CN106611758A - Integrated power module packaging structure - Google Patents
Integrated power module packaging structure Download PDFInfo
- Publication number
- CN106611758A CN106611758A CN201510694383.1A CN201510694383A CN106611758A CN 106611758 A CN106611758 A CN 106611758A CN 201510694383 A CN201510694383 A CN 201510694383A CN 106611758 A CN106611758 A CN 106611758A
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- Prior art keywords
- circuit substrate
- pin
- side current
- package structure
- power module
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Abstract
The invention discloses an integrated power module packaging structure, which comprises a shell, a first circuit substrate, a second circuit substrate, a first pin, a second pin and a third pin, wherein the shell is provided with a cavity; the second circuit substrate is located relatively above the first circuit substrate, and both circuit substrates are accommodated in the cavity; a switching module is arranged on the first circuit substrate; a high-end current/voltage detection element and a driving element are arranged on the second circuit substrate; the first pin, the second pin and the third pin are arranged between the first circuit substrate and the second circuit substrate; the first pin is serially connected with the high-end current/voltage detection element and the switching module; the second pin is connected with the switching module; and the driving element controls the switching module through the third pin.
Description
Technical field
The present invention relates to a kind of encapsulating structure, particularly a kind of to integrate power module package structure.
Background technology
In response to whole world automation and the development trend of power and energy saving, need arrangements for speed regulation equipment to apply various fields
Close, therefore different speed demands is reached from motor using variable frequency drives.But traditional integrated power
Module only integrates the switch module of variable frequency drives and bridge rectifier, for the other units of variable frequency drives
Part, such as driving element are not integrated.And in order to deal with industry control environment now, often must additionally dispose inspection
Survey element to detect variable frequency drives high low side voltage x current.But, these elements are because of isolation requirement
Variable frequency drives volume can be caused too big, and do not meet current product towards microminiaturization, high power and high density
Deng the trend that direction is developed.
The content of the invention
The technical problem to be solved is to provide a kind of integration power module package structure, examining
Survey element, driving element and switch module and be incorporated into same encapsulation in vivo, reduce overall volume.
To achieve these goals, the invention provides a kind of integrate power module package structure, comprising a shell
Body, one first circuit substrate, a second circuit substrate, one first pin, a second pin and the 3rd are drawn
Pin.Wherein housing has a cavity, this second circuit substrate be located at the first circuit substrate relatively above and
In being placed in this cavity.A switch module is provided with first circuit substrate.It is provided with second circuit substrate
One high-side current/voltage detector component and a driving element.First pin, second pin and the 3rd pin
It is arranged between the first circuit substrate and second circuit substrate.First pin series winding high-side current/voltage detecting unit
Part and switch module.Second pin connecting valve module.Driving element passes through the 3rd pin controlling switch module.
In one embodiment, a low-side current detecting element is arranged on the first circuit substrate.First pin is also
Contact this low-side current detecting element, switch module and high-side current/voltage detector component.
In one embodiment, also it is arranged at outside housing including a tertiary circuit substrate.On tertiary circuit substrate
A power supply component is provided with, power supply component has a positive voltage terminal and a negative voltage side.
In one embodiment, also including one the 4th pin, second circuit substrate and tertiary circuit substrate are arranged at
Between and connect the positive voltage terminal of power supply component.The low-side current contacted is examined by the first pin and the 4th pin
Survey the positive voltage terminal that element, switch module and high-side current/voltage detector component connects power supply component.It is logical
Crossing second pin can be by the low-side current detecting element of series winding, switch module and high-side current/voltage detecting
Element connects the negative voltage side of power supply component.
In one embodiment, also it is arranged on second circuit substrate including one the 5th pin.High-side current/
Voltage detector component detects power supply component and produces one high-side current/voltage detection signal and export and draws to the 5th
Pin.
In one embodiment, also including one the 6th pin, it is arranged on the first circuit substrate and two electric through this
Base board.Low-side current detecting element detects the electric device and produces a low-side current detection signal and exports to
Six pins.
In one embodiment, also including a controller, it is arranged at outside housing, to receive the output of the 5th pin
High-side current/voltage detection signal, and the 6th pin output low-side current detection signal.
In one embodiment, controller is arranged on the tertiary circuit substrate.
In one embodiment, also including one the 7th pin, second circuit substrate and tertiary circuit substrate are arranged at
Between, controller controls driving element by the 7th pin.
