WO2021092975A1 - 显示面板及其制造方法 - Google Patents
显示面板及其制造方法 Download PDFInfo
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- WO2021092975A1 WO2021092975A1 PCT/CN2019/119325 CN2019119325W WO2021092975A1 WO 2021092975 A1 WO2021092975 A1 WO 2021092975A1 CN 2019119325 W CN2019119325 W CN 2019119325W WO 2021092975 A1 WO2021092975 A1 WO 2021092975A1
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- WO
- WIPO (PCT)
- Prior art keywords
- layer
- display panel
- retaining wall
- substrate
- manufacturing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 239000010410 layer Substances 0.000 claims abstract description 147
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 239000012044 organic layer Substances 0.000 claims abstract description 41
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims description 31
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 26
- 229910052731 fluorine Inorganic materials 0.000 claims description 26
- 239000011737 fluorine Substances 0.000 claims description 26
- -1 alkyl vinyl glycols Chemical class 0.000 claims description 21
- 230000004888 barrier function Effects 0.000 claims description 13
- 229920002554 vinyl polymer Polymers 0.000 claims description 12
- 239000011368 organic material Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- 150000001266 acyl halides Chemical class 0.000 claims description 7
- 238000005229 chemical vapour deposition Methods 0.000 claims description 6
- 238000007348 radical reaction Methods 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 239000010408 film Substances 0.000 description 17
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 6
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000000292 calcium oxide Substances 0.000 description 4
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 4
- 239000000395 magnesium oxide Substances 0.000 description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910017109 AlON Inorganic materials 0.000 description 2
- 229910003320 CeOx Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 229910010421 TiNx Inorganic materials 0.000 description 2
- 229910008328 ZrNx Inorganic materials 0.000 description 2
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Chemical compound O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 229910001930 tungsten oxide Inorganic materials 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- ZVWKZXLXHLZXLS-UHFFFAOYSA-N zirconium nitride Chemical compound [Zr]#N ZVWKZXLXHLZXLS-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003709 fluoroalkyl group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- This application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof.
- Organic light-emitting diodes are more sensitive to water and oxygen.
- OLED packaging method is thin-film packaging, that is, organic film layers and inorganic film layers are alternately stacked to block water and oxygen.
- the inorganic film layer has better compactness and can be mainly used to block water and oxygen, while the organic film layer can mainly be used to relieve the internal stress of the inorganic film layer, and at the same time make the encapsulation film layer have a certain degree of flexibility.
- the organic film layer is usually formed by liquid leveling, and the film forming edge is not easy to control.
- the edge overflows too much and the inorganic film layer cannot be covered, water and oxygen can penetrate along the edge of the organic film layer and cause the package to fail.
- the organic film layer is usually formed by liquid leveling, and the film forming edge is not easy to control.
- the edge overflows too much and the inorganic film layer cannot be covered, water and oxygen can penetrate along the edge of the organic film layer and cause the package to fail.
- the embodiments of the present application provide a display panel and a manufacturing method thereof, which can effectively suppress the edge overflow phenomenon of the organic film layer.
- an embodiment of the present application provides a display panel, including:
- a substrate layer, the substrate layer includes a display area and a non-display area
- a first retaining wall is arranged in the non-display area of the substrate layer and is arranged around the display area, and the surface of the first retaining wall has a hydrophobic layer;
- a first inorganic layer covering the substrate layer and exposing the first retaining wall
- the organic layer is disposed on the first inorganic layer and located in the display area.
- the material of the first retaining wall is an organic material.
- the material of the hydrophobic layer includes fluorine-containing alkyl vinyl glycol, fluorine-containing alkyl vinyl glycol, fluorine-containing acyl halide or fluoroalkyl methacrylate.
- fluorine-containing alkyl vinyl glycol fluorine-containing alkyl vinyl glycol
- fluorine-containing acyl halide fluoroalkyl methacrylate.
- the hydrophobic layer is formed by a radical reaction between the first barrier wall and fluorine gas.
- the hydrophobic layer is formed by chemical vapor deposition.
