CN110197824A - Intelligent power module encapsulating structure - Google Patents
Intelligent power module encapsulating structure Download PDFInfo
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- CN110197824A CN110197824A CN201910536902.XA CN201910536902A CN110197824A CN 110197824 A CN110197824 A CN 110197824A CN 201910536902 A CN201910536902 A CN 201910536902A CN 110197824 A CN110197824 A CN 110197824A
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- Prior art keywords
- build
- connecting column
- circuit board
- intelligent power
- function circuit
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- 239000000758 substrate Substances 0.000 claims abstract description 77
- 238000009434 installation Methods 0.000 claims abstract description 14
- 238000009413 insulation Methods 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000741 silica gel Substances 0.000 claims description 13
- 229910002027 silica gel Inorganic materials 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 5
- 230000003993 interaction Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 238000012858 packaging process Methods 0.000 abstract description 5
- 238000005538 encapsulation Methods 0.000 description 14
- 238000003466 welding Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000002788 crimping Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 230000008054 signal transmission Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000002360 explosive Substances 0.000 description 3
- 230000002401 inhibitory effect Effects 0.000 description 3
- 230000005764 inhibitory process Effects 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 241000237983 Trochidae Species 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012260 resinous material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000010977 unit operation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
A kind of intelligent power module encapsulating structure, including intelligent power integrated unit and integrally formed encapsulating housing, intelligent power integrated unit include power circuit substrate, build-in function circuit board and multiple connecting columns；Multiple first through hole corresponding with multiple connecting columns are offered on build-in function circuit board, the bottom end of multiple connecting columns is each attached on power circuit substrate, the top of multiple connecting columns passes through build-in function circuit board by multiple first through hole respectively, and is fixedly connected at corresponding first through hole with build-in function circuit board；Encapsulating housing includes the installation cavity that bottom has opening, and intelligent power integrated unit is mounted in installation cavity, and the power circuit substrate of intelligent power integrated unit blocks at the bottom opening position of installation cavity, forms closed encapsulating structure with encapsulating housing.This configuration reduces the input costs of production line, improve the space utilization rate and design freedom of intelligent power integrated unit, simplify encapsulated shell structural and packaging process.
Description
Technical field
The present embodiments relate to power module package technical field more particularly to a kind of intelligent power module encapsulation knots
Structure.
Background technique
Intelligent power module (Intelligent Power Module, IPM) integrates on the basis of conventional power module
Functional circuit unit is widely used in household electrical appliances, work because of its high integration, high reliability and simple external support circuit
The fields such as industry transmission.The packaged type of existing IPM includes two kinds:
A kind of packaged type is, IPM using the copper conductor frame with pin as packaging frame, by power circuit substrate and
With ic core sheet form, there are functional circuits to be placed on packaging frame, after then wrapping up and solidify by resinous material
Form the encapsulating structure of hard plastic shell.Functional circuit exists in the form of integrated chip in this packaged type, causes to fill
More demanding to production line automation with process, reusing degree is lower, and minor modifications generally require the big change of production line in IPM structure
More, cause IPM type rare, it is with high costs, it is difficult to meet dog-eat-dog and need industrial control product market more abundant.
Another packaged type is that functional circuit exists in the form of built-in function circuit board, and encapsulating structure often wraps
Power circuit substrate, build-in function circuit board, encapsulation framework and encapsulation lid are included, encapsulation framework is first and power circuit substrate is viscous
It connects, then build-in function circuit board is fixed in encapsulation framework in such a way that bonding or the fourth of the twelve Earthly Branches connect, then encapsulating solidifies, and will encapsulate
Lid is connect and is fixed on encapsulating housing by bonding or the fourth of the twelve Earthly Branches, forms the stacked encapsulating structure of storehouse.This packaged type encapsulates work
Sequence complexity, higher cost, and build-in function circuit board has to be fixed in encapsulation framework in such a way that bonding or the fourth of the twelve Earthly Branches connect, and makes
The design for obtaining build-in function circuit board and encapsulation framework must be mutually coupled, and reduce the freedom degree of IPM design.
To sum up, that there are assembling process is more demanding to production line for existing IPM packaged type, and reusing degree is lower, IPM structure
Upper minor modifications generally require the big change of production line, cause IPM type rare, with high costs, it is difficult to meet dog-eat-dog and need
It will industrial control product market more abundant；Alternatively, packaging process is complicated, higher cost, asking for the freedom degree of IPM design is reduced
Topic.
