WO2020253411A1

WO2020253411A1 - Intelligent power module packaging structure

Info

Publication number: WO2020253411A1
Application number: PCT/CN2020/089044
Authority: WO
Inventors: 陈健; 吴桢生; 汤桂衡; 杨轲
Original assignee: 深圳市汇川技术股份有限公司
Priority date: 2019-06-20
Filing date: 2020-05-07
Publication date: 2020-12-24
Also published as: CN110197824A

Abstract

An intelligent power module packaging structure, comprising an intelligent power integration unit and an integrally formed packaging housing, wherein the intelligent power integration unit comprises a power circuit substrate, a built-in functional circuit board, and a plurality of connecting columns; the built-in functional circuit board is provided with a plurality of first through holes corresponding to the plurality of connecting columns, the bottom ends of the plurality of connecting columns are all fixed on the power circuit substrate, the top ends of the plurality of connecting columns respectively penetrate the built-in functional circuit board by means of the plurality of first through holes and are fixedly connected to the built-in functional circuit board at the first through holes corresponding to the connecting columns; the packaging housing comprises a mounting cavity having an opening at the bottom, the intelligent power integration unit is mounted in the mounting cavity, and the power circuit substrate of the intelligent power integration unit is plugged at the opening position at the bottom of the mounting cavity and forms a closed packaging structure with the packaging housing. The structure reduces input costs of a production line, improves the space utilization rate and the design freedom degree of the intelligent power integration unit, and simplifies the packaging housing structure and the packaging process.

Description

Intelligent power module packaging structure

Technical field

The embodiment of the present invention relates to the technical field of power module packaging, in particular to a smart power module packaging structure.

Background technique

Intelligent Power Module (IPM) integrates functional circuit units on the basis of traditional power modules. Because of its high integration, high reliability and simple external supporting circuit, it is widely used in household appliances, industrial transmission and other fields. The existing IPM packaging methods include two types:

One packaging method is that IPM uses a leaded copper lead frame as the packaging frame, and places the power circuit substrate and functional circuits in the form of integrated circuit chips on the packaging frame, and then wraps and cures with resin materials to form a hard plastic package The packaging structure of the shell. In this packaging method, the functional circuits exist in the form of integrated chips, which leads to higher requirements for assembly line automation and lower reusability. Small changes in the IPM structure often require major changes in the production line, resulting in rare IPM types, high costs, and difficulty. To meet the fierce competition and the need for more and more abundant industrial control product market.

Another packaging method is that the functional circuit exists in the form of a built-in functional circuit board. The packaging structure often includes a power circuit substrate, a built-in functional circuit board, a package frame, and a package cover. The package frame is first bonded to the power circuit board. , And then fix the built-in functional circuit board on the package frame by bonding or connecting, and then potting and curing, and fixing the package cover on the package shell by bonding or connecting to form a stacked stacked package structure . The packaging process of this packaging method is complicated and costly, and the built-in functional circuit board must be fixed on the packaging frame by bonding or jointing, so that the design of the built-in functional circuit board and the packaging frame must be coupled with each other, reducing The freedom of IPM design is improved.

technical problem

In summary, the existing IPM packaging methods have higher requirements for the production line in the assembly process and low reuse. Small changes in the IPM structure often require major changes in the production line, resulting in scarcity of IPM types, high costs, and difficulty in meeting fierce competition and increasing needs. Abundant industrial control product market; or, the packaging process is complicated and the cost is high, which reduces the freedom of IPM design.

Technical solutions

In view of this, the purpose of the embodiments of the present invention is to provide a smart power module packaging structure to solve the problem that the assembly process in the prior art has high requirements on the production line and low reusability. Small changes in the IPM structure often require small changes. The major changes in the production line have led to the scarcity of IPM types and high costs, making it difficult to meet the fiercely competitive and increasingly demanding industrial control product market; or the packaging process is complicated and the cost is high, which reduces the freedom of IPM design.

