WO2022176822A1 - Procédé de production d'un élément de dissipation de chaleur - Google Patents

Procédé de production d'un élément de dissipation de chaleur Download PDF

Info

Publication number
WO2022176822A1
WO2022176822A1 PCT/JP2022/005789 JP2022005789W WO2022176822A1 WO 2022176822 A1 WO2022176822 A1 WO 2022176822A1 JP 2022005789 W JP2022005789 W JP 2022005789W WO 2022176822 A1 WO2022176822 A1 WO 2022176822A1
Authority
WO
WIPO (PCT)
Prior art keywords
adherend
thermally conductive
manufacturing
conductive composition
green sheet
Prior art date
Application number
PCT/JP2022/005789
Other languages
English (en)
Japanese (ja)
Inventor
佑介 久保
慶輔 荒巻
勇磨 佐藤
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Publication of WO2022176822A1 publication Critical patent/WO2022176822A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a method for manufacturing a heat radiating member.
  • Electronic devices are equipped with heat-dissipating members that dissipate heat from electronic components, and members such as heat sinks that constitute the heat-dissipating members are attached to semiconductors via heat-conducting members in order to efficiently dissipate heat.
  • a thermally conductive member a polymer matrix such as silicone in which a filler such as an inorganic filler is dispersed is widely used.
  • inorganic fillers include alumina, aluminum nitride, and aluminum hydroxide.
  • types of the heat conducting member there are a grease type, a sheet type, a liquid hardening type, and the like.
  • thermal conductivity there is a demand for further improvement in thermal conductivity in such thermally conductive members, and in general, this is achieved by increasing the filling rate of the inorganic filler blended in the matrix for the purpose of increasing the thermal conductivity. is doing.
  • increasing the filling rate of the inorganic filler impairs the flexibility and causes powder to fall off, so there is a limit to increasing the filling rate of the inorganic filler.
  • scale-like particles such as boron nitride and graphite, carbon fibers, etc. may be filled in the polymer matrix. This is due to the anisotropy of thermal conductivity of scale-like particles, carbon fibers, and the like.
  • carbon fibers have a thermal conductivity of about 600 W/mK to about 1200 W/mK in the fiber direction.
  • Boron nitride has a thermal conductivity of about 110 W/mK in the plane direction and about 2 W/mK in the direction perpendicular to the plane direction.
  • the thermal conductivity can be dramatically improved.
  • Patent Document 1 As a method for producing a thermally conductive sheet having anisotropic thermal conductivity, there is a method of forming a composition containing a matrix and a thermally conductive filler into an uncured green sheet and slicing the laminate of the green sheets. There is (Patent Document 1). There is also a method of slicing a block-shaped object obtained by extruding the composition (Patent Documents 2 and 3).
  • heat-conducting member heat-conducting sheet
  • heat-conducting sheet heat-conducting sheet
  • the present invention has been made in view of the above, and it is an object of the present invention to provide a method of manufacturing a heat dissipating member that can improve mountability while maintaining high thermal conductivity.
  • a method for manufacturing a heat dissipating member according to the present invention provides a thermally conductive composition containing a polymer matrix and an anisotropic filler having anisotropic thermal conductivity. a step of placing the anisotropic filler on a first adherend in a pre-cured state in which the state in which the anisotropic filler is oriented in the thickness direction of the thermally conductive composition is maintained; and mounting the first adherend on the second adherend, and then further curing the thermally conductive composition in the pre-cured state.
  • mountability can be improved while maintaining high thermal conductivity.
  • FIG. 1 is a diagram showing an example of a heat radiating member according to an embodiment.
  • FIG. 2 is a flow chart showing an example of a basic flow of a method for manufacturing a heat radiating member according to the embodiment.
  • FIG. 3 is a flow chart showing the flow of the manufacturing method of the heat radiating member according to the first embodiment.
  • FIG. 4 is a flow chart showing the flow of the manufacturing method of the heat radiating member according to the second embodiment.
  • FIG. 5 is a flow chart showing the flow of the manufacturing method of the heat radiating member according to the third embodiment.
  • FIG. 6 is a flow chart showing the flow of the manufacturing method of the heat radiating member according to the fourth embodiment.
  • FIG. 1 is a diagram showing an example of a heat radiating member 1 according to an embodiment.
  • the heat dissipation member 1 is a member for dissipating the heat of the electronic component 10 .
  • the heat dissipation member 1 exemplified here has heat conductive sheets 11A and 11B, a heat spreader 12, and a heat sink 13. As shown in FIG.
