WO2023240759A1 - Intelligent power module and electrical device - Google Patents

Intelligent power module and electrical device Download PDF

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Publication number
WO2023240759A1
WO2023240759A1 PCT/CN2022/108591 CN2022108591W WO2023240759A1 WO 2023240759 A1 WO2023240759 A1 WO 2023240759A1 CN 2022108591 W CN2022108591 W CN 2022108591W WO 2023240759 A1 WO2023240759 A1 WO 2023240759A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
power module
explosion
board
intelligent power
Prior art date
Application number
PCT/CN2022/108591
Other languages
French (fr)
Chinese (zh)
Inventor
邓新贵
吴桢生
胡渊
Original Assignee
苏州汇川控制技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州汇川控制技术有限公司 filed Critical 苏州汇川控制技术有限公司
Publication of WO2023240759A1 publication Critical patent/WO2023240759A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion

Definitions

  • This application relates to the field of electrical equipment, and in particular to an intelligent power module and electrical equipment.
  • intelligent power integrated module is a power switching device with the advantages of small size, high power density and low cost.
  • the existing IPM includes: power circuit substrate, built-in functional circuit board and packaging shell; the built-in functional circuit board is directly welded to the terminals protruding from the power circuit substrate, and then the packaging shell cover is placed on the built-in functional circuit board.
  • the power circuit substrate seals the bottom opening of the packaging case, and finally the glue is poured and solidified to form a stacked packaging structure.
  • the power chips on the power circuit substrate in the IPM are at risk of exploding.
  • the main purpose of this application is to provide an intelligent power module and electrical equipment, aiming to solve the problem that the existing IPM does not have the explosion-proof function.
  • the explosion impact will destroy the surface of the built-in functional circuit board.
  • the insulation and isolation system threatens the personal safety of users.
  • an intelligent power module including:
  • At least one electrical connector is mounted on the first circuit board
  • the second circuit board passes through the electrical connector and is spaced apart from the first circuit board; a power chip is provided on a side of the first circuit board facing the second circuit board ;as well as,
  • An explosion-proof component avoids the electrical connector and is arranged between the first circuit board and the second circuit board.
  • a plurality of power chips is provided on a side of the first circuit board facing the second circuit board, and the plurality of power chips constitute at least one power circuit;
  • the second circuit board is provided with a primary-side functional circuit electrically connected to at least one of the power circuits through the electrical connector and a secondary-side functional circuit connected to the primary-side functional circuit through an isolation element.
  • the orthographic projection area of the explosion-proof component on the second circuit board at least covers the secondary side functional circuit area.
  • the explosion-proof parts are plastic parts, bare PCB boards or NOMEX insulating paper.
  • the explosion-proof parts when the explosion-proof parts are made of plastic parts, the explosion-proof parts include:
  • a board body is provided with a first support member on one side facing the second circuit board, and the first support member is in contact with the second circuit board.
  • the first support member includes:
  • a plurality of supporting ribs are arranged at intervals along the circumference of the board body, and the top ends of the plurality of supporting ribs are in contact with the second circuit board; and/or,
  • first support column There is at least one first support column, one end of the first support column is provided on a side of the board body facing the second circuit board, and the other end of the first support column is in contact with the second circuit board.
  • the first support member when the first support member includes a plurality of support ribs arranged at intervals along the circumference of the plate body, the first support member further includes a plurality of support ribs arranged along the circumferential direction of the plate body. Reinforcing ribs, the bottom ends of a plurality of supporting ribs are arranged on the reinforcing ribs at intervals.
  • the second circuit board is provided with positioning holes
  • the board body is provided with positioning posts that cooperate with the positioning holes.
  • the board body is provided with guide holes to avoid the electrical connectors, and the electrical connectors include:
  • Welding seat the bottom end of the welding seat is welded on the first circuit board
  • the bottom end of the electrical connection terminal is arranged in the welding hole of the soldering base, and the other end of the electrical connection terminal passes through the corresponding guide hole on the board body and is inserted into the second circuit plate;
  • the side of the board body facing the first circuit board abuts or is fixed on the welding base.
  • a support portion is formed along the outer periphery of the guide hole on a side of the board facing the first circuit board;
  • One end of the support portion away from the plate body is in contact with the upper surface of the welding seat; or,
  • One end of the support portion away from the plate body is interference-fitted with the welding seat.
  • a second support member is provided on a side of the board body facing the first circuit board, and the second support member is in contact with the upper surface of the first circuit board.
  • the second support member includes at least one second support column, one end of the second support column is disposed on a side of the board body facing the first circuit board, and the second support column The other end is in contact with the first circuit board.
  • the intelligent power module further includes:
  • the first circuit board blocks the bottom opening of the shell and defines an accommodation space with the shell.
  • the second circuit board and the explosion-proof component are located on the In the accommodation space;
  • a number of second through holes are provided on the top plate of the housing, and the top ends of some of the electrical connectors extend out of the housing through the second through holes;
  • the housing, the second circuit board and the explosion-proof component are all provided with potting holes for potting insulating medium, and the gaps in the accommodation space are filled with insulating medium.
  • the explosion-proof component adopts a bare PCB board
  • the bare PCB board is provided with welding holes for passing through the electrical connector
  • At least one of the electrical connectors on the first circuit board passes through the corresponding welding hole on the bare PCB board and is welded to the welding hole to fix the bare PCB board to the first circuit board. and the second circuit board.
  • an adhesive part is provided on the electrical connector, and the electrical connector passes through the NOMEX insulating paper and connects to the electrical connector through the adhesive part.
  • the NOMEX insulation paper is bonded.
  • this application also provides an electrical device, including the intelligent power module described in any one of the above.
  • the technical solution of this application is to add an explosion-proof component between the first circuit board and the second circuit board.
  • the explosion shock wave can be isolated on one side of the explosion-proof component to prevent the explosion shock wave from damaging the other side of the explosion-proof component.
  • the insulation isolation system improves the safety of the intelligent power module.
  • Figure 1 is an exploded view of an embodiment of the intelligent power module of the present application
  • Figure 2 is a front view of another embodiment of the smart power module of the present application.
  • Figure 3 is a front view of the explosion-proof parts of the intelligent power module of this application.
  • Figure 4 is a schematic structural diagram of the explosion-proof parts of the intelligent power module of this application.
  • connection can be a fixed connection, a detachable connection, or an integral body; it can It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two elements or an interactive relationship between two elements, unless otherwise clearly limited.
  • fixing can be a fixed connection, a detachable connection, or an integral body; it can It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two elements or an interactive relationship between two elements, unless otherwise clearly limited.
  • This application provides a The intelligent power module, by adding an explosion-proof component 20 between the first circuit board 10 and the second circuit board 30, can isolate the explosion shock wave on one side of the explosion-proof component 20 when the power chip explodes, preventing the explosion shock wave from damaging the explosion-proof component.
  • the insulation isolation system on the surface of the second circuit board 30 on the other side of the component 20 improves the safety of the IPM.
  • an intelligent power module including:
  • At least one electrical connector 11, the electrical connector 11 is installed on the first circuit board 10;
  • the second circuit board 30 is passed through the electrical connector 11 and is spaced apart from the first circuit board 10 ; the first circuit board 10 faces the second circuit board 30 A power chip is provided on one side; and,
  • the explosion-proof component 20 avoids the electrical connector 11 and is disposed between the first circuit board 10 and the second circuit board 30 .
  • the first circuit board 10 includes, but is not limited to, an aluminum-based resin copper-clad laminate, a copper-based resin copper-clad laminate, or a double-sided copper-clad ceramic substrate, and one side of the first circuit board 10 facing the second circuit board 30 is provided with Multiple power chips constitute at least one power circuit.
  • multiple power chips constitute power circuit units including but not limited to inverters, rectifiers, etc.
  • the second circuit board 30 is provided with a plurality of first through holes 32.
  • the electrical connector 11 passes through the first through holes 32 and is welded or crimped at the first through holes 32. In this way, electrical connection and mechanical connection are achieved with the second circuit board 30 .
  • the second circuit board 30 is provided with a primary-side functional circuit electrically connected to the power circuit on the first circuit board 10 through the electrical connector 11 and a primary-side functional circuit electrically connected to the primary-side functional circuit through an isolation element.
  • Secondary side functional circuit The orthographic projection area of the explosion-proof component 20 on the second circuit board 30 at least covers the secondary side functional circuit area.
