CN203932060U - Intelligent power module - Google Patents
Intelligent power module Download PDFInfo
- Publication number
- CN203932060U CN203932060U CN201420343829.7U CN201420343829U CN203932060U CN 203932060 U CN203932060 U CN 203932060U CN 201420343829 U CN201420343829 U CN 201420343829U CN 203932060 U CN203932060 U CN 203932060U
- Authority
- CN
- China
- Prior art keywords
- region
- brachium pontis
- power device
- full
- bridge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 87
- 239000002184 metal Substances 0.000 claims abstract description 87
- 239000000758 substrate Substances 0.000 claims abstract description 87
- 238000003491 array Methods 0.000 claims description 15
- 229910000831 Steel Inorganic materials 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Inverter Devices (AREA)
Abstract
The utility model discloses a kind of Intelligent Power Module, this Intelligent Power Module comprise metal substrate, for drive the first full-bridge of brachium pontis power device and first time brachium pontis power device on first drive chip, for driving the second full-bridge of brachium pontis power device and second time brachium pontis power device on second to drive chip, and for driving the 3rd full-bridge of brachium pontis power device and the 3rd time brachium pontis power device on the 3rd to drive chip; Metal substrate is provided with the first area that drives chip for the first full-bridge is installed, the 3rd region that drives the second area of chip and drive chip for the 3rd full-bridge is installed for the second full-bridge is installed; First area, second area and the 3rd region successively equidistantly linear array on metal substrate.The utility model can improve the reliability of Intelligent Power Module.
Description
Technical field
The utility model relates to electronic technology field, particularly a kind of Intelligent Power Module.
Background technology
Intelligent Power Module, IPM (Intelligent Power Module) is a kind of power drive series products that power electronics and integrated circuit technique are combined.Intelligent Power Module integrates power device and high-voltage driving circuit, compare with the discrete scheme of tradition, Intelligent Power Module wins increasing market with advantages such as its high integration, high reliability, be particularly suitable for frequency converter and the various inverter of drive motors, frequency control, metallurgical machinery, electric traction, servo-drive, a kind of desirable power electronic device of frequency-conversion domestic electric appliances.
In prior art, Intelligent Power Module comprises metal substrate, grid drives integrated chip, brachium pontis power device on first, first time brachium pontis power device, brachium pontis power device on second, second time brachium pontis power device, brachium pontis power device and the 3rd time brachium pontis power device on the 3rd, above-mentioned grid drives integrated chip to comprise brachium pontis drive output on first, first time brachium pontis drive output, brachium pontis drive output on second, second time brachium pontis drive output, brachium pontis drive output and the 3rd time brachium pontis drive output on the 3rd, grid drives these six drive output of integrated chip all through grid, to drive the nation's alignment between integrated chip and metal substrate, metal substrate grid driver circuit, and the nation's alignment between the grid of metal substrate and power device transfers to the respective drive signal of its output the grid of corresponding power device, switch motion with power ratio control device.But, because the area of each power device is larger, and caloric value during power device work is also larger, therefore when assembling Intelligent Power Module, often require the spacing between above-mentioned each power device to want large, again because above-mentioned grid drives the area of Area Ratio power device of integrated chip much smaller, thereby cause grid to drive integrated chip to the metal substrate grid driver circuit of each power device can be very long, thereby easily produce the phenomenon that signal disturbs, the reliability of Intelligent Power Module is reduced.In addition, the pin of Intelligent Power Module of the prior art is to draw in a side of its metal substrate, yet the mode of drawing pin from a side of its metal substrate is unfavorable for wiring and the layout of the peripheral circuit plate of Intelligent Power Module very much.
Utility model content
Main purpose of the present utility model is by the first full-bridge being driven chip, the second full-bridge drive chip and the 3rd full-bridge to drive the drive output of chip the shortest to the driving signal lead between the control end of power device, to reduce signal, disturb, thus the reliability of raising Intelligent Power Module.
For achieving the above object, the utility model provides a kind of Intelligent Power Module, described Intelligent Power Module comprise metal substrate, for drive the first full-bridge of brachium pontis power device and first time brachium pontis power device on first drive chip, for driving the second full-bridge of brachium pontis power device and second time brachium pontis power device on second to drive chip, and for driving the 3rd full-bridge of brachium pontis power device and the 3rd time brachium pontis power device on the 3rd to drive chip; Described metal substrate is provided with the first area that drives chip for described the first full-bridge is installed, the 3rd region that drives the second area of chip and drive chip for described the 3rd full-bridge is installed for described the second full-bridge is installed; Described first area, second area and the 3rd region successively equidistantly linear array on described metal substrate.
Preferably, described metal substrate is rectangle, and described first area, second area and the 3rd region are successively equidistantly on the center line of linear array in described metal substrate along long side direction.
