WO2021120639A1 - 一种带台阶槽的5g小型基站电源功放模块pcb的加工方法 - Google Patents

一种带台阶槽的5g小型基站电源功放模块pcb的加工方法 Download PDF

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WO2021120639A1
WO2021120639A1 PCT/CN2020/106997 CN2020106997W WO2021120639A1 WO 2021120639 A1 WO2021120639 A1 WO 2021120639A1 CN 2020106997 W CN2020106997 W CN 2020106997W WO 2021120639 A1 WO2021120639 A1 WO 2021120639A1
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Prior art keywords
cut
processing
design
power amplifier
amplifier module
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PCT/CN2020/106997
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English (en)
French (fr)
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聂兴培
陈春
吴世亮
林鹭华
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惠州市金百泽电路科技有限公司
深圳市金百泽电子科技股份有限公司
西安金百泽电路科技有限公司
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Publication of WO2021120639A1 publication Critical patent/WO2021120639A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits

Definitions

  • the invention belongs to the technical field of PCB processing, and specifically relates to a method for processing a 5G small base station power amplifier module PCB with a step groove.
  • 5G network signal transmission has the characteristics of high frequency, high speed, and short distance.
  • the number of base stations is large and miniaturization is an inevitable choice.
  • the power supply and power amplifier modules can only be made smaller, it is an inevitable choice to use aluminum-based printed boards with excellent performance and low cost as the heat sink of the power amplifier in terms of heat dissipation.
  • the stamp hole + bridge or V-CUT method is conventionally produced. After patching, there are conventional manual splitting and machine splitting methods. Because the metal materials are relatively hard to form and process, the manual splitting of the stamp hole + bridge will cause the size to be too large, and the automatic splitting machine cannot cut and split the metal, so the size of the metal material PCB is large and adopts It is produced in the form of veneer delivery.
  • the miniaturized 5G base station power amplifier module single aluminum base is small in size, and some are only 20mm*30mm or even smaller. It is delivered with a single board. The customer cannot complete the placement. It requires multiple PCBs to be assembled and then divided after the components are placed. board. It is difficult to implement the conventional gong board method for a metal aluminum-based PCB with a smaller size.
  • 5G power amplifier modules or antenna arrays often use an antenna matrix of 2.35mmx2.35mm patch antennas, which need to form stepped grooves on the metal surface to place components. PCB products without internal positioning holes and stepped grooves are more difficult to achieve.
  • the present invention provides a method for processing a 5G small base station power amplifier module PCB with a step groove.
  • the present invention starts from the process capability of the equipment and the characteristics of the material, and through the design of a hybrid laminated, aluminum-based V-CUT And the processing process of removing burrs to improve the quality, to ensure that the aluminum-based power amplifier module PCB with stepped grooves can be processed in batches, with no burrs in appearance, easy for customers to separate boards, and size and quality to meet design requirements.
  • a method for processing a 5G small base station power amplifier module PCB with a stepped slot is characterized by including the following steps: S1.
  • Process design design the main process, design and shape of the PCB processing of the aluminum-based power amplifier module with a stepped slot
  • the sub-process of the control method of shovel to ensure the processing efficiency and quality of the product.
  • the equipment parameters of the V-CUT machine set the hanging hole according to the hole center distance of 100mm, and calculate the center line passed by the V-CUT knife according to the outer frame data and the degree data provided by the customer and make the data;
  • the step S3 includes: performing V-CUT on all aluminum bases, and retaining a part of FR4 in the hybrid laminate structure as excess thickness; it is convenient for customers to divide the board; for the processing of single-sided aluminum bases, it is necessary to design multiple orders. Face V-CUT plan, and then confirm the final depth of the double-sided V-CUT based on the remaining thickness. It is produced with special knives such as diamonds. When the thickness of the aluminum base exceeds 1mm, the resistance of the V-CUT knife is greater. For every 0.5mm increase in the plate thickness, a reverse V-CUT must be added to remove the burrs in the groove on the same path. -The processing speed of the CUT knife is reduced to about 30% of that of conventional products.
