WO2021007949A1 - 一种提高igbt模块端子焊接强度的工艺方法 - Google Patents

一种提高igbt模块端子焊接强度的工艺方法 Download PDF

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WO2021007949A1
WO2021007949A1 PCT/CN2019/106851 CN2019106851W WO2021007949A1 WO 2021007949 A1 WO2021007949 A1 WO 2021007949A1 CN 2019106851 W CN2019106851 W CN 2019106851W WO 2021007949 A1 WO2021007949 A1 WO 2021007949A1
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solder paste
welding
chip
initial
improving
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PCT/CN2019/106851
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English (en)
French (fr)
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姜维宾
臧天程
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烟台台芯电子科技有限公司
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Publication of WO2021007949A1 publication Critical patent/WO2021007949A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor

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  • the invention relates to a process method for improving the welding strength of IGBT module terminals, and belongs to the technical field of printing welding.
  • Power terminals mainly play the role of electrodes in the IGBT module. They are connected to the ceramic copper clad laminate (DBC board) through welding technology to achieve diversion, and integrate the force and power in the application. Thermal stress and mechanical stress are usually encountered during the stress process, which leads to power cycle degradation and affects the life and long-term reliability of the IGBT module. Therefore, the welding strength of the power terminal has become an important indicator for evaluating the performance of the IGBT module. The welding strength is determined by the terminal Rally manifests.
  • the solder paste is usually printed on the DBC through a stencil, and then the chip is attached to the solder paste for a vacuum soldering. After a vacuum soldering, the solder paste where the chip is not placed will solidify, and finally the terminal Place it on top of the solidified solder paste for secondary vacuum soldering. At this time, the solidified solder paste will wet the DBC and the terminal during the heating process, forming an arc-shaped solder paste solder joint above the DBC and the bottom of the terminal.
  • the welding seam strength is the welding strength of the terminal.
  • the present invention provides a process method for improving the welding strength of IGBT module terminals, ensuring the welding strength between the power terminal and the DBC board, improving the terminal tension, and ensuring the climbing height and sufficient height of the solder paste at the terminal The amount of solder paste improves the connection strength of the terminal solder joints.
  • a process method for improving the welding strength of IGBT module terminals includes the following steps:
  • DBC board printing Place a steel mesh with several meshes on the front of the DBC board, and perform initial solder paste screen printing on the DBC board at the mesh position through the steel mesh;
  • One-time vacuum welding One vacuum welding is performed on the patched DBC board through a vacuum furnace, so that the IGBT chip and FRD chip are respectively soldered with the initial solder paste in contact, and the remaining initial solder paste of the IGBT chip and FRD chip is not placed The area of solidified solder paste;
  • Terminal placement Place the power terminal above the subsequent solder paste in the solder paste area, and fix it by welding tooling;
  • Secondary vacuum welding Perform secondary vacuum welding through a vacuum furnace, so that the power terminal is welded with the initial solder paste and subsequent solder paste.
  • the thickness of the steel mesh is 0.25 mm, and the shape of the mesh is rectangular.
  • the size of the mesh at the IGBT chip patch is between 75% and 80% of the area of the IGBT chip; the mesh at the FRD chip patch The size of the hole is between 75% and 80% of the FRD chip area.
  • the number of meshes is 12, the IGBT chip and the FRD chip occupy 2 meshes respectively, and the initial solder paste at the remaining 8 meshes solidifies Form 8 solder paste areas.
  • the amount of solder paste after the application is between 0.2 and 0.3 g.
  • the time of one vacuum welding is 40 minutes, and the temperature is 285°C.
  • the time of the second vacuum welding is 40 minutes, and the temperature is 285°C.
  • the present invention increases the solder paste content at the power terminal, improves the connection strength of the power terminal solder joint, and improves the reliability of the IGBT product; the subsequent solder paste of the new point has strong activity and the subsequent solder paste
  • the adhesive force is large, the wetting effect is strong, and the coverage of the power terminal is increased, so that the welding strength of the power terminal is also enhanced; since a soldering area will be formed after a single soldering, there is no need to use a special fixture, and the solder paste can be manually applied
  • the method to increase the amount of solder paste is simple, the manufacturing efficiency is high, and the overall cost is low.