- the first retaining wall is flush with the organic layer.
- the display panel further includes:
- a second retaining wall is located between the substrate layer and the first inorganic layer, and the second retaining wall is arranged around the first retaining wall.
- the material of the second retaining wall is an organic material.
- the display panel further includes:
- the second inorganic layer covers the first inorganic layer, the first retaining wall and the organic layer.
- the substrate layer includes a substrate, a flexible substrate and an organic light emitting structure sequentially disposed on the substrate.
- an embodiment of the present application provides a method for manufacturing a display panel, including:
- the backing layer including a display area and a non-display area
- An organic layer is formed on the first inorganic layer, and the organic layer is located in the display area.
- the material of the first retaining wall is an organic material.
- the material of the hydrophobic layer includes fluorine-containing alkyl vinyl glycols, fluorine-containing alkyl vinyl glycols, fluorine-containing acyl halides or methacrylic acid.
- fluorine-containing alkyl vinyl glycols fluorine-containing alkyl vinyl glycols
- fluorine-containing acyl halides fluorine-containing acyl halides or methacrylic acid.
- fluoroalkyl esters One of fluoroalkyl esters.
- the hydrophobic layer is formed by a radical reaction between the first barrier wall and fluorine gas.
- the hydrophobic layer is formed by chemical vapor deposition.
- the first retaining wall is flush with the organic layer.
- the display panel further includes:
- a second retaining wall is located between the substrate layer and the first inorganic layer, and the second retaining wall is arranged around the first retaining wall.
- the material of the second retaining wall is an organic material.
- the display panel further includes:
- the second inorganic layer covers the first inorganic layer, the first retaining wall and the organic layer.
- the substrate layer includes a substrate, a flexible substrate and an organic light emitting structure sequentially disposed on the substrate.
- the display panel provided by the embodiment of the application includes a substrate layer, a first barrier wall, a first inorganic layer, and an organic layer;
- the substrate layer includes a display area and a non-display area;
- the first barrier wall is disposed on the substrate layer
- the non-display area is arranged around the display area, the surface of the first retaining wall has a hydrophobic layer;
- the first inorganic layer covers the substrate layer and exposes the first retaining wall;
- the organic layer is arranged On the first inorganic layer and located in the display area.
- FIG. 1 is a schematic diagram of the structure of a display panel in the prior art.
- FIG. 2 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
- FIG. 3 is a schematic flowchart of a method for manufacturing a display panel provided by an embodiment of the present application.
- a retaining wall structure 20 is commonly arranged on the periphery of the display area 11.
- the first inorganic layer 30 on the retaining wall 20 is used to prevent the organic layer 40 from overflowing.
- a good leveling effect in the display area 11 is often beneficial to the expansion of the organic layer 40. Therefore, in the prior art, the arrangement of the retaining wall 20 still cannot well suppress the edge overflow of the organic layer 40.
- the embodiments of the present application provide a display panel and a manufacturing method thereof, which will be described in detail below.
- FIG. 2 is a schematic structural diagram of a display panel provided by an embodiment of the present application.
- the display panel 100 may include a substrate layer 10, a first barrier wall 20, a first inorganic layer 30 and an organic layer 40.
- the substrate layer 10 may include a display area 11 and a non-display area 12.
- the substrate layer 10 may include a substrate 101 and a flexible substrate 102 and an organic light-emitting structure 103 stacked on the substrate 101 in sequence.
- the substrate 101 is an array substrate for driving the light emitting structure 103 to emit light.
- the substrate 101 may be transparent, translucent or opaque.
- the flexible substrate 102 may be made of a flexible material, such as polyimide (PI).
- PI polyimide
- the flexible substrate 102 can increase the bending resistance of the display panel 100.
- the light emitting structure 103 can realize the screen display of the display panel 100. It can be understood that the light emitting structure 103 is located in the display area 11.
- the first retaining wall 20 is disposed in the non-display area 12 of the substrate layer 10. In addition, the first retaining wall 20 is arranged around the display area 11 of the substrate layer 10. It should be noted that there is a hydrophobic layer 201 on the surface of the first retaining wall 20.
