CN110197824A - 智能功率模块封装结构 - Google Patents
智能功率模块封装结构 Download PDFInfo
- Publication number
- CN110197824A CN110197824A CN201910536902.XA CN201910536902A CN110197824A CN 110197824 A CN110197824 A CN 110197824A CN 201910536902 A CN201910536902 A CN 201910536902A CN 110197824 A CN110197824 A CN 110197824A
- Authority
- CN
- China
- Prior art keywords
- build
- connecting column
- circuit board
- intelligent power
- function circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- 238000009434 installation Methods 0.000 claims abstract description 14
- 238000009413 insulation Methods 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000741 silica gel Substances 0.000 claims description 13
- 229910002027 silica gel Inorganic materials 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 5
- 230000003993 interaction Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000012858 packaging process Methods 0.000 abstract description 5
- 238000005538 encapsulation Methods 0.000 description 14
- 238000003466 welding Methods 0.000 description 14
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
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- 239000002360 explosive Substances 0.000 description 3
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- 241000237983 Trochidae Species 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012260 resinous material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910536902.XA CN110197824A (zh) | 2019-06-20 | 2019-06-20 | 智能功率模块封装结构 |
| PCT/CN2020/089044 WO2020253411A1 (fr) | 2019-06-20 | 2020-05-07 | Structure de conditionnement de module de puissance intelligent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910536902.XA CN110197824A (zh) | 2019-06-20 | 2019-06-20 | 智能功率模块封装结构 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110197824A true CN110197824A (zh) | 2019-09-03 |
Family
ID=67754887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910536902.XA Pending CN110197824A (zh) | 2019-06-20 | 2019-06-20 | 智能功率模块封装结构 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110197824A (fr) |
| WO (1) | WO2020253411A1 (fr) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020253410A1 (fr) * | 2019-06-20 | 2020-12-24 | 深圳市汇川技术股份有限公司 | Structure d'encapsulation pour carte de circuit imprimé de module de puissance intelligent |
| WO2020253411A1 (fr) * | 2019-06-20 | 2020-12-24 | 深圳市汇川技术股份有限公司 | Structure de conditionnement de module de puissance intelligent |
| CN113113378A (zh) * | 2021-02-28 | 2021-07-13 | 华为技术有限公司 | 一种治具 |
| US20230139725A1 (en) * | 2021-11-04 | 2023-05-04 | Lite-On Singapore Pte Ltd | Power module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101419965A (zh) * | 2007-09-27 | 2009-04-29 | 三洋电机株式会社 | 电路装置及其制造方法 |
| CN102822967A (zh) * | 2010-04-01 | 2012-12-12 | 日立汽车系统株式会社 | 功率模块、以及具备功率模块的电力变换装置 |
| CN103023281A (zh) * | 2013-01-04 | 2013-04-03 | 江苏宏微科技股份有限公司 | 装配式功率模块 |
| CN104810328A (zh) * | 2014-01-28 | 2015-07-29 | 台达电子企业管理（上海）有限公司 | 封装外壳及具有该封装外壳的功率模块 |
| CN106611758A (zh) * | 2015-10-23 | 2017-05-03 | 台达电子工业股份有限公司 | 整合功率模块封装结构 |
| CN210073845U (zh) * | 2019-06-20 | 2020-02-14 | 深圳市汇川技术股份有限公司 | 智能功率模块封装结构 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103219870A (zh) * | 2013-02-25 | 2013-07-24 | 周旺龙 | 一种电动车控制器功率单元的铝电解电容器集束散热方式 |
| CN104602479A (zh) * | 2015-01-22 | 2015-05-06 | 广州金升阳科技有限公司 | 带散热基板的电源模块的制造方法及其外壳、组装半成品、电源模块 |
| US9431311B1 (en) * | 2015-02-19 | 2016-08-30 | Semiconductor Components Industries, Llc | Semiconductor package with elastic coupler and related methods |
| CN207134510U (zh) * | 2017-07-13 | 2018-03-23 | 博大科技股份有限公司 | 电子装置结构 |
| CN110197824A (zh) * | 2019-06-20 | 2019-09-03 | 深圳市汇川技术股份有限公司 | 智能功率模块封装结构 |
-
2019
- 2019-06-20 CN CN201910536902.XA patent/CN110197824A/zh active Pending
-
2020
- 2020-05-07 WO PCT/CN2020/089044 patent/WO2020253411A1/fr active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101419965A (zh) * | 2007-09-27 | 2009-04-29 | 三洋电机株式会社 | 电路装置及其制造方法 |
| CN102822967A (zh) * | 2010-04-01 | 2012-12-12 | 日立汽车系统株式会社 | 功率模块、以及具备功率模块的电力变换装置 |
| CN103023281A (zh) * | 2013-01-04 | 2013-04-03 | 江苏宏微科技股份有限公司 | 装配式功率模块 |
| CN104810328A (zh) * | 2014-01-28 | 2015-07-29 | 台达电子企业管理（上海）有限公司 | 封装外壳及具有该封装外壳的功率模块 |
| CN106611758A (zh) * | 2015-10-23 | 2017-05-03 | 台达电子工业股份有限公司 | 整合功率模块封装结构 |
| CN210073845U (zh) * | 2019-06-20 | 2020-02-14 | 深圳市汇川技术股份有限公司 | 智能功率模块封装结构 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020253410A1 (fr) * | 2019-06-20 | 2020-12-24 | 深圳市汇川技术股份有限公司 | Structure d'encapsulation pour carte de circuit imprimé de module de puissance intelligent |
| WO2020253411A1 (fr) * | 2019-06-20 | 2020-12-24 | 深圳市汇川技术股份有限公司 | Structure de conditionnement de module de puissance intelligent |
| CN113113378A (zh) * | 2021-02-28 | 2021-07-13 | 华为技术有限公司 | 一种治具 |
| US20230139725A1 (en) * | 2021-11-04 | 2023-05-04 | Lite-On Singapore Pte Ltd | Power module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020253411A1 (fr) | 2020-12-24 |
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