The technical solutions adopted by the embodiments of the present invention to solve the above technical problems are as follows:

According to one aspect of the embodiments of the present invention, a smart power module packaging structure is provided, including a smart power integrated unit and an integrally formed packaging shell, wherein:

The intelligent power integration unit includes a power circuit substrate, a built-in functional circuit board, and a plurality of connecting posts; the built-in function circuit board is provided with a plurality of first through holes corresponding to the plurality of connecting posts, the The bottom ends of a plurality of connecting posts are fixed on the power circuit substrate, and the top ends of the plurality of connecting posts respectively pass through the built-in functional circuit board through the plurality of first through holes, and are connected to the corresponding The first through hole is fixedly connected to the built-in function circuit board, so that the built-in function circuit board is stacked on top of the power circuit board;

The packaging housing includes an installation cavity with an opening at the bottom, the smart power integration unit is installed in the installation cavity, and the power circuit substrate of the smart power integration unit is sealed at the bottom opening position of the installation cavity , Forming a closed packaging structure with the packaging shell.

On the basis of the above technical solution, the bottom of the side wall of the mounting cavity is provided with a stepped groove that matches with the power circuit substrate, and the power circuit substrate is fixed at the position of the stepped groove by bonding.

On the basis of the above technical solution, the plurality of connecting columns includes a first short connecting column and a second long connecting column, wherein:

The bottom end of the first short connecting column is fixed on the power circuit substrate, and the top end of the first short connecting column passes through the built-in function circuit board through the corresponding first through hole and no longer extends, and The first short connecting post is fixedly connected to the built-in function circuit board at the corresponding first through hole;

The bottom end of the second long connecting column is fixed on the power circuit substrate, and the top end of the second long connecting column passes through the built-in functional circuit board through a corresponding first through hole and has an extension, and The second long connecting post is fixedly connected to the built-in function circuit board at the corresponding first through hole;

A plurality of second through holes are opened on the upper surface of the packaging housing, and the number of the plurality of second through holes is greater than or equal to the number of the second long connecting columns, and the extension portion of the second long connecting columns Passing through the upper surface of the packaging casing through the corresponding second through hole.

On the basis of the above technical solution, the plurality of connection posts includes a first short connection post, the bottom end of the first short connection post is fixed on the power circuit substrate, and the top end of the first short connection post passes The corresponding first through hole does not extend after passing through the built-in function circuit board, and the first short connecting post is fixedly connected to the built-in function circuit board at the corresponding first through hole;

The smart power module packaging structure further includes a plurality of third long connecting posts, the bottom ends of the third long connecting posts are fixed on the power circuit substrate, and the top ends of the third long connecting posts avoid the built-in Functional circuit board with extensions;

A plurality of second through holes are opened on the upper surface of the packaging housing, and the number of the plurality of second through holes is greater than or equal to the number of the third long connecting pillars, and the extension portion of the third long connecting pillar Passing through the upper surface of the packaging shell through the corresponding second through hole.

On the basis of the above technical solution, the packaging shell is provided with a first glue injection port, the smart power packaging structure further includes insulating silicone, and after the packaging shell and the smart power integration unit are assembled, Fill the cavity formed by assembling the packaging shell and the smart power integration unit with the insulating silicone through the first glue injection port.

Based on the above technical solution, the built-in functional circuit board is provided with a second glue injection injection port, and the insulating silicone is injected into the built-in functional circuit board and the power circuit substrate through the second glue injection injection port The space between.

On the basis of the above technical solution, there is a gap between the built-in functional circuit board and the inner surface of the side wall of the package housing, and the insulating silicone gel overflows the package housing and the smart power through the gap. The sealed cavity formed by bonding the integrated unit.

On the basis of the above technical solution, a connector is welded on the built-in functional circuit board, a connector extension port is opened on the packaging shell, and the connector extends out of the packaging shell through the connector extension port The body interacts with external circuits.

