Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
  • C08L83/04—Polysiloxanes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
  • H01B1/20—Conductive material dispersed in non-conductive organic material
  • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/04—Polysiloxanes
  • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/02—Elements
  • C08K3/08—Metals
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K7/00—Use of ingredients characterised by shape
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K7/00—Use of ingredients characterised by shape
  • C08K7/16—Solid spheres
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K9/00—Use of pretreated ingredients
  • C08K9/02—Ingredients treated with inorganic substances
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
  • C08G77/04—Polysiloxanes
  • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/02—Elements
  • C08K3/08—Metals
  • C08K2003/0806—Silver
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K2201/00—Specific properties of additives
  • C08K2201/001—Conductive additives
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2203/00—Applications
  • C08L2203/20—Applications use in electrical or conductive gadgets
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2205/00—Polymer mixtures characterised by other features
  • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
  • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2207/00—Properties characterising the ingredient of the composition
  • C08L2207/32—Properties characterising the ingredient of the composition containing low molecular weight liquid component
  • C08L2207/324—Liquid component is low molecular weight polymer
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
  • C08L2314/00—Polymer mixtures characterised by way of preparation
  • C08L2314/08—Polymer mixtures characterised by way of preparation prepared by late transition metal, i.e. Ni, Pd, Pt, Co, Rh, Ir, Fe, Ru or Os, single site catalyst

Definitions

• the present invention relates to a conductive resin composition that is flexible and has excellent resistance stability in a stretched state.
• the present inventors can cure the cured product at a low temperature (80 ° C.) that does not damage the member, and can suppress an increase in resistance even when the cured product is stretched.
• a sex resin composition was found.
• the gist of the present invention will be described below.
• a conductive resin composition containing the following (A) to (E) and having a content of the component (B) of 6 to 50 parts by mass with respect to 100 parts by mass of the component (A): (A) Polyorganosiloxane having an alkenyl group (B) Polyorganosiloxane having the following structure
• the conductive resin composition according to any one of.
• the conductive resin composition of the present invention contains the following (A) to (E), and the content of the component (B) is 6 to 50 parts by mass with respect to 100 parts by mass of the component (A):
• the present invention provides a conductive resin composition that cures at a low temperature, has excellent conductivity (volume resistivity), and can obtain a cured product in which a change in resistivity due to stretching is suppressed.
• the polyorganosiloxane having an alkenyl group of the component (A) used in the present invention is not particularly limited, and various types can be used.
• the molecular structure of the polyorganosiloxane having an alkenyl group is substantially linear, but there may be a partially branched structure.
• molecular chain double-ended vinyl group-blocking polydimethylsiloxane for example, molecular chain double-ended vinyl group-blocking polydimethylsiloxane; molecular chain-terminal vinyl group-blocking dimethylsiloxane / diphenylsiloxane copolymer; molecular chain double-ended vinyl group-blocking dimethylsiloxane / methylvinylsiloxane / diphenylsiloxane copolymer; molecular chain Polydimethylsiloxane with one end sealed with a vinyl group and the other end with a trimethoxy group; one end of the molecular chain closed with a vinyl group and the other end with a trimethylsiloxy group Blocked polydimethylsiloxane; trimethylsiloxy group-blocked dimethylsiloxane, methylvinylsiloxane, and diphenylsiloxane copolymers at both ends of the molecular chain can
• the viscosity of the component (A) is preferably 100 to 15,000 cPs, more preferably 1,000 to 10,000 cPs, and most preferably 3,000 to 8,000 cPs at 25 ° C.
• the viscosity of the component (A) at 25 ° C. can be measured using a cone plate type viscometer.
• the vinyl equivalent of the component (A) is preferably 0.0001 to 20 Eq / kg, more preferably 0.001 to 10 Eq / kg, and most preferably 0.01 to 1 Eq / kg.
• the vinyl equivalent of the component (A) can be determined by the Wijs method. Specifically, the carbon double bond is reacted with iodine monochloride (excess amount), then the excess iodine monochloride is reacted with potassium iodide, and the liberated iodine is titrated to the end point with an aqueous sodium thiosulfate solution.
• the vinyl equivalent can be calculated from the amount of iodine consumed.
• the weight average molecular weight of the component (A) is preferably 700 or more and less than 150,000, more preferably 2000 or more and less than 130,000, and most preferably 8000 or more and less than 100,000.
• Mw weight average molecular weight
• a value measured by gel permeation chromatography (GPC) using polystyrene as a standard substance shall be adopted.
