WO2021039086A1 - Plaque métallique, composite métal-résine, dispositif semi-conducteur et procédé de production de plaque métallique - Google Patents

Plaque métallique, composite métal-résine, dispositif semi-conducteur et procédé de production de plaque métallique Download PDF

Info

Publication number
WO2021039086A1
WO2021039086A1 PCT/JP2020/025055 JP2020025055W WO2021039086A1 WO 2021039086 A1 WO2021039086 A1 WO 2021039086A1 JP 2020025055 W JP2020025055 W JP 2020025055W WO 2021039086 A1 WO2021039086 A1 WO 2021039086A1
Authority
WO
WIPO (PCT)
Prior art keywords
recess
metal plate
resin
recesses
metal
Prior art date
Application number
PCT/JP2020/025055
Other languages
English (en)
Japanese (ja)
Inventor
慎 青柳
俊紘 笹田
Original Assignee
Ｊｘ金属株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｊｘ金属株式会社 filed Critical Ｊｘ金属株式会社
Publication of WO2021039086A1 publication Critical patent/WO2021039086A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
    • B21D22/02—Stamping using rigid devices or tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D53/00—Making other particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

La présente plaque métallique 1 a une surface recouverte de résine recouverte d'un élément de résine, la plaque métallique 1 ayant au moins trois évidements 2 qui sont formés côte à côte sur la surface recouverte de résine de façon à s'enfoncer dans la surface recouverte de résine, au moins trois des évidements 2 alignés dans une direction de réseau d'évidements Da sont disposés à distance l'un de l'autre sur la surface recouverte de résine à de multiples types de pas P1, P2 de différentes distances.
PCT/JP2020/025055 2019-08-29 2020-06-25 Plaque métallique, composite métal-résine, dispositif semi-conducteur et procédé de production de plaque métallique WO2021039086A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019157393A JP2021034705A (ja) 2019-08-29 2019-08-29 金属板、金属樹脂複合体、半導体デバイス及び、金属板の製造方法
JP2019-157393 2019-08-29

Publications (1)

Publication Number Publication Date
WO2021039086A1 true WO2021039086A1 (fr) 2021-03-04

Family

ID=74677728

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2020/025055 WO2021039086A1 (fr) 2019-08-29 2020-06-25 Plaque métallique, composite métal-résine, dispositif semi-conducteur et procédé de production de plaque métallique

Country Status (3)

Country Link
JP (1) JP2021034705A (fr)
TW (1) TW202123410A (fr)
WO (1) WO2021039086A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023068096A1 (fr) * 2021-10-22 2023-04-27 富士電機株式会社 Module semi-conducteur et procédé de fabrication de module semi-conducteur

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7182675B1 (ja) * 2021-08-11 2022-12-02 Ｊｘ金属株式会社 金属樹脂複合体

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163750A (ja) * 1992-11-27 1994-06-10 Mitsubishi Electric Corp 半導体装置
JPH07161896A (ja) * 1993-12-02 1995-06-23 Hitachi Cable Ltd リードフレームとその製造方法
JP2007305916A (ja) * 2006-05-15 2007-11-22 Rohm Co Ltd リードフレームの製造方法および製造装置
JP2009260282A (ja) * 2008-03-18 2009-11-05 Panasonic Corp パッケージ用リードフレーム
JP2013157536A (ja) * 2012-01-31 2013-08-15 Shinko Electric Ind Co Ltd リードフレーム及びその製造方法と半導体装置及びその製造方法
JP2017005124A (ja) * 2015-06-11 2017-01-05 Ｓｈマテリアル株式会社 リードフレーム、リードフレームの製造方法、および半導体装置
JP2017208486A (ja) * 2016-05-19 2017-11-24 株式会社ミスズ工業 表面に凹凸を有する金属部材、ヒートスプレッダ、半導体パッケージ及びそれらの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163750A (ja) * 1992-11-27 1994-06-10 Mitsubishi Electric Corp 半導体装置
JPH07161896A (ja) * 1993-12-02 1995-06-23 Hitachi Cable Ltd リードフレームとその製造方法
JP2007305916A (ja) * 2006-05-15 2007-11-22 Rohm Co Ltd リードフレームの製造方法および製造装置
JP2009260282A (ja) * 2008-03-18 2009-11-05 Panasonic Corp パッケージ用リードフレーム
JP2013157536A (ja) * 2012-01-31 2013-08-15 Shinko Electric Ind Co Ltd リードフレーム及びその製造方法と半導体装置及びその製造方法
JP2017005124A (ja) * 2015-06-11 2017-01-05 Ｓｈマテリアル株式会社 リードフレーム、リードフレームの製造方法、および半導体装置
JP2017208486A (ja) * 2016-05-19 2017-11-24 株式会社ミスズ工業 表面に凹凸を有する金属部材、ヒートスプレッダ、半導体パッケージ及びそれらの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023068096A1 (fr) * 2021-10-22 2023-04-27 富士電機株式会社 Module semi-conducteur et procédé de fabrication de module semi-conducteur

Also Published As

Publication number Publication date
TW202123410A (zh) 2021-06-16
JP2021034705A (ja) 2021-03-01

Similar Documents

Publication Publication Date Title
WO2021039086A1 (fr) Plaque métallique, composite métal-résine, dispositif semi-conducteur et procédé de production de plaque métallique
US11152280B2 (en) Semiconductor device and method for manufacturing the same
CN106345928A (zh) 用于金属原料的表面粗化装置以及表面粗化方法
JP5669495B2 (ja) 樹脂封止金属部品、それに用いるリードフレーム、及び金属部品の製造方法
JPWO2011024812A1 (ja) 金属ガスケット及び金属ガスケット用金型の製造方法
US9003858B1 (en) Bending die having surface microstructures and bending punch thereof
KR101446406B1 (ko) 열교환용 플레이트의 원판재 및 열교환용 플레이트의 원판재의 제조 방법
JP2014004802A (ja) 金属部材を一体化した樹脂成形品とその製造法
CN107771005B (zh) 散热模块及其制造方法
US6195893B1 (en) Method of manufacture of heat exchange unit
JP2009260282A (ja) パッケージ用リードフレーム
CN103857204A (zh) 承载板及其制作方法
JP6147981B2 (ja) セラミック基板の製造方法
TWI567357B (zh) 熱管及基座固定結構
JP6536992B2 (ja) リードフレーム、樹脂付きリードフレーム及び光半導体装置、並びにそれらの製造方法
NL2030189B1 (en) A die pair for manufacturing a 3d-shaped plate by press forming, a die of the die pair and a press-forming method using the die pair
WO2023017656A1 (fr) Corps composite métal-résine
KR102325895B1 (ko) 유도 가열판 및 이러한 유도 가열판이 구비된 인덕션 가열 기기용 조리 용기
CN209981208U (zh) 一种防药水渗漏的半导体引线框架
JP7173298B2 (ja) セラミック基板の製造方法
JP2011199070A (ja) 保持治具
US20220402059A1 (en) Method for producing a solder deposit, and solder deposit
US20210199386A1 (en) Vapor chamber structure
TWI519230B (zh) 承載板之結構強化方法
JP5896720B2 (ja) 密閉鍛造成形品およびその製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20856104

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20856104

Country of ref document: EP

Kind code of ref document: A1