WO2021074792A1 - Acoustic transducer and method of manufacturing - Google Patents
Acoustic transducer and method of manufacturing Download PDFInfo
- Publication number
- WO2021074792A1 WO2021074792A1 PCT/IB2020/059611 IB2020059611W WO2021074792A1 WO 2021074792 A1 WO2021074792 A1 WO 2021074792A1 IB 2020059611 W IB2020059611 W IB 2020059611W WO 2021074792 A1 WO2021074792 A1 WO 2021074792A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal layer
- array
- composite
- piezoelectric composite
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0688—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
- B06B1/0692—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF with a continuous electrode on one side and a plurality of electrodes on the other side
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
- B06B2201/70—Specific application
- B06B2201/73—Drilling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
- B06B2201/70—Specific application
- B06B2201/76—Medical, dental
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B47/00—Survey of boreholes or wells
- E21B47/002—Survey of boreholes or wells by visual inspection
- E21B47/0025—Survey of boreholes or wells by visual inspection generating an image of the borehole wall using down-hole measurements, e.g. acoustic or electric
Definitions
- the present disclosure relates to acoustic transducers, in particular to piezoelectric transducers, which may be incorporated into imaging probes for medical examination and nondestructive inspection of structures such as pipes, wells, or manufactured parts
- the heat used in soldering to the transducer can affect the piezoelectric effect when it exceeds the Curie temperature.
- the present inventors have also observed that operating in certain hostile environments, such as high temperature, high pressure and chemical presence can lead to cracking at the solder joint.
- FIG. 2 is a cross-sectional view of a transducer stack according to prior art devices.
- Fig 11 is a cross-sectional view of a downhole acoustic probe in a tubular.
- manufacturing comprises combining various techniques for adding metal layers and then selectively removing portions to form individual electrodes for the elements, portions of which extend beyond the piezoelectric composite. Some methods use a support structure to deposit layers.
- Figure 1 shows a side view of a transducer stack for a single element, where an array of elements would extend into the page.
- Piezoelectric composite 22 is covered on a first major surface with a conductive material acting as a common electrode 23 for the array.
- the opposing, second surface is covered on a per element basis with a second conductive material to form addressable (thin) electrodes 25. These electrodes activate the piezoelectric posts in composite 22 to vibrate generally perpendicular to both the first and second surfaces.
- the stack of Figure 1 additionally comprises a thick conductive layer 26 in electrical contact with or part of the thin electrode layer 25.
- the full electrode for each element is comprised of a first thin layer 25 and second thicker layer 26.
- the layer 26 is at least an order of magnitude thicker than layer 25. Both layers extend across the elevation of each transducer element so as to activate the underlying piezoelectric material, and layer 26 extends past the piezoelectric composite, generally continuing in the direction of the elevation dimension to form lead portion 24.
- FIG. 4A illustrates the initial stages of manufacture starting with a piezoelectric composite plate 22, ground flat on both major surfaces. Because the plate is typically quite wide, relative to a single array, plural strips 42 of the composite are diced (step 2) and then placed spaced-apart onto a base, preferably held in place and separated by a temporary, sacrificial support 37 (step 3).
- the support material may be a wax, metal, epoxy or a plastic frame.
- the support structure may have voids therein to hold the composite strips.
- a thin layer 47 of conductive material is deposited on the top and bottom of composite surfaces as electrodes 23, 25, as well as over the support 37. These layers may be added to the composite plate earlier on in the process, as is typically done with commercially available piezoelectric composite. Because the composite is not conductive, forms of electroless depositions are used to add the thin electrode layers, such as vacuum deposition (including physical / chemical vapor deposition, evaporation deposition and sputtering), electroless plating by immersion or adhesion of a foil sheet or thin wireframe.
- This layer 47 may be thin (i.e.
- a thick electrode layer 48 is added to provide strength and robustness at elevated temperatures and pressures. This layer forms electrode 26, extending beyond the composite stack to provide an electrode lead portion 24 which can then be connected to the flex circuit wires.
- the support 37 provides a ground to deposit and hold the extended portion, especially when the addressable elements are present or being formed.
