WO2021039299A1 - Plaque stratifiée revêtue de métal des deux côtés, substrat de câblage imprimé et dispositif de câblage imprimé - Google Patents

Plaque stratifiée revêtue de métal des deux côtés, substrat de câblage imprimé et dispositif de câblage imprimé Download PDF

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Publication number
WO2021039299A1
WO2021039299A1 PCT/JP2020/029683 JP2020029683W WO2021039299A1 WO 2021039299 A1 WO2021039299 A1 WO 2021039299A1 JP 2020029683 W JP2020029683 W JP 2020029683W WO 2021039299 A1 WO2021039299 A1 WO 2021039299A1
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WIPO (PCT)
Prior art keywords
glass
glass cloth
pad
warp
weft
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PCT/JP2020/029683
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English (en)
Japanese (ja)
Inventor
立石　徹
出田　吾朗
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三菱電機株式会社
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Priority to JP2021542678A priority Critical patent/JP7250149B2/ja
Publication of WO2021039299A1 publication Critical patent/WO2021039299A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • This disclosure relates to a double-sided metal-clad laminate, a printed wiring board, and a printed wiring device.
  • Patent Document 1 discloses a metal-clad laminate used for a multilayer printed wiring board.
  • the present disclosure has been made in view of the above problems, and an object thereof is a double-sided metal capable of suppressing the occurrence of cracks in the ceramic capacitor regardless of the arrangement direction of the ceramic capacitor with respect to the metal-clad laminate. It is to provide a tension laminated board, a printed wiring board and a printed wiring device.
  • the double-sided metal-clad laminate of the present disclosure is provided on both sides of a laminate in which a plurality of central insulating layers and outer insulating layers arranged on both sides of the plurality of central insulating layers are laminated to each other. It has a metal layer.
  • the outer insulating layer includes a first glass cloth and a first insulating resin member impregnated in the first glass cloth and covering the first glass cloth, respectively.
  • Each of the plurality of central insulating layers includes a second glass cloth and a second insulating resin member impregnated in the second glass cloth and covering the second glass cloth.
  • the first longitudinal glass occupancy of each of the outer insulating layers is 20% or less.
  • the first lateral glass occupancy of each of the outer insulating layers is 20% or less.
  • the first longitudinal glass occupancy and the first transverse glass occupancy are both smaller than the larger of the second longitudinal glass occupancy and the second transverse glass occupancy of each of the plurality of central insulating layers.
  • the first warp glass occupancy rate is the area ratio of the warp threads of the first glass cloth in the cross section perpendicular to the extending direction of the warp threads of the first glass cloth.
  • the first weft glass occupancy is the area ratio of the weft of the first glass cloth in the cross section perpendicular to the extending direction of the weft of the first glass cloth.
  • the second warp glass occupancy rate is the area ratio of the warp threads of the second glass cloth in the cross section perpendicular to the extending direction of the warp threads of the second glass cloth.
  • the second weft glass occupancy is the area ratio of the weft of the second glass cloth in the cross section perpendicular to the extending direction of the weft of the second glass cloth.
  • the printed wiring board of the present disclosure includes the double-sided metal-clad laminate of the present disclosure.
  • the metal layer includes a first pad, a second pad separated from the first pad, a first lead-out wire connected to the first pad, and a second lead-out wire connected to the second pad. ..
  • the width of the first pad is 0.4 mm or less.
  • the width of the second pad is 0.4 mm or less.
  • the printed wiring device of the present disclosure includes a printed wiring board of the present disclosure and a ceramic capacitor bonded to the first pad and the second pad.
  • the ceramic capacitor has a length of 0.6 mm or less and a width of 0.3 mm or less.
  • the printed wiring board of the present disclosure includes a laminate in which a plurality of central insulating layers and outer insulating layers arranged on both sides of the plurality of central insulating layers are laminated to each other, and a metal provided on both sides of the laminate. It includes a layer and an internal metal layer provided inside the laminate.
  • the outer insulating layer includes a first glass cloth and a first insulating resin member impregnated in the first glass cloth and covering the first glass cloth, respectively.
  • Each of the plurality of central insulating layers includes a second glass cloth and a second insulating resin member impregnated in the second glass cloth and covering the second glass cloth.
  • the first longitudinal glass occupancy of each of the outer insulating layers is 20% or less.
  • the first lateral glass occupancy of each of the outer insulating layers is 20% or less.
  • the first longitudinal glass occupancy and the first transverse glass occupancy are both smaller than the larger of the second longitudinal glass occupancy and the second transverse glass occupancy of each of the plurality of central insulating layers.
  • the first warp glass occupancy is the area ratio of the warp of the first glass cloth in the cross section perpendicular to the extending direction of the warp of the first glass cloth.
  • the first weft glass occupancy is the area ratio of the weft of the first glass cloth in the cross section perpendicular to the extending direction of the weft of the first glass cloth.
  • the second warp glass occupancy rate is the area ratio of the warp threads of the second glass cloth in the cross section perpendicular to the extending direction of the warp threads of the second glass cloth.
  • the second weft glass occupancy is the area ratio of the weft of the second glass cloth in the cross section perpendicular to the extending direction of the weft of the second glass cloth.
  • the thickness of the laminate is 1.0 mm or more.
  • the metal layer includes a first pad, a second pad separated from the first pad, a first lead-out wire connected to the first pad, and a second lead-out wire connected to the second pad. ..
  • the width of the first pad is 0.4 mm or less.
  • the width of the second pad is 0.4 mm or less.