• component (A) Commercially available products of the component (A) include polydimethylsiloxane (viscosity (25 ° C.): 5000 cPs, vinyl equivalent: 0.04 Eq / kg, weight average molecular weight: 49,500) manufactured by Gelest.
• polydimethylsiloxane viscosity (25 ° C.): 5000 cPs, vinyl equivalent: 0.04 Eq / kg, weight average molecular weight: 49,500
• polyorganosiloxane having vinyl groups at both ends of the molecular chain for example, a trade name manufactured by Gelest, DMS-V series (for example, DMS-V31, DMS-V31S15, DMS-V33, DMS-V35, DMS-V35R, DMS-V41, DMS-V42, DMS-V46, DMS-V51, DMS-V52), product name manufactured by Gelest, PDV series (for example, PDV-0341, PDV-0346, PDV-0535, PDV -0541, PDV-01631, PDV-01635, PDV-01641, PDV-2335), product names manufactured by Gelest, PMV-9925, PVV-3522, FMV-4031, EDV-2022 and the like.
• DMS-V series for example, DMS-V31, DMS-V31S15, DMS-V33, DMS-V35, DMS-V35R, DMS-V41, DMS-V42, DMS-V
• Component (B) Polyorganosiloxane having the following structure
• the component (B) of the present invention is a polyorganosiloxane having the following structure.
• R is an alkyl group and / or an aryl group, respectively, and n is an integer of 1 or more).
• the component (B) has excellent compatibility with the component (A) and is a main component that suppresses an increase in resistance during stretching.
• the carbon number of R is preferably 1 to 10, and more preferably 1 to 8.
• Specific examples of R include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, pentyl group, isopentyl group, hexyl group, isohexyl group, cyclohexyl group, phenyl group, methylphenyl group and heptyl group.
• Examples thereof include an isoheptyl group, an octyl group, an isooctyl group, a nonyl group, an isononyl group, a decyl group and an isodecyl group.
• the group consists of a methyl group, an ethyl group, a propyl group, an isopropyl group and a phenyl group. Those having 1 or more are preferable, and those having 1 or more methyl group and / or phenyl group are most preferable.
• R is independently a methyl group (component (B); dimethylsilicone oil) and / or a phenyl group (component (B); diphenylsilicone oil). From the viewpoint of versatility, it is preferable that R at the end of the molecular chain is a methyl group. These may be used alone or in combination of two or more.
• the kinematic viscosity of the component (B) is preferably 5 to 5000 mm 2 / s, more preferably 10 to 3000 mm 2 / s, and most preferably 50 to 1000 mm 2 / s.
• the kinematic viscosity of the component (B) is 5 mm 2 / s or more, it does not separate with time when mixed with the component (A), so that the storage stability can be maintained and the storage stability can be maintained at 5000 mm 2 / s.
• it is s or less it is easy to mix with the component (C), and the component (C) can be uniformly dispersed in the conductive resin composition.
• the kinematic viscosity of the component (B) can be measured by a method according to JIS Z 8803: 2011.
• the amount of the component (B) added is 6 to 50 parts by mass with respect to 100 parts by mass of the component (A). It is more preferably 6 to 30 parts by mass, and most preferably 6 to 20 parts by mass. If the amount of the component (B) added is 6 parts by mass or more, the volume resistivity can be stabilized at the time of stretching, and if it is 50 parts by mass or less, the volume resistivity before stretching is lowered or the conductivity is reduced. As a sex resin composition, sedimentation of the component (C) over time can be suppressed.
• Component (C) Conductive particles
• the component (C) of the present invention is conductive particles, such as metal powders such as gold, silver, copper, nickel, and palladium, and alloys such as solder formed by combining a plurality of types thereof. , Organic polymer particles and plated particles obtained by coating metal particles with another metal thin film.
• gold, silver, copper, and particles whose surface is coated with these metals are preferable from the viewpoint of achieving low resistance.
• silver, copper, and particles coated with these metals are more preferable, and since silver is less likely to be oxidized and easier to handle than copper, silver and silver-coated particles are most preferable. These may be used alone or in combination of two or more.
• Examples of the shape of the component (C) include spherical shape, indefinite shape, scaly shape, needle shape, and dendritic shape.
