US20230292543A1 - Display element and electronic device - Google Patents
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Definitions
- the present technology relates to a display element and an electronic device, and more particularly, to a display element and an electronic device which are capable of improving luminance of pixels.
- a light emission type display element such as an organic EL display element using an organic light emitting diode (OLED) in which a phenomenon called organic electroluminescence (organic EL) is applied has been developed.
- OLED organic light emitting diode
- PTL 1 As a technique for improving light extraction efficiency, for example, a technique disclosed in PTL 1 is known. A technique related to an anode reflector structure which reflects some of light propagated on a member surface using a difference in a refractive index between members is disclosed in PTL 1.
- a method of increasing a light emitting area by increasing a size of a specific pixel in order to improve luminance of each pixel can be used, but in a case in which such a method is employed, since a pixel pitch changes, it is difficult to achieve high definition. For this reason, there is a demand for a technique of improving luminance of pixels more appropriately.
- the luminance of pixels can be improved.
- FIG. 1 is a block diagram illustrating an example of a configuration of one embodiment of a display element to which the present technology is applied.
- FIG. 2 is a circuit diagram illustrating an example of a configuration of a pixel drive circuit.
- FIG. 3 is a plan view illustrating an example of a configuration of a display region.
- FIG. 4 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a related art.
- FIG. 5 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a first embodiment.
- FIG. 6 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a second embodiment.
- FIG. 7 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a third embodiment.
- FIGS. 8 A and 8 B each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of a fourth embodiment.
- FIGS. 9 A, 9 B and 9 C each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of a fifth embodiment.
- FIGS. 10 A and 10 B each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of a sixth embodiment.
- FIG. 11 shows a main part cross-sectional view illustrating a part of a structure of a bottom emission sub pixel 100 according to a seventh embodiment.
- FIGS. 12 A and 12 B each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of an eighth embodiment.
- FIG. 13 is a conceptual diagram for describing reflection of light by a reflector.
- FIG. 14 is a diagram illustrating a relation between a distance to an inclined surface of a reflector and a height of the reflector at which total reflection is performed.
- FIG. 15 is a conceptual diagram for describing the reflection of light by a reflector.
- FIG. 16 is a table illustrating a change in a height of a reflector satisfying a total reflection condition in a case in which a reflector angle is changed.
- FIG. 17 is a diagram illustrating an example of a structure of a reflector satisfying a predetermined total reflection condition.
- FIG. 18 is a diagram for describing a flow of a first example of a pixel manufacturing process according to an embodiment of the present technology.
- FIG. 19 is a diagram for describing a flow of a first example of a pixel manufacturing process according to an embodiment of the present technology.
- FIG. 20 is a diagram for describing a flow of a first example of a pixel manufacturing process according to an embodiment of the present technology.
- FIG. 21 is a diagram for describing a flow of a first example of a pixel manufacturing process according to an embodiment of the present technology.
- FIG. 22 is a diagram for describing a flow of a first example of a pixel manufacturing process according to an embodiment of the present technology.
- FIG. 23 is a diagram for describing a flow of a second example of a pixel manufacturing process according to an embodiment of the present technology.
- FIG. 24 is a diagram for describing a flow of a second example of a pixel manufacturing process according to an embodiment of the present technology.
- FIG. 25 is a diagram for describing a flow of a second example of a pixel manufacturing process according to an embodiment of the present technology.
- FIG. 26 is a diagram for describing a flow of a second example of a pixel manufacturing process according to an embodiment of the present technology.
- FIG. 27 is a diagram for describing a flow of a second example of a pixel manufacturing process according to an embodiment of the present technology.
- FIG. 28 is a diagram illustrating an example of an external appearance of a single-lens reflex camera as an electronic device to which a display element to which an embodiment of the present technology is applied is applied.
- FIG. 29 is a diagram illustrating an example of an external appearance of a head mounted display as an electronic device to which a display element to which an embodiment of the present technology is applied is applied.
- FIG. 1 is a block diagram illustrating an example of a configuration of one embodiment of a display element to which the present technology is applied.
- a display element 1 is a light emission type display element (display device) such as an organic EL display element using, for example, an organic light emitting diode (OLED).
- display device such as an organic EL display element using, for example, an organic light emitting diode (OLED).
- OLED organic light emitting diode
- a plurality of pixels are two-dimensionally arranged on a substrate 11 made of, for example, glass, a silicon wafer, or a resin, so that a display region 23 is formed. Further, a signal line drive circuit 21 and a scan line drive circuit 22 which are drivers for video display are formed on the periphery of the display region 23 .
- a pixel drive circuit 33 is formed in the display region 23 .
- FIG. 2 illustrates an example of a configuration of the pixel drive circuit 33 .
- the pixel drive circuit 33 is an active type drive circuit including a drive transistor Tr 1 , a write transistor Tr 2 , a capacitor (retention capacitor) Cs therebetween, and organic light emitting elements 101 ( 101 R, 101 W, 101 G, and 101 B) connected to the drive transistor Tr 1 in series between a first power line (Vcc) and a second power line (GND).
- a plurality of signal lines 31 are arranged in a column direction, and a plurality of scan lines 32 are arranged in a row direction. Crossing points of the signal lines 31 and the scan lines 32 correspond to the sub pixels 100 R, 100 W, 100 G, and 100 B including any one of the organic light emitting elements 101 R, 101 W, 101 G, 101 B.
- Each signal line 31 is connected to the signal line drive circuit 21 , and an image signal is supplied from the signal line drive circuit 21 to a source electrode of the write transistor Tr 2 via the signal line 31 .
- Each scan line 32 is connected to the scan line drive circuit 22 , and a scan signal is sequentially supplied from the scan line drive circuit 22 to a gate electrode of the write transistor Tr 2 via the scan line 32 .
- FIG. 3 illustrates an example of the plane configuration of the display region 23 .
- the display the sub pixel 100 R that generates red (R) light, the sub pixel 100 W that generates white (W) light, the sub pixel 100 G that generates green (G) light, and the sub pixel 100 B that generates blue (B) light are sequentially formed in the display region 23 in a two-dimensional form as a whole.
- a combination of the adjacent sub pixels 100 R, 100 W, 100 G, and 100 B constitutes one pixel 10 .
- a plurality of pixels 10 are arranged in the display region 23 in a two-dimensional form (in a matrix form), and each pixel 10 is constituted by four sub pixels 100 of red (R), white (W), green (G), and blue (B).
- the pixels 10 arranged in the two-dimensional form are referred to as a WRGB pixel.
- the organic EL display element in order to improve the luminance of respective sub pixels constituting a pixel, it is possible to cope with it by changing a size of a sub pixel.
- the method of increasing the light emitting area by increasing a size of a specific sub pixel among pixels since the pixel pitch is changed, it is difficult to achieve high definition.
- a structure in which a light emitting area of a light emitting portion in a sub pixel 900 W among the four sub pixels 900 is increased in order to improve luminance of the sub pixel 900 W is assumed.
- the pixel pitch of the sub pixel 900 W is different from the pixel pitches of the other sub pixels 900 R, 900 G, and 900 B. Further, as described above, if the pixel pitch is changed for each sub pixel 900 , it is difficult to achieve high definition.
- FIG. 5 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a first embodiment.
- a structure of a pixel 10 according to the first embodiment will be described below with reference to the main part cross-sectional view.
- the pixel 10 of the first embodiment includes four sub pixels, that is, a sub pixel 100 R that emits red (R) light, a sub pixel 100 W that emits white (W) light, a sub pixel 100 G that emits green (G) light, and a sub pixel 100 B that emits blue (B) light.
- the sub pixel 100 R includes an organic light emitting element 101 R.
- the sub pixels 100 W, 100 G, and 100 B include the organic light emitting elements 101 W, 101 G, and 101 B, respectively.
- the organic light emitting element 101 R is a light emitting portion including an organic layer including a light emitting layer, and an electrode.
- the organic layer has a structure sandwiched between an anode electrode and a cathode electrode, but only an anode electrode 121 R is illustrated in FIG. 5 . Further, an opening portion in which the anode electrode 121 R is exposed specifies the light emitting portion.
- the organic layer includes a light emitting layer made of an organic light emitting material, but specifically, for example, the organic layer may have a stacking structure of a hole transport layer, a light emitting layer, and an electron transport layer, a stacking structure of a hole transport layer and a light emitting layer doubling as an electron transport layer, a stacking structure of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer, or the like.
- this organic light emitting element 101 R employ a structure that emits white light.
- the organic light emitting element 101 W is a light emitting portion including an organic layer and an electrode (including an anode electrode 121 W). No color filter is formed for the organic light emitting element 101 W, and the sub pixel 100 W generates white (W) light.
- the organic light emitting element 101 G is a light emitting portion including an organic layer and an electrode (including an anode electrode 121 G).
- the organic light emitting element 101 B is a light emitting portion including an organic layer and an electrode (including an anode electrode 121 B).
- a color filter 131 B by which transmitted light becomes a blue (B) region is formed for the organic light emitting element 101 B, and the sub pixel 100 B generates blue (B) light through such a combination.
- a reflector (light reflecting portion) is formed to improve the light extraction efficiency.
- the reflector includes a first member that reflects light from the organic light emitting element toward a display surface side on a first substrate and a second member which fills a space between a second substrate arranged opposite to the first substrate and a light reflection structure and has a refractive index different from a refractive index of the first member, and the reflector reflects light propagating through the second member on the surface of the first member, so that the light extraction efficiency can be improved.
- a reflector 112 is formed on a surface of a first member 111 configured as a light reflecting layer (reflector structure).
- the first member 111 (in this embodiment and in the subsequently described embodiments) can be formed using a material such as, for example, SiO 2 and/or P—SiO.
- a second member for example, a second member 151 in FIG. 22 to be described later
- the first member 111 is formed to fill a space between the second members.
- the light reflecting layer is formed by the first member 111 and the second member (for example, the second member 151 in FIG. 22 to be described later).
- the four sub pixels including the sub pixel 100 R, the sub pixel 100 W, the sub pixel 100 G, and the sub pixel 100 B differ in the height of the reflector 112 (the height of the inclined surface of the first member 111 ).
- a side wall of the opening portion in which the anode electrode 121 is exposed is inclined at a predetermined inclination angle (reflector angle), and the inclined surface (surface) forms the reflector 112 .
- the height of the inclined surface in the stacking direction is also referred to as an “inclined surface height” of the reflector 112 .
- Inclined surface height of reflector 112 W >inclined surface height of reflector 112 G >inclined surface height of reflector 112 R >inclined surface height of reflector 112 B (1)
- the inclined surface height of the reflector 112 W corresponds to the height of the inclined surface of the first member 111 in the sub pixel 100 W.
- the inclined surface heights of the reflectors 112 G, 112 R, and 112 B correspond to the heights of the inclined surfaces of the first members 111 in the sub pixels 100 G, 100 R, and 100 B.
- luminance of a specific sub pixel 100 is increased such that the four sub pixels 100 are formed to differ in the inclined surface height of the reflector 112 , and the respective sub pixels 100 differ in luminance.
- the inclined surface height of the reflector 112 W of the sub pixel 100 W is high, a region in which light from the organic light emitting element 101 W (the anode electrode 121 W) undergoes total reflection increases, and thus the luminance of the sub pixel 100 W is improved, whereby the luminance of the entire pixel 10 can be improved.
- the respective sub pixels 100 differ in luminance, and thus it is possible to easily achieve high definition.
- the inclined surface height of the reflector 112 with respect to the organic light emitting element 101 (the anode electrode 121 ) serving as the light emitting portion is adjusted for each sub pixel 100 , so that the inclined surface heights of the reflector 112 R, the reflector 112 W, the reflector 112 G, and the reflector 112 B are different. Accordingly, in the pixel 10 of the first embodiment, it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of the specific sub pixel 100 by causing each sub pixel 100 to have different luminance.
- the inclined surface height of the reflector 112 can be adjusted for each sub pixel 100 so that, for example, a relation indicated in the following Formula (1)′ is satisfied.
- Inclined surface height of reflector 112 B >inclined surface height of reflector 112 W >inclined surface height of reflector 112 G >inclined surface height of reflector 112 R 1)′
- the sub pixels 100 constituting the pixel 10 are arranged in the order of the sub pixels 100 R, 100 W, 100 G, and 100 B from the left side to the right side in FIG. 5 , but the arrangement order of the sub pixels 100 is arbitrary.
- the inclined surface height of the reflector 112 is a uniform height like the reflector 112 W of the sub pixel 100 W as illustrated in FIG. 5
- a case in which the inclined surface height of the reflector 112 is not uniform is assumed, but in this case, for example, it is preferable to adjust an average value or the like of the inclined surface height of the reflector 112 for each sub pixel 100 .
- FIG. 6 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a second embodiment.
- a structure of a pixel 10 according to the second embodiment will be described below with reference to the main part cross-sectional view.
- an inclined surface height of a reflector 112 of a specific sub pixel 100 is different.
- an inclined surface height of a reflector 112 of a specific sub pixel 100 among the four sub pixels 100 is changed without changing the inclined surface height of the reflector 112 for all of the four sub pixels 100 as compared with the pixel 10 of the first embodiment ( FIG. 5 ) described above.
- the inclined surface height of the reflector 112 W only in the sub pixel 100 W is changed to be higher than the inclined surface heights of the reflectors 112 R, 112 G, and 112 B of the other sub pixels 100 R, 100 G, and 100 B.
- the inclined surface height of the reflector 112 W corresponds to the height of the inclined surface of the first member 111 in the sub pixel 100 W.
- the inclined surface heights of the reflectors 112 R, 112 G, and 112 B correspond to the heights of the inclined surfaces of the first members 111 in the sub pixels 100 R, 100 G, and 100 B.
- luminance of a specific sub pixel 100 can be increased such that the specific sub pixel 100 among the four sub pixels 100 is formed to differ in the inclined surface height of the reflector 112 , and the respective sub pixels 100 differ in luminance.
- the inclined surface height of only the reflector 112 W of the sub pixel 100 W is high, a region in which light from the organic light emitting element 101 W (the anode electrode 121 W) undergoes total reflection increases, and thus the luminance of the sub pixel 100 W is improved, whereby the luminance of the entire pixel 10 can be improved.
- each sub pixel 100 has different luminance, and thus it is possible to easily achieve high definition.
- the inclined surface height of the reflector 112 with respect to the organic light emitting element 101 (the anode electrode 121 ) serving as the light emitting portion is adjusted for each sub pixel 100 so that only the inclined surface height of the reflector 112 of the specific sub pixel 100 is different from the inclined surface heights of the reflectors 112 of the other sub pixels 100 . Accordingly, in the pixel 10 of the second embodiment, it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of the specific sub pixel 100 by causing each sub pixel 100 to have different luminance.
- the example in which the inclined surface height of the reflector 112 W is highest, and the inclined surface heights of the other reflectors, that is, the reflector 112 G, the reflector 112 R, and the reflector 112 B are equal as indicated in Formula (2) has been described, but the relation indicated in Formula (2) is an example, and the reflector 112 whose inclined surface height is changed is arbitrary as long as the inclined surface height of the reflector 112 of the specific sub pixel 110 is different from the inclined surface heights of the other sub pixels 100 .
- the example in which the inclined surface height of the reflector 112 of one sub pixel 100 as the specific sub pixel 100 is changed has been described, but the number of specific sub pixels 100 may be two or more, for example, the inclined surface heights of the reflectors 112 W and 112 B of the sub pixels 100 W and 100 B may be changed.
- FIG. 7 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a third embodiment.
- a structure of a pixel 10 according to the third embodiment will be described below with reference to the main part cross-sectional view.
- a position of an anode electrode 121 of an organic light emitting element 101 included in a specific sub pixel 100 among the four sub pixels 100 including the sub pixel 100 R, the sub pixel 100 W, the sub pixel 100 G, and the sub pixel 100 B is adjusted.
- the position of the anode electrode 121 of the organic light emitting element 101 (the position in the stacking direction) is adjusted without adjusting the inclined surface height (the height in the stacking direction) of the reflector 112 in the sub pixel 100 as compared with the pixel 10 of the first embodiment ( FIG. 5 ) described above and the pixel 10 of the second embodiment ( FIG. 6 ).
- the inclined surface height of the reflector 112 with respect to the organic light emitting element 101 (the anode electrode 121 ) serving as the light emitting portion can be adjusted for each sub pixel 100 by adjusting the position of the organic light emitting element 101 (the anode electrode 121 ). Accordingly, it is possible to cause the inclined surface height of the reflector 112 of the specific sub pixel 100 to be different from the inclined surface heights of the reflectors 112 of the other sub pixels 100 .
- the position of the anode electrode 121 of the organic light emitting element 101 of the specific sub pixel 100 among the four sub pixels 100 is adjusted so that the inclined surface height of the reflector 112 of the specific sub pixel 100 is different, and thus it is possible to cause the respective sub pixels 100 to have different luminances, and it is possible to increase the luminance of the specific sub pixel 100 accordingly.
- the position of the anode electrode 121 W of the organic light emitting element 101 W of the sub pixel 100 W is adjusted so that only the reflector 112 W of the sub pixel 100 W have a higher inclined surface height, the luminance of the sub pixel 100 W is improved, and the luminance of the entire pixel 10 can be improved accordingly.
- each sub pixel 100 has different luminance, and thus it is possible to easily achieve high definition.
- the inclined surface height of the reflector 112 with respect to the anode electrode 121 of the organic light emitting element 101 serving as the light emitting portion 101 is adjusted for each sub pixel 100 by adjusting the position of the anode electrode 121 side of the specific sub pixel 100 , and thus only the inclined surface height of the reflector 112 of the specific sub pixel 100 is different from the inclined surface heights of the reflectors 112 of the other sub pixels 100 . Accordingly, in the pixel 10 of the third embodiment, it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of the specific sub pixel 100 by causing each sub pixel 100 to have different luminance.
- the example in which the position of the anode electrode 121 side of one sub pixel 100 as the specific sub pixel 100 is adjusted has been presented here, but, for example, the number of specific sub pixels 100 may be two or more, for example, the positions of the anode electrodes 121 W and 121 B side of the sub pixels 100 W and 100 B may be adjusted. Further, the position of the anode electrode 121 side may be adjusted for each sub pixel 100 in the pixel 10 so that, for example, the relation of Formula (1) described above is satisfied.
- FIGS. 8 A and 8 B each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of a fourth embodiment.
- a structure of a pixel 10 according to the fourth embodiment will be described below with reference to these main part cross-sectional views.
- the first member 111 comprises a first (lower) portion 111 A and a second (upper) portion 111 B.
- the lower portion 111 A comprises the light emitting elements 101 R, 101 B, 101 G and 101 W of each sub pixel 100 R, 100 B, 100 G and 100 W and the upper portion 111 B comprises the reflector 112 R, 112 B, 112 G and 112 W of each sub pixel 100 R, 100 B, 100 G and 100 W.
- the upper and lower portions 111 A and 111 B are separated by a gap 800 .
- the gap 800 comprises the color filters 131 R, 131 B and 131 G of each sub pixel 100 R, 100 B and 100 G (the sub pixel 100 W does not have a color filter).
- the inclined surface height of the reflector of one of the sub pixels is higher than the inclined surface heights of the reflectors of the other sub pixels (reflectors 112 R, 112 G and 112 W of sub pixels 100 R, 100 G and 100 W, in this example).
- a relation according to Formula (2)′ is obtained.
- the luminance of a specific sub pixel 100 is increased by differing the inclined surface height of the reflector 112 of the specific sub pixel 100 among the four sub pixels 100 .
- the inclined surface height of the reflector 112 B of the sub pixel 100 B is higher than that of the other sub pixels (as shown in FIG. 8 A )
- a region in which light from the organic light emitting element 101 B undergoes total reflection increases, and thus the luminance of the sub pixel 100 B relative to that of the other sub pixels is improved.
- the inclined surface height of the reflector 112 is changed without changing the light emitting area or the pitch arrangement of each sub pixel 100 , it is possible to easily achieve high definition.
- the inclined surface height of the reflector 112 with respect to the organic light emitting element 101 serving as the light emitting portion is determined for each sub pixel 100 so that only the inclined surface height of the reflector 112 of the specific sub pixel 100 is different from the inclined surface heights of the reflectors 112 of the other sub pixels 100 . Accordingly, in the pixel 10 of FIG. 8 A , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of the specific sub pixel 100 by causing that sub pixel 100 to have a different luminance.
- each of the sub pixels 100 can achieve the same (or similar) lifespan deterioration.
- the example in which the inclined surface height of the reflector 112 B is higher than that of the other reflectors and in which the inclined surface heights of the other reflectors (that is, the reflector 112 G, the reflector 112 R, and the reflector 112 W) are equal, as indicated in Formula (2)′, has been described.
