WO2021039202A1 - Résine thermoconductrice et structure de dissipation de chaleur - Google Patents

Résine thermoconductrice et structure de dissipation de chaleur Download PDF

Info

Publication number
WO2021039202A1
WO2021039202A1 PCT/JP2020/028063 JP2020028063W WO2021039202A1 WO 2021039202 A1 WO2021039202 A1 WO 2021039202A1 JP 2020028063 W JP2020028063 W JP 2020028063W WO 2021039202 A1 WO2021039202 A1 WO 2021039202A1
Authority
WO
WIPO (PCT)
Prior art keywords
alumina
resin
conductive resin
heat
oxide
Prior art date
Application number
PCT/JP2020/028063
Other languages
English (en)
Japanese (ja)
Inventor
圭司 熊野
隆彦 岡部
Original Assignee
イビデン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by イビデン株式会社 filed Critical イビデン株式会社
Publication of WO2021039202A1 publication Critical patent/WO2021039202A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/08—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a thermally conductive resin and a heat radiating structure.
  • a semiconductor is composed of a conductor for energization and an insulating material.
  • the amount of heat generated has increased due to the increase in the output of semiconductors, so how to dissipate the heat generated from the semiconductor has become an important issue.
  • Patent Document 1 describes a resin composition containing a base resin and a ceramic fiber.
  • the ceramic fiber contained in this composition is characterized by containing 70 to 99% by weight of alumina having an pregelatinization rate of 10% or more and 30 to 1% by weight of an inorganic binder component.
  • Patent Document 1 as a method for obtaining alumina fibers as ceramic fibers, alumina fibers containing ⁇ -alumina as a main component and silica as an inorganic binder are heated in the atmosphere at a temperature of 1400 ° C. for 5 hours, and the alumina fibers are contained. It is described that the pregelatinization of ⁇ -alumina is promoted.
  • the ceramic fiber thus obtained is described as containing 95% by weight of ⁇ -alumina and 5% by weight of silica. That is, silica as an inorganic binder component is a component incorporated into the crystals of alumina fibers, and is not a component that coats the alumina fibers.
  • the present invention has been made in view of such a problem, and an object of the present invention is to provide a thermally conductive resin having excellent thermal conductivity.
  • the thermally conductive resin of the present invention comprises a resin, alumina fibers contained in the resin, and oxide-based inorganic particles coating the alumina fibers and having a higher thermal conductivity than the resin.
  • the alumina fibers are in contact with each other via the oxide-based inorganic particles.
  • Alumina fibers are used in the thermally conductive resin of the present invention. Then, the oxide-based inorganic particles coat the alumina fibers.
  • the oxide-based inorganic particles are components contained in the inorganic binder, and the thermal conductivity of the oxide-based inorganic particles is higher than that of the resin. Further, the alumina fibers are in contact with each other via the oxide-based inorganic particles. Therefore, by coating the alumina fibers with the oxide-based inorganic particles and increasing the contact area between the alumina fibers coated with the oxide-based inorganic particles, the thermal conductivity between the alumina fibers is improved, and the thermal conductivity is improved. It is possible to provide an excellent thermal conductive resin.
  • the oxide-based inorganic particles are alumina particles.
  • the alumina particles are oxide-based inorganic particles having a high thermal conductivity, and by using the alumina particles, a thermally conductive resin having a higher thermal conductivity can be obtained. Further, since the coefficient of thermal expansion of the alumina particles is close to the coefficient of thermal expansion of the alumina fibers, it is possible to prevent the alumina fibers from breaking the bond due to the thermal impact.
  • the average particle size of the oxide-based inorganic particles is preferably 500 nm or less. Within this range, the average particle size of the oxide-based inorganic particles is sufficiently smaller than the fiber size of the alumina fiber, so that the surface of the alumina fiber can be easily covered.
  • the resin is preferably a silicone resin, an acrylic resin, or an epoxy resin. These resins are preferable because they have high heat resistance and excellent insulating properties.
  • the alumina fiber has an alumina content of 85% by weight or more and an ⁇ -alumina ratio of 50% by weight or more.
  • the alumina fiber itself is an alumina fiber having an alumina content of 85% by weight or more and an ⁇ -alumina ratio of 50% by weight or more
  • the composition has a higher thermal conductivity than the alumina fiber having a mullite composition containing a large amount of silica. Since it is a fiber of the above, it can be a heat conductive resin having a high thermal conductivity from the viewpoint of the composition of the alumina fiber.