Summary of the invention
In view of this, the embodiment of the present invention is designed to provide a kind of intelligent power module encapsulating structure, on solving
State that assembling process existing in the prior art is more demanding to production line, and reusing degree is lower, minor modifications often need in IPM structure
The big change of production line is wanted, causes IPM type rare, it is with high costs, it is difficult to meet dog-eat-dog and need industry control more abundant
Product market；Alternatively, packaging process is complicated, higher cost, the problem of reducing the freedom degree of IPM design.
It is as follows that the embodiment of the present invention solves technical solution used by above-mentioned technical problem:
According to an aspect of an embodiment of the present invention, a kind of intelligent power module encapsulating structure, including intelligent power are provided
Integrated unit and integrally formed encapsulating housing, in which:
The intelligent power integrated unit includes power circuit substrate, build-in function circuit board and for multiple connections
Column；Multiple first through hole corresponding with the multiple connecting column, the multiple connection are offered on the build-in function circuit board
The bottom end of column is each attached on the power circuit substrate, and it is logical that the top of the multiple connecting column passes through the multiple first respectively
Hole passes through the build-in function circuit board, and fixes at the corresponding first through hole with the build-in function circuit board
Connection is layered in the build-in function circuit board storehouse above the power circuit substrate；
The encapsulating housing includes the installation cavity that bottom has opening, and the intelligent power integrated unit is mounted on the peace
In behaveing affectedly, and the power circuit substrate of the intelligent power integrated unit blocks at the bottom opening position of the installation cavity,
Closed encapsulating structure is formed with the encapsulating housing.
Based on the above technical solution, the bottom of the installation cavity side wall is provided with and the power circuit substrate phase
Cooperate step-like recesses, the power circuit substrate is fixed at step-like recesses position by bonding way.
Based on the above technical solution, the multiple connecting column includes the first short connecting column and the second long connecting column,
Wherein:
The bottom end of the first short connecting column is fixed on the power circuit substrate, the top of the first short connecting column
It is not re-extended after passing through the build-in function circuit board by corresponding first through hole, and the first short connecting column is at it
It is fixedly connected at corresponding first through hole with the build-in function circuit board；
The bottom end of the second long connecting column is fixed on the power circuit substrate, the top of the second long connecting column
The build-in function circuit board is passed through by corresponding first through hole and there is extension, and the second long connecting column exists
It is fixedly connected at first through hole corresponding to it with the build-in function circuit board；
The upper surface of the encapsulating housing offers multiple second through-holes, and the quantity of the multiple second through-hole is greater than or waits
It is worn in the extension of the quantity of the described second long connecting column, the second long connecting column by corresponding second through-hole
Cross the upper surface of the encapsulating housing.
Based on the above technical solution, the multiple connecting column includes the first short connecting column, the first short connection
The bottom end of column is fixed on the power circuit substrate, and the top of the first short connecting column passes through corresponding first through hole
It is not re-extended after the build-in function circuit board, and the first short connecting column is at the first through hole corresponding to it and institute
Build-in function circuit board is stated to be fixedly connected；
The intelligent power module encapsulating structure further includes the long connecting column of multiple thirds, the bottom end of the long connecting column of third
It is fixed on the power circuit substrate, the top of the long connecting column of third avoids the build-in function circuit board and have to prolong
Extending portion；
The upper surface of the encapsulating housing offers multiple second through-holes, and the quantity of the multiple second through-hole is greater than or waits
Institute is passed through by the second corresponding through-hole in the extension of the quantity of the long connecting column of the third, the long connecting column of third
State the upper surface of encapsulating housing.
Based on the above technical solution, the first encapsulating inlet, the intelligence function are offered on the encapsulating housing
Rate encapsulating structure further includes insulation silica gel, and the encapsulating housing and the intelligent power integrated unit after the assembly is completed, pass through institute
It states the first encapsulating inlet and the insulation silica gel is filled into the encapsulating housing and shape after intelligent power integrated unit assembly
At cavity.
Based on the above technical solution, the second encapsulating inlet is offered on the build-in function circuit board, it is described
Insulation silica gel is injected between the build-in function circuit board and the power circuit substrate by the second encapsulating inlet
Space.
Based on the above technical solution, the inner surface of the build-in function circuit board and the encapsulating housing side wall it
Between have gap, the insulation silica gel by the gap overflow the encapsulating housing and the intelligent power integrated unit bonding
The seal cavity formed afterwards.
