KR102717443B1 - 기판의 위치 맞춤 방법 - Google Patents

기판의 위치 맞춤 방법 Download PDF

Info

Publication number
KR102717443B1
KR102717443B1 KR1020227007495A KR20227007495A KR102717443B1 KR 102717443 B1 KR102717443 B1 KR 102717443B1 KR 1020227007495 A KR1020227007495 A KR 1020227007495A KR 20227007495 A KR20227007495 A KR 20227007495A KR 102717443 B1 KR102717443 B1 KR 102717443B1
Authority
KR
South Korea
Prior art keywords
substrate
edge
stage
position data
edge portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020227007495A
Other languages
English (en)
Korean (ko)
Other versions
KR20220073733A (ko
Inventor
즈요시 고바야시
도루 유키
기사토 히라타
Original Assignee
가부시키가이샤 제이이엘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 제이이엘 filed Critical 가부시키가이샤 제이이엘
Publication of KR20220073733A publication Critical patent/KR20220073733A/ko
Application granted granted Critical
Publication of KR102717443B1 publication Critical patent/KR102717443B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/028—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring lateral position of a boundary of the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • H01L21/67259—
    • H01L21/681—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020227007495A 2019-08-22 2020-05-14 기판의 위치 맞춤 방법 Active KR102717443B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019152239A JP7344047B2 (ja) 2019-08-22 2019-08-22 基板の位置合わせ方法
JPJP-P-2019-152239 2019-08-22
PCT/JP2020/019236 WO2021033377A1 (ja) 2019-08-22 2020-05-14 基板の位置合わせ方法

Publications (2)

Publication Number Publication Date
KR20220073733A KR20220073733A (ko) 2022-06-03
KR102717443B1 true KR102717443B1 (ko) 2024-10-15

Family

ID=74661037

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227007495A Active KR102717443B1 (ko) 2019-08-22 2020-05-14 기판의 위치 맞춤 방법

Country Status (6)

Country Link
US (1) US12487082B2 (https=)
JP (1) JP7344047B2 (https=)
KR (1) KR102717443B1 (https=)
CN (1) CN114258474B (https=)
TW (1) TWI758737B (https=)
WO (1) WO2021033377A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025084133A1 (ja) * 2023-10-17 2025-04-24 シンフォニアテクノロジー株式会社 アライナ及び基板処理システム
WO2025085391A1 (en) * 2023-10-18 2025-04-24 Gpd Optoelectronics Corp. Optical detector system having a ring photodetector and an annular beam lens design
WO2025126960A1 (ja) * 2023-12-11 2025-06-19 株式会社東京精密 形状測定装置及び形状測定方法並びにウェーハ加工システム
CN121035033B (zh) * 2025-08-27 2026-03-17 合肥致真精密设备有限公司 一种晶圆校准方法、装置、设备及存储介质

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151575A (ja) * 2000-11-13 2002-05-24 Daihen Corp ウェハアライナ装置
JP2008196855A (ja) * 2007-02-08 2008-08-28 Yamatake Corp ウェハの位置決め方法および位置決め装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3634487B2 (ja) 1996-02-09 2005-03-30 キヤノン株式会社 位置合せ方法、位置合せ装置、および露光装置
JP3724720B2 (ja) * 2001-12-20 2005-12-07 住友金属工業株式会社 反り形状計測方法及び装置
US20070258085A1 (en) * 2006-05-02 2007-11-08 Robbins Michael D Substrate illumination and inspection system
US20060192949A1 (en) * 2004-12-19 2006-08-31 Bills Richard E System and method for inspecting a workpiece surface by analyzing scattered light in a back quartersphere region above the workpiece
JP4309874B2 (ja) * 2005-08-05 2009-08-05 株式会社ブイ・テクノロジー 露光装置
CN101021489A (zh) * 2006-02-15 2007-08-22 奥林巴斯株式会社 外观检查装置
US7508504B2 (en) * 2006-05-02 2009-03-24 Accretech Usa, Inc. Automatic wafer edge inspection and review system
JP4787185B2 (ja) * 2007-02-21 2011-10-05 株式会社トプコン ウエハ表面検査方法及びその装置
JP2008203182A (ja) * 2007-02-22 2008-09-04 Yamatake Corp エッジ検出装置
WO2012029142A1 (ja) 2010-09-01 2012-03-08 三菱電機株式会社 レーザ加工装置および基板位置検出方法
KR102073802B1 (ko) * 2012-04-25 2020-02-05 어플라이드 머티어리얼스, 인코포레이티드 웨이퍼 에지 측정 및 제어
JP6394220B2 (ja) 2014-09-17 2018-09-26 東京エレクトロン株式会社 アライメント装置及び基板処理装置
US10056224B2 (en) * 2015-08-10 2018-08-21 Kla-Tencor Corporation Method and system for edge-of-wafer inspection and review
NL2017860B1 (en) * 2015-12-07 2017-07-27 Ultratech Inc Systems and methods of characterizing process-induced wafer shape for process control using cgs interferometry
TWI706487B (zh) * 2016-03-28 2020-10-01 日商東京精密股份有限公司 探針機台及探針機台的操作方法
CN107367911B (zh) * 2016-05-11 2019-02-15 中芯国际集成电路制造(上海)有限公司 对准方法及对准系统

