WO2021049643A1 - Alliage de soudage sans plomb - Google Patents

Alliage de soudage sans plomb Download PDF

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Publication number
WO2021049643A1
WO2021049643A1 PCT/JP2020/034572 JP2020034572W WO2021049643A1 WO 2021049643 A1 WO2021049643 A1 WO 2021049643A1 JP 2020034572 W JP2020034572 W JP 2020034572W WO 2021049643 A1 WO2021049643 A1 WO 2021049643A1
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WO
WIPO (PCT)
Prior art keywords
solder alloy
lead
mass
free solder
content
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PCT/JP2020/034572
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English (en)
Japanese (ja)
Inventor
西村　哲郎
貴利 西村
徹哉 赤岩
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株式会社日本スペリア社
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Application filed by 株式会社日本スペリア社 filed Critical 株式会社日本スペリア社
Priority to JP2021545632A priority Critical patent/JPWO2021049643A1/ja
Publication of WO2021049643A1 publication Critical patent/WO2021049643A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Definitions

  • the present invention relates to a lead-free solder alloy having excellent soldering characteristics and long-term reliability, and a solder joint using the alloy.
  • Sn-Ag-Cu-based solder alloys and Sn-Cu-Ni-based solder alloys are typical compositions thereof.
  • Sn-Cu-Ni-based solder alloys have excellent properties such as high mechanical strength, stability of joint strength against thermal history and impact, high fluidity and good mountability, and Sn-Ag. -The market is rapidly spreading due to the added cost advantage over Cu-based solder.
  • the Sn-Cu-Ni-based solder alloy contains a small amount of "Ni", which is recognized as a skin sensitizing substance.
  • "Ni” is a substance that is also contained in 500-yen coins, and is a component that is also found in environments where many people often touch it with their bare hands.
  • Lead-free solder as a bonding material is often used in the manufacture of electronic parts and electronic devices, but the current situation is that it is used in extremely limited environments compared to the opportunities that ordinary people touch, such as 500-yen coins. Is. Companies are required to provide safer products that do not contain skin sensitizers.
  • An object of the present invention is to provide a lead-free solder alloy and a solder joint that have the same solderability and joint reliability as that of the addition of "Ni" while not adding "Ni".
  • the present invention comprises a lead-free solder alloy containing Sn—Cu as a basic composition and one or more selected from the group of Co, Mn, Pd, Rh and Fe in the basic composition. And a solder joint using the lead-free solder alloy.
  • the present invention can have solderability equal to or higher than that of a lead-free solder alloy containing "Ni” and high bonding reliability while not adding "Ni”, it can be applied to electronic parts, electronic devices, and the like. It is a highly safe solder alloy that can be applied to soldering in a wide range of versatility and has little effect on the human body.
  • the lead-free solder alloy of the present invention is characterized by containing Sn—Cu as a basic composition and containing one or more selected from the group of Co, Mn, Pd, Rh, and Fe. It is a solder alloy and a solder joint using the lead-free solder alloy. Further, by containing Ge, Ga, P, Si, Al, V, and Zr having an antioxidant effect, solderability and workability at the time of soldering are further improved.
  • the Sn—Cu-based lead-free solder alloy to which "Ni” is added is known to have excellent mounting performance with stability of joint strength and solderability. These factors include the formation of (Cu, Ni) 6 Sn 5 IMC by the addition of "Ni” and the miniaturization of IMC particles.
  • Cu 6 Sn 5 in the Sn—Cu based solder alloy has a stable crystal structure of monoclinic crystals (hereinafter, ⁇ 'phase) and hexagonal crystals (hereinafter, ⁇ phase) at 186 ° C., respectively, and has an environmental temperature. It is known that the crystal structure on the stable side undergoes a phase transformation.
  • Co, Pd, Rh, Mn, and Fe were selected as the elements substitutable for "Ni" in order to have the same characteristics as when "Ni" was added.
  • the selected element has the same effect of refining IMC particles as the effect of "Ni”.
  • the fact that the IMC particles are made finer by the solder alloy to which Co is added and the shape and dimensions of the IMC particles are the same as those of the solder alloy to which "Ni" is added means that the solder alloy to which Co is added also has the same mechanical strength. It can be said that it is improving. It is known that the IMC formed at the bonding interface has the property of being harder and more brittle than the solder alloy. Since the IMC, the substrate, and the electronic components have different coefficients of linear expansion, stress is generated by thermal shock, and if the stress is biased, the IMC cracks, the IMC in the brittle part is destroyed, and the bonding reliability of the solder alloy is impaired. .. By suppressing the growth of IMC and making it finer, it becomes a highly reliable solder alloy with stable joint strength that can withstand stress.
  • the solder alloy of the present invention has improved fluidity, suppresses the generation of bridges and horns, and improves the through-hole rise property, and is a solder alloy with excellent mountability. found.
  • the lead-free solder alloy of the present invention has Sn and Cu as basic compositions, and is characterized by containing one or more selected from the group of Co, Mn, Pd, Rh, and Fe.
  • the Cu content is preferably 0.1 to 1.0% by mass, more preferably 0.5 to 0.9% by mass.
  • the Co content is preferably 0.001 to 0.1% by mass, more preferably 0.01 to 0.05% by mass.
  • the Mn content is preferably 0.001 to 0.01% by mass, more preferably 0.003 to 0.008% by mass.
  • the content of Pd is preferably 0.01 to 1.0% by mass, more preferably 0.04 to 0.1% by mass.
  • the content of Rh is preferably 0.005 to 0.5% by mass, more preferably 0.01 to 0.1% by mass.
  • the Fe content is preferably 0.001 to 0.01% by mass, more preferably 0.003 to 0.008% by mass.
  • the Sn content is other than the above elements and unavoidable impurities.
