WO2021203786A1 - 显示面板、显示装置以及显示面板的制造方法 - Google Patents

显示面板、显示装置以及显示面板的制造方法 Download PDF

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Publication number
WO2021203786A1
WO2021203786A1 PCT/CN2021/070524 CN2021070524W WO2021203786A1 WO 2021203786 A1 WO2021203786 A1 WO 2021203786A1 CN 2021070524 W CN2021070524 W CN 2021070524W WO 2021203786 A1 WO2021203786 A1 WO 2021203786A1
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Prior art keywords
layer
substrate
display panel
opening area
isolation structure
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PCT/CN2021/070524
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English (en)
French (fr)
Inventor
秦成杰
曹方旭
王涛
孙韬
张嵩
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/429,609 priority Critical patent/US20230189627A1/en
Publication of WO2021203786A1 publication Critical patent/WO2021203786A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display panel, a display device, and a manufacturing method of the display panel.
  • the present disclosure provides a display panel, a display device, and a manufacturing method of the display panel.
  • a display panel including:
  • a substrate having a plurality of island regions and at least one opening region, each opening region having an opening penetrating the substrate;
  • It also includes a pixel unit located in the island area and an elastic filling layer located in the opening area.
  • the thickness of the elastic filling layer is smaller than the thickness of the opening area, and the thickness direction of the elastic filling layer and the thickness direction of the opening area are both perpendicular to the bearing surface of the substrate.
  • the thickness of the elastic filling layer is greater than the thickness of the opening area.
  • the elastic filling layer covers the entire substrate.
  • the material of the elastic filling layer includes an organic material.
  • the organic material may include at least one of the following materials: polymethylmethacrylate, polydimethylsiloxane, polyurethane, polyphenylene sulfide, silica gel, hexamethyldimethicone Or tetramethylsilane.
  • the display panel further includes: a first inorganic layer and a second inorganic layer sequentially stacked on the inner sidewall of the opening area.
  • the display panel further includes an isolation structure located between the opening area and the island area, the isolation structure including an isolation structure body and an isolation structure cover layer covering the isolation structure body.
  • the isolation structure body includes at least one of a pixel definition layer or a flat layer.
  • the isolation structure covering layer includes a light emitting layer, an electrode layer, a first inorganic layer, and a second inorganic layer sequentially covering the isolation structure body in a direction from close to the substrate to away from the substrate.
  • a display device which includes the display panel provided by various embodiments of the present disclosure and a driving circuit, and the driving circuit is used to drive pixel units in the display panel.
  • a method for manufacturing a display panel including:
  • the substrate having a plurality of island regions and at least one opening region, the opening region having an opening penetrating the substrate;
  • An elastic filling layer is formed in the opening area.
  • the forming of the base includes: forming the base on the substrate by using a flexible material; after forming the elastic filling layer in the opening area, the method further includes: peeling off the substrate.
  • the method before forming the elastic filling layer in the open area, the method further includes: forming an open hole penetrating the substrate at a predetermined position between the plurality of island areas;
  • the peeling of the substrate includes: peeling the substrate, and peeling the light-emitting layer, the electrode layer, the first inorganic layer, and the second inorganic layer at the bottom of the opening area.
  • the thickness of the elastic filling layer is smaller than the thickness of the opening area, and the thickness direction of the elastic filling layer and the thickness direction of the opening area are both perpendicular to the bearing surface of the substrate.
  • the thickness of the elastic filling layer is greater than the thickness of the opening area, and the thickness direction of the elastic filling layer and the thickness direction of the opening area are both perpendicular to the bearing surface of the substrate.
  • the elastic filling layer covers the substrate.
  • the method further includes:
  • An isolation structure is formed between the opening region and the island region, and the isolation structure includes an isolation structure body and an isolation structure cover layer covering the isolation structure body.
  • the isolation structure body includes at least one of a pixel definition layer or a flat layer; the isolation structure covering layer includes: a light emitting layer sequentially covering the isolation structure body in a direction away from the substrate, The electrode layer, the first inorganic layer, and the second inorganic layer.
  • Fig. 1 shows an exemplary structural block diagram of a display panel according to an embodiment of the present disclosure
  • FIG. 2 shows a cross-sectional view taken along line a-a of the display panel of FIG. 1;
  • Fig. 3 shows an exemplary structural block diagram of a display panel according to another embodiment of the present disclosure
  • FIG. 4 shows an exemplary structural block diagram of a display panel according to another embodiment of the present disclosure
  • 5 to 10 show exemplary schematic diagrams of the manufacturing process of the display panel shown in FIG. 2;
  • Fig. 11 shows an exemplary structural block diagram of a display device according to an embodiment of the present disclosure
  • FIG. 12 shows an exemplary flowchart of a method of manufacturing a display panel according to an embodiment of the present disclosure
  • FIG. 13 shows an exemplary flowchart of a method of manufacturing a display panel according to another embodiment of the present disclosure
  • FIG. 14 shows an exemplary schematic diagram of the manufacturing process of the display panel shown in FIG. 2.
  • the stretchable display panel shown in FIG. 1 mostly uses a large number of opening areas H. These opening areas H can ensure the stretching and bending performance of the display panel, but at the same time These opening areas H will also cause a relatively large risk to the packaging of the display panel. For example, the sidewall package of the opening area H is relatively weak, and is prone to failure during the stretching process. Moreover, when the flexible display panel is peeled from the glass substrate, it is easy to cause the encapsulation layer to break.
  • the embodiments of the present disclosure provide the following technical solutions, which can solve the above-mentioned technical problems.
  • FIG. 1 shows a schematic top view of a display panel according to an embodiment of the present disclosure.