Preferably, on described metal substrate, be also provided with the 4th region for brachium pontis power device on described first is installed, for the 5th region of described first time brachium pontis power device is installed, for the 6th region of brachium pontis power device on described second is installed, for the SECTOR-SEVEN territory of described second time brachium pontis power device is installed, for the Section Eight territory of brachium pontis power device on the described the 3rd being installed and for the 9th region of described the 3rd time brachium pontis power device is installed; Wherein,
Described the 4th region and described the 5th region symmetric arrays be in the both sides of described first area, and described the 4th region, the 5th region and first area are in line and are arranged in the short side direction of described metal substrate; Described the 6th region and described SECTOR-SEVEN territory symmetric arrays be in the both sides of described second area, and described the 6th region, SECTOR-SEVEN territory and second area are in line and are arranged in the short side direction of described metal substrate; Described Section Eight territory and described the 9th region symmetric arrays be in the both sides in described the 3rd region, and described Section Eight territory, the 9th region and the 3rd region are in line and are arranged in the short side direction of described metal substrate.
Preferably, described the 4th region, the 6th region and Section Eight territory successively equidistantly linear array in a side of the center line of described metal substrate long side direction, described the 5th region, SECTOR-SEVEN territory and the 9th region successively equidistantly linear array in the opposite side of the center line of described metal substrate long side direction.
Preferably, the centre distance of the centre distance of described the 4th region and described first area, described the 6th region and described second area, and described Section Eight territory all equates with the centre distance in described the 3rd region.
Preferably, on the first side of described metal substrate, Second Edge and the 3rd limit, be equipped with some input and output pins.
Preferably, on described metal substrate, be also provided with the 4th region for brachium pontis power device on described first is installed, for the 5th region of described first time brachium pontis power device is installed, for the 6th region of brachium pontis power device on described second is installed, for the SECTOR-SEVEN territory of described second time brachium pontis power device is installed, for the Section Eight territory of brachium pontis power device on the described the 3rd being installed and for the 9th region of described the 3rd time brachium pontis power device is installed; Wherein,
Described the 4th region, the 5th region, the 6th region, SECTOR-SEVEN territory, Section Eight territory and the 9th region successively equidistantly linear array in described first area, the same side in second area and the 3rd region.
Preferably, described metal substrate is rectangle, described first area, second area and the 3rd region successively equidistantly linear array in a side of the center line of described metal substrate long side direction; Described the 4th region, the 5th region, the 6th region, SECTOR-SEVEN territory, Section Eight territory and the 9th region successively equidistantly linear array in the opposite side of the center line of described metal substrate long side direction.
Preferably, the centre distance in centre distance, described Section Eight territory and described the 3rd region of centre distance, described SECTOR-SEVEN territory and the described second area of the centre distance of the centre distance of described the 4th region and described first area, described the 5th region and described first area, described the 6th region and described second area, and described the 9th region all equates with the centre distance in described the 3rd region.
Preferably, on two of described metal substrate long limits, be equipped with some input and output pins.
The Intelligent Power Module that the utility model provides, comprise metal substrate, for drive the first full-bridge of brachium pontis power device and first time brachium pontis power device on first drive chip, for driving the second full-bridge of brachium pontis power device and second time brachium pontis power device on second to drive chip, and for driving the first full-bridge of brachium pontis power device and the 3rd time brachium pontis power device on the 3rd to drive chip; Metal substrate is provided with the first area that drives chip for the first full-bridge is installed, the 3rd region that drives the second area of chip and drive chip for the 3rd full-bridge is installed for the second full-bridge is installed; First area, second area and the 3rd region successively equidistantly linear array on metal substrate.The utility model is by driving the first full-bridge chip, the second full-bridge to drive chip and the 3rd full-bridge to drive the drive output of chip the shortest to the driving signal lead between the control end of power device, to reduce signal, disturb, thereby realization improves the object of the reliability of Intelligent Power Module.
Accompanying drawing explanation
Fig. 1 is the module assembled structural representation of the utility model Intelligent Power Module one embodiment;
Fig. 2 is the module assembled structural representation of another embodiment of the utility model Intelligent Power Module.
The realization of the utility model object, functional characteristics and advantage, in connection with embodiment, are described further with reference to accompanying drawing.
Embodiment
Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
The utility model provides a kind of Intelligent Power Module.
With reference to Fig. 1, Fig. 1 is the module assembled structural representation of the utility model Intelligent Power Module one embodiment.
In one embodiment, this Intelligent Power Module comprises that metal substrate 108, the first full-bridge drive chip 100, the second full-bridge to drive chip 200, the 3rd full-bridge to drive on chip 300, first on brachium pontis power device 101, first time brachium pontis power device 102, second brachium pontis power device 105, the 3rd time brachium pontis power device 106 on brachium pontis power device 103, second time brachium pontis power device 104, the 3rd.In the present embodiment, on brachium pontis power device 101 on above-mentioned first, first time brachium pontis power device 102, second, on brachium pontis power device 103, second time brachium pontis power device 104, the 3rd, brachium pontis power device 105, the 3rd time brachium pontis power device 106 are IGBT pipe, and the grid of IGBT pipe is control end.
