WO2021120640A1 - 一种带卡齿的5g信号屏蔽pcb模块的制作方法 - Google Patents
一种带卡齿的5g信号屏蔽pcb模块的制作方法 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Definitions
- the invention belongs to the technical field of PCB processing, and in particular relates to a method for manufacturing a 5G signal shielding PCB module with clamping teeth.
- the priority layout is the network base station, and the core product related to the PCB is the processing of MIMO array antenna products, and the number of units has independent transceiver capabilities.
- the PCB product In order to prevent the signals from interlocking, it is necessary to make a PCB product between each unit to connect with the main PCB to isolate the signal.
- This type of product requires the PCB material to be rigid and flexible, and the entire board has no positioning holes and is surrounded by The dimensional accuracy of the clamping teeth is ⁇ 0.05mm, ultra-long (length-to-width ratio>20:1), ultra-thin (plate thickness ⁇ 0.5mm) and other characteristics.
- the main factors affecting product forming accuracy are: material hardness, plate thickness, finished product aspect ratio, gong groove width, etc.
- the hardness of the material is mainly determined by the performance of the plate, and the finished product aspect ratio, plate thickness, and no internal positioning
- the design directly affects the processing accuracy of PCB processing.
- the present invention provides a method for manufacturing a 5G signal shielding PCB module with clamping teeth.
- the present invention guarantees the effect of 5G signal shielding, while controlling the size of the clamping teeth within ⁇ 0.05mm, ensuring the clamping teeth and the clamping slot The height is consistent with the welding without any gaps, which satisfies the shielding effect of 100% of the signal.
- a method for manufacturing a 5G signal shielding PCB module with clamping teeth includes the following steps:
- Forming processing sub-process When half-hole milling and metallization milling, the expansion and contraction of the drilling file should be used to ensure the shape and accuracy of the slot; the exclusive production process of the forming process is designed to ensure ultra-long, ultra-thin, There is no necessary condition for the final processing accuracy of the internal positioning product to be qualified;
- Tooth size processing The diameter of the half hole at the roots of both sides of the tooth is 0.1-1mm.
- Forming size processing According to the characteristics of long strip ultra-thin products without internal positioning, design a segmented processing plan;
- the main process includes: cutting, inner layer wiring, lamination, drilling, metallization milling groove, sinking copper, outer layer wiring, drawing electric tin, second drilling, half hole milling groove, alkaline etching, AOI inspection, solder mask printing, characters, sandblasting, surface treatment, testing, molding, finished product inspection, packaging.
- the forming size processing process includes: two drills processing the card tooth hole, the first shape gong design, the first shape, the first piece inspection, mass production, washing, filming, the second shape, the first piece Inspection, mass production, tearing film, finished product cleaning, and shipping.
- the first shape is processed for areas on both sides of the PCB module.
- the second shape is processed for the two end areas and the middle area of the PCB module.
- the inner grooves at 1/3 of the two ends of the PCB module are processed.
- the gong knife can accurately rough and finish milling, ensuring that the size here fully meets the design requirements.
- the product aspect ratio is less than 30:1, 4 equal gongs can be designed in this way.
- equal parts of gongs are designed according to the aspect ratio of the product.
- the process of designing split gongs according to the aspect ratio of the product provided by the present invention solves the design method and process of high-precision molding processing under the condition of ultra-long, ultra-thin and no positioning in the board, which is to ensure that the 5G signal shielding PCB module prints PCB products After processing, the quality of the product is qualified, and the height of the clamping teeth and the clamping slot are the same. After welding, there is no gap to meet the necessary conditions for 100% shielding of the signal.
- the accuracy of the size of the teeth is less than or equal to 0.05 mm.
- the main innovations of the present invention are:
- the technical scheme of the present invention also designs pinhole backlight detection and AOI processing schemes to ensure the effect of 5G signal shielding.
- the size of the teeth is controlled within ⁇ 0.05mm to ensure that the heights of the teeth and the slots are consistent after welding. There is no gap, and it can shield the signal 100%.
- Figure 1 is a processing flow chart of the main process of the present invention
- Figure 2 is a sub-flow chart of the forming process of the present invention.
- Figure 3 is a flow chart of the forming dimension processing of the present invention.
