CN112997315A - 显示基板及其制备方法、显示装置 - Google Patents
显示基板及其制备方法、显示装置 Download PDFInfo
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- CN112997315A CN112997315A CN201980001984.6A CN201980001984A CN112997315A CN 112997315 A CN112997315 A CN 112997315A CN 201980001984 A CN201980001984 A CN 201980001984A CN 112997315 A CN112997315 A CN 112997315A
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- 239000000758 substrate Substances 0.000 title claims abstract description 417
- 238000002360 preparation method Methods 0.000 title abstract description 5
- 230000002093 peripheral effect Effects 0.000 claims abstract description 204
- 238000005538 encapsulation Methods 0.000 claims abstract description 90
- 239000000463 material Substances 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 37
- 238000005520 cutting process Methods 0.000 claims description 32
- 238000004519 manufacturing process Methods 0.000 claims description 29
- 229920002120 photoresistant polymer Polymers 0.000 claims description 28
- 230000008569 process Effects 0.000 claims description 24
- 239000011810 insulating material Substances 0.000 claims description 21
- 238000000059 patterning Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 575
- 239000011229 interlayer Substances 0.000 description 37
- 230000004888 barrier function Effects 0.000 description 29
- 229920000642 polymer Polymers 0.000 description 23
- 239000011368 organic material Substances 0.000 description 18
- 239000010408 film Substances 0.000 description 11
- 229920001721 polyimide Polymers 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000004020 conductor Substances 0.000 description 7
- 238000000151 deposition Methods 0.000 description 7
- 229910010272 inorganic material Inorganic materials 0.000 description 7
- 239000011147 inorganic material Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000007769 metal material Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- 239000010409 thin film Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 239000000956 alloy Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 239000002861 polymer material Substances 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- -1 acryl Chemical group 0.000 description 4
- 239000002274 desiccant Substances 0.000 description 4
- 239000002346 layers by function Substances 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 150000008378 aryl ethers Chemical class 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical compound C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 150000003384 small molecules Chemical class 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- NRNFFDZCBYOZJY-UHFFFAOYSA-N p-quinodimethane Chemical group C=C1C=CC(=C)C=C1 NRNFFDZCBYOZJY-UHFFFAOYSA-N 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种显示基板及其制备方法、显示装置。该显示基板包括衬底基板(1110)、像素驱动层(1210)、发光器件(1220)、封装层(1170)、第一绝缘层(1140)及覆盖层(1160)。衬底基板(1110)包括显示区及外围区(1120)，外围区(1120)包括第一外围区(1121)和第二外围区(1122)，第一外围区(1121)在显示区(1130)和第二外围区(1122)之间。第一绝缘层(1140)位于第二外围区(1122)，第一绝缘层(1140)在衬底基板(1110)的至少部分边缘的位置具有第一切口(1150)，第一切口(1150)沿衬底基板的边缘延伸，且第一切口(1150)的远离显示区(1130)的一侧边与衬底基板(1110)的边缘(1111)重叠。覆盖层(1160)位于第二外围(1122)区域，覆盖层(1160)至少部分填充在第一切口(1150)中，且覆盖层(1160)在衬底基板(1110)上的正投影与第一切口(1150)在衬底基板(1110)上的正投影至少部分重叠。
Description
PCT国内申请，说明书已公开。
Claims (25)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/111431 WO2021072671A1 (zh) | 2019-10-16 | 2019-10-16 | 显示基板及其制备方法、显示装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112997315A true CN112997315A (zh) | 2021-06-18 |