  • the primary side functional circuit includes but is not limited to an inverter drive circuit and/or a rectifier drive circuit; the secondary side functional circuit includes but is not limited to a signal sampling circuit, an overcurrent/overvoltage protection circuit, etc.
  • the smart power module also includes: a housing 40 with an opening at the bottom.
  • the first circuit board 10 blocks the bottom opening of the housing 40 and defines an accommodation space with the housing 40.
  • the second circuit board 10 blocks the bottom opening of the housing 40 and defines an accommodation space with the housing 40.
  • the plate 30 and the explosion-proof component 20 are both located in the accommodation space; a number of second through holes 42 are provided on the top plate of the housing 40, and the top ends of some of the electrical connectors 11 pass through the second through holes 42.
  • a hole 42 extends out of the housing 40 .
  • the explosion-proof component 20 is provided with an escape portion for avoiding the electrical connector 11 .
  • the escape portion is at least one escape hole 25 provided corresponding to at least one electrical connector 11 .
  • the avoidance portion may also be a recessed portion provided around the explosion-proof component 20 to avoid the connector.
  • the explosion-proof component 20 includes but is not limited to plastic components, bare PCB boards, or NOMEX insulation paper.
  • the housing 40 , the second circuit board 30 and the explosion-proof component 20 are all provided with potting holes 26 , 33 and 41 for potting the insulating medium 50 .
  • the gap is filled with insulating medium 50 .
  • the insulating medium 50 includes but is not limited to silicone gel. The insulating medium can enhance the effect of insulation isolation.
  • the explosion-proof component 20 can isolate the explosion shock wave on one side of the explosion-proof component 20 when the power chip on the first circuit board 10 explodes to prevent the explosion-proof component 20 from damaging the surface of the second circuit board.
  • the insulation glue adhesion effect improves the safety of the intelligent function module.
  • the explosion-proof component 20 can isolate the explosion shock wave on one side of the explosion-proof component 20 to prevent the carbide generated by the explosion from covering the second circuit board.
  • the surface of the second circuit board 30 destroys the insulation isolation system on the surface of the second circuit board 30, thereby improving the safety of the intelligent power module.
  • the installation method of the explosion-proof component 20 in the intelligent power module includes but is not limited to: by arranging a support structure on the explosion-proof component 20 or on the first circuit board 10 and the second circuit board 30 so that the explosion-proof component 20 can be installed in the intelligent power module.
  • the explosion-proof component 20 is abutted between the first circuit board 10 and the second circuit board 30 ; or, by connecting between the explosion-proof component 20 or the first circuit board 10 and the second circuit board 30 A fixing piece is provided on the casing 40 so that the explosion-proof piece 20 is fixed on the first circuit board 10 or the second circuit board 30; or, the explosion-proof piece 20 can also be fixed on the housing 40, even when When the housing 40 is a split housing 40 , that is, when the frame of the housing 40 and the top plate of the housing 40 have a separate structure, the explosion-proof component 20 can also be designed to be integrated with the housing 40 . 40 in one piece.
  • the explosion-proof component 20 adopts a PCB bare board
  • the PCB bare board is provided with welding holes for passing through the electrical connectors; at least one of the first circuit boards 10
  • the electrical connector 11 passes through the corresponding welding hole on the PCB bare board and is welded with the welding hole to fix the PCB bare board between the first circuit board 10 and the second circuit board 30 .
  • the electrical connector 11 when the explosion-proof component 20 uses NOMEX insulating paper, the electrical connector 11 is provided with an adhesive portion, and the electrical connector 11 passes through the NOMEX insulating paper and passes through the adhesive. The part is bonded with the NOMEX insulation paper.
  • the explosion-proof parts are made of plastic parts, and the specific method is as shown in Figure 2:
  • the explosion-proof part 20 includes:
  • the plate body 21 is provided with a first support member on a side facing the second circuit board 30 , and the first support member is in contact with the second circuit board 30 .
  • the first support member includes:
  • a plurality of support ribs 23 are provided at intervals along the circumferential direction of the board body 21, and the top ends of the plurality of support ribs 23 are in contact with the second circuit board 30; and/or,
  • At least one first support column 24 one end of the first support column 24 is disposed on a side of the board body 21 facing the second circuit board 30 , and the other end of the first support column 24 is in contact with the second circuit board 30 .
  • the second circuit board 30 The second circuit board 30.
  • the height of the support rib 23 is the same as the height of the first support column 24, so that the second circuit board 30 can be supported together with the first support column 24, so that the second circuit board 30 and the board body 21 There is a certain gap therebetween to fill the insulating medium 50 therebetween.
  • the support rib 23 and the first support column 24 is in contact with the lower surface of the second circuit board 30 , when the power chip on the first circuit board 10 explodes, the support rib 23 can be in contact with the second circuit board 30 .
  • a support column 24 evenly distributes and conducts the impact force of the explosion to the second circuit board 30 to prevent the board body 21 from deforming.
  • a plurality of the support ribs 23 are arranged at intervals, so that there is a certain gap between adjacent support ribs 23, which facilitates glue filling and facilitates the smooth discharge of air bubbles generated by glue filling during vacuuming after glue filling.
  • the first support member when the first support member includes a plurality of support ribs 23 spaced apart along the circumference of the plate body 21 , the first support member also includes a plurality of support ribs 23 arranged along the circumference of the plate body 21 .
  • the bottom ends of a plurality of supporting ribs 23 are arranged on the reinforcing ribs 22 at intervals.
  • reinforcing ribs are provided under the supporting ribs, which can improve the strength of the explosion-proof parts and prevent them from deforming.
  • the height of the support rib 23 is the same as the height of the first support column, and both are in contact with the second circuit board 30 ;
  • the reinforcement rib 22 is provided under the support rib 23
  • the height of the first support column 24 is equal to the sum of the heights of the reinforcement rib 22 and the support rib 23.
  • the sum of the first support column 24 and The plurality of support ribs 23 are all in contact with the second circuit board 30 .
  • the second circuit board 30 is provided with positioning holes 31
  • the board body 21 is provided with positioning posts 29 that cooperate with the positioning holes 31 .
  • positioning posts 29 are formed on the upper surface of the board body 21 , and there are at least two positioning posts 29 .
  • the two positioning posts 29 are respectively provided at the upper left corner and the lower right corner of the board body 21 .
  • the number of positioning posts 29 can also be set at three or more, which is not limited in this embodiment.
  • the positioning post 29 penetrates the second circuit board 30, thereby realizing the positioning of the second circuit board 30 on the horizontal plane where the board body 21 is located, so that the orthographic projection of the board body 21 on the second circuit board 30 at least covers all the areas.
  • the second circuit board 30 occupies the area occupied by the secondary side circuit.
  • the electrical connector 11 includes:
  • Welding seat 111 the bottom end of the welding seat 111 is welded on the first circuit board 10;
  • the bottom end of the electrical connection terminal 112 is located in the welding hole of the soldering base 111, and the other end of the electrical connection terminal 112 passes through the corresponding guide hole on the board body and is then inserted into the welding hole.
  • the side of the board 21 facing the first circuit board 10 is in contact with or fixed on the soldering seat 111 .
  • the solder seat 111 is located between the first circuit board 10 and the board body 21 , and the side of the board body 21 facing the first circuit board 10 abuts or is fixed on the solder joint.
  • the soldering base since the soldering base has a certain height, there is a certain distance between the board body 21 and the first circuit board 10, so that the insulating medium 50 can completely cover the first circuit board 10 during glue filling. Bonding wires and other devices on the.
  • a support portion 28 is formed along the outer circumference of the guide hole on a side of the board body 21 facing the first circuit board 10; an end of the support portion 28 away from the board body is connected to the welding hole.
  • the upper surface of the seat 11 is in contact; or, the end of the support portion 28 away from the plate body is in interference fit with the welding seat 11 .
  • the side of the board body 21 facing the first circuit board 10 may also be provided with a supporting part 28, and the supporting part 28 is provided corresponding to the soldering seat 111. This is to increase the distance between the board body 21 and the first circuit board 10 to ensure that the insulating glue can completely cover the binding wires and other devices on the first circuit board 10 during glue filling.
  • the height of the support portion 28 can be set according to actual requirements.
  • the support part may be an annular protrusion, and the inner diameter and outer diameter of the end of the support part are equal to the inner diameter and outer diameter of the upper surface of the welding base respectively, so as to abut with the upper surface of the welding base.
  • the support part is a cylindrical structure with a mounting hole, and the mounting hole is an interference fit with the welding seat.
