CN114258474B - 基板的位置对准方法 - Google Patents

基板的位置对准方法 Download PDF

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Publication number
CN114258474B
CN114258474B CN202080058556.XA CN202080058556A CN114258474B CN 114258474 B CN114258474 B CN 114258474B CN 202080058556 A CN202080058556 A CN 202080058556A CN 114258474 B CN114258474 B CN 114258474B
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China
Prior art keywords
substrate
edge
stage
position data
warpage
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CN202080058556.XA
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English (en)
Chinese (zh)
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CN114258474A (zh
Inventor
古林刚
结城彻
平田树里
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JEL Corp
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JEL Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/028—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring lateral position of a boundary of the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
CN202080058556.XA 2019-08-22 2020-05-14 基板的位置对准方法 Active CN114258474B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019152239A JP7344047B2 (ja) 2019-08-22 2019-08-22 基板の位置合わせ方法
JP2019-152239 2019-08-22
PCT/JP2020/019236 WO2021033377A1 (ja) 2019-08-22 2020-05-14 基板の位置合わせ方法

Publications (2)

Publication Number Publication Date
CN114258474A CN114258474A (zh) 2022-03-29
CN114258474B true CN114258474B (zh) 2024-08-09

Family

ID=74661037

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080058556.XA Active CN114258474B (zh) 2019-08-22 2020-05-14 基板的位置对准方法

Country Status (6)

Country Link
US (1) US12487082B2 (https=)
JP (1) JP7344047B2 (https=)
KR (1) KR102717443B1 (https=)
CN (1) CN114258474B (https=)
TW (1) TWI758737B (https=)
WO (1) WO2021033377A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025084133A1 (ja) * 2023-10-17 2025-04-24 シンフォニアテクノロジー株式会社 アライナ及び基板処理システム
WO2025085391A1 (en) * 2023-10-18 2025-04-24 Gpd Optoelectronics Corp. Optical detector system having a ring photodetector and an annular beam lens design
WO2025126960A1 (ja) * 2023-12-11 2025-06-19 株式会社東京精密 形状測定装置及び形状測定方法並びにウェーハ加工システム
CN121035033B (zh) * 2025-08-27 2026-03-17 合肥致真精密设备有限公司 一种晶圆校准方法、装置、设备及存储介质

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008196855A (ja) * 2007-02-08 2008-08-28 Yamatake Corp ウェハの位置決め方法および位置決め装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3634487B2 (ja) 1996-02-09 2005-03-30 キヤノン株式会社 位置合せ方法、位置合せ装置、および露光装置
JP4615114B2 (ja) 2000-11-13 2011-01-19 株式会社ダイヘン ウェハアライナ装置
JP3724720B2 (ja) * 2001-12-20 2005-12-07 住友金属工業株式会社 反り形状計測方法及び装置
US20070258085A1 (en) * 2006-05-02 2007-11-08 Robbins Michael D Substrate illumination and inspection system
US20060192949A1 (en) * 2004-12-19 2006-08-31 Bills Richard E System and method for inspecting a workpiece surface by analyzing scattered light in a back quartersphere region above the workpiece
JP4309874B2 (ja) * 2005-08-05 2009-08-05 株式会社ブイ・テクノロジー 露光装置
CN101021489A (zh) * 2006-02-15 2007-08-22 奥林巴斯株式会社 外观检查装置
US7508504B2 (en) * 2006-05-02 2009-03-24 Accretech Usa, Inc. Automatic wafer edge inspection and review system
JP4787185B2 (ja) * 2007-02-21 2011-10-05 株式会社トプコン ウエハ表面検査方法及びその装置
JP2008203182A (ja) * 2007-02-22 2008-09-04 Yamatake Corp エッジ検出装置
WO2012029142A1 (ja) 2010-09-01 2012-03-08 三菱電機株式会社 レーザ加工装置および基板位置検出方法
KR102073802B1 (ko) * 2012-04-25 2020-02-05 어플라이드 머티어리얼스, 인코포레이티드 웨이퍼 에지 측정 및 제어
JP6394220B2 (ja) 2014-09-17 2018-09-26 東京エレクトロン株式会社 アライメント装置及び基板処理装置
US10056224B2 (en) * 2015-08-10 2018-08-21 Kla-Tencor Corporation Method and system for edge-of-wafer inspection and review
NL2017860B1 (en) * 2015-12-07 2017-07-27 Ultratech Inc Systems and methods of characterizing process-induced wafer shape for process control using cgs interferometry
TWI706487B (zh) * 2016-03-28 2020-10-01 日商東京精密股份有限公司 探針機台及探針機台的操作方法
CN107367911B (zh) * 2016-05-11 2019-02-15 中芯国际集成电路制造(上海)有限公司 对准方法及对准系统

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008196855A (ja) * 2007-02-08 2008-08-28 Yamatake Corp ウェハの位置決め方法および位置決め装置

Also Published As

Publication number Publication date
WO2021033377A1 (ja) 2021-02-25
JP2021032662A (ja) 2021-03-01
US12487082B2 (en) 2025-12-02
KR20220073733A (ko) 2022-06-03
TW202109724A (zh) 2021-03-01
JP7344047B2 (ja) 2023-09-13
US20220299317A1 (en) 2022-09-22
KR102717443B1 (ko) 2024-10-15
CN114258474A (zh) 2022-03-29
TWI758737B (zh) 2022-03-21

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