- the radial transducer is a 1D array of transducer elements 12 separated radially around the body of the device.
- the geometry of the transducer (including any lens and reflector) directs a pulse outward to sonify the surface of the well, pipe or manufactured part.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Acoustics & Sound (AREA)
- Manufacturing & Machinery (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17/765,841 US12569884B2 (en) | 2019-10-17 | 2020-10-13 | Acoustic transducer and method of manufacturing |
| CN202080070606.6A CN114502927B (zh) | 2019-10-17 | 2020-10-13 | 声换能器和制造方法 |
| JP2022516450A JP2022552082A (ja) | 2019-10-17 | 2020-10-13 | 音響トランスデューサ及び製造方法 |
| KR1020227007019A KR102907521B1 (ko) | 2019-10-17 | 2020-10-13 | 음향 변환기 및 제조 방법 |
| EP20876631.1A EP4045880B1 (en) | 2019-10-17 | 2020-10-13 | Acoustic transducer and method of manufacturing |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1915002.8A GB2588218B (en) | 2019-10-17 | 2019-10-17 | Acoustic transducer and method of manufacturing |
| GB1915002.8 | 2019-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2021074792A1 true WO2021074792A1 (en) | 2021-04-22 |
Family
ID=68728157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/IB2020/059611 Ceased WO2021074792A1 (en) | 2019-10-17 | 2020-10-13 | Acoustic transducer and method of manufacturing |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12569884B2 (https=) |
| EP (1) | EP4045880B1 (https=) |
| JP (1) | JP2022552082A (https=) |
| KR (1) | KR102907521B1 (https=) |
| CN (1) | CN114502927B (https=) |
| GB (1) | GB2588218B (https=) |
| WO (1) | WO2021074792A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11197655B2 (en) * | 2016-10-13 | 2021-12-14 | Fujifilm Corporation | Ultrasound probe and method of manufacturing ultrasound probe |
| US12000266B2 (en) | 2020-03-13 | 2024-06-04 | Geonomic Technologies Inc. | Method and apparatus for measuring a wellbore |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115474128B (zh) * | 2022-10-19 | 2024-03-08 | 哈尔滨工业大学(威海) | 一种高灵敏度水声换能器 |
| KR102737599B1 (ko) * | 2022-12-30 | 2024-12-05 | (주)아이블포토닉스 | 음향광학 가변 필터 제조 방법 |
| WO2025117505A1 (en) * | 2023-11-27 | 2025-06-05 | Sonocharge Energy, Inc. | Acoustic devices and methods of fabrication |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110257532A1 (en) * | 2008-12-25 | 2011-10-20 | Konica Minolta Medical & Graphic, Inc. | Ultrasonic probe and method of preparing ultrasonic probe |
| CA3092535A1 (en) * | 2018-03-02 | 2019-09-06 | Novosound Ltd | Ultrasound array transducer manufacturing |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5512254B2 (https=) | 1973-07-03 | 1980-03-31 | ||
| US4206994A (en) * | 1978-09-20 | 1980-06-10 | Xerox Corporation | Belt tensioning system |
| EP0040374A1 (de) | 1980-05-21 | 1981-11-25 | Siemens Aktiengesellschaft | Ultraschallwandleranordnung und Verfahren zu seiner Herstellung |
| JPS60143358U (ja) * | 1984-03-05 | 1985-09-24 | 呉羽化学工業株式会社 | アレイ型超音波探触子 |
| DE3808017A1 (de) | 1988-03-10 | 1989-09-21 | Siemens Ag | Piezokeramischer ultraschallwandler und verfahren zu seiner herstellung |
| US5457863A (en) | 1993-03-22 | 1995-10-17 | General Electric Company | Method of making a two dimensional ultrasonic transducer array |
