WO2021168925A1 - 一种显示面板、显示装置以及制作方法 - Google Patents

一种显示面板、显示装置以及制作方法 Download PDF

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Publication number
WO2021168925A1
WO2021168925A1 PCT/CN2020/079495 CN2020079495W WO2021168925A1 WO 2021168925 A1 WO2021168925 A1 WO 2021168925A1 CN 2020079495 W CN2020079495 W CN 2020079495W WO 2021168925 A1 WO2021168925 A1 WO 2021168925A1
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WIPO (PCT)
Prior art keywords
substrate
layer
groove
display panel
display area
Prior art date
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PCT/CN2020/079495
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English (en)
French (fr)
Inventor
朱三
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/753,904 priority Critical patent/US11322720B2/en
Publication of WO2021168925A1 publication Critical patent/WO2021168925A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • This application relates to the field of display technology, in particular to a display panel, a display device and a manufacturing method.
  • Organic light emitting diode (Organic Light Emitting Diode, OLED) display is a self-luminous display, and liquid crystal display (liquid Compared with crystal display, LCD), OLED display does not need a backlight, so OLED display is lighter and thinner.
  • OLED display is also more advantageous because of its high brightness, low power consumption, wide viewing angle, high response speed, and wide operating temperature range. It has been used more and more in various high-performance display fields.
  • thin-film encapsulation methods are often used to ensure that organic light-emitting materials and electrodes are not corroded by water vapor and oxygen in the external environment.
  • barrier walls are usually set on the display panel to prevent the outflow of organic matter.
  • the retaining walls in the prior art often use organic acrylic materials. Because organic acrylic materials are not resistant to bending, cracks are likely to occur when the display panel is bent, which not only affects the bending resistance of the display panel, but also due to the expansion of cracks, It will further affect the film packaging performance of the display panel.
  • the present application provides a display panel, a display device, and a manufacturing method to solve the technical problem of stress concentration at the retaining wall when the display panel is bent in the prior art, which causes damage to the packaging layer, thereby causing packaging failure.
  • the present application provides a display panel.
  • the display panel includes: a substrate including a display area and a non-display area surrounding the display area; a light-emitting layer located in the display area of the substrate;
  • the groove is obtained by exposing and developing the substrate, and is arranged in the non-display area of the substrate and surrounds the display area; a thin-film encapsulation layer, the thin-film encapsulation layer covers the light-emitting layer, and the thin-film encapsulation layer includes successively
  • the inorganic layer and the organic layer are arranged at intervals, and the organic layer is located in the area surrounded by the groove.
  • the shape of the groove is any one or a combination of arc, square, trapezoid, and triangle.
  • the groove includes a first groove and a second groove, and the second groove is arranged around the first groove.
  • the thin film encapsulation layer includes at least two inorganic layers and one organic layer; the side of the thin film encapsulation layer adjacent to the substrate and the side away from the substrate are both inorganic layers.
  • the thin film encapsulation layer at least includes a first inorganic layer, a first organic layer, and a second inorganic layer that are sequentially stacked;
  • the first inorganic layer is located on a side of the first organic layer adjacent to the substrate, and the second inorganic layer is located on a side of the first organic layer away from the substrate.
  • the material of the inorganic layer is silicon nitride or silicon oxide
  • the material of the organic layer is epoxy resin, acrylate, acrylic acid or methacrylic acid.
  • the present application also provides a display device, which includes the above display panel.
  • the grooves at the bends of the display device are designed to be zigzags.
  • the present application also provides a display panel manufacturing method.
  • the display panel manufacturing method includes: providing a substrate, the substrate including a display area and a non-display area surrounding the display area; A light emitting layer is formed in the display area of the substrate; a groove is formed on the side of the substrate adjacent to the light emitting layer, and the groove is formed in the non-display area of the substrate and surrounds the display area; and a thin film encapsulation layer is formed
  • the thin-film encapsulation layer covers the light-emitting layer, and the thin-film encapsulation layer includes an inorganic layer and an organic layer arranged at intervals in sequence, and the organic layer is located in an area surrounded by the groove.