  • a second support member is provided on a side of the board body 21 facing the first circuit board 10 , and the second support member is in contact with the upper surface of the first circuit board 10 .
  • the second support member when the board body 21 and the second circuit board 30 are pressed down and installed on the first circuit board 10, the second support member can abut against the first circuit board 10, thereby avoiding The board body 21 is deformed during the press-down installation process to prevent the deformation of the board body 21 from causing the board body 21 to squeeze the binding wires and other components on the first circuit board 10 during the press-down installation process.
  • the second support member includes at least one second support column 27. One end of the second support column 27 is disposed on a side of the board body 21 facing the first circuit board 10. The other end of the second support column 27 is in contact with the first circuit board 10 .
  • this application also provides an electrical device, including the above intelligent power module.
  • the specific structure of the smart power module refers to the above-mentioned embodiments. Since this electrical equipment adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, and will not be detailed here. Repeat.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Disclosed in the present application are an intelligent power module and an electrical device. The intelligent power module comprises: a first circuit board; at least one electrical connector, which is mounted on the first circuit board; a second circuit board, which passes through the electrical connector and is arranged spaced apart from the first circuit board, wherein the face of the first circuit board that faces the second circuit board is provided with a power chip; and an explosion-proof member, which avoids the electrical connector and is arranged between the first circuit board and the second circuit board.

Description

智能功率模块及电气设备Intelligent power modules and electrical equipment
本申请要求于2022年6月16日申请的、申请号为202210683517.X的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims priority to the Chinese patent application with application number 202210683517.X filed on June 16, 2022, the entire content of which is incorporated into this application by reference.
技术领域Technical field
本申请涉及电气设备领域,特别涉及一种智能功率模块及电气设备。This application relates to the field of electrical equipment, and in particular to an intelligent power module and electrical equipment.
背景技术Background technique
相关技术中,智能功率集成模块(IPM,Intelligent Power Module)是一种功率开关器件,具有体积小、功率密度高以及成本低等优点。Among related technologies, intelligent power integrated module (IPM, Intelligent Power Module) is a power switching device with the advantages of small size, high power density and low cost.
现有的IPM包括:功率电路基板、内置功能电路板以及封装壳体;内置功能电路板直接焊接在功率电路基板伸出的端子上,然后将封装壳体罩设在内置功能电路板上,通过功率电路基板封堵封装壳体底部开口,最后灌胶固化,形成堆栈层叠封装结构。在使用过程中,由于控制策略或干扰等原因,IPM内功率电路基板上的功率芯片存在有爆炸的风险。The existing IPM includes: power circuit substrate, built-in functional circuit board and packaging shell; the built-in functional circuit board is directly welded to the terminals protruding from the power circuit substrate, and then the packaging shell cover is placed on the built-in functional circuit board. The power circuit substrate seals the bottom opening of the packaging case, and finally the glue is poured and solidified to form a stacked packaging structure. During use, due to control strategies or interference, the power chips on the power circuit substrate in the IPM are at risk of exploding.
目前,现有的IPM不具有防爆功能,当功率电路基板上的功率芯片发生爆炸时,爆炸冲击会破坏内置功能电路板表面的绝缘隔离系统,威胁用户的人身安全。Currently, existing IPMs do not have explosion-proof functions. When the power chip on the power circuit substrate explodes, the explosion impact will destroy the insulation isolation system on the surface of the built-in functional circuit board, threatening the user's personal safety.
技术问题technical problem
本申请的主要目的是提供一种智能功率模块及电气设备,旨在解决上述现有的IPM不具有防爆功能,当功率电路基板上的功率芯片发生爆炸时,爆炸冲击会破坏内置功能电路板表面的绝缘隔离系统,威胁用户的人身安全的问题。The main purpose of this application is to provide an intelligent power module and electrical equipment, aiming to solve the problem that the existing IPM does not have the explosion-proof function. When the power chip on the power circuit substrate explodes, the explosion impact will destroy the surface of the built-in functional circuit board. The insulation and isolation system threatens the personal safety of users.
技术解决方案Technical solutions
为实现上述目的,本申请提出的一种智能功率模块,包括:In order to achieve the above purpose, this application proposes an intelligent power module, including:
第一电路板;first circuit board;
至少一个电连接件,所述电连接件安装在所述第一电路板上;At least one electrical connector, the electrical connector is mounted on the first circuit board;
第二电路板,所述第二电路板穿设于所述电连接件,并与所述第一电路板间隔设置;所述第一电路板朝向所述第二电路板的一面设置有功率芯片;以及,a second circuit board, the second circuit board passes through the electrical connector and is spaced apart from the first circuit board; a power chip is provided on a side of the first circuit board facing the second circuit board ;as well as,
防爆件,所述防爆件避让所述电连接件,设置在所述第一电路板与所述第二电路板之间。An explosion-proof component avoids the electrical connector and is arranged between the first circuit board and the second circuit board.
在一实施例中,所述第一电路板朝向所述第二电路板的一面设置有多个功率芯片,多个功率芯片组成至少一个功率电路;In one embodiment, a plurality of power chips is provided on a side of the first circuit board facing the second circuit board, and the plurality of power chips constitute at least one power circuit;
所述第二电路板上设置有通过所述电连接件与至少一个所述功率电路电连接的初级侧功能电路以及通过隔离元件与所述初级侧功能电路连接的次级侧功能电路。The second circuit board is provided with a primary-side functional circuit electrically connected to at least one of the power circuits through the electrical connector and a secondary-side functional circuit connected to the primary-side functional circuit through an isolation element.
在一实施例中,所述防爆件在所述第二电路板上的正投影面积至少覆盖所述次级侧功能电路区域。In one embodiment, the orthographic projection area of the explosion-proof component on the second circuit board at least covers the secondary side functional circuit area.
在一实施例中,所述防爆件采用塑胶件、PCB裸板或者NOMEX绝缘纸。In one embodiment, the explosion-proof parts are plastic parts, bare PCB boards or NOMEX insulating paper.
在一实施例中,当所述防爆件采用塑胶件时,所述防爆件包括:In one embodiment, when the explosion-proof parts are made of plastic parts, the explosion-proof parts include:
板体,所述板体朝向所述第二电路板的一面设置有第一支撑件,所述第一支撑件抵接于所述第二电路板。A board body is provided with a first support member on one side facing the second circuit board, and the first support member is in contact with the second circuit board.
在一实施例中,所述第一支撑件包括:In one embodiment, the first support member includes:
沿所述板体周向间隔设置的多个支撑档边,多个所述支撑档边的顶端抵接于所述第二电路板;和/或,A plurality of supporting ribs are arranged at intervals along the circumference of the board body, and the top ends of the plurality of supporting ribs are in contact with the second circuit board; and/or,
至少一个第一支撑柱,所述第一支撑柱的一端设置在所述板体朝向所述第二电路板的一面,所述第一支撑柱的另一端抵接于所述第二电路板。There is at least one first support column, one end of the first support column is provided on a side of the board body facing the second circuit board, and the other end of the first support column is in contact with the second circuit board.
在一实施例中,当所述第一支撑件包括沿所述板体周向间隔设置的多个所述支撑档边时,所述第一支撑件还包括沿所述板体周向设置的加强筋,多个所述支撑档边的底端间隔设置在所述加强筋上。In one embodiment, when the first support member includes a plurality of support ribs arranged at intervals along the circumference of the plate body, the first support member further includes a plurality of support ribs arranged along the circumferential direction of the plate body. Reinforcing ribs, the bottom ends of a plurality of supporting ribs are arranged on the reinforcing ribs at intervals.
在一实施例中,所述第二电路板上设置有定位孔,所述板体上设置有与所述定位孔配合的定位柱。In one embodiment, the second circuit board is provided with positioning holes, and the board body is provided with positioning posts that cooperate with the positioning holes.
在一实施例中,所述板体开设有避让所述电连接件的导向孔,所述电连接件包括:In one embodiment, the board body is provided with guide holes to avoid the electrical connectors, and the electrical connectors include:
焊座,所述焊座的底端焊接在所述第一电路板上;Welding seat, the bottom end of the welding seat is welded on the first circuit board;
电连接端子,所述电连接端子的底端设于所述焊座的焊孔内,所述电连接端子的另一端经过所述板体上对应的导向孔后穿设于所述第二电路板;Electrical connection terminal, the bottom end of the electrical connection terminal is arranged in the welding hole of the soldering base, and the other end of the electrical connection terminal passes through the corresponding guide hole on the board body and is inserted into the second circuit plate;
所述板体朝向所述第一电路板的一面抵接或者固定在述焊座上。The side of the board body facing the first circuit board abuts or is fixed on the welding base.