  • the "Ni" substitution elements of Co, Mn, Pd, Rh and Fe, Co is preferable.
  • one or more selected from the group of Ge, Ga, P, Si, Al, V, Zr can be used as an element having an antioxidant effect that can be added to the lead-free solder alloy of the present invention.
  • the content thereof is not particularly limited as long as it has the effect of the present invention, but the following content is preferable.
  • the content of Ge is preferably 0.0001 to 0.1% by mass, more preferably 0.005 to 0.01% by mass.
  • the content of Ga is preferably 0.0001 to 0.1% by mass, more preferably 0.003 to 0.008% by mass.
  • the content of P is preferably 0.0001 to 0.1% by mass, more preferably 0.003 to 0.005% by mass.
  • the Si content is preferably 0.0001 to 0.1% by mass, more preferably 0.005 to 0.01% by mass.
  • the Al content is preferably 0.0001 to 0.05% by mass, more preferably 0.003 to 0.008% by mass.
  • the V content is preferably 0.0001 to 0.05% by mass, more preferably 0.005 to 0.01% by mass.
  • the Zr content is preferably 0.0001 to 0.05% by mass, more preferably 0.005 to 0.01% by mass.
  • the lead-free solder alloy of the present invention is characterized in that Sn and Cu are used as basic compositions, and one or more selected from the group of Co, Mn, Pd, Rh, and Fe is contained therein. Furthermore, by containing one or more selected from the group of Ge, Ga, P, Si, Al, V, and Zr as an element having an antioxidant effect, excellent soldering characteristics and high bonding reliability are included. However, Ag, Sb, Bi, In, Zn, Ti and the like can also be contained within the range having the effect of the present invention. In addition, the shape can be arbitrarily processed according to the application.
  • soldering when soldering is performed by the dip soldering method, the solder shape is rod-shaped, and when soldering is performed by the reflow soldering method, a paste or ball is used.
  • solder joining using a soldering iron in the shape and preform shape it is possible to process and use it in a linear shape such as solder.
  • Examples 6 to 25 as elements having an antioxidant effect, Ge0.0001 to 0.1% by mass, Ga0.0001 to 0.1% by mass, P0.0001 to 0.1% by mass, Si0.0001 to Si0.0001 to It contains one or more of 0.1% by mass, Al0.0001 to 0.05% by mass, V0.0001 to 0.05% by mass, and Zr0.001 to 0.05% by mass.
  • the zero cross times of Examples 6 to 25 are all smaller than those of Comparative Example 1, and even if an element having an antioxidant content is contained, the element that does not hinder the wettability and refines the particles of the intermetallic compound is present. It can be seen that it is effective.
  • Example 2 Comparing the IMC particles formed at the bonding interface in Example 2 and Comparative Example 1 from the SEM photographs of FIGS. 2 to 4, they both have an elliptical shape, a large particle size, a major axis of 1.2 ⁇ m, and a minor axis of 0.8.
  • Comparative Example 2 containing no Ni or Co has a shape closer to a circle than Example 2 and Comparative Example 1, and has a large IMC particle size diameter of about 2.0 ⁇ m. It is about twice as much as that of Comparative Example 1 containing 2 or "Ni".
  • the IMC, the substrate, and the electronic components have different coefficients of linear expansion, stress is generated by thermal shock, and if the stress is biased, the IMC cracks, the IMC in the brittle part is destroyed, and the bonding reliability of the solder alloy is impaired. ..
  • Similar to Ni and Co by adding the elements Pd, Rh, Mn, and Fe, which refine the IMC particles, to the solder alloy, an IMC having the same shape as when "Ni" is added is formed. It can be expected that the mechanical strength will be improved and the solder alloy will have stable joint strength and high reliability.
  • the SEM photographs of FIGS. 2 to 4 show a comparison in which the lead-free solder alloy of the present invention containing Co in the composition based on Sn—Cu of Example 2 is a conventional composition containing “Ni”. Similar to Example 1, it shows that it is a highly reliable solder alloy with improved mechanical strength and stable bonding strength. Similarly, since the IMC particles are also refined into the elements of Mn, Pd, Rh, and Fe, the IMC particles formed by adding Mn, Pd, Rh, and Fe improve the mechanical strength of the solder alloy. It is presumed that the solder alloy to which Mn, Pd, Rh, and Fe are added has the effect of stabilizing the bonding strength and is a highly reliable solder alloy.
  • Example 7 which is Comparative Example 2 not contained, although the surface is glossy, a shrinkage cavity is seen in the central part of the solidified sample. Since the effect of adding "Ni" to the surface gloss is excellent and no shrinkage cavities are generated, the same effect can be seen in Example 2 in which Co is added, Co is a component of the lead-free solder alloy of the present invention. Is proof that it has a substitute effect of "Ni".
  • the lead-free solder alloy containing "Ni” has excellent solderability, workability at the time of soldering, mechanical properties, and joining reliability of the same or higher. Since it is possible to provide a solder joint, it can be expected to be widely applied to the joining of electronic devices and electronic parts.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'objectif de la présente invention est de fournir un alliage de soudage sans plomb et un corps lié par soudure qui, en dépit de l'absence d'addition de "Ni", ont une aptitude au brasage et des caractéristiques de liaison comme avec un alliage de soudage sans plomb où du "Ni" est ajouté.　Cet alliage de soudage sans plomb est caractérisé en ce que du Sn-Cu est utilisé en tant que composition basique et en ce que la composition basique contient un ou plusieurs éléments choisis dans le groupe constitué par Co, Mn, Pd, Rh et Fe. L'utilisation de l'alliage de soudage sans plomb permet d'obtenir : un alliage de soudage sans plomb qui, par rapport à une soudure sans plomb contenant du "Ni", est exempt de sensibilisation au Ni, et présente une excellente aptitude au soudage et une excellente aptitude au façonnage pendant le soudage et d'excellentes caractéristiques mécaniques et une excellente fiabilité de liaison ; et un corps lié par soudure utilisant l'alliage de soudage sans plomb.
PCT/JP2020/034572 2019-09-12 2020-09-11 Alliage de soudage sans plomb WO2021049643A1 (fr)