  • the thermally conductive sheet 11A is sandwiched between the electronic component 10 and the heat spreader 12, and the thermally conductive sheet 11B is sandwiched between the heat spreader 12 and the heat sink 13.
  • FIG. 1 is a diagram showing an example of a heat radiating member 1 according to an embodiment.
  • the heat dissipation member 1 is a member for dissipating the heat of the electronic component 10 .
  • the heat dissipation member 1 exemplified here has heat conductive sheets 11A and 11B, a heat spreader 12, and a heat sink 13. As shown in FIG.
  • the electronic component 10 is not particularly limited and can be appropriately selected according to the purpose. Examples thereof include CPU, MPU, graphic processing elements, various semiconductor elements such as image sensors, antenna elements, batteries, and the like.
  • the heat spreader 12 is not particularly limited as long as it is a member capable of conducting (dissipating) heat from the electronic component 10, and can be appropriately selected according to the purpose.
  • the thermally conductive sheets 11A and 11B have high thermal conductivity in their thickness direction.
  • the thickness direction is a direction (vertical direction in FIG. 1) perpendicular to the bonding surface between the thermally conductive sheets 11A and 11B and the adherend (in this embodiment, the electronic component 10, the heat spreader 12, or the heat sink 13). be.
  • the heat conductive sheets 11A and 11B By using the heat conductive sheets 11A and 11B, the heat dissipation property of the heat dissipation member 1 can be improved.
  • the two thermally conductive sheets 11A and 11B may be referred to as the thermally conductive sheet 11 when there is no need to distinguish between them.
  • the mounting location of the heat conductive sheet 11 is not limited to the above, and can be appropriately selected according to the configuration of the electronic device to be cooled and the heat dissipating member as a whole. Further, in the above, the configuration using the heat spreader 12 and the heat sink 13 as members for promoting heat dissipation is exemplified. , a metal cover, a housing, or the like may be used.
  • the thermally conductive sheet 11 according to the present embodiment is obtained by curing a binder resin containing a polymer matrix and an anisotropic filler having anisotropic thermal conductivity.
  • the polymer matrix is a polymer component that serves as the base material of the thermally conductive sheet 11, and its type is not particularly limited, and known components can be appropriately selected.
  • the polymer matrix includes thermosetting resins, UV-curable resins, and the like.
  • thermosetting resins include crosslinked rubber, epoxy resin, polyimide resin, bismaleimide resin, benzocyclobutene resin, phenol resin, unsaturated polyester, diallyl phthalate resin, silicone resin, polyurethane, polyimide silicone, thermosetting polyphenylene. Ethers, thermosetting modified polyphenylene ethers, and the like. These may be used individually by 1 type, and may use 2 or more types together. Moreover, a catalyst may be added for adjusting the curing time, the curing temperature, and the like.
  • crosslinked rubber examples include natural rubber, butadiene rubber, isoprene rubber, nitrile rubber, hydrogenated nitrile rubber, chloroprene rubber, ethylene propylene rubber, chlorinated polyethylene, chlorosulfonated polyethylene, butyl rubber, halogenated butyl rubber, and fluororubber. , urethane rubber, acrylic rubber, polyisobutylene rubber, and silicone rubber. These may be used individually by 1 type, and may use 2 or more types together.
  • thermosetting resins it is preferable to use a silicone resin from the viewpoint of excellent moldability and weather resistance, as well as adhesion and conformability to electronic parts.
  • the silicone resin is not particularly limited, and the type of silicone resin can be appropriately selected according to the purpose.
  • the silicone resin is preferably a silicone resin composed of a liquid silicone gel main agent and a curing agent.
  • silicone resins include addition reaction type liquid silicone resins, heat vulcanization type millable type silicone resins using peroxide for vulcanization, and the like.
  • addition reaction type liquid silicone resin is particularly preferable as a heat dissipating member for dissipating heat from an electronic device, since adhesion between the heat generating surface of the electronic component and the heat sink surface is required.
  • addition reaction type liquid silicone resin it is preferable to use a two-liquid addition reaction type silicone resin or the like that uses polyorganosiloxane having a vinyl group as the main agent and polyorganosiloxane having an Si—H group as a curing agent.
  • the liquid silicone component has a silicone A liquid component as a main agent and a silicone B liquid component containing a curing agent, and the silicone A liquid component and the silicone B liquid component are blended in a predetermined ratio.
