CN106611758B - Integrated power module packaging structure - Google Patents
Integrated power module packaging structure Download PDFInfo
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- CN106611758B CN106611758B CN201510694383.1A CN201510694383A CN106611758B CN 106611758 B CN106611758 B CN 106611758B CN 201510694383 A CN201510694383 A CN 201510694383A CN 106611758 B CN106611758 B CN 106611758B
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- side current
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Abstract
An integrated power module package structure includes a housing, a first circuit substrate, a second circuit substrate, a first pin, a second pin and a third pin. The shell is provided with a cavity, and the second circuit substrate is positioned above the first circuit substrate and is accommodated in the cavity. The first circuit substrate is provided with a switch module. The second circuit substrate is provided with a high-end current/voltage detection element and a driving element. The first pin, the second pin and the third pin are arranged between the first circuit substrate and the second circuit substrate. The first pin is connected in series with the high-end current/voltage detection element and the switch module. The second pin is connected with the switch module. The driving element controls the switch module through the third pin.
Description
Technical Field
The present invention relates to a package structure, and more particularly, to a package structure for an integrated power module.
Background
In response to the development trend of global automation and power saving, speed regulating devices are required to be applied to various occasions, so that variable frequency drivers and motors are adopted to meet different rotating speed requirements. However, the conventional integrated power module only integrates the switch module and the bridge rectifier of the variable frequency driver, and other components of the variable frequency driver, such as the driving components, are not integrated. In order to cope with the current industrial control environment, additional detection elements are often disposed to detect the high/low-side voltage and current of the variable frequency driver. However, the size of the inverter driver is too large due to the isolation requirement of these devices, and the trend of miniaturization, high power and high density of the present products is not met.
Disclosure of Invention
The present invention provides an integrated power module package structure, which is used to integrate a detection element, a driving element and a switch module in a same package body, so as to reduce the overall volume.
In order to achieve the above object, the present invention provides an integrated power module package structure, which includes a housing, a first circuit board, a second circuit board, a first lead, a second lead, and a third lead. The shell is provided with a cavity, and the second circuit substrate is positioned above the first circuit substrate and is accommodated in the cavity. The first circuit substrate is provided with a switch module. The second circuit substrate is provided with a high-end current/voltage detection element and a driving element. The first pin, the second pin and the third pin are arranged between the first circuit substrate and the second circuit substrate. The first pin is connected in series with the high-end current/voltage detection element and the switch module. The second pin is connected with the switch module. The driving element controls the switch module through the third pin.
In one embodiment, a low-side current detecting element is disposed on the first circuit substrate. The first pin is also connected in series with the low-side current detection element, the switch module and the high-side current/voltage detection element.
In an embodiment, the package further includes a third circuit substrate disposed outside the housing. The third circuit substrate is provided with a power supply element, and the power supply element is provided with a positive voltage end and a negative voltage end.
In an embodiment, the power supply device further includes a fourth pin disposed between the second circuit substrate and the third circuit substrate and connected to the positive voltage terminal of the power supply element. The low-side current detection element, the switch module and the high-side current/voltage detection element which are connected in series are connected with the positive voltage end of the power supply element through the first pin and the fourth pin. The low-side current detection element, the switch module and the high-side current/voltage detection element which are connected in series can be connected with the negative voltage end of the power supply element through the second pin.
In an embodiment, the package further includes a fifth pin disposed on the second circuit substrate. The high-side current/voltage detection element detects the power supply element and generates a high-side current/voltage detection signal to be output to the fifth pin.
In an embodiment, the first circuit substrate further includes a sixth pin disposed on the first circuit substrate and penetrating through the two circuit substrates. The low-side current detection element detects the electric element and generates a low-side current detection signal to be output to the sixth pin.
In an embodiment, the power supply further includes a controller disposed outside the housing for receiving the high-side current/voltage detection signal output by the fifth pin and the low-side current detection signal output by the sixth pin.
In one embodiment, a controller is disposed on the third circuit substrate.
