WO2021017922A1 - 电子元件与电路板的连接方法、电路板组件及电子设备 - Google Patents

电子元件与电路板的连接方法、电路板组件及电子设备 Download PDF

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Publication number
WO2021017922A1
WO2021017922A1 PCT/CN2020/103026 CN2020103026W WO2021017922A1 WO 2021017922 A1 WO2021017922 A1 WO 2021017922A1 CN 2020103026 W CN2020103026 W CN 2020103026W WO 2021017922 A1 WO2021017922 A1 WO 2021017922A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
insulating layer
hole
electronic component
forming
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PCT/CN2020/103026
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English (en)
French (fr)
Inventor
戴聿昌
庞长林
刘洋
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微智医疗器械有限公司
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Publication of WO2021017922A1 publication Critical patent/WO2021017922A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Definitions

  • the present disclosure relates to the technical field of electronic circuits, and more specifically, to a method for connecting an electronic component and a circuit board, a circuit board assembly, and an electronic device.
  • circuit board components have been used in electronic devices such as implanted devices, wearable devices, mobile phones, computers, cameras, and displays.
  • An electronic component is a basic element in an electronic circuit and has at least one metal pad.
  • the circuit board is a carrier of electronic components, and a plurality of electronic components are connected to each other via the circuit board and encapsulated to form a circuit board assembly.
  • One of the common ways to connect electronic components to a circuit board is to solder the electronic components to the circuit board.
  • the volume occupied by the pads has also become smaller.
  • the electronic components are soldered to the circuit board, there will be problems of virtual solder joints and weak connections, and even easy Several pads are interconnected to cause a short circuit, and the pads and the metal layer of the circuit board are not connected and open circuits.
  • the purpose of the present disclosure is to provide a method for connecting an electronic component and a circuit board, a circuit board assembly, and an electronic device, so as to improve the reliability of the connection between the electronic component and the circuit board.
  • the electronic component includes at least one pad
  • the circuit board has a through hole corresponding to the pad
  • the connecting method includes: Place the electronic components on the first surface of the circuit board, and align the pads with the corresponding through holes one by one; forming the pads and/or the first surface The first conductive glue at the through hole; flip the circuit board so that the second surface of the circuit board faces upward, wherein the second surface and the first surface are opposite to each other; and form a filling in the through The second conductive glue in the hole, the first conductive glue and the second conductive glue provide electrical connection between the circuit board and the electronic component.
  • the circuit board includes a first insulating layer, a second insulating layer, and a metal layer.
  • the metal layer is located between the first insulating layer and the second insulating layer.
  • the hole penetrates the first insulating layer, the metal layer, and the second insulating layer; wherein the cross-sectional area of the through hole in the second insulating layer is larger than that in the first insulating layer.
  • the manufacturing method of the circuit board specifically includes the following steps: forming the first insulating layer on a substrate; forming the patterned metal layer on the first insulating layer, wherein , The patterned metal layer has a first opening for forming a part of the via; forming the second insulating layer covering the patterned metal layer; forming a mask on the second insulating layer The mask has a second opening, the cross-sectional area of the second opening is larger than the cross-sectional area of the first opening; the second insulating layer and the first insulating layer are etched to form the The through hole; remove the mask and substrate to obtain the circuit board.
  • forming the first insulating layer on the substrate specifically includes: disposing a first photoresist layer on the substrate; and forming a first photoresist layer on the first photoresist layer. Mentioned first insulating layer.
  • forming the patterned metal layer on the first insulating layer specifically includes: forming a patterned second photoresist layer on the first insulating layer; The metal layer in the pattern of the second photoresist layer is removed, and the second photoresist layer is removed to form the patterned metal layer.
  • the first conductive adhesive seals the through hole located on the first surface.
  • connection method further includes: after forming the first conductive glue, drying the first conductive glue; and/or after forming the second conductive glue, drying the The second conductive adhesive.
  • the first conductive adhesive and the second conductive adhesive are metal-based or carbon-based epoxy resin adhesives.
  • connection method after filling the second conductive glue, the connection method further includes providing a protective film integrally wrapped on the surface of the circuit board and the electronic component.
  • the electronic component is any one of a capacitor, an inductor, a resistor, an oscillator, a filter, a sensor, and an integrated circuit chip.
  • a circuit board assembly includes: a circuit board having at least one through hole; at least one electronic component, the electronic component is located on the first surface of the circuit board, the electronic The component has a pad corresponding to the through hole; and an adhesive that provides electrical connection between the circuit board and the electronic component, and the adhesive includes at least two different The first conductive glue and the second conductive glue formed in the step, the first conductive glue is located on the first surface, and the second conductive glue is filled in the through hole.
  • the first conductive adhesive and the second conductive adhesive are metal-based or carbon-based epoxy resin adhesives.
  • the electronic component is any one of a capacitor, an inductor, a resistor, an oscillator, a filter, a sensor, and an integrated circuit chip.
  • the circuit board is a flexible cable.
  • the circuit board includes: an introduction part having at least one of the through holes; a connection part; and a stimulation end having a plurality of stimulation electrodes on the stimulation end, the stimulation The terminal is connected to the introduction part via the connection part, and the stimulation electrode is connected to the electronic component via the through hole.
  • An electronic device includes: a circuit board assembly manufactured by using the connection method according to the embodiment of the first aspect of the present disclosure, or the circuit board assembly of the embodiment of the second aspect of the present disclosure.
  • the electronic device is any one of a cochlear implant, a retinal stimulation visual prosthesis, a cerebral cortex stimulator, a spinal cord stimulator, and a brain pacemaker.
