WO2021164077A1 - 补强制作贴合方法 - Google Patents

补强制作贴合方法 Download PDF

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Publication number
WO2021164077A1
WO2021164077A1 PCT/CN2020/079293 CN2020079293W WO2021164077A1 WO 2021164077 A1 WO2021164077 A1 WO 2021164077A1 CN 2020079293 W CN2020079293 W CN 2020079293W WO 2021164077 A1 WO2021164077 A1 WO 2021164077A1
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Prior art keywords
reinforcement
template
area
thickness
reinforcing
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PCT/CN2020/079293
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English (en)
French (fr)
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杨桂霞
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瑞声声学科技(深圳)有限公司
瑞声科技(沭阳)有限公司
瑞声精密电子沭阳有限公司
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Publication of WO2021164077A1 publication Critical patent/WO2021164077A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • the present invention relates to the field of reinforcement technology, and in particular to a method of reinforcement manufacturing and bonding.
  • the reinforcement layer includes a plurality of reinforcements of different thicknesses, and the reinforcements of different thicknesses are respectively attached and fixed to the product.
  • the purpose of the present invention is to overcome the above-mentioned technical problems and provide a reinforcement manufacturing and bonding method that can integrate reinforcement sets of different thicknesses to realize one-time striping and high product assembly efficiency.
  • the present invention provides a method of bonding a reinforcing making, having applied to n different thickness of the reinforcing reinforcement needs to be punched template product, said product comprising a reinforcing need to be D 1 is the thickness of the reinforcing
  • Step S1 Prepare n reinforcement templates, including the first reinforcement template to the nth reinforcement template in sequence; the n reinforcement templates correspond to the typesetting of the stamping template of the product to be reinforced, and the first The reinforcing template has a thickness D 1 , the second reinforcing template has a thickness D 2 -D 1 , ..., the n-1th reinforcing template has a thickness D n-1 -D n-2 , the first The n reinforcing template has a thickness of D n -D n-1 ;
  • Step S2. Perform punching processing on the n-th reinforcement template, which will correspond to the first reinforcement area, the second reinforcement area,..., the n-2th reinforcement area and the n-1th reinforcement area. Area punching removal;
  • Step S3 Perform punching processing on the n-1th reinforcement template, which will correspond to the first reinforcement zone, the second reinforcement zone,..., the n-3th reinforcement zone and the n-2th reinforcement zone The area of the zone is punched and removed;
  • Step Sn performing punching processing on the second reinforcement template, and punching and removing the area corresponding to the first reinforcement zone;
  • Step Sn+1 processing the first reinforcing template, and punching out the area corresponding to the non-reinforcing area;
  • the n-1 reinforcement templates that have undergone the punching processing of steps S2 to Sn are sequentially stacked and attached to the first reinforcement template that has undergone the punching processing of step Sn+1, and Perform false pressure to obtain a set of reinforcement layers;
  • step Sn+3 the reinforcement layer is assembled and attached to the stamping template of the product to be reinforced, and the product is stamped again, and excess reinforcement template waste is recovered for recycling.
  • the product is a flexible circuit board.
  • the reinforcement is made of polyimide.
  • the reinforcement manufacturing method of the present invention includes the following steps: step S1, preparing n reinforcement templates; step S2, punching the nth reinforcement template; step S3, The n-1th reinforcement template is punched; ... step Sn, the second reinforcement template is punched; step Sn+1, the first reinforcement template is processed; step Sn +2.
  • the n-1 reinforcement templates after the punching process of steps S2 to Sn are sequentially stacked and attached to the first reinforcement template after the punching process of step Sn+1, and the false pressure is performed to obtain the reinforcement Layer assembly; step Sn+3, attach the reinforcement layer assembly to the stamping template of the product to be reinforced.
  • the reinforcement manufacturing method of the present invention decomposes thick reinforcements into thin reinforcements, which can integrate reinforcements of different thicknesses on the product to the same strip to achieve strips, that is, to integrate reinforcements of different thicknesses. To the same strip to achieve one strip stick, so that the assembly efficiency is high.
  • Fig. 1 is a flow chart of the method of reinforcing, manufacturing and bonding according to the present invention
  • FIG. 2 is a schematic diagram of the first reinforcement template in the first embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a second reinforcement template in the first embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the reinforcing layer assembly in the first embodiment of the present invention being attached to the template of the product to be reinforced;
  • Fig. 5 is a schematic diagram of the stamped product in the first embodiment of the present invention.
