WO2021035907A1 - 含氟基聚酰亚胺及其制造方法、柔性衬底及显示装置 - Google Patents

含氟基聚酰亚胺及其制造方法、柔性衬底及显示装置 Download PDF

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WO2021035907A1
WO2021035907A1 PCT/CN2019/112159 CN2019112159W WO2021035907A1 WO 2021035907 A1 WO2021035907 A1 WO 2021035907A1 CN 2019112159 W CN2019112159 W CN 2019112159W WO 2021035907 A1 WO2021035907 A1 WO 2021035907A1
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fluorine
containing polyimide
structural formula
present
polyimide
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汪亚民
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED

Definitions

  • the present invention relates to a polyimide and its manufacturing method, substrate and display device, in particular to a fluorine-containing polyimide and its manufacturing method, flexible substrate and display device.
  • the substrate material of the existing flexible display panel mainly includes polyimide (PI).
  • PI polyimide
  • polyimide exhibits brown or yellow color, and therefore has poor light transmission properties in the visible light band.
  • the transmittance for visible light at about 500 nm is less than 40%, and the transmittance for visible light at about 400 nm is close to 0%. Therefore, the existing polyimide still needs improvement.
  • the present invention provides a fluorine-containing polyimide, a manufacturing method thereof, a flexible substrate, and a display device to solve the problem of poor light transmittance of the existing polyimide.
  • Another object of the present invention is to provide a flexible substrate, the material of which comprises the fluorine-containing polyimide described in any one of the embodiments of the present invention, so that the light transmittance of the flexible substrate is at most visible light wavelengths. Up to about 85%.
  • Another object of the present invention is to provide a display device including the flexible substrate according to any one of the embodiments of the present invention, so that the flexible substrate of the display device has sufficient light transmittance.
  • an embodiment of the present invention provides a fluorine-containing polyimide, wherein the structural formula of the fluorine-containing polyimide is CB-[A] n -BC, wherein the structural formula of A as follows:
  • C includes dianhydride residues.
  • an embodiment of the present invention provides a fluorine-containing polyimide, wherein the structural formula of the fluorine-containing polyimide is CB-[A] n -BC, wherein A includes Fluorodianhydride residues, B includes diamine residues, and C includes dianhydride residues.
  • another embodiment of the present invention provides a manufacturing method of fluorine-containing polyimide, characterized in that: the manufacturing method of fluorine-containing polyimide includes the steps of: providing fluorine-containing dianhydrides, two Amines and dianhydrides; mixing the fluorine-containing dianhydrides, the diamines, and the dianhydrides to form a semi-finished product; and performing a cross-linking and curing step on the semi-finished product to form a fluorine-containing -Based polyimide, the structural formula of the fluorine-containing polyimide is CB-[A] n -BC, where A includes fluorine-containing dianhydride residues, B includes diamine residues, and C includes dianhydride residues .
  • the fluorine-containing dianhydride includes 3,5-trifluoromethyl p-1,3-diether-diphthalic anhydride.
  • the diamines include 2,4-trifluoromethyl-p-aniline.
  • the dianhydrides include phthalic anhydride.
  • the structural formula of the fluorine-containing polyimide is as follows:
  • the cross-linking and curing step includes heating the semi-finished product at a temperature of 420 to 500° C. for 3 to 5 hours.
  • Another embodiment of the present invention provides a flexible substrate, the material of which comprises the fluorine-containing polyimide described in any one of the embodiments of the present invention.
  • Another embodiment of the present invention provides a display device including the flexible substrate according to any one of the embodiments of the present invention.
  • the fluorine-containing polyimide and its manufacturing method, flexible substrate and display device of the present invention mainly introduce fluorine-containing dianhydride residues into the new polymer molecular structure to improve light transmission. rate.
  • Fig. 1 is a thermogravimetric analysis diagram of a fluorine-containing polyimide in an embodiment of the present invention.
  • Fig. 2 is a flowchart of a method for manufacturing a fluorine-containing polyimide according to an embodiment of the present invention.