- the relation indicated in Formula (2)′ is an example, and the reflector 112 whose inclined surface height is changed is arbitrary as long as the inclined surface height of the reflector 112 of the specific sub pixel 100 is different from the inclined surface heights of the other sub pixels 100 .
- the relation of inclined surface heights indicated in Formula (2) could be used (thereby increasing the luminance of the sub pixel 100 W to increase the luminance of the pixel 10 as a whole).
- each reflector 112 (or, at least, each of a portion of the reflectors 112 ) may have a different respective inclined surface height.
- a portion 801 of the upper portion 111 B comprising the reflector of one of the sub pixels (reflector 112 B of sub pixel 100 B, in this example) is not separated from the lower portion 111 A (that is, the portion 801 is connected to the lower portion 111 A) whereas another portion 802 of the upper portion 111 B comprising at least part of each of the reflectors of the other sub pixels (reflectors 112 R, 112 G and 112 W of sub pixels 100 R, 100 G and 100 W, in this example) is separated from the lower portion 111 A (that is, the portion 802 is not connected to the lower portion 111 A).
- the reflector 112 B of the portion 801 of the upper portion 111 B extends through part of the color filter 131 B of the sub pixel 100 B and part of the neighboring color filters 131 R and 131 G of the sub pixels 100 R and 100 G in order to connect with the lower portion 111 A.
- the surface area of the inclined surface of the reflector comprised by the portion 801 is greater than the surface area of the inclined surface of the reflectors of which at least a part is comprised by the portion 802 (reflectors 112 R, 112 G and 112 W of sub pixels 100 R, 100 G and 100 W, in this example).
- the luminance of a specific sub pixel 100 is increased because of the differing inclined surface area of the reflector 112 of the specific sub pixel 100 among the four sub pixels 100 .
- the inclined surface area of the reflector 112 B of the sub pixel 100 B is higher that of the other sub pixels (as shown in FIG. 8 B )
- a region in which light from the organic light emitting element 101 B undergoes total reflection increases, and thus the luminance of the sub pixel 100 B relative to that of the other sub pixels is improved.
- the inclined surface area of the reflector 112 is changed without changing the light emitting area or the pitch arrangement of each sub pixel 100 , it is possible to easily achieve high definition.
- the inclined surface area of the reflector 112 with respect to the organic light emitting element 101 serving as the light emitting portion is determined for each sub pixel 100 so that only the inclined surface area of the reflector 112 of the specific sub pixel 100 is different from the inclined surface areas of the reflectors 112 of the other sub pixels 100 . Accordingly, in the pixel 10 of FIG. 8 B , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of the specific sub pixel 100 by causing that sub pixel 100 to have a different luminance.
- each of the sub pixels 100 can achieve the same (or similar) lifespan deterioration.
- the example in which the inclined surface area of the reflector 112 B is higher than that of the other reflectors and in which the inclined surface areas of the other reflectors (that is, the reflector 112 G, the reflector 112 R, and the reflector 112 W) are equal has been described.
- the reflector 112 whose inclined surface area is changed is arbitrary as long as the inclined surface area of the reflector 112 of the specific sub pixel 100 is different from the inclined surface areas of the other sub pixels 100 .
- the reflector 112 W of the sub pixel 100 W may have the largest inclined surface area and the other sub pixels may have smaller, equal inclined surface areas (thereby increasing the luminance of the sub pixel 100 W and increasing the luminance of the pixel 10 as a whole).
- each reflector 112 (or, at least, each of a portion of the reflectors 112 ) may have a different respective inclined surface area (e.g. by adjusting the size of the gap between each reflector 112 and the lower portion 111 A).
- FIGS. 9 A, 9 B and 9 C each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of a fifth embodiment.
- a structure of a pixel 10 according to the fifth embodiment will be described below with reference to these main part cross-sectional views.
- each organic light emitting element 101 employs a structure that emits white light which (where necessary) then travels through a color filter (e.g. for sub pixels 100 R, 100 B and 100 G).
- each organic light emitting element 101 may emit a specific color of light (rather than white light).
- no color filters are required because the light emitted from each light emitting element 101 is already the desired color.
- the pixels 10 of the fifth embodiment use such colored light emitting elements 101 .
- These colored light emitting elements are structurally similar to the white light emitting elements of the above-mentioned embodiments, except that the organic layer of each light emitting element includes a light emitting layer made of an organic light emitting material which emits colored (rather than white) light.
- the relative positions of the anode, cathode and organic layer of each light emitting element are the same as previously described for the white light emitting elements of the above-mentioned embodiments.
- each light emitting element 101 is a colored light emitting element and there is no white light emitting element.
- each pixel 10 may comprise a plurality of light emitting elements of a certain color (in this case, each pixel 10 comprises two red light emitting elements 101 R).
- the first member 111 comprises a reflector 112 R, 112 B and 112 G of each sub pixel 100 R, 100 B and 100 G.
- the inclined surface height of the reflector of one of the sub pixels is higher than the inclined surface heights of the reflectors of the other sub pixels (reflectors 112 R and 112 G of sub pixels 100 R and 100 G, in this example).
- the inclined surface heights of the reflectors of the other sub pixels are equal to each other.
- the luminance of a specific sub pixel 100 is increased by differing the inclined surface height of the reflector 112 of the specific sub pixel 100 among the four sub pixels 100 .
- the inclined surface height of the reflector 112 B of the sub pixel 100 B is higher than that of the other sub pixels (as shown in FIG. 9 A )
- a region in which light from the organic light emitting element 101 B undergoes total reflection increases, and thus the luminance of the sub pixel 100 B relative to that of the other sub pixels is improved.
- the inclined surface height of the reflector 112 is changed without changing the light emitting area or the pitch arrangement of each sub pixel 100 , it is possible to easily achieve high definition.
- the inclined surface height of the reflector 112 with respect to the organic light emitting element 101 serving as the light emitting portion is determined for each sub pixel 100 so that only the inclined surface height of the reflector 112 of the specific sub pixel 100 is different from the inclined surface heights of the reflectors 112 of the other sub pixels 100 . Accordingly, in the pixel 10 of FIG. 9 A , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of the specific sub pixel 100 by causing that sub pixel 100 to have a different luminance. In the case of increasing the luminance of sub pixel 100 B using a reflector 112 B with a higher inclined surface height relative to that of the other sub pixels 100 R and 100 G, each of the sub pixels 100 can achieve the same (or similar) lifespan deterioration.
- FIG. 9 A the example in which the inclined surface height of the reflector 112 B is higher than that of the other reflectors and in which the inclined surface height of the other reflectors (that is, the reflector 112 G and the reflector 112 R) are equal has been described.
- the reflector 112 whose inclined surface height is changed is arbitrary as long as the inclined surface height of the reflector 112 of the specific sub pixel 100 is different from the inclined surface heights of the other sub pixels 100 .
- each reflector 112 (or, at least, each of a portion of the reflectors 112 ) may have a different respective inclined surface height.
- the first member 111 comprises a reflector for only one of the sub pixels (reflector 112 B of sub pixel 100 B, in this example).
- the luminance of a specific sub pixel 100 is increased by providing a reflector 112 only for that specific sub pixel 100 among the four sub pixels 100 .
- a reflector 112 B for sub pixel 100 B is provided, a region in which light from the organic light emitting element 101 B undergoes total reflection increases, and thus the luminance of the sub pixel 100 B relative to that of the other sub pixels is improved.
- the reflector 112 of the specific sub pixel is provided without changing the light emitting area or the pitch arrangement of each sub pixel 100 , it is possible to easily achieve high definition.
- each of the sub pixels 100 can achieve the same (or similar) lifespan deterioration.
- a reflector 112 is provided only to one specific sub pixel 100 in the pixel 10 of FIG. 9 B .
- the number of specific sub pixels 100 may be two or more. That is, more generally, a reflector 112 may be provided to a portion of the sub pixels 100 of a pixel 10 whereas a remaining portion of the sub pixels 100 of the pixel 10 are not provided with a reflector 112 . This improves the luminance of the specific sub pixels 100 to which a reflector 112 is provided.
- the first member 111 comprises a first (lower) portion 111 A and a second (upper) portion 111 B.
- the lower portion 111 A comprises the light emitting elements 101 R, 101 B and 101 G of each sub pixel 100 R, 100 B and 100 G and the upper portion 111 B comprises a reflector 112 R, 112 B and 112 G of each sub pixel 100 R, 100 B and 100 G.
- the lower and upper portions 111 A and 111 B are separated by a gap which varies in size for different respective facing portions of the lower and upper portions 111 A and 111 B.
- the size of the gap 903 between a portion 901 of the upper portion 111 B comprising the reflector of one of the sub pixels (reflector 112 B of sub pixel 100 B, in this example) and the lower portion 111 A is smaller than the size of the gap 904 between another portion 902 of the upper portion 111 B comprising at least part of each of the reflectors of the other sub pixels (reflectors 112 R and 112 G of sub pixels 100 R and 100 G, in this example) and the lower portion 111 A.
- FIG. 9 C the size of the gap 903 between a portion 901 of the upper portion 111 B comprising the reflector of one of the sub pixels (reflector 112 B of sub pixel 100 B, in this example) and the lower portion 111 A is smaller than the size of the gap 904 between another portion 902 of the upper portion
- the surface 905 of the lower portion 111 A facing the upper portion 111 B comprises a planarized layer 907 into which the portions 901 and 902 of the upper portion 111 B are embedded at different positions with respect to the lower portion 111 A so as to provide the gaps of different sizes between the portions 901 and 902 of the upper portion 111 B and the lower portion 111 A.
- the planarized layer 907 is formed of a transmissive material through which light emitted by each of the light emitting elements 101 R, 101 B and 101 G can pass.
- the planarized layer 907 may be formed of, for example, a resin such as an acrylic resin, a polyimide resin, a silicon resin or the like.
- the surface area of the inclined surface of the reflector comprised by the portion 901 is greater than the surface area of the inclined surface of the reflectors of which at least a part is comprised by the portion 902 (reflectors 112 R and 112 G of sub pixels 100 R and 100 G).
- the luminance of a specific sub pixel 100 is increased because of the differing inclined surface area of the reflector 112 of the specific sub pixel 100 among the four sub pixels 100 .
- the inclined surface area of the reflector 112 B of the sub pixel 100 B is higher that of the other sub pixels (as shown in FIG. 9 C )
- a region in which light from the organic light emitting element 101 B undergoes total reflection increases, and thus the luminance of the sub pixel 100 B relative to that of the other sub pixels is improved.
- the inclined surface area of the reflector 112 is changed without changing the light emitting area or the pitch arrangement of each sub pixel 100 , it is possible to easily achieve high definition.
- the inclined surface area of the reflector 112 with respect to the organic light emitting element 101 serving as the light emitting portion is determined for each sub pixel 100 so that only the inclined surface area of the reflector 112 of the specific sub pixel 100 is different from the inclined surface areas of the reflectors 112 of the other sub pixels 100 . Accordingly, in the pixel 10 of FIG. 9 C , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of the specific sub pixel 100 by causing that sub pixel 100 to have a different luminance. In the case of increasing the luminance of sub pixel 100 B using a reflector 112 B with a higher inclined surface area relative to that of the other sub pixels 100 R and 100 G, each of the sub pixels 100 can achieve the same (or similar) lifespan deterioration.
- the example in which the inclined surface area of the reflector 112 B is higher than that of the other reflectors and in which the inclined surface areas of the other reflectors (that is, the reflector 112 G and the reflector 112 R) are equal has been described.
- the reflector 112 whose inclined surface area is changed is arbitrary as long as the inclined surface area of the reflector 112 of the specific sub pixel 100 is different from the inclined surface areas of the other sub pixels 100 .
- the number of specific sub pixels 100 may be two or more. That is, more generally, the size of the gap between the upper portion 111 B and lower portion 111 A of the first member 111 may be varied such that the inclined surface area of the reflector of a portion of the sub pixels 100 of a pixel 10 is greater than that of the reflector of a remaining portion of the sub pixels 100 of the pixel 10 . This improves the luminance of the specific sub pixels 100 to which a reflector 112 with a greater inclined surface area is provided.
- each reflector 112 (or, at least, each of a portion of the reflectors 112 ) may have a different respective inclined surface area (e.g. by adjusting the size of the gap between each reflector 112 and the lower portion 111 A).
- FIGS. 10 A and 10 B each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of a sixth embodiment.
- a structure of a pixel 10 according to the sixth embodiment will be described below with reference to these main part cross-sectional views.
- the light emitting element 101 of each sub pixel 100 comprises an organic layer with a structure sandwiched between an anode electrode and a cathode electrode (the cathode being above the anode in the FIGS).
- the cathode formed of ITO, for example
- the anode formed of Al, Cu or the like, for example
- the present technology is not limited to such an arrangement, however.
- the anode which is transparent and the cathode which is reflective so that light emitted by the organic layer of each sub pixel 100 is transmitted through the anode to the reflector 112 of that sub pixel 100 but is reflected by the cathode rather than being transmitted through it.
- the anode is formed of ITO, for example, and the cathode is formed of Al, Cu or the like, for example.
- Such an arrangement is known as a bottom emission OLED type.
- the variants of the sixth embodiment shown in FIGS. 10 A and 10 B represent example bottom emission OLED type pixels.
- the first member 111 comprises a first (lower) portion 111 A and a second (upper) portion 111 B.
- the upper portion 111 B comprises the light emitting elements 101 R, 101 B and 101 G of each sub pixel 100 R, 100 B and 100 G and the lower portion 111 A comprises a reflector 112 R, 112 B and 112 G of each sub pixel 100 R, 100 B and 100 G.
- the lower and upper portions 111 A and 111 B are separated by a gap which varies in size for different respective facing portions of the lower and upper portions 111 A and 111 B.
- the size of the gap 1004 between a portion 1001 of the lower portion 111 A comprising the reflector of one of the sub pixels (reflector 112 B of sub pixel 100 B, in this example) and the upper portion 111 B is smaller than the size of the gap 1005 between another portion 1002 of the lower portion 111 A comprising at least part of each of the reflectors of the other sub pixels (reflectors 112 R and 112 G of sub pixels 100 R and 100 G in this example) and the upper portion 111 B.
- FIG. 10 A the size of the gap 1004 between a portion 1001 of the lower portion 111 A comprising the reflector of one of the sub pixels (reflector 112 B of sub pixel 100 B, in this example) and the upper portion 111 B is smaller than the size of the gap 1005 between another portion 1002 of the lower portion 111
- the surface 1006 of the upper portion 111 B facing the lower portion 111 A comprises a planarized layer 1000 into which the portions 1001 and 1002 of the lower portion 111 A are embedded at different positions with respect to the upper portion 111 B so as to provide the gaps of different sizes between the portions 1001 and 1002 of the lower portion 111 A and the upper portion 111 B.
- the planarized layer 1000 is formed of a transmissive material through which light emitted by each of the light emitting elements 101 R, 101 B and 101 G can pass.
- the planarized layer 1000 may be formed of, for example, a resin such as an acrylic resin, a polyimide resin, a silicon resin or the like.
- the surface area of the inclined surface of the reflector comprised by the portion 1001 is greater than the surface area of the inclined surface of the reflectors of which at least a part is comprised by the portion 1002 (reflectors 112 R and 112 G of sub pixels 100 R and 100 G, this this example).
- the luminance of a specific sub pixel 100 is increased because of the differing inclined surface area of the reflector 112 of the specific sub pixel 100 among the four sub pixels 100 .
- the inclined surface area of the reflector 112 B of the sub pixel 100 B is higher than that of the other sub pixels (as shown in FIG. 10 A )
- a region in which light from the organic light emitting element 101 B undergoes total reflection increases, and thus the luminance of the sub pixel 100 B relative to that of the other sub pixels is improved.
- the inclined surface area of the reflector 112 is changed without changing the light emitting area or the pitch arrangement of each sub pixel 100 , it is possible to easily achieve high definition.
- the inclined surface area of the reflector 112 with respect to the organic light emitting element 101 serving as the light emitting portion is determined for each sub pixel 100 so that only the inclined surface area of the reflector 112 of the specific sub pixel 100 is different from the inclined surface areas of the reflectors 112 of the other sub pixels 100 . Accordingly, in the pixel 10 of FIG. 10 A , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of the specific sub pixel 100 by causing that sub pixel 100 to have a different luminance. In the case of increasing the luminance of sub pixel 100 B using a reflector 112 B with a higher inclined surface area relative to that of the other sub pixels 100 R and 100 G, each of the sub pixels 100 can achieve the same (or similar) lifespan deterioration.
- the example in which the inclined surface area of the reflector 112 B is higher than that of the other reflectors and in which the inclined surface areas of the other reflectors (that is, the reflector 112 G and the reflector 112 R) are equal has been described.
- the reflector 112 whose inclined surface area is changed is arbitrary as long as the inclined surface area of the reflector 112 of the specific sub pixel 100 is different from the inclined surface areas of the other sub pixels 100 .
- the number of specific sub pixels 100 may be two or more. That is, more generally, the size of the gap between the upper portion 111 B and lower portion 111 A of the first member 111 may be varied such that the inclined surface area of the reflector of a portion of the sub pixels 100 of a pixel 10 is greater than that of the reflector of a remaining portion of the sub pixels 100 of the pixel 10 . This improves the luminance of the specific sub pixels 100 to which a reflector 112 with a greater inclined surface area is provided.
- each reflector 112 may have a different respective inclined surface area (e.g. by adjusting the size of the gap between each reflector 112 and the upper portion 111 B).
- each reflector may have the same inclined surface area (e.g. by ensuring that the size of the gap between each of the reflectors 112 and the upper portion 111 B is the same), thereby providing an equally improved luminance of each of the sub pixels 100 and thus an improved overall luminance of the pixel 10 .
- FIG. 10 B shows a pixel 10 of a second variant of the sixth embodiment.
- the pixel 10 of FIG. 10 B is the same as that of FIG. 10 A , except that the lower and upper portions 111 A and 111 B of the first member 111 are separated by a gap 1003 of a constant size and that the reflector of one of the sub pixels (reflector 112 B of sub pixel 100 B, in this example) extends in a direction towards the bottom surface 1007 of the planarized layer 1000 to a greater extent than the extent to which the reflectors of the other sub pixels (reflectors 112 R and 112 G of sub pixels 100 R and 100 G, in this example) extend towards the bottom surface 1007 of the planarized layer 1000 .
- a reflector 112 (e.g. reflector 112 B) which extends towards the bottom surface 1007 of the planarised layer 1000 to a greater extent (so that the distance between a lower end 1008 of the reflector 112 and the bottom surface 1007 of the planarised layer 1000 is smaller) is said to have a greater depth.
- a reflector 112 (e.g. reflector 112 B) which extends towards the bottom surface 1007 of the planarised layer 1000 to a greater extent (so that the distance between a lower end 1008 of the reflector 112 and the bottom surface 1007 of the planarised layer 1000 is smaller) is said to have a greater depth.
- a reflector 112 (e.g.
- the reflectors 112 R and 112 G which extends towards the bottom surface 1007 of the planarised layer 1000 to a lesser extent (so that the distance between a lower end 1008 of the reflector 112 and the bottom surface 1007 of the planarised layer 1000 is smaller) is said to have a lesser depth.
- the reflector depths of the reflectors other than the reflector 112 B with the deepest reflector depth are equal to each other.
- the luminance of a specific sub pixel 100 is increased by differing the reflector depth of the reflector 112 of the specific sub pixel 100 among the four sub pixels 100 .
- the reflector depth of the reflector 112 B of the sub pixel 100 B is greater than that of the other sub pixels (as shown in FIG. 10 B )
- a region in which light from the organic light emitting element 101 B undergoes total reflection increases.
- the greater reflector depth provides a greater surface area of the reflector from which light emitted by the light emitting element 101 B is reflected.
- the luminance of the sub pixel 100 B relative to that of the other sub pixels is therefore improved.
- the reflector depth of the reflector 112 is changed without changing the light emitting area or the pitch arrangement of each sub pixel 100 , it is possible to easily achieve high definition.
- the reflector depth of the reflector 112 with respect to the organic light emitting element 101 serving as the light emitting portion is determined for each sub pixel 100 so that only the reflector depth of the reflector 112 of the specific sub pixel 100 is different from the reflector depth of the reflectors 112 of the other sub pixels 100 . Accordingly, in the pixel 10 of FIG. 10 B , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of the specific sub pixel 100 by causing that sub pixel 100 to have a different luminance. In the case of increasing the luminance of sub pixel 100 B using a reflector 112 B with a reflector depth relative to that of the other sub pixels 100 R and 100 G, each of the sub pixels 100 can achieve the same (or similar) lifespan deterioration.