In an embodiment, the display device further includes a seventh pin disposed between the second circuit substrate and the third circuit substrate, and the controller controls the driving element through the seventh pin.
The invention has the technical effects that:
because the integrated power module packaging structure of the technical scheme enables the elements to be sequentially arranged on the mutually stacked substrates through the stacked packaging structure, the elements have higher concentration density. Besides the existing switch module, the high-end current/voltage detection element with the key function can be integrated into the packaging structure, so that the packaging efficiency is high.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
Fig. 1 is a cross-sectional view of an integrated power module package structure according to an embodiment of the invention;
fig. 2 is a perspective view of an integrated power module package structure according to an embodiment of the invention;
FIG. 3 is a cross-sectional view of an integrated power module package structure and an external circuit substrate according to an embodiment of the invention;
fig. 4 is a perspective view of an integrated power module package structure and an external circuit substrate according to an embodiment of the invention.
Wherein the reference numerals
10 integrated power module packaging structure
100 case
101 cavity
102 side wall
103 support part
110 first circuit board
111 low-side current detecting element
112 switch module
113 copper layer
114 ceramic substrate
120 second circuit substrate
121 high-end current/voltage detection element
122 drive element
131 first pin
132 second pin
133 third leg
134 fourth pin
135 fifth pin
136 sixth pin
137 seventh lead
140 third circuit board
141 power supply element
150 controller
Detailed Description
The invention will be described in detail with reference to the following drawings, which are provided for illustration purposes and the like:
in order to make the description of the present invention more complete and complete, reference is made to the accompanying drawings and the various embodiments described below, in which like reference numerals refer to the same or similar elements. However, the embodiments are not provided to limit the scope of the present invention, but rather the structural operations are described to limit the order of execution, and any arrangement of components which results in a structure which achieves equivalent functionality is within the scope of the present invention.
The drawings are for illustrative purposes only and are not drawn to scale. In other instances, well-known elements and steps have not been described in detail in order to avoid unnecessarily obscuring the present invention.
According to the integrated power module packaging structure of the invention, besides the existing switch module, the current/voltage detection element with the key function is integrated into the packaging structure, and meanwhile, the stacked packaging structure is adopted, so that the elements are sequentially arranged on the mutually stacked substrates, therefore, the elements have higher concentration density, the whole volume of the power module is reduced, and under the condition of reducing the whole volume, a key element is additionally integrated into the power module, and the integrated power module packaging structure has packaging benefit. In addition, by the stacked structure, the wiring between the elements can be shortest, the noise caused by overlong wiring can be avoided, and the noise interference can be reduced. Fig. 1 is a cross-sectional view of an integrated power module package structure according to an embodiment of the invention. Fig. 2 is a perspective view of an integrated power module package structure according to an embodiment of the invention. Please refer to fig. 1 and fig. 2. The integrated power module package structure 10 at least includes a housing 100, a first circuit substrate 110, a second circuit substrate 120 and three leads, which are a first lead 131, a second lead 132 and a third lead 133, respectively. The housing 100 has a cavity 101. The housing 100 has a sidewall 102 surrounding the cavity 101, and the sidewall 102 may be provided with a protruding supporting portion 103 for supporting the second circuit substrate 120.