在一实施例中,所述板体朝向所述第一电路板的一面沿所述导向孔的外周形成有支撑部;In one embodiment, a support portion is formed along the outer periphery of the guide hole on a side of the board facing the first circuit board;
所述支撑部远离所述板体的一端与所述焊座的上表面抵接;或者,One end of the support portion away from the plate body is in contact with the upper surface of the welding seat; or,
所述支撑部远离所述板体的一端与所述焊座过盈配合。One end of the support portion away from the plate body is interference-fitted with the welding seat.
在一实施例中,所述板体朝向所述第一电路板的一面设置有第二支撑件,所述第二支撑件与所述第一电路板的上表面抵接。In one embodiment, a second support member is provided on a side of the board body facing the first circuit board, and the second support member is in contact with the upper surface of the first circuit board.
在一实施例中,所述第二支撑件包括至少一个第二支撑柱,所述第二支撑柱的一端设置在所述板体朝向所述第一电路板的一面,所述第二支撑柱的另一端抵接于所述第一电路板。In one embodiment, the second support member includes at least one second support column, one end of the second support column is disposed on a side of the board body facing the first circuit board, and the second support column The other end is in contact with the first circuit board.
在一实施例中,所述的智能功率模块,还包括:In one embodiment, the intelligent power module further includes:
底部具有开口的壳体,所述第一电路板封堵所述壳体的底部开口并与所述壳体限定出一容置空间,所述第二电路板以及所述防爆件均位于所述容置空间内;所述壳体的顶板上开设有若干第二通孔,部分所述电连接件的顶端穿过所述第二通孔延伸出所述壳体;A shell with an opening at the bottom. The first circuit board blocks the bottom opening of the shell and defines an accommodation space with the shell. The second circuit board and the explosion-proof component are located on the In the accommodation space; a number of second through holes are provided on the top plate of the housing, and the top ends of some of the electrical connectors extend out of the housing through the second through holes;
所述壳体、所述第二电路板以及所述防爆件上均开设有灌封绝缘介质的灌封孔,所述容置空间的空隙内填充有绝缘介质。The housing, the second circuit board and the explosion-proof component are all provided with potting holes for potting insulating medium, and the gaps in the accommodation space are filled with insulating medium.
在一实施例中,所述防爆件的外周与所述壳体的内壁之间具有间隙。In one embodiment, there is a gap between the outer periphery of the explosion-proof component and the inner wall of the housing.
在一实施例中,当所述防爆件采用PCB裸板时,所述PCB裸板开设有用于穿设所述电连接件的焊孔;In one embodiment, when the explosion-proof component adopts a bare PCB board, the bare PCB board is provided with welding holes for passing through the electrical connector;
所述第一电路板上的至少一个所述电连接件穿过所述PCB裸板上对应的焊孔并与所述焊孔焊接,以将所述PCB裸板固定在所述第一电路板与所述第二电路板之间。At least one of the electrical connectors on the first circuit board passes through the corresponding welding hole on the bare PCB board and is welded to the welding hole to fix the bare PCB board to the first circuit board. and the second circuit board.
在一实施例中,当所述防爆件采用NOMEX绝缘纸时,所述电连接件上设置有粘接部,所述电连接件穿过所述NOMEX绝缘纸并通过所述粘接部与所述NOMEX绝缘纸粘接。In one embodiment, when the explosion-proof part uses NOMEX insulating paper, an adhesive part is provided on the electrical connector, and the electrical connector passes through the NOMEX insulating paper and connects to the electrical connector through the adhesive part. The NOMEX insulation paper is bonded.
第二方面,本申请还提供了一种电气设备,包括上述任一项所述的智能功率模块。In a second aspect, this application also provides an electrical device, including the intelligent power module described in any one of the above.
有益效果beneficial effects
本申请技术方案通过在第一电路板和第二电路板之间增设一防爆件,可以在功率芯片发生爆炸时,将爆炸冲击波隔离在防爆件的一侧,避免爆炸冲击波破坏防爆件另一侧的绝缘隔离系统,提高了智能功率模块的安全性。The technical solution of this application is to add an explosion-proof component between the first circuit board and the second circuit board. When the power chip explodes, the explosion shock wave can be isolated on one side of the explosion-proof component to prevent the explosion shock wave from damaging the other side of the explosion-proof component. The insulation isolation system improves the safety of the intelligent power module.
附图说明Description of the drawings
为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图示出的结构获得其他的附图。In order to explain the embodiments of the present application or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on the structures shown in these drawings without exerting creative efforts.
图1为本申请智能功率模块一实施例的爆炸图;Figure 1 is an exploded view of an embodiment of the intelligent power module of the present application;
图2为本申请智能功率模块另一实施例的主视图;Figure 2 is a front view of another embodiment of the smart power module of the present application;
图3为本申请智能功率模块的防爆件的主视图;Figure 3 is a front view of the explosion-proof parts of the intelligent power module of this application;
图4为本申请智能功率模块的防爆件的结构示意图。Figure 4 is a schematic structural diagram of the explosion-proof parts of the intelligent power module of this application.
附图标号说明:Explanation of reference numbers:
标号 label 名称 name 标号 label 名称 name
10 10 第一电路板 first circuit board 24 twenty four 第一支撑柱 first support column
20 20 防爆件 Explosion-proof parts 25 25 避让孔 escape hole
30 30 第二电路板 Second circuit board 26、33、41 26, 33, 41 灌胶孔 Glue filling hole
40 40 壳体 case 27 27 第二支撑柱 second support column
11 11 电连接件 Electrical connectors 28 28 支撑部 Support part
111 111 焊座 Welding seat 29 29 定位柱 Positioning post
112 112 电连接端子 Electrical connection terminal 31 31 定位孔 Positioning hole
21 twenty one 板体 plate body 32 32 第一通孔 first through hole
22 twenty two 加强筋 Reinforcement ribs 50 50 绝缘介质 insulating medium
23 twenty three 支撑档边 Support side 42 42 第二通孔 second through hole
本申请目的的实现、功能特点及优点将结合实施例,参照附图做进一步说明。The realization of the purpose, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings.
本发明的实施方式Embodiments of the invention
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请的一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of this application.
需要说明,本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of this application are only used to explain the relationship between components in a specific posture (as shown in the drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.
在本申请中,除非另有明确的规定和限定,术语“连接”、“固定”等应做广义理解,例如,“固定”可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。In this application, unless otherwise clearly stated and limited, the terms "connection", "fixing", etc. should be understood in a broad sense. For example, "fixing" can be a fixed connection, a detachable connection, or an integral body; it can It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two elements or an interactive relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
另外,若本申请实施例中有涉及“第一”、“第二”等的描述,则该“第一”、“第二”等的描述仅用于描述目的,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外,全文中出现的“和/或”的含义,包括三个并列的方案,以“A和/或B”为例,包括A方案、或B方案、或A和B同时满足的方案。另外,各个实施例之间的技术方案可以相互结合,但是必须是以本领域普通技术人员能够实现为基础,当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在,也不在本申请要求的保护范围之内。In addition, if there are descriptions involving “first”, “second”, etc. in the embodiments of this application, the descriptions of “first”, “second”, etc. are only for descriptive purposes and shall not be understood as indications or implications. Its relative importance or implicit indication of the number of technical features indicated. Therefore, features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, the meaning of "and/or" appearing in the entire text includes three parallel solutions. Taking "A and/or B" as an example, it includes solution A, or solution B, or a solution that satisfies both A and B at the same time. In addition, the technical solutions in various embodiments can be combined with each other, but it must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that such a combination of technical solutions does not exist. , nor is it within the scope of protection required by this application.
针对现有的IPM不具有防爆功能,当功率电路基板上的功率芯片发生爆炸时,爆炸冲击会破坏内置功能电路板表面的绝缘隔离系统,威胁用户的人身安全的问题,本申请提供了一种智能功率模块,通过在第一电路板10和第二电路板30之间增设一防爆件20,可以在功率芯片发生爆炸时,将爆炸冲击波隔离在防爆件20的一侧,避免爆炸冲击波破坏防爆件20另一侧第二电路板30表面的绝缘隔离系统,提高了IPM的安全性。In view of the problem that the existing IPM does not have an explosion-proof function. When the power chip on the power circuit substrate explodes, the explosion impact will destroy the insulation isolation system on the surface of the built-in functional circuit board, threatening the user's personal safety. This application provides a The intelligent power module, by adding an explosion-proof component 20 between the first circuit board 10 and the second circuit board 30, can isolate the explosion shock wave on one side of the explosion-proof component 20 when the power chip explodes, preventing the explosion shock wave from damaging the explosion-proof component. The insulation isolation system on the surface of the second circuit board 30 on the other side of the component 20 improves the safety of the IPM.
