WO2021033377A1 - 基板の位置合わせ方法 - Google Patents

基板の位置合わせ方法 Download PDF

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Publication number
WO2021033377A1
WO2021033377A1 PCT/JP2020/019236 JP2020019236W WO2021033377A1 WO 2021033377 A1 WO2021033377 A1 WO 2021033377A1 JP 2020019236 W JP2020019236 W JP 2020019236W WO 2021033377 A1 WO2021033377 A1 WO 2021033377A1
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WO
WIPO (PCT)
Prior art keywords
substrate
edge
position data
stage
optical
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Ceased
Application number
PCT/JP2020/019236
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English (en)
French (fr)
Japanese (ja)
Inventor
剛 古林
結城　徹
樹里 平田
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JEL Corp
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JEL Corp
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Filing date
Publication date
Application filed by JEL Corp filed Critical JEL Corp
Priority to US17/636,764 priority Critical patent/US12487082B2/en
Priority to CN202080058556.XA priority patent/CN114258474B/zh
Priority to KR1020227007495A priority patent/KR102717443B1/ko
Publication of WO2021033377A1 publication Critical patent/WO2021033377A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/028—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring lateral position of a boundary of the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Definitions

  • the present invention relates to a substrate alignment method. More specifically, the present invention relates to a substrate alignment method capable of accurately centering or accurately aligning a substrate having a warped peripheral edge.
  • the aligner device used in the alignment process of a semiconductor wafer (hereinafter referred to as a substrate)
  • the accurate center alignment of the substrate placed on the stage is performed. Is done.
  • angle adjustment is performed using reference marks such as orientation flats and notches and various marks attached to the surface of the substrate.
  • the aligner device disclosed in Patent Document 1 is equipped with a fixed focus camera and a half mirror that focus on a very narrow range in order to image the periphery of the substrate.
  • This aligner device images the edge of the substrate illuminated by illumination and the outside of the substrate, and detects a position where the brightness component in the captured image shows a remarkable rate of change as the position of the edge of the substrate.
  • the aligner device rotates the substrate, measures the position of the edge of the substrate at a predetermined angle, and uses the measurement result to align the center of the substrate and adjust the angle of the reference mark. ..
  • the angle ⁇ obtained by measurement and the distance r from the center of rotation of the substrate are used to align the center of the substrate and the angle of the reference mark.
  • the distance between the camera lens and the board differs depending on the state of warpage from the distance between the lens and the board in the case of a flat board without warpage.
  • the optical magnification at the time of imaging changes depending on the state of warpage.
  • there is a difference in the measured values of the edge positions and the calculation accuracy of the substrate center position and the substrate edge angle is lowered.
  • the aligner device described in Patent Document 1 provides a stage on which the substrate is placed to the extent that the rate of change in the luminance distribution clearly appears in the captured image when a substrate having a warp around the edge is handled. Raise and lower to correct the height of the board.
  • this aligner device corrects the height of the board and focuses the camera focus on the edge of the board, it only obtains the correction amount of the height of the board for four points when the board is rotated by 90 °. Is. Further, this aligner device only estimates the warp over the entire circumference of the substrate by curve fitting with a spline curve according to a predetermined algorithm.
  • an object of the present invention is to provide a substrate alignment method capable of solving the problems of the above-mentioned conventional techniques and accurately centering the substrate on which the peripheral edge is warped. It is in. Alternatively, it is an object of the present invention to provide a method for aligning a substrate capable of performing accurate angle alignment.
  • the substrate alignment method of the present invention uses optical means to measure the position of each edge portion of the substrate over the entire circumference of the substrate placed on the stage.
  • Steps to acquire secondary position data indicating the position of each edge part Using the primary position data and the secondary position data, a step of calculating the difference amount of the positions of the edges before and after the stage moves, and The ratio of the optical magnification of each part of the edge is calculated from each of the difference amount and the movement amount of the stage, and each of the edges of the primary position data is based on the calculated ratio of the optical magnification of each part of the edge.
  • the step of correcting the position of the part and acquiring the corrected position data It is characterized by including.
  • the position of each portion of the edge is preferably indicated by the position on the image sensor when the image pickup means provided with the image sensor images the substrate mounted on the stage.
