WO2020253411A1 - Structure de conditionnement de module de puissance intelligent - Google Patents

Structure de conditionnement de module de puissance intelligent Download PDF

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Publication number
WO2020253411A1
WO2020253411A1 PCT/CN2020/089044 CN2020089044W WO2020253411A1 WO 2020253411 A1 WO2020253411 A1 WO 2020253411A1 CN 2020089044 W CN2020089044 W CN 2020089044W WO 2020253411 A1 WO2020253411 A1 WO 2020253411A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
built
packaging
packaging structure
smart power
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Application number
PCT/CN2020/089044
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English (en)
Chinese (zh)
Inventor
陈健
吴桢生
汤桂衡
杨轲
Original Assignee
深圳市汇川技术股份有限公司
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Application filed by 深圳市汇川技术股份有限公司 filed Critical 深圳市汇川技术股份有限公司
Publication of WO2020253411A1 publication Critical patent/WO2020253411A1/fr

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/10Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/165Containers

Definitions

  • the embodiment of the present invention relates to the technical field of power module packaging, in particular to a smart power module packaging structure.
  • IPM Intelligent Power Module
  • IPM uses a leaded copper lead frame as the packaging frame, and places the power circuit substrate and functional circuits in the form of integrated circuit chips on the packaging frame, and then wraps and cures with resin materials to form a hard plastic package
  • the packaging structure of the shell In this packaging method, the functional circuits exist in the form of integrated chips, which leads to higher requirements for assembly line automation and lower reusability. Small changes in the IPM structure often require major changes in the production line, resulting in rare IPM types, high costs, and difficulty. To meet the fierce competition and the need for more and more abundant industrial control product market.
  • the packaging structure often includes a power circuit substrate, a built-in functional circuit board, a package frame, and a package cover.
  • the package frame is first bonded to the power circuit board.
  • the packaging process of this packaging method is complicated and costly, and the built-in functional circuit board must be fixed on the packaging frame by bonding or jointing, so that the design of the built-in functional circuit board and the packaging frame must be coupled with each other, reducing The freedom of IPM design is improved.
  • the existing IPM packaging methods have higher requirements for the production line in the assembly process and low reuse.
  • Small changes in the IPM structure often require major changes in the production line, resulting in scarcity of IPM types, high costs, and difficulty in meeting fierce competition and increasing needs.
  • Abundant industrial control product market; or, the packaging process is complicated and the cost is high, which reduces the freedom of IPM design.
  • the purpose of the embodiments of the present invention is to provide a smart power module packaging structure to solve the problem that the assembly process in the prior art has high requirements on the production line and low reusability.
  • Small changes in the IPM structure often require small changes.
  • the major changes in the production line have led to the scarcity of IPM types and high costs, making it difficult to meet the fiercely competitive and increasingly demanding industrial control product market; or the packaging process is complicated and the cost is high, which reduces the freedom of IPM design.
  • a smart power module packaging structure including a smart power integrated unit and an integrally formed packaging shell, wherein:
  • the intelligent power integration unit includes a power circuit substrate, a built-in functional circuit board, and a plurality of connecting posts;
  • the built-in function circuit board is provided with a plurality of first through holes corresponding to the plurality of connecting posts, the The bottom ends of a plurality of connecting posts are fixed on the power circuit substrate, and the top ends of the plurality of connecting posts respectively pass through the built-in functional circuit board through the plurality of first through holes, and are connected to the corresponding The first through hole is fixedly connected to the built-in function circuit board, so that the built-in function circuit board is stacked on top of the power circuit board;
  • the packaging housing includes an installation cavity with an opening at the bottom, the smart power integration unit is installed in the installation cavity, and the power circuit substrate of the smart power integration unit is sealed at the bottom opening position of the installation cavity , Forming a closed packaging structure with the packaging shell.
  • the bottom of the side wall of the mounting cavity is provided with a stepped groove that matches with the power circuit substrate, and the power circuit substrate is fixed at the position of the stepped groove by bonding.