  • the processing method is to rough the gong counterclockwise once, the tolerance is controlled at about +0.05-0.1mm, and then call the data of the fine gong clockwise to remove the burrs in the groove once. Control it within ⁇ 0.5mm.
  • the step S3 also includes: the conventional V-CUT processing speed is between 30-60m/min.
  • the conventional V-CUT processing speed is between 30-60m/min.
  • the step S4 includes that for products that have steps and have been surface-treated, a V-CUT burr cleaning process needs to be designed, and products with a small step depth need to fill the platform steps with blue glue before using the grinding plate
  • the solution is to deal with burrs, and products with deeper steps can be directly processed with abrasive belt sanding plates, and the V-CUT direction is the same as the direction of the sanding plate when grinding the plate.
  • use the 600-800# belt grinder to grind the aluminum base surface on one side, and then use the 800-1000# grinding surface to polish the aluminum base surface.
  • the V-CUT direction and the grinding are required when grinding the plate.
  • the direction of the board can reduce the scratches of the aluminum-based filaments on the aluminum-based surface, and all the washing processes are acid-free.
  • the step S6 includes using a V-CUT residual thickness measuring instrument to measure the residual thickness of the V groove, to ensure that the size meets the design requirements, and to inspect the appearance for quality problems such as burrs and scratches.
  • step S1 a laminate structure design is included, and the laminate structure includes FR4, PP, and aluminum base layers arranged in sequence.
  • step S1 it also includes designing the processing flow based on FR4, PP, and aluminum base.
  • the processing part of the conventional FR4 sheet needs to complete the production and opening and short circuit functional test according to the normal flow.
  • the PP chooses non-flowing PP, after the aluminum base is opened. If there is a patch at the position of the abrasive belt grinding plate and the FR4 connection plug-in, the PP and metal aluminum base surface need to be milled and processed. After the total pressure, the production is carried out according to the process to the V-CUT process.
  • the main innovations of the present invention are:
  • a manufacturing method for PCB processing of small 5G base station power amplifier modules with step grooves using hybrid lamination technology and V-CUT molding technology The new technology has designed the process and method of hybrid lamination, and uses FR4 material as the excess thickness and adopts multiple depth control V-CUT processing technology of different depths to meet the product size and quality requirements.
  • V-CUT cutting on aluminum-based materials will cause a large amount of burrs on the wall and surroundings of the groove to scratch the substrate and the entire product.
  • the invention develops control measures and processes for cutting the aluminum base in stages and removing burrs, which is an effective method to ensure the quality of product processing.
  • the aluminum base adopts V-CUT cutting technology to separate the boards and completely design the excess thickness on the conventional FR4 material. It solves the technical problems that such products cannot be divided into boards and the size of stamp hole + bridge technology is too large. V-CUT cutting can improve production efficiency and reduce processing costs. Meet the needs of enterprises for mass production. It is a high value-added processing project in the 5G and subsequent markets, which can obtain more orders and high processing profits for the company.
  • the PCB of the present invention adopts a hybrid lamination process, and a step groove is designed on the aluminum base surface.
  • the finished product size is small.
  • the PCB processing problem of the small 5G base station power amplifier module with step groove ensures that such products can be produced in batches, quickly and safely.
  • the V-CUT line and the milling slot will be in the same straight line, there will be burrs. Cutting on the aluminum-based material will also produce a large amount of burrs around the V-CUT slot, which will scratch the substrate and the entire product.
  • the present invention needs to develop a method for controlling burrs when cutting aluminum substrates to ensure product quality.
  • V-CUT knife processing technology program can be more efficient than the conventional stamp hole + bridge production mode, and it can also obtain a better product size. It improves the processing capacity of products and reduces processing costs. It is a high value-added processing project in the 5G and subsequent markets, which can obtain more orders and high processing profits for the company.