Based on the above technical solution, two sides of the packaging shell are respectively provided with assembling holes for fixing the smart power module packaging structure on an external heat dissipation plane through a fastener.

On the basis of the above technical solution, it further includes a deformation suppression cylinder, the top end of the deformation suppression cylinder abuts against the central part of the inner surface of the upper top of the packaging shell, and the bottom end of the deformation suppression cylinder passes through the The built-in functional circuit board abuts against the upper surface of the power circuit board.

Beneficial effect

The beneficial effects of the embodiments of the present invention are as follows:

In the smart power module packaging structure provided by the embodiment of the present invention, the functional circuit exists in the form of a built-in functional circuit board, and the assembly process does not require special process processing, and has low requirements on the production line, making the production line high in reusability and reducing the investment in the production line Cost; because the built-in functional circuit board is fixed above the power circuit substrate through the connecting column, there is no need for coupling design between the built-in functional circuit board and the package casing, thereby increasing the freedom of design of the intelligent power integrated unit and improving the packaging structure Space utilization,

It is beneficial to reduce the volume of the package structure and increase the power density of the package structure; in addition, because there is no need to couple the design between the built-in functional circuit board and the package shell, the shell of the smart function module can be designed as an integrated package shell, reducing the shell The number of components simplifies the packaging process and reduces costs.

Description of the drawings

In order to explain the technical solutions in the embodiments of the present invention more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only of the present invention. For some embodiments, for those of ordinary skill in the art, other drawings can be obtained from these drawings without creative labor.

FIG. 1 is an exploded view of a smart power module packaging structure provided by an embodiment of the present invention;

2 is a schematic structural diagram of a smart power integration unit in a smart power module packaging structure provided by an embodiment of the present invention in a specific implementation manner;

FIG. 3 is a schematic structural diagram of a smart power integration unit in another specific implementation manner in the smart power module packaging structure provided by an embodiment of the present invention;

4 is a schematic structural diagram of a stepped groove opened at the bottom of the side wall of the packaging case in the smart power module packaging structure provided by an embodiment of the present invention;

5 is a schematic cross-sectional view of the smart power module packaging structure provided by an embodiment of the present invention after packaging is completed;

6 is a schematic structural diagram of the smart power module packaging structure provided by an embodiment of the present invention after packaging is completed;

FIG. 7 is an exploded view of a smart power module packaging structure provided by another embodiment of the present invention;

8 is a schematic diagram of the matching relationship between the deformation suppression cylinder and the packaging shell in the smart power module packaging structure provided by another embodiment of the present invention;

9 is a schematic cross-sectional view of the smart power module packaging structure provided by another embodiment of the present invention after packaging is completed.

Embodiments of the invention

In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following further describes the embodiments of the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the embodiments of the present invention, and are not used to limit the embodiments of the present invention.

Example one

Fig. 1 is an exploded view of a smart power module packaging structure provided by an embodiment of the present invention. For ease of description, only the parts related to this embodiment are shown.

As shown in Fig. 1, the smart power module packaging structure provided by this embodiment includes a smart power integrated unit 1 and an integrally formed packaging housing 2, in which:

The smart power integration unit 1 includes a power circuit board 11, a built-in functional circuit board 12, and a plurality of connecting posts 13 for signal transmission and fixing the built-in functional circuit board 12; the built-in functional circuit board 12 is provided with A plurality of first through holes (not shown in the figure) corresponding to the plurality of connecting posts 13, the bottom ends of the plurality of connecting posts 13 are all fixed on the power circuit substrate 11, the plurality of connecting posts The top ends of 13 respectively pass through the built-in function circuit board 12 through the plurality of first through holes, and are fixedly connected to the built-in function circuit board 12 at the corresponding first through holes, so that the built-in function The functional circuit board 12 is stacked on top of the power circuit substrate 11;

The packaging housing 2 includes a mounting cavity with an opening at the bottom, the smart power integration unit 1 is installed in the mounting cavity, and the power circuit substrate 11 of the smart power integration unit 1 is sealed in the mounting cavity. At the bottom opening position, it forms a closed packaging structure with the packaging shell 2.

