JP7541247B2 - 導電性樹脂組成物 - Google Patents

導電性樹脂組成物 Download PDF

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Publication number
JP7541247B2
JP7541247B2 JP2021550419A JP2021550419A JP7541247B2 JP 7541247 B2 JP7541247 B2 JP 7541247B2 JP 2021550419 A JP2021550419 A JP 2021550419A JP 2021550419 A JP2021550419 A JP 2021550419A JP 7541247 B2 JP7541247 B2 JP 7541247B2
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component
resin composition
conductive resin
group
mass
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Japanese (ja)
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JPWO2021065243A5 (enExample
JPWO2021065243A1 (enExample
Inventor
悟 遠藤
美麗 本松
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ThreeBond Co Ltd
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ThreeBond Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/32—Properties characterising the ingredient of the composition containing low molecular weight liquid component
    • C08L2207/324—Liquid component is low molecular weight polymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2314/00—Polymer mixtures characterised by way of preparation
    • C08L2314/08—Polymer mixtures characterised by way of preparation prepared by late transition metal, i.e. Ni, Pd, Pt, Co, Rh, Ir, Fe, Ru or Os, single site catalyst

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
JP2021550419A 2019-10-04 2020-08-21 導電性樹脂組成物 Active JP7541247B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019183650 2019-10-04
JP2019183650 2019-10-04
PCT/JP2020/031631 WO2021065243A1 (ja) 2019-10-04 2020-08-21 導電性樹脂組成物

Publications (3)

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JPWO2021065243A1 JPWO2021065243A1 (enExample) 2021-04-08
JPWO2021065243A5 JPWO2021065243A5 (enExample) 2022-06-13
JP7541247B2 true JP7541247B2 (ja) 2024-08-28

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JP2021550419A Active JP7541247B2 (ja) 2019-10-04 2020-08-21 導電性樹脂組成物

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US (1) US12104060B2 (enExample)
JP (1) JP7541247B2 (enExample)
KR (1) KR20220079531A (enExample)
CN (1) CN114450352B (enExample)
WO (1) WO2021065243A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102742117B1 (ko) * 2018-08-01 2024-12-16 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 점착제 조성물 및 이것을 사용한 점착 테이프 또는 점착 필름

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004331742A (ja) 2003-05-02 2004-11-25 Shin Etsu Chem Co Ltd 付加反応硬化型導電性シリコーンゴム組成物及びその硬化方法並びにその硬化物
JP2008038137A (ja) 2006-07-12 2008-02-21 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物およびその硬化物
JP2009108312A (ja) 2007-10-11 2009-05-21 Dow Corning Toray Co Ltd 金属粒子分散構造体、該構造体からなる微粒子、該構造体により被覆された物品およびこれらの製造方法
JP2010150399A (ja) 2008-12-25 2010-07-08 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002046308A1 (en) * 2000-12-07 2002-06-13 Kaneka Corporation Semiconductive resion composition and semiconductive member
JP3922342B2 (ja) 2001-01-17 2007-05-30 信越化学工業株式会社 電気接点材料用又は電磁波シールド材料用導電性シリコーンゴム組成物及び電気接点材料用又は電磁波シールド材料用導電性部品
JP2007154100A (ja) * 2005-12-07 2007-06-21 Canon Inc 樹脂用導電剤、導電性樹脂組成物及び導電性樹脂組成物の製造方法
EP1878767A1 (en) * 2006-07-12 2008-01-16 Shin-Etsu Chemical Co., Ltd. Heat conductive silicone grease composition and cured product thereof
CN101624471A (zh) * 2009-03-06 2010-01-13 上海锐朗光电材料有限公司 一种热固化现场成型高导电硅橡胶组合物及其应用
CN102220012B (zh) * 2011-06-08 2012-10-31 北京工业大学 电磁屏蔽用单组分挤出成型导电橡胶及其制备方法
JP5511872B2 (ja) * 2012-03-19 2014-06-04 日本バルカー工業株式会社 熱伝導性樹脂組成物及びこれを用いた熱伝導性シート
WO2016017344A1 (ja) * 2014-07-30 2016-02-04 住友精化株式会社 シリコーン樹脂組成物、シリコーン樹脂硬化物、及び、光半導体素子封止体
CN107207835B (zh) * 2015-01-19 2020-04-17 京瓷株式会社 导电性树脂组合物以及半导体装置
JP6791672B2 (ja) * 2016-07-22 2020-11-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 熱伝導性ポリシロキサン組成物
CN111512400B (zh) * 2018-02-06 2023-03-10 三菱综合材料株式会社 银包覆树脂粒子

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004331742A (ja) 2003-05-02 2004-11-25 Shin Etsu Chem Co Ltd 付加反応硬化型導電性シリコーンゴム組成物及びその硬化方法並びにその硬化物
JP2008038137A (ja) 2006-07-12 2008-02-21 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物およびその硬化物
JP2009108312A (ja) 2007-10-11 2009-05-21 Dow Corning Toray Co Ltd 金属粒子分散構造体、該構造体からなる微粒子、該構造体により被覆された物品およびこれらの製造方法
JP2010150399A (ja) 2008-12-25 2010-07-08 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーングリース組成物

Also Published As

Publication number Publication date
CN114450352B (zh) 2023-12-26
KR20220079531A (ko) 2022-06-13
US20220372292A1 (en) 2022-11-24
US12104060B2 (en) 2024-10-01
JPWO2021065243A1 (enExample) 2021-04-08
CN114450352A (zh) 2022-05-06
WO2021065243A1 (ja) 2021-04-08

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