  • the new process is a technological innovation of the current process, with strong operability, can meet the needs of printed board manufacturers for mass production and safe production, and can become a new profit increase point for enterprises.
  • a method for processing a 5G small base station power amplifier module PCB with a stepped slot is characterized by including the following steps: S1.
  • Process design design the main process, design and shape of the PCB processing of the aluminum-based power amplifier module with a stepped slot
  • the sub-process of the control method of shovel to ensure the processing efficiency and quality of the product.
  • the equipment parameters of the V-CUT machine set the hanging hole according to the hole center distance of 100mm, and calculate the center line passed by the V-CUT knife according to the outer frame data and the degree data provided by the customer and make the data;
  • the step S3 includes: performing V-CUT on all aluminum bases, and retaining a part of FR4 in the hybrid laminate structure as excess thickness; it is convenient for customers to divide the board; for the processing of single-sided aluminum bases, it is necessary to design multiple orders. Face V-CUT plan, and then confirm the final depth of the double-sided V-CUT based on the remaining thickness.
  • the processing method is to rough the gong counterclockwise once, the tolerance is controlled at about +0.05-0.1mm, and then call the data of the fine gong clockwise to remove the burrs in the groove once. Control it within ⁇ 0.5mm.
  • the step S3 also includes: the conventional V-CUT processing speed is between 30-60m/min.
  • the conventional V-CUT processing speed is between 30-60m/min.
  • the step S4 includes that for products that have steps and have been surface-treated, a V-CUT burr cleaning process needs to be designed, and products with a small step depth need to fill the platform steps with blue glue before using the grinding plate.
  • the solution is to deal with burrs, and products with deeper steps can be directly processed with abrasive belt sanding plates, and the V-CUT direction is the same as the direction of the sanding plate when grinding the plate.
  • the step S6 includes using a V-CUT residual thickness measuring instrument to measure the residual thickness of the V groove, to ensure that the size meets the design requirements, and to inspect the appearance for quality problems such as burrs and scratches.
  • step S1 a laminate structure design is included, and the laminate structure includes FR4, PP, and aluminum base layers arranged in sequence.
  • step S1 it also includes designing the processing flow based on FR4, PP, and aluminum base.
  • the processing part of the conventional FR4 sheet needs to complete the production and opening and short circuit functional test according to the normal flow.
  • the PP chooses non-flowing PP, after the aluminum base is opened. If there is a patch at the position of the abrasive belt grinding plate and the FR4 connection plug-in, the PP and metal aluminum base surface need to be milled and processed. After the total pressure, the production is carried out according to the process to the V-CUT process.
  • the present invention also provides specific embodiments for setting processing parameters in the following table.
  • this type of PCB adopts a hybrid lamination process, and a step groove is designed on the aluminum base surface.
  • the finished product is small in size and cannot be patched in single board delivery, and the stamp hole + bridge solution cannot be used in continuous delivery.
  • the present invention It mainly solves the PCB processing problem of small 5G base station power amplifier modules with step grooves, and ensures that such products can be produced in batches, quickly and safely.
  • the V-CUT line and the milling slot will be in the same straight line. There will be burrs. Cutting on the aluminum-based material will also produce a large amount of burrs around the V-CUT slot, which will scratch the substrate and the entire product.
  • the present invention needs to develop a method for controlling burrs when cutting aluminum substrates to ensure product quality.
  • the special V-CUT knife processing technical scheme developed by the present invention can be more efficient than the conventional stamp hole + bridge production mode, and can also obtain better product sizes. It improves the processing capacity of products and reduces processing costs. It is a high value-added processing project in the 5G and subsequent markets, which can obtain more orders and high processing profits for the company.
  • the new process is a technological innovation of the current process, has strong operability, can meet the needs of printed board manufacturers for mass production and safe production, and can become a new profit increase point for enterprises.