  • Fig. 2 shows a cross-sectional view taken along line a-a of the display panel of Fig. 1. It can be seen in combination with FIG. 1 and FIG. 2 that the display panel provided by the embodiment of the present disclosure includes:
  • the substrate 101 has a plurality of island areas AA and at least one open area H, wherein each open area H has an opening penetrating the substrate.
  • each open area H has an opening penetrating the substrate.
  • adjacent island areas AA may be connected by a bridge area Q, and a plurality of opening areas H penetrating the substrate are distributed at preset positions in the bridge area Q.
  • It also includes a pixel unit located in the island area AA, and an elastic filling layer 601 located in the hole area H. Among them, one or more pixel units may be provided in each island area AA.
  • the structure of the display panel shown in FIG. 1 is only used as an example and is not a unique limitation, and its specific structure can be determined according to actual needs.
  • the display panel includes a plurality of island areas AA, and adjacent island areas AA are connected by bridge areas Q.
  • the island area AA includes pixel units (also referred to as display units), and the bridge area Q is used for wiring.
  • a plurality of opening areas H are distributed at preset positions in the bridge area Q.
  • the hole area H is the position where the hole is located. The existence of the hole increases the stretchable range and bendable degree of the display panel, that is, the display panel provided by the embodiment of the present disclosure is a flexible display panel.
  • an encapsulation layer is also formed on the inner side wall of the opening region H, and the material of the encapsulation layer is an inorganic material. Since the thickness of the encapsulation layer formed on the inner sidewall of the opening area H is generally thin, and the stretching performance of the encapsulation layer is poor, the encapsulation layer is prone to failure during the stretching and bending process of the display panel. As shown in FIG. 2, in this solution, an elastic filling layer 601 formed of an elastic material is provided in the opening area H, which can strengthen the packaging layer, thereby effectively reducing the process of stretching and bending of the display panel. The probability of failure improves the reliability of the sidewall package of the opening area. In addition, since the elastic filling layer 601 is made of elastic material, it will not affect the stretching and bending performance of the display panel.
  • the packaging layer located at the bottom of the hole area H needs to be peeled off, which may easily cause the packaging layer on the inner sidewall of the hole area H to crack.
  • the elastic filling layer 601 after the elastic filling layer 601 is provided in the opening area H, the elastic filling layer 601 can form a pressing force on the inner side wall of the opening area 601. This force can solve the problem of rupture of the packaging layer that is easily caused when the flexible display panel is peeled from the glass substrate.
  • the elastic material forming the elastic filling layer 601 may include an organic material.
  • the organic material may include at least one of the following materials: polymethylmethacrylate (PMMA), polydimethylsiloxane (PDMS), polyurethane (PU) or Polyphenylene sulfide (PPS), etc.; alternatively, it can also include at least one of the following materials: silicone compounds such as silica gel, hexamethyldimethicone (HMDSO) or tetramethylsilane (TMS) Material.
  • PMMA polymethylmethacrylate
  • PDMS polydimethylsiloxane
  • PU polyurethane
  • PPS Polyphenylene sulfide
  • silicone compounds such as silica gel, hexamethyldimethicone (HMDSO) or tetramethylsilane (TMS) Material.
  • the thickness (also referred to as the height) of the elastic filling layer 601 may be smaller than the thickness of the hole region H.
  • the thickness direction of the elastic filling layer 601 and the thickness direction of the opening area H are both perpendicular to the bearing surface of the substrate 101. That is, in this embodiment, the elastic filling layer 601 may all be located in the openings of the opening region H.
  • the thickness of the elastic filling layer 601 may be greater than the thickness of the hole region H. That is, a part of the elastic filling layer 601 is located in the opening of the opening area H, and a part is located outside the opening.
  • the difference of the display panel shown in FIG. 3 is that the thickness of the elastic filling layer 601 is increased, so that the elastic filling layer 601 can protect the inorganic layer (that is, the encapsulation layer formed of inorganic material) The range has increased.
  • the elastic filling layer 601 may cover the entire substrate 101 as a whole, that is, the orthographic projection of the elastic filling layer 601 on the substrate 101 may cover each island area AA and each opening area H And each bridge area Q.
  • the difference of the display panel shown in FIG. 4 is that the thickness and coverage of the elastic filling layer 601 are different.
  • the elastic filling layer 601 can not only protect the inorganic layer of the opening area H, but also protect the film layer on the entire substrate 101 from being damaged by foreign matter.
  • the thickness and coverage of the above several kinds of elastic filling layer 601 can be selected according to the use scene, and there is no limitation here.
  • the display panel may further include: an isolation structure 304 (also called a barrier structure or a barrier dam) located between the opening area H and the island area AA, and the isolation structure 304 includes The isolation structure body 304-1 and the isolation structure cover layer 304-2 covering the isolation structure body 304-1.
  • the isolation structure 304 can block the water vapor and oxygen around the opening area H from entering the island area AA, so as to reduce the adverse effect on the performance of the pixel unit, thereby improving the display effect of the display panel.
  • the isolation structure body 304-1 includes a pixel definition layer 303. As shown in FIG. 2, the isolation structure body 304-1 is composed of a part of the pixel definition layer 303. When manufacturing the pixel definition layer 303, the isolation structure body 304-1 can be obtained by patterning the pixel definition layer 303.
  • the isolation structure body 304-1 may include a flat layer 301, that is, the isolation structure body 304-1 is composed of a part of the flat layer 301.
  • the isolation structure body 304-1 can be obtained by patterning the flat layer 301.
  • the isolation structure body 304-1 may include a flat layer 301 and a pixel definition layer 303 that are sequentially stacked. That is, the isolation structure body 304-1 is composed of a part of the flat layer 301 and a part of the pixel definition layer 303.
