WO2021125152A1 - Bande de traitement de semi-conducteur - Google Patents

Bande de traitement de semi-conducteur Download PDF

Info

Publication number
WO2021125152A1
WO2021125152A1 PCT/JP2020/046636 JP2020046636W WO2021125152A1 WO 2021125152 A1 WO2021125152 A1 WO 2021125152A1 JP 2020046636 W JP2020046636 W JP 2020046636W WO 2021125152 A1 WO2021125152 A1 WO 2021125152A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensitive adhesive
pressure
meth
polyurethane
semiconductor processing
Prior art date
Application number
PCT/JP2020/046636
Other languages
English (en)
Japanese (ja)
Inventor
達宏 池谷
中西　健一
Original Assignee
昭和電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昭和電工株式会社 filed Critical 昭和電工株式会社
Priority to CN202080078579.7A priority Critical patent/CN114729232B/zh
Priority to KR1020227015871A priority patent/KR102565398B1/ko
Priority to JP2021565581A priority patent/JPWO2021125152A1/ja
Publication of WO2021125152A1 publication Critical patent/WO2021125152A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/08—Polyurethanes from polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a tape for semiconductor processing.
  • a semiconductor wafer backgrinding process is performed in the semiconductor device manufacturing process.
  • the front surface of the semiconductor wafer is protected with a back grind tape, and then the back surface is ground to make the semiconductor wafer thinner.
  • the backgrinding tape is peeled from the semiconductor wafer, static electricity called peeling charge is generated, and the circuit of the semiconductor wafer may be destroyed or foreign matter may adhere to the semiconductor wafer. Therefore, the back grind tape is required to have sufficient antistatic performance.
  • Patent Document 1 As a back grind tape having both unevenness absorbing performance and antistatic performance, a base material layer, an unevenness absorbing resin layer, an antistatic layer, and adhesiveness are provided.
  • An adhesive film for processing a semiconductor wafer which comprises a resin layer and a resin layer in this order, is disclosed.
  • the adhesive film for semiconductor wafer processing described in Patent Document 1 needs to be manufactured by laminating each layer after forming a sheet, so that the manufacturing procedure is complicated. Further, the back grind tape is required to have an adhesive force capable of fixing an adherend such as a semiconductor wafer to the back grind tape with sufficient strength. However, when the back grind tape with high adhesive strength is attached to the adherend, the adherend is processed, and then the back grind tape is peeled off, the adhesive layer of the back grind tape is transferred to the adherend. The rest may occur.
  • the present invention has been made in view of the above circumstances, has sufficient unevenness absorption, appropriate adhesive strength, and antistatic performance, and is less likely to leave adhesive residue after peeling off the semiconductor processing tape, and is less.
  • An object of the present invention is to provide a tape for semiconductor processing that can be manufactured in a manufacturing process.
  • a semiconductor processing tape having a sheet-like base material having a base material main body and an antistatic layer provided on at least one surface of the base material main body, and an adhesive layer formed on the antistatic layer.
  • the antistatic layer contains a polypyrrole compound and
  • the pressure-sensitive adhesive layer is a cured product of the pressure-sensitive adhesive composition.
  • the thickness of the pressure-sensitive adhesive layer is 50 to 500 ⁇ m.
  • the pressure-sensitive adhesive composition contains a polyurethane (A), a (meth) acrylate monomer (B), a chain transfer agent (C), and a photopolymerization initiator (D).
  • the polyurethane (A) contains polyurethane (a1), and the polyurethane (A) contains polyurethane (a1).
  • the polyurethane (a1) has a skeleton containing a structure derived from a polyoxyalkylene polyol and a structure derived from a polyisocyanate, and has a (meth) acryloyl group at a plurality of terminals.
  • [2] The semiconductor processing tape according to [1], wherein the pressure-sensitive adhesive layer has a single-layer structure.
  • the (meth) acrylate monomer (B) contains 85 to 99 mol% of the monofunctional (meth) acrylate and 1 to 15 mol% of the polyfunctional (meth) acrylate, [1] to [5].
  • the tape for semiconductor processing described in any one of. [7] The pressure-sensitive adhesive composition 20 to 50% by mass of the polyurethane (A), 35-79% by mass of the (meth) acrylate monomer (B), 0.5 to 8% by mass of the chain transfer agent (C), The semiconductor processing tape according to any one of [1] to [6], which contains 0.01 to 5% by mass of the photopolymerization initiator (D). [8] The tape for semiconductor processing according to any one of [1] to [7], wherein the pressure-sensitive adhesive composition further contains a fatty acid ester (E).
  • the present invention it is possible to provide a semiconductor processing tape which has sufficient unevenness absorption, appropriate adhesive strength, and antistatic performance, and is less likely to cause adhesive residue after peeling off the semiconductor processing tape.
  • the pressure-sensitive adhesive layer is a cured product of the pressure-sensitive adhesive composition and has sufficient unevenness-absorbing property and adhesive strength. It is not necessary to separately provide the above, and it can be manufactured with a small number of manufacturing steps. Further, by forming the pressure-sensitive adhesive layer on the base material having the antistatic layer, it is possible to have sufficient antistatic performance. Therefore, the semiconductor processing tape of the present invention is used to protect the surface of an adherend having an uneven portion on the surface, such as a semiconductor wafer having bumps formed on the surface. Suitable as a grind tape.
  • the semiconductor processing tape in the present embodiment has a sheet-shaped base material and an adhesive layer formed on one side of the base material.
  • the base material has a base material main body and an antistatic layer provided on at least one surface of the base material main body.
  • the antistatic layer contains a polypyrrole compound.
  • the pressure-sensitive adhesive layer is a cured product of the pressure-sensitive adhesive composition described later.
  • the thickness of the pressure-sensitive adhesive layer is 50 to 500 ⁇ m.
  • the pressure-sensitive adhesive composition contains a polyurethane (A), a (meth) acrylate monomer (B), a chain transfer agent (C), and a photopolymerization initiator (D).
  • the polyurethane (A) contains polyurethane (a1).
  • the polyurethane (a1) has a skeleton containing a structure derived from a polyoxyalkylene polyol and a structure derived from a polyisocyanate, and has a (meth) acryloyl group at a plurality of terminals.
  • the (meth) acrylate monomer (B) contains a monofunctional (meth) acrylate and a polyfunctional (meth) acrylate.
  • the "tape” here is not limited to a strip-shaped one, but also includes a rectangular or a sheet on a disk.
  • the material of the base material body can be appropriately selected, and examples thereof include a resin material.
  • the resin material include polyolefins such as polyethylene (PE) and polypropylene (PP); polyester sheets such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene naphthalate; polyvinyl chloride (PVC); polyimide (PI). ; Polyphenylene terephide (PPS); ethylene vinyl acetate (EVA); polytetrafluoroethylene (PTFE) and the like.
  • PE, PP, and PET are preferably used because a sheet having appropriate flexibility can be obtained.
  • the resin material only one kind may be used alone, or two or more kinds may be mixed and used.
  • the resin sheet When a resin sheet made of a resin material is used as the base material body, the resin sheet may have a single layer or a multi-layer structure having two or more layers (for example, a three-layer structure).
  • the resin material constituting each layer may be a resin material containing only one type alone or a resin material containing two or more types.
  • the surface of the base material on which the antistatic layer is formed is subjected to easy-adhesion treatment such as acid treatment, alkali treatment, primer treatment, corona treatment, plasma treatment, ultraviolet treatment, ozone treatment, etc., if necessary. May be.
  • the thickness of the base material body can be appropriately selected according to the material of the base material body and the like.
  • the semiconductor processing tape is used for a purpose of being attached to a semiconductor wafer having an uneven portion on the surface and then peeled off, and when the semiconductor processing tape uses a resin sheet as a base material body, it is a base.
  • the thickness of the material body is preferably, for example, 10 to 1000 ⁇ m, and more preferably 50 to 300 ⁇ m.
  • the thickness of the base material body is 10 ⁇ m or more, the rigidity (stiffness) of the semiconductor processing tape becomes high. Therefore, when the semiconductor processing tape is attached to or peeled off from the semiconductor wafer as an adherend, the semiconductor processing tape tends to be less likely to wrinkle or float.
  • the thickness of the base material body is 1000 ⁇ m or less, the semiconductor processing tape attached to the semiconductor wafer can be easily peeled off from the semiconductor wafer, and workability (handleability, handling) is improved.
  • the antistatic layer contains a polypyrrole compound.
  • the polypyrrole compound is not particularly limited as long as it is a polymer of pyrrole and / or a pyrrole derivative, and may contain a small amount of a monomer other than pyrrole and a pyrrole derivative as a polymerization component.
  • Examples of the pyrrole derivative include N-alkylpyrrole, 3-alkylpyrrole, 3,4-dialkylpyrrole, 3-alkoxypyrrole, 3,4-dialkoxypyrrole, 3-chloropyrrole, 3,4-dichloropyrrole and the like. ..
  • the means for providing the antistatic layer is not particularly limited, and various known methods can be adopted. For example, the following methods (i) to (vi) can be mentioned.