  • the plurality of connecting columns includes a first short connecting column and a second long connecting column, wherein:
  • the bottom end of the first short connecting column is fixed on the power circuit substrate, and the top end of the first short connecting column passes through the built-in function circuit board through the corresponding first through hole and no longer extends, and
  • the first short connecting post is fixedly connected to the built-in function circuit board at the corresponding first through hole;
  • the bottom end of the second long connecting column is fixed on the power circuit substrate, and the top end of the second long connecting column passes through the built-in functional circuit board through a corresponding first through hole and has an extension, and
  • the second long connecting post is fixedly connected to the built-in function circuit board at the corresponding first through hole;
  • a plurality of second through holes are opened on the upper surface of the packaging housing, and the number of the plurality of second through holes is greater than or equal to the number of the second long connecting columns, and the extension portion of the second long connecting columns Passing through the upper surface of the packaging casing through the corresponding second through hole.
  • the plurality of connection posts includes a first short connection post, the bottom end of the first short connection post is fixed on the power circuit substrate, and the top end of the first short connection post passes The corresponding first through hole does not extend after passing through the built-in function circuit board, and the first short connecting post is fixedly connected to the built-in function circuit board at the corresponding first through hole;
  • the smart power module packaging structure further includes a plurality of third long connecting posts, the bottom ends of the third long connecting posts are fixed on the power circuit substrate, and the top ends of the third long connecting posts avoid the built-in Functional circuit board with extensions;
  • a plurality of second through holes are opened on the upper surface of the packaging housing, and the number of the plurality of second through holes is greater than or equal to the number of the third long connecting pillars, and the extension portion of the third long connecting pillar Passing through the upper surface of the packaging shell through the corresponding second through hole.
  • the packaging shell is provided with a first glue injection port
  • the smart power packaging structure further includes insulating silicone, and after the packaging shell and the smart power integration unit are assembled, Fill the cavity formed by assembling the packaging shell and the smart power integration unit with the insulating silicone through the first glue injection port.
  • the built-in functional circuit board is provided with a second glue injection injection port, and the insulating silicone is injected into the built-in functional circuit board and the power circuit substrate through the second glue injection injection port The space between.
  • a connector is welded on the built-in functional circuit board, a connector extension port is opened on the packaging shell, and the connector extends out of the packaging shell through the connector extension port
  • the body interacts with external circuits.
  • two sides of the packaging shell are respectively provided with assembling holes for fixing the smart power module packaging structure on an external heat dissipation plane through a fastener.
  • the deformation suppression cylinder further includes a deformation suppression cylinder, the top end of the deformation suppression cylinder abuts against the central part of the inner surface of the upper top of the packaging shell, and the bottom end of the deformation suppression cylinder passes through the The built-in functional circuit board abuts against the upper surface of the power circuit board.
  • the functional circuit exists in the form of a built-in functional circuit board, and the assembly process does not require special process processing, and has low requirements on the production line, making the production line high in reusability and reducing the investment in the production line Cost; because the built-in functional circuit board is fixed above the power circuit substrate through the connecting column, there is no need for coupling design between the built-in functional circuit board and the package casing, thereby increasing the freedom of design of the intelligent power integrated unit and improving the packaging structure Space utilization,
  • the shell of the smart function module can be designed as an integrated package shell, reducing the shell The number of components simplifies the packaging process and reduces costs.
  • FIG. 1 is an exploded view of a smart power module packaging structure provided by an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a smart power integration unit in a smart power module packaging structure provided by an embodiment of the present invention in a specific implementation manner;
  • FIG. 3 is a schematic structural diagram of a smart power integration unit in another specific implementation manner in the smart power module packaging structure provided by an embodiment of the present invention
  • FIG. 4 is a schematic structural diagram of a stepped groove opened at the bottom of the side wall of the packaging case in the smart power module packaging structure provided by an embodiment of the present invention
  • FIG. 5 is a schematic cross-sectional view of the smart power module packaging structure provided by an embodiment of the present invention after packaging is completed;
  • FIG. 6 is a schematic structural diagram of the smart power module packaging structure provided by an embodiment of the present invention after packaging is completed;
  • FIG. 7 is an exploded view of a smart power module packaging structure provided by another embodiment of the present invention.
  • FIG. 8 is a schematic diagram of the matching relationship between the deformation suppression cylinder and the packaging shell in the smart power module packaging structure provided by another embodiment of the present invention.
  • FIG. 9 is a schematic cross-sectional view of the smart power module packaging structure provided by another embodiment of the present invention after packaging is completed.