Wherein, the power circuit substrate 11 in the smart power integrated unit 1 includes, but is not limited to, an aluminum-based resin copper clad laminate, a copper-based resin copper clad laminate or a double-sided copper-clad ceramic substrate, and the power circuit substrate 11 is welded with a function It is not limited to power switching devices such as inversion, rectification, braking, buffering, and temperature and electrical signal sampling devices. The functions welded on the built-in function circuit board 12 are not limited to discrete functional devices such as power supply, signal sampling and conditioning, protection, driving, and micro-control unit operation.

Wherein, the bottom ends of the plurality of connecting posts 13 are fixed on the power circuit substrate 11 by welding, and the plurality of connecting posts 13 are welded and/or crimped at their corresponding first through holes. The method realizes fixing and signal transmission with the built-in function circuit board 12. Preferably, in this embodiment, multiple built-in functional circuit substrates can be stacked on the multiple connecting posts.

In this embodiment, multiple connecting posts 13 are fixed on the power circuit board 11 by welding, and are fixed and signal transmitted with at least one built-in functional circuit board 12 by welding and/or crimping, and connection can be realized. The stability of the connection between the post and the power circuit board 11 and the built-in functional circuit board 12, and the power circuit board 11 and the built-in functional circuit board 12 can realize signal multiplexing based on the connection post 13; in addition, since the power switching devices are all welded It is fixed on the power circuit substrate 11, so that the connecting post can be assembled together with the power switching device, which simplifies the assembly process.

Further, referring to FIG. 2, in a specific implementation manner, the plurality of connecting pillars 13 includes a first short connecting pillar 131 and a second long connecting pillar 132, wherein:

The bottom end of the first short connecting column 131 is fixed on the power circuit substrate 11, and the top end of the first connecting column 131 passes through the built-in function circuit board 12 through the corresponding first through hole. Extend, and the first connecting post 131 is fixedly connected to the built-in function circuit board 12 at the corresponding first through hole;

The bottom end of the second long connecting column 132 is fixed on the power circuit substrate 11, and the top end of the second long connecting column 132 penetrates the built-in function circuit board 12 through the corresponding first through hole and has Extension portion, and the second long connecting post 132 is fixedly connected to the built-in functional circuit board 12 at the corresponding first through hole;

The upper surface of the packaging casing 2 is provided with a plurality of second through holes 21, the number of the plurality of second through holes 21 is greater than or equal to the number of the second long connecting posts 132, and the second long connecting The extension portion of the pillar 132 penetrates the upper surface of the packaging case 2 through the second through hole 21 corresponding thereto.

Preferably, in this embodiment, the bottom end of the first short connecting post 131 is fixed on the power circuit substrate 11 by welding, and the first short connecting post 131 is in its corresponding first through hole. The location is welded or crimped with the built-in functional circuit board 12 to achieve signal transmission and functional multiplexing with fixed structure.

Preferably, in this embodiment, the bottom end of the second long connecting column 132 is fixed on the power circuit substrate 11 by welding, and the top end of the second long connecting column 132 is in its corresponding through hole. The location is welded or crimped with the built-in functional circuit board 12 to achieve signal transmission and functional multiplexing with fixed structure.

Preferably, in this embodiment, the top ends of the first short connecting post 131 and the second long connecting post 132 may be set in a needle-like shape, which is convenient for the first short connecting post 131 and the second The long connecting post 132 quickly passes through the first through hole on the built-in function circuit board 12, which is convenient for assembly.