  • FIG. 6 is a schematic diagram of the first reinforcement template in the second embodiment of the present invention.
  • FIG. 7 is a schematic diagram of the second reinforcement template in the second embodiment of the present invention.
  • FIG. 8 is a schematic diagram of the third reinforcement template in the second embodiment of the present invention.
  • FIG. 9 is a schematic diagram of the reinforcement layer assembly in the second embodiment of the present invention being attached to the product template to be reinforced;
  • Fig. 10 is a schematic diagram of the stamped product in the second embodiment of the present invention.
  • FIG. 1 a reinforcement manufacturing method provided by the present invention.
  • the reinforcement manufacturing and bonding method is applied to stamping templates of products to be reinforced with n different thickness reinforcement requirements.
  • the to-be-reinforced product includes the first reinforcement area that needs D 1 thickness reinforcement, the second reinforcement area that needs D 2 thickness reinforcement,..., the n-1th reinforcement area that needs D n-1 thickness reinforcement A strong area, an n-th reinforced area that requires D n thickness reinforcement, and a non-reinforced area.
  • n ⁇ 2
  • n is a positive integer.
  • the reinforcement manufacturing method includes the following steps:
  • Step S1 Prepare n reinforcement templates, including the first reinforcement template to the nth reinforcement template in sequence.
  • the n reinforcement templates correspond to the typesetting of the stamping templates of the product to be reinforced.
  • the first reinforcement template has a thickness D 1
  • the second reinforcement template has a thickness D 2 -D 1
  • the n-1th reinforcement template has a thickness D n-1 -D n-2
  • the nth reinforcing template has a thickness D n -D n-1 .
  • Step S2. Perform punching processing on the n-th reinforcement template, which will correspond to the first reinforcement area, the second reinforcement area,..., the n-2th reinforcement area and the n-1th reinforcement area. Area die cut removal.
  • Step S3 Perform punching processing on the n-1th reinforcement template, which will correspond to the first reinforcement zone, the second reinforcement zone,..., the n-3th reinforcement zone and the n-2th reinforcement zone The area of the zone is punched out.
  • step Sn punching processing is performed on the second reinforcement template, and the area corresponding to the first reinforcement area is punched and removed.
  • Step Sn+1 processing the first reinforcing template, and punching out the area corresponding to the non-reinforcing area.
  • the n-1 reinforcement templates that have undergone the punching processing of steps S2 to Sn are sequentially stacked and attached to the first reinforcement template that has undergone the punching processing of step Sn+1, and Perform false pressure to obtain a set of reinforcement layers.
  • the implementation of this step will integrate the reinforcements of different thicknesses into the same strip to realize one-time striping, so that the assembly efficiency is high.
  • step Sn+3 the reinforcement layer is assembled and attached to the stamping template of the product to be reinforced, and the product is stamped again, and excess reinforcement template waste is recovered for recycling.
  • the method of attaching the reinforcing layer assembly strip to the template of the product to be reinforced is implemented, and then the product is stamped, which is beneficial to improve production efficiency.
  • the product is a flexible circuit board.
  • the reinforcement is made of polyimide. Of course, other materials are also possible, and different materials can be selected for the reinforcement according to actual needs.
  • FIGS. 2-5 Please refer to FIGS. 2-5.
  • the following uses two kinds of stamping templates 100 of the product 10 to be reinforced with different thickness reinforcement requirements as the first embodiment to illustrate the reinforcement manufacturing and bonding method of the present invention.
  • the product 10 to be reinforced need D 1 comprises a first thickness of the reinforcing reinforcement area A1, D 2 required thickness of the reinforcing region of the second reinforcing and non-reinforcing area A2 B.
  • D 1 is 0.1 mm
  • D 2 is 0.2 mm.
  • the reinforcement manufacturing method includes the following steps:
  • Step S1 Prepare two reinforcement templates, including the first reinforcement template and the second reinforcement template in turn. Both the first reinforcement template and the second reinforcement template correspond to the layout of the stamping template 100 of the product 10 to be reinforced.
  • the first reinforcement template has a thickness D 1 , that is, the thickness of the first reinforcement template is 0.1 mm.
  • Step S2 punching processing is performed on the second reinforcement template, and the area corresponding to the first reinforcement area A1 is punched and removed.