  • the isolation structure cover layer 304-2 includes: in a direction from close to the substrate 101 to away from the substrate 101 (in the direction from bottom to top in the figure), the light emitting layer of the isolation structure body 304-1 is sequentially covered. 402, an electrode layer 403, a first inorganic layer 501, and a second inorganic layer 503.
  • the electrode layer 403 may be an anode layer or a cathode layer, which is not limited here. In the following description, the electrode layer 403 is used as a cathode layer as an example.
  • the base 101 may be located on a substrate 100, and the substrate 100 may be a glass substrate.
  • the substrate 101 may be a flexible substrate, and the material of the flexible substrate may be polyimide, so that the display device can be bent, bent, or stretched.
  • the display panel may further include: a buffer layer 102, a first insulating layer 103, a second insulating layer 104, an intermediate layer 105, and a thin film transistor stacked on the substrate 101 in sequence.
  • the thin film transistor includes an active layer 201, a gate 202, an electrode 203, and a source and drain 204.
  • the electrode 203 can form a capacitance with the gate 202.
  • the display panel may further include: on the intermediate layer 105, a flat layer 301, an anode 401, and a pixel definition layer 303 are sequentially stacked.
  • a flat layer 301 and/or the pixel definition layer 303 are formed, the flat layer 301 and/or the pixel definition layer 303 can be patterned to form the isolation structure body 304-1.
  • the openings of the opening area H of the substrate 101 can penetrate the intermediate layer 105, the second insulating layer 104, the first insulating layer 103, the buffer layer 102 and the substrate 101 in sequence.
  • the display panel may further include: a light-emitting layer 402 and a cathode 403 stacked on the pixel definition layer 303 in sequence.
  • the light-emitting layer 402 and the cathode 403 cover the isolation structure body 304-1, forming a part of the isolation structure covering layer 304-2.
  • the display panel further includes: a first inorganic layer 501, an organic layer 502, and a second inorganic layer 503 stacked on the cathode 403 in sequence.
  • the first inorganic layer 501, the organic layer 502 and the second inorganic layer 503 realize the encapsulation of the display panel.
  • the organic layer 502 is blocked by the isolation structure 304 and does not cover the entire isolation structure body 304-1.
  • the first inorganic layer 501 and the second inorganic layer 503 completely cover the substrate 101. Therefore, as shown in FIG.
  • the isolation structure cover layer 304-2 further includes a first inorganic layer 501 and a second inorganic layer 503 laminated on the cathode 403 in sequence.
  • FIG. 8 shows the process steps for forming the openings, which are not described here. For details, please refer to the introduction in the following manufacturing method embodiments.
  • the embodiment of the present disclosure further provides a display device.
  • the display device may include: a display panel 10 as provided in the foregoing embodiment of the present disclosure, and a display panel 10 for driving pixel units in the display panel 10.
  • Drive circuit 20 may be included in the display panel 10.
  • the driving circuit 20 may include a gate driving circuit 201 and a source driving circuit 202.
  • the source driving circuit 202 is used to provide data signals for each column of pixel units px.
  • the gate driving circuit 201 is used to provide a gate driving signal for each row of pixel units px. Each pixel unit px can emit light under the driving of the gate driving signal and the data signal.
  • the gate driving circuit 201 may be located on the substrate 101 of the display panel 10, that is, the gate driving circuit 201 may be a gate driver on array (GOA) circuit.
  • GOA gate driver on array
  • the present disclosure also provides a method for manufacturing a display panel, which is used to manufacture the display panel provided in the above-mentioned embodiments. As shown in Figure 12, the manufacturing method includes:
  • Step S101 forming a substrate, the substrate having a plurality of island regions and at least one opening region, and the opening region has an opening penetrating the substrate.
  • adjacent island areas are connected by a bridge area, at least one opening area is located in the bridge area, and each opening area has an opening penetrating the substrate.
  • Step S102 forming a pixel unit in the island area.
  • one or more pixel units may be formed in each island region.
  • Step S103 forming an elastic filling layer in the opening area.
  • the elastic filling layer may be formed of an elastic material, and the elastic material may be an organic material.
  • the manufacturing process of the display panel will be described below with reference to FIGS. 5 to 10. Referring to FIG. 13, the manufacturing process includes the following steps.
  • Step S201 forming a base on the substrate.
  • a base 101 is formed on a substrate 100, and the substrate 100 may be a glass substrate.
  • the substrate 101 is a flexible substrate, and the material of the flexible substrate may be polyimide, so that the display device can be bent, bent or stretched.
  • Step S202 forming an isolation structure body of an isolation structure between the island area and the opening area of the substrate.
  • a buffer layer 102, a first insulating layer 103, a second insulating layer 104, an intermediate layer 105, and a thin film transistor (TFT) may be sequentially formed on the substrate 101.
  • the thin film transistor includes an active layer 201, a gate 202, an electrode 203, and a source and drain 204.
  • a flat layer 301, an anode 401, and a pixel definition layer 303 can be further formed on the intermediate layer 105 in sequence.
  • the anode 401 is connected to the source and drain 204 of the thin film transistor through a via hole in the flat layer 301.
  • the pixel definition layer 303 when the pixel definition layer 303 is formed, the pixel definition layer 303 may be patterned to form a pattern of the isolation structure body 304-1. And/or, when the flat layer 301 is formed, the flat layer 301 may be patterned to form a pattern of the isolation structure body 304-1.
  • Step S203 forming an opening penetrating the substrate in the opening region between the plurality of island regions.
  • At least one opening penetrating the substrate 101 may be formed at a preset position in the bridge area Q between adjacent island areas AA.
  • the area where the opening is located is an opening area H.
  • the opening may be formed by a photolithography process.
  • the openings in the opening region H also penetrate the intermediate layer 105, the second insulating layer 104, the first insulating layer 103 and the buffer layer 102 in sequence.