• the component (C) may be used alone or in combination of two or more, but it is preferable to use two or more in combination because lower resistance and high thermal conductivity can be realized. From the viewpoint of exhibiting low resistance without increasing the viscosity of the conductive resin composition too much, it is more preferable to combine spherical and scaly shapes. Further, if the specific gravity of the conductive particles is too heavy, the conductive particles may settle during storage of the conductive resin composition. Therefore, when using spherical particles, use particles in which organic polymer particles are coated with metal. Is preferable.
• the organic polymer particles acrylic particles, styrene particles, butadiene particles, silicone particles and the like are preferable, and among them, acrylic particles and styrene particles are preferable from the viewpoint of versatility.
• the spherical shape means that the sphericity (minor axis / major axis) represented by the minor axis with respect to the major axis is 0.6 to 1.0.
• the scaly shape is non-spherical and flake-shaped.
• the average particle size of the component (C) is preferably 0.05 to 70 ⁇ m, preferably 0.1 to 50 ⁇ m, and most preferably 0.5 to 20 ⁇ m.
• the average particle size of the component (C) is 0.05 ⁇ m or more, the resistance can be stabilized, and when it is 70 ⁇ m or less, the conductive resin composition is applied by dispense coating, screen printing, or the like. It is possible to suppress the occurrence of nozzle and mesh clogging at the time.
• Examples of the method for confirming the average particle size include image analysis of a laser diffraction / scattering type, a microsorting control type particle size / shape distribution measuring instrument, an optical microscope, an electron microscope, and the like. In the present invention, conductive particles measured by the laser diffraction / scattering method are used.
• the specific surface area of the component (C) is preferably 0.01 to 10 m 2 / g, more preferably 0.1 to 7 m 2 / g, and most preferably 1 to 5 m 2 / g. preferable.
• the specific surface area of the component (C) is 0.01 to 10 m 2 / g, it can be highly filled in the conductive resin composition, so that high conductivity and high heat dissipation can be realized. ..
• the specific surface area can be calculated from the BET specific surface area.
• tap density is preferably 0.5 ⁇ 10g / cm 3, more preferably 1 ⁇ 8g / cm 3, most preferably 2 ⁇ 5g / cm 3.
• tap density can be measured according to JIS Z 2512: 2012.
• saturated fatty acids and unsaturated fatty acids can be used as lubricants.
• Specific examples include capric acid, undecylic acid, lauric acid, tridecylic acid, myristic acid, pentadecylic acid, palmitic acid, margaric acid, stearic acid, linolenic acid, linoleic acid, palmitoleic acid, oleic acid and their ester compounds.
• Lubricants are used in manufacturing for the purpose of preventing aggregation, improving dispersibility, etc. when processing solid or powdered metals, but even in conductive resin compositions, lubricants are composed of conductive particles and resins. Since the wettability and dispersibility are improved and the oxidation of the metal surface is suppressed, higher conductivity can be realized.
• the component (C) preferably contains 10 to 2000 parts by mass, and more preferably 50 to 1000 parts by mass with respect to 100 parts by mass of the component (A). Most preferably, it contains 100 to 600 parts by mass.
• the component (C) is contained in an amount of 10 to 2000 parts by mass with respect to 100 parts by mass of the component (A), the volume resistivity at the initial stage and during stretching of the cured product can be stabilized.
• Component (D) Compound having a hydrosilyl group
• the component (D) of the present invention is a compound having a hydrosilyl group.
• the compound having a hydrosilyl group is not particularly limited as long as it is a compound containing a hydrosilyl group that can be cured by cross-linking with the component (A), and various compounds can be used, but an organohydrogenpolysiloxane is preferable and is in the molecule.
• a silicone composed of linear, branched, cyclic or reticulated molecules containing a silicon atom to which a hydrogen atom is directly bonded. From the viewpoint of low-temperature curability, it is preferable that the molecule has two or more silicon atoms to which hydrogen atoms are directly bonded.
• the hydrogen atom may be bonded to either the terminal silicon atom or the side chain silicon atom, but it is preferably bonded to the side chain from the viewpoint of enabling low temperature curability and improving the toughness of the cured product.
• the substituent other than the hydrogen atom bonded to the silicon atom of the component (D) is preferably an alkyl group or a phenyl group having 1 to 6 carbon atoms from the viewpoint of low temperature curability, but other groups may be used.
• the amount of the component (D) added is preferably 0.5 to 1.5 equivalents with respect to one alkenyl group of the component (A). More preferably, it is 0.8 to 1.2 equivalents.