In the present embodiment, said metal substrates 108 is rectangle, metal substrate 108 is provided with the first area that drives chip 100 for the first full-bridge is installed, the 3rd region that drives the second area of chip 200 and drive chip 300 for the 3rd full-bridge is installed for the second full-bridge is installed, first area, second area and the 3rd region successively equidistantly linear array on the center line 120 of metal substrate 108 long side directions, also be that above-mentioned the first full-bridge drives chip 100, the second full-bridge drives chip 200, the 3rd full-bridge drives chip 300 successively equidistantly on the center line 120 of linear array in metal substrate 108 along long side direction.
Further, on metal substrate 108, be also provided with the 4th region for brachium pontis power device 101 on first is installed, for the 5th region of first time brachium pontis power device 102 is installed, for the 6th region of brachium pontis power device 103 on second is installed, for the SECTOR-SEVEN territory of second time brachium pontis power device 104 is installed, for the Section Eight territory of brachium pontis power device 105 on the 3rd being installed and for the 9th region of the 3rd time brachium pontis power device 106 is installed.
Wherein, above-mentioned the 4th region and above-mentioned the 5th region symmetric arrays are in the both sides of first area, and the 4th region, the 5th region and first area are in line and are arranged in the short side direction of metal substrate 108, brachium pontis power device 101 and first time brachium pontis power device 102 symmetric arrays drive the both sides of chip 100 in the first full-bridge on first, and brachium pontis power device 101 on first, first time brachium pontis power device 102 and the first full-bridge drive chip 100 to be in line and are arranged in the short side direction of metal substrate 108, also be brachium pontis power device 101 on first, first time brachium pontis power device 102 and the first full-bridge drive chip 100 center connecting line to be parallel to the minor face of metal substrate 108,
Above-mentioned the 6th region and above-mentioned SECTOR-SEVEN territory symmetric arrays are in the both sides of second area, and the 6th region, SECTOR-SEVEN territory and second area are in line and are arranged in the short side direction of metal substrate 108, brachium pontis power device 103 and second time brachium pontis power device 104 symmetric arrays drive the both sides of chip 200 in the second full-bridge on second, and brachium pontis power device 103 on second, second time brachium pontis power device 104 and the second full-bridge drive chip 200 to be in line and are arranged in the short side direction of metal substrate 108, also be brachium pontis power device 103 on second, second time brachium pontis power device 104 and the second full-bridge drive chip 200 center connecting line to be parallel to the minor face of metal substrate 108,
Above-mentioned Section Eight territory and above-mentioned the 9th region symmetric arrays be in the both sides in the 3rd region, and Section Eight territory, the 9th region and the 3rd region are in line and are arranged in the short side direction of metal substrate 108; Brachium pontis power device 105 and the 3rd time brachium pontis power device 106 symmetric arrays drive the both sides of chip 300 in the 3rd full-bridge on the 3rd, and brachium pontis power device 105 on the 3rd, the 3rd time brachium pontis power device 106 and the 3rd full-bridge drive chip 300 to be in line and be arranged in the short side direction of metal substrate 108, also brachium pontis power device 105 on the 3rd, the 3rd time brachium pontis power device 106 and the 3rd full-bridge drive chip 300 center connecting line to be parallel to the minor face of metal substrate 108;
Further, in the present embodiment, above-mentioned the 4th region, the 6th region and Section Eight territory successively equidistantly linear array in a side of the center line 120 of metal substrate 108 long side directions, on above-mentioned first on brachium pontis power device 101, second on brachium pontis power device 103 and the 3rd brachium pontis power device 105 successively equidistantly linear array in a side of the center line 120 of metal substrate 108 long side directions; The 5th region, SECTOR-SEVEN territory and the 9th region successively equidistantly linear array in the opposite side of the center line 120 of metal substrate 108 long side directions, above-mentioned first time brachium pontis power device 102, second time brachium pontis power device 104 and the 3rd time brachium pontis power device 106 successively equidistantly linear array in the opposite side of the center line 120 of metal substrate 108 long side directions.
Further, in the present embodiment, the centre distance of the centre distance of the 4th region and first area, the 6th region and second area, and Section Eight territory all equates with the centre distance in the 3rd region, brachium pontis power device 101 and the first full-bridge drive brachium pontis power device 103 and the second full-bridge in the centre distance, second of chip 100 to drive brachium pontis power device 105 in the centre distance and the 3rd of chip 200 to equate with the centre distance of the 3rd full-bridge driving chip 300 on first.Again because brachium pontis power device 101 on first and first time brachium pontis power device 102 symmetric arrays drive the both sides of chip 100 in the first full-bridge, on second, brachium pontis power device 103 and second time brachium pontis power device 104 symmetric arrays drive the both sides of chip 200 in the second full-bridge, on the 3rd, brachium pontis power device 105 and the 3rd time brachium pontis power device 106 symmetric arrays drive the both sides of chip 300 in the 3rd full-bridge, therefore, on first, brachium pontis power device 101 and the first full-bridge drive the centre distance of chip 100, first time brachium pontis power device 102 and the first full-bridge drive the centre distance of chip 100, on second, brachium pontis power device 103 and the first full-bridge drive the centre distance of chip 200, second time brachium pontis power device 104 and the first full-bridge drive the centre distance of chip 200, on the 3rd, brachium pontis power device 105 drives the centre distance of chip 300 and the 3rd time brachium pontis power device 106 to drive the centre distance of chip 300 all to equate with the 3rd full-bridge with the 3rd full-bridge.