Based on the above technical solution, connector, the encapsulating housing are welded on the build-in function circuit board
On offer connector and extend mouth, the connector by the connector extends mouth, and to extend the encapsulating housing and the external world electric
Road carries out signal interaction.
Based on the above technical solution, the two sides of the encapsulating housing are separately provided for institute through locking part
State the pilot hole that intelligent power module encapsulating structure is fixed in external cooling plane.
It based on the above technical solution, further include that deformation inhibits cylinder, the deformation inhibits top and the institute of cylinder
It states encapsulating housing upper top inner surface centre to abut against, the deformation inhibits cylinder bottom end to pass through the build-in function circuit
Upper surface after plate with the power circuit substrate abuts against.
The embodiment of the present invention has the beneficial effect that:
In intelligent power module encapsulating structure provided in an embodiment of the present invention, functional circuit is in the form of built-in function circuit board
In the presence of, assembling process is handled without special process, and it is lower to production line requirement, so that production line has high reusability, reduce
The input cost of production line；Since build-in function circuit board is fixed on above power circuit substrate by connecting column, so that interior
It sets without Coupling Design between function circuit board and encapsulating housing, to increase the freedom of intelligent power integrated unit design
Degree, and the space utilization rate of encapsulating structure is improved, the power for advantageously reducing encapsulating structure volume and increase encapsulating structure is close
Degree；Further, since Coupling Design is not necessarily between build-in function circuit board and encapsulating housing, so that the shell of intelligent function module can
To be designed as integrally formed encapsulating housing, reduces the quantity of case member, simplify packaging process, reduce costs.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without any creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the explosive view of intelligent power module encapsulating structure provided in an embodiment of the present invention；
Fig. 2 is that the intelligent power integrated unit in intelligent power module encapsulating structure provided in an embodiment of the present invention has one
Structural schematic diagram in body implementation；
Fig. 3 is intelligent power integrated unit in intelligent power module encapsulating structure provided in an embodiment of the present invention another
Structural schematic diagram in specific implementation；
Fig. 4 is the platform that encapsulating housing sidewall bottom opens up in intelligent power module encapsulating structure provided in an embodiment of the present invention
The structural schematic diagram of stepwise groove；
Fig. 5 is the diagrammatic cross-section after the completion of intelligent power module encapsulating structure encapsulation provided in an embodiment of the present invention；
Fig. 6 is the structural schematic diagram after the completion of intelligent power module encapsulating structure encapsulation provided in an embodiment of the present invention；
Fig. 7 be another embodiment of the present invention provides intelligent power module encapsulating structure explosive view；
Fig. 8 be another embodiment of the present invention provides intelligent power module encapsulating structure in deformation inhibit cylinder and encapsulating shell
The schematic diagram of matching relationship between body；
Fig. 9 be another embodiment of the present invention provides intelligent power module encapsulating structure encapsulation after the completion of section signal
Figure.
Specific embodiment
In order to which the objects, technical solutions and advantages of the embodiment of the present invention are more clearly understood, below in conjunction with attached drawing and reality
Example is applied, the embodiment of the present invention is further elaborated.It should be appreciated that specific embodiment described herein is only used to
It explains the embodiment of the present invention, is not intended to limit the present invention embodiment.
Embodiment one
Fig. 1 is the explosive view of intelligent power module encapsulating structure provided in an embodiment of the present invention.For ease of description, only
Show part related to the present embodiment.
It is shown in Figure 1, intelligent power module encapsulating structure provided in this embodiment include intelligent power integrated unit 1 and
Integrally formed encapsulating housing 2, in which:
The intelligent power integrated unit 1 is including power circuit substrate 11, build-in function circuit board 12 and is used for signal
Multiple connecting columns 13 of transmission and the fixed build-in function circuit board 12；It is offered on the build-in function circuit board 12 and institute
The corresponding multiple first through hole (not shown)s of multiple connecting columns 13 are stated, the bottom end of the multiple connecting column 13 is each attached to institute
It states on power circuit substrate 11, the top of the multiple connecting column 13 is passed through by the multiple first through hole described built-in respectively
Function circuit board 12, and be fixedly connected at the corresponding first through hole with the build-in function circuit board 12, make institute
It states 12 storehouse of build-in function circuit board and is layered in 11 top of power circuit substrate；
The encapsulating housing 2 includes the installation cavity that bottom has opening, and the intelligent power integrated unit 1 is mounted on described
In installation cavity, and the power circuit substrate 11 of the intelligent power integrated unit 1 is blocked in the bottom opening position of the installation cavity
Place is set, forms closed encapsulating structure with the encapsulating housing 2.