  • Fig. 1 is an exploded view of a smart power module packaging structure provided by an embodiment of the present invention. For ease of description, only the parts related to this embodiment are shown.
  • the smart power module packaging structure includes a smart power integrated unit 1 and an integrally formed packaging housing 2, in which:
  • the smart power integration unit 1 includes a power circuit board 11, a built-in functional circuit board 12, and a plurality of connecting posts 13 for signal transmission and fixing the built-in functional circuit board 12;
  • the built-in functional circuit board 12 is provided with A plurality of first through holes (not shown in the figure) corresponding to the plurality of connecting posts 13, the bottom ends of the plurality of connecting posts 13 are all fixed on the power circuit substrate 11, the plurality of connecting posts
  • the top ends of 13 respectively pass through the built-in function circuit board 12 through the plurality of first through holes, and are fixedly connected to the built-in function circuit board 12 at the corresponding first through holes, so that the built-in function
  • the functional circuit board 12 is stacked on top of the power circuit substrate 11;
  • the packaging housing 2 includes a mounting cavity with an opening at the bottom, the smart power integration unit 1 is installed in the mounting cavity, and the power circuit substrate 11 of the smart power integration unit 1 is sealed in the mounting cavity. At the bottom opening position, it forms a closed packaging structure with the packaging shell 2.
  • the power circuit substrate 11 in the smart power integrated unit 1 includes, but is not limited to, an aluminum-based resin copper clad laminate, a copper-based resin copper clad laminate or a double-sided copper-clad ceramic substrate, and the power circuit substrate 11 is welded with a function It is not limited to power switching devices such as inversion, rectification, braking, buffering, and temperature and electrical signal sampling devices.
  • the functions welded on the built-in function circuit board 12 are not limited to discrete functional devices such as power supply, signal sampling and conditioning, protection, driving, and micro-control unit operation.
  • the bottom ends of the plurality of connecting posts 13 are fixed on the power circuit substrate 11 by welding, and the plurality of connecting posts 13 are welded and/or crimped at their corresponding first through holes.
  • the method realizes fixing and signal transmission with the built-in function circuit board 12.
  • multiple built-in functional circuit substrates can be stacked on the multiple connecting posts.
  • multiple connecting posts 13 are fixed on the power circuit board 11 by welding, and are fixed and signal transmitted with at least one built-in functional circuit board 12 by welding and/or crimping, and connection can be realized.
  • the stability of the connection between the post and the power circuit board 11 and the built-in functional circuit board 12, and the power circuit board 11 and the built-in functional circuit board 12 can realize signal multiplexing based on the connection post 13; in addition, since the power switching devices are all welded It is fixed on the power circuit substrate 11, so that the connecting post can be assembled together with the power switching device, which simplifies the assembly process.
  • the plurality of connecting pillars 13 includes a first short connecting pillar 131 and a second long connecting pillar 132, wherein:
  • the bottom end of the first short connecting column 131 is fixed on the power circuit substrate 11, and the top end of the first connecting column 131 passes through the built-in function circuit board 12 through the corresponding first through hole. Extend, and the first connecting post 131 is fixedly connected to the built-in function circuit board 12 at the corresponding first through hole;
  • the bottom end of the second long connecting column 132 is fixed on the power circuit substrate 11, and the top end of the second long connecting column 132 penetrates the built-in function circuit board 12 through the corresponding first through hole and has Extension portion, and the second long connecting post 132 is fixedly connected to the built-in functional circuit board 12 at the corresponding first through hole;
  • the upper surface of the packaging casing 2 is provided with a plurality of second through holes 21, the number of the plurality of second through holes 21 is greater than or equal to the number of the second long connecting posts 132, and the second long connecting The extension portion of the pillar 132 penetrates the upper surface of the packaging case 2 through the second through hole 21 corresponding thereto.
  • the bottom end of the first short connecting post 131 is fixed on the power circuit substrate 11 by welding, and the first short connecting post 131 is in its corresponding first through hole.
  • the location is welded or crimped with the built-in functional circuit board 12 to achieve signal transmission and functional multiplexing with fixed structure.
  • the bottom end of the second long connecting column 132 is fixed on the power circuit substrate 11 by welding, and the top end of the second long connecting column 132 is in its corresponding through hole.