The method have technical effect that：
Due to the integration power module package structure of the technical program, by stacked package framework, each unit is allowed
Part is sequentially arranged on the substrate for overlieing one another, therefore each interelement has higher collection Midst density.And except bag
Include outside existing switch module, also high-side current/the voltage detector component of tool key function can be integrated into this
In encapsulating structure, therefore with encapsulation benefit.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as to the present invention's
Limit.
Description of the drawings
Fig. 1 is the integration power module package section of structure according to one embodiment of the invention；
Fig. 2 is the integration power module package structural upright view according to one embodiment of the invention；
Fig. 3 is to integrate power module package structure and an external circuit substrate according to one embodiment of the invention
Profile；
Fig. 4 is the integration power module package structure and an external circuit substrate according to one embodiment of the invention
Three-dimensional view.
Wherein, reference
10 integrate power module package structure
100 housings
101 cavitys
102 side walls
103 supporting parts
110 first circuit substrates
111 low-side current detecting elements
112 switch modules
113 layers of copper
114 ceramic substrates
120 second circuit substrates
121 high-side currents/voltage detector component
122 driving elements
131 first pins
132 second pins
133 the 3rd pins
134 the 4th pins
135 the 5th pins
136 the 6th pins
137 the 7th pins
140 tertiary circuit substrates
141 power supply components
150 controllers
Specific embodiment
The structural principle and operation principle of the present invention are described in detail below in conjunction with the accompanying drawings：
In order that the narration of present invention it is more detailed with it is complete, can refer to appended schema and described below
Various embodiments, identical number represents same or analogous element in schema.But the embodiment for being provided is simultaneously
It is not used to limit the scope that the present invention is covered, and the description of structure operation is not used to limit the suitable of its execution
Sequence, any structure reconfigured by element, it is produced with it is equal the effects such as device, be all institute of the present invention
The scope for covering.
Wherein schema only for the purpose of description, and not according to life size mapping.On the other hand, it is thus well known that
Element is not described in embodiment with step, to avoid causing the present invention unnecessary restriction.
Integration power module package structure of the invention, in addition to including existing switch module, will also
The current/voltage detecting element of tool key function is integrated in this encapsulating structure, while using stacked package
Framework, allows each element to be sequentially arranged on the substrate for overlieing one another, therefore, each interelement can be caused to have higher
Collection Midst density, not only reduce the overall volume of power model, and in the case of overall volume is reduced, also
Additionally a key element is integrated in this power model, with encapsulation benefit.Additionally, thereby stack is tied
Structure, can cause interelement cabling most short, it is to avoid the noise that long cabling causes, and then reduce noise jamming.
Fig. 1 show integration power module package section of structure according to an embodiment of the invention.Fig. 2 show
Integration power module package structural upright view according to an embodiment of the invention.Please refer to Fig. 1 and Tu
2.Integrate power module package structure 10, including at least a housing 100, one first circuit substrate 110,
One second circuit substrate 120 and three pins, respectively one first pin 131, the and of a second pin 132
One the 3rd pin 133.Wherein, housing 100, with a cavity 101.Housing 100 has surrounding cavity
101 side wall 102, can arrange prominent supporting part 103, to support second circuit base on side wall 102
Plate 120.
First circuit substrate 110 and second circuit substrate 120 are placed in cavity 101.First circuit substrate
110 can be fixed on housing 100 by materials such as stickers.One is provided with first circuit substrate 110 to open
Close module 112.In one embodiment, switch module 112 can be IGBT, MOSFET, DIODE
Deng, and switch module 112 can be single switch or form different connections by multiple switch and combine.Due to
Switch module 112 can produce substantial amounts of heat when operating, therefore, the first circuit substrate 110 is preferably led
Hot good substrate.For example, the first circuit substrate 110 can include ceramic substrate 114 and
The layers of copper 113 being coated on ceramic substrate, because copper is the good material of thermal conductivity, therefore can be rapidly
Heat produced by switch module 112 is taken away to radiate.Switch module 112 is arranged at ceramic substrate 114
Upper surface.It is noted that the pin of the pattern palpus avoiding switching module 112 of layers of copper 113, Yi Miankai
The pin for closing module 112 is turned on by layers of copper 113 and causes short-circuit phenomenon.And second circuit substrate 120,
Then it is located at the first circuit substrate 110 relatively above, second circuit substrate 120 can be by materials such as stickers
It is fixed on the supporting part 103 of side wall 102, thereby plants stacked structures, the first circuit substrate can be caused
Element trace between 110 and second circuit substrate 120 is most short, it is to avoid the noise that long cabling causes, interference
Element operation.Wherein second circuit substrate 120 is provided with a high-side current/electricity as substrate is driven
The pressure driving element 122 of detecting element 121 and.High-side current/voltage detector component 121 is disposed on just
The detecting element of voltage end (+), wherein current detecting part can be examined using shunting (shunt) resistor
Survey, and current detection section can be detected using the voltage detecting circuit of positive voltage terminal (+).Second circuit
Substrate 120 can be a multilayer board, can be by height by the metal interconnecting of multilayer board
Current/voltage detecting element 121 and the signal of driving element 122 is held to be directed to corresponding first pin respectively
131st, the switch module 112 on the pin 133 of second pin 132 or the 3rd, and the first circuit substrate 110
Carry out signal transmission.