  • Step S204 sequentially forming a light-emitting layer and an electrode layer at the bottom of the opening area.
  • a light-emitting layer 402 and an electrode layer 403 may be sequentially formed on the pixel definition layer 303, and the electrode layer 403 may be a cathode.
  • the light-emitting layer 402 and the cathode 403 are disconnected in the opening area H, covering the bottom of the opening area H. That is, a part of the light-emitting layer 402 and the cathode 403 is directly formed on the substrate 101 and is located in the opening.
  • Step S205 forming a first inorganic layer and a second inorganic layer on the bottom and inner sidewalls of the opening area in sequence.
  • a first inorganic layer 501, an organic layer 502, and a second inorganic layer 503 may be sequentially formed on the cathode 403, thereby realizing the encapsulation of the display panel.
  • the first inorganic layer 501 and the second inorganic layer 503 cover the inner sidewall and bottom of the hole region H.
  • the isolation structure covering layer 304-2 may include: a light emitting layer 402, a cathode 403, a first inorganic layer 501, and a second inorganic layer 503 sequentially covering the isolation structure body 304-1 in a direction away from the substrate 101 .
  • the thin film transistor, anode 401, light-emitting layer 402 and cathode 403 on the substrate 101 can constitute a pixel unit.
  • steps S202 to step 205 it can be seen that in the process of forming pixel units in the island area AA, the openings located in the opening area H, and the openings located in the island area AA and the opening area H can be simultaneously formed. Between the isolation structure 304.
  • Step S206 forming an elastic filling layer in the opening area.
  • a method of screen printing or inkjet printing may be used to form an elastic filling layer 601 on the second inorganic layer 503 in the hole region H.
  • the elastic filling layer 601 can also be obtained by first coating the entire surface with an elastic material, and then processing it through a photolithography process.
  • the thickness of the elastic filling layer 601 may be less than the thickness of the hole region H.
  • the thickness of the elastic filling layer 601 may be greater than the thickness of the hole region H, and only a part of the substrate 101 is covered.
  • the thickness of the elastic filling layer 601 may be greater than the thickness of the hole region H, and the entire layer covers the substrate 101.
  • Step S207 peeling off the substrate, and peeling off the light-emitting layer, the electrode layer, the first inorganic layer and the second inorganic layer at the bottom of the opening area.
  • the substrate 100 and the base 101 can be peeled off by a laser process.