  • the location is welded or crimped with the built-in functional circuit board 12 to achieve signal transmission and functional multiplexing with fixed structure.
  • the top ends of the first short connecting post 131 and the second long connecting post 132 may be set in a needle-like shape, which is convenient for the first short connecting post 131 and the second The long connecting post 132 quickly passes through the first through hole on the built-in function circuit board 12, which is convenient for assembly.
  • the appearance realization form of the first short connecting column 131 and the second long connecting column 132 is not limited by a certain fixed shape.
  • the first short connecting column Specific implementation forms of 131 and the second long connecting post 132 include but are not limited to cylindrical terminals, regular polygon terminals and/or flat terminals.
  • the number of second through holes 21 opened on the upper surface of the packaging housing 2 is greater than the number of the second long connecting posts 132, so that the packaging housing 2 can be compatible with multiple different Types of power circuit substrates 11 need to extend the long terminals.
  • the number of second through holes 21 opened on the upper surface of the package housing 2 may also be equal to the number of second through holes welded on the power circuit substrate 11.
  • the number of long connecting posts 132 may also be equal to the number of second through holes welded on the power circuit substrate 11.
  • the plurality of connecting pillars 13 includes a first short connecting pillar 131, and the bottom end of the first short connecting pillar 131 is fixed to the power circuit substrate 11, the top end of the first short connecting post 131 passes through the built-in function circuit board 12 through the corresponding first through hole and no longer extends, and the first short connecting post 131 is at its corresponding first through hole.
  • a through hole is fixedly connected to the built-in function circuit board 12;
  • the smart power module packaging structure further includes a plurality of third long connecting posts 133 for signal transmission, the bottom end of the third long connecting posts 133 is fixed on the power circuit substrate 11, and the third long connecting The top end of the pillar 133 avoids the built-in function circuit board 12 and has an extension;
  • the upper surface of the packaging housing 2 is provided with a plurality of second through holes 21, the number of the plurality of second through holes 21 is greater than or equal to the number of the third long connecting posts 133, the third long connecting The extension part of the pillar 133 penetrates the upper surface of the packaging case 2 through the second through hole 21 corresponding thereto.
  • the bottom end of the first short connecting post 131 is fixed on the power circuit substrate 11 by welding, and the first short connecting post 131 is in its corresponding first through hole.
  • the location is welded or crimped with the built-in functional circuit board 12 to achieve signal transmission and functional multiplexing with fixed structure.
  • the area of the built-in function circuit board 12 is smaller than the area of the power circuit substrate 11, and the third long connecting posts 133 are respectively arranged on the power circuit substrate 11 near the surrounding positions.
  • the bottom end of the third long connecting post 133 is fixed to the power circuit board 11 by welding, and the top end of the third long connecting post 133 passes through the built-in function circuit board 12 after avoiding the
  • the second through hole 21 on the packaging shell 2 extends out of the packaging shell 2 for signal interaction with external circuits.
  • the size of the second through hole 21 opened on the upper surface of the package housing 2 is equal to the cross-sectional area of the extension of the third cylinder, so that the third cylinder The extension part just extends out of the package housing 2 through the corresponding second through hole 21 for signal interaction with the external circuit.
  • the number of second through holes 21 opened on the upper surface of the packaging housing 2 is greater than the number of the third long connecting posts 133, so that the packaging housing 2 can be compatible with multiple different Types of power circuit substrates 11 need to extend the long terminals.
  • the number of second through holes 21 opened on the upper surface of the package housing 2 may also be equal to the number of third through holes welded on the power circuit substrate 11.
  • the number of long connecting posts 133 may also be equal to the number of third through holes welded on the power circuit substrate 11.
  • the appearance and realization form of the first short connecting column 131 and the third long connecting column 133 are not limited by a certain fixed shape.
  • the first short connecting column The specific implementation forms of 131 and the third long connecting post 133 include but are not limited to cylindrical terminals, regular polygon terminals and/or flat terminals.
  • the packaging housing 2 is provided with a first glue injection port 22, the smart power packaging structure further includes insulating silicone, the packaging housing 2 and the smart power integrated unit 1
  • the insulating silicone rubber is injected into the cavity formed by the assembly of the packaging shell 2 and the smart power integrated unit 1 through the first glue injection port 22.