Preferably, in this embodiment, the appearance realization form of the first short connecting column 131 and the second long connecting column 132 is not limited by a certain fixed shape. In a specific implementation, the first short connecting column Specific implementation forms of 131 and the second long connecting post 132 include but are not limited to cylindrical terminals, regular polygon terminals and/or flat terminals.

Preferably, in this embodiment, the number of second through holes 21 opened on the upper surface of the packaging housing 2 is greater than the number of the second long connecting posts 132, so that the packaging housing 2 can be compatible with multiple different Types of power circuit substrates 11 need to extend the long terminals. Of course, in other application scenarios where the compatibility with the package housing 2 is low, the number of second through holes 21 opened on the upper surface of the package housing 2 may also be equal to the number of second through holes welded on the power circuit substrate 11. The number of long connecting posts 132.

Further, referring to FIG. 3, in another specific implementation manner, the plurality of connecting pillars 13 includes a first short connecting pillar 131, and the bottom end of the first short connecting pillar 131 is fixed to the power circuit substrate 11, the top end of the first short connecting post 131 passes through the built-in function circuit board 12 through the corresponding first through hole and no longer extends, and the first short connecting post 131 is at its corresponding first through hole. A through hole is fixedly connected to the built-in function circuit board 12;

The smart power module packaging structure further includes a plurality of third long connecting posts 133 for signal transmission, the bottom end of the third long connecting posts 133 is fixed on the power circuit substrate 11, and the third long connecting The top end of the pillar 133 avoids the built-in function circuit board 12 and has an extension;

The upper surface of the packaging housing 2 is provided with a plurality of second through holes 21, the number of the plurality of second through holes 21 is greater than or equal to the number of the third long connecting posts 133, the third long connecting The extension part of the pillar 133 penetrates the upper surface of the packaging case 2 through the second through hole 21 corresponding thereto.

Preferably, in this embodiment, the area of the built-in function circuit board 12 is smaller than the area of the power circuit substrate 11, and the third long connecting posts 133 are respectively arranged on the power circuit substrate 11 near the surrounding positions. Where, the bottom end of the third long connecting post 133 is fixed to the power circuit board 11 by welding, and the top end of the third long connecting post 133 passes through the built-in function circuit board 12 after avoiding the The second through hole 21 on the packaging shell 2 extends out of the packaging shell 2 for signal interaction with external circuits.

Preferably, in this embodiment, the size of the second through hole 21 opened on the upper surface of the package housing 2 is equal to the cross-sectional area of the extension of the third cylinder, so that the third cylinder The extension part just extends out of the package housing 2 through the corresponding second through hole 21 for signal interaction with the external circuit.

Preferably, in this embodiment, the number of second through holes 21 opened on the upper surface of the packaging housing 2 is greater than the number of the third long connecting posts 133, so that the packaging housing 2 can be compatible with multiple different Types of power circuit substrates 11 need to extend the long terminals. Of course, in other application scenarios where the compatibility with the package housing 2 is low, the number of second through holes 21 opened on the upper surface of the package housing 2 may also be equal to the number of third through holes welded on the power circuit substrate 11. The number of long connecting posts 133.

Preferably, in this embodiment, the appearance and realization form of the first short connecting column 131 and the third long connecting column 133 are not limited by a certain fixed shape. In specific implementation, the first short connecting column The specific implementation forms of 131 and the third long connecting post 133 include but are not limited to cylindrical terminals, regular polygon terminals and/or flat terminals.