  • (I) A method in which pyrrole and / or a pyrrole derivative is dissolved in an organic solvent such as diethyl ether, methanol, tetrahydrofuran (THF), applied to the base material body, and then the organic solvent is dried and removed (for example, JP-A-3-).
  • Fine particles of polypyrrole and / or polypyrrole derivative are dispersed in a hydrophilic solvent using a polymer dispersant and / or a dopant, and further mixed with a hydrophilic binder resin to prepare a resin composition; the resin composition thereof.
  • a method of coating a substance on a substrate body such as a polymer film and then drying and removing the solvent to form the substance for example, JP-A-2001-334598).
  • fine particles of polypyrrole and / or polypyrrole derivative are dispersed in a hydrophilic solvent using a polymer dispersant and / or dopant.
  • a method of preparing a resin composition by mixing with a water-soluble or water-dispersible binder resin; applying the resin composition onto the main body of the substrate and then drying and removing the solvent to form the resin composition is preferable.
  • a known coating method such as a bar coater, an air knife coater, a blade coater, a rod coater, a gravure coater, a size press coater, and a gate roll coater may be adopted.
  • the film thickness of the antistatic layer is preferably 0.1 to 20 ⁇ m, more preferably 0.5 to 10 ⁇ m. When the thickness of the antistatic layer is within this range, sufficient antistatic performance is exhibited.
  • the content of the polypyrrole compound in the antistatic layer is preferably 5 to 80% by mass, more preferably 10 to 70% by mass. If it is 5% by mass or more, sufficient antistatic performance can be obtained, and if it is 80% by mass or less, economic efficiency is good.
  • polymer dispersant examples include polymer acids, salts of these polymer acids, esterified products of these polymer acids, and the like, and only one of these may be used alone. However, two or more types may be used in combination.
  • Specific examples of the polymer acid include a polymer acid such as polystyrene sulfonic acid, polyacrylic acid, polyallyl sulfonic acid, and alginic acid.
  • Specific examples of the polymer acid salt include neutralizing salts such as sodium salt, potassium salt and ammonium salt.
  • the dopant is not particularly limited, and it is preferable to use molecular iodine and / or iodine ion. When iodine ions are used, the iodine ion value is not particularly specified. The use of iodine and / or iodine ions further improves conductivity and adhesion to the substrate body.
  • water-soluble or water-dispersible binder resin examples include polyester, polyurethane, acrylic resin, vinyl resin, epoxy resin, and amide resin. Each of these may have a substantially composite structure due to copolymerization or the like.
  • binder resin having a composite structure examples include acrylic resin graft polyester, acrylic resin graft polyurethane, vinyl resin graft polyester, vinyl resin graft polyurethane and the like. By containing these resins, the strength of the antistatic layer and the adhesion to the base material body can be improved.
  • the water-soluble or water-dispersible binder resin may be used alone or in combination of two or more.
  • the resin composition may contain a cross-linking reactive compound, if necessary.
  • Crosslink-reactive compounds improve the cohesiveness, surface hardness, scratch resistance, solvent resistance, and water resistance of the coating layer mainly by cross-linking with functional groups contained in other resins and compounds and by self-cross-linking. be able to.
  • the crosslinkable compound that can be used amino resins such as melamine type, benzoguanamine type and urea type, and oxazoline type, epoxy type and glyoxal type are preferably used.
  • Additives such as surfactants, defoamers, coatability improvers, thickeners, organic lubricants, organic particles, inorganic particles, antioxidants, ultraviolet absorbers, dyes, pigments, etc. are added to the resin composition. It may be contained. These additives may be used alone, or two or more thereof may be used in combination if necessary.
  • the pressure-sensitive adhesive layer is formed on the antistatic layer of the base material.
  • the adhesive layer is formed on either side of the antistatic layer.
  • the pressure-sensitive adhesive layer is a cured product of the pressure-sensitive adhesive composition described later.
  • the pressure-sensitive adhesive layer is, in particular, a photocurable product of the pressure-sensitive adhesive composition described later.
  • the semiconductor processing tape may be used for applications where it is attached to an adherend such as a semiconductor wafer having an uneven portion on the surface and then peeled off.
  • the pressure-sensitive adhesive layer has a role of protecting the surface of the adherend during the back grind process by fixing the semiconductor processing tape to the surface of the adherend with sufficient adhesive force.
  • the pressure-sensitive adhesive layer has a role of improving the accuracy of the back grind process by absorbing and smoothing the unevenness of the surface of the adherend.
  • the pressure-sensitive adhesive layer reduces the peeling charge generated when the semiconductor processing tape is peeled from the adherend.
  • the pressure-sensitive adhesive layer of the semiconductor processing tape of the present embodiment does not leave adhesive residue when the semiconductor processing tape is peeled off.
  • the thickness of the pressure-sensitive adhesive layer of the present embodiment is 50 to 500 ⁇ m, preferably 60 to 400 ⁇ m, and more preferably 70 to 300 ⁇ m.
  • the thickness of the pressure-sensitive adhesive layer is 50 ⁇ m or more, the unevenness absorption and the adhesive strength of the semiconductor processing tape become good. Further, when the thickness of the pressure-sensitive adhesive layer is 500 ⁇ m or less, the film thickness of the pressure-sensitive adhesive layer can be easily controlled.
  • the thickness of the pressure-sensitive adhesive layer largely depends on the height of the uneven portion on the surface of the adherend.
  • the thickness of the pressure-sensitive adhesive layer is preferably equal to or greater than the height of the uneven portion on the surface so that sufficient uneven absorption can be obtained. Therefore, for example, when the unevenness of the surface is a bump formed on the semiconductor wafer, it is preferable that the thickness of the pressure-sensitive adhesive layer is twice or more the height dimension of the bump.
  • the height of the bump is usually 30 to 200 ⁇ m. For example, when the height of the bump is 100 ⁇ m, the thickness of the adhesive layer is preferably 200 ⁇ m or more, and when the height of the bump is 200 ⁇ m.
  • the thickness of the pressure-sensitive adhesive layer is preferably 400 ⁇ m or more.
  • the pressure-sensitive adhesive layer may have a single-layer structure, or may have a multi-layer structure in which the pressure-sensitive adhesive layer of the present embodiment and one or more other pressure-sensitive adhesive layers different from the pressure-sensitive adhesive layer of the present embodiment are laminated. You may.
  • a conventionally known pressure-sensitive adhesive layer can be used.
  • the pressure-sensitive adhesive layer of the present embodiment needs to be present on the outermost surface.
  • a layer other than the pressure-sensitive adhesive layer may exist between the pressure-sensitive adhesive layer and the base material within a range that does not hinder the curing of the pressure-sensitive adhesive layer. From the viewpoint of shortening the process, the pressure-sensitive adhesive layer preferably has a single-layer structure.
  • the gel fraction of the pressure-sensitive adhesive layer is preferably 50 to 65% by mass.
  • the gel fraction is 50% by mass or more, the generation of adhesive residue due to peeling off the semiconductor processing tape attached to the adherend can be more effectively suppressed.
  • the pressure-sensitive adhesive layer has sufficient fluidity, and the unevenness absorption of the semiconductor processing tape becomes even better.
  • the gel fraction of the pressure-sensitive adhesive layer is more preferably 52% by mass or more. Further, the gel fraction of the pressure-sensitive adhesive layer is more preferably 63% by mass or less.
  • a preferable range of the gel fraction of the pressure-sensitive adhesive layer can be achieved, for example, by adjusting the composition of the pressure-sensitive adhesive composition described later to a preferable range.
  • the surface resistivity of the pressure-sensitive adhesive layer is preferably less than 1 ⁇ 10 12 ⁇ / ⁇ , and more preferably less than 1 ⁇ 10 11 ⁇ / ⁇ .
  • the surface resistivity is less than 1 ⁇ 10 12 ⁇ / ⁇ , the peeling charge when the semiconductor processing tape attached to the adherend is peeled off is reduced, and the semiconductor processing tape has further excellent antistatic performance. Become.
  • the semiconductor processing tape may be provided with a transparent separator on the surface of the pressure-sensitive adhesive layer for the purpose of protecting the pressure-sensitive adhesive layer.
  • the separator is preferably laminated on the surface of the pressure-sensitive adhesive layer.
  • the material of the separator for example, paper, a plastic film, or the like can be used, and it is preferable to use a plastic film from the viewpoint of excellent surface smoothness.
  • the plastic film used as the separator is not particularly limited as long as it can protect the above-mentioned pressure-sensitive adhesive layer, and examples thereof include polyethylene, polypropylene, polyethylene terephthalate, and polybutene.
  • the pressure-sensitive adhesive layer of the semiconductor processing tape of the present embodiment is a cured product of the pressure-sensitive adhesive composition.
  • the pressure-sensitive adhesive composition used as the material of the pressure-sensitive adhesive layer in the semiconductor processing tape of the present embodiment will be described in detail.
  • the pressure-sensitive adhesive composition of the present embodiment contains a polyurethane (A), a (meth) acrylate monomer (B), a chain transfer agent (C), and a photopolymerization initiator (D).