- a method for manufacturing a 5G signal shielding PCB module with clamping teeth includes the following steps:
- Forming processing sub-process When half-hole milling and metallization milling, the expansion and contraction of the drilling file should be used to ensure the shape and accuracy of the slot; the exclusive production process of the forming process is designed to ensure ultra-long, ultra-thin, There is no necessary condition for the final processing accuracy of the internal positioning product to be qualified;
- Tooth size processing The diameter of the half hole at the roots of both sides of the tooth is 0.1-1mm.
- Forming size processing According to the characteristics of long strip ultra-thin products without internal positioning, design a segmented processing plan;
- the main process includes: cutting, inner layer wiring, lamination, drilling, metallization milling groove, sinking copper, outer layer wiring, drawing electric tin, second drilling, half hole milling groove, alkaline etching, AOI inspection, solder mask printing, characters, sandblasting, surface treatment, testing, molding, finished product inspection, packaging.
- the forming size processing process includes: two drills processing the card tooth hole, the first shape gong design, the first shape, the first piece inspection, mass production, washing, filming, the second shape, the first piece Inspection, mass production, tearing film, finished product cleaning, and shipping.
- the first shape is processed for areas on both sides of the PCB module.
- the second shape is processed for the two end areas and the middle area of the PCB module.
- the inner grooves at 1/3 of the two ends of the PCB module are processed.
- the gong knife can accurately rough and finish milling, ensuring that the size here fully meets the design requirements.
- the product aspect ratio is less than 30:1, 4 equal gongs can be designed in this way.
- equal parts of gongs are designed according to the aspect ratio of the product.
- the process of designing split gongs according to the aspect ratio of the product provided by the present invention solves the design method and process of high-precision molding processing under the condition of ultra-long, ultra-thin and no positioning in the board, which is to ensure that the 5G signal shielding PCB module prints PCB products After processing, the quality of the product is qualified, and the height of the clamping teeth and the clamping slot are the same. After welding, there is no gap to meet the necessary conditions for 100% shielding of the signal.
- the accuracy of the size of the teeth is less than or equal to 0.05 mm.
- the present invention also provides specific embodiments for setting processing parameters in the following table.
- the invention develops and designs a technical scheme for quickly and automatically processing ultra-long, ultra-thin 5G signal shielding PCB printed boards with no internal positioning using a numerical control molding machine as a tool, and improves production efficiency to meet the needs of large-scale production of enterprises.
- the film production solves the quality problems of the forming size accuracy of the long strip without internal positioning, the gong plate roughness and other quality problems.
- the shape and the size accuracy of the teeth are ⁇ 0.05mm, which can meet the installation and welding requirements of the card slot.
- the invention can ensure that one-time processing eliminates rework and scrapping and reduces costs. This type of product has high added value.
- the use of new technologies to realize independent production can reduce production costs and obtain high processing profits for the company.
- the new process of the invention reduces the difficulty of product production from a technical level, has strong operability, can meet the needs of printed board manufacturers for mass production and safe production, and can become a profit increase point for enterprise lean production and efficiency improvement.
- the invention saves time, labor and other processing costs for the enterprise, and the quality is qualified. Under the premise that technology is not controlled by others, companies must also use high-tech, sophisticated and cutting-edge technology as the latest profit increase point to obtain more orders for 5G products and higher profit returns.