  • Step S2+1 that is, step S3
  • processing the first reinforcing template and punching out the area corresponding to the non-reinforcing area B.
  • Step S2+2 i.e. step S4
  • step S4 superimposing the second reinforcement template after the punching processing of the step S2 on the first reinforcement template after the punching processing of the step S2+1 , And perform false pressure to obtain reinforcement layer set A.
  • Step S2+3 attach the reinforcement layer assembly A to the stamping template 100 of the product to be reinforced 10, and then stamp the product, and recover excess reinforcement template waste for recycling.
  • the thickness of the first reinforcement area A1 is the thickness (0.1 mm) of the first reinforcement template.
  • the second reinforcement area A2 is punched and removed without the reinforcement template, that is, the thickness of the second reinforcement area A2 is the thickness of the reinforcement layer assembly A, so the second reinforcement area
  • the processed reinforcement thickness meets the design requirements, and the step S5 integrates reinforcements of different thicknesses into the same strip to achieve one strip sticking, so that the assembly efficiency is high.
  • the second embodiment is basically the same as the first embodiment, and the meaning of the symbols is the same as that of the first embodiment, and only the differences are listed below.
  • the product 10 to be reinforced need D 3 further comprising a third thickness of the reinforcing reinforcement area A3.
  • D 2 is 0.5 mm.
  • the reinforcement manufacturing method includes the following steps:
  • Step S1 Prepare two reinforcement templates, including the first reinforcement template, the second reinforcement template, and the third reinforcement template in sequence. Punching layout template reinforcing the first template, the second template and the third reinforcing reinforcing each template 10 with the product to be reinforced, corresponds.
  • Step S2 performing punching processing on the third reinforcement template, and punching and removing regions corresponding to the first reinforcement area A1 and the second reinforcement area A2.
  • Step S3 Perform punching processing on the second reinforcement template, and punch out the area corresponding to the first reinforcement area A1.
  • Step S3+1 that is, step S4, processing the first reinforcing template, and punching out the area corresponding to the non-reinforcing area B.
  • Step S3+2 that is, step S5
  • the third reinforcement template and the second reinforcement template that have undergone the punching processing of steps S2 to S4 are sequentially stacked and pasted to the punches after the step S3.
  • a first post-cut process reinforcing a template, and the pressure obtaining false reinforcing layer set a is sequentially stacked and pasted to the punches after the step S3.
  • Step S3 + 3 i.e., step S6
  • the reinforcing layer set A attached to the product 10 to be reinforced, stamping template 100, and then stamping products, reinforcing template recover excess waste for recycling .
  • the thickness of the first reinforcement area A1 is the thickness (0.1 mm) of the first reinforcement template.
  • the third reinforcement area A3 is punched and removed without the reinforcement template, that is, the thickness of the third reinforcement area A3 is the thickness of the reinforcement layer assembly A, so the second reinforcement area
  • the processed reinforcement thickness meets the design requirements, and the step S6 integrates reinforcements of different thicknesses into the same strip to realize one strip sticking, so that the assembly efficiency is high.
  • the reinforcement manufacturing method of the present invention includes the following steps: step S1, preparing n reinforcement templates; step S2, punching the nth reinforcement template; step S3, The n-1th reinforcement template is punched; ... step Sn, the second reinforcement template is punched; step Sn+1, the first reinforcement template is processed; step Sn +2.
  • the n-1 reinforcement templates after the punching process of steps S2 to Sn are sequentially stacked and attached to the first reinforcement template after the punching process of step Sn+1, and the false pressure is performed to obtain the reinforcement Layer assembly; step Sn+3, attach the reinforcement layer assembly to the stamping template of the product to be reinforced.