下面结合一些具体实施例进一步阐述本申请的构思。The concept of the present application will be further elaborated below in conjunction with some specific embodiments.
参见图1所示,本申请实施例提供一种智能功率模块包括:As shown in Figure 1, an embodiment of the present application provides an intelligent power module including:
第一电路板10;first circuit board 10;
至少一个电连接件11,所述电连接件11安装在所述第一电路板10上;At least one electrical connector 11, the electrical connector 11 is installed on the first circuit board 10;
第二电路板30,所述第二电路板30穿设于所述电连接件11,并与所述第一电路板10间隔设置;所述第一电路板10朝向所述第二电路板30的一面设置有功率芯片;以及,The second circuit board 30 is passed through the electrical connector 11 and is spaced apart from the first circuit board 10 ; the first circuit board 10 faces the second circuit board 30 A power chip is provided on one side; and,
防爆件20,所述防爆件20避让所述电连接件11,设置在所述第一电路板10与所述第二电路板30之间。The explosion-proof component 20 avoids the electrical connector 11 and is disposed between the first circuit board 10 and the second circuit board 30 .
所述第一电路板10包括但不限于铝基树脂覆铜板、铜基树脂覆铜板或者双面覆铜陶瓷基板,且所述第一电路板10朝向所述第二电路板30的一面设置有多个功率芯片,多个功率芯片组成至少一个功率电路,例如:多个功率芯片组成包括但不仅限于逆变、整流等功率电路单元。The first circuit board 10 includes, but is not limited to, an aluminum-based resin copper-clad laminate, a copper-based resin copper-clad laminate, or a double-sided copper-clad ceramic substrate, and one side of the first circuit board 10 facing the second circuit board 30 is provided with Multiple power chips constitute at least one power circuit. For example, multiple power chips constitute power circuit units including but not limited to inverters, rectifiers, etc.
所述第二电路板30上设置有若干第一通孔32,所述电连接件11对应穿过所述第一通孔32,并在所述第一通孔32处通过焊接或压接的方式与所述第二电路板30实现电连接及机械连接。所述第二电路板30上设置有通过所述电连接件11与所述第一电路板10上的功率电路电性连接的初级侧功能电路以及通过隔离元件与初级侧功能电路电性连接的次级侧功能电路。所述防爆件20在所述第二电路板30上的正投影面积至少覆盖所述次级侧功能电路区域。其中,所述初级侧功能电路包括但不限于逆变驱动电路和/或整流驱动电路;所述次级侧功能电路包括但不限于信号采样电路、过流/过压保护电路等。The second circuit board 30 is provided with a plurality of first through holes 32. The electrical connector 11 passes through the first through holes 32 and is welded or crimped at the first through holes 32. In this way, electrical connection and mechanical connection are achieved with the second circuit board 30 . The second circuit board 30 is provided with a primary-side functional circuit electrically connected to the power circuit on the first circuit board 10 through the electrical connector 11 and a primary-side functional circuit electrically connected to the primary-side functional circuit through an isolation element. Secondary side functional circuit. The orthographic projection area of the explosion-proof component 20 on the second circuit board 30 at least covers the secondary side functional circuit area. The primary side functional circuit includes but is not limited to an inverter drive circuit and/or a rectifier drive circuit; the secondary side functional circuit includes but is not limited to a signal sampling circuit, an overcurrent/overvoltage protection circuit, etc.
智能功率模块还包括:底部具有开口的壳体40,所述第一电路板10封堵所述壳体40的底部开口并与所述壳体40限定出一容置空间,所述第二电路板30以及所述防爆件20均位于所述容置空间内;所述壳体40的顶板上开设有若干第二通孔42,部分所述电连接件11的顶端穿过所述第二通孔42延伸出所述壳体40。The smart power module also includes: a housing 40 with an opening at the bottom. The first circuit board 10 blocks the bottom opening of the housing 40 and defines an accommodation space with the housing 40. The second circuit board 10 blocks the bottom opening of the housing 40 and defines an accommodation space with the housing 40. The plate 30 and the explosion-proof component 20 are both located in the accommodation space; a number of second through holes 42 are provided on the top plate of the housing 40, and the top ends of some of the electrical connectors 11 pass through the second through holes 42. A hole 42 extends out of the housing 40 .
所述防爆件20上设置有避让所述电连接件11的避让部。如图1所示,在一实施例中,所述避让部为与至少一个电连接件11对应设置的至少一个避让孔25。当然在其他实现示例中,当电连接件11仅位于靠近第一电路板10的四周的侧边时,所述避让部也可以是设置在防爆件20四周避让所述连接件的凹部。在一实施例中,所述防爆件20包括但不限于塑胶件、PCB裸板或者NOMEX绝缘纸。The explosion-proof component 20 is provided with an escape portion for avoiding the electrical connector 11 . As shown in FIG. 1 , in one embodiment, the escape portion is at least one escape hole 25 provided corresponding to at least one electrical connector 11 . Of course, in other implementation examples, when the electrical connector 11 is only located on the side close to the periphery of the first circuit board 10 , the avoidance portion may also be a recessed portion provided around the explosion-proof component 20 to avoid the connector. In one embodiment, the explosion-proof component 20 includes but is not limited to plastic components, bare PCB boards, or NOMEX insulation paper.
在一实施例中,所述壳体40、所述第二电路板30以及所述防爆件20上均开设有灌封绝缘介质50的灌封孔26、33、41,所述容置空间的空隙内填充有绝缘介质50。在本实施例中,所第一电路板10与所述防爆件20之间、所述防爆件20与所述第二电路板30之间以及所述第二电路板30与所述壳体40的顶板之间的间隙均填充有绝缘介质50。其中,所述绝缘介质50包括但不限于硅凝胶。所述绝缘介质可以起到加强绝缘隔离的效果。在一实施例中,所述防爆件20的外周与所述壳体40的内壁之间具有间隙。这样一方面便于灌胶,另一方面便于将灌胶时产生的气泡顺利排出,提高灌封效果。在本实施例中,所述防爆件20可以在所述第一电路板10上的功率芯片发生爆炸时,将爆炸冲击波隔离在防爆件20的一侧,避免防爆件20破坏第二电路板表面的绝缘胶附着效果,提高了智能功能模块的安全性。In one embodiment, the housing 40 , the second circuit board 30 and the explosion-proof component 20 are all provided with potting holes 26 , 33 and 41 for potting the insulating medium 50 . The gap is filled with insulating medium 50 . In this embodiment, between the first circuit board 10 and the explosion-proof component 20 , between the explosion-proof component 20 and the second circuit board 30 , and between the second circuit board 30 and the housing 40 The gaps between the top plates are filled with insulating medium 50 . Wherein, the insulating medium 50 includes but is not limited to silicone gel. The insulating medium can enhance the effect of insulation isolation. In one embodiment, there is a gap between the outer periphery of the explosion-proof component 20 and the inner wall of the housing 40 . On the one hand, this facilitates glue filling, and on the other hand, it facilitates the smooth discharge of air bubbles generated during glue filling, thereby improving the potting effect. In this embodiment, the explosion-proof component 20 can isolate the explosion shock wave on one side of the explosion-proof component 20 when the power chip on the first circuit board 10 explodes to prevent the explosion-proof component 20 from damaging the surface of the second circuit board. The insulation glue adhesion effect improves the safety of the intelligent function module.
当然,在其他实现示例中,当所述第二电路板30的面积足够大时,能够满足所述第二电路板30上各元器件之间的爬电距离和电气间隙的要求时,所述防爆件20与所述第二电路板30之间也可以不填充绝缘介质50,此时所述防爆件20可以将爆炸冲击波隔离在防爆件20的一侧,避免爆炸产生的碳化物覆盖到第二电路板30表面,破坏第二电路板30表面的绝缘隔离系统,进而提高了智能功率模块的安全性。Of course, in other implementation examples, when the area of the second circuit board 30 is large enough to meet the requirements of the creepage distance and electrical clearance between the components on the second circuit board 30, the The insulating medium 50 does not need to be filled between the explosion-proof component 20 and the second circuit board 30. In this case, the explosion-proof component 20 can isolate the explosion shock wave on one side of the explosion-proof component 20 to prevent the carbide generated by the explosion from covering the second circuit board. The surface of the second circuit board 30 destroys the insulation isolation system on the surface of the second circuit board 30, thereby improving the safety of the intelligent power module.