- the example in which the reflector depth of the reflector 112 B is greater than that of the other reflectors and in which the reflector depth of the other reflectors (that is, the reflector 112 G and the reflector 112 R) are equal has been described.
- this is only an example, and the reflector 112 whose reflector depth is changed is arbitrary as long as the reflector depth of the reflector 112 of the specific sub pixel 100 is different from the reflector depths of the other sub pixels 100 .
- each reflector 112 (or, at least, each of a portion of the reflectors 112 ) may have a different respective reflector depth.
- each reflector may have the same reflector depth, thereby providing an equally improved luminance of each of the sub pixels 100 and thus an improved overall luminance of the pixel 10 .
- the pixels 10 of FIGS. 10 A and 10 B use colored light emitting elements 101 R, 101 B and 101 G, it will be appreciated that, alternatively, white light emitting elements 101 R, 101 B and 101 G could be used.
- the pixel 10 comprises a further layer attached to the bottom surface 1007 of the planarized layer 1000 comprising appropriate color filters (like those shown in FIGS. 5 , 6 , 7 and 8 A and 8 B , for example).
- a red color filter e.g. color filter 101 R
- a blue color filter e.g. color filter 131 B
- a green color filter e.g. color filter 131 G
- FIG. 11 shows a main part cross-sectional view illustrating a part of a structure of a bottom emission sub pixel 100 according to a seventh embodiment.
- each sub pixel 100 comprises the structure shown in FIG. 11 .
- the sub pixel 100 comprises a substrate 1101 comprising the necessary pixel circuitry (not shown).
- the substrate 1101 is a thin film transistor (TFT) substrate, for example.
- a planarized layer 1102 is formed on the substrate 1101 .
- the planarized layer 1102 is formed of, for example, a resin such as an acrylic resin, a polyimide resin, a silicon resin or the like.
- An anode 121 is formed over a first portion of the planarized layer 1102 .
- An insulating layer 1103 is formed over a second portion of the planarized layer 1102 .
- the insulating layer 1103 is formed of an insulating material.
- the insulating layer 1103 may be formed of, for example, a resin such as an acrylic resin, a polyimide resin, a silicon resin or the like.
- the planarized layer 1102 and insulating layer 1103 may be made of the same or different materials.
- a groove 1106 is formed over a third portion of the planarized layer 1102 .
- the groove 1106 extends through the insulating layer 1103 and into the planarized layer 1102 .
- An organic layer 1104 (comprising a light emitting layer) and a cathode layer 1105 are formed as adjacent layers (forming a combined layer) over the anode 121 , insulating layer 1103 and the inside surface of the groove 1106 .
- the anode 121 (formed of ITO, for example) is transparent.
- the cathode 1105 (formed of Al, Cu or the like, for example) is reflective.
- the formation of the organic layer 1104 and cathode 1105 over the anode 121 causes a portion of the organic layer 1104 to be in contact with both the anode 121 and the cathode 1105 .
- Light is therefore emitted by this portion of the organic layer 1104 which, together with the anode 121 and corresponding portion of the cathode 1105 , thus forms a light emitting element.
- Light rays 1107 emitted by this light emitting element travel through the anode 121 and planarized layer 1102 and are reflected at one or more of the boundary between the planarized layer 1102 (with a first refractive index) and the organic layer 14 (with a second refractive index), the boundary between the organic layer 1104 and the cathode 1105 (with a third refractive index), and the reflective cathode 1105 .
- a pixel comprising sub pixels 100 of the type shown in FIG. 11 is manufactured by first forming the substrate 1101 (e.g. TFT substrate) using a suitable process (such processes are known in the art and are therefore not discussed in detail here). Then, the planarized layer 1102 is formed on the substrate 1101 using a planarizing process. Then, the anode 121 is formed on the planarized layer 1102 . This is done using a CVD (chemical vapor deposition) film forming process, for example.
- CVD chemical vapor deposition
- the insulating layer 1103 is then formed on the planarized layer 1102 and anode 121 . This is carried out using a further planarizing process, for example. Portions of the insulating layer 1103 and/or planarized layer 1102 are then removed in order to expose the anode 121 and form the groove 1106 .
- This is carried out by, for example, repeatedly forming a photoresist layer on the insulating layer 1103 and/or planarized layer 1102 , exposing a portion of the photoresist layer to a predetermined pattern of light, carrying out a developing process to remove the exposed portion of the photoresist layer and etching a portion of the insulating layer 1103 and/or planarized layer 1102 exposed by the removed portion of the photoresist layer. This process is repeated to etch away successive layers of the insulating layer 1103 and/or planarized layer 1102 until the anode 121 is exposed and the groove 1106 is formed.
- the organic and cathode layers 1104 and 1105 are then deposited over the exposed anode 121 , the remaining portions of the insulating layer 1103 and the inside surface of the groove 1106 (again using a CVD film forming process, for example).
- the organic layer 1104 may be deposited on the anode 121 only (that is, not over the remaining portions of the insulating layer 1103 and the inside surface of the groove 1106 ) whilst the cathode layer 1105 is deposited over the exposed anode 121 , the remaining portions of the insulating layer 1103 and the inside surface of the groove 1106 .
- FIGS. 12 A and 12 B each show a main part cross-sectional view illustrating a part of a structure of a bottom emission pixel according to variants of an eighth embodiment.
- a structure of a pixel 10 according to the eighth embodiment will be described below with reference to these main part cross-sectional views.
- the pixels 10 of FIGS. 12 A and 12 B are each the same as that of FIG. 10 A except that, rather than having a first member comprising an upper portion 111 B comprising the light emitting elements 101 R, 101 B and 101 G of each sub pixel 100 R, 100 B and 100 G and a lower portion 111 A comprising a reflector 112 R, 112 B and 112 G of each sub pixel 100 R, 100 B and 100 G, there is a one piece first member 111 and the reflectors 112 R, 112 B and 112 G are the boundaries of notch portions 1200 at which light emitted by each of the light emitting elements 101 is reflected by internal reflection (e.g. total internal reflection).
- the notch portions 1200 provide gaps (e.g.
- the material a resin such as an acrylic resin, a polyimide resin, a silicon resin or the like
- the material a resin such as an acrylic resin, a polyimide resin, a silicon resin or the like
- the notch portions 1200 of FIGS. 12 A and 12 B are positioned with respect to the first member 111 similarly to the way in which the portions of material forming the lower portion 111 A forming the reflectors 112 of FIG. 10 A are positioned with respect to the upper portion 111 B. That is, an upper surface 1201 of each notch portion is separated from the first member 111 by a varying distance.
- the distance between the respective upper surfaces 1201 of notch portions 1200 B and 1200 C comprising the reflector of one of the sub pixels (reflector 112 B of sub pixel 100 B, in this example) and the first member 111 is smaller than the distance between the respective upper surfaces 1201 of the remaining notch portions 1200 A, 1200 D and 1200 E comprising at least part of each of the reflectors of the other sub pixels (reflectors 112 R and 112 G of sub pixels 100 R and 100 G in this example) and the first member 111 .
- the surface 1203 of the first member 111 facing the notch portions comprises a planarized layer 1202 in which the notch portions 1200 are formed.
- the planarized layer 1202 is formed of a transmissive material through which light emitted by each of the light emitting elements 101 R, 101 B and 101 G can pass.
- the planarized layer 1202 may be formed of, for example, a resin such as an acrylic resin, a polyimide resin, a silicon resin or the like.
- a separate notched layer 1203 (formed of a further resin, for example) is provided on the planarized layer 1203 and it is the separate notched layer into which the notch portions 1200 are formed.
- the surface area of the reflector 112 B of sub pixel 100 B is greater than the surface area of reflectors 112 R and 112 G of sub pixels 100 R and 100 G.
- the luminance of a specific sub pixel 100 is increased because of the differing surface area of the reflector 112 of the specific sub pixel 100 among the four sub pixels 100 .
- the surface area of the reflector 112 B of the sub pixel 100 B is higher than that of the other sub pixels (as shown in FIGS. 12 A and 12 B )
- a region in which light from the organic light emitting element 101 B undergoes total reflection increases, and thus the luminance of the sub pixel 100 B relative to that of the other sub pixels is improved.
- the inclined surface area of the reflector 112 is changed without changing the light emitting area or the pitch arrangement of each sub pixel 100 , it is possible to easily achieve high definition.
- the surface area of the reflector 112 with respect to the organic light emitting element 101 serving as the light emitting portion is determined for each sub pixel 100 so that only the surface area of the reflector 112 of the specific sub pixel 100 is different from the inclined surface areas of the reflectors 112 of the other sub pixels 100 . Accordingly, in the pixel 10 of FIGS. 12 A and 12 B , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of the specific sub pixel 100 by causing that sub pixel 100 to have a different luminance. In the case of increasing the luminance of sub pixel 100 B using a reflector 112 B with a higher surface area relative to that of the other sub pixels 100 R and 100 G, each of the sub pixels 100 can achieve the same (or similar) lifespan deterioration.
- FIGS. 12 A and 12 B the example in which the surface area of the reflector 112 B is higher than that of the other reflectors and in which the surface areas of the other reflectors (that is, the reflector 112 G and the reflector 112 R) are equal has been described.
- the reflector 112 whose surface area is changed (by determining the size of the gap between the notch portion whose boundary defines that reflector 112 and the first member 111 ) is arbitrary as long as the surface area of the reflector 112 of the specific sub pixel 100 is different from the inclined surface areas of the other sub pixels 100 .
- the number of specific sub pixels 100 may be two or more. That is, more generally, the distance between the upper surface 1201 of each notch portion and the first member 111 may be varied such that the surface area of the reflector of a portion of the sub pixels 100 of a pixel 10 is greater than that of the reflector of a remaining portion of the sub pixels 100 of the pixel 10 . This improves the luminance of the specific sub pixels 100 to which a reflector 112 with a greater surface area is provided.
- each reflector 112 may have a different respective inclined surface area (e.g. by adjusting the distance between the upper surface 1201 of each notch portion and the first member 111 ).
- each reflector may have the same inclined surface area (e.g. by ensuring that the distance between the upper surface 1201 of each of the notch portions 1200 and the first member 111 is the same), thereby providing an equally improved luminance of each of the sub pixels 100 and thus an improved overall luminance of the pixel 10 .
- the notch portions 1200 of FIGS. 12 A and 12 B may a similar arrangement to that of FIG. 10 A instead of FIG. 10 B .
- the distance between the upper surface 1201 of each of the notch portions 1200 and the first member 111 may be the same and a portion of the notch portions 1200 (e.g. the notch portions 1200 B and 1200 C comprising the reflector 112 B of sub pixel 100 B) may extend in a direction towards the bottom surface 1204 of the planarized layer 1202 or notched layer 1203 to a greater extent (providing a greater reflector depth) than the extent to which a remaining portion of the notch portions 1200 (e.g. the remaining notch portions 1200 A, 1200 D and 1200 E) extend towards the bottom surface 1204 of the planarized layer 1202 or notched layer 1203 (providing a less reflector depth).
- the pixels 10 of FIGS. 12 A and 12 B use colored light emitting elements 101 R, 101 B and 101 G, it will be appreciated that, alternatively, white light emitting elements 101 R, 101 B and 101 G could be used.
- the pixel 10 comprises a further layer attached to the bottom surface 1204 of the planarized layer 1202 or notched layer 1203 comprising appropriate color filters (like those shown in FIGS. 5 , 6 , 7 and 8 A and 8 B , for example).
- a red color filter e.g. color filter 101 R
- a blue color filter e.g. color filter 131 B
- a green color filter e.g. color filter 131 G
- each reflector 112 comprises a light reflecting surface (e.g. a reflective surface of first member 111 or a boundary between a material with a higher refractive index and a material with a lower refractive index) with an area which may be different for one or more of the sub pixels 100 of each pixel 10 in order to change amount of reflected light for those sub pixels 100 and thus the output luminance of those sub pixels 100 .
- a light reflecting surface e.g. a reflective surface of first member 111 or a boundary between a material with a higher refractive index and a material with a lower refractive index
- the light reflecting surface of each sub pixel 100 is an inclined surface and the area of the inclined surface of each sub pixel 100 is determined according to a length along which that inclined surface extends in a stacking direction (with the greater the length of the inclined surface, the greater the area over which light is reflected and the greater the amount of light which is reflected).
- the inclined surfaces of all reflectors 112 extend from a common plane and the length along which each inclined surface extends is determined by the height or depth of that inclined surface.
- the common plane is the plane along which each of the light emitting elements 101 is defined.
- the common plane is the top surface of the lower portion 111 A of the first member 111 (which is parallel to the plane along which the light emitting elements 101 are defined and separated from the plane along which the light emitting elements 101 are defined by the gap 1003 ).
- At least one inclined surface extends from a plane at a different position in the stacking direction to the plane(s) at which each of the other inclined surface(s) extends.
- Each inclined surface may, however, extend such that all inclined surfaces meet in a common plane.
- the inclined surface of reflector 112 B extends from a different plane to that of the inclined surfaces of the other reflectors. However, all the inclined surfaces extend to meet in a common plane. In FIG.
- the common plane is that defined by the top of the first member 111 (on which the color filters 131 are arranged).
- the common plane is that defined by the top of the upper portion 111 B of the first member 111 .
- the common plane is that defined by the bottom of the lower portion 111 A of the first member 111 .
- the common plane is that defined by the bottom of the planarized layers 1202 and 1203 , respectively. The length along which each inclined surface extends is therefore varied by the position of the plane from which that inclined surface extends to the common plane.
- the length along which an inclined surface of each sub pixel 100 extends in the stacking direction may be referred to as the height or depth of that inclined surface relative to the light emitting portion of that sub pixel 100 .
- “height” and “depth” are relative terms in that something measured as a “height” may equally be measured as a “depth” if the length concerned is considered from a different perspective (e.g. if FIG. 5 is viewed upside down, then the “height” of each reflector 112 becomes a “depth” and if FIG.
- each reflector 112 becomes a “height”.
- the terms “height” and “depth” should therefore be considered functionally equivalent and the terms “height” or “depth” may be used interchangeably with the expression “length which extends in a stacking direction”.
- the length along which each reflector 112 extends in the stacking direction may also be referred to, more generally, as the distance between a first plane which is coplanar with a first end of the reflector 112 (e.g. the top of the reflector in the stacking direction) and a second plane which is coplanar with a second end of the reflector 112 (e.g. the bottom of the reflector in the stacking direction).
- the term “stacking direction” should be understood to mean the direction in which the display element 1 comprising the pixels 10 and sub pixels 100 is formed by successively stacking one layer on top of another.
- the layers include, for example, the first member 111 (including, where present, the lower portion 111 A and upper portion 111 B of the first member 111 ), the anode, organic layer and cathode of each light emitting element 101 and, where present, one or more planarized layers (such as planarized layers 907 , 1000 , 1106 , 1202 and 1203 ).
- a plurality of pixels (each of which may comprise a plurality of sub pixels or may itself be a sub pixel) arranged in a two-dimensional form include a first pixel, a second pixel and a third pixel.
- a first light reflecting portion (reflector 112 ) is located between the first pixel and the second pixel (so as to reflect light emitted by either the first or second pixel) and a second light reflecting portion (reflector 112 ) is located between the second pixel and the third pixel (so as to reflect light emitted by either the second or third pixel).
- the height of the first and second light reflecting portions may be the same (in order to improve the perceived luminance of each pixel from which light is reflected equally). Alternatively, the height of the first and second light reflecting portions may be different (in order to improve the perceived luminance of one pixel from which light is reflected over another).
- each reflector 112 is an inclined reflective surface and that each pixel (which may comprise a plurality of sub pixels or may itself be a sub pixel) emits light which is reflected by one or more of these surfaces.
- each pixel which may comprise a plurality of sub pixels or may itself be a sub pixel
- emits light which is reflected by one or more of these surfaces For example, in each of FIGS. 5 , 6 , 7 , 8 A, 8 B, 9 A, 9 C, 10 A, 10 B, 12 A and 12 B , each of the sub pixels 100 emits light which is reflected by two inclined surfaces (that is, each sub pixel is said to have two inclined surfaces).
- the blue sub pixel 100 B emits light which is reflected by two inclined surfaces (that is, the blue sub pixel 100 B has two inclined surfaces), each of one of the red sub pixels 100 R and the green sub pixel 100 G emits light which is reflected by one inclined surface (that is, each of these sub pixels has one inclined surface) and the remaining red sub pixel 100 R emits light which is not reflected by an inclined surface (that is, this sub pixel has no inclined surface).
- a different perceived luminance of a first pixel relative to a second pixel is achieved by changing the height of at least one inclined reflective surface of the first pixel with respect to the height of at least one inclined reflective surface of the second pixel so as to change the overall area over which light emitted by the first pixel is reflected with respect to the overall area over which light emitted by the second pixel is reflected.
- FIG. 13 is a conceptual diagram for describing reflection of light by the reflector 112 .
- the light from (the anode electrode 121 of) the organic light emitting element 101 to the reflector 112 is omnidirectional, but the reflector 112 reflects light incident at a predetermined total reflection angle or more but transmits light incident at less than the angle.
- the light beams L 2 and L 3 among light beams L 1 to L 4 from the anode electrode 121 of the organic light emitting element 101 are totally reflected by the reflector 112 , while the light beam L 4 passes through the reflector 112 .
- FIG. 14 illustrates a relation between a distance L (unit: nm) to the inclined surface of the reflector 112 and an inclined surface height H (unit: nm) of the reflector 112 at which the total reflection is performed.
- the distance L to the inclined surface of the reflector 112 is a maximum of 2,000 nm.
- the height H satisfying the total reflection condition is approximately 1,600 nm from the relation between L and H illustrated in FIG. 14 .
- the height (inclined surface height) H satisfying the total reflection condition can be obtained by, for example, the following calculation.
- ⁇ an incidence angle (reflection angle) of light incident on the reflector 112 is indicated by ⁇
- ⁇ an incidence angle (reflection angle) of light incident on the reflector 112 is indicated by ⁇
- the height (inclined surface height) H satisfying the total reflection condition is obtained.
- a refractive index nA of the reflector 112 for example, SiO
- a refractive index nB of an organic EL material of the organic layer for example, a layer 141 of FIG. 22 to be described later
- the inventors of the present technology analyzed the optimum reflector angle ⁇ and the width of the opening portion between the reflectors 112 (the size of the opening portion) by obtaining a change in the height (inclined surface height) H satisfying the total reflection condition in a case in which the reflector angle ⁇ is changed by a detailed simulation.
- the result of the simulation is illustrated in FIG. 16 .
- a table of FIG. 16 illustrates a value (unit: nm) of the height (inclined surface height) satisfying the total reflection condition (unit: degree) when the value (unit: degree) of reflector angle ⁇ and the value (unit: nm) of the distance L to the inclined surface of the reflector 112 are changed.
- the width of the portion in which the organic light emitting element 101 serving as the light emitting portion emits (the portion in which the anode electrode 121 is exposed), that is, the size of the opening portion be 3000 nm or less, and in that case, it is desirable that the reflector angle ⁇ is 60° to 80°.
- a dry processing process is performed as illustrated in A of FIG. 18 .
- anode electrodes 121 R and 121 G are formed on a first member 111 A.
- SiO 2 or the like can be used as a material of the first member 111 A.
- a reflective material such as Al, Cu or the like can be used as the material of the anode electrode 121 .
- a CVD film forming process is performed as illustrated in B of FIG. 18 .
- a first member 111 B is formed on the anode electrodes 121 R and 121 G formed on the first member 111 A.
- P—SiO or the like can be used as a material of the first member 111 B.
- a resist coating process is performed as illustrated in C of FIG. 18 .
- the first member 111 B is coated with a photoresist 211 .
- an exposure process is performed as illustrated in D of FIG. 19 .
- a surface of the photoresist 211 is exposed to light in a pattern form using a photomask 221 , so that a pattern including the exposed portion (an exposed portion 212 ) and an unexposed portion (a portion excluding the exposed portion 212 ) is formed.
- a developing process is performed as illustrated in E of FIG. 19 .
- the exposed portion 212 of the photoresist 211 is removed.
- an etching process is performed as illustrated in F of FIG. 19 .
- the portion excluding the portion masked by the photoresist 211 is etched, and a part of the first member 111 B is processed.
- a resist coating process is performed as illustrated in G of FIG. 20 .
- the processed portion of the first member 111 B is coated with the photoresist 211 .
- an exposure process is performed as illustrated in H of FIG. 20 .
- a surface of the photoresist 211 is exposed to light in a pattern form using a photomask 231 , so that a pattern including the exposed portions (exposed portions 213 and 214 ) and an unexposed portion (a portion excluding the exposed portions 213 and 214 ) is formed.