  • the embodiment of the present invention provides a fluorine-containing polyimide, the structural formula of the fluorine-containing polyimide is CB-[A] n -BC, wherein the group A includes a fluorine-containing dianhydride residue and a group B Includes diamine residues, and group C includes dianhydride residues.
  • the fluorine-containing polyimide of the embodiment of the present invention is provided with n repetitive arrangements of the groups A, where n may be, for example, between 30 and 50,000.
  • the group C is mainly used as a capping agent.
  • the group B is branched between the group A and the group C.
  • the group A may have a benzene ring structure.
  • the structural formula of the group A is as follows:
  • the group B may have a benzene ring structure.
  • the structural formula of the group B is as follows:
  • the group C may have a benzene ring structure.
  • the structural formula of the group C is as follows:
  • the structural formula of the fluorine-containing polyimide is as follows:
  • the fluorine-containing polyimide of the above formula (1) is analyzed by thermogravimetric analysis and light transmittance analysis. As shown in FIG. 1, the fluorine-containing polyimide of the embodiment of the present invention only loses 1% of its weight at high temperature (about 561°C). On the other hand, the light transmittance of the fluorine-containing polyimide of the embodiment of the present invention can reach about 85% at most wavelengths (for example, the range of visible light is about 390 to 780 nm), which far exceeds the commercial standard of 70. % Of eligibility criteria.
  • the fluorine-containing polyimide of the embodiment of the present invention can be used as a substrate material of a flexible display panel.
  • the method 20 for manufacturing a fluorine-containing polyimide according to an embodiment of the present invention includes steps 21 to 23: providing fluorine-containing dianhydrides, diamines, and dianhydrides (step 21); The fluorine-containing dianhydrides, the diamines, and the dianhydrides are formed to form a semi-finished product (step 22); and a cross-linking curing step is performed on the semi-finished product to form a fluorine-containing polyimide
  • the structural formula of the fluorine-containing polyimide is CB-[A] n -BC, where A includes fluorine-containing dianhydride residues, B includes diamine residues, and C includes dianhydride residues (step 23).
  • Step 21 of the manufacturing method 20 of the fluorine-containing polyimide of the embodiment of the present invention is: providing fluorine-containing dianhydrides, diamines, and dianhydrides.
  • this step 21 for example, 0.1 to 10 mmol of fluorine-containing dianhydrides, 0.1 to 10 mmol of diamines, and 0.1 to 5 mmol of dianhydrides are provided.
  • the fluorine-containing dianhydride may have a benzene ring structure.
  • the fluorine-containing dianhydride contains 3,5-trifluoromethyl-p-1,3-diether-diphthalic anhydride, and has the following structural formula:
  • the diamines may have a benzene ring structure.
  • the diamines may include 2,4-trifluoromethyl-p-aniline, and have the following structural formula:
  • the dianhydrides may have a benzene ring structure.
  • the dianhydrides may include phthalic anhydride, and have the following structural formula:
  • Step 22 of the manufacturing method 20 of the fluorine-containing polyimide of the embodiment of the present invention is: mixing the fluorine-containing dianhydrides, the diamines, and the dianhydrides to form a semi-finished product.
  • the semi-finished product can be formed in the following manner, for example.
  • fluorine-containing dianhydrides and diamines are added to a solvent to form a mixture.
  • the solvent contains N,N-dimethylacetamide (dimethylacetamide; DMAC) and N-methylpyrrolidone (N-methylpyrrolidone). -2-pyrrolidone; NMP).
  • dianhydrides are added to the mixture and uniformly mixed at room temperature for 24 to 96 hours to obtain the semi-finished product.
  • the volume ratio of DMAC to NMP is between 0.2 and 2.
  • the structural formula of the semi-finished product is as follows:
  • the semi-finished product may be subjected to a bubble removal step, for example, a vacuum filtration (filter) may be performed for about 1 hour to remove bubbles in the semi-finished product; or the semi-finished product may be allowed to stand at room temperature for about 2 hours. Up to 4 hours to remove air bubbles in the semi-finished product.
  • a bubble removal step for example, a vacuum filtration (filter) may be performed for about 1 hour to remove bubbles in the semi-finished product; or the semi-finished product may be allowed to stand at room temperature for about 2 hours. Up to 4 hours to remove air bubbles in the semi-finished product.