The first circuit substrate 110 and the second circuit substrate 120 are accommodated in the cavity 101. The first circuit substrate 110 may be fixed to the housing 100 by an adhesive or the like. The first circuit substrate 110 is provided with a switch module 112. In one embodiment, the switch module 112 may be an IGBT, a MOSFET, a DIODE, or the like, and the switch module 112 may be a single switch or a plurality of switches forming different connection combinations. Since the switch module 112 generates a large amount of heat during operation, the first circuit substrate 110 is preferably a substrate with good thermal conductivity. For example, the first circuit substrate 110 may include a ceramic substrate 114 and a copper layer 113 coated on the ceramic substrate, and since copper is a material with good thermal conductivity, heat generated by the switch module 112 can be rapidly taken away to dissipate heat. The switch module 112 is disposed on the upper surface of the ceramic substrate 114. It should be noted that the pattern of the copper layer 113 should avoid the pins of the switch module 112, so as to prevent the pins of the switch module 112 from being short-circuited due to the conduction through the copper layer 113. The second circuit substrate 120 is located above the first circuit substrate 110, and the second circuit substrate 120 can be fixed on the supporting portion 103 of the sidewall 102 by an adhesive or the like, so that the stacked structure can minimize the element routing between the first circuit substrate 110 and the second circuit substrate 120, thereby avoiding noise caused by too long routing and interfering with element operation. The second circuit substrate 120 is used as a driving substrate, and a high-side current/voltage detecting element 121 and a driving element 122 are disposed thereon. The high-side current/voltage detection element 121 is a detection element provided at the positive voltage terminal (+), wherein the current detection portion may perform detection using a shunt (shunt) resistor, and the voltage detection portion may perform detection using a voltage detection circuit of the positive voltage terminal (+). The second circuit substrate 120 may be a multi-layer printed circuit board, and signals of the high-side current/voltage detecting element 121 and the driving element 122 may be respectively guided to the corresponding first pin 131, second pin 132 or third pin 133 through metal interconnects of the multi-layer printed circuit board to perform signal transmission with the switch module 112 on the first circuit substrate 110.
The first, second and third leads 131, 132 and 133 are disposed between the first and second circuit substrates 110 and 120. The first pin 131 is used to connect the high-side current/voltage detecting element 121 on the second circuit substrate 120 and the switch module 112 on the first circuit substrate 110 in series. The second pin 132 is connected to the switch module 112. The second leads 132 protrude from the housing 100 for electrical connection with external devices. The first lead 131 does not protrude from the housing 100. And the third pin 133 is used to connect the driving element 122 and the switch module 112, so that the driving element 122 can control the switch module 112 through the third pin 133.
In addition, a low-side current detecting element 111 may be disposed on the first circuit substrate 110. The low-side current detection element 111 is a detection element provided at the negative voltage terminal (-), wherein the current detection portion can perform detection using a shunt (shunt) resistor. The low-side current detecting element 111 is connected to the second pin 132. That is, the high-side current/voltage detecting element 121 on the second circuit substrate 120 and the low-side current detecting element 111 and the switching module 112 on the first circuit substrate 110 may be connected in series through the first pin 131 and the second pin 132. Since the switch module 112 is connected to the second pin 132, the second pin 132 protrudes out of the housing 100 and is electrically connected to an external device. Therefore, in another embodiment, as shown in fig. 3, a cross-sectional view of an integrated power module package and an external circuit substrate according to an embodiment of the invention, and fig. 4, a perspective view of an integrated power module package and an external circuit substrate according to another embodiment of the invention, a third circuit substrate 140 is further disposed outside the housing 100, a power supply element 141 is disposed on the third circuit substrate 140, and the power supply element 141 has a positive voltage terminal (+) and a negative voltage terminal (-).
In order to enable the power supply device 141 to supply power to the high-side current/voltage detecting device 121 on the second circuit substrate 120, the low-side current detecting device 111 and the switch module 112 on the first circuit substrate 110, a fourth pin 134 is further disposed between the second circuit substrate 120 and the third circuit substrate 140, wherein the fourth pin 134 is connected to the positive voltage terminal (+) of the power supply device 141, and the second pin 132 protruding out of the housing 100 is connected to the negative voltage terminal (-) of the power supply device 141. Therefore, the low-side current detecting element 111, the switch module 112 on the first circuit substrate 110 and the high-side current/voltage detecting element 121 on the second circuit substrate 120 can be connected to the positive voltage terminal (+) and the negative voltage terminal (-) of the power supply element 141 to form a loop through the first pin 131, the second pin 132 and the fourth pin 134, which can include other energy storage elements such as inductors located outside the housing 100. The power supply device 141 can thus power the low-side current detecting device 111, the switch module 112 and the high-side current/voltage detecting device 121 along the loop, wherein the switch module 112 includes at least one power device.