Wherein, power circuit substrate 11 described in the intelligent power integrated unit 1 includes but is not limited to that aluminum based resin covers
Copper sheet, copper-based resin copper-clad plate or double-sided copper-clad ceramic substrate, and welded on the power circuit substrate 11 it is functional not only
It is limited to inversion, rectification, braking, buffering constant power switching device and temperature and electric signal Sampling device.The build-in function electricity
It is welded on road plate 12 and functional is not limited only to that power supply, signal sampling conditioning, protection, driving, micro-control unit operation equal part renders meritorious service
It can device.
Wherein, the bottom end of the multiple connecting column 13 is fixed on by welding on the power circuit substrate 11,
The multiple connecting column 13 is realized by way of welding and/or crimping and the build-in function at its corresponding first through hole
The fixation of circuit board 12 and signal transmission.Preferably, in the present embodiment, on the multiple connecting column can storehouse stacking it is multiple built-in
Functional circuit substrate.
In the present embodiment, multiple connecting columns 13 are fixed on the power circuit substrate 11 by the way of welding, are used
The mode and at least one build-in function circuit board 12 of welding and/or crimping realize that fixed and signal transmits, and may be implemented to connect
The stability connected between column and power circuit substrate 11 and build-in function circuit board 12, and power circuit substrate 11 and built-in
Function circuit board 12 can realize signal multiplexing based on connecting column 13；Further, since device for power switching is solid by welding
It is scheduled on the power circuit substrate 11, so that connecting column can be assembled together with device for power switching, be simplified
Assembly process.
Further, shown in Figure 2, in a specific implementation, the multiple connecting column 13 includes the first short company
Connect column 131 and the second long connecting column 132, in which:
The bottom end of the first short connecting column 131 is fixed on the power circuit substrate 11, first connecting column 131
Top by corresponding first through hole pass through the build-in function circuit board 12 after do not re-extend, and it is described first connection
Column 131 is fixedly connected at the first through hole corresponding to it with the build-in function circuit board 12；
The bottom end of the second long connecting column 132 is fixed on the power circuit substrate 11, the second long connecting column
132 top passes through the build-in function circuit board 12 by corresponding first through hole and has extension, and described the
Two long connecting columns 132 are fixedly connected at the first through hole corresponding to it with the build-in function circuit board 12；
The upper surface of the encapsulating housing 2 offers multiple second through-holes 21, and the quantity of the multiple second through-hole 21 is big
In or equal to the second long connecting column 132 quantity, the extension of the second long connecting column 132 passes through corresponding institute
State the upper surface that the second through-hole 21 passes through the encapsulating housing 2.
Preferably, in the present embodiment, the bottom end of the described first short connecting column 131 is fixed on described by welding
On power circuit substrate 11, the first short connecting column 131 is at its corresponding first through hole by way of welding or crimping
The multiplexing functions that signal transmission and structure are fixed are realized with the build-in function circuit board 12.
Preferably, in the present embodiment, the bottom end of the described second long connecting column 132 is fixed on described by welding
On power circuit substrate 11, the top of the second long connecting column 132 passes through the side of welding or crimping in its corresponding through hole
Formula and the build-in function circuit board 12 realize the multiplexing functions that signal transmission and structure are fixed.
Preferably, in the present embodiment, the top of the described first short connecting column 131 and the second long connecting column 132 can
To be set as needle-based shape, institute is passed rapidly through convenient for the described first short connecting column 131 and the second long connecting column 132 in this way
The first through hole on build-in function circuit board 12 is stated, convenient for assembly.
Preferably, in the present embodiment, the appearance of the described first short connecting column 131 and the second long connecting column 132 is real
Existing form is not limited, in specific implementation, the first short connecting column 131 and the second long connecting column by a certain fixed profile
132 specific implementation form includes but is not limited to cylindric terminal, regular polygon terminal and/or flat-shaped terminal.
Preferably, in the present embodiment, the quantity for the second through-hole 21 that the upper surface of the encapsulating housing 2 opens up is greater than institute
State the quantity of the second long connecting column 132, so that encapsulating housing 2 can be compatible with multiple and different type power circuit substrates 11
The extension demand of long terminal.Certainly, at other under the lower application scenarios of the compatibility of encapsulating housing 2, the encapsulating housing 2
The quantity for the second through-hole 21 that upper surface opens up can also be equal to the second long connecting column welded on the power circuit substrate 11
132 quantity.