- a developing process is performed as illustrated in I of FIG. 20 .
- the exposed portions 213 and 214 of the photoresist 211 are removed.
- an etching process is performed as illustrated in J of FIG. 21 .
- the portion excluding the portion masked by the photoresist 211 is etched, and a part of the first member 111 B is processed.
- the 30 reflectors having different heights in the respective sub pixels 100 are formed, and the anode electrodes 121 R and 121 G on the first member 111 A are exposed.
- a resist peeling process is performed as illustrated in K of FIG. 21 .
- the photoresist 211 is peeled off.
- a vapor deposition process and a CVD film forming process are performed as illustrated in L of FIG. 21 .
- a layer 141 including an organic layer and a cathode electrode layer (formed of a transparent material such as ITO, for example) and a protective film 142 are formed on the surface of the anode electrodes 121 R and 121 G and the first member 111 B formed on the first member 111 A.
- the organic layer emits light between the anode electrode and the cathode electrode layer.
- it is desirable that the organic layer emit white light.
- an insulating material, a conductive material, or the like can be used as a material of the protective film 142 .
- a planarizing process is performed as illustrated in M of FIG. 22 .
- a resin such as an acrylic resin, a polyimide resin, a silicon resin, or the like can be used as a material of the second member 151 .
- the second member 151 is further formed, so that the light reflecting layer (reflector structure) including the first member 111 ( 111 B) and the second member 151 is formed.
- a color filter forming process is performed as illustrated in N of FIG. 22 .
- color filters 131 R and 131 G are formed on the planarized second member 151 .
- the respective sub pixels 100 differ in luminance, and thus it is possible to improve the luminance of the specific sub pixel 100 .
- a dry processing process is performed as illustrated in A of FIG. 23 .
- anode electrodes 121 R, 121 G, 121 W, and 121 B are formed on a first member 111 A.
- SiO 2 or the like can be used as a material of the first member 111 A.
- a reflective material such as Al, Cu or the like can be used as the material of the anode electrode 121 .
- a CVD film forming process is performed as illustrated in B of FIG. 23 .
- a first member 111 B is formed on the anode electrodes 121 R, 121 G, 121 W, and 121 B formed on the first member 111 A.
- P—SiO or the like can be used as a material of the first member 111 B.
- a resist coating process is performed as illustrated in C of FIG. 23 .
- the first member 111 B is coated with a photoresist 311 .
- an exposure process is performed as illustrated in D of FIG. 24 .
- a surface of the photoresist 311 is exposed to light in a pattern form using a photomask 321 , so that a pattern including the exposed portion (an exposed portion 312 ) and an unexposed portion (a portion excluding the exposed portion 312 ) is formed.
- a developing process is performed as illustrated in E of FIG. 24 .
- the exposed portion 312 of the photoresist 311 is removed.
- an etching process is performed as illustrated in F of FIG. 24 .
- the portion excluding the portion masked by the photoresist 311 is etched, and a part of the first member 111 B is processed.
- a resist coating process is performed as illustrated in G of FIG. 25 .
- the processed portion of the first member 111 B is coated with the photoresist 311 .
- an exposure process is performed as illustrated in H of FIG. 25 .
- a surface of the photoresist 311 is exposed to light in a pattern form using a photomask 331 , so that a pattern including the exposed portions (exposed portions 313 , 314 , 315 , and 316 ) and an unexposed portion (a portion excluding the exposed portions 313 , 314 , 315 , and 316 ) is formed.
- a developing process is performed as illustrated in I of FIG. 25 .
- the exposed portions 313 , 314 , 315 , and 316 of the photoresist 311 are removed.
- an etching process is performed as illustrated in J of FIG. 26 .
- the portion excluding the portion masked by the photoresist 311 is etched, and a part of the first member 111 B is processed.
- the reflectors having different heights in the respective sub pixels 100 are formed, and the 30 anode electrodes 121 R, 121 G, 121 W, and 121 B on the first member 111 A are exposed.
- a resist peeling process is performed as illustrated in K of FIG. 26 .
- the photoresist 311 is peeled off.
- a vapor deposition process and a CVD film forming process are performed as illustrated in L of FIG. 26 .
- a layer 141 including an organic layer and a cathode electrode layer (formed of a transparent material such as ITO, for example) and a protective film 142 are formed on the surface of the anode electrodes 121 R, 121 G, 121 W, and 121 B and the first member 111 B formed on the first member 111 A.
- the organic layer emits light between the anode electrode and the cathode electrode layer.
- an insulating material, a conductive material, or the like can be used as a material of the protective film 142 .
- a planarizing process is performed as illustrated in M of FIG. 27 .
- a second member 151 is embedded and planarized.
- a resin such as an acrylic resin, a polyimide resin, a silicon resin, or the like can be used as the second member.
- the second member 151 is further formed, so that the light reflecting layer (reflector structure) including the first member 111 ( 111 B) and the second member 151 is formed.
- a color filter forming process is performed as illustrated in N of FIG. 27 .
- color filters 131 R, 131 G, and 131 B are formed on the planarized second member 151 .
- the respective sub pixels 100 differ in luminance, and thus it is possible to improve the luminance of the specific sub pixel 100 .
- the pixel 10 is described as being the WRGB pixel, that is, including the four sub pixels 100 R, 100 G, 100 B, and 100 W, but the configuration of the sub pixel 100 is not limited thereto.
- the pixel 10 may not include the sub pixel 100 W and may include three sub pixels 100 R, 100 G, and 100 B. Further, for example, a sub pixel 100 of another color having high visibility equal to that of white (W) may be used instead of the white (W) sub pixel 100 W. Further, in the pixel 10 , the arrangement order of a plurality of sub pixels 100 may be an arbitrary order that differs for each color.
- the inclined surface height of the reflector 112 is adjusted for each sub pixel 100
- the position of the anode electrode 121 side is adjusted for each sub pixel 100
- the adjustments may be performed at the same time.
- both the inclined surface height of the reflector 112 and the position on the anode electrode 121 side may be adjusted for each sub pixel 100 .
- a material and a thickness of each layer, a film forming method, a 25 film forming conditions, and the like described in the above embodiments are not limited to the above description, and other materials and thicknesses, or other film forming methods, and other film forming conditions may be used. Further, in the above-described embodiments and the like, the configuration of the organic light emitting element 101 has been specifically described, but it is not necessary to include all the layers, and another layer may be further included.
- the configuration of the active matrix type display element has been described, but the present technology can be also applied to a passive matrix type display element (display device).
- the configuration of the pixel drive circuit for active matrix driving is not limited to that described in the above embodiments, and a capacitive element, a transistor, or the like may be added if necessary.
- a necessary drive circuit may be appropriately added with a change in the pixel drive circuit.
- FIG. 28 illustrates an example of an external appearance of a single-lens reflex camera (a lens interchangeable single-lens reflex type digital camera) as an electronic device (an imaging apparatus) to which the display element to which an embodiment of the present technology is applied is applied.
- a single-lens reflex camera a lens interchangeable single-lens reflex type digital camera
- an electronic device an imaging apparatus
- the single-lens reflex camera includes, for example, an interchangeable photographing lens unit (interchangeable lens) 412 installed on a front right side of a camera body (camera body) 411 and a grip portion 413 installed on a front left side and gripped by a photographer.
- interchangeable photographing lens unit interchangeable lens
- camera body camera body
- grip portion 413 installed on a front left side and gripped by a photographer.
- a monitor 414 is installed substantially at a central portion of a rear surface of the camera body 411 .
- a viewfinder (eyepiece window) 415 is installed above the monitor 414 . By looking into the viewfinder 415 , the photographer can visually recognize a light image of a subject guided from the photographing lens unit 412 and decide a composition.
- This viewfinder 415 is constituted by the display element (display element 1 ) to which an embodiment of the present technology described above is applied.
- FIG. 29 illustrates an example of an external appearance of a head mounted display (HMD) as an electronic device to which the display element to which an embodiment of the present technology is applied is applied.
- HMD head mounted display
- the head mounted display includes, for example, ear hook portions 512 worn on a head of a user formed on both sides of a glasses type display unit 511 .
- the display unit 511 is constituted by the display element (display element 1 ) to which an embodiment of the present technology is applied.
- the user wearing the head mounted display of A of FIG. 29 on the head can view a virtual reality (VR) video displayed on the display unit 511 .
- VR virtual reality
- a of FIG. 29 illustrates an example of a non-transmissive type head mounted display completely covering the eyes of the user, but a display unit 521 of a transmissive type (for example, video transmissive type or the like) head mounted display may be constituted by the display element (display element 1 ) to which an embodiment of the present technology is applied as illustrated in B of FIG. 29 .
- a transmissive type for example, video transmissive type or the like
- the user wearing the head mounted display of B of FIG. 29 on the head can view an augmented reality (AR) image displayed on the display unit 521 .
- AR augmented reality
- the single-lens reflex camera and the head mounted display are illustrated as the electronic devices to which the display element to which an embodiment of the present technology is applied is applied, but the display element to which an embodiment of the present technology is applied may be applied to an electronic device such as, for example, a smartphone, a television receiver, a personal computer, a video camera, a mobile phone, a game machine, a wearable device, or the like.
- a display element including: a display region including pixels arranged in a two-dimensional form, each of the pixels including a plurality of sub pixels. In each pixel, a height of a light reflecting portion with respect to a light emitting portion is adjusted for each sub pixel.
- a display region including pixels arranged in a two-dimensional form is provided, each of the pixels including a plurality of sub pixels.
- a height of a light reflecting portion with respect to a light emitting portion is adjusted for each sub pixel.
- an electronic device including a display element including a display region including pixels arranged in a two-dimensional form, each of the pixels including a plurality of sub pixels. In each pixel, a height of a light reflecting portion with respect to a light emitting portion is adjusted for each sub pixel.
- An electronic device is equipped with a display element in which a display region including pixels arranged in a two-dimensional form is provided, each of the pixels including a plurality of sub pixels. In each pixel, a height of a light reflecting portion with respect to a light emitting portion is adjusted for each sub pixel.
- the display element or the electronic device according to embodiments of the present technology may be an independent device or an internal block constituting one device.
- a display element including:
- each pixel includes a first sub pixel, a second sub pixel, and a third sub pixel that emit three basic colors of light and a fourth sub pixel that emits a non-basic color of light.
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Abstract
There is provided a display element, including: a display region including pixels arranged in a two-dimensional form, each of the pixels including a plurality of sub pixels. In each pixel, a height of a light reflecting portion with respect to a light emitting portion is adjusted for each sub pixel.
Description
- The present application is a Continuation of application Ser. No. 16/955,917, filed Jun. 19, 2020, which is a 371 National Stage Entry of International Application No.: PCT/JP2018/047187, filed on Dec. 21, 2018, which claims the benefit of Japanese Priority Patent Application JP 2017-248697 filed on Dec. 26, 2017, the entire contents of which are incorporated herein by reference.
- The present technology relates to a display element and an electronic device, and more particularly, to a display element and an electronic device which are capable of improving luminance of pixels.
- This application claims the benefit of Japanese Priority Patent Application JP 2017-248697 filed Dec. 26, 2017, the entire contents of which are incorporated herein by reference.
- In recent years, as a light emitting element which emits light by itself when a voltage is applied, a light emission type display element such as an organic EL display element using an organic light emitting diode (OLED) in which a phenomenon called organic electroluminescence (organic EL) is applied has been developed.
- In the organic EL display element, if light extraction efficiency is poor, an actual light emission amount in the organic EL element is not used effectively, leading to a loss in terms of power consumption or the like, and thus there is a demand for a technique of extracting light efficiently.
- As a technique for improving light extraction efficiency, for example, a technique disclosed in
PTL 1 is known. A technique related to an anode reflector structure which reflects some of light propagated on a member surface using a difference in a refractive index between members is disclosed inPTL 1. -
- JP 2013-191533A
- In the organic EL display element, a method of increasing a light emitting area by increasing a size of a specific pixel in order to improve luminance of each pixel can be used, but in a case in which such a method is employed, since a pixel pitch changes, it is difficult to achieve high definition. For this reason, there is a demand for a technique of improving luminance of pixels more appropriately.
- It is desirable to make it possible to improve the luminance of the pixels.
- The present technology is defined by the claims.
- According to an embodiment of the present technology, the luminance of pixels can be improved.
- Further, the effect described here is not necessarily limiting, and any effect described in the present disclosure may be included.
-
FIG. 1 is a block diagram illustrating an example of a configuration of one embodiment of a display element to which the present technology is applied. -
FIG. 2 is a circuit diagram illustrating an example of a configuration of a pixel drive circuit. -
FIG. 3 is a plan view illustrating an example of a configuration of a display region. -
FIG. 4 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a related art. -
FIG. 5 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a first embodiment. -
FIG. 6 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a second embodiment. -
FIG. 7 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a third embodiment. -
FIGS. 8A and 8B each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of a fourth embodiment. -
FIGS. 9A, 9B and 9C each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of a fifth embodiment. -
FIGS. 10A and 10B each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of a sixth embodiment. -
FIG. 11 shows a main part cross-sectional view illustrating a part of a structure of a bottomemission sub pixel 100 according to a seventh embodiment. -
FIGS. 12A and 12B each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of an eighth embodiment. -
FIG. 13 is a conceptual diagram for describing reflection of light by a reflector. -
FIG. 14 is a diagram illustrating a relation between a distance to an inclined surface of a reflector and a height of the reflector at which total reflection is performed. -
FIG. 15 is a conceptual diagram for describing the reflection of light by a reflector. -
FIG. 16 is a table illustrating a change in a height of a reflector satisfying a total reflection condition in a case in which a reflector angle is changed. -
FIG. 17 is a diagram illustrating an example of a structure of a reflector satisfying a predetermined total reflection condition. -
FIG. 18 is a diagram for describing a flow of a first example of a pixel manufacturing process according to an embodiment of the present technology. -
FIG. 19 is a diagram for describing a flow of a first example of a pixel manufacturing process according to an embodiment of the present technology. -
FIG. 20 is a diagram for describing a flow of a first example of a pixel manufacturing process according to an embodiment of the present technology. -
FIG. 21 is a diagram for describing a flow of a first example of a pixel manufacturing process according to an embodiment of the present technology. -
FIG. 22 is a diagram for describing a flow of a first example of a pixel manufacturing process according to an embodiment of the present technology. -
FIG. 23 is a diagram for describing a flow of a second example of a pixel manufacturing process according to an embodiment of the present technology. -
FIG. 24 is a diagram for describing a flow of a second example of a pixel manufacturing process according to an embodiment of the present technology. -
FIG. 25 is a diagram for describing a flow of a second example of a pixel manufacturing process according to an embodiment of the present technology. -
FIG. 26 is a diagram for describing a flow of a second example of a pixel manufacturing process according to an embodiment of the present technology. -
FIG. 27 is a diagram for describing a flow of a second example of a pixel manufacturing process according to an embodiment of the present technology. -
FIG. 28 is a diagram illustrating an example of an external appearance of a single-lens reflex camera as an electronic device to which a display element to which an embodiment of the present technology is applied is applied. -
FIG. 29 is a diagram illustrating an example of an external appearance of a head mounted display as an electronic device to which a display element to which an embodiment of the present technology is applied is applied. - Hereinafter, embodiments of the present technology will be described with reference to the appended drawings. Further, the description will proceed in the following order.
- 2. Modified example
3. Example of electronic device -
FIG. 1 is a block diagram illustrating an example of a configuration of one embodiment of a display element to which the present technology is applied. - In
FIG. 1 , adisplay element 1 is a light emission type display element (display device) such as an organic EL display element using, for example, an organic light emitting diode (OLED). - As illustrated in
FIG. 1 , in thedisplay element 1, a plurality of pixels (sub pixels substrate 11 made of, for example, glass, a silicon wafer, or a resin, so that adisplay region 23 is formed. Further, a signalline drive circuit 21 and a scanline drive circuit 22 which are drivers for video display are formed on the periphery of thedisplay region 23. - A
pixel drive circuit 33 is formed in thedisplay region 23.FIG. 2 illustrates an example of a configuration of thepixel drive circuit 33. - As illustrated in
FIG. 2 , thepixel drive circuit 33 is an active type drive circuit including a drive transistor Tr1, a write transistor Tr2, a capacitor (retention capacitor) Cs therebetween, and organic light emitting elements 101 (101R, 101W, 101G, and 101B) connected to the drive transistor Tr1 in series between a first power line (Vcc) and a second power line (GND). - In the
pixel drive circuit 33, a plurality ofsignal lines 31 are arranged in a column direction, and a plurality ofscan lines 32 are arranged in a row direction. Crossing points of thesignal lines 31 and thescan lines 32 correspond to thesub pixels light emitting elements - Each
signal line 31 is connected to the signalline drive circuit 21, and an image signal is supplied from the signalline drive circuit 21 to a source electrode of the write transistor Tr2 via thesignal line 31. Eachscan line 32 is connected to the scanline drive circuit 22, and a scan signal is sequentially supplied from the scanline drive circuit 22 to a gate electrode of the write transistor Tr2 via thescan line 32. -
FIG. 3 illustrates an example of the plane configuration of thedisplay region 23. InFIG. 3 , the display thesub pixel 100R that generates red (R) light, thesub pixel 100W that generates white (W) light, thesub pixel 100G that generates green (G) light, and thesub pixel 100B that generates blue (B) light are sequentially formed in thedisplay region 23 in a two-dimensional form as a whole. - Further, a combination of the
adjacent sub pixels pixel 10. In other words, a plurality ofpixels 10 are arranged in thedisplay region 23 in a two-dimensional form (in a matrix form), and eachpixel 10 is constituted by foursub pixels 100 of red (R), white (W), green (G), and blue (B). In other words, in thedisplay region 23, thepixels 10 arranged in the two-dimensional form are referred to as a WRGB pixel. - In the organic EL display element, in order to improve the luminance of respective sub pixels constituting a pixel, it is possible to cope with it by changing a size of a sub pixel. However, in a case in which the method of increasing the light emitting area by increasing a size of a specific sub pixel among pixels is employed, since the pixel pitch is changed, it is difficult to achieve high definition.
- Specifically, as illustrated in
FIG. 4 , in a pixel 90 including four sub pixels 900, a structure in which a light emitting area of a light emitting portion in a sub pixel 900W among the four sub pixels 900 is increased in order to improve luminance of the sub pixel 900W is assumed. - In this structure, since the light emitting area is increased only in the sub pixel 900W, the pixel pitch of the sub pixel 900W is different from the pixel pitches of the other sub pixels 900R, 900G, and 900B. Further, as described above, if the pixel pitch is changed for each sub pixel 900, it is difficult to achieve high definition.
- In this regard, in the present technology, it is possible to adjust the luminance of each
sub pixel 100 without changing the pixel pitch by adjusting a height of a light reflecting portion (reflector) with respect to the light emitting portion for eachsub pixel 100 constituting thepixel 10. Hereinafter, structures of thepixels 10 of the first to third embodiments will be described in order as a structure of a pixel to which an embodiment of the present technology is applied. -
FIG. 5 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a first embodiment. A structure of apixel 10 according to the first embodiment will be described below with reference to the main part cross-sectional view. - In
FIG. 5 , thepixel 10 of the first embodiment includes four sub pixels, that is, asub pixel 100R that emits red (R) light, asub pixel 100W that emits white (W) light, asub pixel 100G that emits green (G) light, and asub pixel 100B that emits blue (B) light. - Further, the
sub pixel 100R includes an organiclight emitting element 101R. Similarly, thesub pixels light emitting elements - The organic
light emitting element 101R is a light emitting portion including an organic layer including a light emitting layer, and an electrode. In the organiclight emitting element 101R, the organic layer has a structure sandwiched between an anode electrode and a cathode electrode, but only ananode electrode 121R is illustrated inFIG. 5 . Further, an opening portion in which theanode electrode 121R is exposed specifies the light emitting portion. - Here, the organic layer includes a light emitting layer made of an organic light emitting material, but specifically, for example, the organic layer may have a stacking structure of a hole transport layer, a light emitting layer, and an electron transport layer, a stacking structure of a hole transport layer and a light emitting layer doubling as an electron transport layer, a stacking structure of a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer, or the like. For example, it is desirable that this organic
light emitting element 101R employ a structure that emits white light. - Further, in the
sub pixel 100R, acolor filter 131R by which transmitted light becomes a red (R) region is formed for the organiclight emitting element 101R, and thesub pixel 100R generates red (R) light through such a combination. - Similarly to the organic
light emitting element 101R, the organiclight emitting element 101W is a light emitting portion including an organic layer and an electrode (including ananode electrode 121W). No color filter is formed for the organiclight emitting element 101W, and thesub pixel 100W generates white (W) light. - Similarly to the organic
light emitting element 101R, the organiclight emitting element 101G is a light emitting portion including an organic layer and an electrode (including ananode electrode 121G). Acolor filter 131G by which transmitted light becomes a green (G) region is formed for the organiclight emitting element 101G, and thesub pixel 100G generates green (G) light through such a combination. - Similarly to the organic
light emitting element 101R, the organiclight emitting element 101B is a light emitting portion including an organic layer and an electrode (including ananode electrode 121B). Acolor filter 131B by which transmitted light becomes a blue (B) region is formed for the organiclight emitting element 101B, and thesub pixel 100B generates blue (B) light through such a combination. - Further, in the
pixel 10 of the first embodiment, a reflector (light reflecting portion) is formed to improve the light extraction efficiency. - Here, the reflector includes a first member that reflects light from the organic light emitting element toward a display surface side on a first substrate and a second member which fills a space between a second substrate arranged opposite to the first substrate and a light reflection structure and has a refractive index different from a refractive index of the first member, and the reflector reflects light propagating through the second member on the surface of the first member, so that the light extraction efficiency can be improved.