  • the step of forming a groove on the side of the substrate adjacent to the light-emitting layer includes: exposing and developing the substrate, thereby forming a groove on the side of the substrate adjacent to the light-emitting layer.
  • the advantage of the present application is that the display panel of the present application is provided with grooves on the substrate, which can effectively improve the bending resistance and film packaging performance of the display panel.
  • FIG. 1 is a schematic structural diagram of an embodiment of a display panel provided by the present application.
  • FIG. 2 is a schematic diagram of the anti-overflow effect of the display panel provided in FIG. 1;
  • FIG. 3 is a schematic structural diagram of an embodiment of a display device provided by the present application.
  • FIG. 4 is a schematic flowchart of an embodiment of a method for manufacturing a display panel provided by the present application
  • FIG. 5 is a schematic structural diagram of an embodiment of a display panel manufacturing apparatus provided by the present application.
  • Fig. 6 is a schematic structural diagram of an embodiment of a computer storage medium provided by the present application.
  • FIG. 1 is a schematic structural diagram of an embodiment of a display panel provided by the present application.
  • the display panel 100 in FIG. 1 includes a substrate 11, a light-emitting layer 12, a thin film encapsulation layer (not shown in the figure), and a groove 13 provided on the substrate 11.
  • the substrate 11 includes a display area 111 and a non-display area 112 surrounding the display area 111.
  • the substrate 11, the light-emitting layer 12 and the thin-film encapsulation layer are laminated in sequence, and the light-emitting layer 12 is located in the display area 111 of the substrate 11.
  • the groove 13 is located in the non-display area 112 of the substrate 11 and surrounds the display area 111. Wherein, the groove 13 can be obtained from the side of the substrate 11 adjacent to the light-emitting layer 12 through exposure and development.
  • the thin-film encapsulation layer covers the light-emitting layer 12.
  • the thin-film encapsulation layer includes an inorganic layer and an organic layer that are arranged at intervals in sequence, and the organic layer is located in the area surrounded by the groove 13.
  • the substrate 11 may be an array substrate that drives the light-emitting layer 12 to emit light.
  • the substrate 11 includes a display area 111 and a non-display area 112.
  • the display area 111 corresponds to the light-emitting layer 12 to realize the display of images
  • the non-display area 112 corresponds to The area is not rendered.
  • the substrate 11 may be transparent, semi-transparent or opaque.
  • the thin film encapsulation layer is located on the light emitting layer 12.
  • the thin-film encapsulation layer protects the light-emitting layer 12 and other thin layers from external moisture, oxygen, and the like.
  • the thin film encapsulation layer may include an inorganic layer and an organic layer, and the inorganic layer and the organic layer are stacked alternately.
  • the groove 13 is arranged in the non-display area 112 of the substrate 11 and surrounds the display area 111.
  • the groove 13 serves as a cut-off layer of the organic layer in the thin film encapsulation layer and is covered by the inorganic layer of the thin film encapsulation layer. At the same time, the groove 13 can be further improved
  • the water and oxygen barrier effect of the display panel 100 prevents the transmission and propagation of cracks in the inorganic layer.
  • the retaining wall often uses organic acrylic material, and the organic acrylic material is not resistant to bending. As the flexible OLED display panel is continuously bent, the retaining wall is prone to cracks and the cracks further expand, which may affect the film of the display panel. Encapsulation performance, and the adhesion between the organic acrylic material and the inorganic layer of the film encapsulation layer is weak. When the display panel is bent, the inorganic layer and the retaining wall are easily separated, so that water vapor and oxygen can easily pass through the inorganic layer and the retaining wall. The separation part enters the inside of the display panel, which affects the lateral water blocking performance of the film encapsulation layer, thereby affecting the life of the display panel.
  • the display panel 100 reduces the concentrated stress generated during bending through the groove 13, so that cracks are not easily generated when the display panel 100 is bent, and the bending resistance and the film packaging performance of the display panel 100 are improved.