| US5592730A (en) | 1994-07-29 | 1997-01-14 | Hewlett-Packard Company | Method for fabricating a Z-axis conductive backing layer for acoustic transducers using etched leadframes |
| JP3526486B2 (ja) | 1995-04-28 | 2004-05-17 | 株式会社東芝 | 超音波探触子,この探触子を備えた超音波プローブ,およびこれらの製造方法 |
| EP0796669A3 (de) | 1996-03-19 | 1998-04-29 | Siemens Aktiengesellschaft | Ultraschallwandler |
| US5755909A (en) * | 1996-06-26 | 1998-05-26 | Spectra, Inc. | Electroding of ceramic piezoelectric transducers |
| JP3673035B2 (ja) | 1996-10-25 | 2005-07-20 | 株式会社東芝 | 超音波トランスジューサ |
| JP2001223556A (ja) * | 2000-02-14 | 2001-08-17 | Ueda Japan Radio Co Ltd | 圧電振動子及びアレイ型圧電振動子 |
| DE10018355A1 (de) * | 2000-04-13 | 2001-12-20 | Siemens Ag | Ultraschallwandler und Verfahren zur Herstellung eines Ultraschallwandlers |
| JP2001340340A (ja) | 2000-06-02 | 2001-12-11 | Toshiba Corp | 超音波診断装置 |
| US7036363B2 (en) | 2003-07-03 | 2006-05-02 | Pathfinder Energy Services, Inc. | Acoustic sensor for downhole measurement tool |
| US7224104B2 (en) * | 2003-12-09 | 2007-05-29 | Kabushiki Kaisha Toshiba | Ultrasonic probe and ultrasonic diagnostic apparatus |
| JP4769127B2 (ja) | 2005-05-30 | 2011-09-07 | 株式会社東芝 | 超音波プローブ及び超音波プローブ製造方法 |
| JP2006345312A (ja) | 2005-06-09 | 2006-12-21 | Denso Corp | 超音波センサ及び超音波振動子 |
| US20070041273A1 (en) | 2005-06-21 | 2007-02-22 | Shertukde Hemchandra M | Acoustic sensor |
| JP4842726B2 (ja) | 2006-07-18 | 2011-12-21 | 富士フイルム株式会社 | 超音波検査装置 |
| JP5002402B2 (ja) | 2007-10-03 | 2012-08-15 | 株式会社東芝 | 超音波探触子及び超音波診断装置 |
| WO2010044312A1 (ja) * | 2008-10-17 | 2010-04-22 | コニカミノルタエムジー株式会社 | アレイ型超音波振動子 |
| JP5099175B2 (ja) | 2010-05-28 | 2012-12-12 | 株式会社村田製作所 | 超音波センサ |
| JP6519136B2 (ja) | 2014-09-26 | 2019-05-29 | ブラザー工業株式会社 | 圧電アクチュエータ、及び、圧電アクチュエータの製造方法 |
| JP6261820B2 (ja) * | 2015-05-11 | 2018-01-17 | 富士フイルム株式会社 | 電気音響変換フィルム原反、電気音響変換フィルム、および、その製造方法 |
| JP2017099664A (ja) * | 2015-12-02 | 2017-06-08 | セイコーエプソン株式会社 | 超音波プローブユニット、超音波プローブ、及び超音波装置 |
| JP2017176311A (ja) * | 2016-03-29 | 2017-10-05 | セイコーエプソン株式会社 | 超音波デバイス、超音波測定装置、及び超音波画像表示装置 |
| WO2020102564A1 (en) * | 2018-11-14 | 2020-05-22 | Invensense, Inc. | Dual electrode piezoelectric micromachined ultrasound transducer device |
-
2019
- 2019-10-17 GB GB1915002.8A patent/GB2588218B/en active Active
-
2020
- 2020-10-13 KR KR1020227007019A patent/KR102907521B1/ko active Active
- 2020-10-13 US US17/765,841 patent/US12569884B2/en active Active
- 2020-10-13 EP EP20876631.1A patent/EP4045880B1/en active Active
- 2020-10-13 WO PCT/IB2020/059611 patent/WO2021074792A1/en not_active Ceased
- 2020-10-13 JP JP2022516450A patent/JP2022552082A/ja active Pending
- 2020-10-13 CN CN202080070606.6A patent/CN114502927B/zh active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110257532A1 (en) * | 2008-12-25 | 2011-10-20 | Konica Minolta Medical & Graphic, Inc. | Ultrasonic probe and method of preparing ultrasonic probe |
| CA3092535A1 (en) * | 2018-03-02 | 2019-09-06 | Novosound Ltd | Ultrasound array transducer manufacturing |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP4045880A1 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11197655B2 (en) * | 2016-10-13 | 2021-12-14 | Fujifilm Corporation | Ultrasound probe and method of manufacturing ultrasound probe |