  • the polyurethane (A) includes the polyurethane (a1) described later.
  • the polyurethane (A) may contain not only the polyurethane (a1) but also the polyurethane (a2) described later for the purpose of adjusting the cohesive force of the cured product of the pressure-sensitive adhesive composition. It is preferable that the polyurethane (A) does not contain components other than the polyurethane (a1) and the polyurethane (a2) contained if necessary.
  • Polyurethane (a1) has a skeleton containing a structure derived from a polyoxyalkylene polyol and a structure derived from a polyisocyanate.
  • polyurethane (a1) has a plurality of (meth) acryloyl groups at the ends.
  • the terminal (meth) acryloyl group of the polyurethane (a1) is preferably a part of the (meth) acryloyloxy group.
  • the "plurality of ends" of polyurethane means two ends when the polyurethane is a linear polymer, and two of the same number of ends as the number of each branched chain when the polyurethane is a branched polymer. One or more ends.
  • Polyurethane (a2) Polyurethane (a2), like polyurethane (a1), has a skeleton containing a structure derived from a polyoxyalkylene polyol and a structure derived from a polyisocyanate. Polyurethane (a2), unlike polyurethane (a1), has a (meth) acryloyl group at only one end. The terminal (meth) acryloyl group of the polyurethane (a2) is preferably a part of the (meth) acryloyloxy group.
  • the terminal having no (meth) acryloyl group preferably has one selected from the group consisting of an isocyanato group, a structure derived from an alkyl alcohol, and a structure derived from an alkyl isocyanate, and is preferably derived from an alkyl alcohol. It is more preferable to have a structure.
  • the polyoxyalkylene polyol having a structure derived from the polyoxyalkylene polyol contained in the skeletons of the polyurethane (a1) and the polyurethane (a2) preferably has an alkylene chain having 2 to 4 carbon atoms. Specific examples include polyoxyethylene polyol, polyoxypropylene polyol, and polyoxybutylene polyol.
  • the polyoxyalkylene polyol having a structure derived from the polyoxyalkylene polyol may contain one type of alkylene chain or may contain two or more types of alkylene chains.
  • the polyoxyalkylene polyol having a structure derived from the polyoxyalkylene polyol is preferably one having two or three hydroxyl groups at the terminal (diol type or triol type polyoxyalkylene polyol), and is preferably a polyoxyalkylene glycol (diol). Type) is more preferable, and polypropylene glycol having an alkylene chain having 3 carbon atoms is particularly preferable.
  • the hydroxyl value is preferably 20 to 120 mgKOH / g, more preferably 30 to 100 mgKOH / g, and further preferably 40 to 80 mgKOH / g. preferable.
  • polypropylene glycol include polypropylene glycol (Actcol D-2000; manufactured by Mitsui Chemicals, number average molecular weight 2000, diol type) having a hydroxyl group (hydroxy group) having a hydroxyl value of 56 mgKOH / g at the end. Be done.
  • the hydroxyl value of the polyoxyalkylene polyol is the hydroxyl value of the polyoxyalkylene polyol measured according to JIS K0070. That is, it means the number of mg of potassium hydroxide required to neutralize free acetic acid when 1 g of polyoxyalkylene polyol is acetylated. Specifically, it can be obtained by acetylating a hydroxyl group in a sample (polyoxyalkylene polyol) with acetic anhydride and titrating the free acetic acid generated at that time with a potassium hydroxide solution.
  • the number average molecular weight of the polyoxyalkylene polyol is preferably 500 to 5,000, more preferably 800 to 4,000, and even more preferably 1,000 to 3,000.
  • the semiconductor processing tape having the pressure-sensitive adhesive layer which is a cured product of the pressure-sensitive adhesive composition containing polyurethane (A) synthesized using the polyoxyalkylene polyol, has a peel strength. It will be expensive.
  • the number average molecular weight of the polyoxyalkylene polyol is 5,000 or less, the polyurethane (A) synthesized using the polyoxyalkylene polyol contains a sufficient amount of urethane bonds. Therefore, the cured product obtained by curing the pressure-sensitive adhesive composition containing polyurethane (A) has a good cohesive force.
  • the structure derived from the polyoxyalkylene polyol contained in the skeletons of the polyurethane (a1) and the polyurethane (a2) may be of only one type, or may be a structure containing two or more types.
  • Polyurethane (a1) and polyurethane (a2) may have a structure in which two or more different polyoxyalkylene polyol-derived structures are bonded with a polyisocyanate-derived structure in between.
  • the structure derived from the polyoxyalkylene polyol contained in the skeleton of the polyurethane (a1) and the structure derived from the polyoxyalkylene polyol contained in the skeleton of the polyurethane (a2) may be the same or different. ..
  • Polyisocyanate having a structure derived from the polyisocyanate contained in the skeletons of the polyurethane (a1) and the polyurethane (a2) a compound having a plurality of isocyanato groups is used, and it is preferable to use a diisocyanate.
  • the diisocyanate include tolylene diisocyanate and its hydrogen additive, xylylene diisocyanate and its hydrogen additive, diphenylmethane diisocyanate and its hydrogen additive, 1,5-naphthylene diisocyanate and its hydrogen additive, hexamethylene diisocyanate, and trimethyl.
  • Examples thereof include hexamethylene diisocyanate, tetramethylxylylene diisocyanate, isophorone diisocyanate, 4,4'-dicyclohexyldiisocyanate, 1,3-bis (isocyanatemethyl) cyclohexane, norbornan diisocyanate and the like.
  • polystyrene resin it is preferable to use an isophorone diisocyanate or a hydrogenated diphenylmethane diisocyanate from the viewpoint of controlling the light resistance of the polyurethane (A) synthesized using the polyisocyanate and the reactivity with the polyoxyalkylene polyol. .. Further, it is more preferable to use a hydrogenated diphenylmethane diisocyanate in terms of reactivity with a polyoxyalkylene polyol.
  • polyisocyanate having a structure derived from polyisocyanate examples include hydrogenated diphenylmethane diisocyanate (Desmodule W, manufactured by Sumika Covestro Urethane) and isophorone diisocyanate (Desmodule I, manufactured by Sumika Covestro Urethane). Can be mentioned.
  • the polyisocyanate-derived structure contained in the skeletons of the polyurethane (a1) and the polyurethane (a2) may be of only one type, or may be a structure containing two or more types. Further, the structure derived from polyisocyanate contained in the skeleton of polyurethane (a1) and the structure derived from polyisocyanate contained in the skeleton of polyurethane (a2) may be the same or different.
  • the structure derived from polyisocyanate and the structure derived from polyoxyalkylene polyol contained in the skeletons of polyurethane (a1) and polyurethane (a2) are the same.
  • the polyurethane (a1) and the polyurethane (a2) can be synthesized at the same time, and the polyurethane (A) can be efficiently produced.
  • the proportion of polyurethane (a1) contained in polyurethane (A) is preferably 80 to 100%, more preferably 90 to 100%, and even more preferably 100% of polyurethane (A) on the basis of the number of molecules.
  • the proportion of polyurethane (a2) contained in polyurethane (A) is preferably 0 to 20%, more preferably 0 to 10%, and even more preferably 0% of polyurethane (A) on the basis of the number of molecules.
  • polyurethane (A) Of all the number of ends contained in polyurethane (A) (the total number of the number of ends of polyurethane (a1) and the number of ends of polyurethane (a2) contained as needed), 90 to 100 based on the number of molecules. It is preferable that a (meth) acryloyl group is introduced into%, more preferably 95 to 100%, still more preferably 100%. When the amount of the (meth) acryloyl group introduced is 90% or more based on the number of molecules among all the terminals contained in the polyurethane (A), it is obtained by curing the pressure-sensitive adhesive composition containing the polyurethane (A). The cohesive force of the cured product is sufficiently high.
  • the ratio of the number of terminals into which the (meth) acryloyl group is introduced based on the number of molecules out of all the number of terminals contained in polyurethane (A) can be calculated using the result of analysis of polyurethane (A).
  • the analysis method include an infrared absorption spectrum (IR) method and a nuclear magnetic resonance spectrum (NMR) method.
  • the ratio of the number of introduced terminals can be adjusted by the method for producing polyurethane (A) described later.
  • the mass average molecular weight of polyurethane (A) is preferably 30,000 to 200,000, more preferably 50,000 to 150,000, and even more preferably 60,000 to 100,000. ..
  • the mass average molecular weight of the polyurethane (A) is 30,000 or more, the cured product obtained by curing the pressure-sensitive adhesive composition containing the polyurethane (A) has good flexibility. Further, when the mass average molecular weight of the polyurethane (A) is 200,000 or less, the pressure-sensitive adhesive composition containing the polyurethane (A) is easy to handle and has good workability.
  • the mass average molecular weight of polyurethane (A) is a polystyrene-equivalent value measured by gel permeation chromatography (GPC-101; Showa Denko KK Shodex®) (hereinafter referred to as GPC). ..
  • GPC gel permeation chromatography
  • the measurement conditions of GPC are as follows. Column: LF-804 (manufactured by Showa Denko KK) Column temperature: 40 ° C Sample: 0.2 mass% tetrahydrofuran solution of polyurethane (A) Flow rate: 1 ml / min Eluent: Tetrahydrofuran Detector: RI detector (differential refractive index detector)
  • the content of the polyurethane (A) in the pressure-sensitive adhesive composition of the present embodiment is preferably 20 to 50% by mass, more preferably 25 to 45% by mass, and 30 to 40% by mass. Is even more preferable.
  • the content of the polyurethane (A) is 20% by mass or more, the cured product obtained by curing the pressure-sensitive adhesive composition has a sufficient cohesive force, and an excellent adhesive force can be obtained.
