JP6739825B2 - 熱伝導性組成物及び熱伝導性成形体 - Google Patents
熱伝導性組成物及び熱伝導性成形体 Download PDFInfo
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Description
Claims (9)
- 高分子マトリクス中に熱伝導性充填材を含む熱伝導性組成物において、
メチルフェニル系シリコーンを含有し、
前記熱伝導性充填材は、平均粒径が10〜100μmであり、前記熱伝導性組成物中の前記熱伝導性充填材の含有率が70〜90体積%であり、かつ、当該熱伝導性充填材中の30〜80体積%が粒径40μm以上であり、
前記高分子マトリクスは、付加反応硬化型シリコーンであり、
前記メチルフェニル系シリコーンは、JIS K 0062:1992に準拠した屈折率が1.427以上であり、かつ、前記熱伝導性組成物中におけるその含有率が1〜10体積%であることを特徴とする熱伝導性組成物。
- 前記熱伝導性充填材は、当該熱伝導性充填材中の20〜50体積%が粒径5μm未満である請求項1記載の熱伝導性組成物。
- 前記熱伝導性充填材は、粒径が40μm以上のものと粒径が5μm未満であるものとの合計が、全熱伝導性充填材中の90体積%以上である請求項1または請求項2記載の熱伝導性組成物。
- 前記熱伝導性充填材は、金属、金属酸化物、金属窒化物、金属炭化物から選択される請求項1〜請求項3何れか1項記載の熱伝導性組成物。
- 前記熱伝導性充填材は、酸化アルミニウム、窒化アルミニウムから選択される少なくとも1つ以上である請求項1〜請求項3何れか1項記載の熱伝導性組成物。
- 請求項1〜請求項5何れか1項記載の熱伝導性組成物の硬化体である熱伝導性成形体。
- シート状である請求項6記載の熱伝導性成形体。
- 熱伝導率が4.5W/m・K以上である請求項6または請求項7記載の熱伝導性成形体。
- E硬度が20〜70である請求項6〜請求項8何れか1項記載の熱伝導性成形体。
Applications Claiming Priority (3)
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JP2018014487 | 2018-01-31 | ||
JP2018014487 | 2018-01-31 | ||
PCT/JP2019/000994 WO2019150944A1 (ja) | 2018-01-31 | 2019-01-16 | 熱伝導性組成物及び熱伝導性成形体 |
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JPWO2019150944A1 JPWO2019150944A1 (ja) | 2020-04-02 |
JP6739825B2 true JP6739825B2 (ja) | 2020-08-12 |
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US (1) | US11781052B2 (ja) |
EP (1) | EP3747953B1 (ja) |
JP (1) | JP6739825B2 (ja) |
CN (1) | CN111315827A (ja) |
WO (1) | WO2019150944A1 (ja) |
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WO2021090655A1 (ja) * | 2019-11-06 | 2021-05-14 | 信越化学工業株式会社 | 熱伝導性シリコーンポッティング組成物およびその硬化物 |
CN115135710A (zh) * | 2020-03-26 | 2022-09-30 | Ddp特种电子材料美国有限责任公司 | 包含多模态分布的球形填料的热界面材料 |
EP4130132A4 (en) * | 2020-03-30 | 2024-05-29 | Sekisui Polymatech Co., Ltd. | SILICONE COMPOSITION AND METHOD FOR MANUFACTURING SILICONE COMPOSITION |
CN115668486A (zh) | 2020-05-29 | 2023-01-31 | 积水保力马科技株式会社 | 导热性片的制造方法及叠层体 |
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JP2004176016A (ja) * | 2002-11-29 | 2004-06-24 | Shin Etsu Chem Co Ltd | 熱伝導性シリコーン組成物及びその成形体 |
JP2005194479A (ja) * | 2004-01-09 | 2005-07-21 | Inoac Corp | 放熱成形品用の混練剤及び放熱成形品 |
CN101035876A (zh) * | 2004-08-23 | 2007-09-12 | 莫门蒂夫性能材料股份有限公司 | 导热性组合物及其制备方法 |
JP4590253B2 (ja) * | 2004-12-16 | 2010-12-01 | 東レ・ダウコーニング株式会社 | オルガノポリシロキサンおよびシリコーン組成物 |
JP5089908B2 (ja) | 2006-04-06 | 2012-12-05 | 株式会社マイクロン | 高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート用配合粒子、高熱伝導性樹脂コンパウンド・高熱伝導性樹脂成形体・放熱シート、および、その製造方法 |
JP2007150349A (ja) | 2007-02-09 | 2007-06-14 | Shin Etsu Chem Co Ltd | 熱軟化性熱伝導性部材 |
JP5619487B2 (ja) | 2010-06-24 | 2014-11-05 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーングリース組成物 |
JP6136952B2 (ja) * | 2013-02-28 | 2017-05-31 | 信越化学工業株式会社 | 熱伝導性複合シリコーンゴムシート |
CN103194067B (zh) * | 2013-04-25 | 2015-03-11 | 汕头市骏码凯撒有限公司 | 一种超低热阻导热硅脂及其制备方法 |
JP6075261B2 (ja) * | 2013-10-02 | 2017-02-08 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
JP6194861B2 (ja) * | 2014-07-28 | 2017-09-13 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び熱伝導性シリコーン成型物 |
JP6503725B2 (ja) | 2014-12-15 | 2019-04-24 | 日立化成株式会社 | エポキシ樹脂組成物、樹脂シート、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物及び金属基板 |
CN105111743A (zh) * | 2015-09-16 | 2015-12-02 | 赵孝连 | 导热介质及其在锂电池组中的应用和制造其的方法 |
JP6708005B2 (ja) | 2016-06-20 | 2020-06-10 | 信越化学工業株式会社 | 熱伝導性シリコーンパテ組成物 |
JP6648837B2 (ja) | 2016-11-09 | 2020-02-14 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物、ならびに製造方法 |
CN111051434B (zh) * | 2017-07-24 | 2022-03-29 | 陶氏东丽株式会社 | 多成分硬化型导热性硅酮凝胶组合物、导热性部件及散热构造体 |
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- 2019-01-16 CN CN201980005573.4A patent/CN111315827A/zh active Pending
- 2019-01-16 JP JP2019566367A patent/JP6739825B2/ja active Active
- 2019-01-16 US US16/956,343 patent/US11781052B2/en active Active
- 2019-01-16 EP EP19747034.7A patent/EP3747953B1/en active Active
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EP3747953A4 (en) | 2021-10-27 |
US20200317979A1 (en) | 2020-10-08 |
EP3747953A1 (en) | 2020-12-09 |
CN111315827A (zh) | 2020-06-19 |
US11781052B2 (en) | 2023-10-10 |
JPWO2019150944A1 (ja) | 2020-04-02 |
WO2019150944A1 (ja) | 2019-08-08 |
EP3747953B1 (en) | 2023-08-09 |
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