And, in the present embodiment, on a minor face (calling first side in the following text) of metal substrate 108 and two long limit (calling Second Edge and the 3rd limit in the following text), be equipped with some input and output pins.Concrete, metal substrate 108 first sides (scheming not label) are provided with for the pin 11 of input service voltage and pin 12 for being connected with ground wire, the Second Edge of metal substrate 108 (scheming not label) is provided with the pin 13 (being the ceiling voltage point input pin of Intelligent Power Module) for being connected with busbar voltage input, for inputting the pin 14 that U goes up brachium pontis control signal mutually, for inputting the pin 15 that U descends brachium pontis control signal mutually, for inputting the pin 16 that V goes up brachium pontis control signal mutually, for inputting the pin 17 that V descends brachium pontis control signal mutually, for inputting W, go up mutually the pin 18 of brachium pontis control signal and the pin 19 that input W descends brachium pontis control signal mutually, the 3rd limit (scheming not label) of metal substrate 108 is provided with the pin 20 (practical applications for being connected with U phase higher-pressure region power supply phase negative terminal, this pin 20 is connected with three phase electric machine A), for the pin 21 (practical applications that are connected with V phase higher-pressure region power supply negative terminal, this pin 21 is connected with three phase electric machine B), for the pin 22 (practical applications that are connected with W phase higher-pressure region power supply negative terminal, this pin 22 is connected with three phase electric machine C), for with U phase hold the pin 23 being connected, for with V phase hold the pin 24 that is connected and for W phase hold the pin 25 being connected.
Further, on the metal substrate in the present embodiment 108, be also provided with some resistance 109.The first full-bridge drives chip 100, the second full-bridge to drive chip 200, the 3rd full-bridge to drive the control input end of chip 300 to include brachium pontis control signal input and lower brachium pontis control signal input, and the first full-bridge drives chip 100, the second full-bridge to drive chip 200, the 3rd full-bridge to drive the drive output of chip 300 to include brachium pontis drive output and lower brachium pontis drive output.Wherein, the first full-bridge drives chip 100, the second full-bridge to drive chip 200, the 3rd full-bridge to drive the power input of chip 300 all via circuit board cabling, to be connected with pin 11, and the first full-bridge drives chip 100, the second full-bridge to drive chip 200, the 3rd full-bridge to drive the ground end of chip 300 all via circuit board cabling, to be connected with pin 12; The first full-bridge drives the upper brachium pontis control signal input of chip 100 to be connected with pin 14 via circuit board cabling, and the first full-bridge drives the lower brachium pontis control signal input of chip 100 to be connected with pin 15 via circuit board cabling; The second full-bridge drives the upper brachium pontis control signal input of chip 200 to be connected with pin 16 via circuit board cabling, and the second full-bridge drives the lower brachium pontis control signal input of chip 200 to be connected with pin 17 via circuit board cabling; The 3rd full-bridge drives the upper brachium pontis control signal input of chip 300 to be connected with pin 18 via circuit board cabling, and the 3rd full-bridge drives the lower brachium pontis control signal input of chip 300 to be connected with pin 19 via circuit board cabling; The upper brachium pontis drive output that the first full-bridge drives chip 100 through a resistance with first on the control end of brachium pontis power device 101 be connected, the lower brachium pontis drive output of the first full-bridge driving chip 100 is connected with the control end of first time brachium pontis power device 102 through a resistance; The upper brachium pontis drive output that the second full-bridge drives chip 200 through a resistance with second on the control end of brachium pontis power device 103 be connected, the lower brachium pontis drive output of the second full-bridge driving chip 200 is connected with the control end of second time brachium pontis power device 104 through a resistance; The upper brachium pontis drive output that the 3rd full-bridge drives chip 300 through a resistance with the 3rd on the control end of brachium pontis power device 105 be connected, the lower brachium pontis drive output of the 3rd full-bridge driving chip 300 is connected with the control end of the 3rd time brachium pontis power device 106 through a resistance.On first, on brachium pontis power device 101, second, on brachium pontis power device 103 and the 3rd, the collector electrode of brachium pontis power device 105 links together via circuit board cabling, is connected with pin 13 simultaneously; On first, the collector electrode of the emitter of brachium pontis power device 101 and first time brachium pontis power device 102 links together via circuit board cabling and aluminum steel, is connected via circuit board cabling with pin 20 simultaneously; On second, the collector electrode of the emitter of brachium pontis power device 103 and second time brachium pontis power device 104 links together via circuit board cabling and aluminum steel, is connected via circuit board cabling with pin 21 simultaneously; On the 3rd, the collector electrode of the emitter of brachium pontis power device 105 and the 3rd time brachium pontis power device 106 links together via circuit board cabling and aluminum steel, is connected via circuit board cabling with pin 22 simultaneously; The emitter of first time brachium pontis power device 102 is connected with pin 23 via circuit board cabling, the emitter of second time brachium pontis power device 104 is connected with pin 24 via circuit board cabling, and the emitter of the 3rd time brachium pontis power device 106 is connected with pin 25 via circuit board cabling.
