Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F2/00—Processes of polymerisation
  • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F2/00—Processes of polymerisation
  • C08F2/46—Polymerisation initiated by wave energy or particle radiation
  • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
  • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
  • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B5/00—Optical elements other than lenses
  • G02B5/20—Filters
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
  • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/022—Quinonediazides
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/022—Quinonediazides
  • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/20—Exposure; Apparatus therefor
  • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B33/00—Electroluminescent light sources
  • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B33/00—Electroluminescent light sources
  • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
  • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers

Definitions

• the present invention relates to a positive photosensitive resin composition.
• the positive photosensitive resin composition is used in the manufacture of partition walls and microlenses used for pixel portions of color filters and organic EL elements (for example, Patent Documents 1 and 2).
• the present invention includes the following aspects. 1.
• 1. Contains an alkali-soluble resin (A), a photosensitizer (B), a cross-linking agent (C), and an ink-repellent agent (D).
• the cross-linking agent (C) contains a compound having at least one selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfo group and a phosphoric acid group as an acidic group.
• the proportion of the compound having an acidic group is in the range of 5 to 35% with respect to the total of (A) + (B) + (C) + (D) in terms of mass ratio, and the ink repellent agent (D)
• a positive photosensitive resin composition containing at least one of an acrylic compound having an F atom and a silicone compound having an F atom. 2.
• 3. The positive photosensitive resin composition according to 1 or 2, wherein the alkali-soluble resin (A) has a mass average molecular weight in the range of 500 to 10000. 4.
• the positive photosensitive resin composition according to any one of 1 to 8 above, which further contains a solvent (E) and the proportion of the compound having a boiling point of 170 ° C. or higher in the solvent is in the range of 10 to 70% by mass. 10.
• the positive photosensitive resin composition of the present invention comprises a combination of an essential component and an optional component.
• the essential component is essentially contained in the positive photosensitive resin composition and gives a main function of performance.
• Optional ingredients are used as needed.
• % means mass%.
• the mass-based ratio percentage, part, etc.
• the numerical range includes the rounded range. Further, when the numerical range is indicated as "X to Y", it means "X or more and Y or less”.
• Examples of the essential component include an alkali-soluble resin (A), a photosensitizer (B), a cross-linking agent (C), and an ink-repellent agent (D).
• A alkali-soluble resin
• B photosensitizer
• C cross-linking agent
• D ink-repellent agent
• the alkali-soluble resin (A) is a resin that dissolves in the alkali used in the developing process, and is a resin that is the main component of the partition wall used in the pixel portion and the like.
• a known resin used in the positive photosensitive resin composition can be used.
• the alkali-soluble resin (A) Japanese Patent No. 6177495, Japanese Patent No. 5447384, Japanese Patent No. 4770985, Japanese Patent No. 4600477, Japanese Patent No. 544749
• the alkali-soluble resin described in Japanese Patent Application Laid-Open No. 2019/156000 is shown, but the alkali-soluble resin (A) is not limited thereto.
• the alkali-soluble resin (A) is preferably a phenol resin.
• a phenol resin is used, the curability of the obtained positive photosensitive resin composition is improved, and the generation of outgas is reduced.
• an orthocresol resin is particularly preferable because the molecular weight of the resin can be controlled to be small.
• the mass average molecular weight of the alkali-soluble resin (A) is preferably in the range of 500 to 10000, more preferably in the range of 1000 to 5000, and preferably in the range of 1000 to 3000. Especially preferable.
• the mass average molecular weight means the mass average molecular weight converted with reference to standard polystyrene, which is measured by gel permeation chromatography (GPC) with tetrahydrofuran as the mobile phase.
• the amount of the alkali-soluble resin (A) used is preferably in the range of 40 to 80%, preferably 50 to 75% of the total of (A) + (B) + (C) + (D) in terms of mass ratio. It is more preferably in the range of%, and particularly preferably in the range of 55 to 72%. When the amount used is within this range, the effect of the present invention can be effectively exhibited.
• the photosensitizer (B) is a compound that reacts with light during exposure to change the solubility of the positive photosensitive resin composition in an alkaline solution.
• Examples of the photosensitizer (B) used in the present invention include known photosensitizers used in positive photosensitive resin compositions.