  • the heat radiating structure of the present invention is characterized by comprising a heat source, a heat radiating member, and a heat conductive resin of the present invention arranged between the heat source and the heat radiating member. With this structure, heat from the heat source can be suitably conducted to the heat radiating member via the heat conductive resin.
  • FIG. 1 is a schematic view showing a mode in which alumina fibers are in contact with each other via oxide-based inorganic particles.
  • FIG. 2 is a cross-sectional view schematically showing an embodiment of the heat conductive resin of the present invention.
  • FIG. 3 is a cross-sectional view schematically showing an embodiment of the heat dissipation structure.
  • the thermally conductive resin of the present invention comprises a resin, alumina fibers contained in the resin, and oxide-based inorganic particles coating the alumina fibers and having a higher thermal conductivity than the resin.
  • the fibers are in contact with each other via the oxide-based inorganic particles.
  • FIG. 1 is a schematic view showing a mode in which alumina fibers are in contact with each other via oxide-based inorganic particles.
  • FIG. 1 shows how the alumina fibers 30 are each coated with the oxide-based inorganic particles 40, and the two alumina fibers 30 are in contact with each other via the oxide-based inorganic particles 40. Since the oxide-based inorganic particles 40 are present between the alumina fibers 30, the contact area between the alumina fibers is increased, and the thermal conductivity between the alumina fibers is improved.
  • FIG. 2 is a cross-sectional view schematically showing an embodiment of the heat conductive resin of the present invention.
  • the thermally conductive resin 10 shown in FIG. 2 is composed of the resin 20, the alumina fibers 30 contained in the resin 20, and the oxide-based inorganic particles 40 that coat the alumina fibers 30.
  • the alumina fiber 30 and the oxide-based inorganic particles 40 are present in the matrix of the resin 20.
  • the resin is preferably at least one selected from the group consisting of epoxy resin, silicone resin, acrylic resin, polyimide resin, melamine resin, polycarbonate resin, polypropylene resin and polyethylene resin.
  • silicone resin, acrylic resin or epoxy resin is more preferable. Since the silicone resin, acrylic resin, or epoxy resin has high insulating properties, it is preferable because the insulating properties can be ensured when the thermosetting resin is used in contact with a semiconductor element or the like.
  • the alumina fiber preferably has an average fiber diameter of 1 ⁇ m or more, and more preferably 4 ⁇ m or more. Moreover, it is preferable that the average fiber diameter is 30 ⁇ m or less.
  • the average fiber diameter of the alumina fibers is determined as an average value by taking an electron micrograph of the heat conductive resin at a magnification of about 1500 times and measuring the diameters of 10 or more fibers from the obtained photographs. When the average fiber diameter of the alumina fibers is 1 ⁇ m or more, the amount of heat transferred by the alumina fibers increases, and the effect of improving the thermal conductivity by using the alumina fibers is suitably exhibited.
  • the average fiber length of the alumina fibers is preferably 100 ⁇ m or more, and more preferably 400 ⁇ m or more.
  • the average fiber length of the alumina fibers is preferably 5000 ⁇ m or less.
  • the aspect ratio of the alumina fiber is preferably more than 100 and 1000 or less. When the aspect ratio of the alumina fiber is in the above range, heat flows continuously over a long distance of the fiber portion, and a resin portion having a low thermal conductivity does not intervene between them, so that the heat conductive resin has a higher thermal conductivity. can do.
  • the aspect ratio of alumina fibers can be determined by (average fiber length / average fiber diameter of alumina fibers).
  • the alumina fiber is preferably an alumina fiber having an alumina content of 85% by weight or more and an ⁇ -alumina ratio of 50% by weight or more. Since such alumina fibers have a composition having a high thermal conductivity, the thermal conductivity of the thermally conductive resin can be improved. Further, the alumina fiber may be a silica-alumina fiber or a silica-alumina fiber having a mullite composition.
  • the alumina content in the alumina fiber is determined by quantitatively analyzing the elements contained in the alumina fiber by the following procedure by the fluorescent X-ray analysis method to determine the Al content, and the weight ratio in terms of Al 2 O 3 from the Al content. Can be obtained by calculating. First, the sample is sufficiently crushed in a mortar, an organic binder (Chemplex Industries Inc Spectro Blend 44 ⁇ m) is added, and the mixture is mixed well. Then, it is formed into pellets by pressurizing. The size of the pellet is, for example, about 13 mm in diameter and about 5 mm in thickness. It is measured by a fluorescent X-ray measuring device (ZSX Primus II manufactured by Rigaku Co., Ltd.). The X-ray tube of this device is Rh, and the rated maximum output is 4 kW. The analysis area is 10 mm ⁇ .
  • the ⁇ -alumina ratio of the alumina fiber is preferably 80% by weight or more, and preferably 99% by weight or less.