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Automatic Assembly (AREA)
Abstract
一种带卡齿的5G信号屏蔽PCB模块的制作方法，包括以下步骤：S1.主流程；S2.成型加工子流程；S3.卡齿尺寸加工；S4.成型尺寸加工；S5.尺寸及外观质量检测。保证5G信号屏蔽的效果，同时将卡齿的尺寸控制在±0.05mm以内，确保了卡齿与卡槽的高度吻合焊接后无任何空隙，满足对信号100％的屏蔽作用。
Description
本发明属于PCB加工技术领域，具体涉及一种带卡齿的5G信号屏蔽PCB模块的制作方法。
在5G网络中优先布局的是网络基站，与PCB相关的核心产品是MIMO阵列天线产品的加工，数量且单元具备独立收发能力。为了防止信号相互间串挠，在每个单元之间需要制作PCB产品与主PCB相连接来对信号进行隔离，此类产品要求PCB材料具有刚性及柔忍性，整板无定位孔，且四周的卡齿尺寸精度≤0.05mm，超长（长宽比＞20：1）、超薄（板厚＜0.5mm）等特点。而要实现此指标要求，目前按常规方法很难实现。
现有技术中成型时采用外定位或内定位，常规产品成型精度控制为≤0.1mm，因成品尺寸超长（长宽比＞20：1）、板厚超薄（板厚＜0.5mm）在锣板时水平方向受力较小，锣刀移动时板子会弯曲变形导致尺寸偏移。因无内定位，成型后尺寸变小的产品只能报废，尺寸偏大的产品无法再返锣处理，成本高昂，因此需开发一种PCB的加工方法，确保一次性锣板尺寸满足客户要求，杜绝报废降低制作成本。
影响产品成型精度的主要因素有：材料硬度、板厚、成品长宽尺寸比、锣槽宽度等，其中材料的硬度主要由板材性能决定，而成品长宽尺寸比、板厚、及无内定位设计则直接影响到PCB加工的加工精度。为实现成品公差≤0.05mm的要求，目前常规工艺很难满足，尤其量产质量难以保证。因此，如何稳定高效地确保加工尺寸合格并实现批量生产，成为PCB业界有待解决的技术难题。
有鉴于此，本发明提供种带卡齿的5G信号屏蔽PCB模块的制作方法，本发明保证5G信号屏蔽的效果，同时将卡齿的尺寸控制在±0.05mm以内，确保了卡齿与卡槽的高度吻合焊接后无任何空隙，满足对信号100%的屏蔽作用。
本申请的技术方案为：
一种带卡齿的5G信号屏蔽PCB模块的制作方法，包括以下步骤：
S1. 主流程：主流程中外层蚀刻后对线路进行AOI检查时，除了常规检验外增加对铜皮铜粒、针孔的检查，确保产品无针孔及空洞，使得产品有良好的信号屏蔽功能；
S2. 成型加工子流程：半边孔铣槽、金属化铣槽时要依据钻孔文件的涨缩处理，确保槽位形状及精度；成型工序设计专有的生产流程是确保超长、超薄、无内定位产品最终加工精度合格的必要条件；
S3. 卡齿尺寸加工：卡齿两侧根部半孔的直径为0.1-1mm，用二次元测试产品涨缩并依据涨缩资料修改钻带资料；按二钻流程选择钻机调出二钻的钻带，采用0.1-1mm的钻咀生产；
S4.成型尺寸加工：依据长条形超薄无内定位产品的特点，设计分段加工方案；
S5. 尺寸及外观质量检测。
进一步的，所述主流程包括：开料、内层线路、层压、钻孔、金属化铣槽、沉铜、外层线路、图电锡、二钻、半边孔铣槽、碱性蚀刻、AOI检查、阻焊印刷、字符、喷砂、表面处理、测试、成型、成品检验、包装。
进一步的，所述成型尺寸加工流程包括：二钻加工卡齿孔、第1次外形锣带设计、第1次外形、首件检测、批量生产、洗板、贴膜、第2次外形、首件检测、批量生产、撕膜、成品清洗、出货。
进一步的，所述第1次外形针对PCB模块两侧区域进行加工。
进一步的，所述第2次外形针对PCB模块两端区域以及中间区域进行加工。
进一步的，所述第1次外形，加工PCB模块两端1/3位置的内槽，此时有第2次外形未锣掉的中间及两端的部件支撑，可以确保第1次外形生产时产品不变形，锣刀能够精准地粗铣和精铣，确保此处尺寸完全满足设计要求。以此类推，当产品长宽比小于30：1时，可以按此方式设计4等份的锣带。以此类推依据产品长宽比设计锣带的等份。