  • the new process of the present invention is a technological innovation of the current process, has strong operability, can meet the needs of printed board manufacturers for mass production and safe production, and can become a new profit increase point for enterprises.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

属于PCB加工技术领域，提供一种带台阶槽的5G小型基站电源功放模块PCB的加工方法，包括以下步骤：S1.流程设计；S2.成型V-CUT加工资料设计；S3.V-CUT加工；S4.V-CUT毛剌清理；S5.锣槽设计；S6.尺寸及外观检测。从设备的工艺能力和材料的特性入手，通过设计混合层压、铝基专用的V-CUT及清除毛剌改善质量的加工流程，确保带台阶槽的铝基电源功放模块PCB能批量加工，外观无毛剌、客户易于分板，尺寸及品质满足设计需求。

Description

一种带台阶槽的5G小型基站电源功放模块PCB的加工方法 技术领域
本发明属于PCB加工技术领域，具体涉及一种带台阶槽的5G小型基站电源功放模块PCB的加工方法。
 背景技术
与4G信号相比5G网络信号传输具有高频、高速、短距离的特点，基站数量多微型化是必然的选择。因电源及功放模块只能制作得更小，在散热方式上采用性能优良、成本低的铝基印制板作为功放的散热器件则成为必然的选择。
对于尺寸较小的PCB为了保证贴片需求常规采用邮票孔+桥连或V-CUT的方式生产，贴片后常规有手动分板和机器分板两种方式。因金属材料均比较硬成型加工后采用邮票孔+桥连的方式手动分板会造成尺寸偏大，自动分板机又无法对金属进行切割分板，因此金属材料PCB的尺寸均较大且采用单板交付的方式生产。
 技术问题
小型化的5G基站电源功放模块单支铝基尺寸均很小，有的只有20mm*30mm甚至更小采用单板交付客户无法完成贴片，需要多支PCB合拼待元器件贴片后再分板。对于尺寸较小金属铝基PCB目前按常规锣板的方法很难实现。5G功放模块或天线阵列常采用2.35mmx2.35mm贴片天线的天线矩阵，需要在金属面形成台阶槽放置元件，无内定位孔且有台阶槽的PCB产品制作则更难实现。
 技术解决方案
有鉴于此，本发明提供一种带台阶槽的5G小型基站电源功放模块PCB的加工方法，本发明从设备的工艺能力和材料的特性入手，通过设计混合层压、铝基专用的V-CUT及清除毛剌改善质量的加工流程，确保带台阶槽的铝基电源功放模块PCB能批量加工，外观无毛剌、客户易于分板，尺寸及品质满足设计需求。
本发明的技术方案为：
一种带台阶槽的5G小型基站电源功放模块PCB的加工方法，其特征在于，包括以下步骤：S1.流程设计：设计带台阶槽的铝基电源功放模块PCB加工的主流程、设计成型及毛剌的控制方法的子流程；保证产品的加工效率与质量。
S2.成型V-CUT加工资料设计；
按照V-CUT机的设备参数按孔中心距离100mm设挂孔、按客户提供的外框资料、度数数据计算出V-CUT刀经过的中心线并制作资料；
S3.V-CUT加工；
S4.V-CUT毛剌清理；
S5.锣槽设计：由于铝基材料刚性差，此类产品必须先V-CUT加工再锣槽以保证产品不会断裂；由于V-CUT线与锣槽在同一直线上会产生毛剌，需要设计逆时针粗锣和顺时针精锣程序去除槽内毛剌程序；
S6.尺寸及外观检测。