  • the reinforcement manufacturing method of the present invention decomposes thick reinforcements into thin reinforcements, which can integrate reinforcements of different thicknesses on the product to the same strip to achieve strips, that is, to integrate reinforcements of different thicknesses. To the same strip to achieve one strip stick, so that the assembly efficiency is high.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

一种补强制作贴合方法，应用于具有n种不同厚度补强需求的待补强产品（10）的冲压模板（100），该方法包括如下步骤：步骤S1、准备n个补强模板；步骤S2、对第n补强模板进行冲切处理；步骤S3、对第n-1补强模板进行冲切处理；......步骤Sn、对第2补强模板进行冲切处理；步骤Sn+1、对第1补强模板进行加工；步骤Sn+2、将经过步骤S2至Sn冲切处理后的n-1个补强模板依次叠设贴合于经过步骤Sn+1冲切处理后的第1补强模板，并进行加压获取补强层集合；步骤Sn+3、将补强层集合贴合于待补强产品的冲压模板。该方法可整合不同厚度的补强集合以实现一次条贴，产品的组装效率高。

Description

补强制作贴合方法 技术领域
本发明涉及补强技术领域，尤其涉及一种补强制作贴合方法。
 背景技术
随着产品性能和可靠性要求越来越高，为了提高产品例如柔性电路板的强度和可靠性，以适应各种产品需求，在产品上增加补强成为其中较为常用的技术。
 技术问题
然而，补强层包括多个不同厚度的补强，不同厚度的补强分别贴合固定于产品，厚度种类越多，贴合的次数就会越多。还有一些特殊情况，比如，多个补强分别间隔时候，会导致多个补强无法连成条贴，只能单片贴合导致人工效率增加，或牺牲排版利用率以迁就不同补强贴合， 造成产品的组装效率低下，最终导致成本增加，失去产品竞争力。
因此，实有必要提供一种新的方法解决上述技术问题。
 技术解决方案
本发明的目的是克服上述技术问题，提供一种可整合不同厚度的补强集合实现一次条贴，产品的组装效率高的补强制作贴合方法。
为了实现上述目的，本发明提供一种补强制作贴合方法，应用于具有n种不同厚度补强需求的待补强产品的冲压模板，所述待补强产品包括需要D 1厚度补强的第1补强区、需要D 2厚度补强的第2补强区、……、需要D n-1厚度补强的第n-1补强区、需要D n厚度补强的第n补强区以及非补强区，其中，n≥2，n为正整数；该方法包括如下步骤：
步骤S1、准备n个补强模板, 依次包括第1补强模板至第n补强模板;所述n个补强模板与所述待补强产品的冲压模板的排版相对应, 所述第1补强模板具有厚度D 1, 所述第2补强模板具有厚度D 2- D 1，……，所述第n-1补强模板具有厚度D n-1-D n-2，所述第n补强模板具有厚度D n-D n-1；
步骤S2、对所述第n补强模板进行冲切处理，将对应于第1补强区、第2补强区、……、第n-2补强区和第n-1补强区的区域冲切去除；
步骤S3、对所述第n-1补强模板进行冲切处理，将对应于第1补强区、第2补强区、……、第n-3补强区和第n-2补强区的区域冲切去除；
……
步骤Sn、对所述第2补强模板进行冲切处理，将对应于第1补强区的区域冲切去除；
步骤Sn+1、对所述第1补强模板进行加工，将对应于所述非补强区的区域冲切去除；
步骤Sn+2、将经过所述步骤S2至Sn冲切处理后的n-1个补强模板依次叠设贴合于经过所述步骤Sn+1冲切处理后的第1补强模板，并进行假压获取补强层集合；
步骤Sn+3、将所述补强层集合贴合于所述待补强产品的冲压模板, 再冲压产品, 回收多余的补强模板废料以循环利用。
优选的，所述产品为柔性电路板。
优选的，所述补强为聚酰亚胺制成。
 有益效果
与现有技术相比，本发明的补强制作贴合方法包括如下步骤：步骤S1、准备n个补强模板；步骤S2、对所述第n补强模板进行冲切处理；步骤S3、对所述第n-1补强模板进行冲切处理；……步骤Sn、对所述第2补强模板进行冲切处理；步骤Sn+1、对所述第1补强模板进行加工；步骤Sn+2、将经过步骤S2至Sn冲切处理后的n-1个补强模板依次叠设贴合于经过步骤Sn+1冲切处理后的第1补强模板，并进行假压获取补强层集合；步骤Sn+3、将补强层集合贴合于待补强产品的冲压模板。综合上述步骤，本发明的补强制作贴合方法通过将厚补强分解成薄补强，可以整合产品上不同厚度的补强到同一条上，实现条贴，也就是整合不同厚度的补强到同一条实现一次条贴，从而使组装效率高。