- As illustrated in
FIG. 5 , in thepixel 10 of the first embodiment, areflector 112 is formed on a surface of afirst member 111 configured as a light reflecting layer (reflector structure). Further, the first member 111 (in this embodiment and in the subsequently described embodiments) can be formed using a material such as, for example, SiO2 and/or P—SiO. - Further, although not illustrated in
FIG. 4 , in thepixel 10 of the first embodiment, a second member (for example, asecond member 151 inFIG. 22 to be described later) that propagates light from each organiclight emitting element 101 and emits the light toward the outside is formed, and thefirst member 111 is formed to fill a space between the second members. In other words, the light reflecting layer (reflector structure) is formed by thefirst member 111 and the second member (for example, thesecond member 151 inFIG. 22 to be described later). - As illustrated in
FIG. 5 , in thepixel 10 of the first embodiment, the four sub pixels including thesub pixel 100R, thesub pixel 100W, thesub pixel 100G, and thesub pixel 100B differ in the height of the reflector 112 (the height of the inclined surface of the first member 111). - Here, in the
first member 111, a side wall of the opening portion in which theanode electrode 121 is exposed is inclined at a predetermined inclination angle (reflector angle), and the inclined surface (surface) forms thereflector 112. Hereinafter, the height of the inclined surface in the stacking direction is also referred to as an “inclined surface height” of thereflector 112. - In other words, in the
pixel 10 of the first embodiment, in a case in which the inclined surface heights of thereflectors 112 in therespective sub pixels 100 are compared, for example, a relation illustrated in the following Formula (1) can be obtained. -
Inclined surface height ofreflector 112W>inclined surface height ofreflector 112G>inclined surface height ofreflector 112R>inclined surface height ofreflector 112B (1) - Here, in Formula (1), the inclined surface height of the
reflector 112W corresponds to the height of the inclined surface of thefirst member 111 in thesub pixel 100W. Similarly, the inclined surface heights of thereflectors first members 111 in thesub pixels - As described above, in the
pixel 10 of the first embodiment, luminance of aspecific sub pixel 100 is increased such that the foursub pixels 100 are formed to differ in the inclined surface height of thereflector 112, and therespective sub pixels 100 differ in luminance. In particular, when the inclined surface height of thereflector 112W of thesub pixel 100W is high, a region in which light from the organiclight emitting element 101W (theanode electrode 121W) undergoes total reflection increases, and thus the luminance of thesub pixel 100W is improved, whereby the luminance of theentire pixel 10 can be improved. - Further, in the
pixel 10 of the first embodiment, since the region that reflects light, that is, the inclined surface height of thereflector 112 is changed without changing the light emitting area or the pitch arrangement in eachsub pixel 100, therespective sub pixels 100 differ in luminance, and thus it is possible to easily achieve high definition. - As described above, in the
pixel 10 of the first embodiment, the inclined surface height of thereflector 112 with respect to the organic light emitting element 101 (the anode electrode 121) serving as the light emitting portion is adjusted for eachsub pixel 100, so that the inclined surface heights of thereflector 112R, thereflector 112W, thereflector 112G, and thereflector 112B are different. Accordingly, in thepixel 10 of the first embodiment, it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of thespecific sub pixel 100 by causing eachsub pixel 100 to have different luminance. - Further, in
FIG. 5 , the example in which the inclined surface height of thereflector 112W is highest, and the inclined surface height decrease in the order of thereflector 112G, thereflector 112R, and thereflector 112B as indicated in Formula (1) has been described, but the relation indicated in Formula (1) is an example, and the order of the inclined surface heights is arbitrary as long as the inclined surface heights of thereflectors - For example, in a case in which the
respective sub pixels 100 in thepixel 10 differ in lifespan, since it is possible to reduce an applied current density by improving the luminance of thesub pixel 100, it is possible to perform an adjustment so that therespective sub pixels 100 have the same lifespan deterioration. In a case in which such an adjustment is performed, the inclined surface height of thereflector 112 can be adjusted for eachsub pixel 100 so that, for example, a relation indicated in the following Formula (1)′ is satisfied. -
Inclined surface height ofreflector 112B>inclined surface height ofreflector 112W>inclined surface height ofreflector 112G>inclined surface height ofreflector 112R 1)′ - Further, in
FIG. 5 , thesub pixels 100 constituting thepixel 10 are arranged in the order of thesub pixels FIG. 5 , but the arrangement order of thesub pixels 100 is arbitrary. Further, in addition to a case in which the inclined surface height of thereflector 112 is a uniform height like thereflector 112W of thesub pixel 100W as illustrated inFIG. 5 , a case in which the inclined surface height of thereflector 112 is not uniform is assumed, but in this case, for example, it is preferable to adjust an average value or the like of the inclined surface height of thereflector 112 for eachsub pixel 100. -
FIG. 6 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a second embodiment. A structure of apixel 10 according to the second embodiment will be described below with reference to the main part cross-sectional view. - As illustrated in
FIG. 6 , in apixel 10 of a second embodiment, among the foursub pixels 100 including thesub pixel 100R, thesub pixel 100W, thesub pixel 100G, and thesub pixel 100B, an inclined surface height of areflector 112 of aspecific sub pixel 100 is different. - In other words, in the
pixel 10 of the second embodiment (FIG. 6 ), an inclined surface height of areflector 112 of aspecific sub pixel 100 among the foursub pixels 100 is changed without changing the inclined surface height of thereflector 112 for all of the foursub pixels 100 as compared with thepixel 10 of the first embodiment (FIG. 5 ) described above. - Specifically, in
FIG. 6 , the inclined surface height of thereflector 112W only in thesub pixel 100W is changed to be higher than the inclined surface heights of thereflectors other sub pixels - In other words, in the
pixel 10 of the second embodiment, in a case in which the inclined surface heights of thereflectors 112 in therespective sub pixels 100 are compared, for example, a relation illustrated in the following Formula (2) can be obtained. -
Inclined surface height ofreflector 112W>inclined surface height ofreflector 112R=inclined surface height ofreflector 112G=inclined surface height ofreflector 112B (2) - Here, in Formula (2), the inclined surface height of the
reflector 112W corresponds to the height of the inclined surface of thefirst member 111 in thesub pixel 100W. Similarly, the inclined surface heights of thereflectors first members 111 in thesub pixels - As described above, in the
pixel 10 of the second embodiment, luminance of aspecific sub pixel 100 can be increased such that thespecific sub pixel 100 among the foursub pixels 100 is formed to differ in the inclined surface height of thereflector 112, and therespective sub pixels 100 differ in luminance. For example, when the inclined surface height of only thereflector 112W of thesub pixel 100W is high, a region in which light from the organiclight emitting element 101W (theanode electrode 121W) undergoes total reflection increases, and thus the luminance of thesub pixel 100W is improved, whereby the luminance of theentire pixel 10 can be improved. - Further, in the
pixel 10 of the second embodiment, since the inclined surface height of thereflector 112 is changed without changing the light emitting area or the pitch arrangement of eachsub pixel 100, eachsub pixel 100 has different luminance, and thus it is possible to easily achieve high definition. - As described above, in the
pixel 10 of the second embodiment, the inclined surface height of thereflector 112 with respect to the organic light emitting element 101 (the anode electrode 121) serving as the light emitting portion is adjusted for eachsub pixel 100 so that only the inclined surface height of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface heights of thereflectors 112 of theother sub pixels 100. Accordingly, in thepixel 10 of the second embodiment, it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of thespecific sub pixel 100 by causing eachsub pixel 100 to have different luminance. - Further, in
FIG. 6 , the example in which the inclined surface height of thereflector 112W is highest, and the inclined surface heights of the other reflectors, that is, thereflector 112G, thereflector 112R, and thereflector 112B are equal as indicated in Formula (2) has been described, but the relation indicated in Formula (2) is an example, and thereflector 112 whose inclined surface height is changed is arbitrary as long as the inclined surface height of thereflector 112 of the specific sub pixel 110 is different from the inclined surface heights of theother sub pixels 100. - Here, in a case in which the
respective sub pixels 100 in thepixel 10 differ in lifespan, it is possible to perform an adjustment so that therespective sub pixels 100 have the same lifespan deterioration by changing the luminance for eachsub pixel 100 as described above, but the inclined surface height of thereflector 112G of thespecific sub pixel 100G can be adjusted so that, for example, a relation indicated in the following Formula (2)′ is satisfied. -
Inclined surface height ofreflector 112B>inclined surface height ofreflector 112W=inclined surface height ofreflector 112G=inclined surface height ofreflector 112R (2)′ - Further, the example in which the inclined surface height of the
reflector 112 of onesub pixel 100 as thespecific sub pixel 100 is changed has been described, but the number ofspecific sub pixels 100 may be two or more, for example, the inclined surface heights of thereflectors sub pixels -
FIG. 7 is a main part cross-sectional view illustrating a part of a structure of a pixel according to a third embodiment. A structure of apixel 10 according to the third embodiment will be described below with reference to the main part cross-sectional view. - As illustrated in
FIG. 7 , in apixel 10 of a third embodiment, a position of ananode electrode 121 of an organiclight emitting element 101 included in aspecific sub pixel 100 among the foursub pixels 100 including thesub pixel 100R, thesub pixel 100W, thesub pixel 100G, and thesub pixel 100B is adjusted. - In other words, in the
pixel 10 of the third embodiment (FIG. 7 ), the position of theanode electrode 121 of the organic light emitting element 101 (the position in the stacking direction) is adjusted without adjusting the inclined surface height (the height in the stacking direction) of thereflector 112 in thesub pixel 100 as compared with thepixel 10 of the first embodiment (FIG. 5 ) described above and thepixel 10 of the second embodiment (FIG. 6 ). - As described above, the inclined surface height of the
reflector 112 with respect to the organic light emitting element 101 (the anode electrode 121) serving as the light emitting portion can be adjusted for eachsub pixel 100 by adjusting the position of the organic light emitting element 101 (the anode electrode 121). Accordingly, it is possible to cause the inclined surface height of thereflector 112 of thespecific sub pixel 100 to be different from the inclined surface heights of thereflectors 112 of theother sub pixels 100. - Specifically, in
FIG. 7 , only theanode electrode 121W of the organiclight emitting element 101W in thesub pixel 100W is formed with a large depth in the stacking direction, and thus the inclined surface height of thereflector 112W of thesub pixel 100W is higher than the inclined surface heights of thereflectors sub pixels - In other words, in the third embodiment, in a case in which the inclined surface heights of the
reflectors 112 in therespective sub pixels 100 are compared, for example, a relation similar to that of Formula (2) described above is obtained. - As described above, in the
pixel 10 of the third embodiment, the position of theanode electrode 121 of the organiclight emitting element 101 of thespecific sub pixel 100 among the foursub pixels 100 is adjusted so that the inclined surface height of thereflector 112 of thespecific sub pixel 100 is different, and thus it is possible to cause therespective sub pixels 100 to have different luminances, and it is possible to increase the luminance of thespecific sub pixel 100 accordingly. - For example, since the position of the
anode electrode 121W of the organiclight emitting element 101W of thesub pixel 100W is adjusted so that only thereflector 112W of thesub pixel 100W have a higher inclined surface height, the luminance of thesub pixel 100W is improved, and the luminance of theentire pixel 10 can be improved accordingly. - Further, in the
pixel 10 of the third embodiment, since the position of theanode electrode 121 of the organiclight emitting element 101 is adjusted without changing the light emitting area or the pitch arrangement of eachsub pixel 100, eachsub pixel 100 has different luminance, and thus it is possible to easily achieve high definition. - As described above, in the
pixel 10 of the third embodiment, the inclined surface height of thereflector 112 with respect to theanode electrode 121 of the organiclight emitting element 101 serving as thelight emitting portion 101 is adjusted for eachsub pixel 100 by adjusting the position of theanode electrode 121 side of thespecific sub pixel 100, and thus only the inclined surface height of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface heights of thereflectors 112 of theother sub pixels 100. Accordingly, in thepixel 10 of the third embodiment, it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of thespecific sub pixel 100 by causing eachsub pixel 100 to have different luminance. - Further, in
FIG. 7 , the example in which the inclined surface height of thereflector 112W is highest, and the inclined surface heights of the other reflectors, that is, thereflector 112G, thereflector 112R, and thereflector 112B are equal so that the relation similar to that in Formula (2) is obtained has been described, but the relation is an example, and thesub pixel 100 in which the position of theanode electrode 121 side is changed is arbitrary as long as the inclined surface height of thereflector 112 of the specific sub pixel 110 is different from the inclined surface heights of theother sub pixels 100. - Further, the example in which the position of the
anode electrode 121 side of onesub pixel 100 as thespecific sub pixel 100 is adjusted has been presented here, but, for example, the number ofspecific sub pixels 100 may be two or more, for example, the positions of theanode electrodes sub pixels anode electrode 121 side may be adjusted for eachsub pixel 100 in thepixel 10 so that, for example, the relation of Formula (1) described above is satisfied. -
FIGS. 8A and 8B each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of a fourth embodiment. A structure of apixel 10 according to the fourth embodiment will be described below with reference to these main part cross-sectional views. - As illustrated in
FIG. 8A , in apixel 10 of a first variant of the fourth embodiment, thefirst member 111 comprises a first (lower)portion 111A and a second (upper)portion 111B. Thelower portion 111A comprises thelight emitting elements sub pixel upper portion 111B comprises thereflector sub pixel lower portions gap 800. Thegap 800 comprises thecolor filters sub pixel sub pixel 100W does not have a color filter). - The inclined surface height of the reflector of one of the sub pixels (
reflector 112B ofsub pixel 100B, in this example) is higher than the inclined surface heights of the reflectors of the other sub pixels (reflectors sub pixels reflectors 112 in therespective sub pixels 100 are compared, for example, a relation according to Formula (2)′ is obtained. - In the
pixel 10 ofFIG. 8A , the luminance of aspecific sub pixel 100 is increased by differing the inclined surface height of thereflector 112 of thespecific sub pixel 100 among the foursub pixels 100. For example, when the inclined surface height of thereflector 112B of thesub pixel 100B is higher than that of the other sub pixels (as shown inFIG. 8A ), a region in which light from the organiclight emitting element 101B undergoes total reflection increases, and thus the luminance of thesub pixel 100B relative to that of the other sub pixels is improved. Further, in thepixel 10 ofFIG. 8A , since the inclined surface height of thereflector 112 is changed without changing the light emitting area or the pitch arrangement of eachsub pixel 100, it is possible to easily achieve high definition. - As described above, in the
pixel 10 ofFIG. 8A , the inclined surface height of thereflector 112 with respect to the organiclight emitting element 101 serving as the light emitting portion is determined for eachsub pixel 100 so that only the inclined surface height of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface heights of thereflectors 112 of theother sub pixels 100. Accordingly, in thepixel 10 ofFIG. 8A , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of thespecific sub pixel 100 by causing thatsub pixel 100 to have a different luminance. In the case of increasing the luminance ofsub pixel 100B using areflector 112B with a higher inclined surface height relative to that of theother sub pixels sub pixels 100 can achieve the same (or similar) lifespan deterioration. - Further, in
FIG. 8A , the example in which the inclined surface height of thereflector 112B is higher than that of the other reflectors and in which the inclined surface heights of the other reflectors (that is, thereflector 112G, thereflector 112R, and thereflector 112W) are equal, as indicated in Formula (2)′, has been described. However, the relation indicated in Formula (2)′ is an example, and thereflector 112 whose inclined surface height is changed is arbitrary as long as the inclined surface height of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface heights of theother sub pixels 100. For example, the relation of inclined surface heights indicated in Formula (2) could be used (thereby increasing the luminance of thesub pixel 100W to increase the luminance of thepixel 10 as a whole). - Further, an example in which the inclined surface height of the
reflector 112 of onesub pixel 100 as thespecific sub pixel 100 is changed has been described, but the number ofspecific sub pixels 100 may be two or more. For example, the inclined surface heights of both thereflectors sub pixels reflectors sub pixels - As illustrated in
FIG. 8B , in apixel 10 of a second variant of the fourth embodiment, only a portion of theupper portion 111B is separated from thelower portion 111A by thegap 800 whilst the remaining portion of theupper portion 111B is not separated from (that is, is connected to) thelower portion 111A. In particular, aportion 801 of theupper portion 111B comprising the reflector of one of the sub pixels (reflector 112B ofsub pixel 100B, in this example) is not separated from thelower portion 111A (that is, theportion 801 is connected to thelower portion 111A) whereas anotherportion 802 of theupper portion 111B comprising at least part of each of the reflectors of the other sub pixels (reflectors sub pixels lower portion 111A (that is, theportion 802 is not connected to thelower portion 111A). In the example ofFIG. 8B , thereflector 112B of theportion 801 of theupper portion 111B extends through part of thecolor filter 131B of thesub pixel 100B and part of the neighboringcolor filters sub pixels lower portion 111A. - Due to there being a
gap 800 between theportion 802 of theupper portion 111B and thelower portion 111A but nogap 800 between theportion 801 of theupper portion 111B and thelower portion 111A (for a given reflector height as measured from atop surface 803 of the color filters 131), the surface area of the inclined surface of the reflector comprised by the portion 801 (reflector 112B ofsub pixel 100B, in this example) is greater than the surface area of the inclined surface of the reflectors of which at least a part is comprised by the portion 802 (reflectors sub pixels - In the
pixel 10 ofFIG. 8B , the luminance of aspecific sub pixel 100 is increased because of the differing inclined surface area of thereflector 112 of thespecific sub pixel 100 among the foursub pixels 100. For example, when the inclined surface area of thereflector 112B of thesub pixel 100B is higher that of the other sub pixels (as shown inFIG. 8B ), a region in which light from the organiclight emitting element 101B undergoes total reflection increases, and thus the luminance of thesub pixel 100B relative to that of the other sub pixels is improved. Further, in thepixel 10 ofFIG. 8B , since the inclined surface area of thereflector 112 is changed without changing the light emitting area or the pitch arrangement of eachsub pixel 100, it is possible to easily achieve high definition. - As described above, in the
pixel 10 ofFIG. 8B , the inclined surface area of thereflector 112 with respect to the organiclight emitting element 101 serving as the light emitting portion is determined for eachsub pixel 100 so that only the inclined surface area of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface areas of thereflectors 112 of theother sub pixels 100. Accordingly, in thepixel 10 ofFIG. 8B , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of thespecific sub pixel 100 by causing thatsub pixel 100 to have a different luminance. In the case of increasing the luminance ofsub pixel 100B using areflector 112B with a higher inclined surface area relative to that of theother sub pixels sub pixels 100 can achieve the same (or similar) lifespan deterioration. - Further, in
FIG. 8B , the example in which the inclined surface area of thereflector 112B is higher than that of the other reflectors and in which the inclined surface areas of the other reflectors (that is, thereflector 112G, thereflector 112R, and thereflector 112W) are equal has been described. However, this is only an example, and thereflector 112 whose inclined surface area is changed (by determining which portion(s) of theupper portion 111B are connected to thelower portion 111A and which are not) is arbitrary as long as the inclined surface area of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface areas of theother sub pixels 100. For example, thereflector 112W of thesub pixel 100W may have the largest inclined surface area and the other sub pixels may have smaller, equal inclined surface areas (thereby increasing the luminance of thesub pixel 100W and increasing the luminance of thepixel 10 as a whole). - Further, an example in which the inclined surface area of the
reflector 112 of onesub pixel 100 as thespecific sub pixel 100 is changed has been described, but the number ofspecific sub pixels 100 may be two or more, for example, the inclined surface areas of both thereflectors sub pixels reflectors sub pixels reflector 112 and thelower portion 111A). -