  • the softness of the pressure-sensitive adhesive layer is within an appropriate range, and air bubbles are less likely to be caught between the pressure-sensitive adhesive layer and the adherend.
  • the cured product obtained by curing the pressure-sensitive adhesive composition has sufficient flexibility. Therefore, the semiconductor processing tape using this cured product as the pressure-sensitive adhesive layer has good wettability to the adherend.
  • the (meth) acrylate monomer (B) contains a monofunctional (meth) acrylate and a polyfunctional (meth) acrylate other than the polyurethane (A).
  • monofunctional (meth) acrylate means a (meth) acrylate having only one (meth) acryloyloxy group.
  • polyfunctional in the polyfunctional (meth) acrylate means a (meth) acrylate having two or more (meth) acryloyloxy groups.
  • the (meth) acrylate monomer (B) includes a monofunctional (meth) acrylate and a polyfunctional (meth) acrylate from the viewpoint of the cohesive force of the cured product obtained by curing the pressure-sensitive adhesive composition and the curability of the pressure-sensitive adhesive composition. It is preferable to use it in combination with acrylate. It is more preferable to contain a monofunctional (meth) acrylate and a trifunctional or higher functional (meth) acrylate. In particular, it is most preferable to contain a monofunctional (meth) acrylate and a trifunctional (meth) acrylate having three (meth) acryloyloxy groups.
  • Examples of the monofunctional (meth) acrylate include cyclic alkyl (meth) acrylate such as alkyl (meth) acrylate and isobornyl (meth) acrylate, alkoxyalkyl (meth) acrylate, alkoxy (poly) alkylene glycol (meth) acrylate, and hydroxy.
  • alkyl (meth) acrylate it is preferable to contain an alkyl (meth) acrylate. This is because the adhesive strength (peeling force) and gel fraction of the cured product obtained by curing the pressure-sensitive adhesive composition tend to be in a more appropriate range when the cured product is used as the pressure-sensitive adhesive layer of a semiconductor processing tape. is there.
  • the alkyl (meth) acrylate it is more preferable to use an alkyl (meth) acrylate having an alkyl group having 4 to 10 carbon atoms.
  • alkyl (meth) acrylate examples include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate.
  • 2-ethylhexyl (meth) acrylate and / or n-butyl (meth) acrylate examples include 2-ethylhexyl (meth) acrylate and / or n-butyl (meth) acrylate.
  • the polyfunctional (meth) acrylate is a compound other than polyurethane (A) and having a plurality of (meth) acryloyloxy groups.
  • the polyfunctional (meth) acrylate it is preferable to use a poly (meth) acrylate of a polyol compound.
  • Specific examples of the polyfunctional (meth) acrylate include polyethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, and tripropylene glycol.
  • trimethylolpropane tri (meth) acrylate is preferably used as the polyfunctional (meth) acrylate from the viewpoint of curability of the pressure-sensitive adhesive composition.
  • These polyfunctional (meth) acrylates may be used alone or in combination of two or more.
  • the ratio of monofunctional (meth) acrylate and polyfunctional (meth) acrylate is 85 to 99 mol% of monofunctional (meth) acrylate when the total of (meth) acrylate monomer (B) is 100 mol%. It preferably contains 1 to 15 mol% of functional (meth) acrylate. In this case, the content of the monofunctional (meth) acrylate is more preferably 90 to 99 mol%, further preferably 95 to 98 mol%. The content of the polyfunctional (meth) acrylate is more preferably 1 to 10 mol%, further preferably 2 to 5 mol%.
  • the fluidity of the cured product obtained by curing the pressure-sensitive adhesive composition is high when the cured product is used as the pressure-sensitive adhesive layer of the semiconductor processing tape. It is in a preferable range. Therefore, the semiconductor processing tape using this cured product as the pressure-sensitive adhesive layer can obtain sufficient unevenness absorption, and when attached to an adherend having an uneven portion on the surface, the tape will be in contact with the uneven portion of the adherend. It is preferable because voids are less likely to occur between them.
  • the adhesive residue when the semiconductor processing tape using the cured product of the pressure-sensitive adhesive composition as the pressure-sensitive adhesive layer is peeled off from the adherend. It is difficult to do and is preferable.
  • the fluidity of the cured product obtained by curing the pressure-sensitive adhesive composition does not become too large, which is preferable. Further, when the content of the polyfunctional (meth) acrylate is 15 mol% or less, the fluidity of the cured product obtained by curing the pressure-sensitive adhesive composition allows the cured product to be used as the pressure-sensitive adhesive layer of the semiconductor processing tape. If there is, it will be a preferable range. Therefore, the semiconductor processing tape using the cured product as the pressure-sensitive adhesive layer has sufficient unevenness absorbing property, and when attached to an adherend having an uneven portion on the surface, the tape with the uneven portion of the adherend is attached. It is preferable because voids are less likely to occur between them.
  • the content of the (meth) acrylate monomer (B) in the pressure-sensitive adhesive composition of the present embodiment is preferably 35 to 79% by mass, more preferably 40 to 73% by mass, and 45 to 66% by mass. It is more preferably%.
  • the content of the (meth) acrylate monomer (B) is 35% by mass or more, the viscosity of the pressure-sensitive adhesive composition does not become too high and the coatability is excellent, which is preferable.
  • the content of the (meth) acrylate monomer (B) is 79% by mass or less, the viscosity of the pressure-sensitive adhesive composition does not become too low, and the thickness of the coating film made of the pressure-sensitive adhesive composition can be easily controlled. ,preferable.
  • the chain transfer agent (C) is contained in the pressure-sensitive adhesive composition for the purpose of controlling the unevenness absorption and gel fraction of the cured product obtained by curing the pressure-sensitive adhesive composition.
  • the chain transfer agent (C) it is preferable to use a thiol compound.
  • polyfunctional thiols can be preferably used.
  • a polyfunctional thiol is a compound having two or more mercapto groups in the molecule.
  • the polyfunctional thiol is not particularly limited, and is, for example, 1,2-ethanedithiol, 1,4-bis (3-mercaptobutylyloxy) butane, tetraethylene glycol bis (3-mercaptopropionate), and trimethylol.
  • the chain transfer agent (C) it is preferable to use pentaerythritol tetrakis (3-mercaptobuty
  • the content of the chain transfer agent (C) in the pressure-sensitive adhesive composition of the present embodiment is preferably 0.5 to 8% by mass, more preferably 1 to 5% by mass, and 3 to 4. It is more preferably 5% by mass.
  • the content of the chain transfer agent (C) is 0.5% by mass or more, the fluidity of the cured product obtained by curing the pressure-sensitive adhesive composition allows the cured product to be used as the pressure-sensitive adhesive layer of the semiconductor processing tape. If there is, it will be a preferable range. Therefore, the semiconductor processing tape using the cured product as the pressure-sensitive adhesive layer has sufficient unevenness absorbing property, and is less likely to generate voids between the cured product and the uneven portion of the adherend, which is preferable.
  • the content is 8% by mass or less, the tape for semiconductor processing using the cured product of the pressure-sensitive adhesive composition as the pressure-sensitive adhesive layer is less likely to remain adhesive when peeled from the adherend, which is preferable.
  • the photopolymerization initiator (D) is not particularly limited, but a photoradical polymerization initiator is preferable.
  • the photopolymerization initiator (D) include a carbonyl-based photopolymerization initiator, a sulfide-based photopolymerization initiator, an acylphosphine oxide-based photopolymerization initiator, a quinone-based photopolymerization initiator, and a sulfochloride-based photopolymerization initiator.
  • a thioxanthone-based photopolymerization initiator or the like can be used.
  • a carbonyl-based photopolymerization initiator and / or an acylphosphine oxide-based photopolymerization initiator is used from the viewpoint of transparency of the cured product obtained by photocuring the pressure-sensitive adhesive composition.
  • the content of the photopolymerization initiator (D) in the pressure-sensitive adhesive composition of the present embodiment is preferably 0.01 to 5% by mass, more preferably 0.05 to 3% by mass, and 0. It is more preferably 1 to 2% by mass.
  • the content of the photopolymerization initiator (D) is 0.01% by mass or more, the photocuring of the pressure-sensitive adhesive composition proceeds sufficiently.
  • the content of the photopolymerization initiator (D) is 5% by mass or less, the low molecular weight component does not become too large during photocuring of the pressure-sensitive adhesive composition. Therefore, it is preferable that the semiconductor processing tape using the cured product of the pressure-sensitive adhesive composition as the pressure-sensitive adhesive layer is less likely to leave adhesive residue when peeled from the adherend.
  • the pressure-sensitive adhesive composition of the present embodiment contains a polyurethane (A), a (meth) acrylate monomer (B), a chain transfer agent (C), and a photopolymerization initiator (D), if necessary. , Fatty acid ester (E) may be contained.
  • the fatty acid ester (E) controls the adhesive force of the tape for semiconductor processing using the cured product of the pressure-sensitive adhesive composition as the pressure-sensitive adhesive layer, and also has the laminating property (wetting property) and the foam removal property (adhesion property) of the pressure-sensitive adhesive layer.