First pin 131, the pin 133 of second pin 132 and the 3rd are then provided in the first circuit substrate 110
And between second circuit substrate 120.First pin 131 is to the high-end electricity on second circuit substrate 120 of contacting
Switch module 112 on the circuit substrate 110 of stream/voltage detector component 121 and first.Second pin 132
Then connecting valve module 112.It is outer to carry out electricity with outer member that second pin 132 can protrude from housing 100
Property connection.And the first pin 131 is then non-bulging in housing 100.And the 3rd pin 133 is to connect driving
Element 122 and switch module 112 so that driving element 122 can pass through the controlling switch mould of the 3rd pin 133
Block 112.
Additionally, can also arrange a low-side current detecting element 111 on the first circuit substrate 110.Low-side current
Detecting element 111 is disposed on the detecting element of negative voltage side (-), and wherein current detecting part can use one point
Stream (shunt) resistor is detected.Low-side current detecting element 111 connects second pin 132.Namely
Say, by the first pin 131 and second pin 132 can by the high-side current on second circuit substrate 120/
Low-side current detecting element 111 and switch module on the circuit substrate 110 of voltage detector component 121 and first
112 are contacted.Because switch module 112 connects second pin 132, and second pin 132 can be protruded
It is electrically connected with outside housing 100 and with outer member.Therefore, in another embodiment, root as shown in Figure 3
According to the profile for integrating power module package structure and an external circuit substrate of one embodiment of the invention, and scheme
4 show integration power module package structure according to another embodiment of the present invention and an external circuit substrate
Three-dimensional view, outside housing 100, be additionally provided with a tertiary circuit substrate 140, tertiary circuit substrate
A power supply component 141 is then provided with 140, power supply component 141 has a positive voltage terminal (+) and a negative electricity
Pressure side (-).
To make the power supply component 141 can be to the high-side current/voltage detector component on second circuit substrate 120
Low-side current detecting element 111 and switch module 112 on 121, and the first circuit substrate 110 is carried out
Power supply, can also arrange one the 4th pin 134 between second circuit substrate 120 and tertiary circuit substrate 140,
Wherein this 4th pin 134 connects the positive voltage terminal (+) of power supply component 141, and protrudes from outside housing 100
Second pin 132 then connect the negative voltage side (-) of power supply component 141.Thereby, by the first pin 131,
The low-side current detecting element that the pin 134 of second pin 132 and the 4th can allow on the first circuit substrate 110
111st, the high-side current/voltage detector component 121 on switch module 112 and second circuit substrate 120
The positive voltage terminal (+) of connection power supply component 141 forms primary Ioops with negative voltage side (-), is worth mentioning, above-mentioned
Other energy-storage travelling wave tubes such as inductance outside housing 100 can be included in loop.Therefore power supply component 141, can
This loop is followed to low-side current detecting element 111, switch module 112 and high-side current/voltage detector component
121 are powered, and wherein switch module 112 includes at least one power component.
