CN106611758B - Integrated power module packaging structure - Google Patents

Abstract

An integrated power module packaging structure includes a housing, a first circuit substrate, a second circuit substrate, a first pin, a second pin and a third pin. The housing has a cavity, and the second circuit substrate is located relatively above the first circuit substrate and is accommodated in the cavity. A switch module is arranged on the first circuit substrate. A high-end current/voltage detection element and a drive element are arranged on the second circuit substrate. The first pin, the second pin and the third pin are arranged between the first circuit substrate and the second circuit substrate. The first pin is connected in series with the high-end current/voltage detection element and the switch module. The second pin is connected to the switch module. The drive element controls the switch module through the third pin.

Description

Integrated Power Module Package Structure

technical field

The invention relates to a package structure, in particular to an integrated power module package structure.

Background technique

In response to the development trend of global automation and power saving, speed control devices are required to be applied in various occasions, so variable frequency drives and motors are used to achieve different speed requirements. However, the traditional integrated power module only integrates the switch module and the bridge rectifier of the variable frequency drive, and does not integrate other components of the variable frequency drive, such as driving components. And in order to cope with today's industrial control environment, it is often necessary to deploy additional detection components to detect the high/low-side voltage and current of the variable frequency driver. However, due to the isolation requirements of these components, the volume of the variable frequency drive will be too large, which does not meet the trend of miniaturization, high power, and high density of current products.

SUMMARY OF THE INVENTION

The technical problem to be solved by the present invention is to provide an integrated power module packaging structure, which is used to integrate the detection element, the driving element and the switch module in the same package to reduce the overall volume.

In order to achieve the above object, the present invention provides an integrated power module packaging structure, comprising a casing, a first circuit substrate, a second circuit substrate, a first pin, a second pin and a third lead foot. The casing has a cavity, and the second circuit substrate is located opposite to the first circuit substrate and both are accommodated in the cavity. A switch module is arranged on the first circuit substrate. A high-side current/voltage detecting element and a driving element are arranged on the second circuit substrate. The first pin, the second pin and the third pin are arranged between the first circuit substrate and the second circuit substrate. The first pin is connected in series with the high-side current/voltage detection element and the switch module. The second pin is connected to the switch module. The driving element controls the switch module through the third pin.

In one embodiment, a low-side current detection element is disposed on the first circuit substrate. The first pin is also connected in series with the low-side current detecting element, the switch module and the high-side current/voltage detecting element.

In one embodiment, it further includes a third circuit substrate disposed outside the casing. A power supply element is disposed on the third circuit substrate, and the power supply element has a positive voltage terminal and a negative voltage terminal.

In one embodiment, a fourth pin is further included, which is disposed between the second circuit substrate and the third circuit substrate and is connected to the positive voltage terminal of the power supply element. The low-side current detection element, the switch module and the high-side current/voltage detection element connected in series are connected to the positive voltage terminal of the power supply element through the first pin and the fourth pin. The low-side current detection element, the switch module and the high-side current/voltage detection element connected in series can be connected to the negative voltage terminal of the power supply element through the second pin.

In one embodiment, a fifth pin is further included, which is disposed on the second circuit substrate. The high-side current/voltage detection element detects the power supply element and generates a high-side current/voltage detection signal to output to the fifth pin.

In one embodiment, a sixth pin is further included, which is disposed on the first circuit substrate and penetrates the two circuit substrates. The low-side current detection element detects the electrical element and generates a low-side current detection signal to output to the sixth pin.

In one embodiment, a controller is further included, disposed outside the casing, and used for receiving the high-side current/voltage detection signal output by the fifth pin and the low-side current detection signal output by the sixth pin.

In one embodiment, the controller is disposed on the third circuit substrate.

In one embodiment, a seventh pin is further included, which is disposed between the second circuit substrate and the third circuit substrate, and the controller controls the driving element through the seventh pin.

The technical effect of the present invention is:

Due to the integrated power module packaging structure of the technical solution, the components are sequentially arranged on the substrates stacked on each other through the stacked packaging structure, so that there is a higher concentration density among the components. In addition to including the existing switch module, a high-side current/voltage detection element with key functions can be integrated into the package structure, so it has packaging benefits.

The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention.