Further, shown in Figure 3, in another specific implementation, the multiple connecting column 13 includes first short
The bottom end of connecting column 131, the first short connecting column 131 is fixed on the power circuit substrate 11, the first short connection
The top of column 131 does not re-extend after passing through the build-in function circuit board 12 by corresponding first through hole, and described the
One short connecting column 131 is fixedly connected at the first through hole corresponding to it with the build-in function circuit board 12；
The intelligent power module encapsulating structure further includes the long connecting column 133 of multiple thirds for signal transmission, described
The bottom end of the long connecting column 133 of third is fixed on the power circuit substrate 11, and the top of the long connecting column 133 of third is avoided
The build-in function circuit board 12 simultaneously has extension；
The upper surface of the encapsulating housing 2 offers multiple second through-holes 21, and the quantity of the multiple second through-hole 21 is big
In or equal to the long connecting column 133 of third quantity, the extension of the long connecting column 133 of third passes through corresponding the
Two through-holes 21 pass through the upper surface of the encapsulating housing 2.
Preferably, in the present embodiment, the bottom end of the described first short connecting column 131 is fixed on described by welding
On power circuit substrate 11, the first short connecting column 131 is at its corresponding first through hole by way of welding or crimping
The multiplexing functions that signal transmission and structure are fixed are realized with the build-in function circuit board 12.
Preferably, in the present embodiment, the area of the build-in function circuit board 12 is less than the power circuit substrate 11
Area, the long connecting column 133 of third be separately positioned on the power circuit substrate 11 close to surrounding position at, it is described
The bottom end of the long connecting column 133 of third is fixed on by welding on the power circuit substrate 11, the long connection of the third
The second through-hole 21 that the top of column 133 is avoided passing through on the encapsulating housing 2 after the build-in function circuit board 12 extends institute
It states encapsulating housing 2 and external circuit carries out signal interaction.
Preferably, in the present embodiment, the size for the second through-hole 21 that 2 upper surface of encapsulating housing opens up and described the
The cross-sectional area of the extension of three cylinders is equal in magnitude, so that the extension of the third cylinder passes through corresponding just
Two through-holes 21 extend the encapsulating housing 2 and carry out signal interaction with external circuitry.
Preferably, in the present embodiment, the quantity for the second through-hole 21 that the upper surface of the encapsulating housing 2 opens up is greater than institute
State the quantity of the long connecting column 133 of third, so that encapsulating housing 2 can be compatible with multiple and different type power circuit substrates 11
The extension demand of long terminal.Certainly, at other under the lower application scenarios of the compatibility of encapsulating housing 2, the encapsulating housing 2
The quantity for the second through-hole 21 that upper surface opens up can also be equal to the long connecting column of third welded on the power circuit substrate 11
133 quantity.
Preferably, in the present embodiment, the appearance of the described first short connecting column 131 and the long connecting column 133 of the third is real
Existing form is not limited, in specific implementation, the first short connecting column 131 and the long connecting column of the third by a certain fixed profile
133 specific implementation form includes but is not limited to cylindric terminal, regular polygon terminal and/or flat-shaped terminal.
Further, shown in Figure 2, the first encapsulating inlet 22, the intelligence function are offered on the encapsulating housing 2
Rate encapsulating structure further includes insulation silica gel, and the encapsulating housing 2 after the assembly is completed, passes through with the intelligent power integrated unit 1
The insulation silica gel is injected the encapsulating housing 2 and filled with the intelligent power integrated unit 1 by the first encapsulating inlet 22
The cavity formed after matching.The second encapsulating inlet 122 is offered on the build-in function circuit board 12, the insulation silica gel passes through
The second encapsulating inlet 122 fills the space between the build-in function circuit board 12 and the power circuit substrate 11.
There is gap, the insulation silica gel passes through between the inner surface of 2 side wall of the build-in function circuit board 12 and the encapsulating housing
The gap overflows the seal cavity formed after the encapsulating housing 2 and the intelligent power integrated unit 1 bonding.In this implementation
In example, the insulation silica gel can pass through the first encapsulating inlet 22, the second encapsulating inlet 122 and the gap
The intracorporal space of seal chamber formed after the encapsulating housing 2 and intelligent power integration module encapsulation is overflowed, to the function
Energy circuit substrate and the build-in function circuit board 12 play insulation protection and dust-proof effect.