FIGS. 9A, 9B and 9C each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of a fifth embodiment. A structure of apixel 10 according to the fifth embodiment will be described below with reference to these main part cross-sectional views. - In the above-mentioned embodiments, each organic
light emitting element 101 employs a structure that emits white light which (where necessary) then travels through a color filter (e.g. forsub pixels light emitting element 101 may emit a specific color of light (rather than white light). Thus, for example, there may be a redlight emitting element 101R emitting red light, a bluelight emitting element 101B emitting blue light and a greenlight emitting element 101G emitting green light. In this case, no color filters are required because the light emitted from each light emittingelement 101 is already the desired color. - The
pixels 10 of the fifth embodiment use such coloredlight emitting elements 101. These colored light emitting elements are structurally similar to the white light emitting elements of the above-mentioned embodiments, except that the organic layer of each light emitting element includes a light emitting layer made of an organic light emitting material which emits colored (rather than white) light. In particular, the relative positions of the anode, cathode and organic layer of each light emitting element (not shown) are the same as previously described for the white light emitting elements of the above-mentioned embodiments. - In the embodiments of
FIGS. 9A, 9B and 9C , eachlight emitting element 101 is a colored light emitting element and there is no white light emitting element. Furthermore, eachpixel 10 may comprise a plurality of light emitting elements of a certain color (in this case, eachpixel 10 comprises two redlight emitting elements 101R). - As illustrated in
FIG. 9A , in apixel 10 of a first variant of the fifth embodiment, thefirst member 111 comprises areflector sub pixel reflector 112B ofsub pixel 100B, in this example) is higher than the inclined surface heights of the reflectors of the other sub pixels (reflectors sub pixels - In the
pixel 10 ofFIG. 9A , the luminance of aspecific sub pixel 100 is increased by differing the inclined surface height of thereflector 112 of thespecific sub pixel 100 among the foursub pixels 100. For example, when the inclined surface height of thereflector 112B of thesub pixel 100B is higher than that of the other sub pixels (as shown inFIG. 9A ), a region in which light from the organiclight emitting element 101B undergoes total reflection increases, and thus the luminance of thesub pixel 100B relative to that of the other sub pixels is improved. Further, in thepixel 10 ofFIG. 9A , since the inclined surface height of thereflector 112 is changed without changing the light emitting area or the pitch arrangement of eachsub pixel 100, it is possible to easily achieve high definition. - As described above, in the
pixel 10 ofFIG. 9A , the inclined surface height of thereflector 112 with respect to the organiclight emitting element 101 serving as the light emitting portion is determined for eachsub pixel 100 so that only the inclined surface height of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface heights of thereflectors 112 of theother sub pixels 100. Accordingly, in thepixel 10 ofFIG. 9A , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of thespecific sub pixel 100 by causing thatsub pixel 100 to have a different luminance. In the case of increasing the luminance ofsub pixel 100B using areflector 112B with a higher inclined surface height relative to that of theother sub pixels sub pixels 100 can achieve the same (or similar) lifespan deterioration. - Further, in
FIG. 9A , the example in which the inclined surface height of thereflector 112B is higher than that of the other reflectors and in which the inclined surface height of the other reflectors (that is, thereflector 112G and thereflector 112R) are equal has been described. However, this is only an example, and thereflector 112 whose inclined surface height is changed is arbitrary as long as the inclined surface height of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface heights of theother sub pixels 100. - Further, an example in which the inclined surface height of the
reflector 112 of onesub pixel 100 as thespecific sub pixel 100 is changed has been described, but the number ofspecific sub pixels 100 may be two or more, for example, the inclined surface heights of both thereflectors sub pixels reflectors 112R of thesub pixels 100R. It will also be appreciated that, more generally, each reflector 112 (or, at least, each of a portion of the reflectors 112) may have a different respective inclined surface height. - As illustrated in
FIG. 9B , in apixel 10 of a second variant of the fifth embodiment, thefirst member 111 comprises a reflector for only one of the sub pixels (reflector 112B ofsub pixel 100B, in this example). - In the
pixel 10 ofFIG. 9B , the luminance of aspecific sub pixel 100 is increased by providing areflector 112 only for thatspecific sub pixel 100 among the foursub pixels 100. For example, when areflector 112B forsub pixel 100B is provided, a region in which light from the organiclight emitting element 101B undergoes total reflection increases, and thus the luminance of thesub pixel 100B relative to that of the other sub pixels is improved. Further, in thepixel 10 ofFIG. 9B , since thereflector 112 of the specific sub pixel is provided without changing the light emitting area or the pitch arrangement of eachsub pixel 100, it is possible to easily achieve high definition. - In the
pixel 10 ofFIG. 9B , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of thespecific sub pixel 100 by causing thatsub pixel 100 to have a different luminance. In the case of increasing the luminance ofsub pixel 100B using areflector 112B (without using a reflector for theother sub pixels sub pixels 100 can achieve the same (or similar) lifespan deterioration. - In the
pixel 10 ofFIG. 9B , an example in which areflector 112B is provided only forsub pixel 100B has been described. However, this is only an example, and thesub pixel 100 to which areflector 112 is provided may be a different sub pixel. - In the
pixel 10 ofFIG. 9B , an example in which areflector 112 is provided only to onespecific sub pixel 100 has been described. However, the number ofspecific sub pixels 100 may be two or more. That is, more generally, areflector 112 may be provided to a portion of thesub pixels 100 of apixel 10 whereas a remaining portion of thesub pixels 100 of thepixel 10 are not provided with areflector 112. This improves the luminance of thespecific sub pixels 100 to which areflector 112 is provided. - As illustrated in
FIG. 9C , in apixel 10 of a third variant of the fifth embodiment, thefirst member 111 comprises a first (lower)portion 111A and a second (upper)portion 111B. Thelower portion 111A comprises thelight emitting elements sub pixel upper portion 111B comprises areflector sub pixel - The lower and
upper portions upper portions FIG. 9C , the size of thegap 903 between aportion 901 of theupper portion 111B comprising the reflector of one of the sub pixels (reflector 112B ofsub pixel 100B, in this example) and thelower portion 111A is smaller than the size of thegap 904 between anotherportion 902 of theupper portion 111B comprising at least part of each of the reflectors of the other sub pixels (reflectors sub pixels lower portion 111A. In the example ofFIG. 9C , thesurface 905 of thelower portion 111A facing theupper portion 111B comprises aplanarized layer 907 into which theportions upper portion 111B are embedded at different positions with respect to thelower portion 111A so as to provide the gaps of different sizes between theportions upper portion 111B and thelower portion 111A. Theplanarized layer 907 is formed of a transmissive material through which light emitted by each of thelight emitting elements planarized layer 907 may be formed of, for example, a resin such as an acrylic resin, a polyimide resin, a silicon resin or the like. - Due to there being a gap of a greater size between the
portion 902 of theupper portion 111B and thelower portion 111A and a gap of a smaller size between theportion 901 of theupper portion 111B and thelower portion 111A (for a given reflector height as measured from atop surface 906 of the planarized layer 907), the surface area of the inclined surface of the reflector comprised by the portion 901 (reflector 112B ofsub pixel 100B, in this example) is greater than the surface area of the inclined surface of the reflectors of which at least a part is comprised by the portion 902 (reflectors sub pixels - In the
pixel 10 ofFIG. 9C , the luminance of aspecific sub pixel 100 is increased because of the differing inclined surface area of thereflector 112 of thespecific sub pixel 100 among the foursub pixels 100. For example, when the inclined surface area of thereflector 112B of thesub pixel 100B is higher that of the other sub pixels (as shown inFIG. 9C ), a region in which light from the organiclight emitting element 101B undergoes total reflection increases, and thus the luminance of thesub pixel 100B relative to that of the other sub pixels is improved. Further, in thepixel 10 ofFIG. 9C , since the inclined surface area of thereflector 112 is changed without changing the light emitting area or the pitch arrangement of eachsub pixel 100, it is possible to easily achieve high definition. - As described above, in the
pixel 10 ofFIG. 9C , the inclined surface area of thereflector 112 with respect to the organiclight emitting element 101 serving as the light emitting portion is determined for eachsub pixel 100 so that only the inclined surface area of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface areas of thereflectors 112 of theother sub pixels 100. Accordingly, in thepixel 10 ofFIG. 9C , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of thespecific sub pixel 100 by causing thatsub pixel 100 to have a different luminance. In the case of increasing the luminance ofsub pixel 100B using areflector 112B with a higher inclined surface area relative to that of theother sub pixels sub pixels 100 can achieve the same (or similar) lifespan deterioration. - Further, in
FIG. 9C , the example in which the inclined surface area of thereflector 112B is higher than that of the other reflectors and in which the inclined surface areas of the other reflectors (that is, thereflector 112G and thereflector 112R) are equal has been described. However, this is only an example, and thereflector 112 whose inclined surface area is changed (by determining the size of the gap between the portion of theupper portion 111B comprising thatreflector 112 and thelower portion 111A) is arbitrary as long as the inclined surface area of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface areas of theother sub pixels 100. - Further, an example in which the inclined surface area of the
reflector 112 of onesub pixel 100 as thespecific sub pixel 100 is changed has been described, but the number ofspecific sub pixels 100 may be two or more. That is, more generally, the size of the gap between theupper portion 111B andlower portion 111A of thefirst member 111 may be varied such that the inclined surface area of the reflector of a portion of thesub pixels 100 of apixel 10 is greater than that of the reflector of a remaining portion of thesub pixels 100 of thepixel 10. This improves the luminance of thespecific sub pixels 100 to which areflector 112 with a greater inclined surface area is provided. It will also be appreciated that, more generally, each reflector 112 (or, at least, each of a portion of the reflectors 112) may have a different respective inclined surface area (e.g. by adjusting the size of the gap between eachreflector 112 and thelower portion 111A). -
FIGS. 10A and 10B each show a main part cross-sectional view illustrating a part of a structure of a pixel according to variants of a sixth embodiment. A structure of apixel 10 according to the sixth embodiment will be described below with reference to these main part cross-sectional views. - In the above-mentioned embodiments, the
light emitting element 101 of eachsub pixel 100 comprises an organic layer with a structure sandwiched between an anode electrode and a cathode electrode (the cathode being above the anode in the FIGS). The cathode (formed of ITO, for example) is transparent so that light emitted by the organic layer is transmitted through the cathode to thereflector 112 of thatsub pixel 100. On the other hand, the anode (formed of Al, Cu or the like, for example) is reflective so that light emitted by the organic layer is reflected by the anode rather than being transmitted through it. Such an arrangement is known as a top emission OLED display type. The present technology is not limited to such an arrangement, however. In an alternative embodiment, it is the anode which is transparent and the cathode which is reflective so that light emitted by the organic layer of eachsub pixel 100 is transmitted through the anode to thereflector 112 of thatsub pixel 100 but is reflected by the cathode rather than being transmitted through it. In this case, the anode is formed of ITO, for example, and the cathode is formed of Al, Cu or the like, for example. Such an arrangement is known as a bottom emission OLED type. The variants of the sixth embodiment shown inFIGS. 10A and 10B represent example bottom emission OLED type pixels. - As illustrated in
FIG. 10A , in apixel 10 of a first variant of the sixth embodiment, thefirst member 111 comprises a first (lower)portion 111A and a second (upper)portion 111B. Theupper portion 111B comprises thelight emitting elements sub pixel lower portion 111A comprises areflector sub pixel - The lower and
upper portions upper portions FIG. 10A , the size of thegap 1004 between aportion 1001 of thelower portion 111A comprising the reflector of one of the sub pixels (reflector 112B ofsub pixel 100B, in this example) and theupper portion 111B is smaller than the size of thegap 1005 between anotherportion 1002 of thelower portion 111A comprising at least part of each of the reflectors of the other sub pixels (reflectors sub pixels upper portion 111B. In the example ofFIG. 10A , thesurface 1006 of theupper portion 111B facing thelower portion 111A comprises aplanarized layer 1000 into which theportions lower portion 111A are embedded at different positions with respect to theupper portion 111B so as to provide the gaps of different sizes between theportions lower portion 111A and theupper portion 111B. Theplanarized layer 1000 is formed of a transmissive material through which light emitted by each of thelight emitting elements planarized layer 1000 may be formed of, for example, a resin such as an acrylic resin, a polyimide resin, a silicon resin or the like. - Due to there being a
gap 1005 of a greater size between theportion 1002 of thelower portion 111A and theupper portion 111B and agap 1004 of a smaller size between theportion 1001 of thelower portion 111A and theupper portion 111B (and given that each reflector of thelower portion 111A extends to abottom surface 1007 of the planarized layer 1000), the surface area of the inclined surface of the reflector comprised by the portion 1001 (reflector 112B ofsub pixel 100B, in this example) is greater than the surface area of the inclined surface of the reflectors of which at least a part is comprised by the portion 1002 (reflectors sub pixels - In the
pixel 10 ofFIG. 10A , the luminance of aspecific sub pixel 100 is increased because of the differing inclined surface area of thereflector 112 of thespecific sub pixel 100 among the foursub pixels 100. For example, when the inclined surface area of thereflector 112B of thesub pixel 100B is higher than that of the other sub pixels (as shown inFIG. 10A ), a region in which light from the organiclight emitting element 101B undergoes total reflection increases, and thus the luminance of thesub pixel 100B relative to that of the other sub pixels is improved. Further, in thepixel 10 ofFIG. 10A , since the inclined surface area of thereflector 112 is changed without changing the light emitting area or the pitch arrangement of eachsub pixel 100, it is possible to easily achieve high definition. - As described above, in the
pixel 10 ofFIG. 10A , the inclined surface area of thereflector 112 with respect to the organiclight emitting element 101 serving as the light emitting portion is determined for eachsub pixel 100 so that only the inclined surface area of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface areas of thereflectors 112 of theother sub pixels 100. Accordingly, in thepixel 10 ofFIG. 10A , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of thespecific sub pixel 100 by causing thatsub pixel 100 to have a different luminance. In the case of increasing the luminance ofsub pixel 100B using areflector 112B with a higher inclined surface area relative to that of theother sub pixels sub pixels 100 can achieve the same (or similar) lifespan deterioration. - Further, in
FIG. 10A , the example in which the inclined surface area of thereflector 112B is higher than that of the other reflectors and in which the inclined surface areas of the other reflectors (that is, thereflector 112G and thereflector 112R) are equal has been described. However, this is only an example, and thereflector 112 whose inclined surface area is changed (by determining the size of the gap between the portion of thelower portion 111A comprising thatreflector 112 and theupper portion 111A) is arbitrary as long as the inclined surface area of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface areas of theother sub pixels 100. - Further, an example in which the inclined surface area of the
reflector 112 of onesub pixel 100 as thespecific sub pixel 100 is changed has been described, but the number ofspecific sub pixels 100 may be two or more. That is, more generally, the size of the gap between theupper portion 111B andlower portion 111A of thefirst member 111 may be varied such that the inclined surface area of the reflector of a portion of thesub pixels 100 of apixel 10 is greater than that of the reflector of a remaining portion of thesub pixels 100 of thepixel 10. This improves the luminance of thespecific sub pixels 100 to which areflector 112 with a greater inclined surface area is provided. It will also be appreciated that, more generally, each reflector 112 (or, at least, each of a portion of the reflectors 112) may have a different respective inclined surface area (e.g. by adjusting the size of the gap between eachreflector 112 and theupper portion 111B). Alternatively, each reflector may have the same inclined surface area (e.g. by ensuring that the size of the gap between each of thereflectors 112 and theupper portion 111B is the same), thereby providing an equally improved luminance of each of thesub pixels 100 and thus an improved overall luminance of thepixel 10. -
FIG. 10B shows apixel 10 of a second variant of the sixth embodiment. Thepixel 10 ofFIG. 10B is the same as that ofFIG. 10A , except that the lower andupper portions first member 111 are separated by a gap 1003 of a constant size and that the reflector of one of the sub pixels (reflector 112B ofsub pixel 100B, in this example) extends in a direction towards thebottom surface 1007 of theplanarized layer 1000 to a greater extent than the extent to which the reflectors of the other sub pixels (reflectors sub pixels bottom surface 1007 of theplanarized layer 1000. The extent to which areflector 112 extends towards thebottom surface 1007 of theplanarized layer 1000 may be referred to as the reflector depth. A reflector 112 (e.g. reflector 112B) which extends towards thebottom surface 1007 of theplanarised layer 1000 to a greater extent (so that the distance between alower end 1008 of thereflector 112 and thebottom surface 1007 of theplanarised layer 1000 is smaller) is said to have a greater depth. A reflector 112 (e.g. reflectors 112R and 112G) which extends towards thebottom surface 1007 of theplanarised layer 1000 to a lesser extent (so that the distance between alower end 1008 of thereflector 112 and thebottom surface 1007 of theplanarised layer 1000 is smaller) is said to have a lesser depth. In the example ofFIG. 10B , the reflector depths of the reflectors other than thereflector 112B with the deepest reflector depth are equal to each other. - In the
pixel 10 ofFIG. 10B , the luminance of aspecific sub pixel 100 is increased by differing the reflector depth of thereflector 112 of thespecific sub pixel 100 among the foursub pixels 100. For example, when the reflector depth of thereflector 112B of thesub pixel 100B is greater than that of the other sub pixels (as shown inFIG. 10B ), a region in which light from the organiclight emitting element 101B undergoes total reflection increases. This is because the greater reflector depth provides a greater surface area of the reflector from which light emitted by thelight emitting element 101B is reflected. The luminance of thesub pixel 100B relative to that of the other sub pixels is therefore improved. Further, in thepixel 10 ofFIG. 10B , since the reflector depth of thereflector 112 is changed without changing the light emitting area or the pitch arrangement of eachsub pixel 100, it is possible to easily achieve high definition. - As described above, in the
pixel 10 ofFIG. 10B , the reflector depth of thereflector 112 with respect to the organiclight emitting element 101 serving as the light emitting portion is determined for eachsub pixel 100 so that only the reflector depth of thereflector 112 of thespecific sub pixel 100 is different from the reflector depth of thereflectors 112 of theother sub pixels 100. Accordingly, in thepixel 10 ofFIG. 10B , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of thespecific sub pixel 100 by causing thatsub pixel 100 to have a different luminance. In the case of increasing the luminance ofsub pixel 100B using areflector 112B with a reflector depth relative to that of theother sub pixels sub pixels 100 can achieve the same (or similar) lifespan deterioration. - Further, in
FIG. 10B , the example in which the reflector depth of thereflector 112B is greater than that of the other reflectors and in which the reflector depth of the other reflectors (that is, thereflector 112G and thereflector 112R) are equal has been described. However, this is only an example, and thereflector 112 whose reflector depth is changed is arbitrary as long as the reflector depth of thereflector 112 of thespecific sub pixel 100 is different from the reflector depths of theother sub pixels 100. - Further, an example in which the reflector depth of the
reflector 112 of onesub pixel 100 as thespecific sub pixel 100 is changed has been described, but the number ofspecific sub pixels 100 may be two or more. For example, the reflector depths of both thereflectors sub pixels reflectors 112R of thesub pixels 100R. It will also be appreciated that, more generally, each reflector 112 (or, at least, each of a portion of the reflectors 112) may have a different respective reflector depth. Alternatively, each reflector may have the same reflector depth, thereby providing an equally improved luminance of each of thesub pixels 100 and thus an improved overall luminance of thepixel 10. - Although the