- the material of the first retaining wall 20 may be an organic material. At this time, the first retaining wall 20 may be fluorinated.
- fluorine gas may be introduced to cause the first retaining wall 20 to undergo a radical reaction with the fluorine gas to form a hydrophobic layer 201 of fluorine ion-containing material on the surface of the first retaining wall 20.
- hydrophobic materials such as fluoroalkyl vinyl glycols, fluorine-containing alkyl vinyl glycols, fluorine-containing acyl halides, or fluoroalkyl methacrylates.
- the hydrophobic layer 201 may be formed by forming a fluorine ion-containing material layer by chemical vapor deposition after forming the first retaining wall 20, and then etching the fluorine ion-containing material layer.
- the first inorganic layer 30 covers the base layer 10. In addition, the first inorganic layer 30 exposes the first retaining wall 20. It can be understood that the first inorganic layer 30 covers the light emitting structure 103. The first inorganic layer 30 can protect the light-emitting structure 103 to prevent the light-emitting structure 103 from being affected by external moisture or oxygen.
- the material of the first inorganic layer 30 may be made of materials with good hydrophobicity, such as aluminum oxide Al2O3, aluminum nitride AlN, aluminum oxynitride AlON, silicon carbon nitride SiCN, magnesium oxide MgO, calcium oxide CaO, tungsten oxide WOx , Titanium dioxide TiO2, titanium nitride TiNx, titanium nitride ZrO2, zirconium nitride ZrNx, zinc oxide ZnO, tantalum pentoxide Ta2O5, hafnium dioxide HfO2, hafnium nitride HfNx, indium trioxide In2O3, cerium oxide CeOx or two Zirconia ZrO2 and so on.
- the organic layer 40 is disposed on the first inorganic layer 30.
- the organic layer 40 is located in the display area 11 of the substrate layer 10. It can be understood that the organic layer 40 is flush with the first retaining wall 20.
- the organic layer 40 can mainly serve as a buffer, and is used to reduce the stress between the first inorganic layer 30 and the second inorganic layer 60.
- the first inorganic layer 30 is often beneficial to the expansion of the organic layer 40. Therefore, the first inorganic layer 30 exposing the first barrier wall 20 may be formed on the substrate layer 10. At this time, the first retaining wall 20 with the hydrophobic layer 201 can directly contact the organic layer 40.
- the organic layer 40 has certain fluidity.
- the first barrier wall 20 with the hydrophobic layer 201 can confine the organic layer 40 in the display area 11 surrounded by the barrier wall 20 to prevent the organic layer 40 from spreading and increasing the non-display area.
- the first retaining wall 20 can better prevent water vapor and oxygen from entering the inside of the display panel 100 and prevent the display panel 100 from being corroded by water vapor or oxygen.
- the display panel 100 may further include a second retaining wall 50.
- the second retaining wall 50 may be arranged between the substrate layer 10 and the first inorganic layer 30 and arranged around the first retaining wall 20.
- the second retaining wall 50 can be used to support a mask used for making the inorganic layer 41. Moreover, if the organic layer 40 overflows the display area 11 surrounded by the first barrier wall 20 during the process, the second barrier wall 50 can also serve as a further barrier to prevent the organic layer 40 from being extended, which is beneficial to the display panel 100. Narrow border.
- the material of the second retaining wall 50 may be an organic material.
- the silicone material has a small elastic modulus and good bending performance, and the display panel 100 is not prone to cracks when it is bent, which can improve the bending resistance of the display panel 100.
- the organic silicon material contains silicon and oxygen, and has good adhesion to the inorganic film layer. When the display panel 100 is bent, the separation of the inorganic film layer from the second retaining wall 50 is avoided, and the lateral direction of the display panel 100 is further enhanced. Water resistance and bending resistance.
- the display panel 100 may further include a second inorganic layer 60.
- the second inorganic layer 60 covers the first inorganic layer 30, the first retaining wall 20 and the organic layer 40.