  • the ratio of the optical magnification is the ratio of the optical magnification when the flat substrate without warp is imaged by the optical means to the optical magnification when the warped substrate is imaged by the optical means. Is preferable.
  • the optical power ratio changes according to the state of warpage generated in the substrate, and the reciprocal of the optical power ratio is multiplied by the coordinates indicating the positions of the edges of the primary position data. It is preferable to obtain the coordinates indicating the position of each portion of the edge of the correction position data.
  • accurate center alignment can be performed with respect to a substrate having a warp on the peripheral edge.
  • accurate angle adjustment can be performed.
  • the plan view which shows typically the aligner apparatus shown in FIG. FIG. 3 is a plan view of an eccentric substrate aligned by the substrate alignment method according to the embodiment.
  • the substrate at each rotation angle when the substrate is rotated once around the ⁇ axis is schematically shown, and the edge positions on the image sensor when the substrate is imaged by the image sensor are continuously schematically shown.
  • FIG. 6A is a developed view in which the amount of warpage is expanded in the circumferential direction in order to show the state of warpage generated at a predetermined position on the edge of the substrate shown in FIG. 6A.
  • a conceptual diagram of the optical system of the aligner device that captures the edge position of the warped substrate.
  • Results edge is warped upward, when the substrate distance is moved by a predetermined amount of the substrate in the Y direction is D U, conceptual view of an optical system provided aligner apparatus. Results edge is warped downward, when the substrate distance is moved by a predetermined amount of the substrate in the Y direction is D L, conceptual view of an optical system provided aligner apparatus.
  • the flowchart of the alignment process which concerns on embodiment of this invention.
  • the flowchart of the position data correction processing which concerns on embodiment of this invention.
  • a CG model diagram visually showing the state of warpage generated on the substrate in 3D.
  • FIG. 1 is a front view of the aligner device 10 that aligns the substrate W by the method of aligning the substrate W according to the embodiment of the present invention.
  • FIG. 2 is a plan view thereof. Note that FIG. 1 shows a part of the internal configuration in addition to the appearance of the aligner device 10 for easy understanding.
  • a drive device built in the device main body 13 (hereinafter, simply referred to as the main body 13) places the substrate W on the upper surface of the stage 11 protruding from the upper surface of the main body 13, and the stage 11 is the stage 11 thereof.
  • the substrate W is held by adsorbing the substrate W.
  • the aligner device 10 acquires the edge position information of the held substrate W, measures the center position of the substrate W and the position of a reference mark such as a notch formed on the edge of the substrate W, and adjusts the angle. ..
  • an arm of a substrate transfer robot conveys the substrate W to the aligner device 10, and the substrate W is placed on the circular stage 11 in a plan view.
  • the substrate W is placed so that its center substantially coincides with the rotation axis (that is, the ⁇ axis 12) of the stage 11, as shown by virtual lines in FIGS. 1 and 2.
  • the substrate W is attracted by a known vacuum chuck or the like (not shown) incorporated in the stage 11 and held on the stage 11.
  • the stage 11 slides horizontally in the X and Y directions shown in FIG. 2 by a drive device (not shown) incorporated in the main body 13, and further rotates in the forward and reverse directions by a rotation axis ( ⁇ axis 12). To do.
  • the stage 11 gives a predetermined translation and rotation to the substrate W that is attracted and held on the upper surface of the stage 11 by operating the drive device by a command from a control unit (not shown).
  • the aligner device 10 includes a camera 20 that images the edge of the substrate W in order to acquire edge position information of the substrate W on the stage 11, and an illumination 30 that secures the amount of light at the time of imaging. And have.
  • the camera 20 is housed in a box 21 which is provided upright from the main body 13 so as to secure a predetermined distance in order to image the edge of the substrate W held on the stage 11.
  • a fixed focus camera in which the focus of the lens 23 is fixed is used.
  • the lens 23 is located on the lower surface of the opened box 21. Further, the lens 23 has a focal length such that the upper surface of the substrate is located substantially in the center within the depth of field.
  • an image sensor 24 is arranged at the position of the image plane of the lens barrel accommodating the lens 23, and a predetermined work distance (WD) is set on the substrate side of the image sensor 24.
  • a CMOS (Complementary Metal Oxide Semiconductor) linear image sensor hereinafter, the CMOS linear image sensor is simply referred to as an image sensor
  • the image sensor 24 is used as the image sensor 24.