  • the light-emitting layer 402, the cathode 403, the first inorganic layer 501 and the second inorganic layer 503 located at the bottom of the hole area H will be peeled off together.
  • the elastic filling layer 601 and the first inorganic layer 501 and the second inorganic layer 503 on the inner sidewall of the opening region H can be retained.
  • the elastic filling layer 601 can form a pressing force on the inner side wall of the opening area 601. This force can prevent the first inorganic layer 501 and the second inorganic layer 502 from breaking along with the peeling of the bottom film layer of the opening area H, thereby enhancing the encapsulation strength of the sidewall of the opening area H without affecting the stretching of the display panel. performance.
  • the elastic filling layer 601 can also strengthen the inorganic layer of the inner side wall, thereby effectively reducing the probability of failure of the inorganic layer during the stretching and bending process of the display panel, and improving the encapsulation of the side wall of the opening area. reliability.
  • the elastic filling layer 601 is made of elastic material, it will not affect the stretching and bending performance of the display panel.

Abstract

本公开提供了一种显示面板、显示装置以及显示面板的制造方法。该显示面板包括：基底，基底具有多个岛区和至少一个开孔区，该开孔区具有穿透基底的开孔；还包括位于该岛区的像素单元，以及位于开孔区的弹性填充层。根据本公开实施例提供的技术方案，通过在开孔区设置弹性填充层，能够在不影响显示面板拉伸和弯折性能的前提下，加固该开孔区内侧壁的封装层。由此，可以有效降低该封装层在显示面板拉伸和弯折过程中失效的概率，获得提高开孔区封装可靠性的效果。

Description

显示面板、显示装置以及显示面板的制造方法
本公开要求于2020年4月9日提交的申请号为202010275063.3、发明名称为“显示面板、显示装置以及显示面板的制造方法”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及显示技术领域，尤其涉及显示面板、显示装置以及显示面板的制造方法。
背景技术
在柔性显示技术领域，现有可拉伸显示面板多采用大量的开孔结构设计，这些开孔结构对显示面板的封装造成比较大的风险。比如开孔结构的内侧壁封装比较薄弱，在拉伸过程中容易失效。而且在将柔性显示面板与玻璃基板剥离时，容易造成封装层的破裂。
发明内容
本公开提供一种显示面板、显示装置以及显示面板的制造方法。
一方面，提供一种显示面板，包括：
基底，基底具有多个岛区和至少一个开孔区，该每个开孔区具有穿透基底的开孔；
还包括位于岛区的像素单元，以及位于开孔区的弹性填充层。
在一些实施例中，弹性填充层的厚度小于开孔区的厚度，该弹性填充层的厚度方向和开孔区的厚度方向均垂直于基底的承载面。
在一些实施例中，弹性填充层的厚度大于开孔区的厚度。
在一些实施例中，弹性填充层覆盖整个基底。
在一些实施例中，弹性填充层的材料包括有机材料。
在一些实施例中，有机材料可以包括下述材料中的至少一种：聚甲基丙烯酸甲酯、聚二甲基硅氧烷、聚氨酯、聚苯硫醚、硅胶、六甲基二甲硅醚或四甲 基硅烷。
在一些实施例中，该显示面板还包括：在开孔区的内侧壁上依次层叠的第一无机层和第二无机层。
在一些实施例中，该显示面板还包括：位于开孔区和岛区之间的隔离结构，隔离结构包括隔离结构本体和覆盖隔离结构本体的隔离结构覆盖层。
在一些实施例中，隔离结构本体包括像素定义层或平坦层中的至少一种。
在一些实施例中，隔离结构覆盖层包括在从靠近基底到远离基底的方向上，依次覆盖隔离结构本体的发光层、电极层、第一无机层和第二无机层。
另一方面，提供一种显示装置，包括本公开各实施例所提供的显示面板，以及驱动电路，该驱动电路用于驱动显示面板中的像素单元。
又一方面，提供一种显示面板的制造方法，包括：
形成基底，所述基底具有多个岛区和至少一个开孔区，所述开孔区具有穿透所述基底的开孔；
在所述岛区形成像素单元；
在所述开孔区形成弹性填充层。
在一些实施例中，所述形成基底，包括：采用柔性材料在基板上形成基底；在所述开孔区形成弹性填充层之后，所述方法还包括：剥离所述基板。
在一些实施例中，在所述开孔区形成弹性填充层之前，所述方法还包括：在多个岛区之间的预设位置，形成穿透基底的开孔；
依次在开孔区的底部形成发光层和电极层；
依次在开孔区的底部和内侧壁形成第一无机层和第二无机层；
所述剥离所述基板，包括：剥离基板，并剥离开孔区底部的发光层、电极层、第一无机层和第二无机层。
所述弹性填充层的厚度小于所述开孔区的厚度，所述弹性填充层的厚度方向和所述开孔区的厚度方向均垂直于所述基底的承载面。
在一些实施例中，所述弹性填充层的厚度大于所述开孔区的厚度，所述弹性填充层的厚度方向和所述开孔区的厚度方向均垂直于所述基底的承载面。
在一些实施例中，所述弹性填充层覆盖所述基底。
在一些实施例中，所述方法还包括：
在所述开孔区和所述岛区之间形成隔离结构，所述隔离结构包括隔离结构 本体和覆盖所述隔离结构本体的隔离结构覆盖层。