  • a tape for semiconductor processing is contained in the pressure-sensitive adhesive composition for the purpose of improving the ease of removing air bubbles sandwiched between the body and the adhesive.
  • an ester of a fatty acid and an alkyl alcohol can be used. Further, from the viewpoint of compatibility with other components, an ester of a fatty acid having 8 to 18 carbon atoms and a monofunctional alcohol having a branched hydrocarbon group having 3 to 18 carbon atoms, and an unsaturated fatty acid having 14 to 18 carbon atoms. It is preferable to use a fatty acid ester selected from the group consisting of esters of 2 to 4 functional alcohols.
  • ester of a fatty acid having 8 to 18 carbon atoms and a monofunctional alcohol having a branched hydrocarbon group having 3 to 18 carbon atoms examples include isostearyl laurate, isopropyl myristate, isosetyl myristate, octyldodecyl myristate, and isopropyl palmitate.
  • isostearyl palmitate isosetyl stearate, 2-ethylhexyl stearate, octyldodecyl oleate, diisostearyl adipate, diisocetyl sebacate, trioleyl trimeritate, triisocetyl trimeritate and the like.
  • isopropyl myristate, isopropyl palmitate, and 2-ethylhexyl stearate are preferably used, and isopropyl myristate and / or 2-ethylhexyl stearate is particularly preferable.
  • esters of unsaturated fatty acids having 14 to 18 carbon atoms and alcohols having 2 to 4 functionalities include unsaturated fatty acids such as myristoleic acid, oleic acid, linoleic acid, linolenic acid, isostriatic acid, and isostearic acid, and ethylene.
  • esters with alcohols such as glycols, propylene glycols, glycerins, trimethylolpropanes, pentaerythritols, and sorbitans.
  • the content of the fatty acid ester (E) in the pressure-sensitive adhesive composition of the present embodiment is preferably 3 to 18% by mass, more preferably 5 to 15% by mass.
  • the adhesive strength of the semiconductor processing tape using the cured product of the pressure-sensitive adhesive composition as the pressure-sensitive adhesive layer is in a preferable range, and the pressure-sensitive adhesive layer is laminated. Good properties and foam removal properties.
  • the content of the fatty acid ester (E) is 18% by mass or less, the fatty acid ester (E) is formed when the semiconductor processing tape using the cured product of the pressure-sensitive adhesive composition as the pressure-sensitive adhesive layer is peeled off from the adherend. It is preferable because the adhesive residue containing the ester is less likely to occur.
  • the pressure-sensitive adhesive composition of the present embodiment may contain a solvent, but is more preferably a solvent-free one containing substantially no solvent.
  • a solvent for example, a solvent can be used as a leveling agent and / or a softening agent.
  • the pressure-sensitive adhesive composition of the present embodiment is solvent-free, excellent productivity can be obtained because the step of heating and drying the solvent can be omitted when forming the pressure-sensitive adhesive layer of the semiconductor processing tape using the pressure-sensitive adhesive composition. Be done.
  • the productivity improvement effect by omitting the step of heating and drying the solvent Is remarkable, so it is preferable that there is no solvent.
  • the meaning of "substantially free of solvent” in the pressure-sensitive adhesive composition means that the content of the solvent in the pressure-sensitive adhesive composition is 0 to 1% by mass, preferably 0 to 0. It is 5.5% by mass, more preferably 0 to 0.1% by mass.
  • the pressure-sensitive adhesive composition of the present embodiment may contain other additives, if necessary, as long as the effects of the present invention are not impaired.
  • Additives include, for example, plasticizers, surface lubricants, antioxidants, antioxidants, light stabilizers, UV absorbers, polymerization inhibitors, light stabilizers such as benzotriazoles, phosphate esters and others. Examples include flame retardants and dyes.
  • the method for producing the pressure-sensitive adhesive composition of the present embodiment will be described in detail with reference to an example.
  • the polyurethane (A) will be described with reference to a preferable synthetic method.
  • polyurethane (A) such as (meth) acrylate monomer (B), chain transfer agent (C), photopolymerization initiator (D), fatty acid ester (E), etc.
  • Commercially available products can be easily purchased for each ingredient except.
  • the synthesis method differs depending on the type of compound used as each component. Therefore, the description of the synthesis method will be omitted.
  • the reaction between the hydroxy group and the isocyanato group is carried out in any step using a urethanization catalyst in the presence of an organic solvent inert to the isocyanato group.
  • this urethanization catalyst include dibutyltin dilaurate, dibutyltin diethylhexoate, and dioctyltin dilaurate.
  • the reaction between the hydroxy group and the isocyanato group is preferably carried out continuously at 30 to 100 ° C. for 1 to 5 hours in any of the steps.
  • the amount of the urethanization catalyst used is preferably 50 to 500 mass ppm with respect to the total mass of the reactant (raw material).
  • polyoxyalkylene polyol and polyisocyanate are mixed at a ratio in which the isocyanato group amount (based on the number of molecules, the same applies hereinafter) is larger than the amount of the hydroxy group (based on the number of molecules, the same applies hereinafter).
  • the polyoxyalkylene polyol is reacted with the polyisocyanate to synthesize a polyurethane having an isocyanato group at the terminal as a precursor of the polyurethane (A).
  • Specific examples of the polyoxyalkylene polyol and the polyisocyanate used as raw materials are as illustrated in the section of polyurethane (A).
  • the molecular weight (degree of polymerization) of the polyurethane having an isocyanato group at the terminal can be adjusted by adjusting the ratio of the isocyanato group amount to the hydroxy group amount contained in the raw material. Specifically, the smaller the excess amount of the isocyanato group with respect to the hydroxy group amount, the larger the molecular weight of the polyurethane having an isocyanato group at the terminal. Further, the larger the excess amount of the isocyanato group with respect to the hydroxy group amount, the smaller the molecular weight of the polyurethane having an isocyanato group at the terminal.
  • the mass average molecular weight of the target polyurethane (A) is adjusted by adjusting the molecular weight of the polyurethane having an isocyanato group at the terminal.
  • polyurethane having an isocyanato group at the terminal is reacted with a compound having a hydroxy group and a (meth) acryloyl group to produce a polyurethane (A) containing the polyurethane (a1).
  • Polyurethane (a1) has a skeleton containing a structure derived from a polyoxyalkylene polyol and a structure derived from a polyisocyanate, and has a (meth) acryloyl group at a plurality of ends.
  • the terminal (meth) acryloyl group of the produced polyurethane (A) is preferably a part of the (meth) acryloyloxy group.
  • the compound having a hydroxy group and a (meth) acryloyl group is not particularly limited, but is a hydroxyalkyl such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate.
  • Examples thereof include monool having a (meth) acryloyl group derived from various polyols such as.
  • These compounds having a hydroxy group and a (meth) acryloyl group may be used alone or in combination of two or more.
  • 2-hydroxyethyl (meth) is obtained from the viewpoint of reactivity with the isocyanato group of polyurethane having an isocyanato group at the terminal and photocurability of the pressure-sensitive adhesive composition.
  • the polyurethane (A) has an isocyanato group at the terminal in combination with a compound having a hydroxy group and a (meth) acryloyl group and an alkyl alcohol having no (meth) acryloyl group and having one hydroxy group. It may be produced by reacting with polyurethane.
  • the alkyl alcohol may be any as long as it does not have a (meth) acryloyl group and has one hydroxy group, and linear, branched, alicyclic alkyl alcohols and the like can be used and is not particularly limited. ..
  • the above alkyl alcohol may be used alone or in combination of two or more.
  • Polyurethane (A) is obtained by reacting a compound having a hydroxy group and a (meth) acryloyl group, an alkyl alcohol having no (meth) acryloyl group and having one hydroxy group, and a polyurethane having an isocyanato group at the terminal.
  • the amount of (meth) acryloyl group introduced into polyurethane having an isocyanato group at the terminal can be adjusted by producing.
  • a polyurethane (A) containing a plurality of types of polyurethane having different amounts of introduced (meth) acryloyl groups at the ends is produced.
  • the plurality of types of polyurethanes include polyurethanes (a1) having a plurality of (meth) acryloyl groups at the ends.
  • the plurality of types of polyurethane include not only polyurethane (a1) but also polyurethane in which at least a part of the plurality of ends has a structure derived from the above alkyl alcohol.
  • the produced plurality of types of polyurethanes include polyurethanes in which at least some of the plurality of ends do not have a (meth) acryloyl group. Furthermore, among the plurality of types of polyurethane produced, polyurethane (a2) having a (meth) acryloyl group at only one terminal may be included.
  • reaction between the hydroxy group and the isocyanato group is preferably carried out continuously at 30 to 100 ° C. for 1 to 5 hours in any of the steps.
  • the amount of the urethanization catalyst used is preferably 50 to 500 mass ppm with respect to the total mass of the reactant (raw material).
  • polyurethane having a hydroxy group at the terminal is synthesized as a precursor of polyurethane (A). Specifically, first, the polyoxyalkylene polyol and the polyisocyanate are charged at a ratio in which the hydroxy group amount (based on the number of molecules, the same applies hereinafter) is larger than the amount of the isocyanato group (based on the number of molecules, the same applies hereinafter). Then, the polyoxyalkylene polyol is reacted with the polyisocyanate to synthesize a polyurethane having a hydroxy group at the terminal as a precursor of the polyurethane (A).