  • the camera 20 and the drive device described above can synchronize the imaging timing of the substrate W, the interval between the imaging timings, and the rotation amount of the substrate W at the time of imaging by a command from the control unit 25 in the box 21. .. Further, the imaging timing of the substrate W can be synchronized when the substrate W is rotated by a predetermined rotation amount by the stage 11. Further, the time interval of imaging can be set according to the amount of rotation of the substrate W.
  • the camera 20 is an example of an imaging means as defined in the present specification and claims.
  • the lens 23 is an example of optical means.
  • the illumination 30 is arranged between the lens 23 and the upper surface of the main body 13 and below the edge of the substrate W held by the stage 11.
  • the illumination 30 uses LED illumination that functions as a surface light source.
  • the camera 20 takes an image of the back surface (upper surface of the substrate) of the substrate W illuminated by the illumination 30 below, as shown in the enlarged view portion of FIG.
  • the image sensor is provided with a rod-shaped light receiving surface, an image is formed on the light receiving surface separated by a dark portion shaded by the substrate W and a bright portion illuminated by the incident light from the illumination 30.
  • edge position information of the substrate W which is basic information for aligning the center of the substrate W and aligning the angle of the reference mark, calculating the center position of the substrate W, and calculating the angle of the reference mark.
  • the procedure of FIG. 3 will be described with reference to FIGS. 3 to 5.
  • the procedure for calculating the center position using the edge position information of the substrate W will be described with reference to FIGS. 3 and 4.
  • the substrate W is temporarily mounted on the stage 11 of the aligner device 10 by using the arm of the substrate transfer robot, but at this time, the rotation axis ( ⁇ axis 12) of the stage 11 and the center position of the substrate W are slightly aligned. It may be eccentric.
  • FIG. 3 is a plan view of the eccentric substrate W aligned by the alignment method of the substrate W according to the embodiment.
  • the position information for acquiring the edge position information of the substrate W is schematically shown on the substrate W.
  • the center position (X W , Y W ) of the substrate W is deviated from the rotation center (X R , Y R ) of the substrate W, that is, the rotation axis ( ⁇ axis 12) of the stage 11. There is. As a result, the substrate W is in a state of being eccentric from the rotation axis ( ⁇ axis 12) by an eccentric amount (a, b).
  • the range of the notch n as the reference mark position (for example, before and after r n and ⁇ n) is determined. Accordingly, the reference mark position (r n, ⁇ n) to obtain the (step S12).
  • edge position except these reference mark position (r i, ⁇ i) calculate the substrate radius R from the edge position used in the calculation (r i, ⁇ i) and the substrate radius R calculated The amount of eccentricity (a, b) is obtained from. Then, the center positions (X W , Y W ) of the substrate W are finally calculated from the obtained eccentricity amounts (a, b) (step S13).
  • the angle calculation of the reference marks indicate the reference mark position (r n, ⁇ n) and the substrate center position (X W, Y W) and the angle theta nw can be calculated with (FIG. 5 shown in FIG. 3 Step S21).
  • FIG. 6A schematically shows the substrate W at each rotation angle when the substrate W is rotated once around the ⁇ axis 12, and is on the image sensor 24 when the substrate W is imaged by the image sensor 24. It is a development view which showed the edge position of a continuous schematic.
  • FIG. 6B is an enlarged development view of the edge position shown in FIG. 6A.
  • the edge position on the image sensor 24 draws a smooth curve as shown in FIG. 6B when the position of the substrate W with respect to the rotation angle around the ⁇ axis 12 is plotted. Since this curve is in a discontinuous state at the reference mark (notch) position, it is necessary to determine and exclude the reference mark position as described above when acquiring edge position information.
  • FIG. 7A is a plan view of the substrate W having a curved surface due to warpage.
  • FIG. 7B is a developed view of the edge position of the substrate W shown in FIG. 7A developed in the circumferential direction. Note that FIG. 7A shows the substrate W viewed in a plan view as well as the substrate W viewed in a side view for ease of understanding.
  • FIG. 7B the edge position of the warped substrate W shown in FIG. 7A smoothly changes from the reference position to the upper side or the lower side when the position without the warp is set as the reference position.
  • the warp of the substrate W is maximized upward at an angle of 90 ° and 270 °.