  • FIG. 1 is a schematic flow chart of a process method for improving the welding strength of IGBT module terminals provided in an embodiment of the present invention
  • step S1 is a schematic diagram of step S1 of the process method for improving the welding strength of IGBT module terminals provided in an embodiment of the present invention
  • FIG. 3 is a schematic diagram of steps S2, S3, and S4 of the process method for improving the welding strength of IGBT module terminals provided in an embodiment of the present invention
  • step S5 is a schematic diagram of step S5 of the process method for improving the welding strength of IGBT module terminals provided in an embodiment of the present invention.
  • a process method for improving the welding strength of IGBT module terminals includes the following steps:
  • DBC board 1 printing Place a steel mesh 2 with a number of meshes 20 on the front of the DBC board 1, and perform initial solder paste 3 on the DBC board 1 at the position of the mesh 20 through the steel mesh 2 Screen printing
  • S2 Patch: Place the IGBT chip 41 on top of one initial solder paste 3 printed on the screen, and place the FRD chip 42 on the other initial solder paste 3 printed on the screen;
  • Terminal placement Place the power terminal 6 above the subsequent solder paste 5 in the solder paste area 30, and fix it by welding tool 7;
  • S6 Secondary vacuum welding: Perform secondary vacuum welding through a vacuum furnace, so that the power terminal 6 is welded with the initial solder paste 3 and the subsequent solder paste 5 together.
  • a steel mesh 2 is placed on the front of the DBC board 1, and the initial solder paste 3 is screen-printed on the DBC board 1 through the steel mesh 2.
  • the steel mesh 2 is provided with a mesh 2020 with a thickness of 0.25 mm, the shape of the 12 meshes 20 is rectangular, and the size of the mesh 20 is between 75% and 80% of the chip area.
  • the IGBT chip 41 and FRD chip are pasted on the initial solder paste 3 of the screen printing; the DBC board 1 is placed in a vacuum furnace for one vacuum welding, and the time for one vacuum welding is 40min.
  • the temperature is 285° C.
  • the IGBT chip 41 and the FRD chip are welded together with the initial solder paste 3, and the initial solder paste 3 without the IGBT chip 41 and the FRD chip will solidify to form 8 solder paste areas 30 to be spotted.
  • Spot the subsequent solder paste 5 at the solder paste area 30 to be spotted, and the amount of the subsequent solder paste 5 is between 0.2-0.3 g.
  • the power terminal 6 is placed above the subsequent solder paste 5, fixed by the welding tool 7, and then placed in a vacuum furnace for secondary vacuum welding.
  • the time for secondary vacuum welding is 40 minutes and the temperature is 285 °C, solder the terminal and solder paste together, test the terminal tension, the tension value of a single terminal is greater than 40kg.
  • the tinning process is added, and the subsequent tin paste 5 is manually placed at the solidified initial tin paste 3, and the power terminal 6 is placed above the subsequent tin paste 5 for the second vacuum welding.
  • the increased solder ensures the activity of the solder paste and the amount of solder paste under the power terminal 6.
  • the solder paste will wet and spread at the bottom of the power terminal 6, then climb along the power terminal 6 and at the same time diffuse and wet with the solidified solder paste on the DBC board 1. Therefore, the climbing height of the solder paste at the power terminal 6 and a sufficient amount of solder paste are ensured, and finally the connection strength of the terminal solder joints can be improved.
  • solder paste 5 has a strong adhesion and a strong wetting effect, and the coverage of the power terminal 6 is increased, so that the welding strength of the power terminal 6 is also enhanced; since a soldering area will be formed after a single soldering, no special fixture is required.