  • the technical solution provided by the present disclosure connects the electronic components to the first surface of the circuit board through the first conductive glue, and fills the second conductive glue in the through holes of the circuit board.
  • the glue on both sides of the circuit board can greatly improve the electronic components and The reliability of the electrical connection between the circuit boards avoids the virtual connection or disconnection of the electronic components and the circuit board.
  • the solution is simple in process, and at the same time, the process yield is improved, and the electronic components are guaranteed to work normally under the condition of limited size, and it is especially suitable for micro-electronic devices.
  • the through holes of the circuit board in the present disclosure have different cross-sectional areas at the first surface and the second surface, exposing part of the surface of the metal layer, which can not only reduce the contact resistance between the circuit board and the electronic components It can also form a second conductive adhesive with a stepped structure, which improves the bonding strength between the circuit board and the electronic component.
  • the first conductive adhesive seals the through hole on the first surface, so that when the second conductive adhesive is formed, the conductive adhesive does not leak to the bottom surface or sidewall of the electronic component. Avoid short circuits caused by multiple pad interconnections or interconnections between pads and the sidewalls of electronic components.
  • the technical solution provided by the present disclosure forms a protective film integrally wrapped on the surface of the electronic component and the circuit board after the connection between the electronic component and the circuit board is completed, which can prevent mechanical damage, water vapor corrosion and chemical corrosion, and increase the electronic components.
  • the reliability and stability of the components are particularly important.
  • FIG. 1a is a schematic diagram of a step of connecting an electronic component to a first surface of a circuit board in a method for connecting an electronic component and a circuit board according to an embodiment of the present disclosure
  • 1b is a schematic diagram of the step of turning the circuit board so that the second surface of the circuit board faces upward in the method for connecting an electronic component and a circuit board according to an embodiment of the present disclosure
  • 1c is a schematic diagram of a step of filling a second conductive glue into a through hole in a method for connecting an electronic component and a circuit board according to an embodiment of the present disclosure
  • FIG. 1d is a schematic diagram of a second conductive glue filled in a through hole in a method for connecting an electronic component and a circuit board according to an embodiment of the present disclosure
  • Fig. 2 is a partial perspective view of a circuit board assembly according to an embodiment of the present disclosure
  • Figure 3 is a partial exploded view of a circuit board assembly according to an embodiment of the present disclosure
  • Figure 4 is a top view of a circuit board according to an embodiment of the present disclosure.
  • FIG. 5a is a schematic diagram of the initial steps of a method of manufacturing a circuit board according to an embodiment of the present disclosure
  • 5b is a schematic diagram of a step of forming a first insulating layer on the first photoresist layer in the method for manufacturing a circuit board according to an embodiment of the present disclosure
  • 5c is a schematic diagram of a step of forming a patterned second photoresist layer on the surface of the first insulating layer in the method of manufacturing a circuit board according to an embodiment of the present disclosure
  • 5d is a schematic diagram of a step of forming a patterned metal layer in a method of manufacturing a circuit board according to an embodiment of the present disclosure
  • 5e is a schematic diagram of a step of forming a second insulating layer covering a metal layer in a method of manufacturing a circuit board according to an embodiment of the present disclosure
  • 5f is a schematic diagram of a step of forming a mask on the second insulating layer in the method of manufacturing a circuit board according to an embodiment of the present disclosure
  • 5g is a schematic diagram of a step of forming a through hole penetrating the first insulating layer, the metal layer, and the second insulating layer in the method of manufacturing a circuit board according to an embodiment of the present disclosure
  • 5h is a schematic diagram of a step of removing the mask, the first photoresist layer, and the substrate to release the circuit board in the method for manufacturing the circuit board according to the embodiment of the present disclosure.
  • Circuit board 100 first surface 100a; second surface 100b;
  • Electronic component 200 pad 201; adhesive 300;
  • First conductive glue 301 First conductive glue 301; second conductive glue 302; glue dispensing device 310.
  • the electronic component 200 is connected to the first surface 100a of the circuit board 100.
  • the electronic component 200 includes at least one pad 201, and the circuit board 100 has a through hole 114 corresponding to the pad 201.
  • the first surface 100a of the circuit board 100 is facing upwards, and the electronic components 200 are placed on the first surface 100a of the circuit board 100, so that the pads 201 are aligned with the corresponding through holes 114 one by one.
  • a first conductive glue 301 is formed at the through hole 114 of the first surface 100a to connect the electronic component 200 to the first surface 100a of the circuit board 100 via the first conductive glue 301.
  • the first conductive adhesive 301 is dried.
  • the circuit board 100 includes a first insulating layer 111, a metal layer 112, and a second insulating layer 113.
  • the metal layer 112 is located between the first insulating layer 111 and the second insulating layer 113, and the through hole 114 penetrates the first insulating layer. 111, a metal layer 112, and a second insulating layer 113.
  • the cross-sectional area of the through hole 114 on the second insulating layer 113 is larger than the cross-sectional area of the through hole 114 on the first insulating layer 111 to expose part of the surface of the metal layer 112, and the exposed surface of the metal layer 112 is used for electrical connection .
  • the exposed surface of the first insulating layer 111 is the first surface 100 a of the circuit board 100
  • the exposed surface of the second insulating layer 113 is the second surface 100 b of the circuit board 100.
  • the circuit board 100 may be a flexible printed circuit (FPC), but is not limited thereto. Or alternatively, the circuit board 100 may also be any circuit board with through holes 114.
  • the circuit board 100 is turned over so that the second surface 100b of the circuit board 100 faces upward, as shown in FIG. 1b.