进一步的，所述步骤S3包括：对所有铝基进行V-CUT，将混合层压结构中FR4的一部分作为余厚保留；便于客户分板；对于单面铝基的加工，需要设计多次单面V-CUT方案，再依据余厚确认最终双面V-CUT的深度。采用钻石等特种刀生产，当铝基厚度超过1mm时V-CUT刀受到的阻力越大，板厚每增加0.5mm在同一路径需要增设1次反向的V-CUT清除槽内毛剌，V-CUT刀的加工速度降低至常规产品的30%左右。
进一步的，所述步骤S3中，加工方式为先逆时针粗锣1次，公差控制在+0.05-0.1mm左右，然后再调用精锣的资料顺时针精锣1次去除槽内毛剌，公差控制在±0.5mm左右。
进一步的，所述步骤S3还包括：V-CUT常规加工速度在30-60m/min之间，生产超厚金属材料产品时，同一位置加工的次数越多，V-CUT刀受到的阻力越大，需要依次降低V-CUT刀的加工速度，速度按常规产品的40-70%设置。
进一步的，所述步骤S4包括对于有台阶位且已做表面处理的产品，需要设计V-CUT毛剌清理流程，台阶深度较小的产品需要先用蓝胶填平台阶位后再采用磨板的方案处理毛剌，台阶较深的产品可以直接用砂带磨板处理毛剌，磨板时V-CUT方向与磨板方向一至。具体为，采用600-800#砂带磨板机单面磨板铝基面，再用800-1000#的磨板面单面对铝基面进行抛光，磨板时要求V-CUT方向与磨板方向一至减少铝基细丝对铝基面的刮伤，所有水洗过程无酸。
进一步的，所述步骤S6包括采用V-CUT残厚测量仪测量V槽的余厚，确保尺寸满足设计要求，检验外观有无毛剌、擦花等品质问题。
进一步的，步骤S1中，包括层压结构设计，所述层压结构包括依次设置的FR4、PP、铝基层。
进一步的，步骤S1中，还包括依据FR4、PP、铝基设计加工流程，常规FR4板材加工部分需要按正常流程完成生产及开短路功能性测试，PP选择不流胶PP，铝基开料后需要砂带磨板与FR4连接插件位置有贴片的需要对PP及金属铝基面铣槽加工，总压后按流程生产至V-CUT工序。
本发明的主要创新点在于：
1、一种采用混合层压工艺及V-CUT成型工艺技术解决带台阶槽的小型5G基站电源功放模块PCB加工的制作方法。新技术设计了混合层压的流程和方法及以FR4材料为余厚采用不同深度的多次控深V-CUT加工技术来满足产品尺寸及品质的要求。
2、在铝基材料上进行V-CUT切割在槽壁及四周产生的大量毛剌会擦花基材及整个产品。本发明开发了分次切割铝基及清除毛剌的控制措施和流程，是保证产品加工质量的有效方法。
    3、含有金属材料的混合层压产品，对铝基采用V-CUT切割技术分板并完全将余厚设计在常规FR4材料上的加工技术。解决了此类产品无法分板及采用邮票孔+桥连技术尺寸偏大的技术难题。V-CUT切割可提升生产效率降低加工成本的制作方法。满足企业批量生产的需求。属于5G及后续市场高附加值加工项目，可为公司获得更多订单及高额加工利润。
 有益效果
1、本发明PCB采用混合层压工艺，在铝基面设计有台阶槽，成品尺寸小采用单板交付无法贴片，连片交付又不能采用邮票孔+桥连的方案，本发明主要解决带台阶槽的小型5G基站电源功放模块PCB加工问题，确保此类产品能批量、快速安全地生产。
2、为确保尺寸合格，V-CUT线与铣槽位在同一直线会有毛剌，在铝基材料上切割也会在V-CUT槽四周产生大量毛剌会擦花基材及整个产品。本发明需要开发切割铝基时毛剌的控制方法，保证产品质量。
3、开发专用的V-CUT刀加工技术方案可以比常规的邮票孔+桥连生产模式更高效，而且还可以获得更优良的产品尺寸。提升了产品的加工能力，降低加工成本，属于5G及后续市场高附加值加工项目，可为公司获得更多订单及高额加工利润。