  • the blending ratio of the silicone A liquid component and the silicone B liquid component can be adjusted as appropriate. It is preferable that the blending ratio is such that the uncured component of the polymer matrix can bleed to the contact surface with the heat spreader 12 or the heat sink 13).
  • UV-curable resins examples include (meth)acrylate resins and unsaturated polyester resins containing photopolymerization initiators, and epoxy resins containing photocationic curing agents. These may be used individually by 1 type, and may use 2 or more types together.
  • the content of the polymer matrix in the heat conductive sheet 11 is not particularly limited and can be appropriately selected according to the purpose. It is preferably about 15% by volume to 50% by volume, more preferably 20% by volume to 45% by volume.
  • the anisotropic filler is a component for improving the thermal conductivity of the thermally conductive sheet 11, and has an anisotropic thermal conductivity.
  • the type of the anisotropic filler is not particularly limited as long as it is a material having high thermal conductivity and anisotropic thermal conductivity. Examples thereof include scaly particles and fibrous particles.
  • scale-like particles examples include boron nitride and graphite. These may be used individually by 1 type, and may use 2 or more types together.
  • the thermal conductivity is high in the surface direction (direction parallel to the bonding surface) and low in the direction perpendicular to the surface direction.
  • the thermal conductivity is about 110 W/mK in the plane direction and about 2 W/mK in the direction perpendicular to the plane direction.
  • fibrous particles include carbon fibers.
  • carbon fibers for example, pitch-based, PAN-based, graphitized PBO fibers, arc discharge method, laser evaporation method, CVD method (chemical vapor deposition method), CCVD method (catalytic chemical vapor deposition method), etc. and those synthesized by Among these, carbon fibers obtained by graphitizing PBO fibers and pitch-based carbon fibers are more preferable because high thermal conductivity can be obtained. These may be used individually by 1 type, and may use 2 or more types together.
  • the carbon fiber can be used by surface-treating part or all of it, if necessary.
  • Surface treatments include, for example, oxidation treatment, nitriding treatment, nitration, sulfonation, or attaching or binding metals, metal compounds, organic compounds, etc. to the surface of functional groups or carbon fibers introduced to the surface by these treatments. and the like.
  • Functional groups include, for example, hydroxyl groups, carboxyl groups, carbonyl groups, nitro groups, amino groups and the like.
  • the average fiber length (average long axis length) of the carbon fibers is not particularly limited and can be appropriately selected. It is preferably in the range of 75 ⁇ m to 275 ⁇ m, and particularly preferably in the range of 90 ⁇ m to 250 ⁇ m.
  • the average fiber diameter (average minor axis length) of the carbon fibers is not particularly limited and can be selected as appropriate. is preferred, and a range of 5 ⁇ m to 14 ⁇ m is more preferred.
  • the aspect ratio (average major axis length/average minor axis length) of carbon fibers is preferably 8 or more, more preferably 9 to 30, in order to reliably obtain high thermal conductivity. If the aspect ratio is less than 8, the fiber length (major axis length) of the carbon fibers is short, and the thermal conductivity may decrease. Since the dispersibility is lowered, there is a possibility that sufficient thermal conductivity cannot be obtained.
  • the thermal conductivity of carbon fibers in the fiber direction is about 600 W/mK to about 1200 W/mK.
  • the surface direction of the scaly particles and the fiber direction of the carbon fibers as described above are made the same as the thickness direction of the heat conductive sheet 11, which is the direction of heat conduction, that is, the scaly particles and carbon fibers are oriented in the thickness direction. As a result, thermal conductivity can be dramatically improved.
  • the thermally conductive sheet 11 may further contain an inorganic filler as a thermally conductive filler.
  • an inorganic filler By containing the inorganic filler, the thermal conductivity of the thermally conductive sheet 11 can be further increased, and the strength of the sheet can be improved.
  • the shape, material, average particle size, etc. of the inorganic filler are not particularly limited, and can be appropriately selected according to the purpose. Examples of the shape include spherical, ellipsoidal, massive, granular, flattened, needle-like, and the like. Among these, a spherical shape and an elliptical shape are preferable from the viewpoint of filling properties, and a spherical shape is particularly preferable.
  • inorganic filler materials include aluminum nitride (aluminum nitride: AlN), silica, alumina (aluminum oxide), boron nitride, titania, glass, zinc oxide, silicon carbide, silicon (silicon), silicon oxide, metal particles, and the like. is mentioned.