  • FIG. 5 is a schematic partially enlarged cross-sectional view showing one step of the method for manufacturing a double-sided metal-clad laminate according to the first embodiment. It is a schematic partial enlarged plan view which shows an example of the printed wiring board and the printed wiring apparatus of Embodiment 1 and Embodiment 2.
  • FIG. 5 is a schematic partially enlarged plan view showing another example of the printed wiring board and the printed wiring device of the first embodiment and the second embodiment. It is a figure which shows the result of an Example and a comparative example. It is a schematic partial enlarged sectional view of the multilayer metal-clad laminate of the second embodiment.
  • the double-sided metal-clad laminate 1 of the first embodiment will be described with reference to FIGS. 1 and 2.
  • the double-sided metal-clad laminate 1 includes a laminate 10 and metal layers 21 and 28.
  • the double-sided metal-clad laminate 1 means a metal-clad laminate having two metal layers 21 and 28.
  • the metal-clad laminate containing three or more metal layers is not the double-sided metal-clad laminate 1.
  • the laminate 10 includes a plurality of central insulating layers 11 and outer insulating layers 12 arranged on both sides of the plurality of central insulating layers 11.
  • the plurality of central insulating layers 11 and the outer insulating layer 12 are laminated on each other.
  • the number of outer insulating layers 12 is two or more. Specifically, at least one outer insulating layer 12 is arranged on the top surface 14 side of the laminated body 10. At least one outer insulating layer 12 is arranged on the bottom surface 15 side of the laminated body 10. The number of layers of the outer insulating layer 12 arranged on the top surface 14 side of the laminated body 10 may be equal to the number of layers of the outer insulating layer 12 arranged on the bottom surface 15 side of the laminated body 10.
  • the laminated body 10 may have a layer structure that is line-symmetrical in the thickness direction (z direction) of the laminated body 10.
  • the outer insulating layer 12 includes a first glass cloth 6 and a first insulating resin member 7 impregnated in the first glass cloth 6 and covering the first glass cloth 6, respectively. As shown in FIG. 2, the first glass cloth 6 extends in the x direction and the y direction. The first thickness of the first glass cloth 6 is smaller than the second thickness of the second glass cloth 8.
  • the first glass cloth 6 is formed by weaving warp threads 6a and weft threads 6b together. For example, the warp threads 6a extend in the y direction and the weft threads 6b extend in the x direction.
  • the weaving method of the first glass cloth 6 is not particularly limited, but is, for example, a plain weave.
  • the warp threads 6a and weft threads 6b of the first glass cloth 6 are each formed by bundling the first glass filaments.
  • the first diameter of the first glass filament contained in the warp 6a and the weft 6b of the first glass cloth 6 is smaller than the second diameter of the second glass filament contained in the warp 8a and the weft 8b of the second glass cloth 8.
  • the first glass cloth 6 is, for example, a glass cloth of IPC style number 2116, a glass cloth of IPC style number 3313, a glass cloth of IPC style number 1080, or a glass cloth of IPC style number 1501.
  • the first glass cloth 6 may be formed of E glass having an alkaline component content of 1% or less, or may be formed of S glass, T glass or NE glass.
  • E-glass is excellent in electrical insulation, weather resistance and cost performance.
  • S glass has higher tensile strength and higher tensile elastic modulus than E glass.
  • T-glass has a lower coefficient of thermal expansion and higher tensile elastic modulus than E-glass.
  • NE glass has a lower dielectric constant and lower dielectric loss tangent than E glass, and has a lower transmission loss than E glass.
  • the first insulating resin member 7 is mainly formed of a thermosetting resin such as an epoxy resin.
  • the first insulating resin member 7 may further contain a curing accelerator, a filler, a flame retardant, and the like.
  • the first longitudinal glass occupancy of each of the outer insulating layers 12 is 20% or less.
  • the first warp glass occupancy is the area ratio of the warp 6a of the first glass cloth 6 in the cross section (xz plane) perpendicular to the extending direction (longitudinal direction, y direction) of the warp 6a of the first glass cloth 6. is there.
  • the area ratio of the warp 6a of the first glass cloth 6 is obtained by dividing the area of the warp 6a of the first glass cloth 6 in this cross section (xz plane) by the area of each of the outer insulating layers 12 in this cross section (xz plane). Defined as a value.
  • the first lateral glass occupancy of each of the outer insulating layers 12 is 20% or less.
  • the first weft glass occupancy is the area ratio of the weft 6b of the first glass cloth 6 in the cross section (yz plane) perpendicular to the extending direction (horizontal direction, x direction) of the weft 6b of the first glass cloth 6. is there.
  • the area ratio of the weft 6b of the first glass cloth 6 is obtained by dividing the area of the weft 6b of the first glass cloth 6 in this cross section (xz plane) by the area of each of the outer insulating layers 12 in this cross section (yz plane). Defined as a value.
  • the area ratio of the yarn (warp 6a or weft 6b) of the first glass cloth 6 is the area of the yarn (warp 6a or weft 6b) calculated from the specifications of the first glass cloth 6 in the cross-sectional area of the first prepreg 42. Obtained by dividing.
  • the thickness of each of the outer insulating layers 12 is given by the nominal thickness of the first prepreg 42, which is standardized according to the first glass cloth 6.
  • the area of the yarn (warp 6a or weft 6b) is determined from the specifications of the first glass cloth 6 by, for example, the following formula (1).
  • the specifications of the first glass cloth 6 are the filament diameter, the number of filaments per yarn, and the yarn density (yarn arrangement direction (for example, the arrangement direction of the warp threads 6a is the x direction, and the arrangement direction of the weft threads 6b is the y direction). ) Includes the unit length of the glass cloth (eg, the number of yarns per inch (2.54 cm)).