  • Step 23 of the manufacturing method 20 of the fluorine-containing polyimide of the embodiment of the present invention is: performing a cross-linking and curing step on the semi-finished product to form a fluorine-containing polyimide, and the fluorine-containing polyimide is
  • the structural formula of imine is CB-[A] n -BC, where group A includes a fluorine-containing dianhydride residue, group B includes a diamine residue, and group C includes a dianhydride residue.
  • the group A, group B, and group C in step 23 of the manufacturing method 20 of the fluorine-containing polyimide of the embodiment of the present invention can refer to the previously described embodiment of the present invention.
  • the group A, group B and group C in the fluorine-based polyimide will not be repeated here.
  • the cross-linking and curing step includes heating the semi-finished product at a temperature of 420 to 500° C. for 1 to 5 hours.
  • the cross-linking curing step may include at least one of hard baking and soft baking, for example.
  • the hard baking is directly heated to a specified temperature (for example, between 420 and 500°C) for 1 hour; the soft baking has multiple temperature platforms, such as heating to a first temperature platform (for example, 200 to 250°C). Between) for 20 to 30 minutes, and then heated to the second temperature platform (for example, between 300 to 350°C) for 20 to 30 minutes, and then reach the third temperature platform (for example, between 420 to 500°C) for 3 hour.
  • the above-mentioned temperature and time are only examples, and the cross-linking and curing step is not limited by the above-mentioned temperature and time.
  • the semi-finished product can be spin-coated on a substrate, for example.
  • a vacuum chamber dryer is used to dry the semi-finished product to remove the solvent of the semi-finished product.
  • step 23 can also be performed in a vacuum chamber dryer to remove the solvent of the semi-finished product and perform the cross-linking and curing step.
  • the method for manufacturing the fluorine-containing polyimide of the embodiment of the present invention can produce the fluorine-containing polyimide of the embodiment of the present invention.