  • the first conductive glue 301 can close the through hole 114 on the first surface 100a of the circuit board 100.
  • the first conductive glue 301 and the sidewall of the through hole 114 of the circuit board 100 are formed A semi-closed structure with an open top is used, so that when the second conductive adhesive is set, the conductive adhesive does not leak to the bottom surface or sidewall of the electronic component 200, and the conductive adhesive interconnects the multiple pads 201, Or a short circuit caused by the interconnection between the pad 201 and the sidewall of the electronic component 200.
  • the second conductive glue 302 is filled into the through hole 114, as shown in FIGS. 1c and 1d.
  • the glue dispensing device 310 can be used to drip the second conductive glue 302 into the through hole 114, and the second conductive glue 302 can be dried.
  • the aforementioned exposed surface of the metal layer 112 may be connected to the pad 201 via the second conductive glue 302 and the first conductive glue 301.
  • the first conductive adhesive 301 and the second conductive adhesive 302 may be any one of silver-based conductive adhesive, gold-based conductive adhesive, platinum-based conductive adhesive, aluminum-based conductive adhesive, copper-based conductive adhesive, and carbon-based conductive adhesive.
  • the first conductive adhesive 301 and the second conductive adhesive 302 are metal epoxy adhesives.
  • the electronic component 200 is connected to the first surface 100a of the circuit board 100 through the first conductive glue 301, and the second conductive glue 302 is filled in the through hole 114 of the circuit board 100.
  • the first conductive adhesive 301 can ensure the reliability of the mechanical connection between the electronic component 200 and the circuit board 100
  • the second conductive adhesive 302 can ensure the reliability of the electrical connection between the electronic component 200 and the circuit board 100.
  • the method of dispensing on both sides greatly improves the reliability of the connection between the electronic component 200 and the circuit board 100, can avoid the virtual connection or disconnection of the electronic component 200 and the circuit board 100, and the process is simple, and the process yield is improved at the same time , To ensure that the electronic component 200 can work normally when the size is limited, and is especially suitable for miniature electronic devices.
  • a protective film integrally wrapped on the surface of the circuit board assembly is formed.
  • the protective film can wrap circuit boards and electronic components.
  • the protective film may be at least one of parylene film, polyimide film, polypropylene film, polyterephthalic acid film and silica gel film.
  • the protective film can be formed by a chemical vapor deposition (Chemical Vapor Deposition, CVD) process, a spin coating method, or an injection molding method.
  • CVD chemical Vapor Deposition
  • the above-mentioned protective film can prevent mechanical damage, water vapor corrosion and chemical corrosion, and improve the reliability and stability of the electronic component 200.
  • the electronic device can be formed by energizing or electrically connecting the circuit board assembly as described above to other electronic circuits.
  • Electronic equipment may include implanted devices, wearable equipment, mobile phones, computers, cameras, displays, etc. Since this solution can form small-size flexible circuit board components, it is especially suitable for micro-electronic equipment.
  • the circuit board assembly includes a circuit board 100, an electronic component 200, and an adhesive 300.
  • the circuit board 100 has at least one through hole 114
  • the electronic component 200 includes a pad 201 corresponding to the through hole 114
  • the through hole 114 corresponds to the pad 201 one-to-one.
  • the electronic component 200 is connected to the first surface 100a of the circuit board 100 via an adhesive 300.
  • the adhesive 300 may include at least a first conductive glue 301 and a second conductive glue 302 formed in two different steps.
  • the glue 301 is dispensed from the first surface 100 a of the circuit board 100
  • the second conductive glue 302 is dispensed from the second surface 100 b of the circuit board 100.
  • the electronic component 200 may be any of capacitors, inductors, resistors, oscillators, filters, sensors, integrated circuit chips and other components.
  • the circuit board 100 includes an introduction part 110, a connection part 120 and a stimulation end 130.
  • the circuit board 100 may be a flexible cable, which is suitable for implantation devices, such as cochlear implants, retinal stimulation visual prostheses, cerebral cortex stimulators, spinal cord stimulators, and deep brain stimulators (brain pacemakers).
  • the flexible cable can avoid damage to the tissue when it is in contact with the tissue, and can ensure biocompatibility and reliability.
  • the introduction part 110 has at least one through hole 114, and the through hole 114 is used to fill a conductive material to connect electronic components on the introduction part 110.
  • the surface or the inside of the connecting portion 120 includes a metal layer corresponding to the stimulation end 130 (not shown in the figure).
  • the stimulation terminal 130 has a plurality of stimulation electrodes 131 connected to the introduction portion 110 via the connection portion 120, and the stimulation electrodes 131 are connected to electronic components via the through holes 114 to form a complete circuit.
  • the circuit board of the implanted device is taken as an example to illustrate the structure of the circuit board, but the circuit board of the present disclosure is not limited to flexible cables, and the electronic equipment is not limited to the implanted device.
  • the circuit board 100 may be made of insulating layer and metal.
  • the manufacturing method of the circuit board starts with the substrate 101 and the first photoresist layer 102 on the substrate 101, as shown in FIG. 5a.
  • the substrate 101 is used to provide mechanical support
  • the first photoresist layer 102 is used to protect the substrate 101 in the cutting process and as a sacrificial layer in the step of releasing the circuit board.
  • the first photoresist layer 102 may be omitted to reduce cost and simplify the process flow.
  • the substrate 101 may be a wafer, which facilitates the formation of a small area circuit board.
  • a negative photoresist can be spin-coated on the surface of the wafer, and the negative photoresist can be hard baked.
  • a first insulating layer 111 is formed on the first photoresist layer 102, as shown in FIG. 5b.