  • Yarn area (filament diameter / 2) 2 x ⁇ x (number of filaments per yarn) x yarn density (1)
  • the number of layers of the plurality of central insulating layers 11 is, for example, three or more.
  • the number of layers of the central insulating layer 11 may be, for example, four or more, five or more, or six or more.
  • the number of layers of the central insulating layer 11 may be an even number or an odd number.
  • Each of the plurality of central insulating layers 11 includes a second glass cloth 8 and a second insulating resin member 9 impregnated in the second glass cloth 8 and covering the second glass cloth 8.
  • the second glass cloth 8 extends in the x direction and the y direction.
  • the second glass cloth 8 is formed by weaving warp threads 8a and weft threads 8b together.
  • the warp 8a extends in the y direction and the weft 8b extends in the x direction.
  • the weaving method of the second glass cloth 8 is not particularly limited, but is, for example, a plain weave.
  • the warp threads 8a and the weft threads 8b of the second glass cloth 8 are each formed by bundling the second glass filaments.
  • the second glass cloth 8 is, for example, a glass cloth having IPC style number 7628 or a glass cloth having IPC style number 7629.
  • the second glass cloth 8 (warp 8a and weft 8b) may be formed of E glass having an alkaline component content of 1% or less, or may be formed of S glass, T glass or NE glass.
  • the warp 8a and the weft 8b of the second glass cloth 8 may be formed of a material having the same composition as the warp 6a and the weft 6b of the first glass cloth 6. That is, the warp 8a and the weft 8b of the second glass cloth 8 may be the same as the warp 6a and the weft 6b of the first glass cloth 6 in the type of glass fiber.
  • the warp 8a and the weft 8b of the second glass cloth 8 may be formed of a material having a composition different from that of the warp 6a and the weft 6b of the first glass cloth 6. That is, the warp 8a and the weft 8b of the second glass cloth 8 may be different from the warp 6a and the weft 6b of the first glass cloth 6 in the type of glass fiber.
  • the second insulating resin member 9 is mainly formed of a thermosetting resin such as an epoxy resin.
  • the second insulating resin member 9 may further contain a curing accelerator, a filler, a flame retardant, and the like.
  • the second insulating resin member 9 may have the same composition as the first insulating resin member 7, or may have a composition different from that of the first insulating resin member 7.
  • the first longitudinal glass occupancy rate and the first horizontal glass occupancy rate of each of the outer insulating layers 12 are the second longitudinal glass occupancy rate and the second horizontal glass occupancy rate of each of the plurality of central insulating layers 11. Is smaller than the larger one.
  • the second warp glass occupancy is the area ratio of the warp 8a of the second glass cloth 8 in the cross section (xz plane) perpendicular to the extending direction (longitudinal direction, y direction) of the warp 8a of the second glass cloth 8. is there.
  • the area ratio of the warp 8a of the second glass cloth 8 is obtained by dividing the area of the warp 8a of the second glass cloth 8 in this cross section (xz plane) by the area of each of the central insulating layers 11 in this cross section (xz plane).
  • the second weft glass occupancy is the area ratio of the weft 8b of the second glass cloth 8 in the cross section (yz plane) perpendicular to the extending direction (horizontal direction, x direction) of the weft 8b of the second glass cloth 8. is there.
  • the area ratio of the weft 8b of the second glass cloth 8 is obtained by dividing the area of the weft 8b of the second glass cloth 8 in this cross section (yz plane) by the area of each of the central insulating layers 11 in this cross section (yz plane). Defined as a value.
  • the area ratio of the yarn (warp 8a or weft 8b) of the second glass cloth 8 is the area of the yarn (warp 8a or weft 8b) calculated from the specifications of the second glass cloth 8 in the cross-sectional area of the second prepreg 41. Obtained by dividing.
  • the thickness of each of the central insulating layers 11 is given by the nominal thickness of the second prepreg 41, which is standardized according to the second glass cloth 8.
  • the area of the yarn (warp 8a or weft 8b) is determined from the specifications of the second glass cloth 8 by, for example, the already described formula (1).
  • the specifications of the second glass cloth 8 are the filament diameter, the number of filaments per yarn, and the yarn density (yarn arrangement direction (for example, the arrangement direction of the warp 8a is the x direction, and the arrangement direction of the weft 8b is the y direction). ) Includes the unit length of the glass cloth (eg, the number of yarns per inch (2,54 cm)).
  • the thickness t 1 of one layer of the outer insulating layer 12 is smaller than the thickness t 2 of one layer of the central insulating layer 11.
  • the number of layers of the outer insulating layer 12 arranged on one side (top surface 14 side) of the plurality of central insulating layers 11 may be smaller than the number of layers of the plurality of central insulating layers 11.
  • the number of layers of the outer insulating layer 12 arranged on the other side (bottom surface 15 side) of the plurality of central insulating layers 11 may be smaller than the number of layers of the plurality of central insulating layers 11.
  • the number of layers of the outer insulating layer 12 arranged on one side (top surface 14 side) of the plurality of central insulating layers 11 is the outer insulation arranged on the other side (bottom surface 15 side) of the plurality of central insulating layers 11. It may be equal to the number of layers of the layer 12.
  • the thickness t of the laminated body 10 is 1.0 mm or more.
  • the thickness t of the laminate 10 may be 1.2 mm or more, or 1.4 mm or more.
  • the double-sided metal-clad laminate 1 is, for example, train equipment, video system, heavy electric system such as substation system or elevator, industrial mechatronics such as FA equipment or automobile equipment, or air conditioning equipment, cooling equipment, LCD TV or It is applied to home appliances such as solar power generation systems (excluding mobile terminals such as smartphones).