On the other hand, a controller 150 disposed outside the housing 100 may output a control signal to control the driving element 122 to control the duty cycle of the switch module 112 through the third pin 133, so as to adjust the output power of the power module. The controller 150 outputs the control signal to the driving element 122 according to whether the high-side current/voltage detection element 121 detects a high-side current/voltage detection signal generated by the power supply element 141 or the low-side current detection signal generated by the low-side current detection element 111 detects a low-side current detection signal generated by the power supply element 141. Therefore, the high-side current/voltage detection signal generated by the high-side current/voltage detection element 121 and the low-side current detection signal generated by the low-side current detection element 111 are transmitted to the controller 150. Thus, a fifth pin 135 is provided on the second circuit substrate 120 to draw a high-side current/voltage detection signal generated by the high-side current/voltage detection element 121 on the second circuit substrate 120 to the controller 150, and a sixth pin 136 is provided on the first circuit substrate 110 to extend through the second circuit substrate 120 to draw a low-side current detection signal generated by the low-side current detection element 111 on the first circuit substrate 110 to the controller 150.
In one embodiment, the controller 150 may be disposed on the third circuit substrate 140. Accordingly, the fifth pin 135 is disposed between the second circuit substrate 120 and the third circuit substrate 140 to extract the high-side current/voltage detection signal generated by the high-side current/voltage detection element 121 on the second circuit substrate 120 and provide the high-side current/voltage detection signal to the controller 150 on the third circuit substrate 140. The sixth lead 136 is disposed between the first circuit substrate 110 and the third circuit substrate 140 and penetrates the second circuit substrate 120, and leads out the low-side current detection signal generated by the low-side current detection element 111 on the first circuit substrate 110 to the controller 150 on the third circuit substrate 140. In addition, in order to transmit the control signal output by the controller 150 to the driving element 122 on the second substrate 120, a seventh pin 137 is further disposed between the second circuit substrate 120 and the third circuit substrate 140, so that the controller 150 can control the driving element 122 through the seventh pin 137, and control the duty cycle of the switch module 112 on the first circuit substrate 110 through the third pin 133, so as to adjust the output power of the power module 10.
Accordingly, the integrated power module package structure of the present invention allows the elements to be sequentially disposed on the substrates stacked on each other through the stacked package structure, thereby providing a higher concentration density between the elements. Besides the existing switch module, a high-side current/voltage detection element with a key function is integrated into the packaging structure, so that the packaging structure has great packaging benefit.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. An integrated power module package structure, comprising:
a housing having a cavity;
a first circuit substrate accommodated in the cavity, wherein the first circuit substrate is provided with a switch module;
a second circuit substrate accommodated in the cavity and located above the first circuit substrate to form a stacked structure with the first circuit substrate, so that the element wiring between the first circuit substrate and the second circuit substrate is shortest, wherein the second circuit substrate is provided with a high-end current/voltage detection element and a driving element;
a first pin, a second pin and a third pin are arranged between the first circuit substrate and the second circuit substrate, wherein the first pin is connected in series with the high-end current/voltage detection element and the switch module, the second pin is connected with the switch module, and the driving element controls the switch module through the third pin; and
and a low-side current detection element disposed on the first circuit substrate, wherein the second pin is further connected in series with the low-side current detection element and the switch module.
2. The package structure of claim 1, further comprising a third circuit substrate disposed outside the housing, wherein the third circuit substrate is provided with a power supply device having a positive voltage terminal and a negative voltage terminal.
3. The package structure of claim 2, further comprising a fourth pin disposed between the second circuit substrate and the third circuit substrate and connected to the positive voltage terminal of the power supply device, wherein:
the switch module and the high-side current/voltage detection element are connected in series with the positive voltage terminal of the power supply element through the first pin and the fourth pin, an
The low-side current detection element and the switch module connected in series are connected to the negative voltage end of the power supply element through the second pin.
4. The package structure of claim 3, further comprising a fifth pin disposed on the second circuit substrate, wherein the high-side current/voltage detection device detects the power supply device and generates a high-side current/voltage detection signal to output to the fifth pin.