  • FIG. 6C is a developed view in which the amount of warpage is developed in the circumferential direction in order to show the state of warpage generated at a predetermined position on the edge of the substrate W shown in FIG. 6A.
  • FIG. 8 is a conceptual diagram of the optical system of the aligner device 10 that images the edge position of the warped substrate W.
  • FIG. 8 shows a flat plate-shaped substrate W without warping for the sake of explanation.
  • the substrate W warped downward is also shown in addition to the substrate W warped upward.
  • the substrates W in the three states are drawn in an overlapping manner.
  • the distance from the edge to the lens 23 (hereinafter referred to as the substrate side distance) D L or DU is the substrate side of the flat plate-shaped substrate W without the warp. It is different from the distance D 0. Since the aligner device 10 employs a fixed-focus optical system, if the substrate-side distances D L and DU are different from the substrate-side distance D 0 , as shown in FIG. 8, the image sensor starts from the center of the lens 23. The distance to the position where the edge of the substrate W of 24 is imaged (hereinafter, referred to as the sensor-side distance) is also different from the sensor-side distance of the flat plate-shaped substrate W without warpage.
  • the edge position of the image formed on the image sensor 24 changes depending on the presence or absence of the warp and the degree of the warp.
  • the optical magnification fluctuates.
  • the distance on the substrate side is not the center (that is, the principal point) in the thickness direction of the lens 23, but the distance from the surface of the lens 23 on the substrate side (object side) to the substrate W. ..
  • FIG. 6D is a developed view of the edge position on the image sensor 24 developed in the circumferential direction when the substrate W (see FIGS. 6A and 6C) having a warped portion is imaged by the image sensor 24.
  • the edge position of the substrate W having the warped portion is indicated by a broken line.
  • the position of the edge of the substrate W having the warped portion is deviated from the position of the edge of the substrate W having no warp.
  • the edge of the substrate W having the warped portion is projected on the image sensor 24 at a position different from the edge of the substrate W having no warp.
  • FIG. 9 is a conceptual diagram showing a change in optical magnification due to a warp generated in the substrate W.
  • the scale is displayed to show the change in the optical magnification.
  • the optical magnification is larger than that of the flat plate-shaped substrate W. Further, in the case of the substrate W which is curved downward and has an edge on the lower side, the optical magnification is smaller than that of the flat plate-shaped substrate W. Therefore, if the optical magnification of the optical system is constant when acquiring the position information of the edge of the warped substrate W, the accuracy of the acquired position information is obviously lowered.
  • the resolution Re is defined as a premise for removing the influence of the warp of the substrate W. That is, the amount of movement of the end of the subject from the reference distance between the lens 23 and the subject (hereinafter referred to as the reference distance) is projected onto the image pickup surface (that is, the light receiving surface described above) on the image sensor 24.
  • the ratio with the amount of movement of the edge of the subject is defined as the resolution Re.
  • the amount of movement of the subject end on the imaging surface of the image sensor 24 when the distance between the lens 23 and the subject end (subject side distance) is unknown and the subject end moves by ⁇ i (mm).
  • Figure 10A is a result of the edge is warped upward, when the substrate side distance moves the substrate W is D U in the Y direction by a predetermined amount [Delta] Y
  • Figure 10B is a result of the edge is warped downward, when the substrate side distance moves the substrate W is D L in the Y direction by a predetermined amount [Delta] Y
  • Figure 10A and FIG. 10B in order to facilitate understanding, an optical system when the flat plate-shaped substrate W is moved in the Y direction by a predetermined amount ⁇ Y is also shown.
  • the movement amount ⁇ U on the imaging surface of the image sensor 24 is larger than the movement amount ⁇ 0 in the case of the flat plate-shaped substrate W.
  • the movement amount ⁇ L on the imaging surface of the image sensor 24 is smaller than the movement amount ⁇ 0 in the case of the flat plate-shaped substrate W. ..
  • the optical magnification when the reference distance D 0 the distance from the reference distance D 0 predetermined distance D U (or distance D L)
  • the reciprocal (1 / R) can be multiplied by the position data before the movement to correct the position data before the movement and convert it into the position data in a state without warpage.
  • FIG. 11 is a flowchart of alignment processing
  • FIG. 12 is a flowchart of position data correction processing.