  • the metal layers 21 and 28 are provided on both sides of the laminated body 10.
  • the metal layer 21 is provided on the top surface 14 of the laminated body 10.
  • the metal layer 28 is provided on the bottom surface 15 of the laminated body 10.
  • the metal layers 21 and 28 are formed of, for example, a metal foil such as a copper foil.
  • the first glass cloth 6 is impregnated with the thermosetting resin, and the first glass cloth 6 is covered with the thermosetting resin.
  • the thermosetting resin is heated and dried to make it semi-cured. In this way, the first prepreg 42 is obtained.
  • the second glass cloth 8 is impregnated with the thermosetting resin, and the second glass cloth 8 is covered with the thermosetting resin.
  • the thermosetting resin is heated and dried to make it semi-cured. In this way, the second prepreg 41 is obtained.
  • the first prepreg 42 is superposed on both sides of the second prepreg 41, and the metal layers 21 and 28 such as metal foils are superposed on the outside of the first prepreg 42.
  • the first prepreg 42, the second prepreg 41, and the metal layers 21, 28 are molded while applying heat and pressure.
  • the thermosetting resin of the first prepreg 42 and the thermosetting resin of the second prepreg 41 are cured.
  • the first prepreg 42, the second prepreg 41, and the metal layers 21, 28 are integrated. In this way, the double-sided metal-clad laminate 1 is obtained.
  • the thickness t 1 of one layer of the outer insulating layer 12 is substantially equal to the nominal thickness of the first prepreg 42.
  • the thickness t 2 of one layer of the central insulating layer 11 is substantially equal to the nominal thickness of the second prepreg 41.
  • the double-sided metal-clad laminate 1 is used for manufacturing a printed wiring board 2 (see FIGS. 4 and 5).
  • the second insulating resin member 9 may be formed of a material having the same composition as the first insulating resin member 7, and the second glass cloth 8 may be formed of a material having the same composition as the first glass cloth 6. .. That is, the second insulating resin member 9 is the same as the first insulating resin member 7 in the type of resin, and the warp 8a and the weft 8b of the second glass cloth 8 are the first glass in the type of glass fiber. It may be the same as the warp 6a and the weft 6b of the cloth 6. In this case, it becomes easy to mold and cure the first prepreg 42 and the second prepreg 41 at the same time.
  • the printed wiring board 2 and the printed wiring device 3 will be described with reference to FIGS. 4 and 5.
  • the printed wiring board 2 includes a double-sided metal-clad laminate 1.
  • the printed wiring board 2 is a double-sided printed wiring board.
  • the double-sided printed wiring board means a printed wiring board 2 having two metal layers 21 and 28.
  • a printed wiring board containing three or more metal layers is not a double-sided printed wiring board.
  • At least one of the metal layers 21 and 28 includes a first pad 22, a second pad 24 separated from the first pad 22, a first lead-out wire 23, and a second lead-out wire 25.
  • the metal layer 21 includes a first pad 22, a second pad 24, a first lead-out wire 23, and a second lead-out wire 25.
  • the second pad 24 is separated from the first pad 22 in the direction (longitudinal direction, y direction) in which the warp threads 6a and 8a of the first glass cloth 6 and the second glass cloth 8 extend. You may. As shown in FIG. 5, the second pad 24 is separated from the first pad 22 in the direction (horizontal direction, x direction) in which the weft threads 6b and 8b of the first glass cloth 6 and the second glass cloth 8 extend. You may.
  • the first pad 22 and the second pad 24 have a size suitable for a ceramic capacitor 30 having a size of 0603 or less.
  • the ceramic capacitor 30 having a size of 0603 or less has a length L 1 of 0.6 mm or less and a width W 1 of 0.3 mm or less.
  • the length L 1 of the ceramic capacitor 30 is the length of the ceramic capacitor 30 in the direction in which the pair of electrodes 32 and 33 of the ceramic capacitor 30 are separated from each other.
  • the width W 1 of the ceramic capacitor 30 is the length of the ceramic capacitor 30 in the direction perpendicular to the direction in which the pair of electrodes 32, 33 of the ceramic capacitor 30 are separated from each other.
  • the length L 1 and the width W 1 of the ceramic capacitor 30 are both expressed as TYPE values.
  • the width W 2 of the first pad 22 is, for example, 0.4 mm or less.
  • the width W 3 of the second pad 24 is, for example, 0.4 mm or less.
  • the width of the pads (first pad 22, second pad 24) is the pad in the direction perpendicular to the direction in which the pair of electrodes 32, 33 of the ceramic capacitor 30 are separated from each other (first pad 22, second pad 24). Is the length of.
  • the length L 2 of the first pad 22 is, for example, 0.3 mm or less.
  • the length L 3 of the second pad 24 is, for example, 0.3 mm or less.
  • the length of the pads is the length of the pads (first pad 22, second pad 24) in the direction in which the pair of electrodes 32, 33 of the ceramic capacitor 30 are separated from each other. Is.
  • the distance G between the first pad 22 and the second pad 24 is, for example, 0.3 mm or less.
  • the first lead-out wiring 23 is connected to the first pad 22.
  • the first lead-out wiring 23 is drawn out from, for example, the first edge of the first pad 22 distal to the second pad 24.
  • the second lead-out wiring 25 is connected to the second pad 24.
  • the second lead-out wire 25 is drawn out from, for example, the second edge of the second pad 24 distal to the first pad 22.
  • the printed wiring board 2 is obtained by etching and patterning the metal layer 21 included in the double-sided metal-clad laminate 1.
  • the printed wiring board 2 further includes an insulating protective film 26.
  • the insulating protective film 26 is provided on the top surface 14 and the metal layer 21 of the laminated body 10.
