KR102717443B1 - 기판의 위치 맞춤 방법 - Google Patents

기판의 위치 맞춤 방법 Download PDF

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Publication number
KR102717443B1
KR102717443B1 KR1020227007495A KR20227007495A KR102717443B1 KR 102717443 B1 KR102717443 B1 KR 102717443B1 KR 1020227007495 A KR1020227007495 A KR 1020227007495A KR 20227007495 A KR20227007495 A KR 20227007495A KR 102717443 B1 KR102717443 B1 KR 102717443B1
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South Korea
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substrate
edge
stage
position data
edge portion
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Korean (ko)
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KR20220073733A (ko
Inventor
즈요시 고바야시
도루 유키
기사토 히라타
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가부시키가이샤 제이이엘
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/028—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring lateral position of a boundary of the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • H01L21/67259—
    • H01L21/681—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020227007495A 2019-08-22 2020-05-14 기판의 위치 맞춤 방법 Active KR102717443B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019152239A JP7344047B2 (ja) 2019-08-22 2019-08-22 基板の位置合わせ方法
JPJP-P-2019-152239 2019-08-22
PCT/JP2020/019236 WO2021033377A1 (ja) 2019-08-22 2020-05-14 基板の位置合わせ方法

Publications (2)

Publication Number Publication Date
KR20220073733A KR20220073733A (ko) 2022-06-03
KR102717443B1 true KR102717443B1 (ko) 2024-10-15

Family

ID=74661037

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227007495A Active KR102717443B1 (ko) 2019-08-22 2020-05-14 기판의 위치 맞춤 방법

Country Status (6)

Country Link
US (1) US12487082B2 (https=)
JP (1) JP7344047B2 (https=)
KR (1) KR102717443B1 (https=)
CN (1) CN114258474B (https=)
TW (1) TWI758737B (https=)
WO (1) WO2021033377A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025084133A1 (ja) * 2023-10-17 2025-04-24 シンフォニアテクノロジー株式会社 アライナ及び基板処理システム
WO2025085391A1 (en) * 2023-10-18 2025-04-24 Gpd Optoelectronics Corp. Optical detector system having a ring photodetector and an annular beam lens design
WO2025126960A1 (ja) * 2023-12-11 2025-06-19 株式会社東京精密 形状測定装置及び形状測定方法並びにウェーハ加工システム
CN121035033B (zh) * 2025-08-27 2026-03-17 合肥致真精密设备有限公司 一种晶圆校准方法、装置、设备及存储介质

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151575A (ja) * 2000-11-13 2002-05-24 Daihen Corp ウェハアライナ装置
JP2008196855A (ja) * 2007-02-08 2008-08-28 Yamatake Corp ウェハの位置決め方法および位置決め装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3634487B2 (ja) * 1996-02-09 2005-03-30 キヤノン株式会社 位置合せ方法、位置合せ装置、および露光装置
JP3724720B2 (ja) 2001-12-20 2005-12-07 住友金属工業株式会社 反り形状計測方法及び装置
US20070258085A1 (en) * 2006-05-02 2007-11-08 Robbins Michael D Substrate illumination and inspection system
US20060192950A1 (en) * 2004-12-19 2006-08-31 Neil Judell System and method for inspecting a workpiece surface using combinations of light collectors
JP4309874B2 (ja) * 2005-08-05 2009-08-05 株式会社ブイ・テクノロジー 露光装置
CN101021489A (zh) * 2006-02-15 2007-08-22 奥林巴斯株式会社 外观检查装置
US7508504B2 (en) * 2006-05-02 2009-03-24 Accretech Usa, Inc. Automatic wafer edge inspection and review system
JP4787185B2 (ja) * 2007-02-21 2011-10-05 株式会社トプコン ウエハ表面検査方法及びその装置
JP2008203182A (ja) 2007-02-22 2008-09-04 Yamatake Corp エッジ検出装置
KR101435352B1 (ko) * 2010-09-01 2014-08-28 미쓰비시덴키 가부시키가이샤 레이저 가공장치 및 기판위치 검출방법
CN104137249B (zh) * 2012-04-25 2017-11-14 应用材料公司 晶片边缘的测量和控制
JP6394220B2 (ja) 2014-09-17 2018-09-26 東京エレクトロン株式会社 アライメント装置及び基板処理装置
US10056224B2 (en) * 2015-08-10 2018-08-21 Kla-Tencor Corporation Method and system for edge-of-wafer inspection and review
NL2017860B1 (en) * 2015-12-07 2017-07-27 Ultratech Inc Systems and methods of characterizing process-induced wafer shape for process control using cgs interferometry
WO2017170393A1 (ja) * 2016-03-28 2017-10-05 株式会社東京精密 プローバ及びプローバの操作方法
CN107367911B (zh) 2016-05-11 2019-02-15 中芯国际集成电路制造(上海)有限公司 对准方法及对准系统

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002151575A (ja) * 2000-11-13 2002-05-24 Daihen Corp ウェハアライナ装置
JP2008196855A (ja) * 2007-02-08 2008-08-28 Yamatake Corp ウェハの位置決め方法および位置決め装置

Also Published As

Publication number Publication date
JP7344047B2 (ja) 2023-09-13
JP2021032662A (ja) 2021-03-01
CN114258474B (zh) 2024-08-09
CN114258474A (zh) 2022-03-29
TWI758737B (zh) 2022-03-21
KR20220073733A (ko) 2022-06-03
US12487082B2 (en) 2025-12-02
TW202109724A (zh) 2021-03-01
WO2021033377A1 (ja) 2021-02-25
US20220299317A1 (en) 2022-09-22

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