Further, referring to FIG. 2, the packaging housing 2 is provided with a first glue injection port 22, the smart power packaging structure further includes insulating silicone, the packaging housing 2 and the smart power integrated unit 1 After the assembly is completed, the insulating silicone rubber is injected into the cavity formed by the assembly of the packaging shell 2 and the smart power integrated unit 1 through the first glue injection port 22. The built-in function circuit board 12 is provided with a second glue injection port 122, and the insulating silicone is filled between the built-in function circuit board 12 and the power circuit substrate 11 through the second glue injection port 122 Space. There is a gap between the built-in functional circuit board 12 and the inner surface of the side wall of the packaging shell 2, and the insulating silicone gel overflows the packaging shell 2 and the smart power integrated unit 1 through the gap. The sealed cavity formed afterwards. In this embodiment, the insulating silica gel can overflow the packaging shell 2 and the smart power integrated module through the first glue injection port 22, the second glue injection port 122, and the gap. The space in the sealed cavity formed after packaging plays a role of insulation protection and dust prevention for the functional circuit board and the built-in functional circuit board 12.

Further, referring to FIG. 2, a connector 123 is welded on the built-in functional circuit board 12, and a connector extension port 23 is opened on the packaging housing 2, and the connector 123 passes through the connector extension port. 23 extends out of the encapsulation shell 2 for signal interaction with external circuits.

Further, referring to FIG. 2, two sides of the packaging housing 2 are respectively provided with assembly holes 24 for fixing the smart power module packaging structure on an external heat dissipation plane through a locking member. Preferably, in this embodiment, the locking member is a screw.

Further, referring to FIG. 4, the bottom of the side wall of the mounting cavity is provided with a stepped groove 25 that cooperates with the power circuit substrate 11, and the power circuit substrate 11 is fixed to the stepped groove by bonding. 25 position. Preferably, in this embodiment, the surface of the stepped groove 25 is coated with silicon rubber, and the power circuit substrate 11 is bonded to the stepped groove 25 through the silicon rubber. Refer to FIG. 5 and FIG. 6 for the schematic diagram of the structure of the intelligent power integrated module and the packaging shell 2 after packaging.

As can be seen from the above, in the smart power module packaging structure provided by this embodiment, since the functional circuit is in the form of a built-in functional circuit board 12, the assembly process does not require special process processing, and has low requirements on the production line, making the production line highly reusable. The investment cost of the production line is reduced; since the built-in functional circuit board 12 is fixed above the power circuit substrate 11 through the connecting posts, no coupling design is required between the built-in functional circuit board 12 and the package housing 2, thereby increasing the design of the intelligent power integrated unit 1 The degree of freedom of the packaging structure is improved, and the space utilization rate of the packaging structure is improved, which is beneficial to reduce the volume of the packaging structure and increase the power density of the packaging structure. In addition, because the built-in functional circuit board 12 and the packaging housing 2 do not need to be coupled to design, intelligent functions The shell of the module can be designed as an integrally formed packaging shell 2, which reduces the number of shell components, simplifies the packaging process and reduces the cost.

Example two

FIG. 7 is a schematic structural diagram of a smart power module packaging structure provided by another embodiment of the present invention. For convenience of description, only the parts related to this embodiment are shown.

As shown in FIG. 7, compared with the previous embodiment, the smart power module packaging structure provided by this embodiment further includes a deformation suppression column 14. The top end of the deformation suppression column 14 and the upper top of the packaging housing 2 The central part of the surface abuts, and the bottom end of the deformation suppression column 14 passes through the built-in function circuit board 12 and then abuts the upper surface of the power circuit board 11.

In this embodiment, the built-in function circuit board 12 is provided with an extension opening for the deformation suppression column 14, and the bottom end of the deformation suppression column 14 abuts on the upper surface of the power circuit board 11. The top end of the suppression cylinder 14 passes through the built-in functional circuit board 12 through the deformation suppression cylinder extension opening 124 and abuts against the inner surface of the top shell of the package housing 2 (as shown in FIG. 8), such that When the smart power package structure is locked to the external heat dissipation plane by a screw or other locking member, the deformation suppression column 14 can play a role in suppressing the deformation of the power circuit substrate 11. Refer to FIG. 9 for a cross-sectional schematic diagram of the deformation suppression column 14 after the completion of the packaging of the power circuit substrate 11, the built-in functional circuit board 12 and the packaging housing 2.