- the second inorganic layer 60 can better prevent water vapor and oxygen from entering the inside of the display panel 100 and prevent the display panel 100 from being corroded by water vapor or oxygen.
- the material of the second inorganic layer 60 can be made of materials with good hydrophobicity, such as aluminum oxide Al2O3, aluminum nitride AlN, aluminum oxynitride AlON, silicon carbon nitride SiCN, magnesium oxide MgO, calcium oxide CaO, tungsten oxide WOx , Titanium dioxide TiO2, titanium nitride TiNx, titanium nitride ZrO2, zirconium nitride ZrNx, zinc oxide ZnO, tantalum pentoxide Ta2O5, hafnium dioxide HfO2, hafnium nitride HfNx, indium trioxide In2O3, cerium oxide CeOx or two Zirconia ZrO2 and so on.
- an embodiment of the present application also provides a manufacturing method of a display panel.
- the specific process of the manufacturing method of the display panel 100 may be as follows:
- a substrate layer 10 is provided.
- the substrate layer 10 includes a display area 11 and a non-display area 12.
- first retaining wall 20 surrounding the display area 11 on the substrate layer 10, and perform a hydrophobic treatment on the first retaining wall 20.
- a first inorganic layer 30 exposing the first retaining wall 20 is formed on the substrate layer 10.
- An organic layer 40 is formed on the first inorganic layer 30, and the organic layer 40 is located in the display area 11.
- the material of the first retaining wall 20 may be an organic material.
- the first retaining wall 20 can be fluorinated to form a hydrophobic layer 201 of fluoride ion-containing material on the surface of the first retaining wall 20.
- hydrophobic materials such as fluoroalkyl vinyl glycols, fluorine-containing alkyl vinyl glycols, fluorine-containing acyl halides, or fluoroalkyl methacrylates.
- fluorine gas may be introduced to cause the first retaining wall 20 to undergo a radical reaction with the fluorine gas to form a hydrophobic layer 201 of fluorine ion-containing material on the surface of the first retaining wall 20.