  • the side of the thin film encapsulation layer adjacent to the substrate 11 and the side away from the substrate 11 are both inorganic layers.
  • the inorganic layer covers the groove 13 and the organic layer has a certain fluidity.
  • the groove 13 confines the organic layer in the area surrounded by the groove 13 to prevent the organic layer from spreading and increase the width of the non-display area 112.
  • the thin film encapsulation layer includes a first inorganic layer, a first organic layer, and a second inorganic layer.
  • the first inorganic layer is located on the side of the first organic layer close to the substrate 11; the second inorganic layer is located on the side of the first organic layer away from the substrate 11.
  • the first inorganic layer and the second inorganic layer are mainly used to prevent water vapor and oxygen from entering the display panel 100 to corrode the light-emitting layer, and the first organic layer mainly serves as a buffer to reduce the size of the first inorganic layer and the second inorganic layer.
  • the thin film encapsulation layer includes a first inorganic layer, a first organic layer and a second inorganic layer. On the one hand, it can prevent water vapor and oxygen from entering the inside of the display panel 100, and on the other hand, the thin film encapsulation layer has a smaller thickness. The development trend of thinner and lighter display panels.
  • the thin-film encapsulation layer includes two inorganic layers and one organic layer, and is not a limitation of the present invention.
  • the thin-film encapsulation layer may also include successively Multiple inorganic layers and multiple organic layers arranged at intervals.
  • the material of the above-mentioned inorganic layer is silicon nitride or silicon oxide
  • the material of the organic layer is epoxy resin, acrylate, acrylic acid or methacrylic acid.
  • the shape of the groove 13 is any one or a combination of arcs, squares, trapezoids, and triangles.
  • multiple rows of grooves 13 may also be provided on the substrate 11, which specifically include at least a first groove (not shown in the figure) and a second groove (not shown in the figure). The second groove is arranged around the first groove.
  • FIG. 2 Please refer to FIG. 2 for details of the anti-overflow effect of the groove 13.
  • the organic polymer in the film encapsulation process is printed in a specific area, and the specific area is the display area 111.
  • the organic polymer will first enter the groove 13 and flow along the groove 13, slowing down the tendency of the polymer to flow along the overflow direction and making it flow in the area inside the groove 13, thereby greatly reducing The feasibility of organic polymer overflow during flow is improved.
  • FIG. 3 is a schematic structural diagram of an embodiment of the display device provided in the present application.
  • the display device 200 of this embodiment includes a housing 21 and the display panel (not shown in the figure) in the above-mentioned embodiment. As shown in the figure, at the bending position of the display device 200, the groove 22 on the display panel has a zigzag design, which can greatly increase the number of bending of the display panel.
  • FIG. 4 is a schematic flowchart of an embodiment of the method for manufacturing a display panel provided by the present application.
  • the manufacturing method of the display panel of this embodiment specifically includes the following steps:
  • S401 Provide a substrate.
  • the substrate includes a display area and a non-display area surrounding the display area.
  • S403 forming a groove on the side of the substrate adjacent to the light-emitting layer, the groove being formed in the non-display area of the substrate and surrounding the display area.
  • a photosensitive polyimide material is used to expose and develop the substrate, thereby forming a groove on the side of the substrate adjacent to the light-emitting layer.
  • S404 forming a thin-film encapsulation layer, the thin-film encapsulation layer covers the light-emitting layer, the thin-film encapsulation layer includes an inorganic layer and an organic layer arranged at intervals in sequence, and the organic layer is located in an area surrounded by the groove.
  • FIG. 5 is a schematic structural diagram of an embodiment of the display panel manufacturing apparatus provided in the present application.
  • the display panel manufacturing apparatus 500 of this embodiment includes a processor 51, a memory 52, an input and output device 53 and a bus 54.
  • the processor 51, the memory 52, and the input/output device 53 are respectively connected to the bus 54.
  • the memory 52 stores a computer program.
  • the processor 51 is used to execute the computer program to implement the display panel manufacturing method described in the foregoing embodiment.