  • the material of the first insulating layer 111 is PMMA (poly(methyl methacrylate)-polymethyl methacrylate), Teflon, silicone resin, polyimide, polyethylene terephthalate, Or Parylene (especially Parylene-C).
  • the first insulating layer 111 is a parylene film, and the parylene film is formed by a chemical vapor deposition process.
  • a patterned second photoresist layer 103 is formed on the surface of the first insulating layer 111, as shown in FIG. 5c.
  • a second photoresist layer 103 may be formed on the surface of the first insulating layer 111, and the second photoresist layer 103 may be exposed and developed to form a patterned second photoresist. ⁇ 103.
  • a patterned metal layer 112 is formed, as shown in FIG. 5d.
  • a metal layer 112 filled in the pattern of the second photoresist layer 103 is formed, and the second photoresist layer 103 is removed to form a patterned metal layer 112.
  • the metal layer 112 has a first opening 104 , The first opening 104 will be used to form a part of the through hole 114.
  • the step of forming the second photolithography layer 103 may be omitted, and after the metal layer 112 is directly formed on the surface of the first insulating layer 111, the metal layer 112 is patterned.
  • a second insulating layer 113 covering the metal layer 112 is formed, as shown in FIG. 5e.
  • the material of the second insulating layer 113 and the material of the first insulating layer 111 may be the same.
  • the second insulating layer 113 is a parylene film, and the parylene film is formed by a chemical vapor deposition process, and the parylene film covers the exposed surfaces of the metal layer 112 and the first insulating layer 111.
  • the parylene film can also be flattened.
  • a mask 105 is formed on the second insulating layer 113, as shown in FIG. 5f.
  • the surface of the mask 105 has a second opening 106, and the cross-sectional area of the second opening 106 is larger than the cross-sectional area of the first opening 104.
  • a plurality of first openings 104 and a plurality of second openings 106 can be designed according to the positions and shapes of the pads of the electronic components to form a circuit board suitable for various electronic components.
  • a through hole 114 penetrating the first insulating layer 111, the metal layer 112 and the second insulating layer 113 is formed, as shown in FIG. 5g.
  • an anisotropic dry etching process may be used to form the through hole 114.
  • the metal layer 112 can be used as a mask for shielding the first insulating layer 111.
  • the etching is continued to form through holes 114 having different cross-sectional areas at the second insulating layer 113 and the first insulating layer 111, so that part of the surface of the metal layer 112 is exposed.