pixels 10 ofFIGS. 10A and 10B use coloredlight emitting elements light emitting elements pixel 10 comprises a further layer attached to thebottom surface 1007 of theplanarized layer 1000 comprising appropriate color filters (like those shown inFIGS. 5, 6, 7 and 8A and 8B , for example). In such a layer, a red color filter (e.g. color filter 101R) is aligned with thelight emitting elements 101R, a blue color filter (e.g. color filter 131B) is aligned with thelight emitting element 101B and a green color filter (e.g. color filter 131G) is aligned with light emittingelement 101G. -
FIG. 11 shows a main part cross-sectional view illustrating a part of a structure of a bottomemission sub pixel 100 according to a seventh embodiment. In a pixel comprising a plurality ofsub pixels 100 according to the seventh embodiment, eachsub pixel 100 comprises the structure shown inFIG. 11 . - The
sub pixel 100 comprises asubstrate 1101 comprising the necessary pixel circuitry (not shown). Thesubstrate 1101 is a thin film transistor (TFT) substrate, for example. Aplanarized layer 1102 is formed on thesubstrate 1101. Theplanarized layer 1102 is formed of, for example, a resin such as an acrylic resin, a polyimide resin, a silicon resin or the like. Ananode 121 is formed over a first portion of theplanarized layer 1102. An insulatinglayer 1103 is formed over a second portion of theplanarized layer 1102. The insulatinglayer 1103 is formed of an insulating material. Like theplanarized layer 1102, the insulatinglayer 1103 may be formed of, for example, a resin such as an acrylic resin, a polyimide resin, a silicon resin or the like. Theplanarized layer 1102 and insulatinglayer 1103 may be made of the same or different materials. Agroove 1106 is formed over a third portion of theplanarized layer 1102. Thegroove 1106 extends through the insulatinglayer 1103 and into theplanarized layer 1102. An organic layer 1104 (comprising a light emitting layer) and acathode layer 1105 are formed as adjacent layers (forming a combined layer) over theanode 121, insulatinglayer 1103 and the inside surface of thegroove 1106. - In the bottom emission pixel of
FIG. 11 , the anode 121 (formed of ITO, for example) is transparent. On the other hand, the cathode 1105 (formed of Al, Cu or the like, for example) is reflective. The formation of theorganic layer 1104 andcathode 1105 over the anode 121 (so that theorganic layer 1104 is sandwiched between theanode 121 and cathode 1105) causes a portion of theorganic layer 1104 to be in contact with both theanode 121 and thecathode 1105. Light is therefore emitted by this portion of theorganic layer 1104 which, together with theanode 121 and corresponding portion of thecathode 1105, thus forms a light emitting element. -
Light rays 1107 emitted by this light emitting element travel through theanode 121 andplanarized layer 1102 and are reflected at one or more of the boundary between the planarized layer 1102 (with a first refractive index) and the organic layer 14 (with a second refractive index), the boundary between theorganic layer 1104 and the cathode 1105 (with a third refractive index), and thereflective cathode 1105. - In an embodiment, a pixel comprising
sub pixels 100 of the type shown inFIG. 11 is manufactured by first forming the substrate 1101 (e.g. TFT substrate) using a suitable process (such processes are known in the art and are therefore not discussed in detail here). Then, theplanarized layer 1102 is formed on thesubstrate 1101 using a planarizing process. Then, theanode 121 is formed on theplanarized layer 1102. This is done using a CVD (chemical vapor deposition) film forming process, for example. - The insulating
layer 1103 is then formed on theplanarized layer 1102 andanode 121. This is carried out using a further planarizing process, for example. Portions of the insulatinglayer 1103 and/orplanarized layer 1102 are then removed in order to expose theanode 121 and form thegroove 1106. This is carried out by, for example, repeatedly forming a photoresist layer on the insulatinglayer 1103 and/orplanarized layer 1102, exposing a portion of the photoresist layer to a predetermined pattern of light, carrying out a developing process to remove the exposed portion of the photoresist layer and etching a portion of the insulatinglayer 1103 and/orplanarized layer 1102 exposed by the removed portion of the photoresist layer. This process is repeated to etch away successive layers of the insulatinglayer 1103 and/orplanarized layer 1102 until theanode 121 is exposed and thegroove 1106 is formed. - The organic and
cathode layers anode 121, the remaining portions of the insulatinglayer 1103 and the inside surface of the groove 1106 (again using a CVD film forming process, for example). Alternatively, theorganic layer 1104 may be deposited on theanode 121 only (that is, not over the remaining portions of the insulatinglayer 1103 and the inside surface of the groove 1106) whilst thecathode layer 1105 is deposited over the exposedanode 121, the remaining portions of the insulatinglayer 1103 and the inside surface of thegroove 1106. -
FIGS. 12A and 12B each show a main part cross-sectional view illustrating a part of a structure of a bottom emission pixel according to variants of an eighth embodiment. A structure of apixel 10 according to the eighth embodiment will be described below with reference to these main part cross-sectional views. - The
pixels 10 ofFIGS. 12A and 12B are each the same as that ofFIG. 10A except that, rather than having a first member comprising anupper portion 111B comprising thelight emitting elements sub pixel lower portion 111A comprising areflector sub pixel first member 111 and thereflectors light emitting elements 101 is reflected by internal reflection (e.g. total internal reflection). The notch portions 1200 provide gaps (e.g. air or vacuum gaps) with a lower refractive index than that of the material (a resin such as an acrylic resin, a polyimide resin, a silicon resin or the like) within which the notch portions are formed, thereby providing the boundaries at which light emitted by the light emitting elements is reflected. - The notch portions 1200 of
FIGS. 12A and 12B are positioned with respect to thefirst member 111 similarly to the way in which the portions of material forming thelower portion 111A forming thereflectors 112 ofFIG. 10A are positioned with respect to theupper portion 111B. That is, anupper surface 1201 of each notch portion is separated from thefirst member 111 by a varying distance. In the example ofFIG. 12A , the distance between the respectiveupper surfaces 1201 ofnotch portions reflector 112B ofsub pixel 100B, in this example) and thefirst member 111 is smaller than the distance between the respectiveupper surfaces 1201 of the remainingnotch portions reflectors sub pixels first member 111. - In the example of
FIG. 12A , thesurface 1203 of thefirst member 111 facing the notch portions comprises aplanarized layer 1202 in which the notch portions 1200 are formed. Theplanarized layer 1202 is formed of a transmissive material through which light emitted by each of thelight emitting elements planarized layer 1202 may be formed of, for example, a resin such as an acrylic resin, a polyimide resin, a silicon resin or the like. In the example ofFIG. 12B , rather than the notch portions being formed in theplanarized layer 1202, a separate notched layer 1203 (formed of a further resin, for example) is provided on theplanarized layer 1203 and it is the separate notched layer into which the notch portions 1200 are formed. - In the examples of
FIGS. 12A and 12B , due to there being a greater distance between thenotch portions first member 111 and a smaller distance between thenotch portions bottom surface 1204 of theplanarized layer 1202 or notched layer 1203), the surface area of thereflector 112B ofsub pixel 100B is greater than the surface area ofreflectors sub pixels - In the
pixel 10 ofFIGS. 12A and 12B , the luminance of aspecific sub pixel 100 is increased because of the differing surface area of thereflector 112 of thespecific sub pixel 100 among the foursub pixels 100. For example, when the surface area of thereflector 112B of thesub pixel 100B is higher than that of the other sub pixels (as shown inFIGS. 12A and 12B ), a region in which light from the organiclight emitting element 101B undergoes total reflection increases, and thus the luminance of thesub pixel 100B relative to that of the other sub pixels is improved. Further, in thepixel 10 ofFIGS. 12A and 12B , since the inclined surface area of thereflector 112 is changed without changing the light emitting area or the pitch arrangement of eachsub pixel 100, it is possible to easily achieve high definition. - As described above, in the
pixel 10 ofFIGS. 12A and 12B , the surface area of thereflector 112 with respect to the organiclight emitting element 101 serving as the light emitting portion is determined for eachsub pixel 100 so that only the surface area of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface areas of thereflectors 112 of theother sub pixels 100. Accordingly, in thepixel 10 ofFIGS. 12A and 12B , it is possible not only to improve the light extraction efficiency by the light reflecting layer but also to improve the luminance of thespecific sub pixel 100 by causing thatsub pixel 100 to have a different luminance. In the case of increasing the luminance ofsub pixel 100B using areflector 112B with a higher surface area relative to that of theother sub pixels sub pixels 100 can achieve the same (or similar) lifespan deterioration. - Further, in
FIGS. 12A and 12B , the example in which the surface area of thereflector 112B is higher than that of the other reflectors and in which the surface areas of the other reflectors (that is, thereflector 112G and thereflector 112R) are equal has been described. However, this is only an example, and thereflector 112 whose surface area is changed (by determining the size of the gap between the notch portion whose boundary defines thatreflector 112 and the first member 111) is arbitrary as long as the surface area of thereflector 112 of thespecific sub pixel 100 is different from the inclined surface areas of theother sub pixels 100. - Further, an example in which the surface area of the
reflector 112 of onesub pixel 100 as thespecific sub pixel 100 is changed has been described, but the number ofspecific sub pixels 100 may be two or more. That is, more generally, the distance between theupper surface 1201 of each notch portion and thefirst member 111 may be varied such that the surface area of the reflector of a portion of thesub pixels 100 of apixel 10 is greater than that of the reflector of a remaining portion of thesub pixels 100 of thepixel 10. This improves the luminance of thespecific sub pixels 100 to which areflector 112 with a greater surface area is provided. It will also be appreciated that, more generally, each reflector 112 (or, at least, each of a portion of the reflectors 112) may have a different respective inclined surface area (e.g. by adjusting the distance between theupper surface 1201 of each notch portion and the first member 111). Alternatively, each reflector may have the same inclined surface area (e.g. by ensuring that the distance between theupper surface 1201 of each of the notch portions 1200 and thefirst member 111 is the same), thereby providing an equally improved luminance of each of thesub pixels 100 and thus an improved overall luminance of thepixel 10. - It will furthermore be appreciated that the notch portions 1200 of
FIGS. 12A and 12B may a similar arrangement to that ofFIG. 10A instead ofFIG. 10B . Namely, the distance between theupper surface 1201 of each of the notch portions 1200 and thefirst member 111 may be the same and a portion of the notch portions 1200 (e.g. thenotch portions reflector 112B ofsub pixel 100B) may extend in a direction towards thebottom surface 1204 of theplanarized layer 1202 or notchedlayer 1203 to a greater extent (providing a greater reflector depth) than the extent to which a remaining portion of the notch portions 1200 (e.g. the remainingnotch portions bottom surface 1204 of theplanarized layer 1202 or notched layer 1203 (providing a less reflector depth). - Although the
pixels 10 ofFIGS. 12A and 12B use coloredlight emitting elements light emitting elements pixel 10 comprises a further layer attached to thebottom surface 1204 of theplanarized layer 1202 or notchedlayer 1203 comprising appropriate color filters (like those shown inFIGS. 5, 6, 7 and 8A and 8B , for example). In such a layer, a red color filter (e.g. color filter 101R) is aligned with thelight emitting elements 101R, a blue color filter (e.g. color filter 131B) is aligned with thelight emitting element 101B and a green color filter (e.g. color filter 131G) is aligned with light emittingelement 101G. - In the above-mentioned embodiments, each
reflector 112 comprises a light reflecting surface (e.g. a reflective surface offirst member 111 or a boundary between a material with a higher refractive index and a material with a lower refractive index) with an area which may be different for one or more of thesub pixels 100 of eachpixel 10 in order to change amount of reflected light for thosesub pixels 100 and thus the output luminance of thosesub pixels 100. - In the above-mentioned embodiments, the light reflecting surface of each
sub pixel 100 is an inclined surface and the area of the inclined surface of eachsub pixel 100 is determined according to a length along which that inclined surface extends in a stacking direction (with the greater the length of the inclined surface, the greater the area over which light is reflected and the greater the amount of light which is reflected). - In some embodiments (e.g. those of
FIGS. 5, 6, 8A, 9A, 9B and 10B ), the inclined surfaces of allreflectors 112 extend from a common plane and the length along which each inclined surface extends is determined by the height or depth of that inclined surface. In the examples ofFIGS. 5, 6, 8A, 9A and 9B , the common plane is the plane along which each of thelight emitting elements 101 is defined. In the example ofFIG. 10B , the common plane is the top surface of thelower portion 111A of the first member 111 (which is parallel to the plane along which thelight emitting elements 101 are defined and separated from the plane along which thelight emitting elements 101 are defined by the gap 1003). - In other embodiments (e.g. those of
FIGS. 7, 8B, 9C, 10A, 12A and 12B ), at least one inclined surface extends from a plane at a different position in the stacking direction to the plane(s) at which each of the other inclined surface(s) extends. Each inclined surface may, however, extend such that all inclined surfaces meet in a common plane. In the examples ofFIGS. 7, 8B, 9C, 10A, 12A and 12B , the inclined surface ofreflector 112B extends from a different plane to that of the inclined surfaces of the other reflectors. However, all the inclined surfaces extend to meet in a common plane. InFIG. 7 , the common plane is that defined by the top of the first member 111 (on which the color filters 131 are arranged). InFIGS. 8B and 9C , the common plane is that defined by the top of theupper portion 111B of thefirst member 111. InFIG. 10A , the common plane is that defined by the bottom of thelower portion 111A of thefirst member 111. InFIGS. 12A and 12B , the common plane is that defined by the bottom of theplanarized layers - In all of the above-mentioned embodiments, the length along which an inclined surface of each
sub pixel 100 extends in the stacking direction (thereby defining the area of the inclined surface which reflects light) may be referred to as the height or depth of that inclined surface relative to the light emitting portion of thatsub pixel 100. It will be appreciated that “height” and “depth” are relative terms in that something measured as a “height” may equally be measured as a “depth” if the length concerned is considered from a different perspective (e.g. ifFIG. 5 is viewed upside down, then the “height” of eachreflector 112 becomes a “depth” and ifFIG. 10A or 10B is viewed upside down, then the “depth” of eachreflector 112 becomes a “height”). The terms “height” and “depth” should therefore be considered functionally equivalent and the terms “height” or “depth” may be used interchangeably with the expression “length which extends in a stacking direction”. The length along which eachreflector 112 extends in the stacking direction may also be referred to, more generally, as the distance between a first plane which is coplanar with a first end of the reflector 112 (e.g. the top of the reflector in the stacking direction) and a second plane which is coplanar with a second end of the reflector 112 (e.g. the bottom of the reflector in the stacking direction). - In embodiments, the term “stacking direction” should be understood to mean the direction in which the
display element 1 comprising thepixels 10 andsub pixels 100 is formed by successively stacking one layer on top of another. The layers include, for example, the first member 111 (including, where present, thelower portion 111A andupper portion 111B of the first member 111), the anode, organic layer and cathode of each light emittingelement 101 and, where present, one or more planarized layers (such asplanarized layers - It will be appreciated that the present technique may be applied more generally such that a plurality of pixels (each of which may comprise a plurality of sub pixels or may itself be a sub pixel) arranged in a two-dimensional form include a first pixel, a second pixel and a third pixel. A first light reflecting portion (reflector 112) is located between the first pixel and the second pixel (so as to reflect light emitted by either the first or second pixel) and a second light reflecting portion (reflector 112) is located between the second pixel and the third pixel (so as to reflect light emitted by either the second or third pixel). The height of the first and second light reflecting portions may be the same (in order to improve the perceived luminance of each pixel from which light is reflected equally). Alternatively, the height of the first and second light reflecting portions may be different (in order to improve the perceived luminance of one pixel from which light is reflected over another).
- In the above-mentioned embodiments, it will be appreciated that each
reflector 112 is an inclined reflective surface and that each pixel (which may comprise a plurality of sub pixels or may itself be a sub pixel) emits light which is reflected by one or more of these surfaces. For example, in each ofFIGS. 5, 6, 7, 8A, 8B, 9A, 9C, 10A, 10B, 12A and 12B , each of thesub pixels 100 emits light which is reflected by two inclined surfaces (that is, each sub pixel is said to have two inclined surfaces). InFIG. 9B , theblue sub pixel 100B emits light which is reflected by two inclined surfaces (that is, theblue sub pixel 100B has two inclined surfaces), each of one of thered sub pixels 100R and thegreen sub pixel 100G emits light which is reflected by one inclined surface (that is, each of these sub pixels has one inclined surface) and the remainingred sub pixel 100R emits light which is not reflected by an inclined surface (that is, this sub pixel has no inclined surface). It will be appreciated that, in the above-mentioned embodiments, a different perceived luminance of a first pixel relative to a second pixel is achieved by changing the height of at least one inclined reflective surface of the first pixel with respect to the height of at least one inclined reflective surface of the second pixel so as to change the overall area over which light emitted by the first pixel is reflected with respect to the overall area over which light emitted by the second pixel is reflected. - Next, a structure of the
reflector 112 will be described in detail with reference toFIGS. 13 to 17 . -
FIG. 13 is a conceptual diagram for describing reflection of light by thereflector 112. - As illustrated in
FIG. 13 , in thesub pixel 100, the light from (theanode electrode 121 of) the organiclight emitting element 101 to thereflector 112 is omnidirectional, but thereflector 112 reflects light incident at a predetermined total reflection angle or more but transmits light incident at less than the angle. - For example, in
FIG. 13 , the light beams L2 and L3 among light beams L1 to L4 from theanode electrode 121 of the organiclight emitting element 101 are totally reflected by thereflector 112, while the light beam L4 passes through thereflector 112. - Here,
FIG. 14 illustrates a relation between a distance L (unit: nm) to the inclined surface of thereflector 112 and an inclined surface height H (unit: nm) of thereflector 112 at which the total reflection is performed. - For example, in a case in which a width of the opening portion (the portion in which the
anode electrode 121 is exposed) between thereflectors 112 is 2,000 nm, the distance L to the inclined surface of thereflector 112 is a maximum of 2,000 nm. In this case, the height H satisfying the total reflection condition is approximately 1,600 nm from the relation between L and H illustrated inFIG. 14 . - In other words, in the
reflector 112, a reflection region has the height H=1600 nm or more, and since the total reflection region increases as the height (inclined surface height) H is increased, the luminance of thesub pixel 100 can be improved. In other words, it can be said that the luminance is improved by the increase in the reflection area with the increase in the inclined surface height H. - Here, the height (inclined surface height) H satisfying the total reflection condition can be obtained by, for example, the following calculation.
- In other words, as illustrated in
FIG. 15 , in a case in which an incidence angle (reflection angle) of light incident on thereflector 112 is indicated by θ, α can be calculated by the following Formula (3). -
α=tan−1(H/(L+t)) (3) - Here, if the reflector angle (inclination angle) is indicated by β, a relation of the following Formula (4) is obtained by the exterior angle theorem of a triangle.
-
(90−θ)+α=β (4) - Therefore, a relation of the following Formula (5) can be derived from Formulas (3) and (4).
-
θ=90+α−β=90+tan−1(H/(L+t))−β -
tan−1(H/(L+t))=θ+β−90 -
tan(θ+β−90)=H/(L+t) (5) - Further, since t=H/tan β is obtained from the relation of tan β=H/t, a relation of the following Formula (6) can be derived on the basis of Formula (5).
-
H=(L+t)×tan(θ+β−90)=(L+(H/tan β)×tan(θ+β−90) (6) - Then, since the total reflection is performed at θ>θmax (a critical angle), the height H satisfying the relation of the following Formula (7) can be obtained.
-
H≥L×tan(θmax+β−90)/(1−(tan(θmax+β−90)/tan β)) (7) - Accordingly, the height (inclined surface height) H satisfying the total reflection condition is obtained.
- Here, a case in which a refractive index nA of the reflector 112 (for example, SiO), that is, the refractive index nA of the surface of the
first member 111 is 1.4, and a refractive index nB of an organic EL material of the organic layer (for example, alayer 141 ofFIG. 22 to be described later) at an interface with thereflector 112 is 1.8 as illustrated inFIG. 15 is assumed. In this case, θmax (critical angle) at which the total reflection is performed has a relation of the following Formula (8). -
sin θmax=sin θmax/sin 90°=nA/nB (8) - Then, a calculation result of the following Formula (9) is obtained by calculating Formula (8).
-
θmax=sin−1(nA/nB)=sin−1(1.4/1.8)=sin−1(0.882)=51.3° (9) - Since θmax=51.3° is obtained as described above, if it is assumed that L is 1000 nm, and β is 71°, H=808 nm can be obtained by solving the following Formula (10) on the basis of Formula (7).