• the amount of the component (D) added is 0.5 equivalent or more, the crosslink density is appropriately formed, so that the toughness of the cured product can be maintained, and when it is 1.5 equivalent or less, dehydrogenation is performed. Foaming due to the reaction can be prevented, and there is no risk of impairing the characteristics (resin strength, resistance stability) of the cured product of the conductive resin composition.
• the amount of the component (D) added is preferably 0.1 to 50 parts by mass with respect to 100 parts by mass of the component (A). More preferably, it is 0.5 to 30 parts by mass.
• the amount of the component (D) added is 0.1 parts by mass or more, the crosslink density is appropriately formed, so that the toughness of the cured product can be maintained, and when it is 50 parts by mass or less, dehydrogenation is performed. Foaming due to the reaction can be prevented, and there is no risk of impairing the characteristics (resin strength, resistance stability) of the cured product of the conductive resin composition.
• D Commercially available products of the component (D) include trade names manufactured by Gelest, DMS-H013, DMS-H11, DMS-H21, DMS-H025, DMS-H31, DMS-H42, PMS-H03, HMS-013, HMS-031, HMS-064, HMS-071, HMS-991, HMS-992, HMS-993, HDP-111, HPM-502, HMS-151, HMS-301, HQM-105, HQM-107 and Toray. Examples thereof include a trade name manufactured by Dow Corning Co., Ltd., DAWSIL SH1107 Fluid (trimethylsiloxy-terminated methyl hydrogen siloxane).
• the component (E) of the present invention is a catalyst capable of promoting a hydrosilylation reaction, and any catalyst can be used.
• examples thereof include radical initiators such as organic peroxides and azo compounds, and transition metal catalysts. From the viewpoint of low temperature curability, transition metal catalysts are preferable, and rhodium catalysts, ruthenium catalysts, and platinum catalysts are more preferable. Most preferably, it is a platinum catalyst.
• Specific examples of the platinum catalyst include platinum chloride, an alcohol solution of platinum chloride, a reaction product of platinum chloride acid and alcohol, a reaction product of platinum chloride acid and an olefin compound, and platinum chloride acid and a vinyl group-containing siloxane.
• platinum-based catalysts such as reactants, platinum-olefin complexes, and platinum-vinyl group-containing siloxane complexes. Further, those in which these catalysts are dissolved and dispersed in a solvent such as isopropanol or toluene or siloxane oil may be used.
• RhCl (PPh 3 ) 3 RhCl 3 , Rh / Al 2 O 3 , RuCl 3 , IrCl 3 , FeCl 3 , AlCl 3 , PdCl 2 ⁇ xH 2 O, NiCl 2 , TiCl 4. , Etc. can be mentioned.
• RhCl (PPh 3 ) 3 RhCl 3 , Rh / Al 2 O 3 , RuCl 3 , IrCl 3 , FeCl 3 , AlCl 3 , PdCl 2 ⁇ xH 2 O, NiCl 2 , TiCl 4. , Etc. can be mentioned.
• These catalysts may be used alone or in combination of two or more.
• the content of the component (E) is preferably in the range of 1 ⁇ 10 -10 to 1 mol with respect to 1 mol of the alkenyl group of the component (A), and more preferably 1 ⁇ 10 -8 to 1 ⁇ 10 ⁇ . It is 3 mol. If the content of the component (E) is 1 ⁇ 10 -10 mol or more with respect to 1 mol of the alkenyl group of the component (A), low temperature curability can be maintained, and if it is 1 mol or less, foaming due to hydrogen gas is prevented. can do.
• Examples of the commercially available product of the component (E) include a platinum catalyst manufactured by Yumicore Precious Metals Japan Co., Ltd., and a trade name: PT-VTSC-3.0X.
• reaction inhibitor The conductive resin composition of the present invention may contain a reaction inhibitor as long as the characteristics of the present invention are not impaired. It is preferable to use a reaction inhibitor because both low-temperature curability and storage stability can be achieved at the same time.
• the reaction inhibitor it is preferable to add a compound containing an aliphatic unsaturated bond that does not react during storage at room temperature and starts the reaction when heated. Specific examples of the compound containing an aliphatic unsaturated bond include 3-hydroxy-3-methyl-1-butyne, 3-hydroxy-3-phenyl-1-butyne, and 3,5-dimethyl-1-hexin-.
• Examples thereof include propagyl alcohols such as 3-ol and 1-ethynyl-1-cyclohexanol, ene-in compounds, maleic anhydride, and maleic esters such as dimethyl maleate. Of these, maleic acid ester is preferable from the viewpoint of compatibility with the conductive resin composition.