  • the insulating protective film 26 is provided with a first opening 26a and a second opening 26b.
  • the first pad 22 is exposed from the insulating protective film 26 at the first opening 26a.
  • the second pad 24 is exposed from the insulating protective film 26 at the second opening 26b.
  • the insulating protective film 26 is not particularly limited, but is made of a resin material such as a solder resist.
  • the printed wiring device 3 includes a printed wiring board 2 and a ceramic capacitor 30 joined to the first pad 22 and the second pad 24.
  • the ceramic capacitor 30 has a size of 0603 or less.
  • the printed wiring device 3 joins the pair of electrodes 32 and 33 of the ceramic capacitor 30 to the first pad 22 and the second pad 24 of the printed wiring board 2 by using a conductive joining member (not shown) such as solder. Obtained by doing.
  • the conductive bonding member (not shown) is provided in the first opening 26a and the second opening 26b of the insulating protective film 26.
  • Example. The double-sided metal-clad laminate 1 of the examples shown in Table 1 was prepared. The specifications of the glass cloth are shown in Table 2. The metal layers 21 and 28 included in the double-sided metal-clad laminate 1 of the embodiment are patterned, and the first pad 22, the second pad 24, the first drawer wiring 23, and the second drawer wiring shown in FIG. 4 are patterned. 25 and form. A ceramic capacitor 30 having a size of 0603 is soldered to the first pad 22 and the second pad 24. In this way, sample 1 was obtained. In sample 1, the ceramic capacitor 30 is arranged in the extending direction (longitudinal direction, y direction) of the warp threads 6a.
  • the metal layers 21 and 28 included in the double-sided metal-clad laminate 1 of the embodiment are patterned, and the first pad 22, the second pad 24, the first drawer wiring 23, and the second drawer wiring shown in FIG. 5 are patterned. 25 and form.
  • a ceramic capacitor 30 having a size of 0603 is soldered to the first pad 22 and the second pad 24. In this way, sample 2 was obtained. In sample 2, the ceramic capacitor 30 is arranged in the extending direction (horizontal direction, x direction) of the weft thread 6b.
  • a double-sided metal-clad laminate of the comparative example shown in Table 1 was prepared.
  • the specifications of the glass cloth are shown in Table 2.
  • the metal layers 21 and 28 included in the double-sided metal-clad laminate of the comparative example are patterned, and the first pad 22, the second pad 24, the first lead wiring 23, and the second lead wiring 25 shown in FIG. 4 are patterned. And form.
  • a ceramic capacitor 30 having a size of 0603 is soldered to the first pad 22 and the second pad 24. In this way, sample 3 was obtained. In sample 3, the ceramic capacitor 30 is arranged in the extending direction (longitudinal direction, y direction) of the warp threads 6a.
  • the metal layers 21 and 28 included in the double-sided metal-clad laminate of the comparative example are patterned, and the first pad 22, the second pad 24, the first lead wiring 23, and the second lead wiring 25 shown in FIG. 5 are patterned. And form.
  • a ceramic capacitor 30 having a size of 0603 is soldered to the first pad 22 and the second pad 24. In this way, sample 4 was obtained. In sample 4, the ceramic capacitor 30 is arranged in the extending direction (horizontal direction, x direction) of the weft thread 6b.
  • the reason why cracks are less likely to occur in the ceramic capacitor 30 when the double-sided metal-clad laminate 1 (printed wiring board 2) is bent is presumed as follows.
  • the outer insulating layer 12 in contact with the metal layer 21 to which the ceramic capacitor 30 is bonded includes the first glass cloth 6 and the first insulating resin member 7.
  • the first glass cloth 6 is made of a material harder than the first insulating resin member 7. Therefore, when the double-sided metal-clad laminate 1 (printed wiring board 2) is bent, the first glass cloth 6 has a great influence on the stress applied to the ceramic capacitor 30 having a size of 0603 or less.
  • the double-sided metal-clad laminate 1 By reducing the first longitudinal glass occupancy and the first lateral glass occupancy of the outer insulating layer 12 in contact with the metal layer 21 to which the ceramic capacitor 30 is bonded to 20% or less, the double-sided metal-clad laminate 1 ( The stress applied to the ceramic capacitor 30 when the printed wiring board 2) is bent can be reduced. In this way, cracks are suppressed in the ceramic capacitor 30 regardless of the arrangement direction of the ceramic capacitor 30 with respect to the double-sided metal-clad laminate 1.
  • the double-sided metal-clad laminate 1 of the present embodiment is laminated with a laminate 10 in which a plurality of central insulating layers 11 and outer insulating layers 12 arranged on both sides of the plurality of central insulating layers 11 are laminated to each other. It includes metal layers 21 and 28 provided on both sides of the body 10.
  • the outer insulating layer 12 includes a first glass cloth 6 and a first insulating resin member 7 impregnated in the first glass cloth 6 and covering the first glass cloth 6, respectively.
  • Each of the plurality of central insulating layers 11 includes a second glass cloth 8 and a second insulating resin member 9 which is impregnated in the second glass cloth 8 and covers the second glass cloth 8.
  • the first longitudinal glass occupancy of each of the outer insulating layers 12 is 20% or less.
  • the first lateral glass occupancy of each of the outer insulating layers 12 is 20% or less.
  • the first longitudinal glass occupancy and the first transverse glass occupancy are both smaller than the larger of the second longitudinal glass occupancy and the second transverse glass occupancy of each of the plurality of central insulating layers 11. ..
  • the first warp glass occupancy is the area ratio of the warp 6a of the first glass cloth 6 in the cross section (xz plane) perpendicular to the extending direction (longitudinal direction, y direction) of the warp 6a of the first glass cloth 6. is there.