  • the processor 51 may also be referred to as a CPU (Central Processing Unit, central processing unit).
  • the processor 51 may be an integrated circuit chip with signal processing capability.
  • the processor 51 may also be a general-purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, a discrete gate or transistor logic device, or a discrete hardware component.
  • DSP digital signal processor
  • ASIC application specific integrated circuit
  • FPGA field programmable gate array
  • the general-purpose processor may be a microprocessor or the processor 51 may also be any conventional processor or the like.
  • the present application also provides a computer storage medium.
  • the computer storage medium 600 is used to store a computer program 61.
  • the computer program 61 is executed by a processor, it is used to implement the display panel manufacturing method provided in this application. The method described in the example.
  • the method involved in the embodiment of the display panel manufacturing method provided in this application when implemented in the form of a software functional unit and sold or used as an independent product, can be stored in the device, for example, a computer readable storage medium.
  • the technical solution of the present application essentially or the part that contributes to the existing technology or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium , Including several instructions to make a computer device (which may be a personal computer, a server, or a network device, etc.) or a processor (processor) execute all or part of the steps of the methods described in the various embodiments of the present invention.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disks or optical disks and other media that can store program codes.
  • the subject of this application can be manufactured and used in industry and has industrial applicability.

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  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

本申请提出了一种显示面板，其包括：基板，包括显示区和围绕显示区的非显示区；发光层，位于基板的显示区内；凹槽，对基板曝光显影得到，设置于基板的非显示区内，且围绕显示区；薄膜封装层，覆盖发光层，薄膜封装层包括依次间隔设置的无机层和有机层，有机层位于凹槽围绕的区域内。该显示面板具有较佳的耐弯折性能。

Description

一种显示面板、显示装置以及制作方法 技术领域
本申请涉及显示技术领域，具体涉及一种显示面板、显示装置以及制作方法。
 背景技术
有机发光二极管(Organic Light Emitting Diode，OLED)显示器是一种自发光显示器，与液晶显示器(liquid crystal display，LCD)相比，OLED显示器不需要背光源，因此OLED显示器更为轻薄，此外OLED显示器还因具有高亮度、低功耗、宽视角、高响应速度、宽使用温度范围等优点而越来越多地被应用于各种高性能显示领域当中。
现有技术中常使用薄膜封装的方法来保证有机发光材料和电极不受外界环境中水汽和氧气的侵蚀。一般为防止薄膜封装中有机材料在制作过程中溢流到显示面板边缘，影响显示面板的侧向封装效果，通常在显示面板上设置挡墙以阻挡有机物外流。
 技术问题
现有技术中的挡墙常采用有机亚克力材料，由于有机亚克力材料的不耐弯折，当显示面板弯折时容易有裂纹产生，不仅影响显示面板的耐弯折性能，并且由于裂纹的扩展，会进一步影响显示面板的薄膜封装性能。
 技术解决方案
本申请提供一种显示面板、显示装置以及制作方法，以解决现有技术中显示面板弯折时，挡墙处应力集中，造成封装层损坏，从而引起封装失效的技术问题。
为解决上述技术问题，本申请提供了一种显示面板，所述显示面板包括：基板，包括显示区和围绕所述显示区的非显示区；发光层，位于所述基板的显示区内；凹槽，对所述基板曝光显影得到，设置于所述基板的非显示区内，且围绕所述显示区；薄膜封装层，所述薄膜封装层覆盖所述发光层，所述薄膜封装层包括依次间隔设置的无机层和有机层，所述有机层位于所述凹槽围绕的区域内。
其中，所述凹槽的形状为圆弧形、方形、梯形、三角形中的任意一种或多种的组合。
其中，所述凹槽包括第一凹槽和第二凹槽，所述第二凹槽围绕所述第一凹槽设置。
其中，所述薄膜封装层至少包括两层无机层和一层有机层；所述薄膜封装层临近所述基板的一侧和远离所述基板的一侧均为无机层。
其中，所述薄膜封装层至少包括依次层叠的第一无机层、第一有机层和第二无机层；
所述第一无机层位于所述第一有机层临近所述基板的一侧，所述第二无机层位于所述第一有机层远离所述基板的一侧。
其中，所述无机层的材料为氮化硅或氧化硅，所述有机层的材料为环氧基树脂、丙烯酸酯、元丙烯酸或甲基丙烯酸。
为解决上述技术问题，本申请还提供了一种显示装置，所述显示装置包括上述的显示面板。
其中，所述显示装置弯折处的凹槽曲折设计。
为解决上述技术问题，本申请还提供了一种显示面板制作方法，所述显示面板制作方法包括：提供一基板，所述基板包括显示区和围绕所述显示区的非显示区；在所述基板的显示区形成发光层；在所述基板临近所述发光层的一侧形成凹槽，所述凹槽形成于所述基板的非显示区内，且围绕所述显示区；形成薄膜封装层，所述薄膜封装层覆盖所述发光层，所述薄膜封装层包括依次间隔设置的无机层和有机层，所述有机层位于所述凹槽围绕的区域内。
其中，所述在所述基板临近所述发光层的一侧形成凹槽的步骤，包括：对所述基板进行曝光显影，从而在所述基板临近所述发光层的一侧形成凹槽。
 有益效果
本申请的优点在于，本申请的显示面板在基板上设置有凹槽，能够有效提高显示面板的耐弯折性能和薄膜封装性能。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。其中：
图1是本申请提供的显示面板一实施例的结构示意图；
图2是图1提供的显示面板防溢流效果的示意图；
图3是本申请提供的显示装置一实施例的结构示意图；
图4是本申请提供的显示面板制作方法一实施例的流程示意图；
图5是本申请提供的显示面板制作装置一实施例的结构示意图；
图6是本申请提供的计算机存储介质一实施例的结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。可以理解的是，此处所描述的具体实施例仅用于解释本申请，而非对本申请的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与本申请相关的部分而非全部结构。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参见图1，其中，图1是本申请提供的显示面板一实施例的结构示意图。图1中的显示面板100包括基板11、发光层12、薄膜封装层（图中未示出）以及设置与基板11上的凹槽13。