Further, shown in Figure 2, connector 123, the encapsulating shell are welded on the build-in function circuit board 12
Connector is offered on body 2 and extends mouth 23, and the connector 123 extends mouth 23 by the connector and extends the encapsulating shell
Body 2 and external circuitry carry out signal interaction.
Further, shown in Figure 2, the two sides of the encapsulating housing 2 are separately provided for institute through locking part
State the pilot hole 24 that intelligent power module encapsulating structure is fixed in external cooling plane.Preferably, in the present embodiment, described
Locking part is screw.
Further, shown in Figure 4, the bottom of the installation cavity side wall is provided with and 11 phase of power circuit substrate
Cooperate step-like recesses 25, the power circuit substrate 11 is fixed at 25 position of step-like recesses by bonding way.It is preferred that
, in the present embodiment, 25 surface of step-like recesses is coated with silicon rubber, and the power circuit substrate 11 passes through the silicon picture
Glue sticking is at the step-like recesses 25.Intelligent power integration module and encapsulating housing 2 encapsulate after structural schematic diagram referring to
Shown in Fig. 5 and Fig. 6.
Above as can be seen that intelligent power module encapsulating structure provided in this embodiment, since functional circuit is with built-in function
Energy 12 form of circuit board exists, and assembling process is handled without special process, lower to production line requirement, so that production line has
High reusability reduces the input cost of production line；Since build-in function circuit board 12 is fixed on power circuit by connecting column
11 top of substrate, so that Coupling Design is not necessarily between build-in function circuit board 12 and encapsulating housing 2, to increase intelligent power
The freedom degree that integrated unit 1 designs, and the space utilization rate of encapsulating structure is improved, advantageously reduce encapsulating structure volume and increasing
Seal up the power density of assembling structure；Further, since being not necessarily to Coupling Design between build-in function circuit board 12 and encapsulating housing 2, make
The shell for obtaining intelligent function module can be designed as integrally formed encapsulating housing 2, reduces the quantity of case member, simplifies
Packaging process reduces costs.
Embodiment two
Fig. 7 be another embodiment of the present invention provides intelligent power module encapsulating structure structural schematic diagram.For the ease of
Illustrate to illustrate only part related to the present embodiment.
Shown in Figure 7, relative to a upper embodiment, intelligent power module encapsulating structure provided in this embodiment further includes
Deformation inhibits cylinder 14, the top of the deformation inhibition cylinder 14 and the 2 upper top inner surface centre phase of encapsulating housing
It abuts, the deformation is upper with the power circuit substrate 11 after inhibiting 14 bottom end of cylinder to pass through the build-in function circuit board 12
Surface abuts against.
In the present embodiment, deformation is offered on the build-in function circuit board 12 inhibits cylinder 14 to extend mouth, the shape
Become the upper surface for inhibiting the bottom end of cylinder 14 to be connected to the power circuit substrate 11, the deformation inhibits the top of cylinder 14 logical
Cross the deformation inhibit cylinder extend mouth 124 pass through the build-in function circuit board 12 and with 2 top shell of encapsulating housing
Contacted inner surfaces connect (as shown in Figure 8), in this way when the intelligent power encapsulating structure is locked to by locking parts such as screws
When in external cooling plane, the deformation inhibition cylinder 14 can play the role of inhibition power circuit substrate 11, and deformation occurs.
Deformation inhibits cylinder 14 to show with the section after the completion of the encapsulation of power circuit substrate 11, build-in function circuit board 12 and encapsulating housing 2
It is intended to shown in Figure 9.
Further, relative to a upper embodiment, the intelligent power integrated unit 1 in the present embodiment further includes multiple having
The limited support column of limited support platform, offers on the build-in function circuit board 12 and multiple limited support columns correspond
Third through-hole；The bottom end of the multiple limited support column is each attached on the power circuit substrate 11, the multiple limit
The top of support column passes through corresponding third through-hole across the build-in function circuit board 12 respectively, makes the multiple limit
Bottom surface of the limited support platform of support column respectively with the build-in function circuit board 12 abuts against, to the build-in function electricity
Road plate 12 is limited and is supported, and the multiple limited support column respectively at its corresponding described third through-hole with it is described interior
Function circuit board 12 is set to be fixedly connected.