Description of drawings

1 is a cross-sectional view of a package structure of an integrated power module according to an embodiment of the present invention;

2 is a perspective view of an integrated power module package structure according to an embodiment of the present invention;

3 is a cross-sectional view of integrating a power module packaging structure and an external circuit substrate according to an embodiment of the present invention;

4 is a perspective view of an integrated power module package structure and an external circuit substrate according to an embodiment of the present invention.

where the reference number

10 Integrated power module package structure

100 shells

101 cavity

102 Sidewall

103 Support

110 The first circuit substrate

111 Low-side current sensing element

112 switch module

113 Copper layer

114 Ceramic substrate

120 Second circuit substrate

121 High Side Current/Voltage Sensing Element

122 Drive elements

131 First pin

132 Second pin

133 Third pin

134 Fourth pin

135 Fifth pin

136 sixth pin

137 Seventh pin

140 Third circuit substrate

141 Power supply elements

150 Controllers

Detailed ways

Below in conjunction with accompanying drawing, structure principle and working principle of the present invention are described in detail:

For a more detailed and complete description of the content of the present invention, reference may be made to the accompanying drawings and the various embodiments described below, where the same numerals in the drawings represent the same or similar elements. However, the provided embodiments are not intended to limit the scope of the present invention, and the description of the structure operation is not intended to limit the order of its execution. Any recombination of components, resulting in a device with equal efficacy, is the the scope of the invention.

The drawings are for illustrative purposes only and are not drawn according to the original size. On the other hand, well-known elements and procedures have not been described in the embodiments in order not to unnecessarily limit the present invention.

According to the integrated power module package structure of the present invention, in addition to the existing switch module, current/voltage detection elements with key functions are integrated into the package structure, and a stacked package structure is adopted, so that each element is arranged in sequence On the substrates stacked on each other, therefore, a higher concentration density between components can be achieved, which not only reduces the overall volume of the power module, but also integrates an additional key component into the power module when the overall volume is reduced. , with encapsulation benefits. In addition, with the stacked structure, the traces between the components can be minimized, noise caused by excessively long traces can be avoided, and noise interference can be reduced. FIG. 1 is a cross-sectional view of a package structure of an integrated power module according to an embodiment of the present invention. FIG. 2 is a perspective view of a package structure of an integrated power module according to an embodiment of the present invention. See also Figure 1 and Figure 2. The integrated power module package structure 10 includes at least a casing 100 , a first circuit substrate 110 , a second circuit substrate 120 and three pins, which are a first pin 131 , a second pin 132 and a first pin 131 respectively. Three pins 133. The casing 100 has a cavity 101 . The casing 100 has a side wall 102 surrounding the cavity 101 , and a protruding support portion 103 may be provided on the side wall 102 for supporting the second circuit substrate 120 .

The first circuit substrate 110 and the second circuit substrate 120 are accommodated in the cavity 101 . The first circuit substrate 110 may be fixed on the casing 100 by using materials such as adhesives. A switch module 112 is disposed on the first circuit substrate 110 . In one embodiment, the switch module 112 may be an IGBT, a MOSFET, a DIODE, etc., and the switch module 112 may be a single switch or a plurality of switches to form different connection combinations. Since the switch module 112 generates a large amount of heat during operation, the first circuit substrate 110 is preferably a substrate with good thermal conductivity. For example, the first circuit substrate 110 may include a ceramic substrate 114 and a copper layer 113 coated on the ceramic substrate. Since copper is a material with good thermal conductivity, the heat generated by the switch module 112 can be quickly taken away to avoid heat dissipation. The switch module 112 is disposed on the upper surface of the ceramic substrate 114 . It should be noted that the pattern of the copper layer 113 must avoid the pins of the switch module 112 to prevent the pins of the switch module 112 from being turned on through the copper layer 113 and causing a short circuit. The second circuit substrate 120 is located on the opposite side of the first circuit substrate 110, and the second circuit substrate 120 can be fixed on the support portion 103 of the side wall 102 through materials such as adhesives. The component wiring between the first circuit substrate 110 and the second circuit substrate 120 is the shortest, so as to avoid noise caused by the long wiring and interfere with the operation of the components. The second circuit substrate 120 is used as a driving substrate, and a high-end current/voltage detecting element 121 and a driving element 122 are disposed thereon. The high-side current/voltage detection element 121 is a detection element disposed at the positive voltage terminal (+), wherein the current detection part can use a shunt resistor for detection, and the voltage detection part can use the voltage of the positive voltage terminal (+) detection circuit to detect. The second circuit substrate 120 can be a multi-layer printed circuit board, and the signals of the high-side current/voltage detection element 121 and the driving element 122 can be respectively guided to the corresponding first pins through the metal interconnects of the multi-layer printed circuit board. 131 , the second pin 132 or the third pin 133 for signal transmission with the switch module 112 on the first circuit substrate 110 .