  • aluminum nitride aluminum nitride: AlN
  • silica silica
  • boron nitride titanium oxide
  • titania titanium oxide
  • glass zinc oxide
  • silicon carbide silicon (silicon), silicon oxide, metal particles, and the like.
  • alumina, boron nitride, aluminum nitride, zinc oxide, and silica are preferable, and from the viewpoint of thermal conductivity, alumina and aluminum nitride are more preferable.
  • the thermally conductive sheet 11 may contain other components as appropriate depending on the purpose.
  • Other components include, for example, magnetic powders, thixotropic agents, dispersants, curing accelerators, retarders, slight tackifiers, plasticizers, flame retardants, antioxidants, stabilizers, colorants, and the like.
  • electromagnetic wave absorption performance may be imparted to the heat conductive sheet 11 by adjusting the content of the magnetic powder.
  • FIG. 2 is a flow chart showing an example of the basic flow of the method for manufacturing the heat radiating member 1 according to the embodiment.
  • a thermally conductive composition containing a polymer matrix and an anisotropic filler is applied to a first adherend in a pre-cured state in which the anisotropic filler is maintained oriented in the thickness direction of the thermally conductive composition.
  • a thermally conductive composition is a composition that serves as a material for the thermally conductive sheet 11 described above.
  • the first adherend is a member (the electronic component 10, the heat spreader 12, or the heat sink 13 in the configuration example of FIG. 1) to which the heat conductive sheet 11 is adhered.
  • the first adherend on which the temporarily cured thermally conductive composition is placed is mounted on the second adherend (S12).
  • the second adherend is a member adhered to the surface of the thermal conductive sheet 11 opposite to the surface to which the first adherend is adhered.
  • the second adherend of the heat conductive sheet 11A is the electronic component 10 when the first adherend is the heat spreader 12, and the heat spreader 12 when the first adherend is the electronic component 10.
  • the second adherend of the thermal conductive sheet 11B is the heat sink 13 when the first adherend is the heat spreader 12, and the heat spreader 12 when the first adherend is the heat sink 13.
  • the temporarily cured thermal conductive composition is further cured (S13).
  • the thermally conductive composition is mounted on the heat dissipating member 1 in a pre-cured state having appropriate orientation and relatively high flexibility, and is completely cured after mounting. This makes it possible to achieve both orientation and adhesiveness, and improve mountability while maintaining high thermal conductivity.
  • FIG. 3 is a flow chart showing the flow of the manufacturing method of the heat radiating member 1 according to the first embodiment.
  • the liquid thermally conductive composition is applied to the first adherend so that the anisotropic filler is oriented in the thickness direction of the thermally conductive composition (S101).
  • a method for realizing the application is not particularly limited, but for example, the application can be achieved using a die head with slits.
  • the thermally conductive composition on the first adherend is pre-cured (S102) to obtain a pre-cured state in which the anisotropic filler is oriented in the thickness direction of the thermally conductive composition.
  • the first adherend on which the temporarily cured thermally conductive composition is placed is mounted on the second adherend (S103).
  • the temporarily cured thermal conductive composition is further cured (S104).
  • the thermally conductive composition is temporarily cured after being applied to the first adherend. This makes it possible to reduce the number of steps and the like.
  • temporary curing may be performed by ultraviolet curing, and curing may be performed by heat curing. Moreover, you may perform both temporary hardening and hardening by thermosetting. In addition, both temporary curing and curing may be performed by ultraviolet curing as long as the ultraviolet light can be sufficiently transmitted.
  • FIG. 4 is a flow chart showing the flow of the manufacturing method of the heat radiating member 1 according to the second embodiment.
  • a green sheet having a sheet shape and in a pre-cured state is produced from a liquid thermally conductive composition (S201). After that, the green sheet is placed on the first adherend (S202). After that, the first adherend on which the temporarily cured green sheet is arranged is mounted on the second adherend (S203). After that, the temporarily cured green sheet is further cured (S204).
  • the thermally conductive composition is prepared in advance as a temporarily cured green sheet and placed in an appropriate location.
  • the step of producing the green sheet (the thermally conductive composition in the temporarily cured state) and the step of placing the green sheet on the first adherend can be separated.