Wherein, the limited support column plays limit, support and fixed function to the built-in power circuit board.Preferably,
In the present embodiment, the bottom end of the multiple limited support column is welded on the power circuit substrate 11, the multiple limit
Position support column respectively at its corresponding second through-hole 21 by way of welding and/or crimping with the build-in function circuit board
12 realize fixation.
Preferably, in the present embodiment, the intelligent power integrated unit 1 include four limited support columns, described four
Limited support column is respectively distributed to four angular positions of the power circuit substrate 11, the bottom end of four limited support columns
Four angular positions of 11 upper surface of power circuit substrate are respectively welded at, top passes through build-in function circuit board 12 respectively
On four third through-holes opening up pass through the build-in function circuit board 12, and make the limited support of four limited support columns
Bottom surface of the platform respectively with the build-in function circuit board 12 abuts against, with to the build-in function circuit board 12 carry out limit and
Support, and four limited support columns are respectively at its corresponding described third through-hole by way of welding and/or crimping
It realizes and fixes with the build-in function circuit board 12.
1 circuit board package structure of intelligent power integrated unit provided in this embodiment is due in the power circuit substrate 11
It is additionally provided between the build-in function circuit substrate for the build-in function circuit board 12 to be limited, supported and consolidated
Fixed limited support column can be further improved the stability of the encapsulation of build-in function circuit board 12 in this way.
It should be noted that the other parts structure of intelligent power module encapsulating structure provided in this embodiment due to it is upper
One embodiment is identical, therefore details are not described herein.
Relative to a upper embodiment, intelligent power module encapsulating structure provided in this embodiment is due to being additionally provided with deformation suppression
Cylinder 14 processed, and deformation inhibits the bottom end of cylinder 14 to abut against with 11 upper surface of power circuit substrate, top passes through build-in function
Contacted inner surfaces after circuit board 12 with 2 top shell of encapsulating housing connect, so as to pass through locking part for intelligent power mould
When block encapsulating structure is installed in external cooling plane, inhibiting power circuit substrate 11, deformation occurs, further improves intelligence
Power module package reliability of structure；Further, since in the power circuit substrate 11 and the build-in function circuit substrate
Between be additionally provided with limited support column for the build-in function circuit board 12 to be limited, supported and fixed, in this way may be used
To further increase the stability of the encapsulation of build-in function circuit board 12.
Preferred embodiments of the present invention have been described above with reference to the accompanying drawings, not thereby limiting the scope of the invention.This
Field technical staff without departing from the scope and spirit of the invention in made by any modifications, equivalent replacements, and improvements, should all this
Within the interest field of invention.
Claims (10)
1. a kind of intelligent power module encapsulating structure, which is characterized in that including intelligent power integrated unit and integrally formed envelope
Fill shell, in which:
The intelligent power integrated unit includes power circuit substrate, build-in function circuit board and transmits and fix for signal
Multiple connecting columns of the build-in function circuit board；It is offered on the build-in function circuit board corresponding with the multiple connecting column
Multiple first through hole, the bottom end of the multiple connecting column is each attached on the power circuit substrate, the multiple connecting column
Top the build-in function circuit board is passed through by the multiple first through hole respectively, and it is logical corresponding described first
It is fixedly connected at hole with the build-in function circuit board, the build-in function circuit board storehouse is made to be layered in the power circuit base
Above plate；
The encapsulating housing includes the installation cavity that bottom has opening, and the intelligent power integrated unit is mounted on the installation cavity
It is interior, and the power circuit substrate of the intelligent power integrated unit blocks at the bottom opening position of the installation cavity, with institute
It states encapsulating housing and forms closed encapsulating structure.
2. intelligent power module encapsulating structure as described in claim 1, which is characterized in that the bottom of the installation cavity side wall is set
It is equipped with and matches step-like recesses with the power circuit substrate, the power circuit substrate is fixed on step by bonding way
At formula groove location.
3. intelligent power module encapsulating structure as described in claim 1, which is characterized in that the multiple connecting column includes first
Short connecting column and the second long connecting column, in which:
The bottom end of the first short connecting column is fixed on the power circuit substrate, and the top of the first short connecting column passes through
Corresponding first through hole does not re-extend after passing through the build-in function circuit board, and the first short connecting column is right in its institute
It is fixedly connected at the first through hole answered with the build-in function circuit board；
The bottom end of the second long connecting column is fixed on the power circuit substrate, and the top of the second long connecting column passes through
Corresponding first through hole passes through the build-in function circuit board and has extension, and the second long connecting column is in its institute
It is fixedly connected at corresponding first through hole with the build-in function circuit board；
The upper surface of the encapsulating housing offers multiple second through-holes, and the quantity of the multiple second through-hole is greater than or equal to institute
The quantity of the second long connecting column is stated, the extension of the second long connecting column passes through institute by corresponding second through-hole
State the upper surface of encapsulating housing.