The Intelligent Power Module that the present embodiment provides, because brachium pontis power device on first becomes symmetrical structural arrangement to drive the both sides of chip in the first full-bridge with first time brachium pontis power device, on second, brachium pontis power device becomes symmetrical structural arrangement in the second full-bridge, to drive the both sides of chip with second time brachium pontis power device, on the 3rd, brachium pontis power device becomes symmetrical structural arrangement in the 3rd full-bridge, to drive the both sides of chip with the 3rd time brachium pontis power device, thereby make the present embodiment can realize the object of thermal balance, be beneficial to heat radiation; And the input and output pin of the present embodiment Intelligent Power Module is drawn from these Intelligent Power Module three sides, with respect to pin in prior art, from one-sided mode of drawing, be more conducive to wiring and the layout of peripheral circuit plate; Simultaneously, the present embodiment Intelligent Power Module can make respectively to drive the drive output of chip the shortest to the driving signal lead (being the metal substrate grid driver circuit of mentioning in background technology) between the control end of corresponding power device, thereby reduced signal interference, improved the reliability of Intelligent Power Module.
With reference to Fig. 2, Fig. 2 is the module assembled structural representation of another embodiment of the utility model Intelligent Power Module.
In one embodiment, this Intelligent Power Module comprises that metal substrate 208, the first full-bridge drive chip 400, the second full-bridge to drive chip 500, the 3rd full-bridge to drive on chip 600, first on brachium pontis power device 401, first time brachium pontis power device 402, second brachium pontis power device 405, the 3rd time brachium pontis power device 406 on brachium pontis power device 403, second time brachium pontis power device 404, the 3rd.In the present embodiment, on brachium pontis power device 401 on above-mentioned first, first time brachium pontis power device 402, second, on brachium pontis power device 403, second time brachium pontis power device 404, the 3rd, brachium pontis power device 405, the 3rd time brachium pontis power device 406 are IGBT pipe, and the grid of IGBT pipe is control end.
In the present embodiment, metal substrate 208 is rectangle, metal substrate 208 is provided with the first area that drives chip 400 for the first full-bridge is installed, the 3rd region that drives the second area of chip 500 and drive chip 600 for the 3rd full-bridge is installed for the second full-bridge is installed, wherein, above-mentioned first area, second area and the 3rd region successively equidistantly linear array on metal substrate 208, be also above-mentioned the first full-bridge drive chip 400, the second full-bridge drive chip 500, the 3rd full-bridge drive chip 600 successively equidistantly linear array on metal substrate 208.
Further, on metal substrate 208, be also provided with the 4th region for brachium pontis power device 401 on first is installed, for the 5th region of first time brachium pontis power device 402 is installed, for the 6th region of brachium pontis power device 403 on second is installed, for the SECTOR-SEVEN territory of second time brachium pontis power device 404 is installed, for the Section Eight territory of brachium pontis power device 405 on the 3rd being installed and for the 9th region of the 3rd time brachium pontis power device 406 is installed.
Wherein, above-mentioned the 4th region, the 5th region, the 6th region, SECTOR-SEVEN territory, Section Eight territory and the 9th region successively equidistantly linear array in first area, the same side in second area and the 3rd region, it is brachium pontis power device 401 on above-mentioned first, first time brachium pontis power device 402, brachium pontis power device 403 on second, second time brachium pontis power device 404, brachium pontis power device 405 on the 3rd, the 3rd time brachium pontis power device 406 successively equidistantly linear array in the first full-bridge, drive chip 400, the second full-bridge drives chip 500 and the 3rd full-bridge to drive the same side of chip 600.The present embodiment, due to brachium pontis power device 405 on brachium pontis power device on brachium pontis power device on above-mentioned first 401, first time brachium pontis power device 402, second 403, second time brachium pontis power device 404, the 3rd, the 3rd time brachium pontis power device 406 successively equidistantly linear array in the first full-bridge, drive chip 400, the second full-bridge to drive chip 500 and the 3rd full-bridge to drive the same side of chip 600, the present embodiment can better be isolated forceful electric power signal and weak electric signal, thereby can reduce the impact of forceful electric power signal on weak electric signal
Further, in the present embodiment, above-mentioned first area, second area and the 3rd region successively equidistantly linear array in a side of the center line 220 of metal substrate 208 long side directions; Above-mentioned the 4th region, the 5th region, the 6th region, SECTOR-SEVEN territory, Section Eight territory and the 9th region successively equidistantly linear array in the opposite side of the center line 220 of metal substrate 208 long side directions.Be above-mentioned the first full-bridge drive chip 400, the second full-bridge drive chip 500 and the 3rd full-bridge drive chip 600 successively equidistantly linear array in a side of the center line 220 of metal substrate 208 long side directions, brachium pontis power device 405 on brachium pontis power device 403, second time brachium pontis power device 404, the 3rd on brachium pontis power device 401 on above-mentioned first, first time brachium pontis power device 402, second, the 3rd time brachium pontis power device 406 successively equidistantly linear array in the opposite side of the center line 220 of metal substrate 208 long side directions.