  • the molecular weight (degree of polymerization) of the polyurethane having a hydroxy group at the terminal can be adjusted by adjusting the ratio of the hydroxy group amount to the isocyanato group amount contained in the raw material. Specifically, the smaller the excess amount of the hydroxy group amount with respect to the isocyanato group amount, the larger the molecular weight of the polyurethane having a hydroxy group at the terminal. Further, the larger the excess amount of the hydroxy group with respect to the isocyanato group amount, the smaller the molecular weight of the polyurethane having a hydroxy group at the terminal.
  • the mass average molecular weight of the target polyurethane (A) is adjusted by adjusting the molecular weight of the polyurethane having a hydroxy group at the terminal.
  • a polyurethane having a hydroxy group at the terminal is reacted with a compound having an isocyanato group and a (meth) acryloyl group to have a structure containing a polyoxyalkylene polyol-derived structure and a polyisocyanate-derived structure.
  • Polyurethane (A) containing polyurethane (a1) having a (meth) acryloyl group at the end of is produced.
  • the terminal (meth) acryloyl group of the produced polyurethane (A) is preferably a part of the (meth) acryloyloxy group.
  • the compound having an isocyanato group and a (meth) acryloyl group is not particularly limited, but is limited to 2- (meth) acryloyloxyethyl isocyanate, 2- (meth) acryloyloxypropyl isocyanate, and 1,1-bis (acryloyloxymethyl) ethyl. Examples thereof include isocyanate. Examples of commercially available compounds having an isocyanato group and a (meth) acryloyl group include Karenz MOI (registered trademark) and Karenz AOI (registered trademark) manufactured by Showa Denko KK. These compounds having an isocyanato group and a (meth) acryloyl group may be used alone or in combination of two or more.
  • 2- (meth) acryloyl from the viewpoint of reactivity with the hydroxy group of polyurethane having a hydroxy group at the terminal and photocurability of the pressure-sensitive adhesive composition. It is preferable to use oxyethyl isocyanate.
  • the polyurethane (A) has a hydroxy group at the terminal in combination with a compound having an isocyanato group and a (meth) acryloyl group and an alkyl isocyanate having no (meth) acryloyl group and having one isocyanato group. It may be produced by reacting with polyurethane.
  • the alkyl isocyanate may be any as long as it does not have a (meth) acryloyl group and has one isocyanato group, and linear type, branched type, alicyclic type alkyl isocyanate and the like can be used and is not particularly limited. ..
  • the above alkyl isocyanate may be used alone or in combination of two or more.
  • Polyurethane (A) is obtained by reacting a compound having an isocyanato group and a (meth) acryloyl group, an alkyl isocyanate having no (meth) acryloyl group and having one isocyanato group, and a polyurethane having a hydroxy group at the terminal.
  • the amount of (meth) acryloyl group introduced into polyurethane having a hydroxy group at the terminal can be adjusted by producing.
  • a polyurethane (A) containing a plurality of types of polyurethane having different amounts of introduced (meth) acryloyl groups at the ends is produced.
  • the plurality of types of polyurethanes include polyurethanes (a1) having a plurality of (meth) acryloyl groups at the ends.
  • the plurality of types of polyurethane include not only polyurethane (a1) but also polyurethane in which at least a part of the plurality of ends has a structure derived from the above-mentioned alkyl isocyanate.
  • the produced plurality of types of polyurethanes include polyurethanes in which at least some of the plurality of ends do not have a (meth) acryloyl group. Furthermore, among the plurality of types of polyurethane produced, polyurethane (a2) having a (meth) acryloyl group at only one terminal may be included.
  • the pressure-sensitive adhesive composition of the present embodiment contains the polyurethane (A) obtained by the above synthesis method, the (meth) acrylate monomer (B), the chain transfer agent (C), and the photopolymerization initiator (D).
  • A polyurethane
  • B the (meth) acrylate monomer
  • C the chain transfer agent
  • D the photopolymerization initiator
  • the method of mixing each component contained in the pressure-sensitive adhesive composition of the present embodiment is not particularly limited, and can be carried out by using, for example, a stirring device equipped with a stirring blade such as a homodisper or a paddle blade. ..
  • the method for producing the semiconductor processing tape of the present embodiment is not particularly limited, and can be produced by using a known method.
  • fine particles of polypyrrole and / or polypyrrole derivative are dispersed in a hydrophilic solvent using a polymer dispersant and / or a dopant, and further mixed with a water-soluble or water-dispersible binder resin to prepare a resin composition.
  • the solvent is dried and removed to obtain a base material on which an antistatic layer is formed.
  • the pressure-sensitive adhesive composition is applied onto the antistatic layer of the base material, and a transparent separator film is laminated to form a laminate. Then, the pressure-sensitive adhesive composition is irradiated with ultraviolet rays via a separator to photo-cure the pressure-sensitive adhesive composition. As a result, a tape for semiconductor processing in which a pressure-sensitive adhesive layer, which is a cured product of the pressure-sensitive adhesive composition, is formed on a base material having an antistatic layer can be obtained.
  • the method of applying the pressure-sensitive adhesive composition to the base material is not particularly limited and can be appropriately selected.
  • various coaters such as a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, a spray coater, a comma coater, and a direct coater are used. Examples thereof include a method to be used and a screen printing method.
  • Examples of the light source for photocuring the pressure-sensitive adhesive composition include a black light, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, and a xenon lamp.
  • the light irradiation intensity is preferably a condition in which the pressure-sensitive adhesive composition can be sufficiently cured and the gel fraction of the cured product is in the range of 50 to 65% by mass. For example, 50 to It is preferably 3000 mW / cm 2. If the light irradiation intensity is weak, it takes time to cure and the productivity is lowered.
  • the pressure-sensitive adhesive composition is irradiated with ultraviolet rays via a transparent separator, but when the base material is transparent, ultraviolet rays may be irradiated from the base material side, and an opaque separator is used. May be good.
  • the semiconductor processing tape of the present embodiment can be used, for example, for an application in which the tape is attached to an adherend having an uneven portion on the surface and then peeled off. Specifically, it can be suitably used as a back grind tape for semiconductor wafer processing, which is attached to a surface on which bumps of a semiconductor wafer are formed to protect the surface of the semiconductor wafer and is peeled off after a predetermined wafer processing step. ..
  • the peel strength (adhesive strength) of the semiconductor processing tape is determined, for example, in the processing process of a semiconductor device. In the back grind process, it is necessary to have a peeling strength (adhesive strength) for firmly fixing the semiconductor processing tape to the semiconductor wafer. On the other hand, the peel strength of the semiconductor processing tape needs to be such a strength that the parts of the semiconductor device are not damaged when the semiconductor processing tape is peeled from the semiconductor wafer after a predetermined processing step.
  • the peel strength of the semiconductor processing tape used for the above applications is such that the peeling speed is 0.3 m / min.
  • the thickness of the pressure-sensitive adhesive layer is 50 to 200 ⁇ m, it is preferably 10 to 300 gf / 25 mm, more preferably 15 to 200 gf / 25 mm, and further preferably 20 to 150 gf / 25 mm. preferable.
  • the thickness of the pressure-sensitive adhesive layer is 200 to 500 ⁇ m, it is preferably 50 to 500 gf / 25 mm, more preferably 60 to 400 gf / 25 mm, and even more preferably 70 to 300 gf / 25 mm.
  • a specific method for measuring the peel strength of the semiconductor processing tape will be described later in Examples.
  • the semiconductor processing tape of the present embodiment has a pressure-sensitive adhesive layer which is a cured product of the pressure-sensitive adhesive composition of the present embodiment on one side of a base material on which an antistatic layer is formed. Therefore, the semiconductor processing tape of the present embodiment has sufficient adhesive strength, and the adhesive layer is less likely to be transferred to the adherend after the semiconductor processing tape is peeled off, and unevenness is less likely to occur. Excellent absorbency and antistatic performance. Therefore, the semiconductor processing tape of the present embodiment is suitable for applications in which the tape is attached to an adherend having an uneven portion on the surface and then peeled off.
  • the semiconductor processing tape of the present embodiment is suitably used as, for example, a semiconductor processing tape that is attached when performing a back grind step of a semiconductor wafer having an uneven portion composed of bumps on the surface and is peeled off after the back grind step. be able to.
  • the semiconductor wafer is fixed with sufficient adhesive force by the semiconductor processing tape of the present embodiment.
  • the semiconductor processing tape has sufficient unevenness absorption, gaps are unlikely to occur between the semiconductor processing tape attached to the semiconductor wafer and the periphery of the bump. Therefore, it is possible to prevent water used in the back grind process from entering the gap between the semiconductor processing tape and the periphery of the bump and contaminating the semiconductor wafer.
