 (ko) * 2016-04-11 2024-04-29 삼성디스플레이 주식회사 디스플레이 장치
CN106876406B (zh) * 2016-12-30 2023-08-08 上海君万微电子科技有限公司 基于iii-v族氮化物半导体的led全彩显示器件结构及制备方法
CN107068719B (zh) * 2017-04-19 2019-07-30 京东方科技集团股份有限公司 一种显示基板、其制作方法及显示装置
CN109037239B (zh) * 2018-07-26 2020-11-17 上海天马微电子有限公司 一种阵列基板及其制备方法、显示面板
CN109087986A (zh) * 2018-08-30 2018-12-25 佛山市国星半导体技术有限公司 一种柔性led器件及其制作方法、led灯丝
CN109817676A (zh) * 2019-01-30 2019-05-28 武汉华星光电半导体显示技术有限公司 显示面板及触控显示器
CN110518053A (zh) * 2019-08-29 2019-11-29 合肥鑫晟光电科技有限公司 显示基板及其制备方法、显示装置
CN110797384B (zh) * 2019-11-22 2021-09-03 深圳市华星光电半导体显示技术有限公司 阵列基板、显示面板及阵列基板的制作方法
CN115332271A (zh) * 2022-10-11 2022-11-11 罗化芯显示科技开发(江苏)有限公司 一种显示面板及其制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140166995A1 (en) * 2012-12-17 2014-06-19 Lg Display Co., Ltd. Organic light emitting diode display device
CN108878626A (zh) * 2018-06-29 2018-11-23 京东方科技集团股份有限公司 一种显示面板及制作方法、显示装置
CN209496866U (zh) * 2018-10-22 2019-10-15 隆达电子股份有限公司 显示装置
CN110112141A (zh) * 2019-04-26 2019-08-09 深圳市华星光电技术有限公司 微发光二极管显示面板及制备方法
CN110416225A (zh) * 2019-07-24 2019-11-05 深圳市华星光电半导体显示技术有限公司 一种TFT驱动背板及Micro-LED显示器

Also Published As

Publication number Publication date
CN111341792A (zh) 2020-06-26
CN111341792B (zh) 2023-10-17

Similar Documents

Publication Publication Date Title
WO2021179417A1 (zh) 一种阵列基板、显示面板及显示面板的制作方法
US11050969B2 (en) Panel device and manufacturing method thereof
WO2021007998A1 (zh) 显示面板、显示模组及显示装置
US11552161B2 (en) Display panels and methods for manufacturing the same
WO2020199445A1 (zh) 一种oled显示器件及其制备方法
WO2018086211A1 (zh) 柔性tft基板及其制作方法
US11165038B2 (en) Display module and electronic device with auxiliary electrode layer on cathode layer
US7645176B2 (en) Organic electro-luminescence display and fabricating method thereof
KR102674764B1 (ko) 디스플레이 패널 및 그의 제조 방법
US11289685B2 (en) Display panel with patterned light absorbing layer, and manufacturing method thereof
JP2004342432A (ja) 有機ｅｌ表示装置
KR100472854B1 (ko) 듀얼패널타입 유기전계발광 소자 및 그의 제조방법
US20210359157A1 (en) Display device and method for fabricating same
CN107230699A (zh) 一种显示面板、显示装置及其驱动方法
WO2022179370A1 (zh) 发光器件、显示组件和发光器件的制造方法
CN108258147B (zh) Oled基板及其封装方法、显示装置
WO2020211132A1 (zh) Oled显示装置
CN109859644B (zh) 显示面板及显示模组
CN113345927B (zh) 屏下摄像头显示面板及透明显示区域的制备方法
US20220320060A1 (en) Light-emitting panel and display device
US8541939B2 (en) Organic light emitting diode display device and manufacturing method thereof
US20050140260A1 (en) Organic electroluminescent device having supporting plate and method of fabricating the same
WO2020103349A1 (zh) Oled显示装置及其制作方法
CN106848097A (zh) 一种有机发光显示面板、显示装置及其制作方法
JP2007227275A (ja) 有機発光表示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20923946

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20923946

Country of ref document: EP

Kind code of ref document: A1