Further, in the present embodiment, the centre distance in centre distance, Section Eight territory and the 3rd region of centre distance, SECTOR-SEVEN territory and the second area of the centre distance of the centre distance of the 4th region and first area, the 5th region and first area, the 6th region and second area, and the 9th region all equates with the centre distance in the 3rd region.Brachium pontis power device 401 and the first full-bridge drive the centre distance of chip 400, first time brachium pontis power device 402 and the first full-bridge to drive brachium pontis power device 403 and the second full-bridge in the centre distance, second of chip 400 to drive the centre distance of brachium pontis power device 405 and the 3rd full-bridge driving chip 600 in the centre distance, the 3rd of the centre distance of chip 500, second time brachium pontis power device 404 and the second full-bridge driving chip 500 on first, and the 3rd time brachium pontis power device 406 all equates with the centre distance of the 3rd full-bridge driving chip 600.
And, in the present embodiment, on two long limits of metal substrate 208 (calling the first long limit and the second long limit in the following text), be equipped with some input and output pins.Concrete, metal substrate 208 first long limits (scheming not label) are provided with pin 31, the pin 32 for being connected with ground wire, the pin 34 of going up mutually brachium pontis control signal for inputting U for input service voltage, for inputting U, descend mutually the pin 35 of brachium pontis control signal, for inputting V, go up mutually brachium pontis control signal pin 36, for inputting V, descend mutually brachium pontis control signal pin 37, for inputting W, go up mutually the pin 38 of brachium pontis control signal and input the pin 39 that W descends brachium pontis control signal mutually, the second long limit (scheming not label) of metal substrate 108 is provided with the pin 33 (being the ceiling voltage point input pin of Intelligent Power Module) for being connected with busbar voltage input, for the pin 40 (practical applications that are connected with U phase higher-pressure region power supply phase negative terminal, this pin 40 is connected with three phase electric machine A), for the pin 41 (practical applications that are connected with V phase higher-pressure region power supply negative terminal, this pin 41 is connected with three phase electric machine B), for the pin 42 (practical applications that are connected with W phase higher-pressure region power supply negative terminal, this pin 42 is connected with three phase electric machine C), for with U phase hold the pin 43 being connected, for with V phase hold the pin 44 that is connected and for W phase hold the pin 45 being connected.
Further, on the metal substrate in the present embodiment 208, be also provided with some resistance 209.The first full-bridge drives chip 400, the second full-bridge to drive chip 500, the 3rd full-bridge to drive the control input end of chip 600 to include brachium pontis control signal input and lower brachium pontis control signal input, and the first full-bridge drives chip 400, the second full-bridge to drive chip 500, the 3rd full-bridge to drive the drive output of chip 600 to include brachium pontis drive output and lower brachium pontis drive output.Wherein, the first full-bridge drives chip 400, the second full-bridge to drive chip 500, the 3rd full-bridge to drive the power input of chip 600 all via circuit board cabling, to be connected with pin 31, and the first full-bridge drives chip 400, the second full-bridge to drive chip 500, the 3rd full-bridge to drive the ground end of chip 600 all via circuit board cabling, to be connected with pin 32; The first full-bridge drives the upper brachium pontis control signal input of chip 400 to be connected with pin 34 via circuit board cabling, and the first full-bridge drives the lower brachium pontis control signal input of chip 400 to be connected with pin 35 via circuit board cabling; The second full-bridge drives the upper brachium pontis control signal input of chip 500 to be connected with pin 36 via circuit board cabling, and the second full-bridge drives the lower brachium pontis control signal input of chip 500 to be connected with pin 37 via circuit board cabling; The 3rd full-bridge drives the upper brachium pontis control signal input of chip 600 to be connected with pin 38 via circuit board cabling, and the 3rd full-bridge drives the lower brachium pontis control signal input of chip 600 to be connected with pin 39 via circuit board cabling; The upper brachium pontis drive output that the first full-bridge drives chip 400 through a resistance with first on the control end of brachium pontis power device 401 be connected, the lower brachium pontis drive output of the first full-bridge driving chip 400 is connected with the control end of first time brachium pontis power device 402 through a resistance; The upper brachium pontis drive output that the second full-bridge drives chip 500 through a resistance with second on the control end of brachium pontis power device 403 be connected, the lower brachium pontis drive output of the second full-bridge driving chip 500 is connected with the control end of second time brachium pontis power device 404 through a resistance; The upper brachium pontis drive output that the 3rd full-bridge drives chip 600 through a resistance with the 3rd on the control end of brachium pontis power device 405 be connected, the lower brachium pontis drive output of the 3rd full-bridge driving chip 600 is connected with the control end of the 3rd time brachium pontis power device 406 through a resistance.On first, on brachium pontis power device 401, second, on brachium pontis power device 403 and the 3rd, the collector electrode of brachium pontis power device 405 links together via circuit board cabling, is connected with pin 33 simultaneously; On first, the collector electrode of the emitter of brachium pontis power device 401 and first time brachium pontis power device 402 links together via circuit board cabling and aluminum steel, is connected via circuit board cabling with pin 40 simultaneously; On second, the collector electrode of the emitter of brachium pontis power device 403 and second time brachium pontis power device 404 links together via circuit board cabling and aluminum steel, is connected via circuit board cabling with pin 41 simultaneously; On the 3rd, the collector electrode of the emitter of brachium pontis power device 405 and the 3rd time brachium pontis power device 406 links together via circuit board cabling and aluminum steel, is connected via circuit board cabling with pin 42 simultaneously; The emitter of first time brachium pontis power device 402 is connected with pin 43 via circuit board cabling, the emitter of second time brachium pontis power device 404 is connected with pin 44 via circuit board cabling, and the emitter of the 3rd time brachium pontis power device 406 is connected with pin 45 via circuit board cabling.