  • the built-in function circuit board 12 is provided with a second glue injection port 122, and the insulating silicone is filled between the built-in function circuit board 12 and the power circuit substrate 11 through the second glue injection port 122 Space. There is a gap between the built-in functional circuit board 12 and the inner surface of the side wall of the packaging shell 2, and the insulating silicone gel overflows the packaging shell 2 and the smart power integrated unit 1 through the gap.
  • the insulating silica gel can overflow the packaging shell 2 and the smart power integrated module through the first glue injection port 22, the second glue injection port 122, and the gap.
  • the space in the sealed cavity formed after packaging plays a role of insulation protection and dust prevention for the functional circuit board and the built-in functional circuit board 12.
  • a connector 123 is welded on the built-in functional circuit board 12, and a connector extension port 23 is opened on the packaging housing 2, and the connector 123 passes through the connector extension port. 23 extends out of the encapsulation shell 2 for signal interaction with external circuits.
  • two sides of the packaging housing 2 are respectively provided with assembly holes 24 for fixing the smart power module packaging structure on an external heat dissipation plane through a locking member.
  • the locking member is a screw.
  • the bottom of the side wall of the mounting cavity is provided with a stepped groove 25 that cooperates with the power circuit substrate 11, and the power circuit substrate 11 is fixed to the stepped groove by bonding. 25 position.
  • the surface of the stepped groove 25 is coated with silicon rubber, and the power circuit substrate 11 is bonded to the stepped groove 25 through the silicon rubber.
  • the assembly process does not require special process processing, and has low requirements on the production line, making the production line highly reusable.
  • the investment cost of the production line is reduced; since the built-in functional circuit board 12 is fixed above the power circuit substrate 11 through the connecting posts, no coupling design is required between the built-in functional circuit board 12 and the package housing 2, thereby increasing the design of the intelligent power integrated unit 1
  • the degree of freedom of the packaging structure is improved, and the space utilization rate of the packaging structure is improved, which is beneficial to reduce the volume of the packaging structure and increase the power density of the packaging structure.
  • the shell of the module can be designed as an integrally formed packaging shell 2, which reduces the number of shell components, simplifies the packaging process and reduces the cost.
  • FIG. 7 is a schematic structural diagram of a smart power module packaging structure provided by another embodiment of the present invention. For convenience of description, only the parts related to this embodiment are shown.
  • the smart power module packaging structure provided by this embodiment further includes a deformation suppression column 14.
  • the top end of the deformation suppression column 14 and the upper top of the packaging housing 2 The central part of the surface abuts, and the bottom end of the deformation suppression column 14 passes through the built-in function circuit board 12 and then abuts the upper surface of the power circuit board 11.
  • the built-in function circuit board 12 is provided with an extension opening for the deformation suppression column 14, and the bottom end of the deformation suppression column 14 abuts on the upper surface of the power circuit board 11.
  • the top end of the suppression cylinder 14 passes through the built-in functional circuit board 12 through the deformation suppression cylinder extension opening 124 and abuts against the inner surface of the top shell of the package housing 2 (as shown in FIG. 8), such that When the smart power package structure is locked to the external heat dissipation plane by a screw or other locking member, the deformation suppression column 14 can play a role in suppressing the deformation of the power circuit substrate 11.
  • FIG. 9 for a cross-sectional schematic diagram of the deformation suppression column 14 after the completion of the packaging of the power circuit substrate 11, the built-in functional circuit board 12 and the packaging housing 2.
  • the intelligent power integration unit 1 in this embodiment further includes a plurality of limit support columns with a limit support platform, and the built-in function circuit board 12 is provided with a plurality of limit supports
  • the support columns correspond to the third through holes one to one; the bottom ends of the plurality of limit support columns are fixed on the power circuit substrate 11, and the top ends of the plurality of limit support columns pass through the corresponding third Through holes pass through the built-in function circuit board 12, so that the limit support platforms of the plurality of limit support columns respectively abut against the bottom surface of the built-in function circuit board 12 to perform Limiting and supporting, and the plurality of limit supporting pillars are respectively fixedly connected to the built-in function circuit board 12 at the corresponding third through holes.
  • the limit support column plays a role of limit, support and fixation on the built-in power circuit board.