所述防爆件20在所述智能功率模块内的安装方式包括但不限于:通过在所述防爆件20或者在所述第一电路板10和所述第二电路板30上设置支撑结构使所述防爆件20抵接于所述第一电路板10与所述第二电路板30之间;或者,通过在所述防爆件20或所述第一电路板10和所述第二电路板30上设置固定件,使所述防爆件20固定在所述第一电路板10或者所述第二电路板30上;或者,所述防爆件20也可以固定在所述壳体40上,甚至当所述壳体40为分体式壳体40时,即所述壳体40的边框与所述壳体40的顶板为分体式的结构时,所述防爆件20还可以设计为与所述壳体40一体成型。The installation method of the explosion-proof component 20 in the intelligent power module includes but is not limited to: by arranging a support structure on the explosion-proof component 20 or on the first circuit board 10 and the second circuit board 30 so that the explosion-proof component 20 can be installed in the intelligent power module. The explosion-proof component 20 is abutted between the first circuit board 10 and the second circuit board 30 ; or, by connecting between the explosion-proof component 20 or the first circuit board 10 and the second circuit board 30 A fixing piece is provided on the casing 40 so that the explosion-proof piece 20 is fixed on the first circuit board 10 or the second circuit board 30; or, the explosion-proof piece 20 can also be fixed on the housing 40, even when When the housing 40 is a split housing 40 , that is, when the frame of the housing 40 and the top plate of the housing 40 have a separate structure, the explosion-proof component 20 can also be designed to be integrated with the housing 40 . 40 in one piece.
在一实施例中,当所述防爆件20采用PCB裸板时,所述PCB裸板开设有用于穿设所述电连接件的焊孔;所述第一电路板上10的至少一个所述电连接件11穿过所述PCB裸板上对应的焊孔并与所述焊孔焊接,以将所述PCB裸板固定在所述第一电路板10与所述第二电路板30之间。In one embodiment, when the explosion-proof component 20 adopts a PCB bare board, the PCB bare board is provided with welding holes for passing through the electrical connectors; at least one of the first circuit boards 10 The electrical connector 11 passes through the corresponding welding hole on the PCB bare board and is welded with the welding hole to fix the PCB bare board between the first circuit board 10 and the second circuit board 30 .
在一实施例中,当所述防爆件20采用NOMEX绝缘纸时,所述电连接件11上设置有粘接部,所述电连接件11穿过所述NOMEX绝缘纸并通过所述粘接部与所述NOMEX绝缘纸粘接。In one embodiment, when the explosion-proof component 20 uses NOMEX insulating paper, the electrical connector 11 is provided with an adhesive portion, and the electrical connector 11 passes through the NOMEX insulating paper and passes through the adhesive. The part is bonded with the NOMEX insulation paper.
在一实施例中,在一较佳实现示例中,所述防爆件采用塑胶件,其具体方式如图2所示:In one embodiment, in a preferred implementation example, the explosion-proof parts are made of plastic parts, and the specific method is as shown in Figure 2:
当所述防爆件20采用塑胶件时,所述防爆件20包括:When the explosion-proof part 20 is made of plastic parts, the explosion-proof part 20 includes:
板体21,所述板体21朝向所述第二电路板30的一面设置有第一支撑件,所述第一支撑件抵接于所述第二电路板30。The plate body 21 is provided with a first support member on a side facing the second circuit board 30 , and the first support member is in contact with the second circuit board 30 .
在一实施例中,所述第一支撑件包括:In one embodiment, the first support member includes:
沿所述板体21周向间隔设置的多个支撑档边23,多个所述支撑档边23的顶端抵接于所述第二电路板30;和/或,A plurality of support ribs 23 are provided at intervals along the circumferential direction of the board body 21, and the top ends of the plurality of support ribs 23 are in contact with the second circuit board 30; and/or,
至少一个第一支撑柱24,所述第一支撑柱24的一端设置在所述板体21朝向所述第二电路板30的一面,所述第一支撑柱24的另一端抵接于所述第二电路板30。At least one first support column 24 , one end of the first support column 24 is disposed on a side of the board body 21 facing the second circuit board 30 , and the other end of the first support column 24 is in contact with the second circuit board 30 . The second circuit board 30.
在本实施例中,所述支撑档边23的高度与第一支撑柱24的高度相同,从而可与第一支撑柱24一同支撑第二电路板30,使得第二电路板30与板体21之间具有一定的间隙,以在两者之间填充绝缘介质50。此外,由于支撑档边23和所述第一支撑柱24的上表面与第二电路板30的下表面相抵接,当第一电路板10上的功率芯片爆炸时,支撑档边23可与第一支撑柱24一同将爆炸的冲击力均匀分散传导至第二电路板30上,防止所述板体21发生形变。同时,多个所述支撑档边23间隔设置,使得相邻支撑档边23之间具有一定间隙,这样便于灌胶以及便于灌胶后抽真空时,使灌胶产生的气泡顺利排出。In this embodiment, the height of the support rib 23 is the same as the height of the first support column 24, so that the second circuit board 30 can be supported together with the first support column 24, so that the second circuit board 30 and the board body 21 There is a certain gap therebetween to fill the insulating medium 50 therebetween. In addition, since the upper surface of the support rib 23 and the first support column 24 is in contact with the lower surface of the second circuit board 30 , when the power chip on the first circuit board 10 explodes, the support rib 23 can be in contact with the second circuit board 30 . A support column 24 evenly distributes and conducts the impact force of the explosion to the second circuit board 30 to prevent the board body 21 from deforming. At the same time, a plurality of the support ribs 23 are arranged at intervals, so that there is a certain gap between adjacent support ribs 23, which facilitates glue filling and facilitates the smooth discharge of air bubbles generated by glue filling during vacuuming after glue filling.
在一实施例中,当所述第一支撑件包括沿所述板体21周向间隔设置的多个所述支撑档边23时,所述第一支撑件还包括沿所述板体21周向设置的加强筋22,多个所述支撑档边23的底端间隔设置在所述加强筋22上。In one embodiment, when the first support member includes a plurality of support ribs 23 spaced apart along the circumference of the plate body 21 , the first support member also includes a plurality of support ribs 23 arranged along the circumference of the plate body 21 . The bottom ends of a plurality of supporting ribs 23 are arranged on the reinforcing ribs 22 at intervals.
在本实施例中,在支撑档边下设置加强筋,可以提高防爆件的强度,防止其发生变形。需要说明的是,当支撑档边23下未设置所述加强筋22时,所述支撑档边23的高度与所述第一支撑柱的高度相同,均抵接于所述第二电路板30;当支撑档边23下设置有所述加强筋22时,所述第一支撑柱24的高度等于所述加强筋22与所述支撑档边23高度之和,所述第一支撑柱24和多个所述支撑档边23均抵接于所述第二电路板30。In this embodiment, reinforcing ribs are provided under the supporting ribs, which can improve the strength of the explosion-proof parts and prevent them from deforming. It should be noted that when the reinforcing rib 22 is not provided under the support rib 23 , the height of the support rib 23 is the same as the height of the first support column, and both are in contact with the second circuit board 30 ; When the reinforcement rib 22 is provided under the support rib 23, the height of the first support column 24 is equal to the sum of the heights of the reinforcement rib 22 and the support rib 23. The sum of the first support column 24 and The plurality of support ribs 23 are all in contact with the second circuit board 30 .
在一实施例中,所述第二电路板30上设置有定位孔31,所述板体21上设置有与所述定位孔31配合的定位柱29。In one embodiment, the second circuit board 30 is provided with positioning holes 31 , and the board body 21 is provided with positioning posts 29 that cooperate with the positioning holes 31 .
