WO2021039200A1 - Résine thermiquement conductrice et structure de dissipation de chaleur - Google Patents

Résine thermiquement conductrice et structure de dissipation de chaleur Download PDF

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Publication number
WO2021039200A1
WO2021039200A1 PCT/JP2020/028058 JP2020028058W WO2021039200A1 WO 2021039200 A1 WO2021039200 A1 WO 2021039200A1 JP 2020028058 W JP2020028058 W JP 2020028058W WO 2021039200 A1 WO2021039200 A1 WO 2021039200A1
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WIPO (PCT)
Prior art keywords
resin
alumina
heat
conductive resin
fibers
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Application number
PCT/JP2020/028058
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English (en)
Japanese (ja)
Inventor
圭司 熊野
隆彦 岡部
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イビデン株式会社
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Publication date
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Publication of WO2021039200A1 publication Critical patent/WO2021039200A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/08—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a thermally conductive resin and a heat radiating structure.
  • a semiconductor is composed of a conductor for energization and an insulating material.
  • the amount of heat generated has increased due to the increase in the output of semiconductors, so how to dissipate the heat generated from the semiconductor has become an important issue.
  • Patent Document 1 describes a heat-resistant thermally conductive silicone composition.
  • This composition is a composition in which spherical alumina particles as a heat conductive filler are contained in a silicone resin, and is used so as to fill a gap between a semiconductor element and a heat radiating material (heat sink).
  • spherical alumina particles are used as the heat conductive filler, but the spherical alumina particles have a low contact probability between the particles in the resin and a resin having a low thermal conductivity between the particles. Due to the presence of parts, it is difficult to form an effective heat transfer path. Therefore, there is a problem that it is difficult to obtain high thermal conductivity with such a composition.
  • the present invention has been made in view of such a problem, and an object of the present invention is to provide a thermally conductive resin having excellent thermal conductivity.
  • the thermally conductive resin of the present invention is a resin and an alumina fiber contained in the resin having an average fiber diameter of 1 ⁇ m or more, an alumina content of 85% by weight or more, and an ⁇ -alumina ratio of 50% by weight or more. It is characterized by being composed of.
  • alumina fibers are used as the thermally conductive filler.
  • the contact probability between the fibers is higher than when alumina particles are used, and heat is transferred not to the resin portion but to the fiber portion, so that an effective heat transfer path is formed. Therefore, a thermosetting resin having a high thermal conductivity can be obtained.
  • the alumina fiber itself is an alumina fiber having an alumina content of 85% by weight or more and an ⁇ -alumina ratio of 50% by weight or more.
  • the content ratio of the alumina fibers is preferably 20% by weight or more.
  • the effect of blending the alumina fibers as the heat conductive filler is more preferably exhibited, and the heat conductive resin having a higher thermal conductivity can be obtained.
  • the aspect ratio of the alumina fibers is preferably more than 100 and 1000 or less.
  • the aspect ratio of the alumina fiber is in the above range, heat flows continuously over a long distance of the fiber portion, and a resin portion having a low thermal conductivity does not intervene between them, so that the heat conductive resin has a higher thermal conductivity. can do.
  • thermosetting resin of the present invention it is preferable that the resin is a silicone resin or an epoxy resin. These resins are preferable because they have high heat resistance and excellent insulating properties.
  • the heat radiating structure of the present invention is characterized by comprising a heat source, a heat radiating member, and a heat conductive resin of the present invention arranged between the heat source and the heat radiating member. With this structure, heat from the heat source can be suitably conducted to the heat radiating member via the heat conductive resin.
  • FIG. 1 is a cross-sectional view schematically showing an embodiment of the heat conductive resin of the present invention.
  • FIG. 2 is a cross-sectional view schematically showing an embodiment of the heat dissipation structure.
  • the thermally conductive resin of the present invention includes a resin, and alumina fibers contained in the resin having an average fiber diameter of 1 ⁇ m or more, an alumina content of 85% by weight or more, and an ⁇ -alumina ratio of 50% by weight or more. It is characterized by consisting of.
  • FIG. 1 is a cross-sectional view schematically showing an embodiment of the heat conductive resin of the present invention.
  • the thermally conductive resin 10 shown in FIG. 1 is composed of the resin 20 and the alumina fibers 30 contained in the resin 20.
  • the alumina fiber 30 is present in the matrix of the resin 20.
  • the resin is preferably at least one selected from the group consisting of epoxy resin, silicone resin, acrylic resin, polyimide resin, melamine resin, polycarbonate resin, polypropylene resin and polyethylene resin.
  • epoxy resin or silicone resin is more preferable. Since the epoxy resin or the silicone resin has high insulating properties, it is preferable because the insulating properties can be ensured when the thermosetting resin is used in contact with a semiconductor element or the like.
  • the average fiber diameter of alumina fibers is 1 ⁇ m or more.
  • the average fiber diameter of the alumina fibers is determined as an average value by taking an electron micrograph of the heat conductive resin at a magnification of about 1500 times and measuring the diameters of 10 or more fibers from the obtained photographs.
  • the average fiber diameter of the alumina fibers is 1 ⁇ m or more, the amount of heat transferred by the alumina fibers increases, and the effect of improving the thermal conductivity by using the alumina fibers is suitably exhibited.
  • the average fiber diameter of the alumina fibers is more preferably 4 ⁇ m or more.
  • the average fiber diameter of the alumina fibers is preferably 30 ⁇ m or less.
  • the alumina fiber is an alumina fiber having an alumina content of 85% by weight or more and an ⁇ -alumina ratio of 50% by weight or more. Since such alumina fibers have a higher thermal conductivity than alumina fibers having a mullite composition containing a large amount of silica, they can be used as a heat conductive resin having a high thermal conductivity from the viewpoint of the composition of the alumina fibers. can do.
  • the alumina content in the alumina fiber is determined by quantitatively analyzing the elements contained in the alumina fiber by the following procedure by the fluorescent X-ray analysis method to determine the Al content, and the weight ratio in terms of Al 2 O 3 from the Al content. Can be obtained by calculating. First, the sample is sufficiently crushed in a mortar, an organic binder (Chemplex Industries Inc Spectro Blend 44 ⁇ m) is added, and the mixture is mixed well. Then, it is molded into pellets by pressurizing. The size of the pellet is, for example, about 13 mm in diameter and about 5 mm in thickness. It is measured by a fluorescent X-ray measuring device (ZSX Primus II manufactured by Rigaku Co., Ltd.). The X-ray tube of this device is Rh, and the rated maximum output is 4 kW. The analysis area is 10 mm ⁇ .