- hydrophobic materials such as fluoroalkyl vinyl glycols, fluorine-containing alkyl vinyl glycols, fluorine-containing acyl halides, or fluoroalkyl methacrylates.
- the hydrophobic layer 201 may be formed by forming a fluorine ion-containing material layer by chemical vapor deposition after forming the first retaining wall 20, and then etching the fluorine ion-containing material layer.
- the display panel 100 provided by the embodiment of the present application includes a substrate layer 10, a first retaining wall 20, a first inorganic layer 30, and an organic layer 40;
- the substrate layer 10 includes a display area 11 and a non-display area 12;
- the wall 20 is arranged in the non-display area of the substrate layer and is arranged around the display area.
- the surface of the first retaining wall has a hydrophobic layer;
- the first inorganic layer covers the substrate layer and exposes the second A retaining wall;
- the organic layer is disposed on the first inorganic layer, and is located in the display area.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种显示面板(100)及其制造方法。显示面板(100)包括衬底层(10)、第一挡墙(20)、第一无机层(30)和有机层(40);其中,衬底层(10)包括显示区(11)和非显示区(12);第一挡墙(20)设置于衬底层(10)的非显示区(12),且围绕显示区(11)设置,第一挡墙(20)表面具有一疏水层(201);第一无机层(30)覆盖衬底层(10),并且暴露第一挡墙(20);有机层(40)设置于第一无机层(30)上,且位于显示区(11)。
Description
本申请涉及显示技术领域,尤其涉及一种显示面板及其制造方法。
有机发光二极管(Organic Light-Emitting Diode, OLED)对水氧较为敏感,目前常用的OLED封装方式为薄膜封装,即采用有机膜层和无机膜层交替层叠的方式对水氧进行阻隔。其中无机膜层的致密性较好,主要可以用来阻隔水氧,而有机膜层主要可以用来缓解无机膜层的内应力,同时也使封装膜层具有一定的柔韧性。
目前,有机膜层通常采用液态流平成膜,其成膜边缘不易控制。当边缘溢流较多,导致无机膜层无法覆盖时,水氧可以沿有机膜层边缘渗入从而导致封装失效。
目前,有机膜层通常采用液态流平成膜,其成膜边缘不易控制。当边缘溢流较多,导致无机膜层无法覆盖时,水氧可以沿有机膜层边缘渗入从而导致封装失效。
本申请实施例提供了一种显示面板及其制造方法,可以有效的抑制有机膜层的边缘溢流现象。
第一方面,本申请实施例提供了一种显示面板,包括:
衬底层,所述衬底层包括显示区和非显示区;
第一挡墙,所述第一挡墙设置于所述衬底层的非显示区,且围绕所述显示区设置,所述第一挡墙表面具有一疏水层;
第一无机层,所述第一无机层覆盖所述衬底层,并且暴露所述第一挡墙;
有机层,所述有机层设置于所述第一无机层上,且位于所述显示区。
在本申请实施例提供的显示面板中,所述第一挡墙的材料为有机材料。
在本申请实施例提供的显示面板中,所述疏水层的材料包括含氟烷基乙烯基二醇类、含氟烷基乙烯基二醇类、含氟酰卤类或甲基丙烯酸氟烷基酯类中的一种。