  • the mask 105, the first photoresist layer 102 and the substrate 101 are removed to release the circuit board 100, as shown in FIG. 5h.
  • a remover can be dipped to remove the mask 105, dissolve the first photoresist layer 102, and remove the substrate 101, and then rinse and bake the released circuit board.
  • the manufacturing method of the flexible cable is taken as an example to illustrate the manufacturing method of the circuit board, but the circuit board of the present disclosure is not limited to the flexible cable, and the structure of the circuit board is not limited to this.
  • the circuit board 100 may be made of an insulating layer and a metal. Any structure of circuit boards formed by layers.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

一种电子元件(200)与电路板(100)的连接方法、电路板组件及电子设备，电子元件(200)包括至少一个焊盘(201)，电路板(100)具有与焊盘(201)相对应的通孔(114)，连接方法包括：在电路板(100)的第一表面(100a)放置电子元件(200)，并使焊盘(201)与相应的通孔(114)一一对齐；形成位于焊盘(201)和/或位于第一表面(100a)的通孔(114)处的第一导电胶(301)；翻转电路板(100)，使第二表面(100b)朝上，第二表面(100b)和第一表面(100a)彼此相对；和形成填充于通孔(114)内的第二导电胶(302)，第一导电胶(301)和第二导电胶(302)提供电路板(100)与电子元件(200)之间的电连接。

Description

电子元件与电路板的连接方法、电路板组件及电子设备 技术领域
本公开涉及电子电路技术领域，更具体地，涉及一种电子元件与电路板的连接方法、电路板组件及电子设备。
背景技术
随着电子产品的普及和电子电路的不断发展，电路板组件已经被应用于植入装置、可穿戴设备、手机、电脑、相机、显示器等电子设备中。
电子元件(electronic component)是电子电路中的基本元素，具有至少一个焊盘(metal pad)。电路板是电子元件的载体，多个电子元件经由电路板相互连接并被封装以形成电路板组件。将电子元件连接至电路板的常见方式之一是将电子元件焊接到电路板上。然而，随着电子设备和电子元件的小型化，焊盘所占的体积也随之变小，在将电子元件焊接至电路板时，会出现焊点虚接、连接不牢固的问题，甚至容易出现多个焊盘互连而导致短路、以及焊盘与电路板的金属层未连接而出现断路的情况。
因此，亟需对现有技术的电子元件与电路板的连接方法进行进一步改进，以解决上述问题。
发明内容
鉴于上述问题，本公开的目的在于提供一种电子元件与电路板的连接方法、电路板组件及电子设备，以提高电子元件与电路板的连接可靠性。
根据本公开第一方面实施例的电子元件与电路板的连接方法，所述电子元件包括至少一个焊盘，所述电路板具有与所述焊盘相对应的通孔，所述连接方法包括：在所述电路板的第一表面放置所述电子元件，并使所述焊盘与相应的所述通孔一一对齐；形成位于所述焊盘和/或位于所述第一表面的所述通孔处的第一导电胶；翻转所述电路板，以使所述电路板的第二表面朝上，其中所述第二表面和所述第一表面彼此相对；以及形成填充于所述通孔内的第二导电胶，所述第一导电胶和所述第二导电胶提供所述电路板与所述电子元件之间的电连接。
根据本公开的一些实施例，所述电路板包括第一绝缘层、第二绝缘层以及金属层，所述金属层位于所述第一绝缘层和所述第二绝缘层之间，所述通孔贯穿所述第一绝缘层、所 述金属层和所述第二绝缘层；其中，所述通孔在所述第二绝缘层中的横截面积大于在所述第一绝缘层中的横截面积，以暴露出所述金属层的部分表面；所述第一表面为所述第一绝缘层的暴露表面，所述第二表面为所述第二绝缘层的暴露表面。
根据本公开的一些实施例，所述电路板的制造方法具体包括以下步骤：在衬底上形成所述第一绝缘层；在所述第一绝缘层上形成图案化的所述金属层，其中，图案化的所述金属层具有用于形成所述通孔的一部分的第一开口；形成覆盖图案化的所述金属层的所述第二绝缘层；在所述第二绝缘层上形成掩膜，所述掩膜具有第二开口，所述第二开口的横截面积大于所述第一开口的横截面积；对所述第二绝缘层和所述第一绝缘层进行蚀刻以形成所述通孔；去除掩膜和衬底，以得到所述电路板。
根据本公开的一些实施例，在所述衬底上形成所述第一绝缘层具体包括：在所述衬底上设置第一光刻胶层；在所述第一光刻胶层上形成所述第一绝缘层。
根据本公开的一些实施例，在所述第一绝缘层上形成图案化的所述金属层具体包括：在所述第一绝缘层上形成具有图案的第二光刻胶层；形成填充于所述第二光刻胶层的图案内的金属层，并去除所述第二光刻胶层，以形成图案化的所述金属层。
根据本公开的一些实施例，所述第一导电胶将位于所述第一表面的所述通孔封闭。
根据本公开的一些实施例，所述连接方法还包括：在形成所述第一导电胶之后，烘干所述第一导电胶；和/或在形成所述第二导电胶之后，烘干所述第二导电胶。
根据本公开的一些实施例，所述第一导电胶和所述第二导电胶为金属系或碳系环氧树脂胶粘剂。
根据本公开的一些实施例，在填充所述第二导电胶之后，所述连接方法还包括设置一体包裹于所述电路板和所述电子元件的表面的保护膜。