5. The package structure of claim 4, further comprising a sixth pin disposed on the first circuit substrate and penetrating between the two circuit substrates, wherein the low-side current detection device detects the power supply device and generates a low-side current detection signal to output to the sixth pin.
6. The package structure of claim 5, further comprising a controller disposed outside the housing for receiving the high-side current/voltage detection signal outputted from the fifth pin and the low-side current detection signal outputted from the sixth pin.
7. The package structure of claim 6, wherein the controller is disposed on the third circuit substrate.
8. The package structure of claim 7, further comprising a seventh pin disposed between the second circuit substrate and the third circuit substrate, wherein the controller controls the driving device via the seventh pin.
9. The package structure of claim 1, wherein the switch module comprises at least one power device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510694383.1A CN106611758B (en) | 2015-10-23 | 2015-10-23 | Integrated power module packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510694383.1A CN106611758B (en) | 2015-10-23 | 2015-10-23 | Integrated power module packaging structure |
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| Publication Number | Publication Date |
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| CN106611758A CN106611758A (en) | 2017-05-03 |
| CN106611758B true CN106611758B (en) | 2020-01-03 |
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| CN201510694383.1A Active CN106611758B (en) | 2015-10-23 | 2015-10-23 | Integrated power module packaging structure |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110197824A (en) * | 2019-06-20 | 2019-09-03 | 深圳市汇川技术股份有限公司 | Intelligent power module encapsulating structure |
| CN111653526A (en) * | 2020-03-24 | 2020-09-11 | 鑫金微半导体(深圳)有限公司 | SiP 3-dimensional packaging and processing method of high-power hybrid semiconductor integrated circuit |
| EP3896726A1 (en) * | 2020-04-17 | 2021-10-20 | Siemens Aktiengesellschaft | Semiconductor module with a housing |
| CN111834353B (en) * | 2020-07-17 | 2023-03-24 | 北京市科通电子继电器总厂有限公司 | SIP laminated structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6144571A (en) * | 1999-02-22 | 2000-11-07 | Hitachi, Ltd. | Semiconductor module, power converter using the same and manufacturing method thereof |
| CN1306385A (en) * | 2000-01-19 | 2001-08-01 | Lg电子株式会社 | Single module system for electrical and electronic device |
| US6313598B1 (en) * | 1998-09-11 | 2001-11-06 | Hitachi, Ltd. | Power semiconductor module and motor drive system |
| CN1356764A (en) * | 2001-12-28 | 2002-07-03 | 西安交通大学 | Process for preparing integrated electric and electronic module based on discrete elements |
| CN1448669A (en) * | 2002-03-29 | 2003-10-15 | 日立空调系统株式会社 | Refrigerating apparatus and an inverter device used therein |
| CN101419965A (en) * | 2007-09-27 | 2009-04-29 | 三洋电机株式会社 | Circuit device and method of manufacturing the same |
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2015
- 2015-10-23 CN CN201510694383.1A patent/CN106611758B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6313598B1 (en) * | 1998-09-11 | 2001-11-06 | Hitachi, Ltd. | Power semiconductor module and motor drive system |
| US6144571A (en) * | 1999-02-22 | 2000-11-07 | Hitachi, Ltd. | Semiconductor module, power converter using the same and manufacturing method thereof |
| CN1306385A (en) * | 2000-01-19 | 2001-08-01 | Lg电子株式会社 | Single module system for electrical and electronic device |
| CN1356764A (en) * | 2001-12-28 | 2002-07-03 | 西安交通大学 | Process for preparing integrated electric and electronic module based on discrete elements |
| CN1448669A (en) * | 2002-03-29 | 2003-10-15 | 日立空调系统株式会社 | Refrigerating apparatus and an inverter device used therein |
| CN101419965A (en) * | 2007-09-27 | 2009-04-29 | 三洋电机株式会社 | Circuit device and method of manufacturing the same |
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| Publication number | Publication date |
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| CN106611758A (en) | 2017-05-03 |
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