本实施例中,所述板体21的上表面上形成有定位柱29,定位柱29至少包括2个,如两个定位柱29分别设置于所述板体21的左上角与右下角。可以理解的,定位柱29还可设置为3个或以上,本实施例对此并不限制。且定位柱29穿设第二电路板30,从而实现对第二电路板30在所述板体21所在水平面上的定位,以使得板体21在第二电路板30上的正投影至少覆盖所述第二电路板30上次级侧电路所占区域。In this embodiment, positioning posts 29 are formed on the upper surface of the board body 21 , and there are at least two positioning posts 29 . For example, the two positioning posts 29 are respectively provided at the upper left corner and the lower right corner of the board body 21 . It can be understood that the number of positioning posts 29 can also be set at three or more, which is not limited in this embodiment. And the positioning post 29 penetrates the second circuit board 30, thereby realizing the positioning of the second circuit board 30 on the horizontal plane where the board body 21 is located, so that the orthographic projection of the board body 21 on the second circuit board 30 at least covers all the areas. The second circuit board 30 occupies the area occupied by the secondary side circuit.
在一实施例中,所述电连接件11包括:In one embodiment, the electrical connector 11 includes:
焊座111,所述焊座111的底端焊接在所述第一电路板10上;Welding seat 111, the bottom end of the welding seat 111 is welded on the first circuit board 10;
电连接端子112,所述电连接端子112的底端设于所述焊座111的焊孔内,所述电连接端子112的另一端通过所述板体上对应的导向孔后穿设于所述第二电路板30;Electrical connection terminal 112, the bottom end of the electrical connection terminal 112 is located in the welding hole of the soldering base 111, and the other end of the electrical connection terminal 112 passes through the corresponding guide hole on the board body and is then inserted into the welding hole. The second circuit board 30;
所述板体21朝向所述第一电路板10的一面抵接或者固定在述焊座111上。The side of the board 21 facing the first circuit board 10 is in contact with or fixed on the soldering seat 111 .
在本实施例中,所述焊座111位于所述第一电路板10与所述板体21之间,所述板体21朝向所述第一电路板10的一面抵接或者固定在述焊座111上,由于焊座具有一定的高度,这样使得所述板体21与第一电路板10之间具有一定的间距,以使得在灌胶时,绝缘介质50可以完全覆盖第一电路板10上的绑定线等器件。In this embodiment, the solder seat 111 is located between the first circuit board 10 and the board body 21 , and the side of the board body 21 facing the first circuit board 10 abuts or is fixed on the solder joint. On the base 111, since the soldering base has a certain height, there is a certain distance between the board body 21 and the first circuit board 10, so that the insulating medium 50 can completely cover the first circuit board 10 during glue filling. Bonding wires and other devices on the.
在一实施例中,所述板体21朝向所述第一电路板10的一面沿所述导向孔的外周形成有支撑部28;所述支撑部28远离所述板体的一端与所述焊座11的上表面抵接;或者,所述支撑部28远离所述板体的一端与所述焊座11过盈配合。In one embodiment, a support portion 28 is formed along the outer circumference of the guide hole on a side of the board body 21 facing the first circuit board 10; an end of the support portion 28 away from the board body is connected to the welding hole. The upper surface of the seat 11 is in contact; or, the end of the support portion 28 away from the plate body is in interference fit with the welding seat 11 .
在实施例中,当所述焊座111的高度较低时,所述板体21朝向所述第一电路板10的一面还可以设置有支撑部28,支撑部28与焊座111对应设置,以增加所述板体21与所述第一电路板10之间的间距,确保在灌胶时,绝缘胶可以完全覆盖第一电路板10上的绑定线等器件。所述支撑部28的高度可以根据实际需求进行设置。In an embodiment, when the height of the soldering seat 111 is low, the side of the board body 21 facing the first circuit board 10 may also be provided with a supporting part 28, and the supporting part 28 is provided corresponding to the soldering seat 111. This is to increase the distance between the board body 21 and the first circuit board 10 to ensure that the insulating glue can completely cover the binding wires and other devices on the first circuit board 10 during glue filling. The height of the support portion 28 can be set according to actual requirements.
在一实施例中,所述支撑部可以为圆环形的凸起,且支撑部端部的内径和外径分别与焊座上表面的内径和外径相等,以与焊座上表面抵接;或者,所述支撑部为带有安装孔的柱形结构,所述安装孔与所述焊座过盈配合。In one embodiment, the support part may be an annular protrusion, and the inner diameter and outer diameter of the end of the support part are equal to the inner diameter and outer diameter of the upper surface of the welding base respectively, so as to abut with the upper surface of the welding base. ; Alternatively, the support part is a cylindrical structure with a mounting hole, and the mounting hole is an interference fit with the welding seat.
在一实施例中,所述板体21朝向所述第一电路板10的一面设置有第二支撑件,所述第二支撑件与所述第一电路板10的上表面抵接。In one embodiment, a second support member is provided on a side of the board body 21 facing the first circuit board 10 , and the second support member is in contact with the upper surface of the first circuit board 10 .
在本实施例中,在将所述板体21与第二电路板30一同下压并安装在第一电路板10上时,第二支撑件可抵接于第一电路板10上,从而避免所述板体21在下压安装过程中发生变形,以避免所述板体21的变形导致所述板体21在下压安装过程中挤压第一电路板10上的绑定线等元器件。在一实施例中,所述第二支撑件包括至少一个第二支撑柱27,所述第二支撑柱27的一端设置在所述板体21朝向所述第一电路板10的一面,所述第二支撑柱27的另一端抵接于所述第一电路板10。In this embodiment, when the board body 21 and the second circuit board 30 are pressed down and installed on the first circuit board 10, the second support member can abut against the first circuit board 10, thereby avoiding The board body 21 is deformed during the press-down installation process to prevent the deformation of the board body 21 from causing the board body 21 to squeeze the binding wires and other components on the first circuit board 10 during the press-down installation process. In one embodiment, the second support member includes at least one second support column 27. One end of the second support column 27 is disposed on a side of the board body 21 facing the first circuit board 10. The other end of the second support column 27 is in contact with the first circuit board 10 .
以上可以看出,本申请实施例提供的智能功率模块通过在第一电路板10和第二电路板30之间增设一防爆件20,可以在功率芯片发生爆炸时,将爆炸冲击波隔离在防爆件20的一侧,避免爆炸冲击波破坏防爆件20另一侧的绝缘隔离系统,提高了IPM的安全性。It can be seen from the above that by adding an explosion-proof component 20 between the first circuit board 10 and the second circuit board 30 in the smart power module provided by the embodiment of the present application, when the power chip explodes, the explosion shock wave can be isolated by the explosion-proof component. 20 to prevent the explosion shock wave from damaging the insulation isolation system on the other side of the explosion-proof part 20, thereby improving the safety of the IPM.
第二方面,本申请还提供了一种电气设备,包括如上的智能功率模块。该智能功率模块的具体结构参照上述实施例,由于本电气设备采用了上述所有实施例的全部技术方案,因此至少具有上述实施例的技术方案所带来的所有有益效果,在此不再一一赘述。In a second aspect, this application also provides an electrical device, including the above intelligent power module. The specific structure of the smart power module refers to the above-mentioned embodiments. Since this electrical equipment adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, and will not be detailed here. Repeat.
以上所述仅为本申请的可选实施例,并非因此限制本申请的专利范围,凡是在本申请的申请构思下,利用本申请说明书及附图内容所作的等效结构变换,或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。The above are only optional embodiments of the present application, and do not limit the patent scope of the present application. Under the application concept of the present application, equivalent structural transformations made using the contents of the description and drawings of the present application, or direct/indirect Application in other related technical fields is included in the scope of patent protection of this application.

Claims (17)

  1. 一种智能功率模块,其中,包括:An intelligent power module, including:
    第一电路板;first circuit board;
    至少一个电连接件,所述电连接件安装在所述第一电路板上;At least one electrical connector, the electrical connector is mounted on the first circuit board;
    第二电路板,所述第二电路板穿设于所述电连接件,并与所述第一电路板间隔设置;所述第一电路板朝向所述第二电路板的一面设置有功率芯片;以及,a second circuit board, the second circuit board passes through the electrical connector and is spaced apart from the first circuit board; a power chip is provided on a side of the first circuit board facing the second circuit board ;as well as,
    防爆件,所述防爆件避让所述电连接件,设置在所述第一电路板与所述第二电路板之间。An explosion-proof component avoids the electrical connector and is arranged between the first circuit board and the second circuit board.
  2. 根据权利要求1所述的智能功率模块,其中,所述第一电路板朝向所述第二电路板的一面设置有多个功率芯片,多个功率芯片组成至少一个功率电路;The intelligent power module according to claim 1, wherein the first circuit board is provided with a plurality of power chips on a side facing the second circuit board, and the plurality of power chips constitute at least one power circuit;
    所述第二电路板上设置有通过所述电连接件与至少一个所述功率电路电连接的初级侧功能电路以及通过隔离元件与所述初级侧功能电路连接的次级侧功能电路。The second circuit board is provided with a primary-side functional circuit electrically connected to at least one of the power circuits through the electrical connector and a secondary-side functional circuit connected to the primary-side functional circuit through an isolation element.