根据本公开的一些实施例，所述电子元件为电容器、电感器、电阻器、振荡器、滤波器、传感器和集成电路芯片中的任意一种。
根据本公开第二方面实施例的电路板组件，包括：电路板，所述电路板具有至少一个通孔；至少一个电子元件，所述电子元件位于所述电路板的第一表面，所述电子元件具有与所述通孔相对应的焊盘；以及粘接剂，所述粘接剂提供所述电路板与所述电子元件之间的电连接，所述粘接剂包括至少在两个不同的步骤中形成的第一导电胶和第二导电胶，所述第一导电胶位于所述第一表面，所述第二导电胶填充于所述通孔内。
根据本公开的一些实施例，所述第一导电胶和所述第二导电胶为金属系或碳系环氧树脂胶粘剂。
根据本公开的一些实施例，所述电子元件为电容器、电感器、电阻器、振荡器、滤波 器、传感器和集成电路芯片中的任意一种。
根据本公开的一些实施例，所述电路板为柔性电缆。
根据本公开的一些实施例，所述电路板包括：引入部分，所述引入部分具有至少一个所述通孔；连接部分；以及刺激端，所述刺激端上具有多个刺激电极，所述刺激端经由所述连接部分连接至所述引入部分，所述刺激电极经由所述通孔连接至所述电子元件。
根据本公开第三方面实施例的电子设备，包括：采用根据本公开上述第一方面实施例的连接方法制成的电路板组件，或者根据本公开上述第二方面实施例的电路板组件。
根据本公开的一些实施例，所述电子设备为人工耳蜗植入体、视网膜刺激视觉假体、脑皮层刺激器、脊髓刺激器和脑起搏器中的任意一个。
本公开提供的技术方案，将电子元件通过第一导电胶连接至电路板的第一表面，在电路板的通孔内填充第二导电胶，电路板的两面点胶可以极大地提高电子元件与电路板之间的电连接可靠性，避免出现电子元件与电路板虚接或断路的问题。该方案工艺简单，同时提高了工艺良品率，保证电子元件在尺寸受限的情况下正常工作，尤其适用于微型电子设备。
进一步地，本公开中的电路板的通孔在第一表面和第二表面处具有不同的横截面积，暴露出金属层的部分表面，不仅能减小电路板与电子元件之间的接触电阻，还能形成具有台阶结构的第二导电胶，提高了电路板与电子元件的结合强度。
进一步地，本公开提供的技术方案，第一导电胶将位于第一表面的通孔封闭，从而在形成第二导电胶时，不会出现导电胶泄漏到电子元件的底面或侧壁的情况，避免出现多个焊盘互连或焊盘与电子元件的侧壁互连而导致的短路问题。
进一步地，本公开提供的技术方案，在完成电子元件与电路板的连接之后，形成了一体包裹于电子元件与电路板表面的保护膜，可以防机械损伤、水汽侵蚀及化学腐蚀，增加了电子元件的可靠性和稳定性。
本公开的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本公开的实践了解到。
附图说明
通过以下参照附图对本公开实施例的描述，本公开的上述以及其他目的、特征和优点将更为清楚，在附图中：
图1a是根据本公开实施例的电子元件与电路板的连接方法中的将电子元件连接至电路板的第一表面的步骤的示意图；
图1b是根据本公开实施例的电子元件与电路板的连接方法中的翻转电路板以使电路板的第二表面朝上的步骤的示意图；
图1c是根据本公开实施例的电子元件与电路板的连接方法中的向通孔内填充第二导电胶的步骤的示意图；
图1d是根据本公开实施例的电子元件与电路板的连接方法中的已在通孔内填充有第二导电胶的示意图；
图2是根据本公开实施例的电路板组件的局部立体图；
图3是根据本公开实施例的电路板组件的局部分解图；
图4是根据本公开实施例的电路板的俯视图；
图5a是根据本公开实施例的电路板的制造方法的开始步骤的示意图；
图5b是根据本公开实施例的电路板的制造方法中的在第一光刻胶层上形成第一绝缘层的步骤的示意图；
图5c是根据本公开实施例的电路板的制造方法中的在第一绝缘层的表面上形成具有图案的第二光刻胶层的步骤的示意图；
图5d是根据本公开实施例的电路板的制造方法中的形成图案化的金属层的步骤的示意图；
图5e是根据本公开实施例的电路板的制造方法中的形成覆盖金属层的第二绝缘层的步骤的示意图；
图5f是根据本公开实施例的电路板的制造方法中的在第二绝缘层上形成掩膜的步骤的示意图；
图5g是根据本公开实施例的电路板的制造方法中的形成贯穿第一绝缘层、金属层和第二绝缘层的通孔的步骤的示意图；
图5h是根据本公开实施例的电路板的制造方法中的去除掩膜、第一光刻胶层和衬底以释放电路板的步骤的示意图。
附图标记：
电路板100；第一表面100a；第二表面100b；
衬底101；第一光刻胶层102；
第二光刻胶层103；第一开口104；掩膜105；
第二开口106；引入部分110；第一绝缘层111；
金属层112；第二绝缘层113；通孔114；
连接部分120；刺激端130；刺激电极131；
电子元件200；焊盘201；粘结剂300；
第一导电胶301；第二导电胶302；点胶装置310。
具体实施方式
下面结合附图和实施例，对本发明的具体实施方式作进一步详细描述。
如图1a所示，将电子元件200连接至电路板100的第一表面100a。电子元件200包括至少一个焊盘201，电路板100具有与焊盘201相应的通孔114。在该步骤中，使电路板100的第一表面100a朝上，并在电路板100的第一表面100a放置电子元件200，使得焊盘201与相应的通孔114一一对齐，在焊盘201和/或位于第一表面100a的通孔114处形成第一导电胶301，以将电子元件200经由第一导电胶301连接至电路板100的第一表面100a。可选地，设置第一导电胶301之后，烘干第一导电胶301。
可选地，电路板100包括第一绝缘层111、金属层112以及第二绝缘层113，金属层112位于第一绝缘层111和第二绝缘层113之间，通孔114贯穿第一绝缘层111、金属层112和第二绝缘层113。通孔114在第二绝缘层113上的横截面积大于通孔114在第一绝缘层111上的横截面积，以暴露出金属层112的部分表面，金属层112的暴露表面用于电连接。第一绝缘层111的暴露表面为电路板100的第一表面100a，第二绝缘层113的暴露表面为电路板100的第二表面100b。电路板100可以为柔性电缆(Flexible Printed Circuit，FPC)，但不限于此。或者可选地，电路板100还可以为具有通孔114的任意电路板。