  • the content of the alumina fibers in the thermally conductive resin is not particularly limited, but is preferably 20% by weight or more. By setting the content ratio of the alumina fibers to 20% by weight or more, the effect of blending the alumina fibers as the heat conductive filler is more preferably exhibited, and the heat conductive resin having a higher thermal conductivity can be obtained. It is more preferable that the content ratio of the alumina fiber is 45% by weight or more. Further, the content ratio of the alumina fiber is preferably 90% by weight or less, and more preferably 80% by weight or less.
  • Oxide-based inorganic particles are particles that coat alumina fibers, and are particles made of a substance having a higher thermal conductivity than the resin constituting the thermally conductive resin.
  • the thermal conductivity of the oxide-based inorganic particles is not particularly limited as long as it is higher than the thermal conductivity of the resin constituting the thermally conductive resin, but is preferably 1 W / m ⁇ K or more, for example.
  • oxide-based inorganic particles alumina particles, silica particles, titania particles and the like are preferable. Further, each of these particles is preferably a particle derived from an inorganic sol dispersion, and is preferably a particle derived from an alumina sol, a silica sol, a titania sol, or the like, respectively.
  • Alumina fibers can be coated with oxide-based inorganic particles by immersing the alumina fibers in an inorganic sol dispersion and drying them in the process of producing the heat conductive resin.
  • the average particle size of the oxide-based inorganic particles is not particularly limited, but is preferably 500 nm or less. When the average particle size of the oxide-based inorganic particles is in this range, the average particle size of the oxide-based inorganic particles is sufficiently smaller than the fiber diameter of the alumina fiber, so that the surface of the alumina fiber can be easily coated.
  • the average particle size of the oxide-based inorganic particles is preferably 5 nm or more.
  • the average particle size of the oxide-based inorganic particles can be determined as the equivalent circle diameter of the oxide-based inorganic particles observed in the SEM image.
  • thermally conductive resin of the present invention in the resin, alumina fibers are in contact with each other via oxide-based inorganic particles as shown in FIG. Whether the alumina fibers are in contact with each other via the oxide-based inorganic particles can be confirmed by image observation by SEM and element mapping by SEM-EDX observation.
  • the thermally conductive resin of the present invention may have a portion in which the alumina fibers are in contact with each other via oxide-based inorganic particles.
  • the thermally conductive resin of the present invention does not require that all the alumina fibers are in contact with each other via oxide-based inorganic particles, but has a portion in which some alumina fibers are in direct contact with each other. May be.
  • the thermally conductive resin may contain an inorganic fiber other than the alumina fiber or an inorganic filler not coated with the alumina fiber, in addition to the resin, the alumina fiber and the oxide-based inorganic particles.
  • inorganic fibers other than alumina fibers include silica fibers, zirconia fibers, titania fibers, and biosoluble fibers.
  • the inorganic filler is preferably at least one selected from the group consisting of silicon nitride, aluminum nitride, boron nitride, silica and alumina. Further, since these inorganic particles are materials having high thermal conductivity, the thermal conductivity of the thermally conductive resin can be enhanced by blending them in the thermally conductive resin.
  • the insulating property of the heat conductive resin can be enhanced by using these inorganic particles.
  • the proportion of the inorganic fiber or the inorganic filler other than the alumina fiber is preferably 30% by weight or less in the heat conductive resin.
  • the thickness of the thermally conductive resin is preferably 500 ⁇ m or more and 10 mm or less. Further, it is more preferably 1 mm or more, and more preferably 3 mm or less. When the thermosetting resin is required to have insulating properties, it preferably has a certain thickness (500 ⁇ m or more). In addition, since the heat conductive resin has a lower thermal conductivity than the metal material, if the thickness of the heat conductive resin is too thick (for example, exceeding 10 mm), the entire heat conduction due to the use of the heat conductive resin Deterioration of sex may occur.
  • the thermal conductivity of the thermally conductive resin preferably exceeds 1 W / m ⁇ K, and more preferably 3 W / m ⁇ K or more.
  • the thermal conductivity of the thermally conductive resin can be measured by the laser flash method.
  • the thermally conductive resin of the present invention can be produced by the following procedure. First, the alumina fibers are dipped in an inorganic sol dispersion containing oxide-based inorganic particles and dried to coat the alumina fibers with the oxide-based inorganic particles. Then, an alumina fiber coated with oxide-based inorganic particles, a resin material, and other materials, if necessary, are mixed and molded to produce a thermally conductive resin.