On the other hand, the exportable control signal of a controller 150 being arranged at outside housing 100, control is driven
The work period that dynamic element 122 passes through the controlling switch module 112 of the 3rd pin 133, to adjust power model
Power output.Wherein controller 150 detects power supply component according to high-side current/voltage detector component 121
One high-side current produced by 141/voltage detection signal, or the detection power supply of low-side current detecting element 111 unit
A low-side current detection signal produced by part 141 is exporting this control signal to driving element 122.Cause
This is the high-side current/voltage detection signal for producing high-side current/voltage detector component 121, and low side
The low-side current detection signal that current measuring element 111 is produced can transmit to controller 150.Then second
One the 5th pin 135 is set on circuit substrate 120, by high-side current/voltage on second circuit substrate 120
The high-side current/voltage detection signal that detecting element 121 is produced is drawn and is supplied to controller 150, and the
One the 6th pin 136 for running through second circuit substrate 120 is set on one circuit substrate 110, it is electric by first
The low-side current detection signal that low-side current detecting element 111 is produced on base board 110 is drawn and is supplied to control
Device 150.
In one embodiment, controller 150 may be provided on tertiary circuit substrate 140.According to this, then the 5th
Pin 135 is arranged between second circuit substrate 120 and tertiary circuit substrate 140, by second circuit substrate
The high-side current that high-side current/voltage detector component 121 is produced on 120/voltage detection signal is drawn and is supplied to
Controller 150 on tertiary circuit substrate 140.6th pin 136 is then arranged on the first circuit substrate 110
And between tertiary circuit substrate 140 and through second circuit substrate 120, by low side on the first circuit substrate 110
The low-side current detection signal that current measuring element 111 is produced is drawn and is supplied on tertiary circuit substrate 140
Controller 150.Additionally, the control signal to export controller 150 can transmit on second substrate 120
Driving element 122, therefore arrange one the also between second circuit substrate 120 and tertiary circuit substrate 140
Seven pins 137, then controller 150 can be by the control driving element 122 of the 7th pin 137 so as to
The work period of switch module 112 on first circuit substrate 110 is controlled by the 3rd pin 133, to adjust
The power output of power model 10.
According to this, integration power module package structure of the invention, by stacked package framework, allows each element
It is sequentially arranged on the substrate for overlieing one another, therefore each interelement has higher collection Midst density.And except including
Outside existing switch module, also the one high-side current/voltage detector component of tool key function is integrated into into this envelope
In assembling structure, therefore great encapsulation benefit.
Certainly, the present invention can also have other various embodiments, in the feelings without departing substantially from spirit of the invention and its essence
Under condition, those of ordinary skill in the art work as can make various corresponding changes and deformation according to the present invention, but
These corresponding changes and deformation should all belong to the protection domain of appended claims of the invention.
Claims (10)
1. it is a kind of to integrate power module package structure, it is characterised in that to include at least：
One housing, with a cavity；
One first circuit substrate, in being placed in the cavity, wherein first circuit substrate is provided with a switching molding
Block；
One second circuit substrate, in being placed in the cavity, and positioned at first circuit substrate relatively above,
Wherein the second circuit substrate is provided with one high-side current/voltage detector component and a driving element；And
One first pin, a second pin and one the 3rd pin are arranged at first circuit substrate and this is second electric
Between base board, wherein first pin is contacted the high-side current/voltage detector component and the switch module, should
Second pin connects the switch module, and the driving element controls the switch module by the 3rd pin.
2. it is as claimed in claim 1 to integrate power module package structure, it is characterised in that also low including one
End current measuring element is arranged on first circuit substrate, and the wherein second pin is also contacted the low-side current
Detecting element, the switch module.
3. it is as claimed in claim 2 to integrate power module package structure, it is characterised in that also including one the
Three-circuit substrate, is arranged at outside the housing, and wherein the tertiary circuit substrate is provided with a power supply component, the confession
Electric device has a positive voltage terminal and a negative voltage side.
4. it is as claimed in claim 3 to integrate power module package structure, it is characterised in that also including one the
Four pins, be arranged between the second circuit substrate and the tertiary circuit substrate and connect the power supply component this just
Voltage end, wherein：
Will the series winding switch module and the high-side current/voltage inspection by first pin and the 4th pin
The positive voltage terminal that element connects the power supply component is surveyed, and
The low-side current detecting element contacted and the switch module are connected by the confession by the second pin
The negative voltage side of electric device.
5. it is as claimed in claim 4 to integrate power module package structure, it is characterised in that also including one the
Five pins, are arranged on the second circuit substrate, and wherein high-side current/the voltage detector component detects the confession
Electric device simultaneously produces one high-side current/voltage detection signal and exports to the 5th pin.