在本申请实施例提供的显示面板中,所述疏水层通过所述第一挡墙与氟气发生自由基反应形成。
在本申请实施例提供的显示面板中,所述疏水层通过化学气相沉积形成。
在本申请实施例提供的显示面板中,所述第一挡墙与所述有机层平齐。
在本申请实施例提供的显示面板中,所述显示面板还包括:
第二挡墙,所述第二挡墙位于所述衬底层和所述第一无机层之间,所述第二挡墙围绕所述第一挡墙设置。
在本申请实施例提供的显示面板中,所述第二挡墙的材料为有机材料。
在本申请实施例提供的显示面板中,所述显示面板还包括:
第二无机层,所述第二无机层覆盖所述第一无机层、第一挡墙和所述有机层。
在本申请实施例提供的显示面板中,所述衬底层包括基板和依次设置于所述基板上的柔性衬底、有机发光结构。
第二方面,本申请实施例提供了一种显示面板的制造方法,包括:
提供一衬底层,所述衬底层包括显示区和非显示区;
在所述衬底层上形成围绕所述显示区的第一挡墙,并对所述第一挡墙进行疏水性处理;
在所述衬底层上形成暴露所述第一挡墙的第一无机层;
在所述第一无机层上形成有机层,所述有机层位于所述显示区。
在本申请实施例提供的显示面板的制造方法中,所述第一挡墙的材料为有机材料。
在本申请实施例提供的显示面板的制造方法中,所述疏水层的材料包括含氟烷基乙烯基二醇类、含氟烷基乙烯基二醇类、含氟酰卤类或甲基丙烯酸氟烷基酯类中的一种。
在本申请实施例提供的显示面板的制造方法中,所述疏水层通过所述第一挡墙与氟气发生自由基反应形成。
在本申请实施例提供的显示面板的制造方法中,所述疏水层通过化学气相沉积形成。
在本申请实施例提供的显示面板的制造方法中,所述第一挡墙与所述有机层平齐。
在本申请实施例提供的显示面板的制造方法中,所述显示面板还包括:
第二挡墙,所述第二挡墙位于所述衬底层和所述第一无机层之间,所述第二挡墙围绕所述第一挡墙设置。
在本申请实施例提供的显示面板的制造方法中,所述第二挡墙的材料为有机材料。
在本申请实施例提供的显示面板的制造方法中,所述显示面板还包括:
第二无机层,所述第二无机层覆盖所述第一无机层、第一挡墙和所述有机层。
在本申请实施例提供的显示面板的制造方法中,所述衬底层包括基板和依次设置于所述基板上的柔性衬底、有机发光结构。
本申请实施例提供的显示面板包括衬底层、第一挡墙、第一无机层和有机层;所述衬底层包括显示区和非显示区;所述第一挡墙设置于所述衬底层的非显示区,且围绕所述显示区设置,所述第一挡墙表面具有一疏水层;所述第一无机层覆盖所述衬底层,并且暴露所述第一挡墙;所述有机层设置于所述第一无机层上,且位于所述显示区。本方案通过在第一挡墙上设置一疏水层,可以有效的抑制有机层的边缘溢流现象。
图1是现有技术中的显示面板的结构示意图。
图2是本申请实施例提供的显示面板的结构示意图。
图3是本申请实施例提供的显示面板的制造方法的流程示意图。
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
在现有技术中,如图1所示,为了抑制有机层40的边缘溢流,常见在显示区11外围设置挡墙结构20,但挡墙20上的第一无机层30为了使有机层40在显示区11有较好的流平效果常常是有利于有机层40的扩展的。因此在现有技术中,挡墙20的设置仍然不能较好的抑制有机层40的边缘溢流。
对此,本申请实施例提供了一种显示面板及其制造方法,以下将分别进行详细说明。
请参阅图2,图2是本申请实施例提供的显示面板的结构示意图。该显示面板100可以包括衬底层10、第一挡墙20、第一无机层30和有机层40。
衬底层10可以包括显示区11和非显示区12。该衬底层10可以包括基板101和依次层叠设置于该基板101上的柔性衬底102和有机发光结构103。其中,该基板101是用于驱动发光结构103发光的阵列基板。该基板101可以是透明的、半透明的或不透明的。柔性衬底102可以由柔性材料构成,比如聚酰亚胺(Polyimide,PI)。该柔性衬底102可以增加显示面板100的耐弯折性。发光结构103可以实现该显示面板100的画面显示。可以理解的是,发光结构103位于显示区11。
第一挡墙20设置于衬底层10的非显示区12。并且,该第一挡墙20围绕衬底层10的显示区11设置。需要说明的是,在该第一挡墙20的表面具有一疏水层201。
在一些实施例中,该第一挡墙20的材料可以是有机材料。此时,可以对该第一挡墙20进行氟化处理。
具体的,可以通入氟气,使得该第一挡墙20与氟气发生自由基反应,以在该第一挡墙20的表面形成含氟离子材料的疏水层201。比如,氟烷基乙烯基二醇类、含氟烷基乙烯基二醇类、含氟酰卤类或甲基丙烯酸氟烷基酯类等疏水材料中的一种。
