TWI845799B - 基板結構及電子裝置 - Google Patents

基板結構及電子裝置 Download PDF

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Publication number
TWI845799B
TWI845799B TW109146550A TW109146550A TWI845799B TW I845799 B TWI845799 B TW I845799B TW 109146550 A TW109146550 A TW 109146550A TW 109146550 A TW109146550 A TW 109146550A TW I845799 B TWI845799 B TW I845799B
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TW
Taiwan
Prior art keywords
electronic device
substrate structure
substrate
electronic
Prior art date
Application number
TW109146550A
Other languages
English (en)
Other versions
TW202226392A (zh
Inventor
薛雅哲
Original Assignee
方略電子股份有限公司
Filing date
Publication date
Application filed by 方略電子股份有限公司 filed Critical 方略電子股份有限公司
Priority to TW109146550A priority Critical patent/TWI845799B/zh
Priority to US17/559,219 priority patent/US11917758B2/en
Publication of TW202226392A publication Critical patent/TW202226392A/zh
Application granted granted Critical
Publication of TWI845799B publication Critical patent/TWI845799B/zh

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TW109146550A 2020-12-28 2020-12-28 基板結構及電子裝置 TWI845799B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW109146550A TWI845799B (zh) 2020-12-28 基板結構及電子裝置
US17/559,219 US11917758B2 (en) 2020-12-28 2021-12-22 Substrate structure and manufacturing method thereof, electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW109146550A TWI845799B (zh) 2020-12-28 基板結構及電子裝置

Publications (2)

Publication Number Publication Date
TW202226392A TW202226392A (zh) 2022-07-01
TWI845799B true TWI845799B (zh) 2024-06-21

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150011131A1 (en) 2013-07-02 2015-01-08 Pulse Electronics, Inc. Methods and apparatus for terminating wire wound electronic components to a header assembly

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150011131A1 (en) 2013-07-02 2015-01-08 Pulse Electronics, Inc. Methods and apparatus for terminating wire wound electronic components to a header assembly

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