  • the embodiment of the present invention also provides a flexible substrate.
  • the material of the flexible substrate includes the fluorine-containing polyimide according to any one of the embodiments of the present invention, so that the light transmittance of the flexible substrate is high. Some visible light wavelengths can reach about 85%.
  • An embodiment of the present invention also provides a display device, which includes the flexible substrate according to any one of the embodiments of the present invention, so that the flexible substrate of the display device has sufficient light transmittance.

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  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
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Abstract

一种含氟基聚酰亚胺及其制造方法、柔性衬底及显示装置。含氟基聚酰亚胺的结构式是C-B-[A] n-B-C，其中A包括含氟二酸酐残基、B包括二胺残基、及C包括二酸酐残基。含氟基聚酰亚胺的透光率在大部分的可见光波长可达约85％。

Description

含氟基聚酰亚胺及其制造方法、柔性衬底及显示装置 技术领域
本发明是有关于一种聚酰亚胺及其制造方法、衬底及显示装置，特别是有关于一种含氟基聚酰亚胺及其制造方法、柔性衬底及显示装置。
背景技术
现有柔性显示面板的衬底材料主要包含聚酰亚胺(polyimide；PI)。然而，聚酰亚胺呈现棕色或黄色，因此在可见光波段的透光性能差。例如，对于约500nm的可见光的透光率小于40％，对于约400nm的可见光的透光率接近0％。因此，现有的聚酰亚胺仍需要改进。
故，有必要提供一种含氟基聚酰亚胺及其制造方法、柔性衬底及显示装置，以解决现有技术所存在的问题。
技术问题
有鉴于此，本发明提供一种含氟基聚酰亚胺及其制造方法、柔性衬底及显示装置，以解决现有聚酰亚胺的透光性能差的问题。
技术解决方案
本发明的一目的在于提供一种含氟基聚酰亚胺，其透光率在大部分的可见光波长可达约85％。本发明的另一目的在于提供一种含氟基聚酰亚胺的制造方法，其通过提供特定化合物来进行特定反应，以形成上述的含氟基聚酰亚胺。
本发明的又一目的在于提供一种柔性衬底，其材质包含本发明实施例任一项所述的含氟基聚酰亚胺，以使柔性衬底的透光率在大部分的可见光波长可达约85％。
本发明的再一目的在于提供一种显示装置，其包含本发明实施例任一项所述的柔性衬底，以使所述显示装置的柔性衬底具备足够的透光率。
为达成本发明的前述目的，本发明一实施例提供一种含氟基聚酰亚胺，其中所述含氟基聚酰亚胺的结构式是C-B-[A] n-B-C，其中A的结构式如下：
Figure PCTCN2019112159-appb-000001
B的结构式如下：
Figure PCTCN2019112159-appb-000002
及
C包括二酸酐残基。
在本发明的一实施例中，C的结构式如下：
Figure PCTCN2019112159-appb-000003
为达成本发明的前述目的，本发明一实施例提供一种含氟基聚酰亚胺，其中所述含氟基聚酰亚胺的结构式是C-B-[A] n-B-C，其中A包括含氟二酸酐残基、B包括二胺残基、及C包括二酸酐残基。
在本发明的一实施例中，A的结构式如下：
Figure PCTCN2019112159-appb-000004
在本发明的一实施例中，B的结构式如下：
Figure PCTCN2019112159-appb-000005
在本发明的一实施例中，C的结构式如下：
Figure PCTCN2019112159-appb-000006
再者，本发明另一实施例提供一种含氟基聚酰亚胺的制造方法，其特征在于：所述含氟基聚酰亚胺的制造方法包含步骤：提供含氟二酸酐类、二胺类及二酸酐类；混合所述含氟二酸酐类、所述二胺类及所述二酸酐类，以形成一半成品；以及对所述半成品进行一交联固化步骤，以形成一含氟基聚酰亚胺，所述含氟基聚酰亚胺的结构式是C-B-[A] n-B-C，其中A包括含氟二酸酐残基、B包括二胺残基以及C包括二酸酐残基。