  3. 如权利要求2所述的智能功率模块,其中,所述防爆件在所述第二电路板上的正投影面积至少覆盖所述次级侧功能电路区域。The intelligent power module according to claim 2, wherein the orthographic projection area of the explosion-proof component on the second circuit board at least covers the secondary side functional circuit area.
  4. 根据权利要求1所述的智能功率模块,其中,所述防爆件采用塑胶件、PCB裸板或者NOMEX绝缘纸。The intelligent power module according to claim 1, wherein the explosion-proof parts are plastic parts, PCB bare boards or NOMEX insulating paper.
  5. 如权利要求1所述的智能功率模块,其中,当所述防爆件采用塑胶件时,所述防爆件包括:The intelligent power module according to claim 1, wherein when the explosion-proof parts are made of plastic parts, the explosion-proof parts include:
    板体,所述板体朝向所述第二电路板的一面设置有第一支撑件,所述第一支撑件抵接于所述第二电路板。A board body is provided with a first support member on one side facing the second circuit board, and the first support member is in contact with the second circuit board.
  6. 根据权利要求5所述的智能功率模块,其中,所述第一支撑件包括:The intelligent power module according to claim 5, wherein the first support member includes:
    沿所述板体周向间隔设置的多个支撑档边,多个所述支撑档边的顶端抵接于所述第二电路板;和/或,A plurality of supporting ribs are arranged at intervals along the circumference of the board body, and the top ends of the plurality of supporting ribs are in contact with the second circuit board; and/or,
    至少一个第一支撑柱,所述第一支撑柱的一端设置在所述板体朝向所述第二电路板的一面,所述第一支撑柱的另一端抵接于所述第二电路板。There is at least one first support column, one end of the first support column is provided on a side of the board body facing the second circuit board, and the other end of the first support column is in contact with the second circuit board.
  7. 根据权利要求6所述的智能功率模块,当所述第一支撑件包括沿所述板体周向间隔设置的多个所述支撑档边时,所述第一支撑件还包括沿所述板体周向设置的加强筋,多个所述支撑档边的底端间隔设置在所述加强筋上。The intelligent power module according to claim 6, when the first support member includes a plurality of support ribs arranged circumferentially along the plate body, the first support member further includes a plurality of support ribs arranged along the circumferential direction of the plate body. Reinforcing ribs are provided in the circumferential direction of the body, and the bottom ends of a plurality of supporting ribs are arranged on the reinforcing ribs at intervals.
  8. 根据权利要求5所述的智能功率模块,其中,所述第二电路板上设置有定位孔,所述板体上设置有与所述定位孔配合的定位柱。The intelligent power module according to claim 5, wherein the second circuit board is provided with positioning holes, and the board body is provided with positioning posts that cooperate with the positioning holes.
  9. 根据权利要求5所述的智能功率模块,其中,所述板体开设有避让所述电连接件的导向孔,所述电连接件包括:The intelligent power module according to claim 5, wherein the plate body is provided with guide holes to avoid the electrical connectors, and the electrical connectors include:
    焊座,所述焊座的底端焊接在所述第一电路板上;Welding seat, the bottom end of the welding seat is welded on the first circuit board;
    电连接端子,所述电连接端子的底端设于所述焊座的焊孔内,所述电连接端子的另一端通过所述板体上对应的导向孔后穿设于所述第二电路板;Electrical connection terminal, the bottom end of the electrical connection terminal is located in the welding hole of the soldering base, and the other end of the electrical connection terminal is passed through the corresponding guide hole on the board body and then penetrated into the second circuit plate;
    所述板体朝向所述第一电路板的一面抵接或者固定在述焊座上。The side of the board body facing the first circuit board abuts or is fixed on the welding base.
  10. 根据权利要求9所述的智能功率模块,其中,所述板体朝向所述第一电路板的一面沿所述导向孔的外周形成有支撑部;The intelligent power module according to claim 9, wherein a support portion is formed along the outer periphery of the guide hole on a side of the board facing the first circuit board;
    所述支撑部远离所述板体的一端与所述焊座的上表面抵接;或者,One end of the support portion away from the plate body is in contact with the upper surface of the welding seat; or,
    所述支撑部远离所述板体的一端与所述焊座过盈配合。One end of the support portion away from the plate body is interference-fitted with the welding seat.
  11. 根据权利要求5所述的智能功率模块,其中,所述板体朝向所述第一电路板的一面设置有第二支撑件,所述第二支撑件与所述第一电路板的上表面抵接。The intelligent power module according to claim 5, wherein a second support member is provided on a side of the board body facing the first circuit board, and the second support member is in contact with the upper surface of the first circuit board. catch.
  12. 根据权利要求11所述的智能功率模块,其中,所述第二支撑件包括至少一个第二支撑柱,所述第二支撑柱的一端设置在所述板体朝向所述第一电路板的一面,所述第二支撑柱的另一端抵接于所述第一电路板。The intelligent power module according to claim 11, wherein the second support member includes at least one second support column, one end of the second support column is disposed on a side of the board body facing the first circuit board. , the other end of the second support column is in contact with the first circuit board.
  13. 根据权利要求1所述的智能功率模块,其中,还包括:The intelligent power module according to claim 1, further comprising:
    底部具有开口的壳体,所述第一电路板封堵所述壳体的底部开口并与所述壳体限定出一容置空间,所述第二电路板以及所述防爆件均位于所述容置空间内;所述壳体的顶板上开设有若干第二通孔,部分所述电连接件的顶端穿过所述第二通孔延伸出所述壳体;A shell with an opening at the bottom. The first circuit board blocks the bottom opening of the shell and defines an accommodation space with the shell. The second circuit board and the explosion-proof component are located on the In the accommodation space; a number of second through holes are provided on the top plate of the housing, and the top ends of some of the electrical connectors extend out of the housing through the second through holes;
    所述壳体的顶板、所述第二电路板以及所述防爆件上均开设有灌封绝缘介质的灌封孔,所述容置空间的空隙内填充有绝缘介质。The top plate of the housing, the second circuit board and the explosion-proof component are all provided with potting holes for potting insulating medium, and the gaps in the accommodation space are filled with insulating medium.
  14. 根据权利要求13所述的智能功率模块,其中,所述防爆件的外周与所述壳体的内壁之间具有间隙。The intelligent power module according to claim 13, wherein there is a gap between the outer periphery of the explosion-proof member and the inner wall of the housing.
  15. 根据权利要求4所述的智能功率模块,其中,当所述防爆件采用PCB裸板时,所述PCB裸板开设有用于穿设所述电连接件的焊孔;The intelligent power module according to claim 4, wherein when the explosion-proof component adopts a PCB bare board, the PCB bare board is provided with welding holes for passing through the electrical connector;
    所述第一电路板上的至少一个所述电连接件穿过所述PCB裸板上对应的焊孔并与所述焊孔焊接,以将所述PCB裸板固定在所述第一电路板与所述第二电路板之间。At least one of the electrical connectors on the first circuit board passes through the corresponding welding hole on the bare PCB board and is welded to the welding hole to fix the bare PCB board to the first circuit board. and the second circuit board.
  16. 根据权利要求4所述的智能功率模块,其中,当所述防爆件采用NOMEX绝缘纸时,所述电连接件上设置有粘接部,所述电连接件穿过所述NOMEX绝缘纸并通过所述粘接部与所述NOMEX绝缘纸粘接。The intelligent power module according to claim 4, wherein when the explosion-proof part adopts NOMEX insulating paper, the electrical connector is provided with an adhesive part, and the electrical connector passes through the NOMEX insulating paper and passes through The bonding part is bonded to the NOMEX insulation paper.
  17. 一种电气设备,其中,包括如权利要求1至16任一项所述的智能功率模块。An electrical device, including the intelligent power module according to any one of claims 1 to 16.
PCT/CN2022/108591 2022-06-16 2022-07-28 Intelligent power module and electrical device WO2023240759A1 (en)

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CN105161879A (en) * 2015-09-24 2015-12-16 上海埃而生电气有限公司 Multilayer PCB (Printed Circuit Board) central distribution box
CN208240652U (en) * 2018-06-20 2018-12-14 广东美的制冷设备有限公司 Power module and air conditioner
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