  • the position data is corrected over the entire circumference of the substrate W having a warp on the peripheral edge by utilizing the relationship of the ratio R of the optical magnification described above.
  • the position data after correction is used to calculate the center position of the substrate and the angle of the reference mark.
  • the warped substrate W is placed on the stage 11 of the aligner device 10 and held by the stage 11. Subsequently, by rotating the rotation axis ( ⁇ axis 12) of the stage 11, the substrate W is rotated around the rotation axis ( ⁇ axis 12), and during the rotation of the substrate W, the edge of the substrate W is rotated by the camera 20. To image. Then, in each of the captured images, the coordinates in the image of the edge image portion in which the edge of the substrate W is captured are measured. Thus, as shown in FIG. 11, and acquires the entire circumference over a primary edge position of the substrate W (r i, ⁇ i) ( step S31). Then, the acquired position data (primary position data) is saved in the storage unit.
  • step S31 the substrate W is rotated around the rotation axis ( ⁇ axis 12) of the stage 11 after movement, and the edge of the rotating substrate W is imaged by the camera 20. Then, the in-image coordinates of the edge image portion are measured for each of the captured images. As a result, the secondary edge positions (r j , ⁇ j ) are acquired over the entire circumference of the substrate W (step S33).
  • the position data (secondary position data) is stored in the storage unit.
  • position data correction is performed based on the primary position data and the secondary position data (step S34).
  • the ratio of the optical magnification at each position is calculated (step S342).
  • the primary position data is corrected to the data in a state without warpage (step S343).
  • Equation 3 shown below corrects each primary edge positions of the primary position data (r i, ⁇ i).
  • correction position data indicating the edge position in a state without warpage is obtained.
  • the data is updated.
  • the correction edge position of the formula 3 is the correction position data shown in FIG.
  • the primary edge position is the primary position data shown in FIG. With the above, the correction of the position data is completed.
  • Corrected edge position (primary edge position x 1 / R) ... (Equation 3)
  • the process returns to the alignment process shown in FIG. Subsequently, the substrate center position is calculated using the corrected position data (step S35). Next, the angle of the reference mark is calculated (step S36). After that, the position of the substrate W is corrected by rotating and sliding the substrate W (step S37). The alignment process is completed by the above steps. By this alignment processing, it is possible to accurately align the center of the substrate W and the angle of the reference mark with respect to the warped substrate W by removing the influence of the warp.
  • the edge of the substrate W is shown as a point cloud, and the amount of warpage is drawn in a 3D format to obtain the direction of warpage (occurrence). Location), the amount of warpage can be easily confirmed visually.
  • a point cloud A displaying the reference height of the edge of the substrate W without warpage and a point cloud group B displaying the edge height of the substrate W with warp are drawn together. For example, when a specified value is set for the warp amount of the substrate W as a product, in the inspection of whether or not the warp amount satisfies the specified value, the drawing color of the point cloud in the range exceeding the specified value is set.
  • the substrate is circular in a plan view, but in the present invention, the plan view shape of the substrate is arbitrary. For example, it may have a shape other than a circular shape in a plan view, such as a rectangle in a plan view.
  • the image sensor includes a rod-shaped light receiving surface, but the shape of the light receiving surface of the image sensor is also arbitrary. The light receiving surface may be rectangular.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
PCT/JP2020/019236 2019-08-22 2020-05-14 基板の位置合わせ方法 Ceased WO2021033377A1 (ja)

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US17/636,764 US12487082B2 (en) 2019-08-22 2020-05-14 Method for positioning substrate
CN202080058556.XA CN114258474B (zh) 2019-08-22 2020-05-14 基板的位置对准方法
KR1020227007495A KR102717443B1 (ko) 2019-08-22 2020-05-14 기판의 위치 맞춤 방법

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WO2025084133A1 (ja) * 2023-10-17 2025-04-24 シンフォニアテクノロジー株式会社 アライナ及び基板処理システム
WO2025126960A1 (ja) * 2023-12-11 2025-06-19 株式会社東京精密 形状測定装置及び形状測定方法並びにウェーハ加工システム

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WO2025085391A1 (en) * 2023-10-18 2025-04-24 Gpd Optoelectronics Corp. Optical detector system having a ring photodetector and an annular beam lens design
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