在本发明的一实施例中，所述含氟二酸酐类包含3,5-三氟甲基对1,3-二醚-二邻苯二甲酸酐。
在本发明的一实施例中，所述二胺类包含2,4-三氟甲基对苯胺。
在本发明的一实施例中，所述二酸酐类包含邻苯二甲酸酐。
在本发明的一实施例中，所述含氟基聚酰亚胺的结构式如下：
Figure PCTCN2019112159-appb-000007
在本发明的一实施例中，所述交联固化步骤包含以420至500℃的一温度加热所述半成品达3至5小时。
本发明另一实施例提供一种柔性衬底，其材料包含本发明实施例任一项所述的含氟基聚酰亚胺。
本发明另一实施例提供一种显示装置，包括如本发明实施例任一项所述的柔性衬底。
有益效果
与现有技术相比较，本发明的含氟基聚酰亚胺及其制造方法、柔性衬底及显示装置主要是通过导入含氟二酸酐残基至新的聚合分子结构中，以改善透光率。
为让本发明的上述内容能更明显易懂，下文特举优选实施例，并配合所附图式，作详细说明如下：
附图说明
图1是本发明实施例的含氟基聚酰亚胺的热重分析图。
图2是本发明实施例的含氟基聚酰亚胺的制造方法的流程图。
本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。再者，本发明所提到的方向用语，例如上、下、顶、底、前、后、左、右、内、外、侧面、周围、中央、水平、横向、垂直、纵向、轴向、径向、最上层或最下层等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
本发明实施例提出一种含氟聚酰亚胺，所述含氟基聚酰亚胺的结构式是C-B-[A] n-B-C，其中基团A包括含氟二酸酐残基、基团B包括二胺残基、及基团C包括二酸酐残基。本发明实施例的含氟聚酰亚胺具备n个重复排列的所述基团A，其中n例如可以是30至50000之间。
所述基团C主要是作为封端剂。所述基团B接支在所述基团A与所述基团C之间。
在一实施例中，所述基团A可具有苯环结构。在一范例中，所述基团A的结构式如下：
Figure PCTCN2019112159-appb-000008
在一实施例中，所述基团B可具有苯环结构。在一范例中，所述基团B的结构式如下：
Figure PCTCN2019112159-appb-000009
在一实施例中，所述基团C可具有苯环结构。在一范例中，所述基团C的结构式如下：
Figure PCTCN2019112159-appb-000010
在一实施例中，所述含氟基聚酰亚胺的结构式如下：
Figure PCTCN2019112159-appb-000011
这边要提到的是，对上述式(1)的含氟基聚酰亚胺进行分析热重分析与透光率分析。如图1所示，本发明实施例的含氟基聚酰亚胺在高温下(约561℃)仅失去1％的重量。另一方面，本发明实施例的含氟基聚酰亚胺的透光率在大部分的波长情况下(例如可见光的范围约为390至780nm)可达约85％，远超过商用标准的70％的合格标准。
在一实施例中，本发明实施例的含氟基聚酰亚胺可作为柔性显示面板的衬底材料的用途。请参照图2，本发明实施例的含氟基聚酰亚胺的制造方法20中，包含步骤21至23：提供含氟二酸酐类、二胺类及二酸酐类(步骤21)；混合所述含氟二酸酐类、所述二胺类及所述二酸酐类，以形成一半成品(步骤22)；及对所述半成品进行一交联固化步骤，以形成一含氟基聚酰亚胺，所述含氟基聚酰亚胺的结构式是C-B-[A] n-B-C，其中A包括含氟二酸酐残基、B包括二胺残基以及C包括二酸酐残基(步骤23)。
本发明实施例的含氟基聚酰亚胺的制造方法20的步骤21是：提供含氟二酸酐类、二胺类及二酸酐类。在本步骤21中，例如提供0.1至10mmol的含氟二酸酐类、0.1至10mmol的二胺类与0.1至5mmol的二酸酐类。
在一实施例中，所述含氟二酸酐类可具有苯环结构。在一范例中，所述含氟二酸酐类包含3,5-三氟甲基对1,3-二醚-二邻苯二甲酸酐，具有如下的结构式：
Figure PCTCN2019112159-appb-000012
在一实施例中，所述二胺类可具有苯环结构。在一范例中，所述二胺类可包含2,4-三氟甲基对苯胺，具有如下的结构式：
Figure PCTCN2019112159-appb-000013
在一实施例中，所述二酸酐类可具有苯环结构。在一范例中，所述二酸酐类可包含邻苯二甲酸酐，具有如下的结构式：
Figure PCTCN2019112159-appb-000014
本发明实施例的含氟基聚酰亚胺的制造方法20的步骤22是：混合所述含氟二酸酐类、所述二胺类及所述二酸酐类，以形成一半成品。在本步骤22中，所述半成品可例如通过下述方式形成。首先，将含氟二酸酐类与二胺类加入一溶剂中以形成一混合物，所述溶剂包含N,N-二甲基乙酰胺(dimethylacetamide；DMAC)与N-甲基吡咯酮(N-methyl-2-pyrrolidone；NMP)。之后，将二酸酐类加入所述混合物中并在室温下均匀混合达24至96小时，以得到所述半成品。在一范例中，DMAC与NMP的体积比为0.2至2之间。