  • the molding method can be arbitrarily set depending on the shape of the thermosetting resin, and methods such as press molding, doctor blade method, extrusion molding, injection molding, sheet molding, and film molding can be used. Further, after forming into a predetermined shape, machining such as cutting and polishing may be performed to obtain a desired shape.
  • thermosetting resin is a curable resin such as a thermosetting resin or a photocurable resin
  • the alumina fiber coated with oxide-based inorganic particles, the resin material, and other materials are mixed and molded.
  • the resin precursor thus obtained may be subjected to thermosetting or photocuring treatment.
  • the heat radiating structure of the present invention is characterized by comprising a heat source, a heat radiating member, and a heat conductive resin of the present invention arranged between the heat source and the heat radiating member.
  • FIG. 3 is a cross-sectional view schematically showing an embodiment of the heat dissipation structure.
  • FIG. 3 shows a heat radiating structure 100 in which a heat conductive resin 10 is arranged between a semiconductor element 110 as a heat source and a heat sink 200 as a heat radiating member.
  • the heat generated from the semiconductor element 110 can be thermally conducted to the heat sink 200 via the heat conductive resin 10.
  • FIG. 3 shows how the heat conductive grease 115 is arranged between the semiconductor element 110 and the heat conductive resin 10 and between the heat conductive resin 10 and the heat sink 200, respectively.
  • the heat conductive grease is arranged to fill the space between the semiconductor element and the heat conductive resin and the space between the heat conductive resin and the heat sink to improve the contact property and the heat conductivity. It is not essential to use the heat conductive grease, and the semiconductor element 110 may be brought into direct contact with the heat conductive resin 10, or the heat conductive resin 10 may be brought into direct contact with the heat sink 200.
  • Examples of the heat source of the heat dissipation structure include a light emitting element (LED element and the like), a capacitor, a resistance element, a battery, a motor and the like in addition to the semiconductor element.
  • a heat sink, a heat radiating block, a heat radiating fin, a heat diffusion sheet, a heat pipe, or the like can be used as the heat radiating member.
  • Example 1 Alumina sol (average particle diameter 30 nm) is added to 100 parts by weight of alumina fibers (average fiber diameter 6 ⁇ m, average fiber length 800 ⁇ m, alumina content 95% by weight, ⁇ -alumina ratio 82% by weight), and the solid content weight of alumina particles is 5 weight.
  • Alumina fibers were coated with alumina particles to obtain alumina particles coated with alumina particles by adding them together with water and stirring them.
  • the heat conductive resin composition was press-molded to prepare a resin sheet having a thickness of 5 mm, and the heat conductive resin according to Example 1 was produced.
  • This resin sheet was processed to a size of 200 mm ⁇ 200 mm, and the thermal conductivity was measured using a laser flash method thermal constant measuring device (TC-1200RH manufactured by ULVAC-RIKO, Inc.).
  • the thermal conductivity of the thermally conductive resin according to Example 1 was 15 W / m ⁇ K.
  • the SEM observation of the produced thermally conductive resin was carried out, it was confirmed that the alumina fibers were in contact with each other via the alumina particles.
  • Example 2 The thermally conductive resin according to Example 2 was produced in the same manner as in Example 1 except that silica-alumina fibers having a mullite composition were used as the alumina fibers.
  • the thermal conductivity of the thermally conductive resin according to Example 2 was 2 W / m ⁇ K.
  • Example 2 the thermally conductive resin according to Comparative Example 1 was produced in the same manner as in Example 2 except that the silica-alumina fiber having a mullite composition was used without coating the alumina particles.
  • the thermal conductivity of the thermally conductive resin according to Comparative Example 1 was 1 W / m ⁇ K.
  • Example 2 From the comparison between Example 2 and Comparative Example 1, a thermally conductive resin having high thermal conductivity could be obtained by making the alumina fibers in contact with each other via the alumina particles. Further, by using an alumina fiber having an alumina content of 85% by weight or more and an ⁇ -alumina ratio of 50% by weight or more as the alumina fiber, a thermally conductive resin having a higher thermal conductivity could be obtained.
  • Thermal conductive resin 10
  • Resin 30 Alumina fiber 40
  • Oxide-based inorganic particles 100
  • Heat dissipation structure 110
  • Semiconductor element (heat source) 115
  • Thermal grease 200
  • Heat sink heat dissipation member