  • the amount of solder paste is increased by manually applying solder paste, which is simple, has high manufacturing efficiency and low overall cost.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connection Of Batteries Or Terminals (AREA)

Abstract

一种提高IGBT模块端子焊接强度的工艺方法，将设有网孔（20）的钢网（2）放置于DBC板（1）的正面，通过钢网（2）对DBC板（1）于网孔（20）位置进行初始锡膏（3）网印；将IGBT芯片（41）贴片在网印的一个初始锡膏（3）上方，将FRD芯片（42）贴片在网印的另外一个初始锡膏（3）上方；对贴片完的DBC板（1）进行一次真空焊接，使IGBT芯片（41）和FRD芯片（42）分别与接触的初始锡膏（3）焊接在一起，剩余初始锡膏凝固形成点锡膏区域（30）；在点锡膏区域（30）的初始锡膏上方点后续锡膏（5）；将功率端子（6）放置在点锡膏区域（30）的后续锡膏（5）上方，通过焊接工装（7）进行固定；二次真空焊接，使功率端子（6）与初始锡膏（3）及后续锡膏（5）焊接在一起。提高端子拉力，保证锡膏在端子处的爬升高度和足够的锡膏量，提高端子焊点的连接强度。

Description

一种提高IGBT模块端子焊接强度的工艺方法 技术领域
本发明涉及一种提高IGBT模块端子焊接强度的工艺方法，属于印刷焊接技术领域。
背景技术
功率端子(简称“端子”)在IGBT模块中主要起到承担电极的作用，其通过焊接技术与陶瓷覆铜板(DBC板)相连从而实现导流，在应用中集受力与受电为一体，受力过程中通常会受到热应力和机械应力，导致功率循环退化，影响IGBT模块的寿命和长期可靠性，因此功率端子的焊接强度成为了评估IGBT模块性能的一项重要指标，焊接强度由端子拉力体现。
现有技术中，通常是将锡膏通过钢网印刷在DBC上方，然后将芯片贴在锡膏上进行一次真空焊接，在一次真空焊接后未放置芯片处的锡膏会进行凝固，最后将端子放置在凝固的锡膏上方进行二次真空焊接，此时，凝固的锡膏在加热过程中会对DBC和端子起润湿作用，在DBC上方和端子底部形成弧形的锡膏焊缝，此焊缝强度就是端子的焊接强度，采用此种方式进行焊接端子时，由于锡膏量会受到钢网厚度的影响，必须与芯片的锡膏需求量相匹配，不能提供端子足够的锡膏量，而且一次真空焊接后锡膏活性会大大下降，造成端子焊点强度较弱，影响IGBT模块的寿命和长期可靠性。
发明内容
本发明针对现有技术存在的不足，提供一种提高IGBT模块端子焊接强度的工艺方法，确保功率端子与DBC板之间的焊接强度，提高端子拉力，保 证锡膏在端子处的爬升高度和足够的锡膏量，提高端子焊点的连接强度。
本发明解决上述技术问题的技术方案如下：一种提高IGBT模块端子焊接强度的工艺方法，包括以下步骤：
1)DBC板印刷：将设有若干网孔的钢网放置于DBC板的正面，通过所述钢网对所述DBC板于所述网孔位置进行初始锡膏网印；
2)贴片：将IGBT芯片贴片在网印的一个初始锡膏上方，将FRD芯片贴片在网印的另外一个初始锡膏上方；
3)一次真空焊接：通过真空炉对贴片完的DBC板进行一次真空焊接，使IGBT芯片和FRD芯片分别与接触的初始锡膏焊接在一起，未放置IGBT芯片和FRD芯片的剩余初始锡膏凝固形成点锡膏区域；
4)点锡膏：在所述点锡膏区域的初始锡膏上方点后续锡膏；
5)端子放置：将功率端子放置在点锡膏区域的后续锡膏上方，通过焊接工装进行固定；
6)二次真空焊接：通过真空炉进行二次真空焊接，使所述功率端子与所述初始锡膏及后续锡膏焊接在一起。
作为提高IGBT模块端子焊接强度的工艺方法的优选方案，所述钢网的厚度为0.25mm，网孔的形状为矩形。
作为提高IGBT模块端子焊接强度的工艺方法的优选方案，所述IGBT芯片贴片处的网孔的大小处于所述IGBT芯片面积的75％～80％之间；所述FRD芯片贴片处的网孔的大小处于所述FRD芯片面积的75％～80％之间。