Further, compared to the previous embodiment, the intelligent power integration unit 1 in this embodiment further includes a plurality of limit support columns with a limit support platform, and the built-in function circuit board 12 is provided with a plurality of limit supports The support columns correspond to the third through holes one to one; the bottom ends of the plurality of limit support columns are fixed on the power circuit substrate 11, and the top ends of the plurality of limit support columns pass through the corresponding third Through holes pass through the built-in function circuit board 12, so that the limit support platforms of the plurality of limit support columns respectively abut against the bottom surface of the built-in function circuit board 12 to perform Limiting and supporting, and the plurality of limit supporting pillars are respectively fixedly connected to the built-in function circuit board 12 at the corresponding third through holes.

Wherein, the limit support column plays a role of limit, support and fixation on the built-in power circuit board. Preferably, in this embodiment, the bottom ends of the plurality of limit support pillars are all welded to the power circuit substrate 11, and the plurality of limit support pillars are respectively located at their corresponding second through holes 21 It is fixed to the built-in functional circuit board 12 by welding and/or crimping.

Preferably, in this embodiment, the smart power integrated unit 1 includes four limit support columns, and the four limit support columns are respectively distributed at four corner positions of the power circuit substrate 11, and the The bottom ends of the four limit support columns are respectively welded at the four corner positions on the upper surface of the power circuit substrate 11, and the top ends respectively pass through the built-in function through four third through holes opened on the built-in function circuit board 12 Circuit board 12, and the limit support platforms of the four limit support columns respectively abut against the bottom surface of the built-in function circuit board 12 to limit and support the built-in function circuit board 12, and The four limit support pillars are respectively fixed to the built-in functional circuit board 12 at the corresponding third through holes by welding and/or crimping.

The circuit board packaging structure of the smart power integrated unit 1 provided in this embodiment is provided between the power circuit substrate 11 and the built-in functional circuit board for limiting, supporting and fixing the built-in functional circuit board 12. The limit support column, which can further improve the stability of the built-in function circuit board 12.

It should be noted that other parts of the smart power module packaging structure provided in this embodiment are completely the same as those in the previous embodiment, so they will not be repeated here.

Compared with the previous embodiment, the smart power module packaging structure provided in this embodiment is further provided with a deformation suppression column 14, and the bottom end of the deformation suppression column 14 abuts against the upper surface of the power circuit substrate 11, and the top end passes through the built-in The functional circuit board 12 then abuts against the inner surface of the top shell of the package housing 2, so that when the smart power module package structure is installed on the external heat dissipation plane through the locking member, the deformation of the power circuit substrate 11 can be suppressed, which further improves The reliability of the packaging structure of the smart power module; in addition, because the power circuit substrate 11 and the built-in function circuit substrate are also provided with a limit for limiting, supporting and fixing the built-in function circuit board 12 The supporting column can further improve the stability of the packaging of the built-in functional circuit board 12.

Industrial applicability

The preferred embodiments of the present invention are described above with reference to the accompanying drawings, and the scope of rights of the present invention is not limited thereby. Any modifications, equivalent substitutions and improvements made by those skilled in the art without departing from the scope and essence of the present invention shall fall within the scope of the rights of the present invention.

Claims

An intelligent power module packaging structure, which is characterized by comprising an intelligent power integrated unit and an integrally formed packaging shell, wherein:

The intelligent power integration unit includes a power circuit substrate, a built-in functional circuit board, and a plurality of connecting posts for signal transmission and fixing the built-in function circuit board; the built-in function circuit board is provided with a plurality of connecting posts Corresponding to a plurality of first through holes, the bottom ends of the plurality of connecting pillars are all fixed on the power circuit substrate, and the top ends of the plurality of connecting pillars respectively pass through the plurality of first through holes A built-in functional circuit board, and fixedly connected to the built-in functional circuit board at the corresponding first through hole, so that the built-in functional circuit board is stacked on top of the power circuit board;