在一些实施例中，所述隔离结构本体包括像素定义层或平坦层中的至少一种；所述隔离结构覆盖层包括：沿远离所述基底的方向依次覆盖所述隔离结构本体的发光层、电极层、第一无机层和第二无机层。
附图说明
通过阅读参照以下附图所作的对非限制性实施例所作的详细描述，本公开的其它特征、目的和优点将会变得更明显：
图1示出了根据本公开实施例的显示面板的示例性结构框图；
图2示出了图1的显示面板的a-a线截面图；
图3示出了根据本公开另一实施例的显示面板的示例性结构框图；
图4示出了根据本公开又一实施例的显示面板的示例性结构框图；
图5至图10示出了图2所示的显示面板的制造过程的示例性示意图；
图11示出了根据本公开一实施例的显示装置的示例性结构框图；
图12示出了根据本公开实施例的显示面板的制造方法的示例性流程图；
图13示出了根据本公开另一实施例的显示面板的制造方法的示例性流程图；
图14示出了图2所示的显示面板的制造过程的示例性示意图。
具体实施方式
下面结合附图和实施例对本公开作进一步的详细说明。可以理解的是，此处所描述的具体实施例仅仅用于解释相关发明，而非对该发明的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与发明相关的部分。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、 “左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
可以理解的是，在不冲突的情况下，本公开中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本公开。
发明人注意到：在柔性显示技术领域，如图1所示的可拉伸显示面板多采用大量的开孔区H，这些开孔区H可以确保显示面板的拉伸和弯折性能，但同时这些开孔区H也会对显示面板的封装造成比较大的风险。比如开孔区H的侧壁封装比较薄弱，在拉伸过程中容易失效。而且在将柔性显示面板与玻璃基板剥离时，容易造成封装层的破裂。
本公开实施例提供了如下技术方案，可以解决上述技术问题。
请参考图1和图2，图1示出了根据本公开实施例的显示面板的俯视示意图。图2示出了图1的显示面板的a-a线截面图。结合图1和图2可以看出，本公开实施例提供的该显示面板包括：
基底101，基底101具有多个岛区AA和至少一个开孔区H，其中每个开孔区H具有穿透基底的开孔。例如，参考图1，相邻的岛区AA可以通过桥区Q连接，在桥区Q内的预设位置分布有多个穿透基底的开孔区H。
还包括位于岛区AA的像素单元，以及位于开孔区H的弹性填充层601。其中，每个岛区AA内可以设置有一个或多个像素单元。
图1中示出的显示面板结构仅是用于示例，并非是唯一性限定，其具体结构可以根据实际需要确定。如图1所示，显示面板包括多个岛区AA，相邻的岛区AA通过桥区Q连接。岛区AA中包括像素单元(也可以称为显示单元)，桥区Q用于走线。桥区Q内预设的位置分布有多个开孔区H。该开孔区H是开孔所在的位置，开孔的存在增加了显示面板的可拉伸范围和可弯折程度，即本公开实施例提供的显示面板为柔性显示面板。
可以理解的是，该开孔区H的内侧壁还形成有封装层，该封装层的材料为无机材料。由于该开孔区H内侧壁上形成的封装层的厚度通常较薄，且该封装层的拉伸性能较差，因此封装层在显示面板拉伸和弯折过程中容易失效。如图2所示，本方案在开孔区H设置由弹性材料形成的弹性填充层601，可以对该封装层起到加固作用，从而有效降低该封装层在显示面板拉伸和弯折过程中失效的概率，提高该开孔区侧壁封装的可靠性。又由于该弹性填充层601由弹性材 料制成，因此不会对显示面板拉伸和弯折性能造成影响。
还可以理解的是，在显示面板制造过程中，需要先在玻璃基板上形成基底以及各个膜层(包括位于开孔区H内侧壁和底部的封装层)，然后再将该玻璃基板与基底剥离。但是，在剥离过程中需要将位于开孔区H底部的封装层也一同剥离，由此容易导致开孔区H内侧壁的封装层破裂。而在本公开实施例中，在开孔区H设置弹性填充层601后，该弹性填充层601能够在开孔区601的内侧壁形成挤压的作用力。该作用力能够解决在柔性显示面板与玻璃基板剥离时，容易造成的封装层的破裂的问题。
可选地，该形成弹性填充层601的弹性材料可以包括有机材料。示例的，该有机材料可以包括下述材料中的至少一种：聚甲基丙烯酸甲酯(polymethyl methacrylate，PMMA)、聚二甲基硅氧烷(polydimethylsiloxane，PDMS)、聚氨酯(polyurethane，PU)或聚苯硫醚(polyphenylene sulfide，PPS)等；或者，也可以包括下述材料中的至少一种：硅胶、六甲基二甲硅醚(HMDSO)或四甲基硅烷(TMS)等有机硅化合物材料。
如图2所示，在一些实施例中，弹性填充层601的厚度(也可以称为高度)可以小于开孔区H的厚度。其中，该弹性填充层601的厚度方向和该开孔区H的厚度方向均垂直于该基底101的承载面。也即是，在该实施例中，该弹性填充层601可以全部位于该开孔区H的开孔内。
如图3所示，在一些实施例中，弹性填充层601的厚度可以大于开孔区H的厚度。即该弹性填充层601的部分位于该开孔区H的开孔内，部分位于开孔外。相比图2所示的显示面板，图3所示的显示面板的区别在于，弹性填充层601的厚度增加了，使得该弹性填充层601可保护的无机层(即无机材料形成的封装层)的范围增加了。
如图4所示，在一些实施例中，弹性填充层601可以整层覆盖整个基底101，即该弹性填充层601在该基底101上的正投影可以覆盖各个岛区AA、各个开孔区H和各个桥区Q。相比图3所示的显示面板，图4所示的显示面板的区别在于，弹性填充层601的厚度和覆盖范围不同。在该实施例中，该弹性填充层601不仅可以保护开孔区H的无机层，还可以保护整个基底101上的膜层不被异物所损坏。
以上几种弹性填充层601的厚度和覆盖范围根据使用场景，进行选择，这 里不做限定。
可选地，如图2所示，该显示面板还可以包括：位于开孔区H和岛区AA之间的隔离结构304(也可以称为阻挡结构，或阻挡坝)，该隔离结构304包括隔离结构本体304-1和覆盖隔离结构本体304-1的隔离结构覆盖层304-2。该隔离结构304可以阻隔开孔区H周边的水汽和氧气进入岛区AA，以减少对像素单元的性能造成的不利影响，从而改善显示面板的显示效果。
在一些实施例中，隔离结构本体304-1包括像素定义层303。如图2所示，隔离结构本体304-1由部分像素定义层303组成。在制造像素定义层303时，可通过图案化该像素定义层303得到该隔离结构本体304-1。
或者，隔离结构本体304-1可以包括平坦层301，即隔离结构本体304-1由部分平坦层301组成。在制造平坦层301时，可通过图案化该平坦层301得到该隔离结构本体304-1。