进一步地，翻转电路板100，以使电路板100的第二表面100b朝上，如图1b所示。可选地，第一导电胶301可以将位于电路板100的第一表面100a的通孔114封闭，在翻转电路板100后，第一导电胶301和电路板100的通孔114的侧壁形成了顶部敞开的半封闭结构，从而在设置第二导电胶时，不会出现导电胶泄漏到电子元件200的底面或侧壁的情况，进而可以避免出现导电胶将多个焊盘201互连、或焊盘201与电子元件200的侧壁互连而导致的短路问题。
更进一步地，向通孔114内填充第二导电胶302，如图1c和图1d所示。在该步骤中，例如可以使用点胶装置310向通孔114内滴注第二导电胶302，并烘干第二导电胶302。可选地，金属层112的上述暴露表面可以经由第二导电胶302和第一导电胶301连接至焊盘201。由此，不仅能减小电路板100与电子元件200之间的接触电阻，第二导电胶302的台阶结构还增大了电路板100与电子元件200的结合强度。
可选地，第一导电胶301和第二导电胶302可以为银系导电胶、黄金系导电胶、铂 金系导电胶、铝系导电胶、铜系导电胶和碳系导电胶中的任意一种。可选地，第一导电胶301和第二导电胶302为金属环氧树脂胶粘剂。
如图1d所示，电子元件200通过第一导电胶301连接至电路板100的第一表面100a，在电路板100的通孔114内填充第二导电胶302。由此，第一导电胶301可以保证电子元件200与电路板100之间的机械连接的可靠性，第二导电胶302可以保证电子元件200与电路板100之间的电连接的可靠性，采用两面点胶的方式极大地提高了电子元件200与电路板100之间的连接可靠性，可以避免出现电子元件200与电路板100虚接或断路的问题，且工艺简单，同时提高了工艺良品率，保证电子元件200在尺寸受限的情况下可以正常工作，尤其适用于微型电子设备。
可选地，在形成如图1d所示的电路板组件之后，形成一体包裹于电路板组件的表面的保护膜(图未示出)。例如，保护膜可以包裹电路板和电子元件。其中，保护膜可以为派瑞林膜、聚酰亚胺膜、聚丙烯膜、聚对苯二甲酸膜和硅胶膜中的至少一种。可以采用化学气相沉积(Chemical Vapor Deposition,CVD)工艺、旋涂法或注塑法形成上述保护膜。上述保护膜可以防止机械损伤、水汽侵蚀和化学腐蚀，提高了电子元件200的可靠性和稳定性。
将如上所述的电路板组件通电或电连接至其他电子电路，就可以形成电子设备。电子设备可以包括植入装置、可穿戴设备、手机、电脑、相机、显示器等，由于该方案可以形成小尺寸柔性电路板组件，因此尤其适用于微型电子设备。
如图2和图3所示，电路板组件包括电路板100、电子元件200以及粘接剂300。
具体而言，电路板100具有至少一个通孔114，电子元件200包括与通孔114相对应的焊盘201，通孔114与焊盘201一一对应。电子元件200经由粘接剂300连接至电路板100的第一表面100a，粘接剂300可以包括至少在两个不同的步骤中形成的第一导电胶301和第二导电胶302，第一导电胶301从电路板100的第一表面100a点胶，第二导电胶302从电路板100的第二表面100b点胶。可选地，电子元件200可以为电容器、电感器、电阻器、振荡器、滤波器、传感器和集成电路芯片等元件中的任意一种。
参照图4，电路板100包括引入部分110、连接部分120和刺激端130。电路板100可以为柔性电缆，柔性电缆适用于植入装置，例如人工耳蜗植入体、视网膜刺激视觉假体、脑皮层刺激器、脊髓刺激器和深部脑刺激器(脑起搏器)等。柔性电缆可以在与组织接触时避免对组织的伤害，且能保证生物相容性和可靠性。
引入部分110上具有至少一个通孔114，通孔114用于填充导电材料，以在引入部分110上连接电子元件。连接部分120的表面或内部包括与刺激端130对应的金属层(图 未示出)。刺激端130上具有多个刺激电极131，并经由连接部分120连接至引入部分110，刺激电极131经由通孔114连接电子元件，以形成完整的电路。
本实施例中是以植入装置的电路板为例说明电路板的结构，但本公开的电路板不限于柔性电缆，电子设备也不限于植入装置，电路板100可以是由绝缘层和金属层形成的任意形状的电路板，以提供电子元件之间的电连接或提供电子元件与其他电子电路的电连接，从而形成其他电子设备。
电路板的制造方法开始于衬底101以及衬底101上的第一光刻胶层102，如图5a所示。衬底101用于提供机械支撑，第一光刻胶层102用于在切割工艺中保护衬底101并在释放电路板的步骤中作为牺牲层。在另一些可选的实施例中，可以省去第一光刻胶层102，以降低成本，简化工艺流程。
在该步骤中，衬底101可以为晶圆(wafer)，便于形成小面积的电路板。完成对晶圆的清洁后，可以在晶圆的表面旋涂负光刻胶，并对该负光刻胶进行硬烤。
进一步地，在第一光刻胶层102上形成第一绝缘层111，如图5b所示。可选地，第一绝缘层111的材料为PMMA(poly(methyl methacrylate)-聚甲基丙烯酸甲酯)、特氟隆、硅树脂、聚酰亚胺、聚对苯二甲酸(polyethylene terephthalate)、或派瑞林(尤其是Parylene-C)。进一步可选地，第一绝缘层111为派瑞林膜，并采用化学气相沉积工艺形成派瑞林膜。
更进一步地，在第一绝缘层111的表面上形成具有图案的第二光刻胶层103，如图5c所示。在该步骤中，例如，在第一绝缘层111的表面上可以形成第二光刻胶层103，并对第二光刻胶层103曝光、显影处理，以形成具有图案的第二光刻胶层103。
进一步地，形成图案化的金属层112，如图5d所示。在该步骤中，形成填充于第二光刻胶层103的图案内的金属层112，并去除第二光刻胶层103，以形成图案化的金属层112，金属层112具有第一开口104，第一开口104将用于形成通孔114的一部分。
在一些可选的实施例中，可以省去形成第二光刻层103的步骤，在第一绝缘层111的表面上直接形成金属层112后，对金属层112进行图案化处理。
进一步地，形成覆盖金属层112的第二绝缘层113，如图5e所示。在该步骤中，第二绝缘层113的材料和第一绝缘层111的材料可以相同。可选地，第二绝缘层113为派瑞林膜，并采用化学气相沉积工艺形成派瑞林膜，派瑞林膜覆盖金属层112和第一绝缘层111的暴露表面。可选地，还可以对派瑞林膜进行平坦化处理。
进一步地，在第二绝缘层113上形成掩膜105，如图5f所示。掩膜105的表面具有第二开口106，第二开口106的横截面积大于第一开口104的横截面积。可选地，可以 根据电子元件的焊盘位置和形状设计多个第一开口104和多个第二开口106，以形成适配各种电子元件的电路板。