本发明提供的按产品长宽比设计分锣的流程解决超长超薄且板内无任何定位的条件下进行高精度成型加工的设计方法及流程，是保证5G信号屏蔽PCB模块印制PCB产品加工后产品质量合格，卡齿与卡槽的高度吻合焊接后无任何空隙满足对信号100%的屏蔽作用的必要条件。
进一步的，当产品长宽比小于10：1时，设计两次锣外形的加工方案。
进一步的，所述卡齿尺寸加工中，确保卡齿尺寸精度≤0.05mm。
进一步的，所述尺寸及外观质量检测中，需满足外形尺寸合格、卡齿尺寸合格满足设计要求，整板无针孔满足5G产品外观需求。
本发明的主要创新点在于：
1、本发明依据产品超长超薄成型加工不受力易变形的技术特点，设计按产品长宽比设计分锣的流程，解决了超长超薄且板内无任何定位的条件下进行高精度成型加工的技术难题，此方法也适用于其它同类产品的加工，满足了批量生产的需要。
2、本发明技术方案还设计了针孔背光检测及AOI加工方案，保证5G信号屏蔽的效果，同时将卡齿的尺寸控制在±0.05mm以内，确保了卡齿与卡槽的高度吻合焊接后无任何空隙，满足对信号100%的屏蔽作用。
1、开发设计专有的检验、锣板、二钻流程解决无内定位长条板成型尺寸精度、锣板毛剌等品质问题，从技术上满足产品的加工需求，提升生产效率满足企业大规模生产的需要。
2、减少报废降低成本：一次加工杜绝返工报废不仅可以降低成本，还可以提升交付周期满足客户快速交付的需要。此类产品附加值高，采用新技术实现自主生产可降低生产成本，为公司获得高额加工利润。
3、5G信号屏蔽PCB模块的制作工艺的开发，为企业节省了时间、人工等加工成本，品质合格。在技术不受制于人的前提下，企业也一定以此高、精、尖技术作为最新的利润增涨点，获得更多的5G产品的订单，更高的利润回报。
图1为本发明主流程的加工流程图；
图2为本发明成型加工子流程图；
图3为本发明成型尺寸加工流程图。
为使本发明的目的、技术方案及优点更加清楚明白，以下结合具体实施方式，对本发明进行进一步的详细说明。应当理解的是，此处所描述的具体实施方式仅用以解释本发明，并不限定本发明的保护范围。
一种带卡齿的5G信号屏蔽PCB模块的制作方法，包括以下步骤：
S1. 主流程：主流程中外层蚀刻后对线路进行AOI检查时，除了常规检验外增加对铜皮铜粒、针孔的检查，确保产品无针孔及空洞，使得产品有良好的信号屏蔽功能；
S2. 成型加工子流程：半边孔铣槽、金属化铣槽时要依据钻孔文件的涨缩处理，确保槽位形状及精度；成型工序设计专有的生产流程是确保超长、超薄、无内定位产品最终加工精度合格的必要条件；
S3. 卡齿尺寸加工：卡齿两侧根部半孔的直径为0.1-1mm，用二次元测试产品涨缩并依据涨缩资料修改钻带资料；按二钻流程选择钻机调出二钻的钻带，采用0.1-1mm的钻咀生产；
S4.成型尺寸加工：依据长条形超薄无内定位产品的特点，设计分段加工方案；
S5. 尺寸及外观质量检测。
进一步的，所述主流程包括：开料、内层线路、层压、钻孔、金属化铣槽、沉铜、外层线路、图电锡、二钻、半边孔铣槽、碱性蚀刻、AOI检查、阻焊印刷、字符、喷砂、表面处理、测试、成型、成品检验、包装。
进一步的，所述成型尺寸加工流程包括：二钻加工卡齿孔、第1次外形锣带设计、第1次外形、首件检测、批量生产、洗板、贴膜、第2次外形、首件检测、批量生产、撕膜、成品清洗、出货。
进一步的，所述第1次外形针对PCB模块两侧区域进行加工。
进一步的，所述第2次外形针对PCB模块两端区域以及中间区域进行加工。
进一步的，所述第1次外形，加工PCB模块两端1/3位置的内槽，此时有第2次外形未锣掉的中间及两端的部件支撑，可以确保第1次外形生产时产品不变形，锣刀能够精准地粗铣和精铣，确保此处尺寸完全满足设计要求。以此类推，当产品长宽比小于30：1时，可以按此方式设计4等份的锣带。以此类推依据产品长宽比设计锣带的等份。
本发明提供的按产品长宽比设计分锣的流程解决超长超薄且板内无任何定位的条件下进行高精度成型加工的设计方法及流程，是保证5G信号屏蔽PCB模块印制PCB产品加工后产品质量合格，卡齿与卡槽的高度吻合焊接后无任何空隙满足对信号100%的屏蔽作用的必要条件。