| US12000266B2 (en) | 2020-03-13 | 2024-06-04 | Geonomic Technologies Inc. | Method and apparatus for measuring a wellbore |
| US12326080B2 (en) | 2020-03-13 | 2025-06-10 | Geonomic Technologies Inc. | Method and apparatus for measuring a wellbore |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102907521B1 (ko) | 2026-01-05 |
| US20220339670A1 (en) | 2022-10-27 |
| GB201915002D0 (en) | 2019-12-04 |
| EP4045880A1 (en) | 2022-08-24 |
| EP4045880B1 (en) | 2026-03-04 |
| KR20220082808A (ko) | 2022-06-17 |
| EP4045880A4 (en) | 2023-11-01 |
| US12569884B2 (en) | 2026-03-10 |
| GB2588218B (en) | 2021-10-27 |
| EP4045880C0 (en) | 2026-03-04 |
| CN114502927B (zh) | 2025-04-29 |
| CN114502927A (zh) | 2022-05-13 |
| JP2022552082A (ja) | 2022-12-15 |
| GB2588218A (en) | 2021-04-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US12569884B2 (en) | Acoustic transducer and method of manufacturing | |
| US20240315137A1 (en) | Methods for Manufacturing Ultrasound Transducers and Other Components | |
| US7514851B2 (en) | Curved capacitive membrane ultrasound transducer array | |
| US6437487B1 (en) | Transducer array using multi-layered elements and a method of manufacture thereof | |
| US5920972A (en) | Interconnection method for a multilayer transducer array | |
| US8316518B2 (en) | Methods for manufacturing ultrasound transducers and other components | |
| JP4758634B2 (ja) | 多層セラミック音響変換器の製造方法 | |
| JP4702826B2 (ja) | 多層セラミック音響変換器の作製方法 | |
| US20200222941A1 (en) | Methods for manufacturing ultrasound transducers and other components | |
| KR102569596B1 (ko) | 고주파 초음파 트랜스듀서 | |
| JP2013501405A (ja) | 集積電気接続を備えた超音波イメージング変換器音響スタック | |
| US12138659B2 (en) | Planar phased ultrasound transducer array | |
| CN101657914A (zh) | 用于超声换能器的声学堆栈及其制造方法 | |
| CN101405090A (zh) | 阵列式超声换能器 | |
| US6429574B1 (en) | Transducer array using multi-layered elements having an even number of elements and a method of manufacture thereof | |
| US6664717B1 (en) | Multi-dimensional transducer array and method with air separation | |
| US6761688B1 (en) | Multi-layered transducer array and method having identical layers | |
| CN1304340A (zh) | 包括复合导电镀层的多元件声探针及其制作方法 | |
| JP2001509901A (ja) | 音響プローブの製造方法 | |
| KR20030062435A (ko) | 금속화 및 제거된 폴리머를 접지면으로서 이용하는 다중소자 음향 프로브 제조 방법 | |
| US6561034B2 (en) | Ultrasonic sparse imaging array | |
| US7344501B1 (en) | Multi-layered transducer array and method for bonding and isolating | |
| Gregory et al. | High density interconnect for polymer based ultrasound transducers |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 20876631 Country of ref document: EP Kind code of ref document: A1 |
|
| ENP | Entry into the national phase |
Ref document number: 2022516450 Country of ref document: JP Kind code of ref document: A |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| ENP | Entry into the national phase |
Ref document number: 2020876631 Country of ref document: EP Effective date: 20220517 |
|
| WWG | Wipo information: grant in national office |
Ref document number: 202080070606.6 Country of ref document: CN |
|
| WWG | Wipo information: grant in national office |
Ref document number: 2020876631 Country of ref document: EP |
|
| WWG | Wipo information: grant in national office |
Ref document number: 17765841 Country of ref document: US |