• a compound having a quinone diazide group hereinafter, also referred to as a quinone diazide compound is preferable because it has excellent photosensitivity.
• the amount of the photosensitizer (B) used is preferably in the range of 10 to 35%, preferably 15 to 30%, based on the total of (A) + (B) + (C) + (D) in terms of mass ratio. It is more preferably in the range of 17 to 22%, and particularly preferably in the range of 17 to 22%. When the amount used is within this range, the effect of the present invention can be effectively exhibited.
• the cross-linking agent (C) is a compound that contributes to the curability of the positive photosensitive resin composition and has two or more photocurable functional groups.
• the photocurable functional group is preferably the same type of functional group as the photocurable functional group contained in the alkali-soluble resin (A). Specifically, an ethylenic double bond is preferable as the photocurable functional group.
• the number of photocurable functional groups contained in the cross-linking agent (C) is 2 or more in one molecule, preferably 3 or more, more preferably 4 or more, and particularly preferably 5 or more. As the number of photocurable functional groups increases, the curability of the coating film surface improves, and the solvent resistance of the cured product and the reliability of outgas and the like improve.
• the cross-linking agent (C) used in the present invention is a compound having one or more selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfo group and a phosphoric acid group as an acidic group (hereinafter, also referred to as a compound having an acidic group). ), And preferably contains a compound having a carboxyl group.
• the number of acidic groups contained in the compound having an acidic group is 1 or more in one molecule, preferably 1 to 3, and particularly preferably 1. When the compound having an acidic group has such a structure, the effect of the present invention can be effectively exhibited.
• the cross-linking agent is uniformly dispersed in the cured film, and the permeability of the developing solution can be improved.
• the mass average molecular weight of the compound having an acidic group is preferably 100 to 1500, more preferably 300 to 1000, and particularly preferably 400 to 800, from the viewpoint of permeation of the developing solution and diffusion into the solution.
• Compounds having an acidic group include, for example, an ester of an aliphatic polyhydroxy compound and an unsaturated carboxylic acid, an ester of an aromatic polyhydroxy compound and an unsaturated carboxylic acid, and a polyisocyanate compound and a (meth) acryloyl-containing hydroxy compound.
• a compound in which an acidic group is introduced by leaving two or more unsaturated bonds (ethylenic double bonds) in an ethylenic compound having a urethane skeleton obtained by reacting with the above is preferable.
• the compound having an acidic group is a compound having an isocyanurate skeleton, a trimethylolpropane skeleton, a phthalic acid skeleton, a pentaerythritol skeleton, a dipentaerythritol skeleton, or a trypentaerythritol skeleton from the viewpoint of the introduction ratio of an ethylenic double bond.
• Is preferable. More preferred specific examples include compounds having a dipentaerythritol skeleton.
• a compound in which an acidic group has been introduced is particularly preferable because the five hydroxy groups of dipentaerythritol are replaced with (meth) acryloyloxy groups and the remaining one hydroxy group is ester-bonded with, for example, succinic acid.
• these compounds contain a photocurable functional group, preferably an ethylenic double bond, more preferably two or more acrylates, preferably three or more, more preferably four or more, particularly preferably four or more photocurable functional groups in one molecule.
• the acid value of the cross-linking agent (C) is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more, and even more preferably 50 mgKOH / g or more.
• the acid value is preferably 200 mgKOH / g or less, more preferably 150 mgKOH / g or less, and even more preferably 100 mgKOH / g or less.
• the acid value is preferably 10 to 200 mgKOH / g, more preferably 20 to 150 mgKOH / g, and particularly preferably 50 to 100 mgKOH / g.
• cross-linking agent (C) the above-mentioned compound having an acidic group may be used alone or in combination with other cross-linking agents.
• the ratio of the compound having an acidic group in the cross-linking agent (C) is preferably 30% or more, more preferably 50% or more, and particularly preferably 60% or more in terms of mass ratio.
• the amount of the compound having an acidic group used is in the range of 5 to 35% with respect to the total of (A) + (B) + (C) + (D) in terms of mass ratio.
• the amount used is preferably 6% or more, more preferably 8% or more.
• the amount used is preferably 25% or less, more preferably 20% or less.
• the amount used is preferably 6 to 25%, particularly preferably 8 to 20%.