  • the first weft glass occupancy is the area ratio of the weft 6b of the first glass cloth 6 in the cross section (yz plane) perpendicular to the extending direction (horizontal direction, x direction) of the weft 6b of the first glass cloth 6. is there.
  • the second warp glass occupancy is the area ratio of the warp 8a of the second glass cloth 8 in the cross section (xz plane) perpendicular to the extending direction (longitudinal direction, y direction) of the warp 8a of the second glass cloth 8. is there.
  • the second weft glass occupancy is the area ratio of the weft 8b of the second glass cloth 8 in the cross section (yz plane) perpendicular to the extending direction (horizontal direction, x direction) of the weft 8b of the second glass cloth 8. is there.
  • the ceramic capacitor when the double-sided metal-clad laminate 1 is bent By reducing the first longitudinal glass occupancy and the first lateral glass occupancy of the outer insulating layer 12 in contact with the metal layer 21 to 20% or less, the ceramic capacitor when the double-sided metal-clad laminate 1 is bent.
  • the stress applied to 30 can be reduced. In this way, cracks in the ceramic capacitor 30 can be suppressed regardless of the arrangement direction of the ceramic capacitor 30 with respect to the double-sided metal-clad laminate 1.
  • both the first vertical glass occupancy rate and the first horizontal glass occupancy rate are larger than the larger of the second vertical glass occupancy rate and the second horizontal glass occupancy rate of each of the plurality of central insulating layers 11. Is also small. That is, the larger of the second longitudinal glass occupancy and the second horizontal glass occupancy of each of the plurality of central insulating layers 11 is the first longitudinal glass occupancy and the first lateral glass occupancy of each of the outer insulating layers 12. It is the largest of the directional glass occupancy and the second longitudinal glass occupancy and the second horizontal glass occupancy of each of the plurality of central insulating layers 11. Therefore, the double-sided metal-clad laminate 1 has improved dimensional stability. Further, as the plurality of central insulating layers 11, an insulating layer including a glass cloth widely used for the printed wiring board 2 can be used, so that the cost increase of the double-sided metal-clad laminate 1 can be reduced.
  • the thickness t of the laminate 10 is 1.0 mm or more. As the thickness t of the laminate 10 increases, the stress applied to the ceramic capacitor 30 increases when the double-sided metal-clad laminate 1 is bent. Since the first longitudinal glass occupancy rate and the first horizontal glass occupancy rate of the outer insulating layer 12 in contact with the metal layer 21 are 20% or less, even if the thickness t of the laminated body 10 is 1.0 mm or more. Regardless of the arrangement direction of the ceramic capacitor 30 with respect to the double-sided metal-clad laminate 1, cracks in the ceramic capacitor 30 can be suppressed.
  • the first diameter of the first glass filament contained in the warp 6a and the weft 6b of the first glass cloth 6 is included in the warp 8a and the weft 8b of the second glass cloth 8. It is smaller than the second diameter of the second glass filament. Therefore, the first longitudinal glass occupancy of each of the outer insulating layers 12 can be made smaller than the second longitudinal glass occupancy of each of the plurality of central insulating layers 11, and each of the outer insulating layers 12 can be made smaller. The occupancy of the first lateral glass can be made smaller than the occupancy of the second lateral glass of each of the plurality of central insulating layers 11. It is possible to suppress the occurrence of cracks in the ceramic capacitor 30 regardless of the arrangement direction of the ceramic capacitor 30 with respect to the double-sided metal-clad laminate 1.
  • the first thickness of the first glass cloth 6 is smaller than the second thickness of the second glass cloth 8. Therefore, the first longitudinal glass occupancy of each of the outer insulating layers 12 can be made smaller than the second longitudinal glass occupancy of each of the plurality of central insulating layers 11, and each of the outer insulating layers 12 can be made smaller.
  • the occupancy of the first lateral glass can be made smaller than the occupancy of the second lateral glass of each of the plurality of central insulating layers 11. It is possible to suppress the occurrence of cracks in the ceramic capacitor 30 regardless of the arrangement direction of the ceramic capacitor 30 with respect to the double-sided metal-clad laminate 1.
  • the double-sided metal-clad laminate 1 Since the second thickness of the second glass cloth 8 is larger than the first thickness of the first glass cloth 6, the double-sided metal-clad laminate 1 has improved dimensional stability. Since an insulating layer including a glass cloth widely used for the printed wiring board 2 can be used as the plurality of central insulating layers 11, the cost increase of the double-sided metal-clad laminate 1 can be reduced.
  • the second glass cloth 8 is a glass cloth of IPC style number 7628 or a glass cloth of IPC style number 7629.
  • the first glass cloth 6 is a glass cloth of IPC style number 2116, a glass cloth of IPC style number 3313, a glass cloth of IPC style number 1080, or a glass cloth of IPC style number 1501. Therefore, it is possible to suppress the occurrence of cracks in the ceramic capacitor 30 regardless of the arrangement direction of the ceramic capacitor 30 with respect to the double-sided metal-clad laminate 1.
  • the warp threads 6a and weft threads 6b of the first glass cloth 6 are formed of E glass, S glass, T glass or NE glass having an alkaline component content of 1% or less.
  • the warp 8a and the weft 8b of the second glass cloth 8 are made of E glass, S glass, T glass or NE glass having an alkaline component content of 1% or less. Therefore, it is possible to suppress the occurrence of cracks in the ceramic capacitor 30 regardless of the arrangement direction of the ceramic capacitor 30 with respect to the double-sided metal-clad laminate 1.