再或者，隔离结构本体304-1可以包括依次层叠的平坦层301和像素定义层303。即隔离结构本体304-1由部分平坦层301和部分像素定义层303组成。
在一些实施例中，隔离结构覆盖层304-2包括：在从靠近基底101到远离基底101的方向上(图中的由下至上的方向上)，依次覆盖隔离结构本体304-1的发光层402、电极层403、第一无机层501和第二无机层503。其中电极层403可以为阳极层或者阴极层，这里不做限定。下文以该电极层403为阴极层为例进行说明。
下面结合图5至图10介绍本公开实施例提供的显示面板的实现方式。
如图5所示，该基底101可以位于基板100上，该基板100可以为玻璃基板。基底101可以为柔性基底，该柔性基底的材料可以是聚酰亚胺，从而使显示器件可以进行弯曲、弯折或拉伸。
如图6所示，该显示面板还可以包括：在基底101上依次层叠的缓冲层102、第一绝缘层103、第二绝缘层104、中间层105和薄膜晶体管。其中，薄膜晶体管包括有源层201、栅极202、电极203、源漏极204。该电极203能够与栅极202形成电容。
如图7所示，该显示面板还可以包括：在中间层105上，依次层叠的平坦层301、阳极401和像素定义层303。其中，在形成平坦层301和/或像素定义层303时，可以图案化该平坦层301和/或像素定义层303以形成隔离结构本体 304-1。
如图8所示，该基底101的开孔区H的开孔可以依次穿透该中间层105、第二绝缘层104、第一绝缘层103、缓冲层102以及基底101。
如图9所示，该显示面板还可以包括：在像素定义层303上依次层叠的发光层402和阴极403。其中，发光层402和阴极403覆盖在隔离结构本体304-1上，形成部分隔离结构覆盖层304-2。
如图10所示，该显示面板还包括：在阴极403上依次层叠的第一无机层501、有机层502和第二无机层503。该第一无机层501、有机层502和第二无机层503实现了显示面板的封装。其中有机层502被隔离结构304阻隔，并未覆盖整个隔离结构本体304-1。该第一无机层501和第二无机层503整层覆盖基底101，因此如图10所示，该开孔区H的内侧壁上也依次层叠有第一无机层501和第二无机层503。
并且，从图10还可以看出，该隔离结构覆盖层304-2还包括在该阴极403上依次层叠的第一无机层501和第二无机层503。
其中图8所示为形成开孔的工艺步骤，这里不做介绍，其说明详见下面的制造方法实施例中的介绍。
本公开实施例还提供一种显示装置，如图11所示，该显示装置可以包括：如本公开上述实施例中所提供的显示面板10，以及用于驱动该显示面板10中的像素单元的驱动电路20。
可选地，如图11所示，该驱动电路20可以包括栅极驱动电路201和源极驱动电路202。其中，该源极驱动电路202用于为各列像素单元px提供数据信号。该栅极驱动电路201用于为各行像素单元px提供栅极驱动信号。每个像素单元px可以在该栅极驱动信号和数据信号的驱动下发光。
在一些实施例中，该栅极驱动电路201可以位于该显示面板10的基底101上，即该栅极驱动电路201可以为阵列基板行驱动(gate driver on array，GOA)电路。
本公开还提供一种显示面板的制造方法，用于制造如上述实施例提供的显示面板。如图12所示，该制造方法包括：
步骤S101、形成基底，该基底具有多个岛区和至少一个开孔区，该开孔区具有穿透该基底的开孔。
其中，相邻的岛区通过桥区连接，至少一个开孔区位于该桥区内，且该每个开孔区均具有穿透基底的开孔。
步骤S102、在该岛区形成像素单元。
在本公开实施例中，该每个岛区内可以形成有一个或多个像素单元。
步骤S103、在该开孔区形成弹性填充层。
该弹性填充层可以由弹性材料形成，该弹性材料可以为有机材料。
下面结合图5至图10说明该显示面板的制造过程，参考图13，该制造过程包括如下步骤。
步骤S201、在基板上形成基底。
如图5所示，在基板100上形成基底101，该基板100可以为玻璃基板。基底101为柔性基底，该柔性基底的材料可以是聚酰亚胺，从而使显示器件可以进行弯曲、弯折或拉伸。
步骤S202、在该基底的岛区和开孔区之间形成隔离结构的隔离结构本体。
如图6所示，在形成隔离结构本体之前，可以先在基底101上依次形成缓冲层102、第一绝缘层103、第二绝缘层104、中间层105和薄膜晶体管(thin film transistor，TFT)，其中，薄膜晶体管包括有源层201、栅极202、电极203和源漏极204。
如图7所示，在形成薄膜晶体管之后，可以进一步在中间层105上，依次形成平坦层301、阳极401和像素定义层303。其中，该阳极401通过平坦层301中的过孔与该薄膜晶体管的源漏极204连接。
可选地，在形成像素定义层303时，可通过图案化该像素定义层303形成隔离结构本体304-1的图案。和/或，可以在形成该平坦层301时，通过图案化该平坦层301以形成隔离结构本体304-1的图案。
步骤S203、在该多个岛区之间的开孔区，形成穿透该基底的开孔。
如图8所示，在形成岛区AA的发光层402之前，可以在相邻岛区AA之间的桥区Q内的预设位置，形成穿透基底101的至少一个开孔，该每个开孔所在区域即为一个开孔区H。可选地，该开孔可通过光刻工艺形成。
参考图8可以看出，该开孔区H内的开孔还依次穿透该中间层105、第二绝缘层104、第一绝缘层103和缓冲层102。
步骤S204、依次在该开孔区的底部形成发光层和电极层。
如图9所示，可以在像素定义层303上依次形成发光层402和电极层403，该电极层403可以为阴极。其中，发光层402和阴极403在开孔区H断开，覆盖了开孔区H的底部。也即是，该发光层402和阴极403的一部分直接形成在基底101上，且位于开孔内。
步骤S205、依次在该开孔区的底部和内侧壁形成第一无机层和第二无机层。
如图10所示，可以在阴极403上，依次形成第一无机层501、有机层502和第二无机层503，由此实现了显示面板的封装。其中，第一无机层501和第二无机层503覆盖了开孔区H的内侧壁和底部。
并且，参考图9和图10可以看出，由于该开孔内的发光层402和阴极403并未完全覆盖该开孔区H的底部，因此位于开孔区H底部的部分第一无机层501可以直接与该基板100接触。
在本公开实施例中，覆盖该隔离结构本体的304-1的部分发光层402、阴极403、第一无机层501和第二无机层503即可组成隔离结构覆盖层304-2。也即是，该隔离结构覆盖层304-2可以包括：沿远离该基底101的方向依次覆盖该隔离结构本体304-1的发光层402、阴极403、第一无机层501和第二无机层503。