4. intelligent power module encapsulating structure as described in claim 1, which is characterized in that the multiple connecting column includes first
The bottom end of short connecting column, the first short connecting column is fixed on the power circuit substrate, the top of the first short connecting column
End does not re-extend after passing through the build-in function circuit board by corresponding first through hole, and the first short connecting column exists
It is fixedly connected at first through hole corresponding to it with the build-in function circuit board；
The intelligent power module encapsulating structure further includes the long connecting column of multiple thirds, and the bottom end of the long connecting column of third is fixed
On the power circuit substrate, the top of the long connecting column of third avoids the build-in function circuit board and has to extend
Portion；
The upper surface of the encapsulating housing offers multiple second through-holes, and the quantity of the multiple second through-hole is greater than or equal to institute
The quantity of the long connecting column of third is stated, the extension of the long connecting column of third passes through the envelope by the second corresponding through-hole
Fill the upper surface of shell.
5. intelligent power module encapsulating structure as described in claim 1, which is characterized in that offer on the encapsulating housing
One encapsulating inlet, the intelligent power encapsulating structure further include insulation silica gel, the encapsulating housing and the intelligent power collection
After the assembly is completed at unit, the insulation silica gel is filled by the encapsulating housing and the intelligence by the first encapsulating inlet
The cavity formed after energy power integrated unit assembly.
6. intelligent power module encapsulating structure as claimed in claim 5, which is characterized in that opened on the build-in function circuit board
Equipped with the second encapsulating inlet, the insulation silica gel by the second encapsulating inlet fill the build-in function circuit board with
Space between the power circuit substrate.
7. intelligent power module encapsulating structure as claimed in claim 6, which is characterized in that the build-in function circuit board and institute
State between the inner surface of encapsulating housing side wall have gap, the insulation silica gel by the gap overflow the encapsulating housing with
The seal cavity formed after the intelligent power integrated unit bonding.
8. intelligent power module encapsulating structure as described in claim 1, which is characterized in that welded on the build-in function circuit board
It is connected to connector, connector is offered on the encapsulating housing and extends mouth, the connector extends mouth by the connector and prolongs
It stretches out the encapsulating housing and external circuitry carries out signal interaction.
9. intelligent power module encapsulating structure as described in claim 1, which is characterized in that distinguish the two sides of the encapsulating housing
It is provided with the pilot hole for being fixed on the intelligent power module encapsulating structure by locking part in external cooling plane.
10. intelligent power module encapsulating structure as claimed in claim 9, which is characterized in that further include that deformation inhibits cylinder, institute
Stating deformation inhibits the top of cylinder to abut against with the encapsulating housing upper top inner surface centre, and the deformation inhibits cylinder
Bottom end abuts against after the build-in function circuit board with the upper surface of the power circuit substrate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910536902.XA CN110197824A (en) | 2019-06-20 | 2019-06-20 | Intelligent power module encapsulating structure |
| PCT/CN2020/089044 WO2020253411A1 (en) | 2019-06-20 | 2020-05-07 | Intelligent power module packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910536902.XA CN110197824A (en) | 2019-06-20 | 2019-06-20 | Intelligent power module encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110197824A true CN110197824A (en) | 2019-09-03 |
Family
ID=67754887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910536902.XA Pending CN110197824A (en) | 2019-06-20 | 2019-06-20 | Intelligent power module encapsulating structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110197824A (en) |
| WO (1) | WO2020253411A1 (en) |
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| WO2020253411A1 (en) * | 2019-06-20 | 2020-12-24 | 深圳市汇川技术股份有限公司 | Intelligent power module packaging structure |
| WO2020253410A1 (en) * | 2019-06-20 | 2020-12-24 | 深圳市汇川技术股份有限公司 | Encapsulation structure for circuit board of intelligent power module |
| CN113113378A (en) * | 2021-02-28 | 2021-07-13 | 华为技术有限公司 | A kind of tool |
| US20230139725A1 (en) * | 2021-11-04 | 2023-05-04 | Lite-On Singapore Pte Ltd | Power module |
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Also Published As
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