 附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本发明补强制作贴合方法的流程框图；
图2为本发明的实施例一中的第1补强模板的示意图；
图3为本发明的实施例一中的第2补强模板的示意图；
图4为本发明的的实施例一中的补强层集合贴合于待补强产品模板的示意图；
图5为本发明的的实施例一中的冲压后的产品的示意图；
图6为本发明的实施例二中的第1补强模板的示意图；
图7为本发明的实施例二中的第2补强模板的示意图；
图8为本发明的的实施例二中的第3补强模板的示意图；
图9为本发明的的实施例二中的补强层集合贴合于待补强产品模板的示意图；
图10为本发明的的实施例二中的冲压后的产品的示意图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
请参阅图1所示，本发明提供的一种补强制作贴合方法。
所述补强制作贴合方法应用于具有n种不同厚度补强需求的待补强产品的冲压模板。所述待补强产品包括需要D 1厚度补强的第1补强区、需要D 2厚度补强的第2补强区、……、需要D n-1厚度补强的第n-1补强区、需要D n厚度补强的第n补强区以及非补强区。其中，n≥2，n为正整数。
所述补强制作贴合方法包括如下步骤：
步骤S1、准备n个补强模板, 依次包括第1补强模板至第n补强模板。所述n个补强模板与所述待补强产品的冲压模板的排版相对应。 所述第1补强模板具有厚度D 1, 所述第2补强模板具有厚度D 2- D 1，……，所述第n-1补强模板具有厚度D n-1-D n-2，所述第n补强模板具有厚度D n-D n-1。
步骤S2、对所述第n补强模板进行冲切处理，将对应于第1补强区、第2补强区、……、第n-2补强区和第n-1补强区的区域冲切去除。
步骤S3、对所述第n-1补强模板进行冲切处理，将对应于第1补强区、第2补强区、……、第n-3补强区和第n-2补强区的区域冲切去除。
……
步骤Sn、对所述第2补强模板进行冲切处理，将对应于第1补强区的区域冲切去除。
步骤Sn+1、对所述第1补强模板进行加工，将对应于所述非补强区的区域冲切去除。
步骤Sn+2、将经过所述步骤S2至Sn冲切处理后的n-1个补强模板依次叠设贴合于经过所述步骤Sn+1冲切处理后的第1补强模板，并进行假压获取补强层集合。本步骤实施将整合不同厚度的补强到同一条实现一次条贴，从而使组装效率高。
步骤Sn+3、将所述补强层集合贴合于所述待补强产品的冲压模板, 再冲压产品, 回收多余的补强模板废料以循环利用。本步骤实施将所述补强层集合条贴方式贴合于待补强产品模板，再冲压所述产品，有利于提高生产效率。
本实施方式中，所述产品为柔性电路板。所述补强为聚酰亚胺制成。当然，其他材料也是可以的，可以根据实际需要将所述补强选用不同的材料。
实施例一
请参阅图2-5所示，以下通过2种种不同厚度补强需求的待补强产品10的冲压模板100来作为实施例一说明本发明的补强制作贴合方法。
本实施例中，所述待补强产品10包括需要D 1厚度补强的第1补强区A1、需要D 2厚度补强的第2补强区A2以及非补强区B。D 1为0.1毫米， D 2为0.2毫米。
所述补强制作贴合方法包括如下步骤：
步骤S1、准备2个补强模板, 依次包括第1补强模板和第2补强模板。所述第1补强模板和所述第2补强模板均与所述待补强产品10的冲压模板100的排版相对应。
所述第1补强模板具有厚度D 1, 即所述第1补强模板的厚度为0.1毫米。
所述第2补强模板具有厚度D 2- D 1，即所述第2补强模板的厚度为0.1毫米（D 2-D 1=0.2毫米-0.1毫米=0.1毫米）。
步骤S2、对所述第2补强模板进行冲切处理，将对应于第1补强区A1的区域冲切去除。
步骤S2+1（即步骤S3）、对所述第1补强模板进行加工，将对应于所述非补强区B的区域冲切去除。
步骤S2+2（即步骤S4）、将经过所述步骤S2冲切处理后的所述第2补强模板叠设贴合于经过所述步骤S2+1冲切处理后的第1补强模板，并进行假压获取补强层集合A。
步骤S2+3（即步骤S5）、将所述补强层集合A贴合于所述待补强产品10的冲压模板100, 再冲压产品, 回收多余的补强模板废料以循环利用。
其中，对于区域A1上的厚度由于所述步骤2中的所述第2补强模板将对应于第1补强区A1的区域冲切去除。所以，第1补强区A1的厚度为所述第1补强模板的厚度（0.1毫米）。