  • the ⁇ -alumina ratio of the alumina fiber is 50% by weight or more.
  • the ⁇ -alumina ratio of the alumina fiber is preferably 80% by weight or more, and preferably 99% by weight or less.
  • the content of the alumina fibers in the thermally conductive resin is not particularly limited, but is preferably 20% by weight or more. By setting the content ratio of the alumina fibers to 20% by weight or more, the effect of blending the alumina fibers as the heat conductive filler is more preferably exhibited, and the heat conductive resin having a higher thermal conductivity can be obtained. It is more preferable that the content ratio of the alumina fiber is 45% by weight or more. Further, the content ratio of the alumina fiber is preferably 90% by weight or less, and more preferably 80% by weight or less.
  • the aspect ratio of the alumina fiber is preferably more than 100 and 1000 or less. When the aspect ratio of the alumina fiber is in the above range, heat flows continuously over a long distance of the fiber portion, and a resin portion having a low thermal conductivity does not intervene between them, so that the heat conductive resin has a higher thermal conductivity. can do.
  • the aspect ratio of alumina fibers can be determined by (average fiber length / average fiber diameter of alumina fibers). The average fiber length of the alumina fiber is measured by taking an electron micrograph of the heat conductive resin at a magnification of about 1500 times in the same manner as the measurement of the average fiber diameter of the alumina fiber, and 10 or more fibers are taken from the obtained photograph.
  • the length can be measured and set as the average value.
  • the average fiber length of the alumina fibers is preferably 100 ⁇ m or more, and more preferably 400 ⁇ m or more.
  • the average fiber length of the alumina fibers is preferably 5000 ⁇ m or less.
  • the thermally conductive resin may contain inorganic fibers other than alumina fibers and inorganic fillers in addition to the resin and alumina fibers.
  • inorganic fibers other than alumina fibers include silica-alumina fibers, silica fibers, zirconia fibers, titania fibers, and biosoluble fibers.
  • the inorganic filler is preferably at least one selected from the group consisting of silicon nitride, aluminum nitride, boron nitride, silica and alumina. Further, since these inorganic particles are materials having high thermal conductivity, the thermal conductivity of the thermally conductive resin can be enhanced by blending them in the thermally conductive resin.
  • the insulating property of the heat conductive resin can be enhanced by using these inorganic particles.
  • the proportion of the inorganic fiber or the inorganic filler other than the alumina fiber is preferably 30% by weight or less in the heat conductive resin.
  • the thickness of the thermally conductive resin is preferably 500 ⁇ m or more and 10 mm or less. Further, it is more preferably 1 mm or more, and more preferably 3 mm or less. When the thermosetting resin is required to have insulating properties, it preferably has a certain thickness (500 ⁇ m or more). In addition, since the heat conductive resin has a lower thermal conductivity than the metal material, if the thickness of the heat conductive resin is too thick (for example, exceeding 10 mm), the entire heat conduction due to the use of the heat conductive resin Deterioration of sex may occur.
  • the thermal conductivity of the thermally conductive resin is preferably 1 W / m ⁇ K or more, and more preferably 3 W / m ⁇ K or more.
  • the thermal conductivity of the thermally conductive resin can be measured by the laser flash method.
  • the thermally conductive resin of the present invention can be produced by mixing and molding a resin material, alumina fibers, and other materials if necessary.
  • the molding method can be arbitrarily set depending on the shape of the thermosetting resin, and methods such as press molding, doctor blade method, extrusion molding, injection molding, sheet molding, and film molding can be used. Further, after forming into a predetermined shape, machining such as cutting and polishing may be performed to obtain a desired shape.
  • the resin constituting the thermosetting resin is a curable resin such as a thermosetting resin or a photocurable resin
  • the resin material and the alumina fiber are mixed and heated with respect to the resin precursor obtained by molding. It may be cured or photocured.
  • the heat radiating structure of the present invention is characterized by comprising a heat source, a heat radiating member, and a heat conductive resin of the present invention arranged between the heat source and the heat radiating member.
  • FIG. 2 is a cross-sectional view schematically showing an embodiment of the heat dissipation structure.
  • FIG. 2 shows a heat radiating structure 100 in which a heat conductive resin 10 is arranged between a semiconductor element 110 as a heat source and a heat sink 200 as a heat radiating member.
  • the heat generated from the semiconductor element 110 can be thermally conducted to the heat sink 200 via the heat conductive resin 10.
  • FIG. 2 shows how the heat conductive grease 115 is arranged between the semiconductor element 110 and the heat conductive resin 10 and between the heat conductive resin 10 and the heat sink 200, respectively.
  • the heat conductive grease is arranged to fill the space between the semiconductor element and the heat conductive resin and the space between the heat conductive resin and the heat sink to improve the contact property and the heat conductivity. It is not essential to use the heat conductive grease, and the semiconductor element 110 may be brought into direct contact with the heat conductive resin 10, or the heat conductive resin 10 may be brought into direct contact with the heat sink 200.
  • Examples of the heat source of the heat dissipation structure include a light emitting element (LED element and the like), a capacitor, a resistance element, a battery, a motor and the like in addition to the semiconductor element.
  • a heat sink, a heat radiating block, a heat radiating fin, a heat diffusion sheet, a heat pipe, or the like can be used as the heat radiating member.
  • Example 1 Bisphenol A type epoxy resin (jER (registered trademark) resin 828, manufactured by Mitsubishi Chemical Co., Ltd.) 83.3 parts by weight, amine-based curing agent (jER (registered trademark) Cure T, manufactured by Mitsubishi Chemical Co., Ltd.) 16.7 A weight mixture was used.
  • alumina fibers alumina fibers having an average fiber diameter of 6 ⁇ m, an average fiber length of 800 ⁇ m, an alumina content of 95% by weight, and an ⁇ -alumina ratio of 82% by weight were prepared.
  • the heat conductive resin composition was press-molded to prepare a resin sheet having a thickness of 5 mm. This resin sheet was processed to a size of 200 mm ⁇ 200 mm, and the thermal conductivity was measured using a laser flash method thermal constant measuring device (TC-1200RH manufactured by ULVAC-RIKO, Inc.). The thermal conductivity was 10 W / m ⁇ K.
  • Example 1 a resin sheet was produced in the same manner as in Example 1 except that alumina particles (manufactured by Denka Co., Ltd.) having an average particle diameter of 5 ⁇ m were used instead of the alumina fibers.
  • the thermal conductivity of this resin sheet was measured and found to be 0.5 W / m ⁇ K.
  • thermoly conductive resin having high thermal conductivity could be obtained by using alumina fibers instead of alumina particles as the material used for the thermally conductive resin.
  • Thermal conductive resin 10
  • Resin 30 Alumina fiber 100
  • Heat dissipation structure 110
  • Semiconductor element (heat source) 115
  • Thermal grease 200
  • Heat sink heat dissipation member