可以理解的是，该基底101上的薄膜晶体管、阳极401、发光层402和阴极403即可组成像素单元。相应的，结合上述步骤S202至步骤205的描述可知，可以在岛区AA内形成像素单元的过程中，同步形成位于该开孔区H的开孔，以及位于该岛区AA和开孔区H之间的隔离结构304。
步骤S206、在该开孔区形成弹性填充层。
如图14所示，可以采用丝网印刷或喷墨打印的方法，在开孔区H的第二无机层503上形成弹性填充层601。或者，该弹性填充层601还可以通过先整面涂覆弹性材料，再通过光刻工艺进行处理的方式获得。
例如，参考图2和图14，该弹性填充层601的厚度可以小于该开孔区H的厚度。或者，参考图3，该弹性填充层601的厚度可以大于该开孔区H的厚度，且仅覆盖部分基底101。又或者，参考图4，该弹性填充层601的厚度可以大于该开孔区H的厚度，且整层覆盖该基底101。
步骤S207、剥离该基板，并剥离该开孔区底部的该发光层、该电极层、该第一无机层和该第二无机层。
如图2所示，可以采用激光工艺将基板100和基底101进行剥离，此时位 于开孔区H底部的发光层402、阴极403、第一无机层501和第二无机层503会一同被剥离。而弹性填充层601、开孔区H内侧壁的第一无机层501和第二无机层503则可以保留。
剥离过程中，开孔区H内侧壁的第一无机层501和第二无机层503容易随底部膜层的剥离而破裂。而在本公开实施例中，在开孔区H设置弹性填充层601后，该弹性填充层601能够在开孔区601内侧壁形成挤压的作用力。该作用力能够防止第一无机层501和第二无机层502随着开孔区H底部膜层的剥离而破裂，从而增强了开孔区H侧壁封装强度，而且不影响显示面板的拉伸性能。
并且，该弹性填充层601还能够对该内侧壁的无机层起到加固作用，从而有效降低该无机层在显示面板拉伸和弯折过程中失效的概率，提高该开孔区侧壁封装的可靠性。又由于该弹性填充层601由弹性材料制成，因此不会对显示面板拉伸和弯折性能造成影响。
应当理解的是，本公开实施例中提及的至少一个是指一个或多个，多个是指两个或两个以上。
还应当理解的是，在本文中提及的“和/或”，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。字符“/”一般表示前后关联对象是一种“或”的关系。
以上描述仅为本公开的示例性实施例以及对所运用技术原理的说明。本领域技术人员应当理解，本公开中所涉及的发明范围，并不限于上述技术特征的特定组合而成的技术方案，同时也应涵盖在不脱离所述发明构思的情况下，由上述技术特征或其等同特征进行任意组合而形成的其它技术方案。例如上述特征与本公开中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术方案。

Claims (20)

  1. 一种显示面板，包括：
    基底，所述基底具有多个岛区和至少一个开孔区，所述开孔区具有穿透所述基底的开孔；
    位于所述岛区的像素单元；
    以及，位于所述开孔区的弹性填充层。
  2. 根据权利要求1所述的显示面板，其中，所述弹性填充层的厚度小于所述开孔区的厚度，所述弹性填充层的厚度方向和所述开孔区的厚度方向均垂直于所述基底的承载面。
  3. 根据权利要求1所述的显示面板，其中，所述弹性填充层的厚度大于所述开孔区的厚度，所述弹性填充层的厚度方向和所述开孔区的厚度方向均垂直于所述基底的承载面。
  4. 根据权利要求3所述的显示面板，其中，所述弹性填充层覆盖所述基底。
  5. 根据权利要求1至4任一所述的显示面板，其中，所述弹性填充层的材料包括有机材料。
  6. 根据权利要求5所述的显示面板，其中，所述有机材料包括下述材料中的至少一种：聚甲基丙烯酸甲酯、聚二甲基硅氧烷、聚氨酯、聚苯硫醚、硅胶、六甲基二甲硅醚或四甲基硅烷。
  7. 根据权利要求1至6任一所述的显示面板，其中，所述显示面板还包括：在所述开孔区的内侧壁上依次层叠的第一无机层和第二无机层。
  8. 根据权利要求1至7任一所述的显示面板，其中，所述显示面板还包括：位于所述开孔区和所述岛区之间的隔离结构，所述隔离结构包括隔离结构本体 和覆盖所述隔离结构本体的隔离结构覆盖层。
  9. 根据权利要求8所述的显示面板，其中，所述隔离结构本体包括像素定义层或平坦层中的至少一种。
  10. 根据权利要求8或9所述的显示面板，其中，所述隔离结构覆盖层包括：沿远离所述基底的方向依次覆盖所述隔离结构本体的发光层、电极层、第一无机层和第二无机层。
  11. 根据权利要求1至10任一所述的显示面板，其中，所述基底为柔性基底。
  12. 一种显示装置，包括：驱动电路，以及如权利要求1-11任一项所述的显示面板，所述驱动电路用于驱动所述显示面板中的像素单元。
  13. 一种显示面板的制造方法，包括：
    形成基底，所述基底具有多个岛区和至少一个开孔区，所述开孔区具有穿透所述基底的开孔；
    在所述岛区形成像素单元；
    在所述开孔区形成弹性填充层。
  14. 根据权利要求13所述的方法，其中，所述形成基底，包括：采用柔性材料在基板上形成基底；
    在所述开孔区形成弹性填充层之后，所述方法还包括：剥离所述基板。
  15. 根据权利要求14所述的方法，其中，在所述开孔区形成弹性填充层之前，所述方法还包括：
    在所述多个岛区之间的开孔区，形成穿透所述基底的开孔；
    依次在所述开孔区的底部形成发光层和电极层；
    依次在所述开孔区的底部和内侧壁形成第一无机层和第二无机层；
    所述剥离所述基板，包括：剥离所述基板，并剥离所述开孔区底部的所述发光层、所述电极层、所述第一无机层和所述第二无机层。
  16. 根据权利要求13至15任一所述的方法，其中，所述弹性填充层的厚度小于所述开孔区的厚度，所述弹性填充层的厚度方向和所述开孔区的厚度方向均垂直于所述基底的承载面。
  17. 根据权利要求13至15任一所述的方法，其中，所述弹性填充层的厚度大于所述开孔区的厚度，所述弹性填充层的厚度方向和所述开孔区的厚度方向均垂直于所述基底的承载面。
  18. 根据权利要求17所述的方法，其中，所述弹性填充层覆盖所述基底。
  19. 根据权利要求13至18任一所述的方法，其中，所述方法还包括：
    在所述开孔区和所述岛区之间形成隔离结构，所述隔离结构包括隔离结构本体和覆盖所述隔离结构本体的隔离结构覆盖层。
  20. 根据权利要求19所述的方法，其中，所述隔离结构本体包括像素定义层或平坦层中的至少一种；所述隔离结构覆盖层包括：沿远离所述基底的方向依次覆盖所述隔离结构本体的发光层、电极层、第一无机层和第二无机层。
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