  • the bottom ends of the plurality of limit support pillars are all welded to the power circuit substrate 11, and the plurality of limit support pillars are respectively located at their corresponding second through holes 21 It is fixed to the built-in functional circuit board 12 by welding and/or crimping.
  • the smart power integrated unit 1 includes four limit support columns, and the four limit support columns are respectively distributed at four corner positions of the power circuit substrate 11, and the The bottom ends of the four limit support columns are respectively welded at the four corner positions on the upper surface of the power circuit substrate 11, and the top ends respectively pass through the built-in function through four third through holes opened on the built-in function circuit board 12 Circuit board 12, and the limit support platforms of the four limit support columns respectively abut against the bottom surface of the built-in function circuit board 12 to limit and support the built-in function circuit board 12, and The four limit support pillars are respectively fixed to the built-in functional circuit board 12 at the corresponding third through holes by welding and/or crimping.
  • the circuit board packaging structure of the smart power integrated unit 1 provided in this embodiment is provided between the power circuit substrate 11 and the built-in functional circuit board for limiting, supporting and fixing the built-in functional circuit board 12.
  • the limit support column which can further improve the stability of the built-in function circuit board 12.
  • the smart power module packaging structure provided in this embodiment is further provided with a deformation suppression column 14, and the bottom end of the deformation suppression column 14 abuts against the upper surface of the power circuit substrate 11, and the top end passes through the built-in
  • the functional circuit board 12 then abuts against the inner surface of the top shell of the package housing 2, so that when the smart power module package structure is installed on the external heat dissipation plane through the locking member, the deformation of the power circuit substrate 11 can be suppressed, which further improves The reliability of the packaging structure of the smart power module; in addition, because the power circuit substrate 11 and the built-in function circuit substrate are also provided with a limit for limiting, supporting and fixing the built-in function circuit board 12 The supporting column can further improve the stability of the packaging of the built-in functional circuit board 12.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne une structure de conditionnement de module de puissance intelligent, comprenant une unité d'intégration de puissance intelligente et un boîtier de conditionnement formés d'un seul tenant, l'unité d'intégration de puissance intelligente comprenant un substrat de circuit de puissance, une carte de circuit fonctionnel intégrée et une pluralité de colonnes de connexion ; la carte de circuit fonctionnel intégrée comporte une pluralité de premiers trous traversants correspondant à la pluralité de colonnes de connexion, les extrémités inférieures de la pluralité de colonnes de connexion sont toutes fixées sur le substrat de circuit de puissance, les extrémités supérieures de la pluralité de colonnes de liaison pénètrent respectivement dans la carte de circuit fonctionnel intégrée au moyen de la pluralité de premiers trous traversants et sont reliées de manière fixe à la carte de circuit fonctionnel intégrée au niveau des premiers trous traversants correspondant aux colonnes de connexion ; le boîtier de conditionnement comprend une cavité de montage ayant une ouverture au niveau du fond, l'unité d'intégration de puissance intelligente est montée dans la cavité de montage, et le substrat de circuit de puissance de l'unité d'intégration de puissance intelligent est branché au niveau de la position d'ouverture au fond de la cavité de montage et forme une structure de conditionnement fermée avec le boîtier de conditionnement. La structure réduit les coûts d'entrée d'une ligne de production, améliore le taux d'utilisation d'espace et le degré de liberté de conception de l'unité d'intégration de puissance intelligente, et simplifie la structure de boîtier de conditionnement et le processus de conditionnement.
PCT/CN2020/089044 2019-06-20 2020-05-07 Structure de conditionnement de module de puissance intelligent WO2020253411A1 (fr)

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CN201910536902.XA CN110197824A (zh) 2019-06-20 2019-06-20 智能功率模块封装结构
CN201910536902.X 2019-06-20

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WO2020253411A1 true WO2020253411A1 (fr) 2020-12-24

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CN110213929A (zh) * 2019-06-20 2019-09-06 深圳市汇川技术股份有限公司 智能功率模块电路板封装结构
CN110197824A (zh) * 2019-06-20 2019-09-03 深圳市汇川技术股份有限公司 智能功率模块封装结构
CN113113378B (zh) * 2021-02-28 2022-08-09 华为技术有限公司 一种治具

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