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne une résine thermiquement conductrice présentant une excellente conductivité thermique. Cette résine thermiquement conductrice est caractérisée en ce qu'elle comprend une résine et des fibres d'alumine qui sont contenues dans la résine, présentent un diamètre moyen de fibre d'au moins 1 µm, et ont 85 % en pds ou plus de teneur en alumine et un rapport d'α-alumine de 50 % en pds ou plus.
PCT/JP2020/028058 2019-08-26 2020-07-20 Résine thermiquement conductrice et structure de dissipation de chaleur WO2021039200A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-153821 2019-08-26
JP2019153821A JP7373942B2 (ja) 2019-08-26 2019-08-26 熱伝導性樹脂及び放熱構造体

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WO2021039200A1 true WO2021039200A1 (fr) 2021-03-04

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009048000A1 (fr) * 2007-10-11 2009-04-16 Denki Kagaku Kogyo Kabushiki Kaisha Matière de fibres alumineuses, son procédé de production et utilisation
JP2009120814A (ja) * 2007-10-23 2009-06-04 Mitsubishi Chemicals Corp 樹脂組成物
JP2010235842A (ja) * 2009-03-31 2010-10-21 Mitsubishi Chemicals Corp 異方性形状の窒化アルミニウムフィラーを含有する熱硬化性樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009048000A1 (fr) * 2007-10-11 2009-04-16 Denki Kagaku Kogyo Kabushiki Kaisha Matière de fibres alumineuses, son procédé de production et utilisation
JP2009120814A (ja) * 2007-10-23 2009-06-04 Mitsubishi Chemicals Corp 樹脂組成物
JP2010235842A (ja) * 2009-03-31 2010-10-21 Mitsubishi Chemicals Corp 異方性形状の窒化アルミニウムフィラーを含有する熱硬化性樹脂組成物

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JP2021031601A (ja) 2021-03-01

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