• an organic phosphorus compound can be used as another reaction inhibitor. Specific examples thereof include triorganophosphins, diorganophosphins, organophosphons, and triorganophosphites.
• an organic sulfur compound can be used as another reaction inhibitor.
• organic sulfur compound examples include organomercaptans, diorganosulfides, hydrogen sulfide, benzothiazole, thiazole, and benzothiazole disulfide.
• a nitrogen-containing compound can be used as another reaction inhibitor.
• Specific examples of the nitrogen-containing compound include N, N, N', N'-tetramethylethylenediamine, N, N-dimethylethylenediamine, N, N-diethylethylenediamine, N, N-dibutylethylenediamine, N, N-dibutyl.
• reaction inhibitors may be used alone or in combination of two or more.
• the amount of the reaction inhibitor is preferably 0.01 to 10 parts by mass, more preferably 0.1 to 7 parts by mass, and most preferably 0.3 to 5 parts by mass with respect to 100 parts by mass of (A). Is.
• the amount of the reaction inhibitor is 0.01 parts by mass or more with respect to 100 parts by mass of (A)
• the storage stability can be maintained as a conductive resin composition, and when it is 10 parts by mass or less. Low temperature curability can be maintained.
• a filler that does not impair the characteristics may be added for the purpose of improving the elastic modulus, fluidity, etc. of the cured product.
• the shape of the filler is not particularly limited, but a spherical shape is preferable because it can improve the mechanical strength of the cured product of the conductive resin composition and suppress an increase in viscosity.
• the average particle size of the filler is not particularly limited, but is preferably in the range of 0.1 to 1000 ⁇ m, and more preferably in the range of 0.5 to 300 ⁇ m.
• the filler include organic powder, inorganic powder, metallic powder and the like.
• the filler for the inorganic powder examples include glass, silica, alumina, mica, ceramics, silicone rubber powder, calcium carbonate, aluminum nitride, carbon powder, kaolin clay, dried clay minerals, and dried diatomaceous earth.
• the blending amount of the inorganic powder is preferably about 0.1 to 100 parts by mass with respect to 100 parts by mass of the component (A). If the blending amount of the inorganic powder is larger than 0.1 parts by mass, the effect will not be reduced, and if it is 100 parts by mass or less, sufficient fluidity of the conductive resin composition can be obtained, and good workability can be obtained. Be done.
• silica can be blended for the purpose of adjusting the viscosity of the conductive resin composition or improving the mechanical strength of the cured product.
• those hydrophobized with organochlorosilanes, polyorganosiloxane, hexamethyldisilazane and the like can be used.
• Specific examples of silica (fumed silica) include, for example, trade names Aerosil (registered trademark) R974, R972, R972V, R972CF, R805, R812, R812S, R816, R8200, RY200, RX200, RY200S manufactured by Nippon Aerosil Co., Ltd. , R202 and other commercially available products.
• Examples of the filler of the organic powder include polyethylene, polypropylene, nylon, crosslinked acrylic, crosslinked polystyrene, polyester, polyvinyl alcohol, polyvinyl butyral, and polycarbonate.
• the blending amount of the organic powder is preferably about 0.1 to 100 parts by mass with respect to 100 parts by mass of the component (A). If the blending amount of the organic powder is larger than 0.1 parts by mass, the effect will not be reduced, and if it is 100 parts by mass or less, sufficient fluidity of the conductive resin composition can be obtained, and good workability can be obtained. Be done.
• a solvent may be added to the conductive resin composition of the present invention as long as the characteristics are not impaired for the purpose of improving fluidity and coatability.
• a solvent having a low polarity is preferable, and a hydrocarbon type is more preferable, because of compatibility with the component (A).
• Specific examples thereof include benzene, toluene, xylene, n-hexane, isohexane, cyclohexane, methylcyclohexane, normal heptane, mineral spirit, naphthenic acid, and isoparaffinic acid, but naphthenic acid and isoparaffinic acid are preferable.
• the amount of the solvent added is preferably 0.1 to 100 parts by mass, more preferably 1 to 50 parts by mass, and most preferably 5 to 30 parts by mass with respect to 100 parts by mass of the component (A). is there.
• Examples of commercially available products of the solvent include naphthenic solvents manufactured by Standard Petroleum Co., Ltd., trade name: Exor D80, and the like.
• the conductive resin composition of the present invention is produced by mixing each component.