4、新工艺是对现行工艺的技术创新，可操作性强，能满足印制板生产商批量化生产和安全生产的需要，能成为企业新的利润增涨点。
 本发明的最佳实施方式
为使本发明的目的、技术方案及优点更加清楚明白，以下结合具体实施方式，对本发明进行进一步的详细说明。应当理解的是，此处所描述的具体实施方式仅用以解释本发明，并不限定本发明的保护范围。
一种带台阶槽的5G小型基站电源功放模块PCB的加工方法，其特征在于，包括以下步骤：S1.流程设计：设计带台阶槽的铝基电源功放模块PCB加工的主流程、设计成型及毛剌的控制方法的子流程；保证产品的加工效率与质量。
S2.成型V-CUT加工资料设计；
按照V-CUT机的设备参数按孔中心距离100mm设挂孔、按客户提供的外框资料、度数数据计算出V-CUT刀经过的中心线并制作资料；
S3.V-CUT加工；
S4.V-CUT毛剌清理；
S5.锣槽设计：由于铝基材料刚性差，此类产品必须先V-CUT加工再锣槽以保证产品不会断裂；由于V-CUT线与锣槽在同一直线上会产生毛剌，需要设计逆时针粗锣和顺时针精锣程序去除槽内毛剌程序；
S6.尺寸及外观检测。
进一步的，所述步骤S3包括：对所有铝基进行V-CUT，将混合层压结构中FR4的一部分作为余厚保留；便于客户分板；对于单面铝基的加工，需要设计多次单面V-CUT方案，再依据余厚确认最终双面V-CUT的深度。
进一步的，所述步骤S3中，加工方式为先逆时针粗锣1次，公差控制在+0.05-0.1mm左右，然后再调用精锣的资料顺时针精锣1次去除槽内毛剌，公差控制在±0.5mm左右。
进一步的，所述步骤S3还包括：V-CUT常规加工速度在30-60m/min之间，生产超厚金属材料产品时，同一位置加工的次数越多，V-CUT刀受到的阻力越大，需要依次降低V-CUT刀的加工速度，速度按常规产品的40-70%设置。
进一步的，所述步骤S4包括对于有台阶位且已做表面处理的产品，需要设计V-CUT毛剌清理流程，台阶深度较小的产品需要先用蓝胶填平台阶位后再采用磨板的方案处理毛剌，台阶较深的产品可以直接用砂带磨板处理毛剌，磨板时V-CUT方向与磨板方向一至。
进一步的，所述步骤S6包括采用V-CUT残厚测量仪测量V槽的余厚，确保尺寸满足设计要求，检验外观有无毛剌、擦花等品质问题。
进一步的，步骤S1中，包括层压结构设计，所述层压结构包括依次设置的FR4、PP、铝基层。
进一步的，步骤S1中，还包括依据FR4、PP、铝基设计加工流程，常规FR4板材加工部分需要按正常流程完成生产及开短路功能性测试，PP选择不流胶PP，铝基开料后需要砂带磨板与FR4连接插件位置有贴片的需要对PP及金属铝基面铣槽加工，总压后按流程生产至V-CUT工序。
 本发明的实施方式
本发明还提供了如下表加工参数设置的具体实施例。
Figure dest_path_image001
在实施例中，此类PCB采用混合层压工艺，在铝基面设计有台阶槽，成品尺寸小采用单板交付无法贴片，连片交付又不能采用邮票孔+桥连的方案，本发明主要解决带台阶槽的小型5G基站电源功放模块PCB加工问题，确保此类产品能批量、快速安全地生产。
为确保尺寸合格，V-CUT线与铣槽位在同一直线会有毛剌，在铝基材料上切割也会在V-CUT槽四周产生大量毛剌会擦花基材及整个产品。本发明需要开发切割铝基时毛剌的控制方法，保证产品质量。
本发明开发专用的V-CUT刀加工技术方案可以比常规的邮票孔+桥连生产模式更高效，而且还可以获得更优良的产品尺寸。提升了产品的加工能力，降低加工成本，属于5G及后续市场高附加值加工项目，可为公司获得更多订单及高额加工利润。
本发明中，新工艺是对现行工艺的技术创新，可操作性强，能满足印制板生产商批量化生产和安全生产的需要，能成为企业新的利润增涨点。