在一些实施例中,该疏水层201可以是在形成第一挡墙20之后,通过化学气相沉积形成含氟离子材料层,然后再对含氟离子材料层进行蚀刻形成的。
第一无机层30覆盖衬底层10。并且,该第一无机层30暴露第一挡墙20。可以理解的是,该第一无机层30覆盖发光结构103。该第一无机层30可以保护发光结构103,以避免发光结构103受到外界的水汽或氧气的影响。
该第一无机层30的材料可以由疏水性较好的材料构成,比如氧化铝Al2O3、氮化铝AlN、氮氧化铝AlON、硅碳氮化物SiCN、氧化镁MgO、氧化钙CaO、氧化钨WOx、二氧化钛TiO2、氮化钛TiNx、氮化钛ZrO2、氮化锆ZrNx、氧化锌ZnO、五氧化二钽Ta2O5、二氧化铪HfO2、氮化铪HfNx、三氧化二铟In2O3、氧化铈CeOx或二氧化锆ZrO2等。
有机层40设置于第一无机层30上。并且,该有机层40位于衬底层10的显示区11。可以理解的是,该有机层40与第一挡墙20平齐。该有机层40主要可以起缓冲作用,用于减小第一无机层30与第二无机层60之间的应力。
可以理解的是,由于第一无机层30常常是有利于有机层40的扩展的。因此,可以在衬底层10上形成暴露第一挡墙20的第一无机层30。此时,可以直接由具有疏水层201的第一挡墙20与有机层40相接触。
具体的,有机层40具有一定的流动性,具有疏水层201的第一挡墙20可以将有机层40限定在挡墙20围绕的显示区域11内,避免有机层40蔓延而增大非显示区12的宽度。该第一挡墙20可以更好的避免水汽和氧气进入显示面板100内部,避免显示面板100被水汽或氧气腐蚀。
在一些实施例中,该显示面板100还可以包括第二挡墙50。该第二挡墙50可以设置于衬底层10和第一无机层30之间,并且围绕第一挡墙20设置。
具体的,该第二挡墙50可以用于支撑制作无机层41所用的掩膜版。并且,若在工艺过程中有机层40溢出了第一挡墙20围绕的显示区11,该第二挡墙50还可以起到进一步的阻挡作用,防止有机层40外延,有利于显示面板100的窄边框。
在一些实施例中,该第二挡墙50的材料可以为有机材料。比如有机硅材料,由于有机硅材料弹性模量小,弯折性能良好,显示面板100弯折时不易产生裂纹,可以提高显示面板100的耐弯折性能。并且有机硅材料含硅和氧,与无机膜层的粘附性较好,显示面板100弯折时,避免了无机膜层与第二挡墙50分离,进一步增强了该显示面板100的侧向阻水能力和耐弯折性能。
在一些实施例中,该显示面板100还可以包括第二无机层60。该第二无机层60覆盖所述第一无机层30、第一挡墙20和有机层40。该第二无机层60可以更好的避免水汽和氧气进入显示面板100内部,避免显示面板100被水汽或氧气腐蚀。
该第二无机层60的材料可以由疏水性较好的材料构成,比如氧化铝Al2O3、氮化铝AlN、氮氧化铝AlON、硅碳氮化物SiCN、氧化镁MgO、氧化钙CaO、氧化钨WOx、二氧化钛TiO2、氮化钛TiNx、氮化钛ZrO2、氮化锆ZrNx、氧化锌ZnO、五氧化二钽Ta2O5、二氧化铪HfO2、氮化铪HfNx、三氧化二铟In2O3、氧化铈CeOx或二氧化锆ZrO2等。
请参阅图3,本申请实施例还提供了一种显示面板的制造方法。该显示面板100的制造方法的具体流程可以如下:
301、提供一衬底层10,衬底层10包括显示区11和非显示区12。
302、在衬底层10上形成围绕显示区11的第一挡墙20,并对第一挡墙20进行疏水性处理。
303、在衬底层10上形成暴露所述第一挡墙20的第一无机层30。
304、在第一无机层30上形成有机层40,有机层40位于显示区11。
在一些实施例中,第一挡墙20的材料可以是有机材料。此时,可以该第一挡墙20进行氟化处理,以在该第一挡墙20的表面形成含氟离子材料的疏水层201。比如,氟烷基乙烯基二醇类、含氟烷基乙烯基二醇类、含氟酰卤类或甲基丙烯酸氟烷基酯类等疏水材料中的一种。
具体的,可以通入氟气,使得该第一挡墙20与氟气发生自由基反应,以在该第一挡墙20的表面形成含氟离子材料的疏水层201。比如,氟烷基乙烯基二醇类、含氟烷基乙烯基二醇类、含氟酰卤类或甲基丙烯酸氟烷基酯类等疏水材料中的一种。
在一些实施例中,该疏水层201可以是在形成第一挡墙20之后,通过化学气相沉积形成含氟离子材料层,然后再对含氟离子材料层进行蚀刻形成的。
由上可知,本申请实施例提供的显示面板100包括衬底层10、第一挡墙20、第一无机层30和有机层40;衬底层10包括显示区11和非显示区12;第一挡墙20设置于所述衬底层的非显示区,且围绕所述显示区设置,所述第一挡墙表面具有一疏水层;所述第一无机层覆盖所述衬底层,并且暴露所述第一挡墙;所述有机层设置于所述第一无机层上,且位于所述显示区。本方案通过在第一挡墙上设置一疏水层,可以有效的抑制有机层的边缘溢流现象。