  • the semiconductor processing tape of the present embodiment has sufficient antistatic performance, it is possible to suppress peeling charge when the semiconductor processing tape attached to the semiconductor wafer is peeled off after the backgrinding step. Further, after the back grind step, adhesive residue is less likely to occur around the bumps of the semiconductor wafer from which the semiconductor processing tape has been peeled off, which is preferable.
  • the semiconductor processing tape of the present embodiment may have a single-layer structure in which the pressure-sensitive adhesive layer is a cured product of the pressure-sensitive adhesive composition.
  • the pressure-sensitive adhesive layer can be formed only by performing the step of forming one layer. Therefore, the semiconductor processing tape of the present embodiment can be easily manufactured in a smaller number of manufacturing steps than, for example, as compared with the case of forming a semiconductor processing tape provided with a layer having unevenness absorption and a layer having adhesive strength. Can be manufactured.
  • the resin composition was heat-cured on one side of a PET film (manufactured by Toyobo Co., Ltd., trade name: ester (trademark) film E5100) having a thickness of 50 ⁇ m as the base material body so that the film thickness after heat curing was 1.0 ⁇ m. It was applied with a gravure coater. Then, it was cured at 130 ° C. for 1 minute to obtain a sheet-like substrate 1.
  • the electrical resistance of the substrate 1 measured with a low resistivity meter Mitsubishi Chemical Analytic Tech Co. Loresta -AX
  • the resin composition was heat-cured on one side of a PET film (manufactured by Toyobo Co., Ltd., trade name: ester (trademark) film E5100) having a thickness of 50 ⁇ m as the base material body so that the film thickness after heat curing was 1.0 ⁇ m. It was applied with a gravure coater. Then, it was cured at 130 ° C. for 1 minute to obtain a sheet-like base material 2.
  • the electrical resistance of the substrate 2 was measured with a low resistivity meter (Mitsubishi Chemical Analytic Tech Co. Loresta -AX) was 4 ⁇ 10 5 ⁇ ⁇ cm.
  • the obtained polyurethane (A-1) was analyzed using an infrared absorption spectrum (IR) method. As a result, no peak derived from the isocyanato group was observed. Therefore, it was confirmed that the polyurethane (A-1) is a polyurethane (a1) in which an acryloyloxy group is introduced at all terminals.
  • IR infrared absorption spectrum
  • the obtained polyurethane (A-2) was analyzed using an infrared absorption spectrum (IR) method. As a result, no peak derived from the isocyanato group was observed. Therefore, it was confirmed that the polyurethane (A-2) is a polyurethane (a1) in which an acryloyloxy group is introduced at all terminals.
  • IR infrared absorption spectrum
  • PE1 Pentaerythritol tetrakis (3-mercaptobutyrate) (manufactured by Showa Denko KK)
  • NR1 1,3,5-Tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -Trione (manufactured by Showa Denko KK)
  • TPO Omnirad TPO H
  • 2,4,6-trimethylbenzoyldiphenylphosphine oxide manufactured by IGM Resins BV) 184 (Omnirad 184): 1-Hydroxycyclohexyl-phenylketone (manufactured by IGM Resins BV)
  • Exepearl IPM Isopropyl myristate (manufactured by Kao Corporation)
  • EHS 2-ethylhexyl stearate (manufactured by Ka
  • Example 1 The pressure-sensitive adhesive composition c1 of Formulation Example 1 in Table 1 was applied to the surface of the base material 1 on the antistatic layer side using an applicator so that the thickness after curing was 150 ⁇ m. Next, a silicone-based ultra-light peeling PET film (manufactured by Toyobo Co., Ltd., product name: E7006) having a thickness of 75 ⁇ m was bonded to the coated surface of the pressure-sensitive adhesive composition using a rubber roller.
  • a silicone-based ultra-light peeling PET film manufactured by Toyobo Co., Ltd., product name: E7006
  • Examples 2 to 3 and Comparative Examples 1 to 6 A semiconductor processing tape is produced in the same manner as in Example 1 except that the base material and the pressure-sensitive adhesive compositions c2 to c7 shown in Table 2 are used and the pressure-sensitive adhesive layer has the film thickness shown in Table 2. did. As a result, the semiconductor processing tapes of Examples 2 to 3 and Comparative Examples 1 to 6 were obtained.
  • the semiconductor processing tape was cut into a size of 120 mm in length and 120 mm in width, and left to stand in an environment of a temperature of 23 ° C. and a relative humidity of 50% RH for 3 hours for humidity control. After that, the peeling PET film is peeled off to expose the pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer is used under the condition of an applied voltage of 100 V ⁇ 60 seconds using a high resistivity meter (High Restor-UX manufactured by Mitsubishi Chemical Analytech Co., Ltd.). The surface resistivity on the side was measured.
  • Surface resistivity is less than 1 ⁇ 10 11 ⁇ / ⁇ ⁇ : Surface resistivity is 1 ⁇ 10 11 ⁇ / ⁇ or more and less than 1 ⁇ 10 12 ⁇ / ⁇ ⁇ : Surface resistivity is 1 ⁇ 10 12 ⁇ / ⁇ or more and 1 ⁇ 10 13 ⁇ / less than ⁇ ⁇ : Surface resistivity is 1 ⁇ 10 13 ⁇ / ⁇ or more
  • ⁇ Peeling force (peeling strength)> The semiconductor processing tape was cut into a size of 25 mm in length and 150 mm in width, and the separator was peeled off to expose the adhesive layer. Then, the entire surface of the exposed adhesive layer is laminated on a glass plate, and a rubber roller (diameter: 85 mm, width: 50 mm) having a mass of 2 kg (load 19.6 N) is reciprocated once to obtain a measurement sample. It was. The obtained measurement sample was left for 30 minutes in an environment of a temperature of 23 ° C. and a relative humidity of 50% RH. Then, according to JIS K 6854-2, the peeling speed was 0.3 m / min. A tensile test in the 180 ° direction was performed in the glass plate to measure the peel strength (gf / 25 mm) with respect to the glass plate.
  • the semiconductor processing tape was cut into a size of 25 mm in length and 50 mm in width, and the separator was peeled off to expose the adhesive layer. Then, the surface of the exposed pressure-sensitive adhesive layer and the bumps of a wafer with bumps (WALTS-TEG FC150SCJY LF (PI) manufactured by Waltz, bump height: 75 ⁇ m, bump size: diameter 90 ⁇ m) were placed facing each other. Then, a rubber roller (diameter: 85 mm, width: 50 mm) having a mass of 2 kg (load 19.6 N) is reciprocated three times at a speed of 10 mm / sec on the base material of the semiconductor processing tape, and the semiconductor processing tape and bumps are formed. The attached wafer was bonded.
  • a wafer with bumps bonded to a semiconductor processing tape is observed from the base material side of the semiconductor processing tape with a digital optical microscope (RH-2000 manufactured by Hirox Co., Ltd.), and the bumps are made according to the following criteria. The unevenness absorption was evaluated.
  • X There is a gap between the adhesive layer of the semiconductor processing tape and the periphery of the bump of the bumped wafer.
  • the semiconductor processing tape was cut into a size of 25 mm in length and 50 mm in width, and the separator was peeled off to expose the adhesive layer. Then, the surface of the exposed pressure-sensitive adhesive layer was placed facing the bumps of a wafer with bumps (WALTS-TEG FC150SCJY LF (PI) manufactured by Waltz, bump height: 75 ⁇ m, bump size: diameter 90 ⁇ m). Then, a rubber roller (diameter: 85 mm, width: 50 mm) having a mass of 2 kg (load 19.6 N) is reciprocated three times at a speed of 10 mm / sec on the base material of the semiconductor processing tape, and the semiconductor processing tape and bumps are formed. The attached wafer was bonded.
  • the bumped wafer bonded to the semiconductor processing tape was left at 23 ° C. for 24 hours, and then the semiconductor processing tape was placed at about 2 m / min. It was peeled off by hand at a moderate speed. Then, the surface of the bumped wafer was observed with a digital optical microscope (RH-2000 manufactured by Hirox Co., Ltd.), and the presence or absence of contamination due to adhesive residue was evaluated according to the following criteria.
  • the “adhesive residue” means that the adhesive layer itself remains attached to the wafer surface and the wafer surface is sticky.
  • X There is contamination due to adhesive residue around the bump.
  • Adhesive composition on a 75 ⁇ m-thick peeling PET film (manufactured by Higashiyama Film Co., Ltd., trade name: Clean Sepa (trademark) HY-S10-2) so that the thickness after curing is 150 ⁇ m using an applicator. I applied the thing.
  • the thickness after curing was adjusted to 30 ⁇ m.
  • the coated surface of the pressure-sensitive adhesive composition was covered with a silicone-based ultra-light peeling PET film (manufactured by Toyobo Co., Ltd., product name: E7006) having a thickness of 75 ⁇ m.
  • the irradiation distance is 25 cm
  • the lamp moving speed is 1.0 m / min
  • the irradiation amount is 1000 mJ / cm 2 .
  • the pressure-sensitive adhesive composition was cured by irradiating ultraviolet rays through an ultra-light peeling PET film to obtain a cured product (adhesive layer).
  • the cured product (adhesive layer) was cut out to a size of about 1 g, and the PET films on both sides were peeled off to prepare a sample for measurement, and the mass thereof was measured.
  • B Mass of measurement sample before immersion in toluene
  • a tape for semiconductor processing which has sufficient unevenness absorption, antistatic performance, adhesive strength, is less likely to cause adhesive residue, and can be manufactured with a small number of manufacturing steps.
  • the semiconductor processing tape can be preferably used as an application for protecting the surface of a semiconductor wafer in the semiconductor wafer processing process and peeling it off after the processing process.
  • it is suitable as a back grind tape used for protecting the surface when performing a back grind step of an adherend having an uneven portion on the surface such as a semiconductor wafer having bumps formed on the surface.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)