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。需注意的是，本发明中所未详细描述的技术特征，均可以通过本领域任一现有技术实现。
 工业实用性
本发明的新工艺是对现行工艺的技术创新，可操作性强，能满足印制板生产商批量化生产和安全生产的需要，能成为企业新的利润增涨点。

Claims (8)

  1. 一种带台阶槽的5G小型基站电源功放模块PCB的加工方法，其特征在于，包括以下步骤：S1.流程设计：设计带台阶槽的铝基电源功放模块PCB加工的主流程、设计成型及毛剌的控制方法的子流程；保证产品的加工效率与质量。
    S2.成型V-CUT加工资料设计；
    按照V-CUT机的设备参数按孔中心距离100mm设挂孔、按客户提供的外框资料、度数数据计算出V-CUT刀经过的中心线并制作资料；
    S3.V-CUT加工；
    S4.V-CUT毛剌清理；
    S5.锣槽设计：由于铝基材料刚性差，此类产品必须先V-CUT加工再锣槽以保证产品不会断裂；由于V-CUT线与锣槽在同一直线上会产生毛剌，需要设计逆时针粗锣和顺时针精锣程序去除槽内毛剌程序；
    S6.尺寸及外观检测。
  2. 根据权利要求1所述的带台阶槽的5G小型基站电源功放模块PCB的加工方法，其特征在于，所述步骤S3包括：对所有铝基进行V-CUT，将混合层压结构中FR4的一部分作为余厚保留；便于客户分板；对于单面铝基的加工，需要设计多次单面V-CUT方案，再依据余厚确认最终双面V-CUT的深度。
  3. 根据权利要求2所述的带台阶槽的5G小型基站电源功放模块PCB的加工方法，其特征在于，所述步骤S3中，加工方式为先逆时针粗锣1次，公差控制在+0.05-0.1mm左右，然后再调用精锣的资料顺时针精锣1次去除槽内毛剌，公差控制在±0.5mm左右。
  4. 根据权利要求2或3所述的带台阶槽的5G小型基站电源功放模块PCB的加工方法，其特征在于，所述步骤S3还包括：V-CUT常规加工速度在30-60m/min之间，生产超厚金属材料产品时，同一位置加工的次数越多，V-CUT刀受到的阻力越大，需要依次降低V-CUT刀的加工速度，速度按常规产品的40-70%设置。
  5. 根据权利要求1所述的带台阶槽的5G小型基站电源功放模块PCB的加工方法，其特征在于，所述步骤S4包括对于有台阶位且已做表面处理的产品，需要设计V-CUT毛剌清理流程，台阶深度较小的产品需要先用蓝胶填平台阶位后再采用磨板的方案处理毛剌，台阶较深的产品可以直接用砂带磨板处理毛剌，磨板时V-CUT方向与磨板方向一至。
  6. 根据权利要求1所述的带台阶槽的5G小型基站电源功放模块PCB的加工方法，其特征在于，所述步骤S6包括采用V-CUT残厚测量仪测量V槽的余厚，确保尺寸满足设计要求，检验外观有无毛剌、擦花等品质问题。
  7. 根据权利要求1所述的带台阶槽的5G小型基站电源功放模块PCB的加工方法，其特征在于，步骤S1中，包括层压结构设计，所述层压结构包括依次设置的FR4、PP、铝基层。
  8. 根据权利要求7所述的带台阶槽的5G小型基站电源功放模块PCB的加工方法，其特征在于，步骤S1中，还包括依据FR4、PP、铝基设计加工流程，常规FR4板材加工部分需要按正常流程完成生产及开短路功能性测试，PP选择不流胶PP，铝基开料后需要砂带磨板与FR4连接插件位置有贴片的需要对PP及金属铝基面铣槽加工，总压后按流程生产至V-CUT工序。
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