6. it is as claimed in claim 5 to integrate power module package structure, it is characterised in that also including one the
Six pins, are arranged on first circuit substrate and through between two circuit substrate, wherein the low-side current inspection
Survey the element testing power supply component and produce a low-side current detection signal and export to the 6th pin.
7. it is as claimed in claim 6 to integrate power module package structure, it is characterised in that also including a control
Device processed, is arranged at outside the housing, to the high-side current/voltage detecting letter for receiving the output of the 5th pin
Number, and the low-side current detection signal of the 6th pin output.
8. it is as claimed in claim 7 to integrate power module package structure, it is characterised in that the controller sets
It is placed on the tertiary circuit substrate.
9. it is as claimed in claim 8 to integrate power module package structure, it is characterised in that also including one the
Seven pins, are arranged between the second circuit substrate and the tertiary circuit substrate, and the controller draws by the 7th
The foot control system driving element.
10. it is as claimed in claim 1 to integrate power module package structure, it is characterised in that the switch
Module includes at least one power component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510694383.1A CN106611758B (en) | 2015-10-23 | 2015-10-23 | Integrated power module packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510694383.1A CN106611758B (en) | 2015-10-23 | 2015-10-23 | Integrated power module packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN106611758A true CN106611758A (en) | 2017-05-03 |
| CN106611758B CN106611758B (en) | 2020-01-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510694383.1A Active CN106611758B (en) | 2015-10-23 | 2015-10-23 | Integrated power module packaging structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110197824A (en) * | 2019-06-20 | 2019-09-03 | 深圳市汇川技术股份有限公司 | Intelligent power module encapsulating structure |
| CN111653526A (en) * | 2020-03-24 | 2020-09-11 | 鑫金微半导体(深圳)有限公司 | SiP 3-dimensional packaging and processing method of high-power hybrid semiconductor integrated circuit |
| CN111834353A (en) * | 2020-07-17 | 2020-10-27 | 北京市科通电子继电器总厂有限公司 | SIP laminated structure |
| EP3896726A1 (en) * | 2020-04-17 | 2021-10-20 | Siemens Aktiengesellschaft | Semiconductor module with a housing |
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| US6313598B1 (en) * | 1998-09-11 | 2001-11-06 | Hitachi, Ltd. | Power semiconductor module and motor drive system |
| CN1356764A (en) * | 2001-12-28 | 2002-07-03 | 西安交通大学 | Process for preparing integrated electric and electronic module based on discrete elements |
| CN1448669A (en) * | 2002-03-29 | 2003-10-15 | 日立空调系统株式会社 | Refrigerating apparatus and an inverter device used therein |
| CN101419965A (en) * | 2007-09-27 | 2009-04-29 | 三洋电机株式会社 | Circuit device and method of manufacturing the same |
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| US6313598B1 (en) * | 1998-09-11 | 2001-11-06 | Hitachi, Ltd. | Power semiconductor module and motor drive system |
| US6144571A (en) * | 1999-02-22 | 2000-11-07 | Hitachi, Ltd. | Semiconductor module, power converter using the same and manufacturing method thereof |
| CN1306385A (en) * | 2000-01-19 | 2001-08-01 | Lg电子株式会社 | Single module system for electrical and electronic device |
| CN1356764A (en) * | 2001-12-28 | 2002-07-03 | 西安交通大学 | Process for preparing integrated electric and electronic module based on discrete elements |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110197824A (en) * | 2019-06-20 | 2019-09-03 | 深圳市汇川技术股份有限公司 | Intelligent power module encapsulating structure |
| WO2020253411A1 (en) * | 2019-06-20 | 2020-12-24 | 深圳市汇川技术股份有限公司 | Intelligent power module packaging structure |
| CN111653526A (en) * | 2020-03-24 | 2020-09-11 | 鑫金微半导体(深圳)有限公司 | SiP 3-dimensional packaging and processing method of high-power hybrid semiconductor integrated circuit |
| EP3896726A1 (en) * | 2020-04-17 | 2021-10-20 | Siemens Aktiengesellschaft | Semiconductor module with a housing |
| WO2021209186A1 (en) | 2020-04-17 | 2021-10-21 | Siemens Aktiengesellschaft | Semiconductor module comprising a housing |
| CN111834353A (en) * | 2020-07-17 | 2020-10-27 | 北京市科通电子继电器总厂有限公司 | SIP laminated structure |
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|---|---|
| CN106611758B (en) | 2020-01-03 |
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