The packaging housing includes an installation cavity with an opening at the bottom, the smart power integration unit is installed in the installation cavity, and the power circuit substrate of the smart power integration unit is sealed at the bottom opening position of the installation cavity , Forming a closed packaging structure with the packaging shell.
The smart power module packaging structure of claim 1, wherein the bottom of the side wall of the mounting cavity is provided with a stepped groove that matches with the power circuit substrate, and the power circuit substrate is fixed by bonding In the stepped groove position.
The smart power module packaging structure according to claim 1, wherein the plurality of connecting pillars comprise a first short connecting pillar and a second long connecting pillar, wherein:

The bottom end of the first short connecting column is fixed on the power circuit substrate, and the top end of the first short connecting column passes through the built-in function circuit board through the corresponding first through hole and no longer extends, and The first short connecting post is fixedly connected to the built-in function circuit board at the corresponding first through hole;

The bottom end of the second long connecting column is fixed on the power circuit substrate, and the top end of the second long connecting column passes through the built-in functional circuit board through a corresponding first through hole and has an extension, and The second long connecting post is fixedly connected to the built-in function circuit board at the corresponding first through hole;

A plurality of second through holes are opened on the upper surface of the packaging housing, and the number of the plurality of second through holes is greater than or equal to the number of the second long connecting columns, and the extension portion of the second long connecting columns Passing through the upper surface of the packaging casing through the corresponding second through hole.
The smart power module packaging structure of claim 1, wherein the plurality of connecting posts comprises a first short connecting post, and the bottom end of the first short connecting post is fixed on the power circuit substrate, so The top end of the first short connecting column passes through the built-in functional circuit board through the corresponding first through hole and no longer extends, and the first short connecting column is connected to the first through hole corresponding to the Built-in functional circuit board fixed connection;

The smart power module packaging structure further includes a plurality of third long connecting posts, the bottom ends of the third long connecting posts are fixed on the power circuit substrate, and the top ends of the third long connecting posts avoid the built-in Functional circuit board with extensions;

A plurality of second through holes are opened on the upper surface of the packaging housing, and the number of the plurality of second through holes is greater than or equal to the number of the third long connecting pillars, and the extension portion of the third long connecting pillar Passing through the upper surface of the packaging shell through the corresponding second through hole.
The smart power module packaging structure of claim 1, wherein the packaging shell is provided with a first glue injection port, the smart power packaging structure further comprises insulating silicone, and the packaging shell is After the smart power integration unit is assembled, the insulating silicone gel is filled through the first glue injection port to fill the cavity formed by the assembly of the packaging shell and the smart power integration unit.
The smart power module packaging structure of claim 5, wherein the built-in function circuit board is provided with a second glue injection port, and the insulating silicone is filled with the second glue injection port. The space between the built-in functional circuit board and the power circuit board.
The smart power module packaging structure of claim 6, wherein there is a gap between the built-in functional circuit board and the inner surface of the side wall of the packaging shell, and the insulating silicone gel overflows through the gap. A sealed cavity formed by bonding the packaging shell and the smart power integration unit.
The smart power module packaging structure of claim 1, wherein a connector is welded on the built-in functional circuit board, a connector extension port is opened on the packaging shell, and the connector passes through the connection The extension opening of the device extends out of the packaging shell for signal interaction with external circuits.
The smart power module packaging structure according to claim 1, wherein two sides of the packaging shell are respectively provided with assembly holes for fixing the smart power module packaging structure on an external heat dissipation plane through a fastener.
The smart power module packaging structure according to claim 9, further comprising a deformation suppression cylinder, the top end of the deformation suppression cylinder abuts against the center part of the inner surface of the top top of the package housing, and the deformation The bottom end of the restraining column passes through the built-in function circuit board and abuts against the upper surface of the power circuit board.