JP7344047B2 - 基板の位置合わせ方法 - Google Patents

基板の位置合わせ方法 Download PDF

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Publication number
JP7344047B2
JP7344047B2 JP2019152239A JP2019152239A JP7344047B2 JP 7344047 B2 JP7344047 B2 JP 7344047B2 JP 2019152239 A JP2019152239 A JP 2019152239A JP 2019152239 A JP2019152239 A JP 2019152239A JP 7344047 B2 JP7344047 B2 JP 7344047B2
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JP
Japan
Prior art keywords
substrate
edge
position data
edge position
optical magnification
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JP2019152239A
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English (en)
Japanese (ja)
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JP2021032662A (ja
JP2021032662A5 (https=
Inventor
剛 古林
徹 結城
樹里 平田
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JEL Corp
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JEL Corp
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Publication date
Priority to JP2019152239A priority Critical patent/JP7344047B2/ja
Application filed by JEL Corp filed Critical JEL Corp
Priority to KR1020227007495A priority patent/KR102717443B1/ko
Priority to US17/636,764 priority patent/US12487082B2/en
Priority to CN202080058556.XA priority patent/CN114258474B/zh
Priority to PCT/JP2020/019236 priority patent/WO2021033377A1/ja
Priority to TW109117818A priority patent/TWI758737B/zh
Publication of JP2021032662A publication Critical patent/JP2021032662A/ja
Publication of JP2021032662A5 publication Critical patent/JP2021032662A5/ja
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Publication of JP7344047B2 publication Critical patent/JP7344047B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/028—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring lateral position of a boundary of the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2019152239A 2019-08-22 2019-08-22 基板の位置合わせ方法 Active JP7344047B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2019152239A JP7344047B2 (ja) 2019-08-22 2019-08-22 基板の位置合わせ方法
US17/636,764 US12487082B2 (en) 2019-08-22 2020-05-14 Method for positioning substrate
CN202080058556.XA CN114258474B (zh) 2019-08-22 2020-05-14 基板的位置对准方法
PCT/JP2020/019236 WO2021033377A1 (ja) 2019-08-22 2020-05-14 基板の位置合わせ方法
KR1020227007495A KR102717443B1 (ko) 2019-08-22 2020-05-14 기판의 위치 맞춤 방법
TW109117818A TWI758737B (zh) 2019-08-22 2020-05-28 基板之對準方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019152239A JP7344047B2 (ja) 2019-08-22 2019-08-22 基板の位置合わせ方法

Publications (3)

Publication Number Publication Date
JP2021032662A JP2021032662A (ja) 2021-03-01
JP2021032662A5 JP2021032662A5 (https=) 2022-08-16
JP7344047B2 true JP7344047B2 (ja) 2023-09-13

Family

ID=74661037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019152239A Active JP7344047B2 (ja) 2019-08-22 2019-08-22 基板の位置合わせ方法

Country Status (6)

Country Link
US (1) US12487082B2 (https=)
JP (1) JP7344047B2 (https=)
KR (1) KR102717443B1 (https=)
CN (1) CN114258474B (https=)
TW (1) TWI758737B (https=)
WO (1) WO2021033377A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025084133A1 (ja) * 2023-10-17 2025-04-24 シンフォニアテクノロジー株式会社 アライナ及び基板処理システム
WO2025085391A1 (en) * 2023-10-18 2025-04-24 Gpd Optoelectronics Corp. Optical detector system having a ring photodetector and an annular beam lens design
WO2025126960A1 (ja) * 2023-12-11 2025-06-19 株式会社東京精密 形状測定装置及び形状測定方法並びにウェーハ加工システム
CN121035033B (zh) * 2025-08-27 2026-03-17 合肥致真精密设备有限公司 一种晶圆校准方法、装置、设备及存储介质

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003185419A (ja) 2001-12-20 2003-07-03 Sumitomo Metal Ind Ltd 反り形状計測方法及び装置
JP2008196855A (ja) 2007-02-08 2008-08-28 Yamatake Corp ウェハの位置決め方法および位置決め装置
JP2008203182A (ja) 2007-02-22 2008-09-04 Yamatake Corp エッジ検出装置
US20170329241A1 (en) 2016-05-11 2017-11-16 Semiconductor Manufacturing International (Shanghai) Corporation Alignment method and alignment system thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3634487B2 (ja) 1996-02-09 2005-03-30 キヤノン株式会社 位置合せ方法、位置合せ装置、および露光装置
JP4615114B2 (ja) 2000-11-13 2011-01-19 株式会社ダイヘン ウェハアライナ装置
US20070258085A1 (en) * 2006-05-02 2007-11-08 Robbins Michael D Substrate illumination and inspection system
US20060192949A1 (en) * 2004-12-19 2006-08-31 Bills Richard E System and method for inspecting a workpiece surface by analyzing scattered light in a back quartersphere region above the workpiece
JP4309874B2 (ja) * 2005-08-05 2009-08-05 株式会社ブイ・テクノロジー 露光装置
CN101021489A (zh) * 2006-02-15 2007-08-22 奥林巴斯株式会社 外观检查装置
US7508504B2 (en) * 2006-05-02 2009-03-24 Accretech Usa, Inc. Automatic wafer edge inspection and review system
JP4787185B2 (ja) * 2007-02-21 2011-10-05 株式会社トプコン ウエハ表面検査方法及びその装置
WO2012029142A1 (ja) 2010-09-01 2012-03-08 三菱電機株式会社 レーザ加工装置および基板位置検出方法
KR102073802B1 (ko) * 2012-04-25 2020-02-05 어플라이드 머티어리얼스, 인코포레이티드 웨이퍼 에지 측정 및 제어
JP6394220B2 (ja) 2014-09-17 2018-09-26 東京エレクトロン株式会社 アライメント装置及び基板処理装置
US10056224B2 (en) * 2015-08-10 2018-08-21 Kla-Tencor Corporation Method and system for edge-of-wafer inspection and review
NL2017860B1 (en) * 2015-12-07 2017-07-27 Ultratech Inc Systems and methods of characterizing process-induced wafer shape for process control using cgs interferometry
TWI706487B (zh) * 2016-03-28 2020-10-01 日商東京精密股份有限公司 探針機台及探針機台的操作方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003185419A (ja) 2001-12-20 2003-07-03 Sumitomo Metal Ind Ltd 反り形状計測方法及び装置
JP2008196855A (ja) 2007-02-08 2008-08-28 Yamatake Corp ウェハの位置決め方法および位置決め装置
JP2008203182A (ja) 2007-02-22 2008-09-04 Yamatake Corp エッジ検出装置
US20170329241A1 (en) 2016-05-11 2017-11-16 Semiconductor Manufacturing International (Shanghai) Corporation Alignment method and alignment system thereof

Also Published As

Publication number Publication date
WO2021033377A1 (ja) 2021-02-25
JP2021032662A (ja) 2021-03-01
CN114258474B (zh) 2024-08-09
US12487082B2 (en) 2025-12-02
KR20220073733A (ko) 2022-06-03
TW202109724A (zh) 2021-03-01
US20220299317A1 (en) 2022-09-22
KR102717443B1 (ko) 2024-10-15
CN114258474A (zh) 2022-03-29
TWI758737B (zh) 2022-03-21

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