  • the warp 8a and the weft 8b of the second glass cloth 8 are the same as the warp 6a and the weft 6b of the first glass cloth 6 in the type of glass fiber.
  • the second insulating resin member 9 is the same as the first insulating resin member 7 in the type of resin. Therefore, the double-sided metal-clad laminate 1 has a structure that can be manufactured more easily and at a lower cost.
  • the printed wiring board 2 of the present embodiment includes a double-sided metal-clad laminate 1.
  • the metal layers 21 and 28 are connected to the first pad 22, the second pad 24 separated from the first pad 22, the first lead wiring 23 connected to the first pad 22, and the second pad 24.
  • the second lead-out wiring 25 is included.
  • the width W 2 of the first pad 22 is 0.4 mm or less.
  • the width W 3 of the second pad 24 is 0.4 mm or less. Therefore, cracks can be suppressed in the ceramic capacitor 30 having a size of 0603 or less regardless of the arrangement direction of the ceramic capacitor 30 having a size of 0603 or less with respect to the printed wiring board 2 (double-sided metal-clad laminate 1). ..
  • the first lead-out wiring 23 is drawn out from the first edge of the first pad 22 distal to the second pad 24.
  • the second lead-out wire 25 is drawn out from the second edge of the second pad 24 distal to the first pad 22. Therefore, while simplifying the drawer structure of the wiring (first drawer wiring 23, second drawer wiring 25) from the first pad 22 and the second pad 24, 0603 with respect to the printed wiring board 2 (double-sided metal-clad laminate 1). Regardless of the arrangement direction of the ceramic capacitor 30 having the following size, it is possible to suppress the occurrence of cracks in the ceramic capacitor 30 having the size of 0603 or less.
  • the printed wiring device 3 of the present embodiment includes a printed wiring board 2 and a ceramic capacitor 30 joined to the first pad 22 and the second pad 24.
  • the ceramic capacitor 30 has a length L 1 of 0.6 mm or less and a width W 1 of 0.3 mm or less. Therefore, cracks can be suppressed in the ceramic capacitor 30 having a size of 0603 or less regardless of the arrangement direction of the ceramic capacitor 30 having a size of 0603 or less with respect to the printed wiring board 2 (double-sided metal-clad laminate 1). ..
  • Embodiment 2 The multilayer metal-clad laminate 1b of the second embodiment will be described with reference to FIG. 7.
  • the multilayer metal-clad laminate 1b of the present embodiment has the same configuration as the double-sided metal-clad laminate 1 of the first embodiment, but differs mainly in the following points.
  • the multilayer metal-clad laminate 1b further includes internal metal layers 51 and 52 provided inside the laminate 10.
  • the multilayer metal-clad laminate 1b means a metal-clad laminate having three or more metal layers (metal layers 21, 28 and internal metal layers 51, 52).
  • the metal-clad laminate having two metal layers is not the multilayer metal-clad laminate 1b.
  • the number of internal metal layers 51 and 52 is one or more.
  • the number of inner metal layers 51 and 52 may be an even number.
  • the inner metal layers 51 and 52 are formed of, for example, a metal foil such as a copper foil.
  • the laminated body 10 including the internal metal layers 51 and 52 may have a layer structure that is line-symmetrical in the thickness direction of the laminated body 10.
  • the printed wiring board 2 and the printed wiring device 3 of the second embodiment will be described with reference to FIGS. 4 and 5.
  • the printed wiring board 2 and the printed wiring device 3 of the present embodiment have the same configurations as the printed wiring board 2 and the printed wiring device 3 of the first embodiment, but instead of the double-sided metal-clad laminate 1, It differs in that it is provided with a multilayer metal-clad laminate 1b.
  • the printed wiring board 2 is a multilayer printed wiring board.
  • the multilayer printed wiring board means a printed wiring board having three or more metal layers (metal layers 21, 28 and internal metal layers 51, 52). In other words, a printed wiring board having two or less metal layers is not the multilayer printed wiring board of the present specification.
  • the multilayer metal-clad laminate 1b, the printed wiring board 2, and the printed wiring device 3 of the present embodiment have the same effects as the double-sided metal-clad laminate 1, the printed wiring board 2, and the printed wiring device 3 of the first embodiment. ..
  • the printed wiring board 2 of the present embodiment is laminated with a laminate 10 in which a plurality of central insulating layers 11 and outer insulating layers 12 arranged on both sides of the plurality of central insulating layers 11 are laminated to each other.
  • the metal layers 21 and 28 provided on both sides of the body 10 and the internal metal layers 51 and 52 provided inside the laminated body 10 are provided.
  • the outer insulating layer 12 includes a first glass cloth 6 and a first insulating resin member 7 impregnated in the first glass cloth 6 and covering the first glass cloth 6, respectively.
  • Each of the plurality of central insulating layers 11 includes a second glass cloth 8 and a second insulating resin member 9 which is impregnated in the second glass cloth 8 and covers the second glass cloth 8.
  • the first longitudinal glass occupancy of each of the outer insulating layers 12 is 20% or less.
  • the first lateral glass occupancy of each of the outer insulating layers 12 is 20% or less.
  • the first longitudinal glass occupancy and the first transverse glass occupancy are both smaller than the larger of the second longitudinal glass occupancy and the second transverse glass occupancy of each of the plurality of central insulating layers 11. ..
  • the first warp glass occupancy is the area ratio of the warp 6a of the first glass cloth 6 in the cross section (xz plane) perpendicular to the extending direction (longitudinal direction, y direction) of the warp 6a of the first glass cloth 6. is there.
  • the first weft glass occupancy is the area ratio of the weft 6b of the first glass cloth 6 in the cross section (yz plane) perpendicular to the extending direction (horizontal direction, x direction) of the weft 6b of the first glass cloth 6. is there.