作为提高IGBT模块端子焊接强度的工艺方法的优选方案，所述网孔的数量为12个，所述IGBT芯片和FRD芯片分别占用2个网孔，剩余的8个网孔处的初始锡膏凝固形成8个点锡膏区域。
作为提高IGBT模块端子焊接强度的工艺方法的优选方案，所述步骤4)中，点后续锡膏量为0.2～0.3g之间。
作为提高IGBT模块端子焊接强度的工艺方法的优选方案，所述步骤3)中，一次真空焊接的时间为40min，温度为285℃。
作为提高IGBT模块端子焊接强度的工艺方法的优选方案，所述步骤6)中，二次真空焊接的时间为40min，温度为285℃。
作为提高IGBT模块端子焊接强度的工艺方法的优选方案，还包括步骤7)端子拉力测试：对所述功率端子进行拉力测试，单个所述功率端子的拉力值大于40kg。
本发明与传统的功率端子焊接工艺相比，通过增加功率端子处的锡膏含量，提高了功率端子焊点的连接强度，IGBT产品可靠性提高；新点的后续锡膏活性强，后续锡膏黏着力大，润湿效果强，对功率端子的覆盖面增大，从而使功率端子的焊接强度也增强；由于一次焊接后会形成待点锡区域，不需要使用专用的夹具，通过手动点锡膏的方式增加锡膏量，方式简单，制造效率高，综合成本低。
附图说明
为了更清楚地说明本发明的实施方式或现有技术中的技术方案，下面将对实施方式或现有技术描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是示例性的，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图引伸获得其它的实施附图。
本说明书所绘示的结构、比例、大小等，均仅用以配合说明书所揭示的内容，以供熟悉此技术的人士了解与阅读，并非用以限定本发明可实施的限定条件，故不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本发明所能产生的功效及所能达成的目的下，均应仍落在本发明所揭示的技术内容得能涵盖的范围内。
图1为本发明实施例中提供的提高IGBT模块端子焊接强度的工艺方法流程示意图；
图2为本发明实施例中提供的提高IGBT模块端子焊接强度的工艺方法步骤S1示意图；
图3为本发明实施例中提供的提高IGBT模块端子焊接强度的工艺方法步骤S2、S3、S4示意图；
图4为本发明实施例中提供的提高IGBT模块端子焊接强度的工艺方法步骤S5示意图。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本发明。但是本发明能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本发明内涵的情况下做类似改进，因此本发明不受下面公开的具体实施例的限制。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本发明。本文所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。
参见图1、图2、图3和图4，一种提高IGBT模块端子焊接强度的工艺方法，包括以下步骤：
S1：DBC板1印刷：将设有若干网孔20的钢网2放置于DBC板1的正面，通过所述钢网2对所述DBC板1于所述网孔20位置进行初始锡膏3网印；
S2：贴片：将IGBT芯片41贴片在网印的一个初始锡膏3上方，将FRD芯片贴片42在网印的另外一个初始锡膏3上方；
S3：一次真空焊接：通过真空炉对贴片完的DBC板1进行一次真空焊接，使IGBT芯片41和FRD芯片分别与接触的初始锡膏3焊接在一起，未放置IGBT芯片41和FRD芯片的剩余初始锡膏3凝固形成点锡膏区域30；
S4：点锡膏：在所述点锡膏区域30的初始锡膏3上方点后续锡膏5；
S5：端子放置：将功率端子6放置在点锡膏区域30的后续锡膏5上方，通过焊接工装7进行固定；
S6：二次真空焊接：通过真空炉进行二次真空焊接，使所述功率端子6与所述初始锡膏3及后续锡膏5焊接在一起。
具体的，以34mm的IGBT模块为例，具体的实施步骤如下：
如图2所示，DBC板1的正面放置钢网2，DBC板1通过钢网2网印初始锡膏3。其中钢网2上开设个网孔2020，厚度为0.25mm，所述12个网孔20的形状为矩形，网孔20的大小是芯片面积的75％-80％之间。