• the mixing order of each component is not particularly limited, and may be added and mixed all at once, or may be added and mixed sequentially.
• the conductive resin composition of the present invention forms a cured product by being heat-cured.
• the heating temperature is preferably 50 ° C. to 100 ° C., more preferably 50 to 90 ° C., and most preferably 50 to 80 ° C. Since the temperature is 50 ° C to 100 ° C, it can be applied to parts and members that are sensitive to heat, so that it can be applied to a wide range of fields.
• the curing time is preferably 10 minutes to 3 hours.
• the resistivity change multiple of the volume resistivity of the cured product obtained by curing the conductive resin composition of the present invention at 80 ° C. ⁇ 1 hour is the volume resistivity when stretched by 20% / the volume resistivity before (initial) stretching ⁇ It is preferably 100.
• the resistance change multiple volume resistivity when stretched by 20% / volume resistivity before (initial) stretching
• the resistance stability during stretching is good, so that the liquid crystal panel or flexible It can be suitably used for applications such as printed circuit boards and wearable terminals that require flexibility during stretching such as grounding and conduction bonding.
• ⁇ Applying method> As a method for applying the conductive resin composition of the present invention to an adherend, a known method is used. For example, methods such as dispensing with an automatic coating machine, spraying, inkjet printing, screen printing, gravure printing, dipping, and spin coating can be mentioned.
• the conductive resin composition of the present invention is liquid at 25 ° C.
• the conductive resin composition of the present invention exhibits low-temperature curability and excellent conductivity, it can be used for various electronic components. Among them, since the resistance stability at the time of stretching is good, it is preferable to develop it in applications requiring flexibility such as grounding and conductive adhesion such as liquid crystal panels, flexible printed circuit boards, and wearable terminals.
• the component (A) was weighed in a stirring container, the component (B) was weighed in a stirring container and stirred for 10 minutes, and the component (C) was weighed in a stirring container and stirred for 30 minutes. Further, 10 parts by mass of Exor D80 (naphthenic solvent; manufactured by Standard Petroleum Co., Ltd.) was added to 100 parts by mass of the component (A), and after stirring for 30 minutes, the component (D) was weighed in a stirring container to 30 parts. Stir for minutes. Further, dimethyl maleate (reaction inhibitor) was weighed at 0.75 parts by mass and the component (E) with respect to 100 parts by mass of the component (A), and the mixture was stirred for 15 minutes.
• the conductive resin compositions of Examples 1 to 3 and Comparative Examples 1 to 11 were prepared by such an operation procedure, respectively. Detailed preparation amounts are shown in Tables 1 and 2, and all numerical values are expressed in parts by mass. Both tests were performed at 25 ° C.
• a polytetrafluoroethylene tape cut to the same size as the glass plate is attached on a test piece of a glass plate of 100 mm ⁇ 100 mm ⁇ 2 mm in thickness, and the length is 100 mm ⁇ width 10 mm ⁇ thickness 80 ⁇ m on the polytetrafluoroethylene tape.
• a conductive resin composition was applied. The test piece was cured at 80 ° C. for 1 hour using a constant temperature bath, then returned to room temperature, and the surface of the cured product was touched with a polytetrafluoroethylene rod to confirm the presence or absence of curing.
• ⁇ The conductive resin composition does not adhere to the polytetrafluoroethylene rod (hardened).
• X The conductive resin composition adheres to the polytetrafluoroethylene rod (uncured).
• Passing criteria 100 x 10-6 ⁇ ⁇ m or less.
• the conductive resin compositions of Examples 1 to 3 were good in all of curability at 80 ° C., initial volume resistivity, and resistance change in the stretched state. Comparative Examples 1 and 2 had poor compatibility and curability, and a cured product could not be produced. Although Comparative Examples 3 to 7 used polyorganosiloxane having a reactive functional group and other plasticizers, satisfactory results could not be obtained in terms of low temperature curability and resistance change during stretching. In Comparative Example 8, the change in resistance in the stretched state was large, and the effect of the present invention could not be obtained. Comparative Example 9 was not satisfactory as a conductive resin composition because of its high initial volume resistivity. In Comparative Example 10 which does not contain the component (B), the resistance change in the stretched state is significantly increased, and it can be seen that the component (B) affects the resistance change in the stretched state.
• the conductive resin composition of the present invention is industrially useful because it can be cured at a low temperature to form a flexible cured product and the resistance change in the stretched state is small.

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• 2020
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