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne une résine thermoconductrice dotée d'une excellente conductivité thermique. Cette résine thermoconductrice : comprend une résine, des fibres d'alumine incluses dans la résine, et des particules d'oxyde inorganique recouvrant les fibres d'alumine et ayant une conductivité thermique supérieure à celle de la résine ; et est caractérisé en ce que les fibres d'alumine sont en contact par l'intermédiaire des particules d'oxyde inorganique.
PCT/JP2020/028063 2019-08-26 2020-07-20 Résine thermoconductrice et structure de dissipation de chaleur WO2021039202A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019153823A JP7449053B2 (ja) 2019-08-26 2019-08-26 熱伝導性樹脂及び熱伝導性樹脂の製造方法
JP2019-153823 2019-08-26

Publications (1)

Publication Number Publication Date
WO2021039202A1 true WO2021039202A1 (fr) 2021-03-04

Family

ID=74678647

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/028063 WO2021039202A1 (fr) 2019-08-26 2020-07-20 Résine thermoconductrice et structure de dissipation de chaleur

Country Status (2)

Country Link
JP (1) JP7449053B2 (fr)
WO (1) WO2021039202A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114156430A (zh) * 2021-11-29 2022-03-08 珠海冠宇电池股份有限公司 极片及电化学装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62198197A (ja) * 1986-02-25 1987-09-01 三菱電機株式会社 高熱伝導性回路板
JPH03137293A (ja) * 1989-10-20 1991-06-11 Mitsubishi Electric Corp セラミックスペーパの製造方法
JPH08283456A (ja) * 1995-04-10 1996-10-29 Otsuka Chem Co Ltd 高熱伝導性樹脂組成物及びそのフィルム
JP2003183498A (ja) * 2001-12-13 2003-07-03 Polymatech Co Ltd 熱伝導性シート
JP2008050555A (ja) * 2006-07-24 2008-03-06 Sumitomo Chemical Co Ltd 熱伝導性樹脂組成物およびその用途
WO2011158942A1 (fr) * 2010-06-17 2011-12-22 ソニーケミカル＆インフォメーションデバイス株式会社 Feuillet thermoconducteur et son procédé de fabrication
JP2014109024A (ja) * 2012-12-04 2014-06-12 Sumitomo Bakelite Co Ltd 複合樹脂組成物及び絶縁性と熱放散性に優れた成形体
WO2018135517A1 (fr) * 2017-01-19 2018-07-26 国立大学法人福井大学 Matériau présentant une conductivité thermique élevée et son procédé de production

