KR20220079531A - 도전성 수지 조성물 - Google Patents

도전성 수지 조성물 Download PDF

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Publication number
KR20220079531A
KR20220079531A KR1020227009703A KR20227009703A KR20220079531A KR 20220079531 A KR20220079531 A KR 20220079531A KR 1020227009703 A KR1020227009703 A KR 1020227009703A KR 20227009703 A KR20227009703 A KR 20227009703A KR 20220079531 A KR20220079531 A KR 20220079531A
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KR
South Korea
Prior art keywords
component
resin composition
conductive resin
group
preferable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020227009703A
Other languages
English (en)
Korean (ko)
Inventor
사토루 엔도
미레이 모토마츠
Original Assignee
가부시끼가이샤 쓰리본드
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Filing date
Publication date
Application filed by 가부시끼가이샤 쓰리본드 filed Critical 가부시끼가이샤 쓰리본드
Publication of KR20220079531A publication Critical patent/KR20220079531A/ko
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/32—Properties characterising the ingredient of the composition containing low molecular weight liquid component
    • C08L2207/324—Liquid component is low molecular weight polymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2314/00—Polymer mixtures characterised by way of preparation
    • C08L2314/08—Polymer mixtures characterised by way of preparation prepared by late transition metal, i.e. Ni, Pd, Pt, Co, Rh, Ir, Fe, Ru or Os, single site catalyst

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
KR1020227009703A 2019-10-04 2020-08-21 도전성 수지 조성물 Pending KR20220079531A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019183650 2019-10-04
JPJP-P-2019-183650 2019-10-04
PCT/JP2020/031631 WO2021065243A1 (ja) 2019-10-04 2020-08-21 導電性樹脂組成物

Publications (1)

Publication Number Publication Date
KR20220079531A true KR20220079531A (ko) 2022-06-13

Family

ID=75338182

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227009703A Pending KR20220079531A (ko) 2019-10-04 2020-08-21 도전성 수지 조성물

Country Status (5)

Country Link
US (1) US12104060B2 (enExample)
JP (1) JP7541247B2 (enExample)
KR (1) KR20220079531A (enExample)
CN (1) CN114450352B (enExample)
WO (1) WO2021065243A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102742117B1 (ko) * 2018-08-01 2024-12-16 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 점착제 조성물 및 이것을 사용한 점착 테이프 또는 점착 필름

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002046308A1 (en) * 2000-12-07 2002-06-13 Kaneka Corporation Semiconductive resion composition and semiconductive member
JP3922342B2 (ja) 2001-01-17 2007-05-30 信越化学工業株式会社 電気接点材料用又は電磁波シールド材料用導電性シリコーンゴム組成物及び電気接点材料用又は電磁波シールド材料用導電性部品
JP2004331742A (ja) 2003-05-02 2004-11-25 Shin Etsu Chem Co Ltd 付加反応硬化型導電性シリコーンゴム組成物及びその硬化方法並びにその硬化物
JP2007154100A (ja) * 2005-12-07 2007-06-21 Canon Inc 樹脂用導電剤、導電性樹脂組成物及び導電性樹脂組成物の製造方法
EP1878767A1 (en) * 2006-07-12 2008-01-16 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone grease composition and cured product thereof
JP2008038137A (ja) 2006-07-12 2008-02-21 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物およびその硬化物
TW200925199A (en) 2007-10-11 2009-06-16 Dow Corning Toray Co Ltd Metal particle dispersion structure, microparticles comprising this structure, articles coated with this structure, and methods of producing the preceding
JP5182515B2 (ja) * 2008-12-25 2013-04-17 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN101624471A (zh) * 2009-03-06 2010-01-13 上海锐朗光电材料有限公司 一种热固化现场成型高导电硅橡胶组合物及其应用
CN102220012B (zh) * 2011-06-08 2012-10-31 北京工业大学 电磁屏蔽用单组分挤出成型导电橡胶及其制备方法
JP5511872B2 (ja) * 2012-03-19 2014-06-04 日本バルカー工業株式会社 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート
WO2016017344A1 (ja) * 2014-07-30 2016-02-04 住友精化株式会社 シリコーン樹脂組成物、シリコーン樹脂硬化物、及び、光半導体素子封止体
CN107207835B (zh) * 2015-01-19 2020-04-17 京瓷株式会社 导电性树脂组合物以及半导体装置
JP6791672B2 (ja) * 2016-07-22 2020-11-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性ポリシロキサン組成物
CN111512400B (zh) * 2018-02-06 2023-03-10 三菱综合材料株式会社 银包覆树脂粒子

Also Published As

Publication number Publication date
CN114450352B (zh) 2023-12-26
US20220372292A1 (en) 2022-11-24
US12104060B2 (en) 2024-10-01
JPWO2021065243A1 (enExample) 2021-04-08
CN114450352A (zh) 2022-05-06
WO2021065243A1 (ja) 2021-04-08
JP7541247B2 (ja) 2024-08-28

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