  • temporary curing may be performed by ultraviolet curing, and curing may be performed by heat curing. Moreover, you may perform both temporary hardening and hardening by thermosetting. In addition, both temporary curing and curing may be performed by ultraviolet curing as long as the ultraviolet light can be sufficiently transmitted.
  • FIG. 5 is a flow chart showing the flow of the manufacturing method of the heat radiating member 1 according to the third embodiment.
  • a liquid thermally conductive composition is extruded to produce an uncured block in which the anisotropic filler is oriented in the extrusion direction (S301).
  • the uncured block is made to have a non-dripping viscosity.
  • a green sheet having a sheet shape and in a pre-cured state is produced from the uncured block (S302). After that, the green sheet is placed on the first adherend (S303). After that, the first adherend on which the temporarily cured green sheet is arranged is mounted on the second adherend (S304). After that, the temporarily cured green sheet is further cured (S305).
  • the green sheet is made from an uncured block made by extrusion and having an anisotropic filler oriented in the direction of extrusion. Thereby, a green sheet can be produced efficiently.
  • temporary curing may be performed by ultraviolet curing, and curing may be performed by heat curing. Moreover, you may perform both temporary hardening and hardening by thermosetting. In addition, both temporary curing and curing may be performed by ultraviolet curing as long as the ultraviolet light can be sufficiently transmitted.
  • FIG. 6 is a flow chart showing the flow of the manufacturing method of the heat radiating member 1 according to the fourth embodiment.
  • a liquid thermally conductive composition is extruded to produce an uncured block in which the anisotropic filler is oriented in the extrusion direction (S401).
  • the surface of the uncured block is irradiated with ultraviolet rays (S402).
  • the uncured block is sliced so as to include the surface irradiated with ultraviolet rays, and a green sheet having a sheet shape and in a temporarily cured state is produced (S403).
  • the green sheet is placed on the first adherend (S404).
  • the first adherend on which the temporarily cured green sheet is arranged is mounted on the second adherend (S405).
  • the temporarily cured green sheet is further cured (S406).
  • the green sheet is produced by cutting out the surface portion of the uncured block that has been cured to some extent by UV irradiation. This facilitates the production of green sheets.
  • Table 1 shows the evaluation results regarding the presence or absence of the orientation process, adhesion (adhesiveness), thermal resistance, orientation, reliability, and cost of each sample manufactured as described above.
  • the thermal resistance each value is shown when the compressibility is changed to 10%, 30%, and 50% for thicknesses of 0.5 mm and 1.0 mm, respectively.
  • the compressibility is the ratio of the compression width to the thickness before compression when the heat conductive composition is compressed in the thickness direction.
  • the presence or absence of the orientation process indicates the presence or absence of the process of orienting the anisotropic filler in the thickness direction.
  • the first comparative example and the first example have an orientation process
  • the second comparative example and the third comparative example do not have an orientation process.
  • Adhesion was evaluated based on whether or not the sample cured after being in close contact. Orientation was evaluated based on the thermal resistance of the sheet. Thermal resistance was measured by a method based on ASTM 05470. Reliability was evaluated based on the pump-out phenomenon when a 30% compressed sample was sandwiched between Cu plates and an HS test was performed 1000 times at ⁇ 40° C. to 125° C. (retention time: 30 minutes). Cost was evaluated based on yield.
  • the result was good ( ⁇ ) because it was cured after mounting, and in the first comparative example, the result was bad ( ⁇ ) because it was mounted after curing. In addition, in the second comparative example, the result was poor because it did not cure.
  • the orientation was evaluated based on the thermal resistance of [first comparative example: oriented sheet]. As for the second and third comparative examples, the thermal resistance was much higher than that of the first comparative example, so the result of orientation was poor. In Example 1, the performance was equal to or higher than that of the sheet, so the result of orientation was good.
  • the results were good in the first example, the first comparative example, and the third comparative example because they were cured, and the second comparative example was uncured and the liquid protruded outside, so the result was poor. rice field.
  • the yield was poor because individual pieces were processed from a sheet, resulting in a poor result.
  • heat dissipation member 10... electronic component, 11A, 11B... thermal conductive sheet, 12... heat spreader, 13... heat sink