在一实施例中，所述半成品的结构式如下所述：
Figure PCTCN2019112159-appb-000015
在一实施例中，可对所述半成品进行一气泡去除步骤，例如可在真空环境下进行抽滤(filter)达约1小时，以去除半成品中的气泡；或者可在室温下静置约2至4小时，以去除半成品中的气泡。
本发明实施例的含氟基聚酰亚胺的制造方法20的步骤23是：对所述半成品进行一交联固化步骤，以形成一含氟基聚酰亚胺，所述含氟基聚酰亚胺的结构式是C-B-[A] n-B-C，其中基团A包括含氟二酸酐残基、基团B包括二胺残基以及基团C包括二酸酐残基。在一实施例中，本发明实施例的含氟基聚酰亚胺的制造方法20的步骤23中的基团A、基团B与基团C可参考前面已介绍的本发明实施例的含氟基聚酰亚胺中的基团A、基团B与基团C，故不再赘述。
在一实施例中，所述交联固化步骤包含以420至500℃的一温度加热所述半成品达1至5小时。在一范例中，所述交联固化步骤例如可包含硬烘烤与软烘烤中的至少一种。例如，所述硬烘烤是直接升温到指定温度(例如420至500℃之间)进行1小时；所述软烘烤具有多个温 度平台，例如加热到第一温度平台(例如200至250℃之间)达20至30分，之后再加热到第二温度平台(例如300至350℃之间)达20至30分，然后才到达第三温度平台(例如420至500℃之间)达3小时。但要提到的是，上述的温度与时间仅为举例，所述交联固化步骤不以上述的温度及时间为限制。
在一实施例中，在步骤22之后及步骤23之前，可例如将所述半成品旋涂在一基材上。之后，以真空腔室干燥机(vacuum chamber dryer)对所述半成品进行干燥步骤，以去除所述半成品的溶剂。在一实施例中，步骤23亦可通过真空腔室干燥机中进行，以去除所述半成品的溶剂以及进行所述交联固化步骤。
在一实施例中，本发明实施例的含氟基聚酰亚胺的制造方法可制得本发明实施例的含氟基聚酰亚胺。
本发明实施例中还提供一种柔性衬底，所述柔性衬底的材料包含本发明实施例任一项所述的含氟基聚酰亚胺，以使柔性衬底的透光率在大部分的可见光波长可达约85％。
本发明实施例中还提供一种显示装置，所述显示装置中包括如本发明实施例任一项所述的柔性衬底，以使所述显示装置的柔性衬底具备足够的透光率。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反地，包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围内。

Claims (12)

  1. 一种含氟聚酰亚胺，所述含氟基聚酰亚胺的结构式是C-B-[A] n-B-C，其中A的结构式如下：
    Figure PCTCN2019112159-appb-100001
    B的结构式如下：
    Figure PCTCN2019112159-appb-100002
    及
    C包括二酸酐残基。
  2. 如权利要求1所述的含氟基聚酰亚胺，其中C的结构式如下：
    Figure PCTCN2019112159-appb-100003
  3. 一种含氟聚酰亚胺，所述含氟基聚酰亚胺的结构式是C-B-[A] n-B-C，其中A包括含氟二酸酐残基、B包括二胺残基、及C包括二酸酐残基。
  4. 如权利要求3所述的含氟基聚酰亚胺，其中A的结构式如下：
    Figure PCTCN2019112159-appb-100004
  5. 如权利要求3所述的含氟基聚酰亚胺，其中B的结构式如下：
    Figure PCTCN2019112159-appb-100005
  6. 如权利要求3所述的含氟基聚酰亚胺，其中C的结构式如下：
    Figure PCTCN2019112159-appb-100006
  7. 一种含氟基聚酰亚胺的制造方法，其包含步骤：
    提供含氟二酸酐类、二胺类及二酸酐类；
    混合所述含氟二酸酐类、所述二胺类及所述二酸酐类，以形成一半成品；以及
    对所述半成品进行一交联固化步骤，以形成一含氟基聚酰亚胺，所述含氟基聚酰亚胺的结构式是C-B-[A] n-B-C，其中A包括含氟二酸酐残基、B包括二胺残基以及C包括二酸 酐残基。
  8. 如权利要求7所述的含氟基聚酰亚胺的制造方法，其中所述含氟二酸酐类包含3,5-三氟甲基对1,3-二醚-二邻苯二甲酸酐、所述二胺类包含2,4-三氟甲基对苯胺、及所述二酸酐类包含邻苯二甲酸酐。
  9. 如权利要求7所述的含氟基聚酰亚胺的制造方法，其中所述含氟基聚酰亚胺的结构式如下：
    Figure PCTCN2019112159-appb-100007
  10. 如权利要求7所述的含氟基聚酰亚胺的制造方法，其中所述交联固化步骤包含以420至500℃的一温度加热所述半成品达3至5小时。
  11. 一种柔性衬底，所述柔性衬底的材料包含如权利要求3所述的含氟聚酰亚胺。
  12. 一种显示装置，其包括如权利要求11所述的柔性衬底。
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