• the amount used is at least the above lower limit value, it is easy to achieve both excellent solvent resistance and coatability.
• the amount used is not more than the above upper limit value, the liquid repellency tends to be good.
• the ratio of the cross-linking agent (C) to the alkali-soluble resin (A) is preferably 8% or more, more preferably 10% or more, further preferably 12% or more, and particularly preferably 14% or more. .. Further, such a ratio is preferably 40% or less, more preferably 35% or less, further preferably 30% or less, and particularly preferably 26% or less. Such a ratio is preferably 8 to 40%, more preferably 10 to 35%, particularly preferably 12 to 30%, and most preferably 14 to 26%. When the ratio of the cross-linking agent (C) is in this range with respect to the alkali-soluble resin (A), the balance between the developer solubility and the pattern shape is excellent.
• the ink repellent (D) gives a function of repelling ink to a partition wall made of the positive photosensitive resin composition of the present invention. Therefore, the ink repellent (D) of the present invention has an F atom and has appropriate hydrophobicity and hydrophilicity.
• the ink-repellent agent (D) having an F atom can be selected from the ink-repellent agents usually used in a positive photosensitive resin composition as long as it has an F atom.
• Preferred specific examples include, for example, a copolymer of acrylic and a resin having a silicone skeleton.
• the ink repellent (D) contains at least one of an acrylic compound having an F atom and a silicone compound having an F atom, it is excellent in liquid repellency and the effect of reducing development residue.
• the ink repellent agent described below can be mentioned as a more preferable specific example.
• the ink repellent (D) preferably has a component that can be crosslinked by light or heat.
• the above-mentioned components include components containing a specific functional group and the like. Examples of such a functional group include a (meth) acryloyl group, an epoxy group, a glycidyl group, a thiol group and the like.
• the ink repellent (D) preferably has a compatibility improving component in order to enhance the stability of the ink repellent in the composition.
• the compatibility improving component include a component containing a specific functional group and the like. Examples of such a functional group include an alkyl group, a phenyl group, a phenylamino group, a hydroxyphenyl group and the like.
• the amount of the ink repellent (D) used is preferably in the range of 0.1 to 2.0% with respect to the total of (A) + (B) + (C) + (D) in terms of mass ratio. , 0.5 to 1.0% is particularly preferable. When the amount used is within this range, the effect of the present invention can be effectively exhibited.
• the positive photosensitive resin composition of the present invention may contain a solvent (E).
• a solvent (E) By containing the solvent (E), the positive photosensitive resin composition is excellent in coatability, adhesion to a substrate, and stability.
• the solvent (E) a known solvent used for the positive photosensitive resin composition can be used. Specific examples thereof include alcohols, ethers, aromatics, and hydrocarbons, but the solvent (E) is not limited to these.
• the proportion of the compound having a boiling point of 170 ° C. or higher in the solvent (E) is preferably in the range of 10 to 70% by mass because the uniformity of the coating film of the positive photosensitive resin composition is improved and the layer separation is excellent. , 20-60% by mass is more preferable, and 30-50% by mass is particularly preferable. When the proportion of the compound having a boiling point of 170 ° C. or higher is in this range, the liquid repellency of the surface of the cured product of the present invention can be more effectively exhibited.
• the solvent (E) is preferably in the range of 60 to 90% by mass ratio, particularly preferably in the range of 75 to 85% in the positive photosensitive resin composition.
• the positive photosensitive resin composition of the present invention is a thermosetting agent, a thermosetting accelerator, a colorant, a silane coupling agent, fine particles, a thickener, and a plasticizer as long as the effects of the present invention are not impaired.
• Known components added as a positive photosensitive resin composition such as an agent, a defoaming agent, a leveling agent, an anti-repellent agent, and an ultraviolet absorber, may be added. More specifically, the components described in Japanese Patent No. 6098635, paragraphs 0080 to 0995 may be added.
• the positive photosensitive resin composition contains the alkali-soluble resin (A), the photosensitive agent (B), the cross-linking agent (C) and the ink-repellent agent (D), and if necessary, the solvent and other components until they become uniform. Prepared by mixing.
• the positive photosensitive resin composition of the present invention is suitably used for optical elements such as organic EL elements, microlenses, color filters, and organic TFT arrays, but the applications are not limited thereto.