Abstract

L'invention concerne une bande de traitement de semi-conducteur qui réduit suffisamment l'influence des irrégularités de surface et présente une force adhésive sensible à la pression modérée ainsi qu'une performance antistatique et qui est moins apte à laisser un résidu adhésif lors du retrait et peut être produite par quelques étapes. La bande de traitement de semi-conducteur comprend : un substrat en forme de feuille comprenant un corps principal de substrat et une couche antistatique disposée sur au moins une surface associée ; et une couche adhésive sensible à la pression. La couche antistatique comporte un composé polypyrrole. La couche adhésive sensible à la pression est un objet durci obtenu à partir d'une composition adhésive sensible à la pression et a une épaisseur de 50 à 500 µm. La composition adhésive sensible à la pression comprend un ou plusieurs polyuréthanes (A), un (méth)acrylate monomère (B) comprenant un composé ayant un groupe (méth)acryloyloxy, un agent de transfert de chaîne (C) et un initiateur de photopolymérisation (D). Les polyuréthanes (A) comportent un polyuréthane (a1) ayant des groupes (méth)acryloyle à une pluralité d'extrémités.
PCT/JP2020/046636 2019-12-17 2020-12-15 Bande de traitement de semi-conducteur WO2021125152A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202080078579.7A CN114729232B (zh) 2019-12-17 2020-12-15 半导体加工用带
KR1020227015871A KR102565398B1 (ko) 2019-12-17 2020-12-15 반도체 가공용 테이프
JP2021565581A JPWO2021125152A1 (fr) 2019-12-17 2020-12-15

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-227280 2019-12-17
JP2019227280 2019-12-17

Publications (1)

Publication Number Publication Date
WO2021125152A1 true WO2021125152A1 (fr) 2021-06-24

Family

ID=76477556

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/046636 WO2021125152A1 (fr) 2019-12-17 2020-12-15 Bande de traitement de semi-conducteur

Country Status (5)

Country Link
JP (1) JPWO2021125152A1 (fr)
KR (1) KR102565398B1 (fr)
CN (1) CN114729232B (fr)
TW (1) TW202132502A (fr)
WO (1) WO2021125152A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115044340A (zh) * 2022-06-24 2022-09-13 山东亿博润新材料科技有限公司 一种抗静电型聚氨酯胶水及其制备方法和应用
CN115058218A (zh) * 2022-07-26 2022-09-16 珠海市泽涛粘合制品有限公司 一种丙烯酸酯改性聚氨酯胶黏剂及其制备方法和应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009120820A (ja) * 2007-10-24 2009-06-04 Asahi Glass Co Ltd 電子部品用粘着シート
WO2016175112A1 (fr) * 2015-04-30 2016-11-03 リンテック株式会社 Bande adhésive pour le traitement de tâches
WO2017179439A1 (fr) * 2016-04-15 2017-10-19 デンカ株式会社 Bande adhésive pour le traitement de semi-conducteurs et procédé de fabrication de puce semi-conductrice ou d'élément semi-conducteur l'utilisant
JP2018006540A (ja) * 2016-06-30 2018-01-11 三井化学東セロ株式会社 半導体ウェハ加工用粘着性フィルム
JP2018002787A (ja) * 2016-06-29 2018-01-11 荒川化学工業株式会社 粘着剤組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61207476A (ja) * 1985-03-12 1986-09-13 Hitachi Chem Co Ltd 絞り加工の表面保護フイルム用放射線硬化型粘着剤
JP2621457B2 (ja) * 1989-01-30 1997-06-18 日立化成工業株式会社 放射線硬化型感圧性接着剤組成物
JP4726405B2 (ja) * 2002-07-26 2011-07-20 日東電工株式会社 加工用粘着シートとその製造方法
US7641946B2 (en) * 2005-08-08 2010-01-05 Nitto Denko Corporation Adhesive film and image display device
WO2009113216A1 (fr) * 2008-03-10 2009-09-17 古河電気工業株式会社 Ruban adhésif sensible à la pression pour la fabrication de composants électroniques
JP2009260332A (ja) * 2008-03-26 2009-11-05 Furukawa Electric Co Ltd:The 半導体ウエハ固定用帯電防止性粘着テープ
KR20110007687A (ko) * 2009-07-17 2011-01-25 공주대학교 산학협력단 무용제 자외선 경화형 아크릴 점착제 조성물 및 그 제조방법
JP5607401B2 (ja) * 2010-03-30 2014-10-15 古河電気工業株式会社 帯電防止型半導体加工用粘着テープ
JP5534896B2 (ja) * 2010-03-30 2014-07-02 古河電気工業株式会社 帯電防止性半導体加工用粘着テープ
CN103640353B (zh) * 2013-12-02 2015-12-30 江苏耐斯数码科技股份有限公司 一种医用胶片的防静电层及制备方法
CN103725245B (zh) * 2013-12-20 2015-12-30 广州慧谷工程材料有限公司 一种光学透明胶带用无溶剂uv固化胶水及其制备和应用
JP6703596B2 (ja) * 2016-03-31 2020-06-03 三井化学東セロ株式会社 半導体ウェハ加工用粘着性フィルム
JP7145868B2 (ja) * 2017-10-05 2022-10-03 昭和電工株式会社 粘着剤組成物及び粘着シート

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009120820A (ja) * 2007-10-24 2009-06-04 Asahi Glass Co Ltd 電子部品用粘着シート
WO2016175112A1 (fr) * 2015-04-30 2016-11-03 リンテック株式会社 Bande adhésive pour le traitement de tâches
WO2017179439A1 (fr) * 2016-04-15 2017-10-19 デンカ株式会社 Bande adhésive pour le traitement de semi-conducteurs et procédé de fabrication de puce semi-conductrice ou d'élément semi-conducteur l'utilisant
JP2018002787A (ja) * 2016-06-29 2018-01-11 荒川化学工業株式会社 粘着剤組成物
JP2018006540A (ja) * 2016-06-30 2018-01-11 三井化学東セロ株式会社 半導体ウェハ加工用粘着性フィルム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115044340A (zh) * 2022-06-24 2022-09-13 山东亿博润新材料科技有限公司 一种抗静电型聚氨酯胶水及其制备方法和应用
CN115058218A (zh) * 2022-07-26 2022-09-16 珠海市泽涛粘合制品有限公司 一种丙烯酸酯改性聚氨酯胶黏剂及其制备方法和应用

Also Published As

Publication number Publication date
TW202132502A (zh) 2021-09-01
CN114729232A (zh) 2022-07-08
KR102565398B1 (ko) 2023-08-08
KR20220082872A (ko) 2022-06-17
JPWO2021125152A1 (fr) 2021-06-24
CN114729232B (zh) 2024-10-01

Similar Documents

Publication Publication Date Title
KR101747522B1 (ko) 투명 점착 시트용 광 경화성 조성물 및 투명 점착 시트
KR102565398B1 (ko) 반도체 가공용 테이프
JP2014065207A (ja) 積層体の製造方法及び積層体
CN113861928A (zh) 一种具有抗静电效果的uv减粘胶及其减粘膜的制备方法
JP2021127353A (ja) 光硬化型光学フィルム用粘着剤組成物、光硬化型光学フィルム用粘着剤層、光学部材、および画像表示装置
TW201432036A (zh) 黏著劑組成物、黏著膜及表面保護膜
TWI824017B (zh) 表面保護薄片用黏著劑組成物及表面保護薄片
JP6497914B2 (ja) 粘着剤組成物、粘着剤、粘着シート、表面保護用粘着剤、表面保護用粘着シート
JP7544058B2 (ja) バックグラインドテープ
JP7513029B2 (ja) 粘着シート
TW202007740A (zh) 黏著片及積層體
JP7532982B2 (ja) バックグラインドテープ
WO2022004238A1 (fr) Composition photodurcissable et feuille transparente adhésive
US20220275260A1 (en) Surface protection film
TW202026385A (zh) 表面保護薄片用黏著劑組成物及表面保護薄片
WO2020170827A1 (fr) Adhésif autocollant et feuille adhésive autocollante et procédé d'utilisation de ceux-ci
JP2022069137A (ja) 粘着フィルム、および積層体
US20240287358A1 (en) Adhesive sheet, flexible image display member, and flexible image display device
CN118255929A (zh) 活性能量线聚合性树脂组合物及层叠体

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20900795

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021565581

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20227015871

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20900795

Country of ref document: EP

Kind code of ref document: A1