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151575A (ja) * 2000-11-13 2002-05-24 Daihen Corp ウェハアライナ装置
JP2008196855A (ja) * 2007-02-08 2008-08-28 Yamatake Corp ウェハの位置決め方法および位置決め装置

Also Published As

Publication number Publication date
WO2021033377A1 (ja) 2021-02-25
JP2021032662A (ja) 2021-03-01
CN114258474B (zh) 2024-08-09
US12487082B2 (en) 2025-12-02
KR20220073733A (ko) 2022-06-03
TW202109724A (zh) 2021-03-01
JP7344047B2 (ja) 2023-09-13
US20220299317A1 (en) 2022-09-22
CN114258474A (zh) 2022-03-29
TWI758737B (zh) 2022-03-21

Similar Documents

Publication Publication Date Title
KR102717443B1 (ko) 기판의 위치 맞춤 방법
CN105345254B (zh) 旁轴式视觉系统与激光振镜加工系统位置关系的标定方法
US8934721B2 (en) Microscopic vision measurement method based on adaptive positioning of camera coordinate frame
CN114714356A (zh) 基于双目视觉的工业机器人手眼标定误差精确检测方法
CN107025670A (zh) 一种远心相机标定方法
US11189012B2 (en) Arrangement having a coordinate measuring machine or microscope
CN106990776B (zh) 机器人归航定位方法与系统
CN103399015A (zh) 病理切片扫描仪及其载片平台定位精度测量方法及装置
CN115761011B (zh) 一种线激光3d相机系统全自动标定方法及装置
US8810799B2 (en) Height-measuring method and height-measuring device
CN110044262B (zh) 基于图像超分辨率重建的非接触式精密测量仪及测量方法
CN204902785U (zh) 具备快速标定功能的手持式激光三维扫描系统
CN113269762A (zh) 屏幕不良检测方法、系统及计算机存储介质
CN103389072B (zh) 一种基于直线拟合的像点定位精度评估方法
WO2018076529A1 (zh) 场景深度计算方法、装置及终端
CN110044266B (zh) 基于散斑投影的摄影测量系统
JP2014035261A (ja) 情報処理方法、情報処理装置、プログラム、撮像装置、検査方法、検査装置、及び基板の製造方法
CN117197170B (zh) 一种单目相机视场角测量方法及系统
WO2021120911A1 (zh) 一种板状工件的三维坐标校准方法
CN112686960A (zh) 一种基于光线追迹的相机入瞳中心及视线方向的标定方法
JP5981353B2 (ja) ３次元計測装置
US20240064421A1 (en) Three dimensional scanner apparatus including an optical device
CN110322516A (zh) 一种紫外光相机与可见光相机阵列的标定方法
TWI674422B (zh) 非接觸式光學量測方法與系統
CN117825398A (zh) 一种基于梯度信息的镜面、类镜面物体表面缺陷的检测方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000