其中，基板11包括显示区111和围绕显示区111的非显示区112。基板11、发光层12和薄膜封装层依次层叠，发光层12位于基板11的显示区111内。凹槽13，位于基板11的非显示区112内，且围绕显示区111。其中，凹槽13可以由基板11临近发光层12的一侧经曝光显影得到。
薄膜封装层，覆盖发光层12，薄膜封装层包括依次间隔设置的无机层和有机层，有机层位于凹槽13围绕的区域内。
在本实施例中，基板11可以为驱动发光层12发光的阵列基板，基板11包括显示区111和非显示区112，显示区111对应具有发光层12，实现画面的显示，非显示区112对应的区域不呈现。其中，基板11可以是透明的、半透明的或不透明的。
薄膜封装层位于发光层12上。薄膜封装层保护发光层12和其它薄层免受外部湿气和氧等的影响。薄膜封装层可以包括无机层和有机层，无机层和有机层交错堆叠。凹槽13设置于基板11的非显示区112内，且围绕显示区111，凹槽13作为薄膜封装层中有机层的截止层，被薄膜封装层的无机层覆盖，同时凹槽13可以进一步提升显示面板100的阻隔水氧的效果，防止无机层裂纹的传输和扩展。
对于柔性OLED显示面板而言，正向与侧向水汽入侵是比较常见的影响OLED显示面板寿命的问题。现有技术中挡墙常采用有机亚克力材料，而有机亚克力材料不耐弯折，随着柔性OLED显示面板不断地弯折，挡墙容易有裂纹产生，裂纹进一步扩展，可能会影响显示面板的薄膜封装性能，并且有机亚克力材料与薄膜封装层的无机层之间的粘附力较弱，显示面板弯折时，无机层与挡墙之间容易分离，使水汽和氧气容易由无机层与挡墙的分离处进入显示面板内部，影响薄膜封装层的侧向阻水性能，从而影响显示面板寿命。
在本实施例中，显示面板100通过凹槽13减少弯折时产生的集中应力，使得显示面板100弯折时不易产生裂纹，提高了显示面板100的耐弯折性能和薄膜封装性能。
进一步地，薄膜封装层临近基板11的一侧和远离基板11的一侧均为无机层。
具体地，无机层覆盖凹槽13，有机层具有一定的流动性，凹槽13将有机层限定在凹槽13围绕的区域内，避免有机层蔓延而增大非显示区112的宽度。通过设置临近基板11的一侧和远离基板11的一侧均为无机层，且无机层覆盖凹槽13，可以更好的避免水汽和氧气进入显示面板100内部，避免显示面板100被水汽或氧气腐蚀。
在本实施例中，薄膜封装层包括第一无机层、第一有机层和第二无机层。
第一无机层位于第一有机层临近基板11的一侧；第二无机层位于第一有机层远离基板11的一侧。
具体的，第一无机层和第二无机层主要用于阻止水汽和氧气进入显示面板100内部腐蚀发光层，第一有机层主要起缓冲作用，用于减小第一无机层和第二无机层之间的应力。薄膜封装层包括第一无机层、第一有机层第二无机层三层膜层，一方面能够保证阻止水汽和氧气进入显示面板100内部，另一方面使得薄膜封装层具有较小的厚度，符合显示面板轻薄化的发展趋势。
需要说明的是,本实施例仅示例性的示出了薄膜封装层包括两层无机层和一层有机层的情况,并非对本发明的限定,在其他实施方式中,薄膜封装层还可以包括依次间隔设置的多层无机层和多层有机层。
其中，上述无机层的材料为氮化硅或氧化硅，有机层的材料为环氧基树脂、丙烯酸酯、元丙烯酸或甲基丙烯酸。
在本申请中，凹槽13的形状为圆弧形、方形、梯形、三角形中的任意一种或多种的组合。为了进一步提高薄膜封装效果，基板11上还可以设置有多行凹槽13，具体至少包括第一凹槽（图中未示出）和第二凹槽（图中未示出）。第二凹槽围绕第一凹槽设置。
凹槽13的防溢流效果具体请参阅图2，如图2所示，薄膜封装工艺中的有机聚合物在特定区域打印，特定区域即显示区域111。当出现异常边缘流平时，有机聚合物首先会进入凹槽13，并沿着凹槽13流动，减缓聚合物沿着外溢方向流动的趋势，使之在凹槽13内区域流动，从而极大地减少了有机聚合物流平时外溢的可行性。
本申请还提供了一种显示装置，具体请参阅图3，图3是本申请提供的显示装置一实施例的结构示意图。
本实施例的显示装置200包括壳体21以及上述实施例中的显示面板（图中未示出）。如图所示，在显示装置200的弯折处，显示面板上的凹槽22呈曲折设计，可以及大地提高显示面板的可弯折次数。
本申请还提供了一种显示面板的制作方法，具体请参阅图4，图4是本申请提供的显示面板制作方法一实施例的流程示意图。
如图4所示，本实施例的显示面板制作方法具体包括以下步骤：
S401：提供一基板，基板包括显示区和围绕显示区的非显示区。
S402：在基板的显示区形成发光层。
S403：在基板临近发光层的一侧形成凹槽，凹槽形成于基板的非显示区内，且围绕显示区。
其中，使用光敏聚酰亚胺材料对基板进行曝光显影，从而在基板临近发光层的一侧形成凹槽。