Family
ID=75538202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980001984.6A Pending CN112997315A (zh) | 2019-10-16 | 2019-10-16 | 显示基板及其制备方法、显示装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11889715B2 (zh) |
| EP (1) | EP4047659A4 (zh) |
| CN (1) | CN112997315A (zh) |
| WO (1) | WO2021072671A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113571568A (zh) * | 2021-07-26 | 2021-10-29 | 京东方科技集团股份有限公司 | 显示装置及显示面板 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110379823B (zh) * | 2019-07-24 | 2021-01-01 | 武汉华星光电半导体显示技术有限公司 | 一种阵列基板及oled显示面板 |
| KR20220022931A (ko) * | 2020-08-19 | 2022-03-02 | 삼성디스플레이 주식회사 | 표시 패널과 그의 제조 방법 |
| KR20220051095A (ko) * | 2020-10-16 | 2022-04-26 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN113838872B (zh) * | 2021-09-26 | 2024-02-13 | 京东方科技集团股份有限公司 | 显示基板及显示装置 |
| CN114420869B (zh) * | 2022-01-17 | 2024-03-12 | 京东方科技集团股份有限公司 | 一种显示基板及显示装置 |
| CN117083998A (zh) * | 2022-01-30 | 2023-11-17 | 京东方科技集团股份有限公司 | 显示面板、显示装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108281570A (zh) * | 2018-02-27 | 2018-07-13 | 京东方科技集团股份有限公司 | 一种显示面板及其制作方法 |
| KR20190064254A (ko) * | 2017-11-30 | 2019-06-10 | 엘지디스플레이 주식회사 | 표시장치 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050248270A1 (en) * | 2004-05-05 | 2005-11-10 | Eastman Kodak Company | Encapsulating OLED devices |
| US8952413B2 (en) * | 2012-03-08 | 2015-02-10 | Micron Technology, Inc. | Etched trenches in bond materials for die singulation, and associated systems and methods |
| KR101907593B1 (ko) | 2013-08-13 | 2018-10-15 | 삼성디스플레이 주식회사 | 가요성 표시 장치 |
| KR102420461B1 (ko) | 2015-02-06 | 2022-07-14 | 삼성디스플레이 주식회사 | 디스플레이 장치 및 이의 제조 방법 |
| CN106653820B (zh) * | 2017-03-08 | 2019-04-05 | 京东方科技集团股份有限公司 | 一种柔性显示面板及制作方法、柔性显示装置 |
| CN107808896B (zh) * | 2017-10-27 | 2021-02-02 | 上海天马微电子有限公司 | 一种显示面板、显示面板的制作方法及显示装置 |
| JP2019102147A (ja) * | 2017-11-29 | 2019-06-24 | 株式会社ジャパンディスプレイ | 表示装置と表示装置の製造方法 |
| KR102489225B1 (ko) * | 2017-12-13 | 2023-01-17 | 엘지디스플레이 주식회사 | 표시장치와 그의 제조방법 |
| KR102538983B1 (ko) * | 2018-01-11 | 2023-06-02 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| CN109003998A (zh) | 2018-06-25 | 2018-12-14 | 云谷（固安）科技有限公司 | 一种柔性显示面板和柔性显示装置 |
| CN109728200B (zh) | 2019-01-03 | 2022-02-08 | 京东方科技集团股份有限公司 | 显示基板、显示基板的制备方法、显示装置 |
| US11463063B2 (en) * | 2019-07-25 | 2022-10-04 | Zhuhai Crystal Resonance Technologies Co., Ltd. | Method for packaging an electronic component in a package with an organic back end |
-
2019
- 2019-10-16 CN CN201980001984.6A patent/CN112997315A/zh active Pending
- 2019-10-16 WO PCT/CN2019/111431 patent/WO2021072671A1/zh unknown
- 2019-10-16 US US16/979,969 patent/US11889715B2/en active Active
- 2019-10-16 EP EP19945464.6A patent/EP4047659A4/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20190064254A (ko) * | 2017-11-30 | 2019-06-10 | 엘지디스플레이 주식회사 | 표시장치 |
| CN108281570A (zh) * | 2018-02-27 | 2018-07-13 | 京东方科技集团股份有限公司 | 一种显示面板及其制作方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113571568A (zh) * | 2021-07-26 | 2021-10-29 | 京东方科技集团股份有限公司 | 显示装置及显示面板 |
Also Published As
| Publication number | Publication date |
|---|---|
| US11889715B2 (en) | 2024-01-30 |
| WO2021072671A1 (zh) | 2021-04-22 |
| EP4047659A1 (en) | 2022-08-24 |
| EP4047659A4 (en) | 2022-10-12 |
| US20210257589A1 (en) | 2021-08-19 |
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