对于第2补强区A2的厚度由于无补强模板对第2补强区A2冲切去除，即第2补强区A2的厚度为所述补强层集合A的厚度，所以第2补强区A2上的厚度为所述第1补强模板的厚度（0.1毫米）加上所述第2补强模板的厚度（0.1毫米），即0.1毫米+0.1毫米=0.2毫米。加工后的补强厚度符合设计要求，所述步骤S5整合不同厚度的补强到同一条实现一次条贴，从而使组装效率高。
实施例二
请参阅图6-10所示，以下通过3种种不同厚度补强需求的待补强产品10 ,的冲压模板100 ,来作为实施例二说明本发明的补强制作贴合方法。
实施例二与实施例一基本相同，符号含义与实施例一相同，以下只列出不同点。
本实施例中，所述待补强产品10 ,还包括需要D 3厚度补强的第3补强区A3。D 2为0.5毫米。
所述补强制作贴合方法包括如下步骤：
步骤S1、准备2个补强模板, 依次包括第1补强模板、第2补强模板及第3补强模板。所述第1补强模板、所述第2补强模板及所述第3补强模板均与所述待补强产品10 ,的冲压模板的排版相对应。
本实施例二中，所述第3补强模板具有厚度D 3-D 2，即所述第2补强模板的厚度为0.3毫米（D 3-D 2=0.5毫米-0.2毫米=0.3毫米）。
步骤S2、对所述第3补强模板进行冲切处理，将对应于所述第1补强区A1和所述第2补强区A2的区域冲切去除。
步骤S3、对所述第2补强模板进行冲切处理，将对应于第1补强区A1的区域冲切去除。
步骤S3+1（即步骤S4）、对所述第1补强模板进行加工，将对应于所述非补强区B的区域冲切去除。
步骤S3+2（即步骤S5）、将经过所述步骤S2至S4冲切处理后的所述所述第3补强模板和第2补强模板依次叠设贴合于经过所述步骤S3冲切处理后的第1补强模板，并进行假压获取补强层集合A ,。
步骤S3+3（即步骤S6）、将所述补强层集合A ,贴合于所述待补强产品10 ,的冲压模板100 ,, 再冲压产品, 回收多余的补强模板废料以循环利用。
其中，对于区域A1上的厚度由于所述步骤S2中的所述第3补强模板将对应于第1补强区A1的区域冲切去除，所述步骤3中的所述第2补强模板将对应于第1补强区A1的区域冲切去除。所以，第1补强区A1的厚度为所述第1补强模板的厚度（0.1毫米）。
对于第2补强区A2的厚度由于所述步骤S2中的所述第3补强模板将对应于所以第2补强区A2的区域冲切去除，所以第2补强区A2上的厚度为所述第1补强模板的厚度（0.1毫米）加上所述第2补强模板的厚度（0.1毫米），即0.1毫米+0.1毫米=0.2毫米。
对于第3补强区A3的厚度由于无补强模板对第3补强区A3冲切去除，即第3补强区A3的厚度为所述补强层集合A的厚度，所以第2补强区A2上的厚度为所述第1补强模板的厚度（0.1毫米）加上所述第2补强模板的厚度（0.1毫米），再加上所述第3补强模板的厚度（0.3毫米），即0.1毫米+0.1毫米+0.3毫米=0.5毫米。加工后的补强厚度符合设计要求，所述步骤S6整合不同厚度的补强到同一条实现一次条贴，从而使组装效率高。
与现有技术相比，本发明的补强制作贴合方法包括如下步骤：步骤S1、准备n个补强模板；步骤S2、对所述第n补强模板进行冲切处理；步骤S3、对所述第n-1补强模板进行冲切处理；……步骤Sn、对所述第2补强模板进行冲切处理；步骤Sn+1、对所述第1补强模板进行加工；步骤Sn+2、将经过步骤S2至Sn冲切处理后的n-1个补强模板依次叠设贴合于经过步骤Sn+1冲切处理后的第1补强模板，并进行假压获取补强层集合；步骤Sn+3、将补强层集合贴合于待补强产品的冲压模板。综合上述步骤，本发明的补强制作贴合方法通过将厚补强分解成薄补强，可以整合产品上不同厚度的补强到同一条上，实现条贴，也就是整合不同厚度的补强到同一条实现一次条贴，从而使组装效率高。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其它相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (3)

  1. 一种补强制作贴合方法，应用于具有n种不同厚度补强需求的待补强产品的冲压模板，所述待补强产品包括需要D 1厚度补强的第1补强区、需要D 2厚度补强的第2补强区、……、需要D n-1厚度补强的第n-1补强区、需要D n厚度补强的第n补强区以及非补强区，其中，n≥2，n为正整数；其特征在于，该方法包括如下步骤：
    步骤S1、准备n个补强模板, 依次包括第1补强模板至第n补强模板;所述n个补强模板与所述待补强产品的冲压模板的排版相对应, 所述第1补强模板具有厚度D 1, 所述第2补强模板具有厚度D 2- D 1，……，所述第n-1补强模板具有厚度D n-1-D n-2，所述第n补强模板具有厚度D n-D n-1；