S404：形成薄膜封装层，薄膜封装层覆盖发光层，薄膜封装层包括依次间隔设置的无机层和有机层，有机层位于凹槽围绕的区域内。
为了实现上述的显示面板制作方法，本申请还提供了一种显示面板制作装置，具体请参阅图5，图5是本申请提供的显示面板制作装置一实施例的结构示意图。
如图6所示，本实施例的显示面板制作装置500包括处理器51、存储器52、输入输出设备53以及总线54。
该处理器51、存储器52、输入输出设备53分别与总线54相连，该存储器52中存储有计算机程序，处理器51用于执行计算机程序以实现上述实施例所述的显示面板制作方法。
在本实施例中，处理器51还可以称为CPU（Central Processing Unit，中央处理单元）。处理器51可能是一种集成电路芯片，具有信号的处理能力。处理器51还可以是通用处理器、数字信号处理器（DSP）、专用集成电路（ASIC）、现场可编程门阵列（FPGA）或者其它可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件。通用处理器可以是微处理器或者该处理器51也可以是任何常规的处理器等。
本申请还提供一种计算机存储介质，如图6所示，计算机存储介质600用于存储计算机程序61，计算机程序61在被处理器执行时，用以实现如本申请提供的显示面板制作方法实施例中所述的方法。
本申请提供的显示面板制作方法实施例中所涉及到的方法，在实现时以软件功能单元的形式存在并作为独立的产品销售或使用时，可以存储在装置中，例如一个计算机可读取存储介质。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备（可以是个人计算机，服务器，或者网络设备等）或处理器（processor）执行本发明各个实施方式所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器（ROM，Read-Only Memory）、随机存取存储器（RAM，Random Access Memory）、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。
 工业实用性
本申请的主题可以在工业中制造和使用，具备工业实用性。

Claims (10)

  1. 一种显示面板，其特征在于，所述显示面板包括：
    基板，包括显示区和围绕所述显示区的非显示区；
    发光层，位于所述基板的显示区内；
    凹槽，对所述基板曝光显影得到，设置于所述基板的非显示区内，且围绕所述显示区；
    薄膜封装层，所述薄膜封装层覆盖所述发光层，所述薄膜封装层包括依次间隔设置的无机层和有机层，所述有机层位于所述凹槽围绕的区域内。
  2. 根据权利要求1所述的显示面板，其特征在于，
    所述凹槽的形状为圆弧形、方形、梯形、三角形中的任意一种或多种的组合。
  3. 根据权利要求2所述的显示面板，其特征在于，所述凹槽包括第一凹槽和第二凹槽，所述第二凹槽围绕所述第一凹槽设置。
  4. 根据权利要求1所述的显示面板，其特征在于，
    所述薄膜封装层至少包括两层无机层和一层有机层；所述薄膜封装层临近所述基板的一侧和远离所述基板的一侧均为无机层。
  5. 根据权利要求4所述的显示面板，其特征在于，
    所述薄膜封装层至少包括依次层叠的第一无机层、第一有机层和第二无机层；
    所述第一无机层位于所述第一有机层临近所述基板的一侧，所述第二无机层位于所述第一有机层远离所述基板的一侧。
  6. 根据权利要求1所述的显示面板，其特征在于，
    所述无机层的材料为氮化硅或氧化硅，所述有机层的材料为环氧基树脂、丙烯酸酯、元丙烯酸或甲基丙烯酸。
  7. 一种显示装置，其特征在于，所述显示装置包括权利要求1所述的显示面板。
  8. 根据权利要求7所述的显示装置，其特征在于，所述显示装置弯折处的凹槽曲折设计。
  9. 一种显示面板制作方法，其特征在于，所述显示面板制作方法包括：
    提供一基板，所述基板包括显示区和围绕所述显示区的非显示区；
    在所述基板的显示区形成发光层；
    在所述基板临近所述发光层的一侧形成凹槽，所述凹槽形成于所述基板的非显示区内，且围绕所述显示区；
    形成薄膜封装层，所述薄膜封装层覆盖所述发光层，所述薄膜封装层包括依次间隔设置的无机层和有机层，所述有机层位于所述凹槽围绕的区域内。
  10. 根据权利要求9所述的显示面板制作方法，其特征在于，
    所述在所述基板临近所述发光层的一侧形成凹槽的步骤，包括：
    对所述基板进行曝光显影，从而在所述基板临近所述发光层的一侧形成凹槽。
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