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Ce procédé de production d'un élément de dissipation de chaleur comprend : une étape au cours de laquelle une composition thermoconductrice, qui contient une matrice polymère et une charge anisotrope qui est anisotrope en matière de conductivité thermique, est disposée sur une première partie adhérée dans un état durci provisoirement dans lequel l'orientation de la charge anisotrope dans le sens de l'épaisseur de la composition thermoconductrice est maintenue ; une étape au cours de laquelle la première partie adhérée est montée sur une seconde partie adhérée ; et une étape au cours de laquelle la composition thermoconductrice dans l'état durci provisoirement est davantage durcie après le montage de la première partie adhérée sur la seconde partie adhérée.
PCT/JP2022/005789 2021-02-22 2022-02-15 Procédé de production d'un élément de dissipation de chaleur WO2022176822A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-025947 2021-02-22
JP2021025947A JP2022127772A (ja) 2021-02-22 2021-02-22 放熱部材の製造方法

Publications (1)

Publication Number Publication Date
WO2022176822A1 true WO2022176822A1 (fr) 2022-08-25

Family

ID=82931726

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/005789 WO2022176822A1 (fr) 2021-02-22 2022-02-15 Procédé de production d'un élément de dissipation de chaleur

Country Status (2)

Country Link
JP (1) JP2022127772A (fr)
WO (1) WO2022176822A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284859A (ja) * 2000-03-31 2001-10-12 Jsr Corp 熱伝導性シートおよびその用途
JP2020047622A (ja) * 2018-09-14 2020-03-26 アイシン精機株式会社 半導体装置及びその製造方法
WO2020105601A1 (fr) * 2018-11-20 2020-05-28 積水ポリマテック株式会社 Feuille thermoconductrice et procédé de fabrication d'une telle feuille thermoconductrice
JP2020116873A (ja) * 2019-01-25 2020-08-06 デクセリアルズ株式会社 熱伝導性シートの製造方法
JP2021022603A (ja) * 2019-07-25 2021-02-18 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP2021138141A (ja) * 2020-03-09 2021-09-16 デクセリアルズ株式会社 熱伝導材料及びその製造方法、放熱構造体及びその製造方法、並びに電子機器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284859A (ja) * 2000-03-31 2001-10-12 Jsr Corp 熱伝導性シートおよびその用途
JP2020047622A (ja) * 2018-09-14 2020-03-26 アイシン精機株式会社 半導体装置及びその製造方法
WO2020105601A1 (fr) * 2018-11-20 2020-05-28 積水ポリマテック株式会社 Feuille thermoconductrice et procédé de fabrication d'une telle feuille thermoconductrice
JP2020116873A (ja) * 2019-01-25 2020-08-06 デクセリアルズ株式会社 熱伝導性シートの製造方法
JP2021022603A (ja) * 2019-07-25 2021-02-18 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP2021138141A (ja) * 2020-03-09 2021-09-16 デクセリアルズ株式会社 熱伝導材料及びその製造方法、放熱構造体及びその製造方法、並びに電子機器

Also Published As

Publication number Publication date
JP2022127772A (ja) 2022-09-01

Similar Documents

Publication Publication Date Title
CN108463882B (zh) 导热片、导热片的制造方法、散热构件和半导体装置
JP6178389B2 (ja) 熱伝導シートの製造方法、熱伝導シート、及び半導体装置
JP6739478B2 (ja) 熱伝導性シートの製造方法
WO2020017350A1 (fr) Feuille thermoconductrice, son procédé de fabrication et procédé de montage de feuille thermoconductrice
JPWO2012070289A1 (ja) 熱伝導性シート及びパワーモジュール
WO2020153346A1 (fr) Procédé de production d'une feuille thermoconductrice
WO2020162164A1 (fr) Feuille thermoconductrice, procédé de montage de feuille thermoconductrice et procédé de production d'équipement électronique
JP2011178894A (ja) 熱硬化性樹脂組成物、熱伝導性シート及びパワーモジュール
JP6999019B2 (ja) 熱伝導性シート及びその製造方法、熱伝導性シートの実装方法
CN110739223A (zh) 导热性片的制造方法
WO2020153377A1 (fr) Feuille de résine thermoconductrice
WO2022176822A1 (fr) Procédé de production d'un élément de dissipation de chaleur
US20240120254A1 (en) Thermally-conductive sheet and electronic device
US20240141222A1 (en) Thermally conductive resin sheet
WO2022176823A1 (fr) Feuille thermo-conductrice
JP6862601B1 (ja) 熱伝導性シート及びその製造方法、熱伝導性シートの実装方法
WO2022176748A1 (fr) Feuille thermoconductrice et procédé de fabrication de feuille thermoconductrice
WO2021157477A1 (fr) Feuille thermoconductrice, procédé de fabrication d'une feuille thermoconductrice, composant de dissipation thermique et procédé de fabrication d'un composant de dissipation thermique
KR20210109563A (ko) 열전도성 시트, 열전도성 시트의 제조 방법
JP2021050350A (ja) 熱伝導性シート及びその製造方法、熱伝導性シートの実装方法
TW202309240A (zh) 熱傳導片材及熱傳導片材之製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22756140

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 22756140

Country of ref document: EP

Kind code of ref document: A1