-
H=L×tan(θmax+β−90)/(1−(tan(θmax+β−90)/tan β))=1000×tan(51.3°+71°−90°)/(1−(tan(51.3°+71°−90°/tan 71°))=808.07 - Further, the inventors of the present technology analyzed the optimum reflector angle β and the width of the opening portion between the reflectors 112 (the size of the opening portion) by obtaining a change in the height (inclined surface height) H satisfying the total reflection condition in a case in which the reflector angle β is changed by a detailed simulation. The result of the simulation is illustrated in
FIG. 16 . - A table of
FIG. 16 illustrates a value (unit: nm) of the height (inclined surface height) satisfying the total reflection condition (unit: degree) when the value (unit: degree) of reflector angle β and the value (unit: nm) of the distance L to the inclined surface of thereflector 112 are changed. - Here, the table of
FIG. 16 illustrates the values of the height H obtained by calculating Formula (7) when β=60°, 65°, 68°, 70°, 71°, 73°, 74°, 75°, and 80°, and L=10 nm, 100 nm, 500 nm, 1000 nm, 1500 nm, 2000 nm, 2500 nm, and 3000 nm. - Further, it was found from the results of this simulation that it is desirable that the width of the portion in which the organic
light emitting element 101 serving as the light emitting portion emits (the portion in which theanode electrode 121 is exposed), that is, the size of the opening portion be 3000 nm or less, and in that case, it is desirable that the reflector angle β is 60° to 80°. An example of a structure satisfying such a total reflection condition is illustrated inFIG. 17 . InFIG. 17 , when β=71° and L=2000 nm, H=1616 nm. - Next, a flow of a first example of a top emission pixel manufacturing process according to an embodiment of the present technology will be described with reference to
FIGS. 18 to 22 . - Further, in the first example of the manufacturing process, for the sake of convenience of description, a flow of a process of manufacturing the
sub pixels arbitrary sub pixels 100 constituting thepixel 10 will be described. - Here, first, a dry processing process is performed as illustrated in A of
FIG. 18 . With the dry processing process,anode electrodes first member 111A. Further, for example, SiO2 or the like can be used as a material of thefirst member 111A. Further, a reflective material such as Al, Cu or the like can be used as the material of theanode electrode 121. - Next, a CVD film forming process is performed as illustrated in B of
FIG. 18 . With the CVD film forming process, afirst member 111B is formed on theanode electrodes first member 111A. Further, for example, P—SiO or the like can be used as a material of thefirst member 111B. - Next, a resist coating process is performed as illustrated in C of
FIG. 18 . With the resist coating process, thefirst member 111B is coated with aphotoresist 211. - Then, an exposure process is performed as illustrated in D of
FIG. 19 . With the exposure process, a surface of thephotoresist 211 is exposed to light in a pattern form using aphotomask 221, so that a pattern including the exposed portion (an exposed portion 212) and an unexposed portion (a portion excluding the exposed portion 212) is formed. - Then, a developing process is performed as illustrated in E of
FIG. 19 . With the developing process, the exposedportion 212 of thephotoresist 211 is removed. - Then, an etching process is performed as illustrated in F of
FIG. 19 . With the etching process, the portion excluding the portion masked by thephotoresist 211 is etched, and a part of thefirst member 111B is processed. - Then, a resist coating process is performed as illustrated in G of
FIG. 20 . With the resist applying process, the processed portion of thefirst member 111B is coated with thephotoresist 211. - Next, an exposure process is performed as illustrated in H of
FIG. 20 . With the exposure process, a surface of thephotoresist 211 is exposed to light in a pattern form using aphotomask 231, so that a pattern including the exposed portions (exposedportions 213 and 214) and an unexposed portion (a portion excluding the exposedportions 213 and 214) is formed. - Then, a developing process is performed as illustrated in I of
FIG. 20 . With the developing process, the exposedportions photoresist 211 are removed. - Then, an etching process is performed as illustrated in J of
FIG. 21 . With the etching process, the portion excluding the portion masked by thephotoresist 211 is etched, and a part of thefirst member 111B is processed. With the process, the 30 reflectors having different heights in therespective sub pixels 100 are formed, and theanode electrodes first member 111A are exposed. - Then, a resist peeling process is performed as illustrated in K of
FIG. 21 . With the resist peeling process, thephotoresist 211 is peeled off. - Then, a vapor deposition process and a CVD film forming process are performed as illustrated in L of
FIG. 21 . With the vapor deposition process, alayer 141 including an organic layer and a cathode electrode layer (formed of a transparent material such as ITO, for example) and aprotective film 142 are formed on the surface of theanode electrodes first member 111B formed on thefirst member 111A. Further, the organic layer emits light between the anode electrode and the cathode electrode layer. For example, it is desirable that the organic layer emit white light. Further, for example, an insulating material, a conductive material, or the like can be used as a material of theprotective film 142. - Then, a planarizing process is performed as illustrated in M of
FIG. 22 . With the planarizing process, asecond member 151 is embedded and planarized. Further, for example, a resin such as an acrylic resin, a polyimide resin, a silicon resin, or the like can be used as a material of thesecond member 151. - As described above, after the
layer 141 including the organic layer and the cathode electrode layer and theprotective film 142 are formed, thesecond member 151 is further formed, so that the light reflecting layer (reflector structure) including the first member 111 (111B) and thesecond member 151 is formed. - Then, a color filter forming process is performed as illustrated in N of
FIG. 22 . With the color filter forming process,color filters second member 151. - In the
pixel 10 manufactured as described above, since the inclined surface 30 height of the reflector caused by the inclination of the inclined surface of thefirst member 111 is different for eachsub pixel 100, therespective sub pixels 100 differ in luminance, and thus it is possible to improve the luminance of thespecific sub pixel 100. - The first example of the manufacturing process has been described above.
- Next, a flow of a second example of a top emission pixel manufacturing process according to an embodiment of the present technology will be described with reference to
FIGS. 23 to 27 . - Further, in the second example of the manufacturing process, for the sake of convenience of description, a flow of a process of manufacturing the
sub pixels arbitrary sub pixels 100 constituting thepixel 10 will be described. - Here, first, a dry processing process is performed as illustrated in A of
FIG. 23 . With the dry processing process,anode electrodes first member 111A. Further, for example, SiO2 or the like can be used as a material of thefirst member 111A. Further, a reflective material such as Al, Cu or the like can be used as the material of theanode electrode 121. - Next, a CVD film forming process is performed as illustrated in B of
FIG. 23 . With the CVD film forming process, afirst member 111B is formed on theanode electrodes first member 111A. Further, for example, P—SiO or the like can be used as a material of thefirst member 111B. - Next, a resist coating process is performed as illustrated in C of
FIG. 23 . With the resist coating process, thefirst member 111B is coated with aphotoresist 311. - Then, an exposure process is performed as illustrated in D of
FIG. 24 . With the exposure process, a surface of thephotoresist 311 is exposed to light in a pattern form using aphotomask 321, so that a pattern including the exposed portion (an exposed portion 312) and an unexposed portion (a portion excluding the exposed portion 312) is formed. - Then, a developing process is performed as illustrated in E of
FIG. 24 . With the developing process, the exposedportion 312 of thephotoresist 311 is removed. - Then, an etching process is performed as illustrated in F of
FIG. 24 . With the etching process, the portion excluding the portion masked by thephotoresist 311 is etched, and a part of thefirst member 111B is processed. - Then, a resist coating process is performed as illustrated in G of
FIG. 25 . With the resist applying process, the processed portion of thefirst member 111B is coated with thephotoresist 311. - Next, an exposure process is performed as illustrated in H of
FIG. 25 . With the exposure process, a surface of thephotoresist 311 is exposed to light in a pattern form using aphotomask 331, so that a pattern including the exposed portions (exposedportions portions - Then, a developing process is performed as illustrated in I of
FIG. 25 . With the developing process, the exposedportions photoresist 311 are removed. - Then, an etching process is performed as illustrated in J of
FIG. 26 . With the etching process, the portion excluding the portion masked by thephotoresist 311 is etched, and a part of thefirst member 111B is processed. With the process, the reflectors having different heights in therespective sub pixels 100 are formed, and the 30anode electrodes first member 111A are exposed. - Then, a resist peeling process is performed as illustrated in K of
FIG. 26 . With the resist peeling process, thephotoresist 311 is peeled off. - Then, a vapor deposition process and a CVD film forming process are performed as illustrated in L of
FIG. 26 . With the vapor deposition process, alayer 141 including an organic layer and a cathode electrode layer (formed of a transparent material such as ITO, for example) and aprotective film 142 are formed on the surface of theanode electrodes first member 111B formed on thefirst member 111A. Further, the organic layer emits light between the anode electrode and the cathode electrode layer. For example, it is desirable that the organic layer emit white light. Further, for example, an insulating material, a conductive material, or the like can be used as a material of theprotective film 142. - Then, a planarizing process is performed as illustrated in M of
FIG. 27 . With the planarizing process, asecond member 151 is embedded and planarized. Further, for example, a resin such as an acrylic resin, a polyimide resin, a silicon resin, or the like can be used as the second member. - As described above, after the
layer 141 including the organic layer and the cathode electrode layer and theprotective film 142 are formed, thesecond member 151 is further formed, so that the light reflecting layer (reflector structure) including the first member 111 (111B) and thesecond member 151 is formed. - Then, a color filter forming process is performed as illustrated in N of
FIG. 27 . With the color filter forming process,color filters second member 151. - In the
pixel 10 manufactured as described above, since the inclined surface height of the reflector caused by the inclination of the inclined surface of thefirst member 111 is different for eachsub pixel 100, therespective sub pixels 100 differ in luminance, and thus it is possible to improve the luminance of thespecific sub pixel 100. - The second example of the manufacturing process has been described above.
- In the above-described embodiments, the
pixel 10 is described as being the WRGB pixel, that is, including the foursub pixels sub pixel 100 is not limited thereto. - For example, the
pixel 10 may not include thesub pixel 100W and may include threesub pixels sub pixel 100 of another color having high visibility equal to that of white (W) may be used instead of the white (W)sub pixel 100W. Further, in thepixel 10, the arrangement order of a plurality ofsub pixels 100 may be an arbitrary order that differs for each color. - Further, in the first and second embodiments, the inclined surface height of the
reflector 112 is adjusted for eachsub pixel 100, whereas in the third embodiment, the position of theanode electrode 121 side is adjusted for eachsub pixel 100, but the adjustments may be performed at the same time. In other words, in thepixel 10, both the inclined surface height of thereflector 112 and the position on theanode electrode 121 side may be adjusted for eachsub pixel 100. - Further, a material and a thickness of each layer, a film forming method, a 25 film forming conditions, and the like described in the above embodiments are not limited to the above description, and other materials and thicknesses, or other film forming methods, and other film forming conditions may be used. Further, in the above-described embodiments and the like, the configuration of the organic
light emitting element 101 has been specifically described, but it is not necessary to include all the layers, and another layer may be further included. - Further, in the above-described embodiments, the configuration of the active matrix type display element (display device) has been described, but the present technology can be also applied to a passive matrix type display element (display device). Furthermore, the configuration of the pixel drive circuit for active matrix driving is not limited to that described in the above embodiments, and a capacitive element, a transistor, or the like may be added if necessary. In this case, in addition to the signal line drive circuit 21 (
FIG. 1 ) and the scan line drive circuit 22 (FIG. 1 ) described above, a necessary drive circuit may be appropriately added with a change in the pixel drive circuit. -
FIG. 28 illustrates an example of an external appearance of a single-lens reflex camera (a lens interchangeable single-lens reflex type digital camera) as an electronic device (an imaging apparatus) to which the display element to which an embodiment of the present technology is applied is applied. - As illustrated in A of
FIG. 28 , the single-lens reflex camera includes, for example, an interchangeable photographing lens unit (interchangeable lens) 412 installed on a front right side of a camera body (camera body) 411 and agrip portion 413 installed on a front left side and gripped by a photographer. - Further, as illustrated in B of
FIG. 28 , amonitor 414 is installed substantially at a central portion of a rear surface of thecamera body 411. A viewfinder (eyepiece window) 415 is installed above themonitor 414. By looking into theviewfinder 415, the photographer can visually recognize a light image of a subject guided from the photographinglens unit 412 and decide a composition. - This
viewfinder 415 is constituted by the display element (display element 1) to which an embodiment of the present technology described above is applied. -
FIG. 29 illustrates an example of an external appearance of a head mounted display (HMD) as an electronic device to which the display element to which an embodiment of the present technology is applied is applied. - As illustrated in A of
FIG. 29 , the head mounted display includes, for example,ear hook portions 512 worn on a head of a user formed on both sides of a glassestype display unit 511. Thedisplay unit 511 is constituted by the display element (display element 1) to which an embodiment of the present technology is applied. - For example, the user wearing the head mounted display of A of
FIG. 29 on the head can view a virtual reality (VR) video displayed on thedisplay unit 511. - Further, A of
FIG. 29 illustrates an example of a non-transmissive type head mounted display completely covering the eyes of the user, but adisplay unit 521 of a transmissive type (for example, video transmissive type or the like) head mounted display may be constituted by the display element (display element 1) to which an embodiment of the present technology is applied as illustrated in B ofFIG. 29 . - For example, the user wearing the head mounted display of B of
FIG. 29 on the head can view an augmented reality (AR) image displayed on thedisplay unit 521. - Further, in
FIGS. 28 and 29 , the single-lens reflex camera and the head mounted display are illustrated as the electronic devices to which the display element to which an embodiment of the present technology is applied is applied, but the display element to which an embodiment of the present technology is applied may be applied to an electronic device such as, for example, a smartphone, a television receiver, a personal computer, a video camera, a mobile phone, a game machine, a wearable device, or the like. - Further, the embodiments of the present technology are not limited to the above-described embodiments, and various modifications can be made within the scope not departing from the gist of the present technology.
- According to an embodiment of the present technology, there is provided a display element, including: a display region including pixels arranged in a two-dimensional form, each of the pixels including a plurality of sub pixels. In each pixel, a height of a light reflecting portion with respect to a light emitting portion is adjusted for each sub pixel.
- In a display element according to an embodiment of the present technology, a display region including pixels arranged in a two-dimensional form is provided, each of the pixels including a plurality of sub pixels. In each pixel, a height of a light reflecting portion with respect to a light emitting portion is adjusted for each sub pixel.
- According to an embodiment of the present technology, there is provided an electronic device including a display element including a display region including pixels arranged in a two-dimensional form, each of the pixels including a plurality of sub pixels. In each pixel, a height of a light reflecting portion with respect to a light emitting portion is adjusted for each sub pixel.
- An electronic device according to an embodiment of the present technology is equipped with a display element in which a display region including pixels arranged in a two-dimensional form is provided, each of the pixels including a plurality of sub pixels. In each pixel, a height of a light reflecting portion with respect to a light emitting portion is adjusted for each sub pixel.
- Further, the display element or the electronic device according to embodiments of the present technology may be an independent device or an internal block constituting one device.
- Additionally, the present technology may also be configured as below.
(1)
A display element, including: -
- a display region including pixels arranged in a two-dimensional form, each of the pixels including a plurality of sub pixels,
- in which, in each pixel, a height of a light reflecting portion with respect to a light emitting portion is adjusted for each sub pixel.
(2)
The display element according to (1), in which a height of an inclined surface of the light reflecting portion in a stacking direction is adjusted for each sub pixel.
(3)
The display element according to (2), in which the height of the inclined surface of the light reflecting portion is different for each sub pixel.
(4)
The display element according to (2), in which the height of the inclined surface of the light reflecting portion is different only in a specific sub pixel among the plurality of sub pixels.
(5)
The display element according to (1), in which a position of the light emitting portion in a stacking direction is adjusted for each sub pixel.
(6)
The display element according to (5), in which the position of the light emitting portion is different for each sub pixel.
(7)
The display element according to (5), in which the position of the light emitting portion is different only in a specific sub pixel among the plurality of sub pixels.
(8)
The display element according to any one of (1) to (7), in which a height of an inclined surface of the light reflecting portion is adjusted in accordance with an angle of the inclined surface of the light reflecting portion and a width of a light emitting part of the light emitting portion.
(9)
- The display element according to any one of (1) to (8), in which each pixel includes a first sub pixel, a second sub pixel, and a third sub pixel that emit three basic colors of light and a fourth sub pixel that emits a non-basic color of light.
- (10)
The display element according to (9), in which the basic colors of light include red light, green light, and blue light, and the non-basic color of light is white light.
(11)
The display element according to any one of (1) to (10), -
- in which the sub pixel is a pixel including a light emitting element which emits light as the light emitting portion, and
- the light emitting element includes an electrode and an organic layer including a light emitting layer.
(12)
An electronic device including - a display element including
- a display region including pixels arranged in a two-dimensional form, each of the pixels including a plurality of sub pixels,
- in which, in each pixel, a height of a light reflecting portion with respect to a light emitting portion is adjusted for each sub pixel.
(13)
A display element, comprising: - a display region including a plurality of pixels arranged in a two-dimensional form, the plurality of pixels including a first pixel, a second pixel and a third pixel,
- a first light reflecting portion located between the first pixel and the second pixel, and a second light reflecting portion located between the second pixel and the third pixel,
- wherein a height of the first light reflecting portion and a height of the second light reflecting portion with respect to a light emitting portion of the plurality of pixels are different.
(14)
The display element according to (13), wherein the height of the first light reflecting portion and the height of the second light reflecting portion are different with respect to a common plane in a stacking direction.
(15)
The display element according to (13), wherein a position of the first light reflecting portion and a position of the second light reflecting portion in a stacking direction relative to a position of a light emitting portion of the plurality of pixels are different.
(16)
The display element according to (13), wherein the height of each light reflecting portion is a length along which a light reflecting surface of that light reflecting portion extends in a stacking direction.
(17)
The display element according to (13), wherein each of the first, second and third pixels emits either one of the three basic colors of light or a non-basic color of light.
(18)
The display element according to (17), wherein the basic colors of light include red light, green light, and blue light, and the non-basic color of light is white light.
(19)
The display element according to (13), - wherein each pixel is a pixel including a light emitting element which emits light as the light emitting portion, and
- the light emitting element includes an electrode and an organic layer including a light emitting layer.
(20)
An electronic device comprising - a display element, the display element comprising
- a display region including a plurality of pixels arranged in a two-dimensional form, the plurality of pixels including a first pixel, a second pixel and a third pixel,
- a first light reflecting portion located between the first pixel and the second pixel, and
- a second light reflecting portion located between the second pixel and the third pixel,
- wherein a height of the first light reflecting portion and a height of the second light reflection portion with respect to a light emitting portion of the plurality of pixels are different.
(21)
A bottom emission organic electroluminescence, EL, display element, comprising: - a display region including a plurality of pixels arranged in a two-dimensional form,
- the plurality of pixels including a first pixel, a second pixel and a third pixel,
- a first light reflecting portion located between the first pixel and the second pixel, and
- a second light reflecting portion located between the second pixel and the third pixel,
- wherein a height of the first light reflecting portion and a height of the second light reflecting portion with respect to a light emitting portion of the plurality of pixels are the same.
(22)
The display element according to (21), wherein the height of each light reflecting portion is a length along which a light reflecting surface of that light reflecting portion extends in a stacking direction.
(23)
The display element according to (21), wherein each of the first, second and third pixels emits either one of the three basic colors of light or a non-basic color of light.
(24)
The display element according to (23), wherein the basic colors of light include red light, green light, and blue light, and the non-basic color of light is white light.
(25)
The display element according to (21), wherein - each pixel is a pixel including a light emitting element which emits light as a light emitting portion, and
- the light emitting element includes an electrode and an organic layer including a light emitting layer.
(26)
An electronic device comprising a bottom emission organic EL display element, the bottom emission organic EL display element comprising: - a display region including a plurality of pixels arranged in a two-dimensional form,
- the plurality of pixels including a first pixel, a second pixel and a third pixel,
- a first light reflecting portion located between the first pixel and the second pixel, and
- a second light reflecting portion located between the second pixel and the third pixel,
- wherein a height of the first light reflecting portion and a height of the second light reflecting portion with respect to a light emitting portions of the plurality of pixels are the same.
-
-
- 1 display element
- 10 pixel
- 11 substrate
- 21 signal line drive circuit
- 22 scan line drive circuit
- 23 display region
- 31 signal line
- 32 scan line
- 33 pixel drive circuit
- 100, 100R, 100G, 100B, 100W sub pixel
- 101, 101R, 101G, 101B, 101W organic light emitting element
- 111 first member
- 112, 112R, 112G, 112B, 112W reflector
- 121, 121R, 121G, 121B, 121W anode electrode
- 131, 131R, 131G, 131B color filter
- 141 layer
- 142 protective film
- 151 second member
Claims (9)
1. (canceled)
2. A bottom emission display element comprising:
a display region including a plurality of pixels arranged in a two-dimensional array, the plurality of pixels including a first pixel, a second pixel and a third pixel,
a first light reflecting portion located between the first pixel and the second pixel, and a second light reflecting portion located between the second pixel and the third pixel,
wherein a height of the first light reflecting portion and a height of the second light reflecting portion are the same with respect to a light emitting portion of at least one of the plurality of pixels.
3. The bottom emission display element according to claim 2 , wherein the height of the first light reflecting portion is a length along which a light reflecting surface of the first light reflecting portion extends in a stacking direction.
4. The bottom emission display element according to claim 2 , wherein the first, second and third pixels respectively emit one of red light, green light, blue light or white light.
5. The bottom emission display element according to claim 2 , wherein
each of the first, second and third pixels includes a light emitting element which emits light as a light emitting portion, the light emitting element including an electrode and an organic layer including a light emitting layer.
6. An electronic device comprising a bottom emission display element according to claim 2 .
7. The electronic device according to claim 6 , wherein the height of the first light reflecting portion is a length along which a light reflecting surface of the first light reflecting portion extends in a stacking direction.
8. The electronic device according to claim 6 , wherein the first, second and third pixels respectively emit one of red light, green light, blue light or white light.
9. The electronic device according to claim 6 , wherein
each of the first, second and third pixels includes a light emitting element which emits light as a light emitting portion, the light emitting element including an electrode and an organic layer including a light emitting layer.
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