如图3所示，将IGBT芯片41和FRD芯片贴在网印的初始锡膏3上方；将贴片完的DBC板1放置在真空炉里进行一次真空焊接，一次真空焊接的时间为40min，温度为285℃，使IGBT芯片41和FRD芯片与初始锡膏3焊接在一起，同时未放置IGBT芯片41和FRD芯片的初始锡膏3会凝固形成8个待点锡膏区域30。在待点锡膏区域30处点后续锡膏5，后续锡膏5量在0.2-0.3g之间。
如图4所示，将功率端子6放置在后续锡膏5上方，通过焊接工装7进行固定，然后放置到真空炉里，进行二次真空焊接，二次真空焊接的时间为40min，温度为285℃，使端子与锡膏焊接在一起，测试端子拉力，单个端子的拉力值大于40kg。
本发明在一次真空焊接后，增加点锡工艺，通过手工方式在凝固的初始 锡膏3处再点后续锡膏5,功率端子6放置在点的后续锡膏5上方进行二次真空焊接，新增的焊料保证了功率端子6下方的锡膏活性和锡膏量，锡膏会在功率端子6底部润湿蔓延，然后沿功率端子6爬升并同时与DBC板1上凝固的锡膏扩散润湿，从而保证了锡膏在功率端子6处的爬升高度和足够的锡膏量，最终可提高端子焊点的连接强度。与传统的功率端子6焊接工艺相比，通过增加功率端子6处的锡膏含量，提高了功率端子6焊点的连接强度，IGBT产品可靠性提高；新点的后续锡膏5活性强，后续锡膏5黏着力大，润湿效果强，对功率端子6的覆盖面增大，从而使功率端子6的焊接强度也增强；由于一次焊接后会形成待点锡区域，不需要使用专用的夹具，通过手动点锡膏的方式增加锡膏量，方式简单，制造效率高，综合成本低。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (8)

  1. 一种提高IGBT模块端子焊接强度的工艺方法，其特征在于，包括以下步骤：
    1)DBC板印刷：将设有若干网孔的钢网放置于DBC板的正面，通过所述钢网对所述DBC板于所述网孔位置进行初始锡膏网印；
    2)贴片：将IGBT芯片贴片在网印的一个初始锡膏上方，将FRD芯片贴片在网印的另外一个初始锡膏上方；
    3)一次真空焊接：通过真空炉对贴片完的DBC板进行一次真空焊接，使IGBT芯片和FRD芯片分别与接触的初始锡膏焊接在一起，未放置IGBT芯片和FRD芯片的剩余初始锡膏凝固形成点锡膏区域；
    4)点锡膏：在所述点锡膏区域的初始锡膏上方点后续锡膏；
    5)端子放置：将功率端子放置在点锡膏区域的后续锡膏上方，通过焊接工装进行固定；
    6)二次真空焊接：通过真空炉进行二次真空焊接，使所述功率端子与所述初始锡膏及后续锡膏焊接在一起。
  2. 根据权利要求1所述的一种提高IGBT模块端子焊接强度的工艺方法，其特征在于，所述钢网的厚度为0.25mm，网孔的形状为矩形。
  3. 根据权利要求1所述的一种提高IGBT模块端子焊接强度的工艺方法，其特征在于，所述IGBT芯片贴片处的网孔的大小处于所述IGBT芯片面积的75％～80％之间；所述FRD芯片贴片处的网孔的大小处于所述FRD芯片面积的75％～80％之间。
  4. 根据权利要求1所述的一种提高IGBT模块端子焊接强度的工艺方法，其特征在于，所述网孔的数量为12个，所述IGBT芯片和FRD芯片分别占用2个网孔，剩余的8个网孔处的初始锡膏凝固形成8个点锡膏区域。
  5. 根据权利要求1所述的一种提高IGBT模块端子焊接强度的工艺方法，其特征在于，所述步骤4)中，点后续锡膏量为0.2～0.3g之间。
  6. 根据权利要求1所述的一种提高IGBT模块端子焊接强度的工艺方法，其特征在于，所述步骤3)中，一次真空焊接的时间为40min，温度为285℃。
  7. 根据权利要求1所述的一种提高IGBT模块端子焊接强度的工艺方法，其特征在于，所述步骤6)中，二次真空焊接的时间为40min，温度为285℃。
  8. 根据权利要求1所述的一种提高IGBT模块端子焊接强度的工艺方法，其特征在于，还包括步骤7)端子拉力测试：对所述功率端子进行拉力测试，单个所述功率端子的拉力值大于40kg。
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