  • the second warp glass occupancy is the area ratio of the warp 8a of the second glass cloth 8 in the cross section (xz plane) perpendicular to the extending direction (longitudinal direction, y direction) of the warp 8a of the second glass cloth 8. is there.
  • the second weft glass occupancy is the area ratio of the weft 8b of the second glass cloth 8 in the cross section (xz plane) perpendicular to the extending direction (horizontal direction, x direction) of the weft 8b of the second glass cloth 8. is there.
  • the thickness of the laminate 10 is 1.0 mm or more.
  • the metal layers 21 and 28 are connected to the first pad 22, the second pad 24 separated from the first pad 22, the first lead wiring 23 connected to the first pad 22, and the second pad 24.
  • the second lead-out wiring 25 is included.
  • the width W 2 of the first pad 22 is 0.4 mm or less.
  • the width W 3 of the second pad 24 is 0.4 mm or less.
  • the ceramic capacitor 30 is formed.
  • the applied stress can be reduced. In this way, cracks in the ceramic capacitor 30 can be suppressed regardless of the arrangement direction of the ceramic capacitor 30 with respect to the printed wiring board 2.
  • the warp threads 6a and weft threads 6b of the first glass cloth 6 are formed of E glass, S glass, T glass or NE glass having an alkaline component content of 1% or less.
  • the warp 8a and the weft 8b of the second glass cloth 8 are made of E glass, S glass, T glass or NE glass having an alkaline component content of 1% or less. Therefore, it is possible to suppress the occurrence of cracks in the ceramic capacitor 30 regardless of the arrangement direction of the ceramic capacitor 30 with respect to the printed wiring board 2.
  • the warp 8a and the weft 8b of the second glass cloth 8 are the same as the warp 6a and the weft 6b of the first glass cloth 6 in the type of glass fiber.
  • the second insulating resin member 9 is the same as the first insulating resin member 7 in the type of resin. Therefore, the printed wiring board 2 has a structure that can be manufactured more easily and at a lower cost.

Abstract

Plaque stratifiée revêtue de métal des deux côtés (1) et comprenant : un corps stratifié (10) obtenu par stratification d'une pluralité de couches centrales d'isolation (11) et de couches externes d'isolation (12) disposées sur les deux côtés de la pluralité de couches centrales d'isolation (11) ; et des couches métalliques (14,15) disposées sur les deux côtés du corps stratifié (10). Chacune des couches externes d'isolation (12) possède une première occupation de verre, dans le sens vertical, de 20 % ou moins. Chacune des couches externes d'isolation (12) possède une première occupation de verre dans le sens horizontal de 20 % ou moins.
PCT/JP2020/029683 2019-08-26 2020-08-03 Plaque stratifiée revêtue de métal des deux côtés, substrat de câblage imprimé et dispositif de câblage imprimé WO2021039299A1 (fr)

Priority Applications (1)

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JP2021542678A JP7250149B2 (ja) 2019-08-26 2020-08-03 両面金属張積層板、プリント配線板、プリント配線装置

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JP2019153521 2019-08-26
JP2019-153521 2019-08-26

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911244A (ja) * 1982-07-10 1984-01-20 旭シユエ−ベル株式会社 ガラス織物入り積層板
JP2001073249A (ja) * 1999-08-31 2001-03-21 Unitika Glass Fiber Co Ltd プリント配線基板用のガラスクロス
JP2003211568A (ja) * 2002-01-22 2003-07-29 Asahi Schwebel Co Ltd 導体パターンが形成されたガラスクロス、プリプレグ及び多層板
JP2015023134A (ja) * 2013-07-18 2015-02-02 キヤノン株式会社 プリント回路板
JP2015099815A (ja) * 2013-11-18 2015-05-28 株式会社東芝 電子機器
WO2015079820A1 (fr) * 2013-11-29 2015-06-04 日東紡績株式会社 Stratifié à composition de résine-tissu de fibre de verre
WO2016117320A1 (fr) * 2015-01-21 2016-07-28 日本電気株式会社 Carte de câblage et son procédé de conception
CN205546197U (zh) * 2016-01-31 2016-08-31 深圳市博敏兴电子有限公司 多层高厚铜线路板
CN208962621U (zh) * 2018-07-11 2019-06-11 金安国纪科技（珠海）有限公司 一种富树脂覆铜板

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5911244A (ja) * 1982-07-10 1984-01-20 旭シユエ−ベル株式会社 ガラス織物入り積層板
JP2001073249A (ja) * 1999-08-31 2001-03-21 Unitika Glass Fiber Co Ltd プリント配線基板用のガラスクロス
JP2003211568A (ja) * 2002-01-22 2003-07-29 Asahi Schwebel Co Ltd 導体パターンが形成されたガラスクロス、プリプレグ及び多層板
JP2015023134A (ja) * 2013-07-18 2015-02-02 キヤノン株式会社 プリント回路板
JP2015099815A (ja) * 2013-11-18 2015-05-28 株式会社東芝 電子機器
WO2015079820A1 (fr) * 2013-11-29 2015-06-04 日東紡績株式会社 Stratifié à composition de résine-tissu de fibre de verre
WO2016117320A1 (fr) * 2015-01-21 2016-07-28 日本電気株式会社 Carte de câblage et son procédé de conception
CN205546197U (zh) * 2016-01-31 2016-08-31 深圳市博敏兴电子有限公司 多层高厚铜线路板
CN208962621U (zh) * 2018-07-11 2019-06-11 金安国纪科技（珠海）有限公司 一种富树脂覆铜板

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