    步骤S2、对所述第n补强模板进行冲切处理，将对应于第1补强区、第2补强区、……、第n-2补强区和第n-1补强区的区域冲切去除；
    步骤S3、对所述第n-1补强模板进行冲切处理，将对应于第1补强区、第2补强区、……、第n-3补强区和第n-2补强区的区域冲切去除；
    ……
    步骤Sn、对所述第2补强模板进行冲切处理，将对应于第1补强区的区域冲切去除；
    步骤Sn+1、对所述第1补强模板进行加工，将对应于所述非补强区的区域冲切去除；
    步骤Sn+2、将经过所述步骤S2至Sn冲切处理后的n-1个补强模板依次叠设贴合于经过所述步骤Sn+1冲切处理后的第1补强模板，并进行假压获取补强层集合；
    步骤Sn+3、将所述补强层集合贴合于所述待补强产品的冲压模板, 再冲压产品, 回收多余的补强模板废料以循环利用。
  2. 根据权利要求1所述的补强制作贴合方法，其特征在于，所述产品为柔性电路板。
  3. 根据权利要求1所述的补强制作贴合方法，其特征在于，所述补强为聚酰亚胺制成。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114226556A (zh) * 2021-12-09 2022-03-25 苏州市吴中区伟良电子有限公司 一种立体内缩胶补强钢片的成型方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015138868A (ja) * 2014-01-22 2015-07-30 株式会社ジャパンディスプレイ 可撓性回路基板及び可撓性回路基板の収納容器
CN108124385A (zh) * 2017-12-21 2018-06-05 上达电子（深圳）股份有限公司 柔性线路板成型方法及模具
CN110267432A (zh) * 2019-06-26 2019-09-20 深圳市新宇腾跃电子有限公司 一种柔性电路板及其制作方法
CN110536543A (zh) * 2019-08-29 2019-12-03 深圳市实锐泰科技有限公司 一种柔性板补强片贴合方法
CN110677999A (zh) * 2019-10-12 2020-01-10 珠海景旺柔性电路有限公司 用于fpc粘贴补强钢片的对位贴合方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05196952A (ja) * 1991-10-02 1993-08-06 Canon Inc 電気的接続構造及び電気的接続方法
JP2003309364A (ja) * 2002-04-15 2003-10-31 Fuji Photo Film Co Ltd フレキ複合型多層基板
CN102458052B (zh) * 2010-10-28 2014-03-19 比亚迪股份有限公司 一种柔性线路板的补强贴合方法
JP6745770B2 (ja) * 2017-08-22 2020-08-26 太陽誘電株式会社 回路基板
CN110493972A (zh) * 2019-08-23 2019-11-22 江苏上达电子有限公司 一种用于cof的补强方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015138868A (ja) * 2014-01-22 2015-07-30 株式会社ジャパンディスプレイ 可撓性回路基板及び可撓性回路基板の収納容器
CN108124385A (zh) * 2017-12-21 2018-06-05 上达电子（深圳）股份有限公司 柔性线路板成型方法及模具
CN110267432A (zh) * 2019-06-26 2019-09-20 深圳市新宇腾跃电子有限公司 一种柔性电路板及其制作方法
CN110536543A (zh) * 2019-08-29 2019-12-03 深圳市实锐泰科技有限公司 一种柔性板补强片贴合方法
CN110677999A (zh) * 2019-10-12 2020-01-10 珠海景旺柔性电路有限公司 用于fpc粘贴补强钢片的对位贴合方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114226556A (zh) * 2021-12-09 2022-03-25 苏州市吴中区伟良电子有限公司 一种立体内缩胶补强钢片的成型方法

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