• a cured product obtained by curing the positive photosensitive resin composition of the present invention can be suitably used for the above-mentioned applications and the like.
• a method for manufacturing an organic EL element is shown.
• a transparent electrode such as tin-doped indium oxide (ITO) is formed on a transparent substrate such as glass by a sputtering method or the like, and if necessary, the transparent electrode is etched into a desired pattern.
• a partition wall (cured product) is formed using the positive photosensitive resin composition of the present invention, the dots are treated with a parent ink, and then the dots are subjected to a hole transport material and a light emitting material by an inkjet method.
• the solutions are applied sequentially and dried to form a hole transport layer and a light emitting layer.
• the pixels of the organic EL element can be obtained by forming an electrode of aluminum or the like by a vapor deposition method or the like.
• Examples 1 to 11 are examples, and examples 12 to 14 are comparative examples.
• evaluation sample Using the positive photosensitive resin composition shown in Table 1, a cured film was prepared on an ITO substrate and used as an evaluation sample. Three types of evaluation samples 1 to 3 were prepared as evaluation samples. The solvent resistance was evaluated using the evaluation sample 1. The liquid repellency was evaluated using the evaluation sample 2. The applicability was evaluated using the evaluation sample 3.
• the exposed ITO substrate was immersed in an aqueous solution of tetramethylammonium hydroxide (0.4% by mass) for 40 seconds for development. Then, it was washed with water and dried. The dried substrate was heated on a hot plate (220 ° C., 60 minutes) to prepare an ITO substrate having a cured film having a specific pattern (evaluation sample 1).
• Example 2 for evaluation The evaluation sample 2 was prepared in the same manner as the evaluation sample 1 except for the step of exposing.
• evaluation sample 3 The evaluation sample 3 was prepared in the same manner as the evaluation sample 1 except that the photomask used was changed.
• Photomask An opening is provided in a range of 20 mm ⁇ 20 mm in the following pattern. Opening shape: 100 ⁇ m x 200 ⁇ m Pattern interval: 20 ⁇ m
• An IJ device (LaboJET 500 Co., Ltd., manufactured by Microjet Co., Ltd.) was used inside the evaluation sample 3 from which the film was removed by developing an arbitrary opening of 100 ⁇ m ⁇ 200 ⁇ m in an area of 20 mm ⁇ 20 mm corresponding to a photomask. 20 pl of a cyclohexylbenzene solution of 1 wt% triphenyldiamine was added dropwise. The spread of the dried triphenyldiamine inside the dots after drying was confirmed. The evaluation was performed according to the following criteria. Good: The inside of the dots was completely covered with a dried product of triphenyldiamine. Impossible: There was a part where the inside of the dot was not covered with the dried product of triphenyldiamine. Good was passed.
• Examples and Comparative Examples The raw materials were stirred (about 30 minutes) at the ratios shown in Table 1 until they became uniform to prepare a positive photosensitive resin composition. Using this, evaluation samples 1, 2 and 3 were prepared and evaluated, respectively. The evaluation results are shown in Table 1. The blanks in the table indicate that the components in the corresponding column are not contained.
• C1 Polybasic acid-modified acrylic oligomer (mixture of dipentaerythritol hexaacrylate, dipentaerythritol pentaacrylate and dipentaerythritol pentaacrylate succinate (acid value 92 mgKOH / g, molecular weight 612))
• C2 2,2,2-triacryloyloxymethylethylphthalic acid (acid value 87 mgKOH / g, molecular weight 446)
• C3 Mixture of dipentaerythritol hexaacrylate and dipentaerythritol pentaacrylate
• the copolymer had a number average molecular weight of 5,540 and a mass average molecular weight of 13,200.
• 130.0 g of the above copolymer solution, 1,1- (bisacryloyloxymethyl) ethyl isocyanate (33.5 g), Dibutyl tin dilaurate (0.13 g), And t-Butyl-p-benzoquinone (1.5 g) were polymerized at 40 ° C. for 24 hours with stirring.
• the polymer was purified with hexane and then dried to give 65.6 g of an ink repellent (D1).

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• 2021
  • 2021-03-01 WO PCT/JP2021/007783 patent/WO2021177251A1/ja not_active Ceased
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