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62198197A (ja) * 1986-02-25 1987-09-01 三菱電機株式会社 高熱伝導性回路板
JPH03137293A (ja) * 1989-10-20 1991-06-11 Mitsubishi Electric Corp セラミックスペーパの製造方法
JPH08283456A (ja) * 1995-04-10 1996-10-29 Otsuka Chem Co Ltd 高熱伝導性樹脂組成物及びそのフィルム
JP2003183498A (ja) * 2001-12-13 2003-07-03 Polymatech Co Ltd 熱伝導性シート
JP2008050555A (ja) * 2006-07-24 2008-03-06 Sumitomo Chemical Co Ltd 熱伝導性樹脂組成物およびその用途
WO2011158942A1 (fr) * 2010-06-17 2011-12-22 ソニーケミカル＆インフォメーションデバイス株式会社 Feuillet thermoconducteur et son procédé de fabrication
JP2014109024A (ja) * 2012-12-04 2014-06-12 Sumitomo Bakelite Co Ltd 複合樹脂組成物及び絶縁性と熱放散性に優れた成形体
WO2018135517A1 (fr) * 2017-01-19 2018-07-26 国立大学法人福井大学 Matériau présentant une conductivité thermique élevée et son procédé de production

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114156430A (zh) * 2021-11-29 2022-03-08 珠海冠宇电池股份有限公司 极片及电化学装置

Also Published As

Publication number Publication date
JP7449053B2 (ja) 2024-03-13
JP2021031602A (ja) 2021-03-01

Similar Documents

Publication Publication Date Title
TWI700243B (zh) 六方晶氮化硼粉末及其製造方法以及使用其之組成物及散熱材
JP7096921B2 (ja) 六方晶窒化ホウ素粉末及びその製造方法、並びにそれを用いた組成物及び放熱材
CN111492474B (zh) 绝缘散热片
TW202031763A (zh) 填料組成物、聚矽氧樹脂組成物、以及散熱零件
JP6739825B2 (ja) 熱伝導性組成物及び熱伝導性成形体
JP2014193965A (ja) 高熱伝導性樹脂組成物、高熱伝導性半硬化樹脂フィルム及び高熱伝導性樹脂硬化物
CN104497477B (zh) 一种导热复合材料及其制备方法
CN108753261A (zh) 一种高k值相变导热片及其制备方法
CN106543728A (zh) 一种石墨烯有机硅橡胶复合材料及其制备方法
JP7220150B2 (ja) 低誘電率熱伝導性放熱部材
WO2021039201A1 (fr) Résine thermoconductrice, structure de dissipation de chaleur et procédé de production de résine thermoconductrice
JP6285155B2 (ja) 放熱部材およびその用途
WO2021039202A1 (fr) Résine thermoconductrice et structure de dissipation de chaleur
JP2019131669A (ja) 樹脂組成物および絶縁熱伝導性シート
JP2012106888A (ja) 高絶縁性炭化ケイ素粉体及び該粉体を含有する組成物
JP2014189701A (ja) 高熱伝導性樹脂硬化物、高熱伝導性半硬化樹脂フィルム及び高熱伝導性樹脂組成物
JP7292941B2 (ja) 窒化アルミニウム複合フィラー
WO2021039200A1 (fr) Résine thermiquement conductrice et structure de dissipation de chaleur
TW201927922A (zh) 玻璃被覆氮化鋁粒子、其製造方法及包含其之放熱性樹脂組成物
CN105086119B (zh) 热辐射性树脂组合物以及使用了该组合物的部件、电子设备
WO2014104292A1 (fr) Feuille de résine fluorée et son procédé de production
JP3572692B2 (ja) α−アルミナ粉末含有樹脂組成物及びゴム組成物
KR20220014349A (ko) 방열용 무기소재 코팅액 제조방법
US9920231B2 (en) Thermal compound composition containing Cu—CuO composite filler
JP2018178032A (ja) 樹脂組成物ならびにそれを用いた電子部品および電子機器

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20855999

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20855999

Country of ref document: EP

Kind code of ref document: A1