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详述的部分,可以参见其他实施例的相关描述。
以上对本申请实施例所提供的一种显示面板及其制造方法进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想;本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。
Claims (20)
- 一种显示面板,其包括:衬底层,所述衬底层包括显示区和非显示区;第一挡墙,所述第一挡墙设置于所述衬底层的非显示区,且围绕所述显示区设置,所述第一挡墙表面具有一疏水层;第一无机层,所述第一无机层覆盖所述衬底层,并且暴露所述第一挡墙;有机层,所述有机层设置于所述第一无机层上,且位于所述显示区。
- 如权利要求1所述的显示面板,其中,所述第一挡墙的材料为有机材料。
- 如权利要求2所述的显示面板,其中,所述疏水层的材料包括含氟烷基乙烯基二醇类、含氟烷基乙烯基二醇类、含氟酰卤类或甲基丙烯酸氟烷基酯类中的一种。
- 如权利要求1所述的显示面板,其中,所述疏水层通过所述第一挡墙与氟气发生自由基反应形成。
- 如权利要求1所述的显示面板,其中,所述疏水层通过化学气相沉积形成。
- 如权利要求1所述的显示面板,其中,所述第一挡墙与所述有机层平齐。
- 如权利要求1所述的显示面板,其中,所述显示面板还包括:第二挡墙,所述第二挡墙位于所述衬底层和所述第一无机层之间,所述第二挡墙围绕所述第一挡墙设置。
- 如权利要求5所述的显示面板,其中,所述第二挡墙的材料为有机材料。
- 如权利要求1所述的显示面板,其中,所述显示面板还包括:第二无机层,所述第二无机层覆盖所述第一无机层、第一挡墙和所述有机层。
- 如权利要求1所述的显示面板,其中,所述衬底层包括基板和依次设置于所述基板上的柔性衬底、有机发光结构。
- 一种显示面板的制造方法,其包括:提供一衬底层,所述衬底层包括显示区和非显示区;在所述衬底层上形成围绕所述显示区的第一挡墙,并对所述第一挡墙进行疏水性处理;在所述衬底层上形成暴露所述第一挡墙的第一无机层;在所述第一无机层上形成有机层,所述有机层位于所述显示区。
- 如权利要求11所述的显示面板的制造方法,其中,所述第一挡墙的材料为有机材料。
- 如权利要求12所述的显示面板的制造方法,其中,所述疏水层的材料包括含氟烷基乙烯基二醇类、含氟烷基乙烯基二醇类、含氟酰卤类或甲基丙烯酸氟烷基酯类中的一种。
- 如权利要求11所述的显示面板的制造方法,其中,所述疏水层通过所述第一挡墙与氟气发生自由基反应形成。
- 如权利要求11所述的显示面板的制造方法,其中,所述疏水层通过化学气相沉积形成。
- 如权利要求11所述的显示面板的制造方法,其中,所述第一挡墙与所述有机层平齐。
- 如权利要求11所述的显示面板的制造方法,其中,所述显示面板还包括:第二挡墙,所述第二挡墙位于所述衬底层和所述第一无机层之间,所述第二挡墙围绕所述第一挡墙设置。
- 如权利要求17所述的显示面板的制造方法,其中,所述第二挡墙的材料为有机材料。
- 如权利要求11所述的显示面板的制造方法,其中,所述显示面板还包括:第二无机层,所述第二无机层覆盖所述第一无机层、第一挡墙和所述有机层。
- 如权利要求10所述的显示面板的制造方法,其中,所述衬底层包括基板和依次设置于所述基板上的柔性衬底、有机发光结构。
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KR102508330B1 (ko) * | 2017-11-22 | 2023-03-09 | 엘지디스플레이 주식회사 | 유기 발광 장치 및 유기 발광 표시 장치 |
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2019
- 2019-11-11 CN CN201911093278.7A patent/CN111312917A/zh active Pending
- 2019-11-19 US US16/641,667 patent/US20210391556A1/en not_active Abandoned
- 2019-11-19 WO PCT/CN2019/119325 patent/WO2021092975A1/zh active Application Filing
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