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JP2021545632A JPWO2021049643A1 (fr) 2019-09-12 2020-09-11

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JP2019165971 2019-09-12
JP2019-165971 2019-09-12

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WO2021049643A1 true WO2021049643A1 (fr) 2021-03-18

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003001482A (ja) * 2001-06-19 2003-01-08 Tokyo Daiichi Shoko:Kk 無鉛半田合金
JP2006061914A (ja) * 2004-08-24 2006-03-09 Nihon Almit Co Ltd 半田合金
JP2007038228A (ja) * 2005-07-29 2007-02-15 Nihon Almit Co Ltd はんだ合金
WO2009028147A1 (fr) * 2007-08-24 2009-03-05 Kabushiki Kaisha Toshiba Composition de collage
WO2013099849A1 (fr) * 2011-12-27 2013-07-04 千住金属工業株式会社 Alliage de brasage sans plomb à base de sn-cu
US20150151386A1 (en) * 2013-12-04 2015-06-04 Mk Electron Co., Ltd. Lead-free solder, solder paste and semiconductor device
WO2016189900A1 (fr) * 2015-05-26 2016-12-01 千住金属工業株式会社 Alliage de soudure, bille de soudure, soudure de puce, pâte de soudure et joint de soudure
JP2018167310A (ja) * 2017-03-30 2018-11-01 千住金属工業株式会社 はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003001482A (ja) * 2001-06-19 2003-01-08 Tokyo Daiichi Shoko:Kk 無鉛半田合金
JP2006061914A (ja) * 2004-08-24 2006-03-09 Nihon Almit Co Ltd 半田合金
JP2007038228A (ja) * 2005-07-29 2007-02-15 Nihon Almit Co Ltd はんだ合金
WO2009028147A1 (fr) * 2007-08-24 2009-03-05 Kabushiki Kaisha Toshiba Composition de collage
WO2013099849A1 (fr) * 2011-12-27 2013-07-04 千住金属工業株式会社 Alliage de brasage sans plomb à base de sn-cu
US20150151386A1 (en) * 2013-12-04 2015-06-04 Mk Electron Co., Ltd. Lead-free solder, solder paste and semiconductor device
WO2016189900A1 (fr) * 2015-05-26 2016-12-01 千住金属工業株式会社 Alliage de soudure, bille de soudure, soudure de puce, pâte de soudure et joint de soudure
JP2018167310A (ja) * 2017-03-30 2018-11-01 千住金属工業株式会社 はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手

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