The Intelligent Power Module that the present embodiment provides, because its input and output pin is drawn from these Intelligent Power Module both sides, from one-sided mode of drawing, is more conducive to wiring and the layout of peripheral circuit plate with respect to pin in prior art equally; And, the present embodiment Intelligent Power Module also can make respectively to drive the drive output of chip the shortest to the driving signal lead (being the metal substrate grid driver circuit of mentioning in background technology) between the control end of corresponding power device, thereby reduced signal interference, improved the reliability of Intelligent Power Module; Simultaneously, the Intelligent Power Module providing due to embodiment, its each power device is only positioned at the first full-bridge and drives chip, the second full-bridge to drive chip and the 3rd full-bridge to drive a side of chip, the present embodiment can better be isolated strong, weak electricity signal, thereby can reduce the impact of forceful electric power signal on weak electric signal, improve further the reliability of Intelligent Power Module.
These are only preferred embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (10)
1. an Intelligent Power Module, it is characterized in that, described Intelligent Power Module comprise metal substrate, for drive the first full-bridge of brachium pontis power device and first time brachium pontis power device on first drive chip, for driving the second full-bridge of brachium pontis power device and second time brachium pontis power device on second to drive chip, and for driving the 3rd full-bridge of brachium pontis power device and the 3rd time brachium pontis power device on the 3rd to drive chip; Described metal substrate is provided with the first area that drives chip for described the first full-bridge is installed, the 3rd region that drives the second area of chip and drive chip for described the 3rd full-bridge is installed for described the second full-bridge is installed; Described first area, second area and the 3rd region successively equidistantly linear array on described metal substrate.
2. Intelligent Power Module as claimed in claim 1, is characterized in that, described metal substrate is rectangle, and described first area, second area and the 3rd region are successively equidistantly on the center line of linear array in described metal substrate along long side direction.
3. Intelligent Power Module as claimed in claim 2, it is characterized in that, on described metal substrate, be also provided with the 4th region for brachium pontis power device on described first is installed, for the 5th region of described first time brachium pontis power device is installed, for the 6th region of brachium pontis power device on described second is installed, for the SECTOR-SEVEN territory of described second time brachium pontis power device is installed, for the Section Eight territory of brachium pontis power device on the described the 3rd being installed and for the 9th region of described the 3rd time brachium pontis power device is installed; Wherein,
Described the 4th region and described the 5th region symmetric arrays be in the both sides of described first area, and described the 4th region, the 5th region and first area are in line and are arranged in the short side direction of described metal substrate; Described the 6th region and described SECTOR-SEVEN territory symmetric arrays be in the both sides of described second area, and described the 6th region, SECTOR-SEVEN territory and second area are in line and are arranged in the short side direction of described metal substrate; Described Section Eight territory and described the 9th region symmetric arrays be in the both sides in described the 3rd region, and described Section Eight territory, the 9th region and the 3rd region are in line and are arranged in the short side direction of described metal substrate.
4. Intelligent Power Module as claimed in claim 3, it is characterized in that, described the 4th region, the 6th region and Section Eight territory successively equidistantly linear array in a side of the center line of described metal substrate long side direction, described the 5th region, SECTOR-SEVEN territory and the 9th region successively equidistantly linear array in the opposite side of the center line of described metal substrate long side direction.
5. Intelligent Power Module as claimed in claim 4, it is characterized in that, the centre distance of the centre distance of described the 4th region and described first area, described the 6th region and described second area, and described Section Eight territory all equates with the centre distance in described the 3rd region.
6. Intelligent Power Module as claimed in claim 2, is characterized in that, on the first side of described metal substrate, Second Edge and the 3rd limit, is equipped with some input and output pins.