The first lead 131 , the second lead 132 and the third lead 133 are disposed between the first circuit substrate 110 and the second circuit substrate 120 . The first pin 131 is used to connect the high-side current/voltage detection element 121 on the second circuit substrate 120 and the switch module 112 on the first circuit substrate 110 in series. The second pin 132 is connected to the switch module 112 . The second pins 132 protrude out of the casing 100 to be electrically connected with external components. On the other hand, the first pins 131 do not protrude from the casing 100 . The third pin 133 is used to connect the driving element 122 and the switch module 112 , so that the driving element 122 can control the switch module 112 through the third pin 133 .

In addition, a low-side current detection element 111 may also be disposed on the first circuit substrate 110 . The low-side current detection element 111 is a detection element disposed at the negative voltage terminal (-), wherein the current detection part can use a shunt resistor for detection. The low-side current detection element 111 is connected to the second pin 132 . That is to say, the high-side current/voltage detecting element 121 on the second circuit substrate 120 and the low-side current detecting element 111 and the switch module 112 on the first circuit substrate 110 can be connected through the first pin 131 and the second lead 132 . Concatenate. Since the switch module 112 is connected to the second pins 132 , the second pins 132 protrude out of the casing 100 and are electrically connected to external components. Therefore, in another embodiment, FIG. 3 shows a cross-sectional view of an integrated power module package structure and an external circuit substrate according to an embodiment of the present invention, and FIG. 4 shows an integrated power module according to another embodiment of the present invention. A three-dimensional view of the package structure of the power module and an external circuit substrate, outside the housing 100, a third circuit substrate 140 is additionally disposed, and a power supply element 141 is disposed on the third circuit substrate 140, and the power supply element 141 has a positive voltage terminal ( +) and a negative voltage terminal (-).

In order to enable the power supply element 141 to supply power to the high-side current/voltage detection element 121 on the second circuit substrate 120, as well as the low-side current detection element 111 and the switch module 112 on the first circuit substrate 110, the power supply element 141 also supplies power to the second circuit substrate. A fourth pin 134 is disposed between the 120 and the third circuit substrate 140 , wherein the fourth pin 134 is connected to the positive voltage terminal (+) of the power supply element 141 , and the second pin 132 protruding from the casing 100 is The negative voltage terminal (-) of the power supply element 141 is connected. Thereby, through the first pin 131 , the second pin 132 and the fourth pin 134 , the low-side current detection element 111 on the first circuit substrate 110 , the switch module 112 and the high-side current on the second circuit substrate 120 can be The voltage detection element 121 is connected to the positive voltage terminal (+) and the negative voltage terminal (-) of the power supply element 141 to form a loop. It is worth mentioning that the loop may include other energy storage elements such as inductors located outside the casing 100 . Therefore, the power supply element 141 can supply power to the low-side current detection element 111 , the switch module 112 and the high-side current/voltage detection element 121 through this loop, wherein the switch module 112 includes at least one power element.

On the other hand, a controller 150 disposed outside the casing 100 can output a control signal to control the driving element 122 to control the duty cycle of the switch module 112 through the third pin 133 to adjust the output power of the power module. The controller 150 outputs according to a high-side current/voltage detection signal generated by the high-side current/voltage detection element 121 detected by the power supply element 141 , or a low-side current detection signal generated by the low-side current detection element 111 detected by the power supply element 141 . This control signal is given to the drive element 122 . Therefore, the high-side current/voltage detection signal generated by the high-side current/voltage detection element 121 and the low-side current detection signal generated by the low-side current detection element 111 can be transmitted to the controller 150 . Therefore, a fifth pin 135 is disposed on the second circuit substrate 120 to extract the high-side current/voltage detection signal generated by the high-side current/voltage detecting element 121 on the second circuit substrate 120 to the controller 150, and the first The circuit substrate 110 is provided with a sixth pin 136 penetrating through the second circuit substrate 120 to extract the low-side current detection signal generated by the low-side current detecting element 111 on the first circuit substrate 110 to the controller 150 .