进一步的，当产品长宽比小于10：1时，设计两次锣外形的加工方案。
进一步的，所述卡齿尺寸加工中，确保卡齿尺寸精度≤0.05mm。
进一步的，所述尺寸及外观质量检测中，需满足外形尺寸合格、卡齿尺寸合格满足设计要求，整板无针孔满足5G产品外观需求。
本发明还提供了如下表加工参数设置的具体实施例。
本发明开发设计以数控成型机为工具快速自动化加工超长超薄且无内定位的5G信号屏蔽PCB印制板的技术方案，提升生产效率满足企业大规模生产的需要。通过设计二次锣板流程，贴膜生产解决无内定位长条板成型尺寸精度、锣板毛剌等品质问题，外形及卡齿尺寸精度≤0.05mm，满足卡槽的安装及焊接需求。
本发明可保证一次加工杜绝返工报废降低成本，此类产品附加值高，采用新技术实现自主生产可降低生产成本，为公司获得高额加工利润。本发明新工艺从技术层面上降低了产品的生产难度，可操作性强，能满足印制板生产商批量化生产和安全生产的需要，能成为企业精益生产，效率提升的利润增涨点。
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。需注意的是，本发明中所未详细描述的技术特征，均可以通过本领域任一现有技术实现。
本发明为企业节省了时间、人工等加工成本，品质合格。在技术不受制于人的前提下，企业也一定以此高、精、尖技术作为最新的利润增涨点，获得更多的5G产品的订单，更高的利润回报。
Claims (9)
- 一种带卡齿的5G信号屏蔽PCB模块的制作方法，其特征在于，包括以下步骤：S1. 主流程：主流程中外层蚀刻后对线路进行AOI检查时，除了常规检验外增加对铜皮铜粒、针孔的检查，确保产品无针孔及空洞；产品有良好的信号屏蔽功能；S2. 成型加工子流程：半边孔铣槽、金属化铣槽时要依据钻孔文件的涨缩处理，确保槽位形状及精度；成型工序设计专有的生产流程是确保超长、超薄、无内定位产品最终加工精度合格的必要条件；S3. 卡齿尺寸加工：卡齿两侧根部半孔的直径为0.1-1mm，用二次元测试产品涨缩并依据涨缩资料修改钻带资料；按二钻流程选择钻机调出二钻的钻带，采用0.1-1mm的钻咀生产；S4.成型尺寸加工：依据长条形超薄无内定位产品的特点，设计分段加工方案；S5. 尺寸及外观质量检测。
- 根据权利要求1所述的带卡齿的5G信号屏蔽PCB模块的制作方法，其特征在于，所述主流程包括：开料、内层线路、层压、钻孔、金属化铣槽、沉铜、外层线路、图电锡、二钻、半边孔铣槽、碱性蚀刻、AOI检查、阻焊印刷、字符、喷砂、表面处理、测试、成型、成品检验、包装。
- 根据权利要求1所述的带卡齿的5G信号屏蔽PCB模块的制作方法，其特征在于，所述成型尺寸加工流程包括：二钻加工卡齿孔、第1次外形锣带设计、第1次外形、首件检测、批量生产、洗板、贴膜、第2次外形、首件检测、批量生产、撕膜、成品清洗、出货。
- 根据权利要求3所述的带卡齿的5G信号屏蔽PCB模块的制作方法，其特征在于，所述第1次外形针对PCB模块两侧区域进行加工。
- 根据权利要求4所述的带卡齿的5G信号屏蔽PCB模块的制作方法，其特征在于，所述第2次外形针对PCB模块两端区域以及中间区域进行加工。
- 根据权利要求5所述的带卡齿的5G信号屏蔽PCB模块的制作方法，其特征在于，所述第1次外形，加工PCB模块两端1/3位置的内槽，此时有第2次外形未锣掉的中间及两端的部件支撑。
- 根据权利要求3所述的带卡齿的5G信号屏蔽PCB模块的制作方法，其特征在于，当产品长宽比小于10：1时，设计两次锣外形的加工方案。
- 根据权利要求1所述的带卡齿的5G信号屏蔽PCB模块的制作方法，其特征在于，所述卡齿尺寸加工中，确保卡齿尺寸精度≤0.05mm。
- 根据权利要求1所述的带卡齿的5G信号屏蔽PCB模块的制作方法，其特征在于，所述尺寸及外观质量检测中，需满足外形尺寸合格、卡齿尺寸合格满足设计要求，整板无针孔满足5G产品外观需求。
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