进一步地，形成贯穿第一绝缘层111、金属层112和第二绝缘层113的通孔114，如图5g所示。在该步骤中，可以采用各向异性的干法蚀刻工艺形成通孔114。形成位于第二绝缘层113中的通孔114之后，由于金属层112的第一开口104小于掩膜105的第二开口106，因此金属层112可以作为遮挡第一绝缘层111的掩膜。继续进行蚀刻，从而形成了在第二绝缘层113和第一绝缘层111处具有不同横截面积的通孔114，使得金属层112的部分表面得以暴露。
进一步地，去除掩膜105、第一光刻胶层102和衬底101，以释放电路板100，如图5h所示。在该步骤中，例如可以采用去除剂浸泡以去除掩膜105，溶解第一光刻胶层102，并去除衬底101，之后对释放后的电路板进行水冲洗和烘烤操作。
本实施例中是以柔性电缆的制造方法为例说明电路板的制造方法，但本公开的电路板不限于柔性电缆，电路板的结构也不限于此，电路板100可以是由绝缘层和金属层形成的任意结构的电路板。
尽管已经示出和描述了本公开的实施例，本领域的普通技术人员可以理解：在不脱离本公开的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本公开的范围由权利要求及其等同物限定。

Claims (17)

  1. 一种电子元件与电路板的连接方法，所述电子元件包括至少一个焊盘，所述电路板具有与所述焊盘相对应的通孔，其特征在于，所述连接方法包括：
    在所述电路板的第一表面放置所述电子元件，并使所述焊盘与相应的所述通孔一一对齐；
    形成位于所述焊盘和/或位于所述第一表面的所述通孔处的第一导电胶；
    翻转所述电路板，以使所述电路板的第二表面朝上，其中所述第二表面和所述第一表面彼此相对；以及
    形成填充于所述通孔内的第二导电胶，所述第一导电胶和所述第二导电胶提供所述电路板与所述电子元件之间的电连接。
  2. 根据权利要求1所述的连接方法，其特征在于，所述电路板包括第一绝缘层、第二绝缘层以及金属层，所述金属层位于所述第一绝缘层和所述第二绝缘层之间，所述通孔贯穿所述第一绝缘层、所述金属层和所述第二绝缘层；
    其中，所述通孔在所述第二绝缘层中的横截面积大于在所述第一绝缘层中的横截面积，以暴露出所述金属层的部分表面；
    所述第一表面为所述第一绝缘层的暴露表面，所述第二表面为所述第二绝缘层的暴露表面。
  3. 根据权利要求2所述的连接方法，其特征在于，所述电路板的制造方法具体包括以下步骤：
    在衬底上形成所述第一绝缘层；
    在所述第一绝缘层上形成图案化的所述金属层，其中，图案化的所述金属层具有用于形成所述通孔的一部分的第一开口；
    形成覆盖图案化的所述金属层的所述第二绝缘层；
    在所述第二绝缘层上形成掩膜，所述掩膜具有第二开口，所述第二开口的横截面积大于所述第一开口的横截面积；
    对所述第二绝缘层和所述第一绝缘层进行蚀刻以形成所述通孔；
    去除掩膜和衬底，以得到所述电路板。
  4. 根据权利要求3所述的连接方法，其特征在于，在所述衬底上形成所述第一绝缘层具体包括：
    在所述衬底上设置第一光刻胶层；
    在所述第一光刻胶层上形成所述第一绝缘层。
  5. 根据权利要求3所述的连接方法，其特征在于，在所述第一绝缘层上形成图案化的所述金属层具体包括：
    在所述第一绝缘层上形成具有图案的第二光刻胶层；
    形成填充于所述第二光刻胶层的图案内的金属层，并去除所述第二光刻胶层，以形成图案化的所述金属层。
  6. 根据权利要求1所述的连接方法，其特征在于，所述第一导电胶将位于所述第一表面的所述通孔封闭。
  7. 根据权利要求1所述的连接方法，其特征在于，还包括：
    在形成所述第一导电胶之后，烘干所述第一导电胶；和/或
    在形成所述第二导电胶之后，烘干所述第二导电胶。
  8. 根据权利要求1所述的连接方法，其特征在于，所述第一导电胶和所述第二导电胶为金属系或碳系环氧树脂胶粘剂。
  9. 根据权利要求1所述的连接方法，其特征在于，在填充所述第二导电胶之后，还包括：
    设置一体包裹于所述电路板和所述电子元件的表面的保护膜。
  10. 根据权利要求1所述的连接方法，其特征在于，所述电子元件为电容器、电感器、电阻器、振荡器、滤波器、传感器和集成电路芯片中的任意一种。
  11. 一种电路板组件，其特征在于，包括：
    电路板，所述电路板具有至少一个通孔；
    至少一个电子元件，所述电子元件位于所述电路板的第一表面，所述电子元件具有与所述通孔相对应的焊盘；以及
    粘接剂，所述粘接剂提供所述电路板与所述电子元件之间的电连接，所述粘接剂包括至少在两个不同的步骤中形成的第一导电胶和第二导电胶，所述第一导电胶位于所述第一表面，所述第二导电胶填充于所述通孔内。
  12. 根据权利要求11所述的电路板组件，其特征在于，所述第一导电胶和所述第二导电胶为金属系或碳系环氧树脂胶粘剂。
  13. 根据权利要求11所述的电路板组件，其特征在于，所述电子元件为电容器、电感器、电阻器、振荡器、滤波器、传感器和集成电路芯片中的任意一种。
  14. 根据权利要求11所述的电路板组件，其特征在于，所述电路板为柔性电缆。
  15. 根据权利要求11所述的连接方法，其特征在于，所述电路板包括：
    引入部分，所述引入部分具有至少一个所述通孔；
    连接部分；以及
    刺激端，所述刺激端上具有多个刺激电极，所述刺激端经由所述连接部分连接至所述引入部分，所述刺激电极经由所述通孔连接至所述电子元件。
  16. 一种电子设备，其特征在于，包括采用根据权利要求1所述的连接方法制成的电路板组件或者根据权利要求11所述的电路板组件。
  17. 根据权利要求16所述的电子设备，其特征在于，所述电子设备为人工耳蜗植入体、视网膜刺激视觉假体、脑皮层刺激器、脊髓刺激器和脑起搏器中的任意一个。
PCT/CN2020/103026 2019-07-26 2020-07-20 电子元件与电路板的连接方法、电路板组件及电子设备 WO2021017922A1 (zh)

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