JPWO2021049643A1 - - Google Patents
Info
- Publication number
- JPWO2021049643A1 JPWO2021049643A1 JP2021545632A JP2021545632A JPWO2021049643A1 JP WO2021049643 A1 JPWO2021049643 A1 JP WO2021049643A1 JP 2021545632 A JP2021545632 A JP 2021545632A JP 2021545632 A JP2021545632 A JP 2021545632A JP WO2021049643 A1 JPWO2021049643 A1 JP WO2021049643A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019165971 | 2019-09-12 | ||
| PCT/JP2020/034572 WO2021049643A1 (fr) | 2019-09-12 | 2020-09-11 | Alliage de soudage sans plomb |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021049643A1 true JPWO2021049643A1 (fr) | 2021-03-18 |
Family
ID=74865764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021545632A Pending JPWO2021049643A1 (fr) | 2019-09-12 | 2020-09-11 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2021049643A1 (fr) |
| WO (1) | WO2021049643A1 (fr) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003001482A (ja) * | 2001-06-19 | 2003-01-08 | Tokyo Daiichi Shoko:Kk | 無鉛半田合金 |
| JP3966554B2 (ja) * | 2004-08-24 | 2007-08-29 | 日本アルミット株式会社 | 半田合金 |
| JP2007038228A (ja) * | 2005-07-29 | 2007-02-15 | Nihon Almit Co Ltd | はんだ合金 |
| US20110091351A1 (en) * | 2007-08-24 | 2011-04-21 | Than Trong Long | Bonding composition |
| JP5614507B2 (ja) * | 2011-12-27 | 2014-10-29 | 千住金属工業株式会社 | Ｓｎ−Ｃｕ系鉛フリーはんだ合金 |
| KR101513494B1 (ko) * | 2013-12-04 | 2015-04-21 | 엠케이전자 주식회사 | 무연 솔더, 솔더 페이스트 및 반도체 장치 |
| JP5880766B1 (ja) * | 2015-05-26 | 2016-03-09 | 千住金属工業株式会社 | はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手 |
| JP2018167310A (ja) * | 2017-03-30 | 2018-11-01 | 千住金属工業株式会社 | はんだ合金、はんだボール、チップソルダ、はんだペースト及びはんだ継手 |
-
2020
- 2020-09-11 JP JP2021545632A patent/JPWO2021049643A1/ja active Pending
- 2020-09-11 WO PCT/JP2020/034572 patent/WO2021049643A1/fr active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021049643A1 (fr) | 2021-03-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20220309 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230906 |