7. Intelligent Power Module as claimed in claim 1, it is characterized in that, on described metal substrate, be also provided with the 4th region for brachium pontis power device on described first is installed, for the 5th region of described first time brachium pontis power device is installed, for the 6th region of brachium pontis power device on described second is installed, for the SECTOR-SEVEN territory of described second time brachium pontis power device is installed, for the Section Eight territory of brachium pontis power device on the described the 3rd being installed and for the 9th region of described the 3rd time brachium pontis power device is installed; Wherein,
Described the 4th region, the 5th region, the 6th region, SECTOR-SEVEN territory, Section Eight territory and the 9th region successively equidistantly linear array in described first area, the same side in second area and the 3rd region.
8. Intelligent Power Module as claimed in claim 7, is characterized in that, described metal substrate is rectangle, described first area, second area and the 3rd region successively equidistantly linear array in a side of the center line of described metal substrate long side direction; Described the 4th region, the 5th region, the 6th region, SECTOR-SEVEN territory, Section Eight territory and the 9th region successively equidistantly linear array in the opposite side of the center line of described metal substrate long side direction.
9. Intelligent Power Module as claimed in claim 8, it is characterized in that, the centre distance in centre distance, described Section Eight territory and described the 3rd region of centre distance, described SECTOR-SEVEN territory and the described second area of the centre distance of the centre distance of described the 4th region and described first area, described the 5th region and described first area, described the 6th region and described second area, and described the 9th region all equates with the centre distance in described the 3rd region.
10. Intelligent Power Module as claimed in claim 8, is characterized in that, on two long limits of described metal substrate, is equipped with some input and output pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420343829.7U CN203932060U (en) | 2014-06-24 | 2014-06-24 | Intelligent power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420343829.7U CN203932060U (en) | 2014-06-24 | 2014-06-24 | Intelligent power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203932060U true CN203932060U (en) | 2014-11-05 |
Family
ID=51827830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420343829.7U Expired - Fee Related CN203932060U (en) | 2014-06-24 | 2014-06-24 | Intelligent power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203932060U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300883A (en) * | 2018-10-31 | 2019-02-01 | 广东美的制冷设备有限公司 | Highly integrated electric-controlled plate and electric appliance |
| CN109980955A (en) * | 2019-04-26 | 2019-07-05 | 广东美的制冷设备有限公司 | Intelligent power module and air conditioner |
| CN110060991A (en) * | 2019-04-26 | 2019-07-26 | 广东美的制冷设备有限公司 | Intelligent power module and air conditioner |
-
2014
- 2014-06-24 CN CN201420343829.7U patent/CN203932060U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300883A (en) * | 2018-10-31 | 2019-02-01 | 广东美的制冷设备有限公司 | Highly integrated electric-controlled plate and electric appliance |
| CN109980955A (en) * | 2019-04-26 | 2019-07-05 | 广东美的制冷设备有限公司 | Intelligent power module and air conditioner |
| CN110060991A (en) * | 2019-04-26 | 2019-07-26 | 广东美的制冷设备有限公司 | Intelligent power module and air conditioner |
| CN110060991B (en) * | 2019-04-26 | 2021-06-22 | 广东美的制冷设备有限公司 | Intelligent power module and air conditioner |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104022414B (en) | A kind of stack bus bar | |
| CN101582413B (en) | Power module with lower stray inductance | |
| CN203932060U (en) | Intelligent power module | |
| CN201417771Y (en) | Power module with lower stray inductance | |
| CN203883271U (en) | Novel aminated busbar | |
| CN107204319A (en) | Small-signal voltage stabilizing semiconductor devices | |
| CN102097418B (en) | IGBT driving unit | |
| CN102013422B (en) | Insulated gate bipolar translator power tube module | |
| CN110335864A (en) | A kind of power modules | |
| CN201839188U (en) | Multi-inverter parallel output current equalizing structure | |
| CN213094567U (en) | Copper bar assembly and motor controller | |
| CN209880607U (en) | Novel semiconductor IGBT module combination | |
| CN209120068U (en) | A kind of power circuit package and electronic device | |
| CN202373604U (en) | Combination module for combiner box | |
| CN201904716U (en) | Intelligent power module component and variable frequency speed regulation system | |
| CN202889239U (en) | Fixing structure for inverter power switch tube | |
| CN105958837B (en) | A kind of power module equipped with partition electrode | |
| CN101752997A (en) | Parallel IGBT module copper bar installation structure | |
| CN218570110U (en) | NPC topological circuit, circuit board and electrical apparatus | |
| CN105490558A (en) | Diode clamped three-level converter and power system thereof | |
| JP6811414B2 (en) | Circuit module and inverter device using it | |
| CN201601597U (en) | Mounting structure of parallel-connected IGBT module copper row | |
| CN205723530U (en) | A kind of power model being provided with electrode large arm | |
| CN105789159B (en) | A kind of power module of electrode connection points matrix arrangement | |
| CN110233145A (en) | A kind of power module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141105 |