In one embodiment, the controller 150 may be disposed on the third circuit substrate 140 . Accordingly, the fifth pin 135 is disposed between the second circuit substrate 120 and the third circuit substrate 140 to extract the high-side current/voltage detection signal generated by the high-side current/voltage detecting element 121 on the second circuit substrate 120 and provide it to The controller 150 on the third circuit substrate 140 . The sixth pin 136 is disposed between the first circuit substrate 110 and the third circuit substrate 140 and penetrates through the second circuit substrate 120 to extract the low-end current detection signal generated by the low-end current detection element 111 on the first circuit substrate 110 to provide to the controller 150 on the third circuit substrate 140 . In addition, in order to enable the control signal output by the controller 150 to be transmitted to the driving element 122 on the second substrate 120, a seventh pin 137 is also arranged between the second circuit substrate 120 and the third circuit substrate 140, so that the controller 150 can control the driving element 122 through the seventh pin 137 to control the duty cycle of the switch module 112 on the first circuit substrate 110 through the third pin 133 to adjust the output power of the power module 10 .

Accordingly, in the integrated power module packaging structure of the present invention, the components are sequentially arranged on the substrates stacked on each other through the stacked packaging structure, so that there is a higher concentration density among the components. In addition to including the existing switch module, a high-side current/voltage detection element with key functions is integrated into the package structure, so it has great packaging benefits.

Of course, the present invention can also have other various embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding Changes and deformations should belong to the protection scope of the appended claims of the present invention.

Claims (9)

1. An integrated power module packaging structure, characterized in that, at least comprising: a shell having a cavity; a first circuit substrate accommodated in the cavity, wherein the first circuit substrate is provided with a switch module; a second circuit substrate, accommodated in the cavity, and positioned opposite to the first circuit substrate to form a stacked structure with the first circuit substrate, so that the components between the first circuit substrate and the second circuit substrate The wiring is the shortest, wherein the second circuit substrate is provided with a high-end current/voltage detection element and a driving element; A first pin, a second pin and a third pin are disposed between the first circuit substrate and the second circuit substrate, wherein the first pin is connected in series with the high-side current/voltage detection element and the switch a module, the second pin is connected to the switch module, and the driving element controls the switch module through the third pin; and A low-end current detection element is disposed on the first circuit substrate, wherein the second pin is also connected in series with the low-end current detection element and the switch module. 2 . The package structure of an integrated power module as claimed in claim 1 , further comprising a third circuit substrate disposed outside the casing, wherein the third circuit substrate is provided with a power supply element, and the power supply element has a positive voltage terminal and a negative voltage terminal. 3. The integrated power module package structure of claim 2, further comprising a fourth pin disposed between the second circuit substrate and the third circuit substrate and connected to the positive voltage of the power supply element end, where: The switch module and the high-side current/voltage detection element are connected in series with the positive voltage terminal of the power supply element through the first pin and the fourth pin, and The low-side current detection element and the switch module connected in series are connected to the negative voltage terminal of the power supply element through the second pin. 4. The integrated power module package structure of claim 3, further comprising a fifth pin disposed on the second circuit substrate, wherein the high-side current/voltage detection element detects the power supply element and generates a fifth pin A high-side current/voltage detection signal is output to the fifth pin. 5 . The package structure of an integrated power module as claimed in claim 4 , further comprising a sixth pin disposed on the first circuit substrate and penetrating between the two circuit substrates, wherein the low-end current detection element The power supply element is detected and a low-end current detection signal is generated and output to the sixth pin. 6. The package structure of an integrated power module as claimed in claim 5, further comprising a controller disposed outside the casing for receiving the high-side current/voltage detection signal output by the fifth pin, and The low-side current detection signal output by the sixth pin. 7 . The integrated power module package structure of claim 6 , wherein the controller is disposed on the third circuit substrate. 8 . 8 . The package structure of the integrated power module as claimed in claim 7 , further comprising a seventh pin disposed between the second circuit substrate and the third circuit substrate, and the controller passes through the seventh pin. 9 . pin controls the drive element. 9 . The package structure of an integrated power module as claimed in claim 1 , wherein the switch module comprises at least one power element. 10 .

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